CN114635051A - Preparation method of aluminum-based gradient electronic packaging composite material with high silicon content - Google Patents
Preparation method of aluminum-based gradient electronic packaging composite material with high silicon content Download PDFInfo
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- CN114635051A CN114635051A CN202011482872.8A CN202011482872A CN114635051A CN 114635051 A CN114635051 A CN 114635051A CN 202011482872 A CN202011482872 A CN 202011482872A CN 114635051 A CN114635051 A CN 114635051A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 29
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 28
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 239000002131 composite material Substances 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000007731 hot pressing Methods 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000000280 densification Methods 0.000 claims description 10
- 239000011863 silicon-based powder Substances 0.000 claims description 8
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 7
- 229910000676 Si alloy Inorganic materials 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000004321 preservation Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000005022 packaging material Substances 0.000 abstract description 17
- 229910018125 Al-Si Inorganic materials 0.000 abstract description 6
- 229910018520 Al—Si Inorganic materials 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 3
- 238000004663 powder metallurgy Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 239000011265 semifinished product Substances 0.000 abstract 1
- 239000011812 mixed powder Substances 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000004377 microelectronic Methods 0.000 description 3
- 238000009849 vacuum degassing Methods 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000009718 spray deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 208000025599 Heat Stress disease Diseases 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000009715 pressure infiltration Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention relates to a preparation method of an aluminum-based gradient electronic packaging composite material with high silicon content, belonging to a thermal forming process of an aluminum-based powder material. The invention solves the defects that the gradient structure design and near-net forming of the packaging material can not be realized by the existing preparation method of the Al-Si electronic packaging material. The gradient-structure electronic packaging material prepared by combining the powder metallurgy with processes such as repeated charging cold pressing, step hot pressing and the like has the advantages of controllable component gradient, low cost and precision forming, and can greatly reduce subsequent machining deformation while ensuring good performance. The method is suitable for preparing the gradient aluminum-based electronic packaging material with the Si mass content of 20-75 percent and preparing high-performance electronic packaging material blank and semi-finished products.
Description
Technical Field
The invention relates to a preparation method of an aluminum-based gradient electronic packaging composite material with high silicon content, belonging to a thermal forming process of an aluminum-based powder material.
Background
With the rapid increase of the integration level and the current frequency of the integrated circuit, the passing current is larger and larger, and the heat load borne by a single micro-electronic substrate is rapidly increased, so that in a micro-electronic integrated circuit and a high-power rectifier device, the heat fatigue caused by the heat stress and poor heat dissipation performance due to the mismatch of the thermal expansion coefficients of materials becomes the main failure mode of the micro-electronic circuit and the device, and the electronic packaging material with good performance becomes the main measure for solving the problems.
At present, among a plurality of electronic packaging materials, an aluminum-based composite material has a low expansion coefficient and good heat conductivity, and becomes the first choice of a high-performance packaging material. Al-SiCp and Al-Si are the two most common types of aluminum matrix composites. Compared with Al-SiCp encapsulating materials, the Al-Si electronic encapsulating material has lower cost, better forming property, machining property and welding property, and is the most widely applied electronic encapsulating material at the present stage.
Common preparation methods of the Al-Si electromagnetic packaging material at the present stage include pressureless infiltration, pressure infiltration, spray deposition, powder metallurgy and the like. The gradient material can be prepared by adopting a spray deposition method, but the gradient material cannot be prepared into a near-net-shape product, and subsequent machining forming is needed, so that the period is long and the cost is high. Therefore, aiming at the defects that the existing preparation method of the Al-Si electronic packaging material cannot realize the gradient structure design and the near-net-shape forming of the packaging material, the preparation method of the aluminum-based gradient electronic packaging composite material with high silicon content is provided, the gradient component design and the near-net-shape forming preparation of the packaging material are realized, the preparation cost is reduced, and the industrial batch production is realized.
Disclosure of Invention
In order to solve the technical problems, the invention provides a preparation method of an aluminum-based gradient electronic packaging composite material with high silicon content.
The technical scheme of the invention is as follows:
a preparation method of an aluminum-based gradient electronic packaging composite material with high silicon content comprises the following steps:
step 1, mixing powder: mixing aluminum-silicon alloy powder with the Si mass content of 10-30% with high-purity silicon powder to prepare aluminum-based material powder with different Si mass contents;
step 2, cold-press forming: sequentially adding aluminum-based material powder into a die according to the sequence of Si mass content from high to low, compacting each added aluminum-based material powder with one Si mass content by using a press, then compacting the added aluminum-based material powder with the next Si mass content, and gradually increasing the cold pressing pressure according to the powder loading sequence until the final aluminum-based material powder with the Si mass content is compacted, so as to obtain a gradient pressed compact with the density of 70-90%;
step 3, heating and vacuumizing: loading the gradient pressed blank into a hot-pressing die with a vacuum seal and a heating device, vacuumizing to a set pressure, and then heating until the vacuum degree and the heating temperature reach a set range;
step 4, hot-pressing densification: when the vacuum degree and the heating temperature in the step 3 reach a set range, immediately pressurizing for densification, stopping pressurizing when the density of the gradient pressed blank reaches more than 95%, performing pressure maintaining treatment, and then performing heat preservation and pressure reduction treatment to obtain a gradient material block;
step 5, hot-press forming: and (4) placing the gradient material block obtained in the step (4) into a hot-press forming die for hot-press forming treatment, keeping the pressure for a certain time, cooling to room temperature, and demolding to obtain the aluminum-based gradient electronic packaging composite material with high silicon content.
Further, the average particle diameter of the aluminum-silicon alloy powder containing 10 to 30 mass% of Si is 5 to 60 μm.
Furthermore, the average particle diameter of the high-purity silicon powder is 5-40 μm, and the purity of the high-purity silicon powder is more than 99.5%.
Further, the Si mass content of the aluminum-based material powder in the step 1 is 20-75%.
Further, the specific operation process of step 3 is as follows: loading the gradient pressed compact into hot-pressing mould with vacuum sealing and heating device, and vacuumizing to 0.5 × 10-1Pa～5.5×10-1Pa, then starting heating and continuing to pump vacuum until the temperature reaches 490-560 ℃ and the vacuum degree is 0.5 multiplied by 10-1Pa～1.5×10-1Pa is up to.
Further, the compactness is calculated through the volume change in the process of pressurizing and compacting treatment in the step 4.
Further, the pressure maintaining treatment time in the step 4 is 1min to 5 min.
Further, the pressure reduction treatment in the step 4 is carried out at a speed not exceeding 10 t/s.
Further, the hot-pressing forming temperature in the step 5 is 500-590 ℃, and the pressure is maintained for 30-120 s after the hot-pressing die reaches the limited position.
The invention has the following beneficial effects: according to the invention, through the combination of powder metallurgy with processes such as repeated charging cold pressing, step hot pressing and the like, the component gradient design of the Al-Si electronic packaging material is completed, and simultaneously the near-net forming of the required parts is realized.
The invention also has the following advantages:
(1) the electronic packaging material prepared by the invention has the advantages that the Si mass content is continuously adjustable from 20-75%, and the near-net shape can be obtained through final die forming;
(2) the invention obtains the aluminum-silicon electronic packaging material with gradient components which can be designed and the structure appearance of which can be adjusted at any time through the processes of layered cold pressing densification, vacuum degassing, hot pressing densification, die forming and the like, and the process is convenient and feasible and is convenient for industrial production.
Drawings
FIG. 1 is a schematic cross-sectional view of a gradient material obtained in embodiment 1.
Detailed Description
The experimental procedures used in the following examples are conventional unless otherwise specified. The materials, reagents, methods and apparatus used, unless otherwise specified, are conventional in the art and are commercially available to those skilled in the art.
Embodiment mode 1:
(1) firstly, aluminum-silicon alloy powder with the average diameter of 30-40 mu m and the silicon content of 20 percent is mixed with simple substance silicon powder with the purity of 99.97 percent and the average diameter of 15-25 mu m to respectively prepare mixed powder with the total silicon content of 27 percent, 35 percent, 50 percent, 60 percent and 70 percent.
(2) Then, the mixed powder with the total silicon content of 70 percent is firstly filled into a steel mould on a hydraulic press, the steel mould is put into a pressure head to be pressurized and densified, the density is calculated through the volume change, the pressurization is stopped when the density reaches about 80 percent, the pressure is slowly released, the mixed powder with the total silicon content of 60 percent is added, then the pressurization and the pressure release treatment are carried out, the mixed powder with the total silicon content of 50 percent, 35 percent and 27 percent is sequentially added according to the method, the pressure of each pressurization is gradually increased, and the densification degree of the finally obtained gradient pressed blank is ensured to reach 85 percent.
(3) Putting the cold-pressed gradient pressed blank into a hot-pressing die sleeve with a vacuum degassing and heating device, vacuumizing until the vacuum degree reaches 3.0 multiplied by 10-1Heating up at Pa, continuously vacuumizing while heating up, maintaining the temperature and continuously vacuumizing until the vacuum degree reaches 1.5 × 10-1And when Pa, breaking vacuum, putting down a pressure head, starting pressurizing and compacting, keeping the pressure for 60s when the compactness reaches 98% of theoretical calculation, then slowly releasing the pressure at the speed of 6 tons/s, taking out a steel mold after complete pressure release, taking out a blank after air cooling to room temperature, sampling the blank, and measuring the performance of a bottom layer (a 70% Si mass content layer), wherein the results are shown in Table 1, and the section of the gradient material is shown in figure 1.
TABLE 1 Performance test results of gradient electronic encapsulants
From the above results, it can be found that the electronic packaging material prepared by the method of the present invention has a well-bonded interface between the different components, and at the same time, the aluminum-based material containing 70% Si by mass has a good thermal conductivity and a low expansion coefficient.
Embodiment mode 2:
(1) firstly, aluminum-silicon alloy powder with the average diameter of 20-30 mu m and the silicon content of 18 percent is mixed with simple substance silicon powder with the purity of 99.97 percent and the average diameter of 10-20 mu m to respectively prepare mixed powder with the total silicon content of 20 percent, 30 percent, 40 percent, 50 percent and 65 percent.
(2) Then, the mixed powder with 65 percent of total silicon content is firstly filled into a steel mould on a hydraulic press, a pressure head is put into the steel mould to be pressurized and densified, the densification is calculated through the volume change, the pressurization is stopped when the densification reaches about 80 percent, the mixed powder with 50 percent of total silicon content is added after the pressure is slowly released, then the pressurization and the pressure release treatment are carried out, the mixed powder with 40 percent, 30 percent and 20 percent of total silicon content is sequentially added according to the method, the pressure of each pressurization is gradually increased, and the densification degree of the finally obtained gradient pressed blank is ensured to reach 85 percent.
(3) Putting the cold-pressed gradient pressed blank into a hot-pressing die sleeve with a vacuum degassing and heating device, vacuumizing until the vacuum degree reaches 2.0 multiplied by 10-1Heating up at Pa, continuously vacuumizing while heating up, maintaining the temperature and continuously vacuumizing until the vacuum degree reaches 1.2 × 10 when the temperature rises to 560 ℃-1And when Pa, breaking vacuum, putting down a pressure head, starting pressurizing and compacting, keeping the pressure for 100s when the compactness reaches 99% of theoretical calculation, then slowly releasing the pressure at the pressure release speed of 8 tons/s, taking out a steel mold after complete pressure release, taking out a blank after air cooling to room temperature, and sampling from a 65% Si mass content layer to measure the performance, wherein the results are shown in Table 2.
TABLE 2 Performance test results of gradient electronic encapsulants
From the above results, it can be found that the electronic packaging material prepared by the method of the present invention has good forming performance and good comprehensive performance.
Claims (8)
1. A preparation method of an aluminum-based gradient electronic packaging composite material with high silicon content is characterized by comprising the following steps:
step 1, mixing powder: mixing aluminum-silicon alloy powder with the Si mass content of 10-30% with high-purity silicon powder to prepare aluminum-based material powder with different Si mass contents;
step 2, cold-press forming: sequentially adding aluminum-based material powder into a die according to the sequence of Si mass content from high to low, compacting by using a press every time one aluminum-based material powder with Si mass content is added, then adding the next aluminum-based material powder with Si mass content and compacting, and gradually increasing the cold-pressing pressure according to the powder loading sequence until the last aluminum-based material powder with Si mass content is compacted, so as to obtain a gradient pressed compact with the density of 70-90%;
step 3, heating and vacuumizing: loading the gradient pressed blank into a hot-pressing die with a vacuum seal and a heating device, vacuumizing to a set pressure, and then heating until the vacuum degree and the heating temperature reach a set range;
step 4, hot-pressing densification: when the vacuum degree and the heating temperature in the step 3 reach a set range, immediately pressurizing for densification, stopping pressurizing when the density of the gradient pressed blank reaches more than 95%, performing pressure maintaining treatment, and then performing heat preservation and pressure reduction treatment to obtain a gradient material block;
step 5, hot-press forming: and (5) placing the gradient material block obtained in the step (4) into a hot-press forming die for hot-press forming treatment, keeping the pressure for a certain time, cooling to room temperature, and demolding to obtain the aluminum-based gradient electronic packaging composite material with high silicon content.
2. The method for preparing the aluminum-based gradient electronic packaging composite material with high silicon content as claimed in claim 1, wherein the average particle diameter of the aluminum-silicon alloy powder with the Si content of 10-30% by mass is 5-60 μm.
3. The preparation method of the aluminum-based gradient electronic packaging composite material with high silicon content according to claim 1, wherein the average particle diameter of the high-purity silicon powder is 5-40 μm, and the purity of the high-purity silicon powder is more than 99.5%.
4. The method for preparing the aluminum-based gradient electronic packaging composite material with high silicon content as claimed in claim 1, wherein the Si content of the aluminum-based material powder in the step 1 is 20-75% by mass.
5. The method for preparing the aluminum-based gradient electronic packaging composite material with high silicon content according to claim 1, wherein the specific operation process of the step 3 is as follows: loading the gradient pressed compact into hot-pressing mould with vacuum sealing and heating device, and vacuumizing to 0.5 × 10-1Pa～5.5×10-1Pa, then starting heating and continuing to pump vacuum until the temperature reaches 490-560 ℃ and the vacuum degree is 0.5 multiplied by 10-1Pa～1.5×10-1Pa。
6. The method for preparing the aluminum-based gradient electronic packaging composite material with high silicon content according to claim 1, wherein the pressure maintaining time in the step 4 is 1-5 min.
7. The method as claimed in claim 1, wherein the step 4 of depressurizing is performed at a rate not exceeding 10 t/s.
8. The method for preparing the aluminum-based gradient electronic packaging composite material with high silicon content according to claim 1, wherein the hot press forming temperature in the step 5 is 500-590 ℃, and the pressure is maintained for 30-120 s after the hot press mold reaches a limited position.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011482872.8A CN114635051A (en) | 2020-12-15 | 2020-12-15 | Preparation method of aluminum-based gradient electronic packaging composite material with high silicon content |
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| CN202011482872.8A CN114635051A (en) | 2020-12-15 | 2020-12-15 | Preparation method of aluminum-based gradient electronic packaging composite material with high silicon content |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116393702A (en) * | 2023-04-03 | 2023-07-07 | 南京瑞为新材料科技有限公司 | Diamond aluminum-aluminum silicon gradient material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0421728A (en) * | 1990-02-01 | 1992-01-24 | Furukawa Alum Co Ltd | Manufacture of extruded material |
| CN105483454A (en) * | 2015-12-28 | 2016-04-13 | 北京有色金属研究总院 | Manufacturing method of laminated aluminum matrix composite for electronic packaging |
| CN111442039A (en) * | 2020-03-02 | 2020-07-24 | 湖南金天铝业高科技股份有限公司 | Light wear-resistant aluminum-based powder metallurgy composite material automobile brake disc and preparation method thereof |
-
2020
- 2020-12-15 CN CN202011482872.8A patent/CN114635051A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0421728A (en) * | 1990-02-01 | 1992-01-24 | Furukawa Alum Co Ltd | Manufacture of extruded material |
| CN105483454A (en) * | 2015-12-28 | 2016-04-13 | 北京有色金属研究总院 | Manufacturing method of laminated aluminum matrix composite for electronic packaging |
| CN111442039A (en) * | 2020-03-02 | 2020-07-24 | 湖南金天铝业高科技股份有限公司 | Light wear-resistant aluminum-based powder metallurgy composite material automobile brake disc and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 周世权等: "《机械制造工艺基础 第3版》", 华中科技大学出版社, pages: 226 - 230 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116393702A (en) * | 2023-04-03 | 2023-07-07 | 南京瑞为新材料科技有限公司 | Diamond aluminum-aluminum silicon gradient material and preparation method thereof |
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