CN114605658A - Preparation method of polyimide-based modified graphene heat-conducting composite material - Google Patents
Preparation method of polyimide-based modified graphene heat-conducting composite material Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000002131 composite material Substances 0.000 title claims abstract description 33
- 239000004642 Polyimide Substances 0.000 title claims abstract description 17
- 229920001721 polyimide Polymers 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 21
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 20
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- -1 maleimide modified graphene Chemical class 0.000 claims abstract description 4
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- 238000006116 polymerization reaction Methods 0.000 claims abstract description 4
- 238000011065 in-situ storage Methods 0.000 claims abstract description 3
- 238000005698 Diels-Alder reaction Methods 0.000 claims abstract 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 21
- 239000000243 solution Substances 0.000 claims description 17
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 12
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 11
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 10
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- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 4
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 4
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 4
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 4
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- 150000002466 imines Chemical class 0.000 abstract description 2
- 239000004952 Polyamide Substances 0.000 abstract 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
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- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
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- 239000006185 dispersion Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及导热高分子复合材料技术领域,具体涉及一种聚酰亚胺基改性石墨烯导热复合材料。The invention relates to the technical field of thermally conductive polymer composite materials, in particular to a polyimide-based modified graphene thermally conductive composite material.
背景技术Background technique
随着5G时代的到来,现代电子技术向小型化、高度集成化和多功能化方向飞速发展,严重的散热问题极大地威胁着高科技设备的可靠性和寿命。高分子基聚合物因其质量轻、易加工、机械性能和电绝缘性能较优异等特点被广泛应用于微电子封装等领域。然而由于其较低的导热性能限制了它们的应用。需要通过引入填料并调控界面热阻和构筑导热通路来提升复合材料的导热性能。With the advent of the 5G era, modern electronic technology is rapidly developing in the direction of miniaturization, high integration and multi-functionality. Serious heat dissipation problems greatly threaten the reliability and life of high-tech equipment. Polymer-based polymers are widely used in microelectronic packaging and other fields due to their light weight, easy processing, excellent mechanical properties and electrical insulation properties. However, their applications are limited due to their low thermal conductivity. It is necessary to improve the thermal conductivity of composites by introducing fillers, regulating interfacial thermal resistance and constructing thermal conduction paths.
目前,石墨烯、碳纳米管、氮化硼纳米片、碳纤维等导热填料由于其固有的超导热性和热通道方面形成的优势,成为了调控复合材料导热性能的主力军。而导热填料改性是调控填料与基体以及填料间界面热阻的有效手段。导热填料的改性分为共价键改性和非共价键改性,共价键改性有着方法多样、产物性质稳定等优点。最近,通过在填料与基体之间构建共价键来构筑导热通路逐渐被研究。通过修饰填料的表面结构在提高填料分散性的同时,也促进了填料与基体之间的声子的有效传输,从而提升了复合材料的导热性能。At present, thermal conductive fillers such as graphene, carbon nanotubes, boron nitride nanosheets, and carbon fibers have become the main force for regulating the thermal conductivity of composite materials due to their inherent advantages in superconductivity and thermal channels. The modification of thermally conductive fillers is an effective means to control the interface thermal resistance between fillers and substrates and between fillers. The modification of thermally conductive fillers is divided into covalent bond modification and non-covalent bond modification. Covalent bond modification has the advantages of various methods and stable product properties. Recently, the construction of thermal conduction pathways by constructing covalent bonds between fillers and matrices has been gradually studied. By modifying the surface structure of the filler, while improving the dispersion of the filler, it also promotes the effective transmission of phonons between the filler and the matrix, thereby improving the thermal conductivity of the composite material.
发明内容SUMMARY OF THE INVENTION
基于上述现有技术所存在的问题,本发明提供一种聚酰亚胺基改性石墨烯导热复合材料的制备方法,旨在提高复合材料的导热性能。Based on the problems existing in the above-mentioned prior art, the present invention provides a preparation method of a polyimide-based modified graphene thermally conductive composite material, aiming at improving the thermal conductivity of the composite material.
本发明为实现目的,采用如下技术方案:The present invention adopts following technical scheme for realizing purpose:
一种聚酰亚胺基改性石墨烯导热复合材料的制备方法,其特点在于:首先通过电化学剥离石墨法得到石墨烯纳米片,记为GNS;然后将马来酰亚胺与GNS通过Diels-Alder反应,得到马来酰亚胺改性石墨烯导热填料,记为M@GNS;最后通过原位聚合法与化学亚胺法,制备以聚酰亚胺为基体、以M@GNS为填料的马来酰亚胺@石墨烯/聚酰亚胺复合材料,记为M@GNS/PI。具体包括如下步骤:A preparation method of a polyimide-based modified graphene thermally conductive composite material is characterized in that: first, graphene nanosheets are obtained by an electrochemical exfoliation graphite method, which is denoted as GNS; then maleimide and GNS are passed through Diels. -Alder reaction to obtain maleimide-modified graphene thermal conductive filler, denoted as M@GNS; finally, polyimide as matrix and M@GNS as filler were prepared by in-situ polymerization and chemical imide method The maleimide@graphene/polyimide composite was denoted as M@GNS/PI. Specifically include the following steps:
步骤1、GNS的制备Step 1. Preparation of GNS
将石墨箔片作为阳极、铂片作为阴极、0.1~0.12mol/L的硫酸铵水溶液作为电解液,剥离电压为15~15.3V恒压,对石墨箔片进行电化学剥离,经抽滤洗涤干燥后,得到GNS;Using graphite foil as anode, platinum foil as cathode, 0.1-0.12mol/L ammonium sulfate aqueous solution as electrolyte, stripping voltage of 15-15.3V constant voltage, electrochemical stripping of graphite foil, washing and drying by suction filtration After, get GNS;
步骤2、M@GNS的合成
将45~50mg马来酰亚胺溶解在40~50mL N,N二甲基甲酰胺中,向溶液中加入10~15mg GNS,超声50~60min,然后在115~120℃油浴中加热14~16h,再在紫外线下照射10~15min;冷却至室温后,将所得悬浮液通过聚四氟乙烯圆盘膜过滤,然后用60~75mL乙醇真空抽滤洗涤,除去未反应的马来酰亚胺;最后,收集滤饼并在室温下真空干燥,获得M@GNS;Dissolve 45-50 mg maleimide in 40-50 mL N,N dimethylformamide, add 10-15 mg GNS to the solution, sonicate for 50-60 min, and then heat in an oil bath at 115-120 °C for 14- 16h, then irradiated under ultraviolet light for 10-15min; after cooling to room temperature, the obtained suspension was filtered through a polytetrafluoroethylene disc membrane, and then washed with 60-75mL ethanol vacuum filtration to remove unreacted maleimide ; Finally, the filter cake was collected and vacuum-dried at room temperature to obtain M@GNS;
步骤3、M@GNS/PAA/PI的合成Step 3. Synthesis of M@GNS/PAA/PI
在氮气气氛下,向三颈烧瓶中加入0.5940~0.5950g 4,4-二氨基二苯甲烷(MDA)和8.5~9.5mL N,N二甲基甲酰胺并溶解,加入M@GNS并超声50~60min,在冰水浴下搅拌5~10min,然后加入0.9000~0.9010g 3,3’-4,4’-联苯四甲酸二酐(BPDA)和分子筛,在冰水浴中搅拌15~20min,得到M@GNS/PAA溶液;随后加入0.15~0.2mL三乙胺和0.08~0.1mL吡啶,得到M@GNS/PAA/PI溶液;Under nitrogen atmosphere, add 0.5940~0.5950
步骤4、M@GNS/PI的合成
将得到的M@GNS/PAA/PI溶液浇注在干净的玻璃基板上,用刮刀进行涂层,并在60~70℃下干燥1~1.5h;最后通过梯度热亚胺化,即制得M@GNS/PI导热复合材料。The obtained M@GNS/PAA/PI solution was cast on a clean glass substrate, coated with a doctor blade, and dried at 60-70 °C for 1-1.5 h; finally, M@GNS/PAA/PI was prepared by gradient thermal imidization. @GNS/PI thermally conductive composites.
进一步地,步骤4中所述梯度热亚胺化的程序为:首先在120℃加热1h,然后在200℃加热1h,最后在250℃加热1h。Further, the procedure of the gradient thermal imidization in
进一步地,步骤3中,M@GNS的加入量占4,4-二氨基二苯甲烷和3,3’-4,4’-联苯四甲酸二酐总质量的0~15wt%。Further, in step 3, the amount of M@GNS added accounts for 0-15wt% of the total mass of 4,4-diaminodiphenylmethane and 3,3'-4,4'-biphenyltetracarboxylic dianhydride.
本发明还公开了按照上述制备方法所获得的M@GNS/PI复合材料。The invention also discloses the M@GNS/PI composite material obtained by the above preparation method.
本发明的有益效果体现在:The beneficial effects of the present invention are embodied in:
1、本发明在复合材料内部通过共价键构建出石墨烯与聚酰亚胺热传递路径,得益于功能化物质马来酰亚胺与聚酰亚胺之间形成的C-N-C键的作用,大大增强了石墨烯与基体的热传递性能。同时,马来酰亚胺与石墨烯之间形成的共价键也有效提升了填料的分散性,完善复合材料整体导热性能。1. The present invention constructs a heat transfer path between graphene and polyimide through covalent bonds inside the composite material, benefiting from the effect of the C-N-C bond formed between the functionalized substance maleimide and polyimide, The heat transfer performance between graphene and the substrate is greatly enhanced. At the same time, the covalent bond formed between maleimide and graphene also effectively improves the dispersibility of the filler and improves the overall thermal conductivity of the composite material.
2、本发明的方法可以将羧基封端的PAA(聚酰胺酸)与功能化石墨烯之间通过C-N-C键相连,增强石墨烯与基体的相容性,从而实现在低含量填料填充下显著提高聚酰亚胺复合材料的导热性能。2. The method of the present invention can connect the carboxyl-terminated PAA (polyamic acid) and the functionalized graphene through C-N-C bonds, so as to enhance the compatibility between graphene and the matrix, so as to achieve a significant increase in the polymerization under low-content filler filling. Thermal conductivity of imide composites.
附图说明Description of drawings
图1为本发明功能化石墨烯与聚酰胺酸的反应机理图,其中(a)为马来酰亚胺改性石墨烯后与聚酰胺酸的反应机理图、(b)为聚酰胺酸部分亚胺化为聚酰亚胺的过程;Fig. 1 is the reaction mechanism diagram of functionalized graphene of the present invention and polyamic acid, wherein (a) is the reaction mechanism diagram with polyamic acid after maleimide-modified graphene, (b) is the polyamic acid part The process of imidization to polyimide;
图2为本发明实施例1所得GNS和M@GNS的SEM图,其中(a)为GNS、(b)为M@GNS;Fig. 2 is the SEM image of the GNS and M@GNS obtained in Example 1 of the present invention, wherein (a) is GNS and (b) is M@GNS;
图3为本发明各实施例和对比例所得复合材料的导热系数图。FIG. 3 is a graph of the thermal conductivity of the composite materials obtained in each embodiment of the present invention and a comparative example.
具体实施方式Detailed ways
下面对本发明的实施例作详细说明,本实施例在以本发明技术方案为前提下进行实施,给出了详细的实施方式和具体的操作过程,但本发明的保护范围不限于下述的实施例。The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and provides a detailed implementation manner and a specific operation process, but the protection scope of the present invention is not limited to the following implementation. example.
实施例1Example 1
本实施例按如下步骤制备5wt%M@GNS/PI复合材料In this example, 5wt% M@GNS/PI composite material was prepared according to the following steps
步骤1、GNS的制备Step 1. Preparation of GNS
将石墨箔片作为阳极、铂片作为阴极、0.1mol/L的硫酸铵水溶液作为电解液,剥离电压为15V恒压,对石墨箔片进行电化学剥离,经抽滤洗涤干燥后,得到GNS。Using graphite foil as anode, platinum foil as cathode, 0.1 mol/L ammonium sulfate aqueous solution as electrolyte, stripping voltage of 15V constant voltage, electrochemical stripping of graphite foil, washing and drying by suction filtration to obtain GNS.
步骤2、M@GNS的合成
将45mg马来酰亚胺溶解在40mL N,N二甲基甲酰胺中,向溶液中加入10mg GNS,超声50min,然后在120℃油浴中加热16h,再在紫外线下照射13min;冷却至室温后,将所得悬浮液通过聚四氟乙烯圆盘膜(0.1μm孔径,直径50mm)过滤,然后用75mL乙醇真空抽滤洗涤,除去任何未反应的马来酰亚胺;最后,收集滤饼并在室温下真空干燥,获得M@GNS。Dissolve 45mg maleimide in 40mL N,N dimethylformamide, add 10mg GNS to the solution, sonicate for 50min, then heat in an oil bath at 120°C for 16h, and then irradiate under ultraviolet light for 13min; cool to room temperature Then, the resulting suspension was filtered through a polytetrafluoroethylene disc membrane (0.1 μm pore size, 50 mm in diameter), and then washed with 75 mL of ethanol by vacuum filtration to remove any unreacted maleimide; finally, the filter cake was collected and Vacuum dried at room temperature to obtain M@GNS.
步骤3、M@GNS/PAA/PI的合成Step 3. Synthesis of M@GNS/PAA/PI
在氮气气氛下,向三颈烧瓶中加入0.5948g 4,4-二氨基二苯甲烷和9mL N,N二甲基甲酰胺并溶解,按照5wt%的质量分数(占4,4-二氨基二苯甲烷和3,3’-4,4’-联苯四甲酸二酐总质量的5wt%)加入M@GNS并超声50min,在冰水浴下搅拌5min,然后加入0.9003g 3,3’-4,4’-联苯四甲酸二酐和分子筛,在冰水浴中搅拌15min,得到具有一定粘度的M@GNS/PAA溶液;随后加入0.2mL三乙胺和0.1mL吡啶,得到具有一定粘度的M@GNS/PAA/PI溶液。Under nitrogen atmosphere, 0.5948g of 4,4-diaminodiphenylmethane and 9mL of N,N dimethylformamide were added to the three-necked flask and dissolved, according to the mass fraction of 5wt% (accounting for 4,4-diaminodiphenylmethane). phenylmethane and 5 wt% of the total mass of 3,3'-4,4'-biphenyltetracarboxylic dianhydride) were added to M@GNS and sonicated for 50 min, stirred for 5 min in an ice-water bath, and then added 0.9003 g of 3,3'-4 ,4'-biphenyltetracarboxylic dianhydride and molecular sieves were stirred in an ice-water bath for 15 min to obtain a M@GNS/PAA solution with a certain viscosity; then 0.2 mL of triethylamine and 0.1 mL of pyridine were added to obtain a M@GNS/PAA solution with a certain viscosity @GNS/PAA/PI solution.
步骤4、M@GNS/PI的合成
将得到的M@GNS/PAA/PI溶液浇注在干净的玻璃基板上,用刮刀进行涂层,并在60℃下干燥1.5h;最后通过梯度热亚胺化(首先在120℃加热1h,然后在200℃加热1h,最后在250℃加热1h),即制得M@GNS/PI导热复合薄膜。The obtained M@GNS/PAA/PI solution was cast on a clean glass substrate, coated with a doctor blade, and dried at 60 °C for 1.5 h; Heating at 200 °C for 1 h, and finally heating at 250 °C for 1 h), the M@GNS/PI thermally conductive composite film was obtained.
实施例2Example 2
本实施例按实施例1相同的方法制备10wt%M@GNS/PI复合材料,区别仅在于步骤3中按照10wt%的质量分数加入M@GNS。In this example, a 10wt% M@GNS/PI composite material was prepared in the same way as in Example 1, except that in step 3, M@GNS was added at a mass fraction of 10wt%.
实施例3Example 3
本实施例按实施例1相同的方法制备15wt%M@GNS/PI复合材料,区别仅在于步骤3中按照15wt%的质量分数加入M@GNS。In this example, a 15wt% M@GNS/PI composite material was prepared by the same method as Example 1, except that in step 3, M@GNS was added at a mass fraction of 15wt%.
对比例1Comparative Example 1
本对比例按如下步骤制备5wt%GNS/PI复合材料:In this comparative example, a 5wt% GNS/PI composite was prepared as follows:
步骤1、GNS的制备Step 1. Preparation of GNS
将石墨箔片作为阳极、铂片作为阴极、0.1mol/L的硫酸铵水溶液作为电解液,剥离电压为15V恒压,对石墨箔片进行电化学剥离,经抽滤洗涤干燥后,得到GNS。Using graphite foil as anode, platinum foil as cathode, 0.1 mol/L ammonium sulfate aqueous solution as electrolyte, stripping voltage of 15V constant voltage, electrochemical stripping of graphite foil, washing and drying by suction filtration to obtain GNS.
步骤2、GNS/PI复合材料的制备
在氮气气氛下,向三颈烧瓶中加入0.5948g 4,4-二氨基二苯甲烷和9mL N,N二甲基甲酰胺并溶解,按照5wt%的质量分数(占4,4-二氨基二苯甲烷和3,3’-4,4’-联苯四甲酸二酐总质量的5wt%)加入GNS并超声100min,在冰水浴下搅拌5min,然后加入0.9003g 3,3’-4,4’-联苯四甲酸二酐和分子筛,在冰水浴中搅拌15min,得到具有一定粘度的M@GNS/PAA溶液;随后加入0.2mL三乙胺和0.1mL吡啶,得到具有一定粘度的GNS/PAA/PI溶液。Under nitrogen atmosphere, 0.5948g of 4,4-diaminodiphenylmethane and 9mL of N,N dimethylformamide were added to the three-necked flask and dissolved, according to the mass fraction of 5wt% (accounting for 4,4-diaminodiphenylmethane). phenylmethane and 5wt% of the total mass of 3,3'-4,4'-biphenyltetracarboxylic dianhydride) were added to GNS and sonicated for 100min, stirred for 5min under an ice-water bath, and then added 0.9003g of 3,3'-4,4 '-Biphenyltetracarboxylic dianhydride and molecular sieves were stirred in an ice-water bath for 15 min to obtain M@GNS/PAA solution with a certain viscosity; then 0.2 mL of triethylamine and 0.1 mL of pyridine were added to obtain GNS/PAA with a certain viscosity /PI solution.
步骤3、GNS/PI的合成Step 3. Synthesis of GNS/PI
将得到的GNS/PAA/PI溶液浇注在干净的玻璃基板上,用刮刀进行涂层,并在60℃下干燥1.5h;最后通过梯度热亚胺化(首先在120℃加热1h,然后在200℃加热1h,最后在250℃加热1h),即制得GNS/PI导热复合薄膜。The resulting GNS/PAA/PI solution was cast on a clean glass substrate, coated with a doctor blade, and dried at 60 °C for 1.5 h; finally, by gradient thermal imidization (first at 120 °C for 1 h, then at 200 °C for 1.5 h). ℃ heating for 1 h, and finally heating at 250 ℃ for 1 h) to obtain the GNS/PI thermally conductive composite film.
对比例2Comparative Example 2
本对比例按对比例1相同的方法制备10wt%GNS/PI复合材料,区别仅在于步骤2中按照10wt%的质量分数(占4,4-二氨基二苯甲烷和3,3’-4,4’-联苯四甲酸二酐总质量的10wt%)加入GNS。In this comparative example, a 10wt% GNS/PI composite material was prepared in the same way as in Comparative Example 1, except that in
对比例3Comparative Example 3
本对比例按对比例1相同的方法制备15wt%GNS/PI复合材料,区别仅在于步骤2中按照15wt%的质量分数(占4,4-二氨基二苯甲烷和3,3’-4,4’-联苯四甲酸二酐总质量的15wt%)加入GNS。In this comparative example, a 15wt% GNS/PI composite material was prepared in the same way as in Comparative Example 1, except that in
图1为马来酰亚胺改性石墨烯与聚酰胺酸的反应机理图,从图上可以看出M@GNS的功能化物质马来酰亚胺中的N-H基团可以通过化学亚胺法与羧基封端的聚酰胺酸(PAA)反应,并使得马来酰亚胺与聚酰胺酸(PAA)端部的羧基之间通过C-N-C键进行桥接。同时聚酰胺酸(PAA)的内部会进行部分亚胺化生成PAA/PI。Figure 1 shows the reaction mechanism of maleimide-modified graphene and polyamic acid. It can be seen from the figure that the N-H group in maleimide, the functionalized substance of M@GNS, can be obtained by chemical imine method. It reacts with carboxyl-terminated polyamic acid (PAA), and bridges between maleimide and the carboxyl group at the end of polyamic acid (PAA) through a C-N-C bond. At the same time, the interior of polyamic acid (PAA) will undergo partial imidization to generate PAA/PI.
图2为马来酰亚胺改性石墨烯前后的SEM图,从图上可以看到改性前GNS表面较为光滑,改性后石墨烯表面存在有机物小颗粒,这说明通过马来酰亚胺与石墨烯之间形成共价键作用,马来酰亚胺成功接在石墨烯表面。Figure 2 shows the SEM images before and after maleimide modification of graphene. From the figure, it can be seen that the surface of GNS before modification is relatively smooth, and there are small organic particles on the surface of graphene after modification, which indicates that through maleimide A covalent bond was formed with graphene, and maleimide was successfully attached to the surface of graphene.
图3为各实施例与对比例热导率测试结果,从图上可以看到,随着填料含量增加,复合材料热导率呈递增趋势,这是因为填料含量越高导热路径越密集,并且在相同填料下,M@GNS/PI复合材料导热系数均高于GNS/PI复合材料,这说明功能化物质马来酰亚胺与聚酰亚胺之间形成的C-N-C键的作用,大大增强了石墨烯与基体的热传递性能。同时,马来酰亚胺与石墨烯之间形成的共价键也有效提升了填料的分散性,完善了复合材料的整体导热性能。Figure 3 shows the thermal conductivity test results of each embodiment and the comparative example. It can be seen from the figure that as the filler content increases, the thermal conductivity of the composite material tends to increase. This is because the higher the filler content, the denser the thermal conduction path, and Under the same filler, the thermal conductivity of M@GNS/PI composites is higher than that of GNS/PI composites, which indicates that the effect of the C-N-C bond formed between the functionalized substance maleimide and polyimide greatly enhances the Heat transfer properties of graphene and substrate. At the same time, the covalent bond formed between maleimide and graphene also effectively improved the dispersibility of the filler and improved the overall thermal conductivity of the composite material.
以上仅为本发明的示例性实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所做的任何修改,等同替换和改进等,均应包含在本发明的保护范围之内。The above are only exemplary embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention. within.
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