CN114608666A - Flow sensor packaging structure and packaging method - Google Patents
Flow sensor packaging structure and packaging method Download PDFInfo
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- CN114608666A CN114608666A CN202210495867.3A CN202210495867A CN114608666A CN 114608666 A CN114608666 A CN 114608666A CN 202210495867 A CN202210495867 A CN 202210495867A CN 114608666 A CN114608666 A CN 114608666A
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- flow sensor
- cover plate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0003—MEMS mechanisms for assembling automatically hinged components, self-assembly devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/14—Casings, e.g. of special material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
Abstract
The invention provides a flow sensor packaging structure and a packaging method, wherein the packaging structure comprises: the flow sensor comprises a flow sensor, a substrate and a flow channel cover plate, wherein the substrate is fixedly connected with the flow sensor, the flow channel cover plate is fixedly connected with the substrate, the flow sensor is embedded into the through hole, and the sensing surface of the flow sensor is flush with the surface of one side, far away from the substrate, of the flow channel cover plate. In the technical scheme provided by the invention, the sensing surface of the flow sensor is flush with the surface of one side of the flow channel cover plate, which is far away from the base plate, and the flow of the fluid is stable near the sensing surface of the flow sensor, so that the situations of reduction of the measurement accuracy, stability and range ratio of the flow sensor caused by the fluctuation of the fluid near the sensing surface of the flow sensor are avoided.
Description
Technical Field
The invention relates to the field of sensors, in particular to a flow sensor packaging structure and a packaging method.
Background
In the fields of industrial control, biomedical, smart home, automobiles, environmental monitoring and the like, a flowmeter is generally used for measuring the flow of fluid, and a thermal flowmeter is commonly used. The thermal flowmeter adopts a thermal diffusion principle, when fluid passes through the surface of the sensor, the flow rate of the fluid increases, the heat quantity taken away increases, the temperature difference of the sensor changes along with the change of the flow rate of a medium, and the flow Q of the fluid can be obtained according to the proportional relation between the temperature difference and the flow rate of the medium.
At present, a sensor chip in a thermal flow sensor is commonly used as an MEMS (Micro-Electro-Mechanical System) chip, the MEMS chip is placed in a groove machined on a substrate, the groove formed by the method is not only high in cost, but also poor in depth consistency, and after the MEMS chip is placed in the groove, the height consistency between the surface of the MEMS chip and the surface of the substrate is poor, and then for a product with a large height difference between the surface of the MEMS chip and the substrate, when a fluid passes through the surface of the MEMS chip, the fluid is easy to fluctuate, thereby affecting the stability of the flow rate and affecting the measurement accuracy of the flow rate.
Therefore, in the process of measuring the flow rate of the fluid, how to avoid the fluctuation of the fluid passing through the surface of the sensor chip after the fluid passes through the inlet of the flowmeter is an urgent problem to be solved.
Disclosure of Invention
The invention provides a flow sensor packaging structure and a packaging method, wherein in the flow sensor packaging structure, a sensing surface of a flow sensor is flush with the surface of one side, far away from a substrate, of a flow channel cover plate, and the flow of fluid is stable near the sensing surface of the flow sensor, so that the situations that the measurement accuracy, the stability and the range ratio of the flow sensor are reduced due to the fluctuation of the fluid near the sensing surface of the flow sensor are avoided, and the specific scheme is as follows:
in a first aspect, a flow sensor package structure is provided, the package structure comprising: base plate (1), flow sensor (2) and runner apron (3), base plate (1) with flow sensor (2) fixed connection, runner apron (3) with base plate (1) fixed connection, wherein, runner apron (3) have through-hole (8), flow sensor (2) are embedded into in through-hole (8), and flow sensor's (2) sensing surface with runner apron (3) are kept away from a side surface parallel and level of base plate (1).
Furthermore, a boss (5) is arranged on the substrate (1), the boss (5) is fixedly connected with the substrate (1), and the flow sensor (2) is fixedly connected with the boss (5) through an adhesive layer (6).
Furthermore, the sum of the thickness of the flow sensor (2) and the thickness of the adhesive layer (6) is the same as the thickness of the runner cover plate (3).
Furthermore, the flow sensor (2) is provided with a cavity part and a non-cavity part, the non-cavity part is bonded with the bonding layer (6), and the cavity part is suspended.
Furthermore, the base plate (1) and the flow channel cover plate (3) are fixedly connected through an adhesive piece (7);
the height of the bonding piece (7) is the same as that of the boss (5).
Further, at least two spot gluing grooves (1-1) are arranged on one side surface of the base plate (1) facing the flow channel cover plate (3), and bonding glue is coated in the at least two spot gluing grooves (1-1) to form the bonding piece (7).
Further, the through hole (8) has a first region (8-1) and a second region (8-2), the flow sensor (2) being embedded in the first region (8-1);
wherein, the position of the substrate (1) corresponding to the second area (8-2) is provided with a first pad (9), the flow sensor (2) is provided with a second pad, the first pad (9) is electrically connected with the second pad through an electric connecting line (11), the electric connecting line (11) passes through the second area (8-2), and a processing circuit (10) for processing the electric signal transmitted by the flow sensor (2) is arranged on one side surface of the substrate (1) far away from the flow sensor (2), the processing circuit (10) is electrically connected with the flow sensor (2) through the first pad (9), the electric connecting line (11) and the second pad.
Further, the second region (8-2) is filled with a protective adhesive (12) wrapping the electric connection line (11).
Further, a connecting structure is arranged on the flow channel cover plate (3), and the connecting structure is used for fixedly connecting the packaging structure with the flow channel main body (4) so as to enable the sensing surface of the flow sensor (2) to face the flow channel main body (4) and detect the flow of the fluid flowing in the flow channel main body (4).
Furthermore, the connecting structure comprises at least one limiting hole (13) and a sealing layer (14) which are arranged on one side of the runner cover plate (3) far away from the substrate (1) and are used for registering and bonding with a corresponding limiting column (15) on the runner main body (4) so as to fixedly connect the runner cover plate (3) with the runner main body (4).
Furthermore, the flow channel cover plate comprises at least one limiting rib group arranged on the surface of one side, close to the base plate (1), of the flow channel cover plate (3).
Furthermore, the packaging structure further comprises a bottom shell (16) fixedly connected with the runner cover plate (3), and the bottom shell (16) and the runner cover plate (3) jointly form a protection cavity for accommodating the substrate (1).
In a second aspect, a flow sensor packaging method is provided, the method comprising:
providing a substrate (1), wherein at least two dispensing grooves (1-1) and a boss (5) are arranged on one side surface of the substrate (1);
coating adhesive glue on the boss (5) to form an adhesive layer (6), and adhering the flow sensor (2) to the adhesive layer (6);
and coating adhesive glue in the at least two glue dispensing grooves (1-1) to form an adhesive piece (7), and adhering a flow channel cover plate (3) with a through hole (8) to the adhesive piece (7), so that the flow sensor (2) is accommodated in the through hole (8) and one side surface, away from the base plate (1), of the flow channel cover plate (3) is flush with one side surface, away from the boss (5), of the flow sensor (2).
In the invention, the flow cover plate is provided with a through hole, the flow sensor is embedded into the through hole, further, the sensing surface of the flow sensor is flush with the surface of one side of the flow cover plate far away from the substrate, the fluid flows into the flow channel main body and passes through the sensing surface and the surface of one side of the flow cover plate far away from the substrate, so that the flow sensor can detect the flow of the fluid, in the process, the sensing surface is flush with the surface of one side of the flow cover plate far away from the substrate, therefore, the flow of the fluid is stable near the sensing surface of the flow sensor, thereby avoiding the reduction of the measurement accuracy, stability and range ratio of the flow sensor caused by the fluctuation of the fluid near the sensing surface of the flow sensor, furthermore, when the flow sensor is in a back cavity type structure, the flow sensor is provided with a cavity part and a non-cavity part, and the non-cavity part is bonded with the bonding layer, the cavity part is suspended, so that the air pressure inside and outside the cavity is equal, in order to enable the sensing surface of the flow sensor to be flush with the surface of one side, away from the base plate, of the flow channel cover plate, the sum of the thickness of the flow sensor and the thickness of the bonding layer is the same as that of the flow channel cover plate, and the sum of the thickness of the bonding layer and the thickness of the boss is the same as the suspension distance of the cavity part of the flow sensor on the base plate.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
FIG. 1 is a schematic diagram of a flow sensor package structure in one embodiment of the invention;
FIG. 2 is a schematic diagram of a cavity-backed flow sensor package in one embodiment of the invention;
FIG. 3 is a bottom view of a flow passage cover plate in one embodiment of the invention;
FIG. 4 is a schematic diagram of the locations of the first pads and electrical connections in one embodiment of the present invention;
FIG. 5 is a bottom view of the flow path cover plate and the base plate after assembly in one embodiment of the invention;
FIG. 6 is a flow chart of a method of packaging a flow sensor in one embodiment of the invention;
fig. 7(a) -7 (g) are schematic diagrams illustrating a process for manufacturing a flow sensor package structure according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Throughout the specification, reference to "one embodiment," "one example," or "an example" means: the particular features, structures, or characteristics described in connection with the embodiment or example are included in at least one embodiment of the invention. Thus, the appearances of the phrases "in one embodiment," "in an embodiment," "one example" or "an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples.
The invention provides a flow sensor packaging structure, which comprises: the flow sensor comprises a base plate, a flow sensor and a flow channel cover plate, wherein the base plate is fixedly connected with the flow sensor, the flow channel cover plate is fixedly connected with the base plate, the flow channel cover plate is provided with a through hole, the flow sensor is embedded into the through hole, and the sensing surface of the flow sensor is flush with the surface of one side, far away from the base plate, of the flow channel cover plate.
In the packaging structure of the invention, the substrate plays a role in supporting the flow sensor, the flow channel cover plate is provided with the through hole, the flow sensor is embedded into the through hole, further, on one hand, the flow sensor is attached to the flow channel cover plate to avoid fluid inflow and fluctuation in the fluid flowing process, on the other hand, the sensing surface of the flow sensor is flush with the surface of one side, far away from the substrate, of the flow channel cover plate, the fluid flows into the flow channel main body and passes through the sensing surface and the surface of one side, far away from the substrate, of the flow channel cover plate, so that the flow sensor can detect the flow of the fluid, and in the process, the sensing surface is flush with the surface of one side, far away from the substrate, of the flow channel cover plate, so that the flow of the fluid is stable near the sensing surface of the flow sensor, and the measurement precision of the flow sensor caused by the fluctuation of the fluid near the sensing surface of the flow sensor is avoided, Stability and reduced span ratio. Further, in the present invention, the flow sensor is a MEMS chip.
Illustratively, as shown in fig. 1, in one implementation of the flow sensor package structure of the present invention, a substrate 1, a flow sensor 2, and a flow channel cover plate 3 are stacked, the flow sensor 2 is fixed on an upper surface of the substrate 1, the flow sensor 2 is embedded in the flow channel cover plate 3, the upper surface of the flow sensor 2 is a sensing surface, the sensing surface is flush with the upper surface of the flow channel cover plate 3, the flow channel cover plate 3 has a through hole 8 for accommodating the flow sensor 2, and a width of the through hole 8 is the same as a width of the flow sensor 2.
Further, a boss 5 is arranged on the substrate 1, the boss 5 is fixedly connected with the substrate 1, and the flow sensor 2 is fixedly connected with the boss 5 through an adhesive layer 6.
In the present embodiment, in order to further fix the flow sensor, the substrate 1 is provided with the boss 5 fixedly connected to the substrate 1, the boss 5 is provided with the adhesive layer 6, as shown in fig. 1, the boss 5 corresponds to the position of the flow sensor 2, the upper surface of the boss 5 is provided with the adhesive layer 6, and for the convenience of adhesion, the size of the boss 5 can be adjusted according to the surface area of the flow sensor 2 to be adhered.
Further, the sum of the thickness of the flow sensor 2 and the thickness of the adhesive layer 6 is the same as the thickness of the flow path cover plate 3.
In the present embodiment, in order to further ensure that the sensing surface of the flow sensor 2 is flush with the surface of the flow cover plate 3 on the side away from the substrate, the sum of the thickness of the flow sensor 2 and the thickness of the adhesive layer 6 is the same as the thickness of the flow cover plate 3, and the thickness of the adhesive layer 6 can be adjusted according to the thickness of the flow sensor 2 and the thickness of the flow cover plate 3. Furthermore, the flow channel cover plate 3 can be formed by injection molding, so that the thickness consistency of the flow channel cover plate can be improved, and fluctuation caused by the height difference of the flow channel cover plate is avoided when fluid passes through the surface of one side of the flow channel cover plate far away from the substrate.
Further, as shown in fig. 2, the flow sensor 2 has a cavity portion 2-1 and a non-cavity portion 2-2, the non-cavity portion 2-2 is bonded to the bonding layer 6, and the cavity portion 2-1 is suspended.
In this embodiment, the flow sensor 2 is a flow sensor having a back cavity structure, and therefore, the flow sensor 2 has a cavity portion 2-1 and a non-cavity portion 2-2, and in order to ensure that the flow sensor 2 is communicated with the inside and the outside of the cavity in the package, the non-cavity portion 2-2 is bonded to the boss, and therefore, the non-cavity portion 2-2 is bonded to the bonding layer, so that the back cavity portion is suspended in the air, and the height difference between the boss 5 and the bonding layer 6 between the cavity portion 2-1 and the non-cavity portion of the flow sensor 2 is enough to ensure that the air in the cavity is communicated with the outside of the cavity, so that the air pressure is equivalent, and the sensitive film structure is prevented from being damaged by the pressure difference between the inside and the outside of the cavity due to the change of the temperature or the air pressure.
Furthermore, the sum of the thickness of the bonding layer 6 and the thickness of the boss 5 is the same as the suspension distance of the cavity part 2-1 of the flow sensor 2 on the substrate 1, so that the flatness of the flow sensor 2 is ensured, and the sensing surface corresponding to the cavity part 2-1 and the sensing surface corresponding to the non-cavity part 2-2 are in the same plane, thereby avoiding the fluctuation of the fluid caused by the unevenness of the cavity part and the non-cavity part of the flow sensor.
In one embodiment, the base plate 1 and the flow channel cover plate 3 are fixedly connected through an adhesive 7;
the height of the adhesive 7 is the same as the height of the boss 5.
In the present embodiment, in order to fixedly connect the substrate 1 and the flow channel cover plate 3, the substrate 1 and the flow channel cover plate 3 are bonded 7 by a bonding member, and exemplarily, as shown in fig. 2, the bonding member 7 is provided between the upper surface of the substrate 1 and the lower surface of the flow channel cover plate 3. Further, the height of the bonding piece 7 is the same as that of the boss 5, so that the surface of the flow channel cover plate 3, which is far away from the substrate 1, is flat, that is, the upper surface of the flow channel cover plate 3 is flat, and thus, the fluctuation of fluid caused by the flatness of the flow channel cover plate 3 is avoided.
In one embodiment, at least two dispensing grooves 1-1 are provided on the surface of the substrate 1 facing the flow path cover plate 3, and the inside of at least two dispensing grooves 1-1 is coated with adhesive to form an adhesive member 7.
In the present embodiment, in order to form the bonding member 7, at least two dispensing grooves 1-1 are provided on a surface of the base plate 1 opposite to the flow channel cover plate 3, the at least two dispensing grooves 1-1 are used for further fixing the flow channel cover plate 3, and a bonding adhesive is coated in the dispensing grooves 1-1 to form the bonding member 7.
Further, the through hole 8 has a first region 8-1 and a second region 8-2, and the flow sensor 2 is embedded in the first region 8-1;
wherein, the substrate 1 is provided with a first bonding pad 9 at a position corresponding to the second area 8-2, a second bonding pad is provided on the flow sensor 2, the first bonding pad 9 is electrically connected with the second bonding pad through an electrical connection line 11, the electrical connection line 11 passes through the second area 8-2, and a processing circuit 10 for processing an electrical signal transmitted by the flow sensor 2 is provided on a side surface of the substrate 1 away from the flow sensor 2, the processing circuit 10 is electrically connected with the flow sensor 2 through the first bonding pad 9, the electrical connection line 11 and the second bonding pad, exemplarily, the processing circuit 10 may be an asic (application Specific Integrated circuit) chip.
Illustratively, in FIG. 3, the through-hole 8 has a first region 8-1 and a second region 8-2, wherein the shape of the first region 8-1 matches the shape of the flow sensor 2; referring to fig. 3 and 4, the upper surface of the substrate 1 is provided with first pads 9 at positions corresponding to the second regions 8-2, and referring to fig. 1 and 4, the lower surface of the substrate 1 is provided with a processing circuit 10, the flow sensor is provided with second pads, and the first pads 9 and the second pads are connected by electrical connection lines 11. The flow data collected by the flow sensor 2 can be transmitted to the processing circuitry 10 to derive the flow rate of the fluid.
In one embodiment, the second region 8-2 is filled with a protective gel 12 that encapsulates the electrical connection wires 11.
In this embodiment, in order to fix and protect the electrical connection, the second region 8-2 is filled with a protective glue 12 wrapping the electrical connection line 11, so that the electrical connection line can be fixed, and the effects of short circuit, moisture resistance and the like can be prevented.
Exemplarily, in connection with fig. 1 to 3, the second area 8-2 is filled with a protective glue 12 wrapping the electrical connection lines 11; in order to protect the electrical connection wires, a large amount of protective glue 12 is usually filled in the second region 8-2, and the protective glue 12 will exceed the upper surface of the flow channel cover plate 3, so that, with reference to fig. 2 and fig. 3, the shape of the second region 8-2 has a certain curvature to adapt to the shape of the protective glue 12; the height of the protective glue 12 is higher than the upper surface of the runner cover plate 3.
Further, a connection structure is provided on the flow channel cover plate 3, and the connection structure is used for fixedly connecting the packaging structure with the flow channel main body 4, so that the sensing surface of the flow sensor 2 faces the flow channel main body 4 and detects the flow rate of the fluid flowing in the flow channel main body 4.
As shown in fig. 1, the upper surface of the flow channel cover plate 3 is fixedly connected with the flow channel main body 4, the inner surface of the flow channel main body 4 is connected with the sensing surface, the upper surface of the flow channel cover plate forms a fluid flowing space, and the fluid passes through the sensing surface when flowing, so that the flow rate of the fluid can be measured; furthermore, an inlet 4-1 for fluid to enter and an outlet 4-2 for fluid to flow out are arranged on the flow passage main body 4, and the inlet 4-1 and the outlet 4-2 are both communicated with the flow space.
As shown in fig. 2, the flow channel main body 4 is provided with a first groove 4-3 corresponding to the position of the protective glue 12; the flow channel main body 4 is also provided with a second groove 4-4 for forming a gas flow space; the first groove 4-3 is not communicated with the second groove 4-4.
In one embodiment, the connection structure includes at least one position-limiting hole 13 and a sealing layer 14 disposed on the side of the flow path cover plate 3 away from the substrate 1, for registering and adhering with a corresponding position-limiting post 15 on the flow path main body 4 to fixedly connect the flow path cover plate 3 with the flow path main body 4.
In this embodiment, with reference to fig. 1 and fig. 3, in order to fixedly connect the flow channel cover plate 3 to the flow channel main body 4, the connection structure includes at least one limiting hole 13 disposed on one side of the flow channel cover plate 3 away from the substrate 1, the limiting hole is matched with the limiting post 15 disposed on the flow channel main body 4, the limiting hole 13 and the limiting post 15 not only perform a connection function, but also perform an alignment function during the assembly process, thereby improving the assembly efficiency and avoiding assembly errors, on the other hand, a sealing layer 14 is further disposed on a surface of one side of the flow channel cover plate 3 away from the substrate 1, the sealing layer 14 not only performs a bonding function between the flow channel cover plate 3 and the flow channel main body 4, on the other hand, sealing of a fluid flowing space is also performed, and fluid leakage during flow measurement is avoided.
Furthermore, the packaging structure further comprises at least one limiting rib group arranged on the surface of one side, close to the substrate, of the flow channel cover plate.
In this embodiment, one side surface that runner apron 3 is close to base plate 1 sets up at least one spacing muscle group, on the one hand, plays the effect of strengthening runner apron 3, and on the other hand plays the effect spacing to base plate 1, the quick alignment of base plate 1 and runner apron of being convenient for to improve equipment precision and efficiency.
Exemplarily, referring to fig. 3 and 5, the lower surface of the flow channel cover plate 3 is provided with a first limiting rib group 3-1, a second limiting rib group 3-2 and a third limiting rib group 3-3 distributed at two sides of the first area 8-1 and the second area 8-2, wherein the limiting ribs in each limiting rib group are correspondingly arranged and respectively arranged at two corresponding edges of the flow channel cover plate 3, and therefore, the first limiting rib group 3-1, the second limiting rib group 3-2 and the third limiting rib group 3-3 each include two limiting ribs extending in a direction toward the first area 8-1 and the second area 8-2; the base plate 1 comprises a first base plate part 1-2 corresponding to the first area 8-1 and the second area 8-2, and the distance between the two limiting ribs is equal to the width of the first base plate part 1-2, so that the first base plate part 1-2 and the flow channel cover plate 3 can be quickly and accurately aligned in the assembling process; the base plate 1 is in a T shape, the base plate 1 further comprises a second base plate part 1-3 connected with the first base plate part 1-2, the width of the second base plate part 1-3 is larger than that of the first base plate part 1-2, the first base plate part 1-3 can be aligned with the flow channel cover plate 3 by clamping the second base plate part 1-3 in the assembling process, and the length of the base plate 1 is larger than that of the flow channel cover plate 3 in the direction perpendicular to the two limiting ribs, so that the clamping device can be evacuated after the base plate 1 is positioned.
In one embodiment, the package structure further includes a bottom case 16 fixedly connected to the flow path cover plate 3, and the bottom case 16 and the flow path cover plate 3 together form a protection cavity for accommodating the substrate 1.
In this embodiment, the package structure further includes a bottom case, the bottom case is fixedly connected to the flow channel cover, for example, as shown in fig. 1, the bottom case 16 is fixedly connected to the flow channel cover 3 through a buckle 17, the bottom case 16 has a concave space, and forms a protection cavity with the flow channel cover 3, so as to accommodate the substrate 1, and further, in combination with fig. 2, the processing circuit 10, the boss 5, the dispensing groove 1-1, and the bonding member 7 are all located in the protection cavity.
As shown in fig. 6, the present invention also provides a flow sensor packaging method, including:
s601, providing a substrate, wherein a dispensing groove and a boss are arranged on one side surface of the substrate.
Illustratively, as shown in fig. 7(a), the surface of the substrate 1 is provided with a dispensing groove 1-1 and a boss 5.
S602, coating adhesive glue on the boss to form an adhesive layer, and adhering the flow sensor to the adhesive layer.
Illustratively, as shown in fig. 7(b), an adhesive is applied to the boss 5 to form an adhesive layer 6, and the flow sensor 2 is adhered to the adhesive layer 6 to fix the flow sensor 2.
S603, coating adhesive glue in the dispensing groove to form an adhesive piece, and adhering the flow channel cover plate with the through hole to the adhesive piece, so that the flow sensor is accommodated in the through hole, and the surface of one side, away from the base plate, of the flow channel cover plate is flush with the surface of one side, away from the boss, of the flow sensor.
Illustratively, as shown in fig. 7(c), an adhesive 7 is formed by applying an adhesive in the dispensing groove 1-1, the flow channel cover plate has a through hole therein, the through hole is disposed corresponding to the position of the flow sensor 2, so that the flow sensor 2 is embedded in the flow channel cover plate 3, and the upper surface of the flow channel cover plate 3 is flush with the sensing surface of the flow sensor 2, so that the flow of the fluid is smooth near the sensing surface of the flow sensor 2, thereby preventing the decrease of the measurement accuracy, stability and span ratio of the flow sensor due to the fluctuation of the fluid near the sensing surface of the flow sensor.
In one embodiment, the flow sensor 2 has a cavity portion 2-1 and a non-cavity portion 2-2, and step S602 further includes: the non-cavity part 2-2 is bonded with the bonding layer 6, and the cavity part 2-1 is suspended.
Exemplarily, as shown in fig. 7(b), the flow sensor 2 has a cavity portion 2-1 and a non-cavity portion 2-2, a lower surface of the non-cavity portion 2-2 is bonded to the bonding layer 6, the cavity portion 2-1 is suspended, and the cavity portion 2-1 is spaced from an upper surface of the substrate 1, so as to ensure that a space inside the cavity is communicated with an outside of the cavity, so as to ensure that air inside the cavity is communicated with the outside of the cavity, so that the air pressure is equivalent, and the sensitive film structure is prevented from being damaged by a pressure difference between the inside and the outside of the cavity due to a temperature or air pressure change.
In one embodiment, in S603, the sum of the thickness of the flow sensor and the thickness of the adhesive layer is the same as the thickness of the flow channel cover plate;
the height of the adhesive 7 is the same as the height of the boss 5.
In order to further ensure that the sensing surface of the flow sensor 2 is flush with the surface of the flow cover plate 3 on the side away from the substrate, the sum of the thickness of the flow sensor 2 and the thickness of the adhesive layer 6 is the same as the thickness of the flow cover plate 3, and the thickness of the adhesive layer 6 can be adjusted according to the thickness of the flow sensor 2 and the thickness of the flow cover plate 3. Furthermore, the flow channel cover plate 3 can be formed by injection molding, so that the thickness consistency of the flow channel cover plate can be improved, and fluctuation caused by the height difference of the flow channel cover plate is avoided when fluid passes through the surface of one side of the flow channel cover plate far away from the substrate.
Exemplarily, with reference to fig. 7(b) and 7(c), the sum of the thickness of the adhesive layer 6 and the thickness of the boss 5 is the same as the suspended distance of the cavity portion 2-1 of the flow sensor 2 above the substrate 1, so as to ensure the flatness of the flow sensor 2, further enable the surface of the flow channel cover plate 3 far from the substrate 1 and the sensing surface of the flow sensor 2 to be at the same level, and avoid the fluid fluctuation caused by the fact that the upper surface of the flow channel cover plate 3 and the surface of the flow sensor 2 are not at the same level.
Further, the height of the adhesive member 7 is the same as that of the boss 5, so that the surface of the flow channel cover plate 3 away from the substrate 1 is ensured to be horizontal, and thus, fluid fluctuation caused by non-horizontal state of the flow channel cover plate 3 is avoided.
In one embodiment, the through-hole 8 has a first region 8-1 and a second region 8-2, and in step S603, the flow sensor is located in the first region;
step S601 further includes: a first bonding pad 9 is arranged at the position of the substrate 1 corresponding to the second area 8-2, and a processing circuit 10 for processing the electric signal transmitted by the flow sensor 3 is arranged on the surface of one side of the substrate 1 away from the flow sensor 2;
leading out an electrical connection wire 11 from the first pad 9 to electrically connect the first pad 9 with a second pad on the flow sensor, the electrical connection wire passing through the second region;
the processing circuit 10 is electrically connected to the flow sensor 2 via the first pads 9, the electrical connection wires 11 and the second pads.
Illustratively, in conjunction with fig. 1 and 3, the via 8 has a first region 8-1 and a second region 8-2, wherein the shape of the first region 8-1 is matched to the shape of the flow sensor 2, and the first pads 9 are provided at positions of the substrate 1 corresponding to the second regions 8-2, as shown in fig. 7(a), a processing circuit 10 for processing the electric signal transmitted by the flow sensor 1 is arranged on the surface of the substrate 1 far away from the flow sensor 2, a second bonding pad is arranged on the flow sensor 2, as shown in fig. 7(d), an electrical connection wire 11 is drawn from the first land 9 to electrically connect the first land with a second land on the flow sensor 2, the electrical connection wire 11 passes through the second region, this achieves that the processing circuit 10 is electrically connected to the flow sensor 2 via the first pads 9, the electrical connection lines 11 and the second pads.
In one embodiment, the method further comprises filling the second region with a protective gel surrounding the electrical connection lines.
Exemplarily, in connection with fig. 3 and 7(e), the second area 8-2 is filled with a protective glue 12 wrapping the electrical connection wires 11; in order to protect the electrical connection lines, the second region is usually filled with a larger amount of protective glue 12, and the protective glue 12 will extend beyond the upper surface of the flow channel cover plate 3.
In one embodiment, S604 is further included, and the flow channel cover plate is fixed on the flow channel main body through the connection structure, so that the sensing surface of the flow sensor faces the flow channel main body.
Exemplarily, with reference to fig. 1 and fig. 7(f), the flow channel cover plate 3 is fixed to the flow channel main body 4 through a connection structure, specifically, the flow channel cover plate 3 is fixedly connected to the flow channel main body 4 through the sealing layer 14 in fig. 1, the limiting column 15 is arranged to fix the flow channel cover plate 3 to the flow channel main body 4, and the upper surface of the flow channel cover plate 3 faces the flow channel main body 4, exemplarily, as shown in fig. 7(g), on the one hand, the sealing layer 14 plays a role of bonding the flow channel cover plate to the flow channel main body, and on the other hand, also plays a role of sealing a fluid flow space, so as to prevent fluid leakage during flow measurement.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (13)
1. A flow sensor package structure, comprising: base plate (1), flow sensor (2) and runner apron (3), base plate (1) with flow sensor (2) fixed connection, runner apron (3) with base plate (1) fixed connection, wherein, runner apron (3) have through-hole (8), flow sensor (2) are embedded into in through-hole (8), and flow sensor's (2) sensing surface with runner apron (3) are kept away from a side surface parallel and level of base plate (1).
2. The encapsulation structure according to claim 1, wherein a boss (5) is provided on the substrate (1), the boss (5) is fixedly connected with the substrate (1), and the flow sensor (2) is fixedly connected with the boss (5) through an adhesive layer (6).
3. The encapsulation structure according to claim 2, characterized in that the sum of the thickness of the flow sensor (2) and the thickness of the adhesive layer (6) is the same as the thickness of the flow duct cover plate (3).
4. The encapsulation structure according to claim 2, wherein the flow sensor (2) has a cavity portion and a non-cavity portion, the non-cavity portion is bonded to the bonding layer (6), and the cavity portion is suspended.
5. The encapsulation structure according to claim 2, wherein the substrate (1) and the flow channel cover plate (3) are fixedly connected by an adhesive (7);
the height of the bonding piece (7) is the same as that of the boss (5).
6. The encapsulation structure according to claim 5, characterized in that at least two glue dispensing grooves (1-1) are provided on a side surface of the substrate (1) facing the flow channel cover plate (3), and a bonding glue is applied in the at least two glue dispensing grooves (1-1) to form the bonding member (7).
7. The encapsulation structure according to claim 1, characterized in that the through-hole (8) has a first region (8-1) and a second region (8-2), the flow sensor (2) being embedded in the first region (8-1);
wherein, the position of the substrate (1) corresponding to the second area (8-2) is provided with a first pad (9), the flow sensor (2) is provided with a second pad, the first pad (9) is electrically connected with the second pad through an electric connecting line (11), the electric connecting line (11) passes through the second area (8-2), and a processing circuit (10) for processing the electric signal transmitted by the flow sensor (2) is arranged on one side surface of the substrate (1) far away from the flow sensor (2), the processing circuit (10) is electrically connected with the flow sensor (2) through the first pad (9), the electric connecting line (11) and the second pad.
8. The encapsulation structure according to claim 7, characterized in that the second region (8-2) is filled with a protective glue (12) that surrounds the electrical connection lines (11).
9. The encapsulation structure of claim 1, the flow channel cover plate (3) being provided with a connection structure for fixedly connecting the encapsulation structure with a flow channel body (4) such that the sensing surface of the flow sensor (2) faces the flow channel body (4) and detects a flow rate of a fluid flowing within the flow channel body (4).
10. The package structure of claim 9, wherein the connecting structure comprises at least one positioning hole (13) and a sealing layer (14) disposed on a side of the runner cover plate (3) away from the substrate (1) for registering and adhering with a corresponding positioning post (15) on the runner body (4) to fixedly connect the runner cover plate (3) with the runner body (4).
11. The package structure of claim 1, comprising: the limiting rib group is arranged on the surface of one side, close to the base plate (1), of the flow channel cover plate (3).
12. The package structure according to claim 1, further comprising a bottom case (16) fixedly connected to the flow channel cover plate (3), wherein the bottom case (16) and the flow channel cover plate (3) together form a protection cavity for accommodating the substrate (1).
13. A method of packaging a flow sensor, the method comprising:
providing a substrate (1), wherein at least two glue dispensing grooves (1-1) and a boss (5) are formed in one side surface of the substrate (1);
coating adhesive glue on the boss (5) to form an adhesive layer (6), and adhering the flow sensor (2) to the adhesive layer (6);
and coating bonding glue in the at least two spot gluing grooves (1-1) to form a bonding piece (7), and bonding a runner cover plate (3) with a through hole (8) onto the bonding piece (7), so that the through hole (8) accommodates the flow sensor (2) and one side surface of the runner cover plate (3) far away from the substrate (1) is flush with one side surface of the flow sensor (2) far away from the boss (5).
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| JP2020016465A (en) * | 2018-07-23 | 2020-01-30 | ミネベアミツミ株式会社 | Fluid sensor |
| WO2020175283A1 (en) * | 2019-02-25 | 2020-09-03 | オムロン株式会社 | Package-type flow sensor |
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| JP2005300365A (en) * | 2004-04-13 | 2005-10-27 | Keyence Corp | Shunt-type flow sensor |
| US20080105046A1 (en) * | 2006-11-03 | 2008-05-08 | Honeywell International Inc. | Microelectronic flow sensor packaging method and system |
| CN101784343A (en) * | 2007-08-21 | 2010-07-21 | 贝利莫控股公司 | Flow sensor and production method thereof |
| CN102620780A (en) * | 2011-12-27 | 2012-08-01 | 郑州炜盛电子科技有限公司 | MEMS (micro-electromechanical system) thermal-type flow sensor |
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