CN114603961A - Protective film base material for cutting integrated circuit packaging substrate - Google Patents

Protective film base material for cutting integrated circuit packaging substrate Download PDF

Info

Publication number
CN114603961A
CN114603961A CN202210379648.9A CN202210379648A CN114603961A CN 114603961 A CN114603961 A CN 114603961A CN 202210379648 A CN202210379648 A CN 202210379648A CN 114603961 A CN114603961 A CN 114603961A
Authority
CN
China
Prior art keywords
parts
surface layer
layer
density polyethylene
polyolefin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210379648.9A
Other languages
Chinese (zh)
Inventor
李丹丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qianhui Semiconductor Technology Suzhou Co ltd
Original Assignee
Qianhui Semiconductor Technology Suzhou Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qianhui Semiconductor Technology Suzhou Co ltd filed Critical Qianhui Semiconductor Technology Suzhou Co ltd
Priority to CN202210379648.9A priority Critical patent/CN114603961A/en
Publication of CN114603961A publication Critical patent/CN114603961A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/327—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polyolefins obtained by a metallocene or single-site catalyst
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/242—All polymers belonging to those covered by group B32B27/32
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/04—Homopolymers or copolymers of ethene
    • C08J2423/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate

Abstract

The invention provides a protective film base material for cutting an integrated circuit packaging substrate, which relates to the technical field of semiconductors, and comprises an outer surface layer, an intermediate layer and an inner surface layer; wherein, the intermediate layer is arranged between the outer surface layer and the inner surface layer, and the outer surface layer and the inner surface layer are both independently prepared by the following components: nano zinc oxide, a coupling agent, a diluent and low-density polyethylene; the middle layer is mainly prepared from the following components: metallocene linear low density polyethylene, ethylene-vinyl acetate copolymer and/or polyethylene elastomer and antioxidant. The invention solves the technical problem that the polyolefin film is easy to generate electrostatic charge aggregation, and achieves the technical effects of low surface resistance, excellent antistatic property and better tensile strength of the polyolefin film.

Description

Protective film base material for cutting integrated circuit packaging substrate
Technical Field
The invention relates to the technical field of semiconductors, in particular to a protective film substrate for cutting an integrated circuit packaging substrate.
Background
The substrate film of the existing wafer cutting scribing film is generally generated by adopting single type polyethylene and adding part of auxiliary agent for polymerization, and the production process is generally blow molding, flow casting and calendaring. In order to ensure that the base material has better bonding strength with the adhesive in the subsequent gluing process, the base material is subjected to surface corona treatment in the base material production process. Although the static electricity removing process is carried out in the production process, the base material belongs to an electric poor conductor, so that static electricity accumulation is easily generated in the winding and unwinding process, and the static electricity accumulation is too much, so that the defect that dust is easily adsorbed to the base material is brought, and in the subsequent cutting process, the risk that the wafer microcircuit is broken down due to too high static voltage even exists.
In order to reduce the electrostatic voltage, the conventional dicing tape often performs an antistatic agent coating process on the surface of the substrate, which not only increases the manufacturing cost, the process complexity and the uncertainty in the dicing process of the dicing tape, but also leads to a strict limitation on the film tearing speed in the film tearing process due to the antistatic property, or leads to a higher electrostatic accumulation.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
An object of the present invention is to provide a polyolefin film having low surface resistance, excellent antistatic properties and good tensile strength.
The second purpose of the invention is to provide a preparation method of the polyolefin film, which has simple process and high yield and is suitable for industrial production.
It is another object of the present invention to provide a dicing tape having a low surface resistance, excellent antistatic properties, and good tensile strength.
The fourth purpose of the present invention is to provide a method for preparing the wafer dicing tape, which has the advantages of simple process, high yield and suitability for industrial production.
The fifth objective of the present invention is to provide an application of the polyolefin film in the cutting of the integrated circuit package substrate.
In order to achieve the above purpose of the present invention, the following technical solutions are adopted:
in a first aspect, a polyolefin film comprises an outer skin layer, an intermediate layer, and an inner skin layer;
the middle layer is arranged between the outer surface layer and the inner surface layer;
the outer surface layer and the inner surface layer are both independently prepared from the following components:
nano zinc oxide, a coupling agent, a diluent and low-density polyethylene;
the middle layer is mainly prepared from the following components:
metallocene linear low density polyethylene, ethylene-vinyl acetate copolymer and/or polyethylene elastomer and antioxidant.
Further, the outer surface layer is mainly prepared from the following components in parts by weight:
10-65 parts of nano zinc oxide, 2-20 parts of coupling agent, 5-20 parts of diluent and 20-50 parts of low-density polyethylene;
preferably, the inner surface layer is mainly prepared from the following components in parts by mass:
10-65 parts of nano zinc oxide, 2-20 parts of coupling agent, 5-20 parts of diluent and 20-50 parts of low-density polyethylene;
preferably, the intermediate layer is mainly prepared from the following components in parts by mass:
10-40 parts of metallocene linear low-density polyethylene, 60-90 parts of ethylene-vinyl acetate copolymer and/or polyethylene elastomer and 1-3 parts of antioxidant.
Further, the outer surface layer is mainly prepared from the following components in parts by weight:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene;
preferably, the inner surface layer is mainly prepared from the following components in parts by mass:
50 parts of nano zinc oxide, 5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene;
preferably, the intermediate layer is mainly prepared from the following components in parts by mass:
25 parts of metallocene linear low-density polyethylene, 65 parts of ethylene-vinyl acetate copolymer and/or polyethylene elastomer and 2 parts of antioxidant.
Further, the coupling agent comprises a titanate coupling agent;
preferably, the diluent comprises white oil;
preferably, the antioxidant comprises basf B216 antioxidant.
Further, the thickness of the outer surface layer and the inner surface layer is 5-30 microns, preferably 10 microns;
preferably, the thickness of the intermediate layer is 70-90 microns, preferably 80 microns.
In a second aspect, a method for preparing the polyolefin film comprises the following steps:
mixing the components of the outer surface layer to obtain an outer surface layer material;
mixing the components of the middle layer to obtain a middle layer material;
mixing the components of the inner surface layer to obtain an inner surface layer material;
and carrying out tape casting on the outer surface layer material, the middle layer material and the inner surface layer material to obtain the polyolefin film.
In a third aspect, a wafer dicing tape includes a substrate layer and a bonding glue layer;
the material of the substrate layer comprises the polyolefin film.
Further, the thickness of the adhesive glue layer is 10-20 microns, and preferably 15 microns.
In a fourth aspect, a method for preparing a wafer dicing tape includes the steps of:
and coating the bonding glue on the substrate layer to obtain the wafer dicing tape.
In a fifth aspect, the polyolefin film is applied to cutting of an integrated circuit packaging substrate.
Compared with the prior art, the invention has at least the following beneficial effects:
the polyolefin film provided by the invention adopts a three-layer structure and comprises an outer surface layer, a middle layer and an inner surface layer, wherein the middle layer is arranged between the outer surface layer and the inner surface layer; the outer surface layer and the inner surface layer are both mainly prepared from nano zinc oxide (by utilizing the conductivity of metal oxide), a coupling agent (as a bridging agent of the metal oxide and high-molecular polymer resin), a diluent (as a process aid to enable the metal nano zinc oxide treated by the coupling agent to be better dispersed in resin) and low-density polyethylene (as a resin main body of the film material), the middle layer is mainly prepared from metallocene linear low-density polyethylene, an ethylene-vinyl acetate copolymer and/or a polyethylene elastomer and an antioxidant, the middle layer provides certain rigidity, and the outer surface layer and the middle layer have synergistic action to contribute to good longitudinal and transverse uniformity to the whole film material; the inner surface layer provides a lower surface resistance to enhance the electrostatic discharge effect in cooperation with a subsequently applied adhesive layer. The friction between the base material and the outer surface can generate static electricity when unreeling, and the film tearing static electricity can be generated when the PET release protection film is separated from the adhesive layer when a product is used, so that the adhesive layer and the inner surface layer are required to have lower surface resistance to release the film tearing static electricity, and the outer surface layer and the inner surface layer can cooperate to provide certain antistatic performance. In conclusion, the three-layer structures prepared from the specific raw materials can be matched with each other, so that the surface resistance of the inner surface and the outer surface exposed outside can be reduced to 106-109Testing the residual electrostatic voltage U between omega by adopting a half-life period method10SLess than 50V, excellent antistatic performance and better tensile strength.
The preparation method of the polyolefin film provided by the invention has the advantages of simple process and high yield, and is suitable for industrial production.
The wafer dicing tape provided by the invention has low surface resistance, excellent antistatic performance and better tensile strength.
The preparation method of the wafer dicing tape provided by the invention is simple in process, high in yield and suitable for industrial production.
The polyolefin film provided by the invention has better cutting effect when applied to the cutting of the integrated circuit packaging substrate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a polyolefin film according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a wafer dicing tape according to an embodiment of the present invention.
An icon: 1-outer surface layer; 2-an intermediate layer; 3-inner surface layer; 4-adhesive layer; 5-a substrate layer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to a first aspect of the present invention, there is provided a polyolefin film comprising an outer skin layer, an intermediate layer and an inner skin layer;
wherein the middle layer is arranged between the outer surface layer and the inner surface layer;
the outer surface layer and the inner surface layer are both independently prepared from the following components:
nano zinc oxide, a coupling agent, a diluent and low density polyethylene;
the middle layer is mainly prepared from the following components:
metallocene linear low density polyethylene, ethylene-vinyl acetate copolymer and/or polyethylene elastomer and antioxidant.
The polyolefin film provided by the invention adopts a three-layer structure and comprises an outer surface layer, a middle layer and an inner surface layer, wherein the middle layer is arranged between the outer surface layer and the inner surface layer; wherein, the outer surface layer and the inner surface layer are mainly prepared by nano zinc oxide, coupling agent, diluent and low density polyethylene, and the middle layer is mainly prepared by metallocene linear low density polyethylene, ethylene-vinyl acetate copolymer and/or polyethylene elastomer and antioxidant; the three-layer structure prepared by specific raw materials can be matched with each other, so that the surface resistance of the exposed inner and outer surfaces is reduced to 106-109Testing the residual electrostatic voltage U between omega by adopting a half-life period method10SLess than 50V, excellent antistatic performance and better tensile strength.
In a preferred embodiment, the outer skin layer of the polyolefin film of the present invention is prepared from the following components in parts by weight:
10-65 parts of nano zinc oxide, 2-20 parts of coupling agent, 5-20 parts of diluent and 20-50 parts of low-density polyethylene.
Wherein, typical but non-limiting mass portions of the nano zinc oxide are, for example, 10 portions, 15 portions, 20 portions, 25 portions, 30 portions, 35 portions, 40 portions, 45 portions, 50 portions, 55 portions, 60 portions and 65 portions; typical but non-limiting parts by mass of coupling agent are for example 2 parts, 2.5 parts, 3 parts, 4 parts, 5 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts; typical but non-limiting parts by mass of diluent are for example 5 parts, 8 parts, 10 parts, 12 parts, 15 parts, 17 parts, 18 parts, 19 parts, 20 parts; typical but not limiting parts by mass of the low density polyethylene are, for example, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts.
In a preferred embodiment, the inner skin layer of the polyolefin film of the present invention is prepared from the following components in parts by mass:
10-65 parts of nano zinc oxide, 2-20 parts of coupling agent, 5-20 parts of diluent and 20-50 parts of low-density polyethylene.
Wherein, typical but non-limiting mass portions of the nano zinc oxide are, for example, 10 portions, 15 portions, 20 portions, 25 portions, 30 portions, 35 portions, 40 portions, 45 portions, 50 portions, 55 portions, 60 portions and 65 portions; typical but non-limiting parts by mass of coupling agent are for example 2 parts, 2.5 parts, 3 parts, 4 parts, 5 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts; typical but non-limiting parts by mass of diluent are for example 5 parts, 8 parts, 10 parts, 12 parts, 15 parts, 17 parts, 18 parts, 19 parts, 20 parts; typical but not limiting parts by mass of the low density polyethylene are, for example, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts.
In a preferred embodiment, the middle layer of the polyolefin film of the invention is prepared from the following components in parts by mass:
10-40 parts of metallocene linear low-density polyethylene, 60-90 parts of ethylene-vinyl acetate copolymer and/or polyethylene elastomer and 1-3 parts of antioxidant.
The content of the vinyl acetate VA in the ethylene-vinyl acetate copolymer is 5-25%, for example, 5%, 8%, 10%, 12%, 15%, 18%, 20%, 23%, 25%, and preferably 18%, and the specific content of the vinyl acetate VA in the ethylene-vinyl acetate copolymer selected by the invention can improve the performance of the ethylene-vinyl acetate copolymer and enhance the synergistic effect with the metallocene linear low-density polyethylene, thereby improving the comprehensive performance of the middle layer and improving the overall performance of the polyolefin film.
Wherein, typical but non-limiting mass parts of the metallocene linear low density polyethylene are, for example, 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts and 40 parts; typical but not limiting parts by mass of the ethylene-vinyl acetate copolymer and/or the polyethylene elastomer are, for example, 60 parts, 62 parts, 65 parts, 68 parts, 70 parts, 72 parts, 75 parts, 78 parts, 80 parts, 82 parts, 85 parts, 88 parts, 90 parts; typical but non-limiting parts by mass of the antioxidant are, for example, 1 part, 2 parts, 3 parts.
The invention is a three-layer structure prepared by specific raw materials and mass ratio thereof, and the specific three-layer structure can be mutually matched, so that the surface resistance of the exposed inner and outer surfaces is reduced to 106-109Testing the residual electrostatic voltage U between omega by adopting a half-life period method10SLess than 50V, excellent antistatic performance and better tensile strength.
In a preferred embodiment, the outer skin layer of the polyolefin film of the present invention is prepared from the following components in parts by weight:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene.
In a preferred embodiment, the inner skin layer of the polyolefin film of the present invention is prepared from the following components in parts by mass:
50 parts of nano zinc oxide, 5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene.
In a preferred embodiment, the middle layer of the polyolefin film of the invention is prepared from the following components in parts by mass:
25 parts of metallocene linear low-density polyethylene, 65 parts of ethylene-vinyl acetate copolymer and/or polyethylene elastomer and 2 parts of antioxidant.
The raw materials of the inner surface layer, the outer surface layer and the middle layer selected by the invention and the specific mass part ratio thereof can enable the polyolefin film with a three-layer structure to have lower surface resistance and more excellent antistatic property, and further improve the tensile strength of the material.
In the present invention, the coupling agent, the diluent and the antioxidant to be added are not particularly limited as long as they are additives capable of achieving a coupling function, a diluting function and an antioxidant function.
In a preferred embodiment, the coupling agent of the invention includes, but is not limited to, a titanate coupling agent, such as, but not limited to, the kenglissan titanate coupling agent KR-TTS; diluents of the present invention include, but are not limited to, white oil; antioxidants of the present invention include, but are not limited to, basf B216 antioxidant.
The coupling agent, the diluent and the antioxidant of the specific type selected by the invention can better interact with respective raw materials, and the antistatic property and the tensile strength of the polyolefin film are further improved.
In a preferred embodiment, the outer skin layer of the polyolefin film of the present invention has a thickness of 5 to 30 microns, with typical but non-limiting thicknesses such as 5 microns, 8 microns, 10 microns, 12 microns, 13 microns, 15 microns, 16 microns, 18 microns, 20 microns, 22 microns, 23 microns, 25 microns, 26 microns, 28 microns, 30 microns, and may preferably be 10 microns; the thickness of the inner skin layer of the polyolefin film of the present invention is 5 to 30 microns, with typical but non-limiting thicknesses such as 5 microns, 8 microns, 10 microns, 12 microns, 13 microns, 15 microns, 16 microns, 18 microns, 20 microns, 22 microns, 23 microns, 25 microns, 26 microns, 28 microns, 30 microns, and may preferably be 10 microns; the thickness of the middle layer of the polyolefin film of the present invention is 70 to 90 micrometers, and its typical but non-limiting thickness is, for example, 70 micrometers, 72 micrometers, 74 micrometers, 76 micrometers, 78 micrometers, 80 micrometers, 82 micrometers, 84 micrometers, 86 micrometers, 88 micrometers, 90 micrometers, and may preferably be 80 micrometers.
The thickness of the outer surface layer, the thickness of the inner surface layer and the thickness of the middle layer selected by the invention can further improve the comprehensive performance of the polyolefin film.
A typical polyolefin film, as shown in figure 1, comprises an outer skin layer 1, an intermediate layer 2 and an inner skin layer 3:
the middle layer 2 is arranged between the outer surface layer 1 and the inner surface layer 3, the thickness of the outer surface layer 1 is 5-30 microns, the thickness of the middle layer 2 is 70-90 microns, and the thickness of the inner surface layer 3 is 5-30 microns;
wherein, the outer surface layer 1 is mainly prepared from the following components in parts by weight:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene; wherein the coupling agent is titanate coupling agent, and the diluent is white oil;
the middle layer 2 is mainly prepared from the following components in parts by mass:
25 parts of metallocene linear low-density polyethylene, 65 parts of ethylene-vinyl acetate copolymer and/or polyethylene elastomer and 2 parts of antioxidant; the casting film auxiliary agent is a chemical auxiliary agent with a low molecular weight polyfunctional group structure, and the antioxidant is a Basf B216 antioxidant;
the inner surface layer 3 is mainly prepared from the following components in parts by mass:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene; wherein the coupling agent is titanate coupling agent, and the diluent is white oil.
The three-layer structure polyolefin film prepared by specific raw materials and specific dosage thereof can be mutually matched, so that the surface resistance of the exposed inner and outer surfaces is reduced to 106-109Testing the residual electrostatic voltage U between omega by adopting a half-life period method10SLess than 50V, excellent antistatic performance and good tensile strength.
According to a second aspect of the present invention, there is provided a method for preparing the polyolefin film, comprising the steps of:
mixing the components of the outer surface layer to obtain an outer surface layer material;
mixing the components of the middle layer to obtain a middle layer material;
mixing the components of the inner surface layer to obtain an inner surface layer material;
and carrying out tape casting on the outer surface layer material, the middle layer material and the inner surface layer material to obtain the polyolefin film.
The preparation method of the polyolefin film provided by the invention has the advantages of simple process and high yield, and is suitable for industrial production.
A method of preparing a typical polyolefin film, comprising the steps of:
preparing master batch materials of the inner surface layer and the outer surface layer: putting nano zinc oxide powder, a coupling agent and a diluent into a high-speed mixer according to a certain proportion, fully and uniformly mixing, then putting the mixed powder and carrier resin low-density polyethylene into a feeding bin of a double-screw granulator, starting the double-screw granulator to heat, starting the double-screw granulator to granulate after the temperature reaches a set temperature, fully drying the master batch for later use after the master batch is manufactured, and obtaining master batch materials of the inner surface layer and the outer surface layer;
preparing an intermediate layer material: mixing metallocene linear low-density polyethylene, ethylene-vinyl acetate copolymer (or polyethylene elastomer), casting film auxiliary agent and antioxidant in proportion to obtain an intermediate layer material;
tape casting: adopting a SDLZ/CPO-1700 casting machine for production, and placing the prepared inner and outer surface layers and the middle layer material in a hopper of an extruder, wherein the temperatures of 1-3 areas of the extruder are respectively set to be 195 ℃, 210 ℃, 220 ℃, and the temperatures of other areas and a die head are set to be 240 ℃; the die head (configured with the American Koro mixing die head) is a coat-hanger type co-extrusion die head, melts of materials of the inner surface layer, the outer surface layer and the middle layer are cast on a cooling iron roller through the die head for cooling and forming, and then are respectively drawn to pass through a steel roller embossing device, a corona device and a winding mechanism to be wound into a roll-shaped base material original film, so that the polyolefin film is obtained.
The preparation method of the polyolefin film provided by the invention has the advantages that the process is simple, the method is suitable for industrial production, the yield is high, and the obtained polyolefin film with the three-layer structure has the characteristics of low surface resistance of the inner surface and the outer surface, high antistatic performance and good tensile strength.
According to a third aspect of the present invention, there is provided a wafer dicing tape, comprising a substrate layer and an adhesive layer, wherein the material of the substrate layer comprises the above three-layer polyolefin film.
The wafer dicing tape provided by the invention has the advantages of low surface resistance, excellent antistatic performance, good tensile strength and strong bonding force between the substrate layer and the bonding adhesive layer.
In a preferred embodiment, the adhesive layer of the dicing tape of the invention has a thickness of 10 to 20 microns, with typical but non-limiting thicknesses being, for example, 10 microns, 12 microns, 14 microns, 16 microns, 18 microns, 20 microns, and preferably 15 microns.
The thickness of the adhesive layer selected by the invention can further improve the comprehensive performance of the wafer dicing tape.
A typical dicing tape, as shown in fig. 2, includes a substrate layer 5 and an adhesive layer 4, where the substrate layer 5 includes an outer surface layer 1, an intermediate layer 2, and an inner surface layer 3:
the adhesive layer 4 is arranged on the substrate layer 5 in a laminating mode, the thickness of the adhesive layer is 10-20 micrometers, the middle layer 2 of the substrate layer 5 is arranged between the outer surface layer 1 and the inner surface layer 3, the thickness of the outer surface layer 1 is 5-30 micrometers, the thickness of the middle layer 2 is 70-90 micrometers, and the thickness of the inner surface layer 3 is 5-30 micrometers.
The wafer dicing tape with the specific structure provided by the invention is formed by laminating the substrate layer with the specific structure and the bonding adhesive layer, has the characteristics of low surface resistance, high antistatic performance and good tensile strength, and has strong bonding force between the substrate layer and the bonding adhesive layer.
According to a fourth aspect of the present invention, there is provided a method for preparing the above wafer dicing tape, comprising the steps of:
and coating the adhesive glue on a polyolefin film to obtain the wafer dicing tape.
The preparation method of the wafer dicing tape provided by the invention is simple in process, high in yield and suitable for industrial production.
A preparation method of a typical wafer dicing tape comprises the following steps:
the single-sided release PET film is used for transfer coating, and glue is coated on the inner surface layer or the outer surface layer of the polyolefin film with the three-layer structure provided by the invention through a coating machine to form a bonding glue layer, so that the protective adhesive tape for wafer cutting, namely the wafer dicing adhesive tape, is obtained.
The preparation method of the wafer dicing tape provided by the invention has the advantages of simple process, suitability for industrial production and high yield, the obtained wafer dicing tape has the characteristics of low surface resistance, high antistatic property and good tensile strength, and the bonding force between the substrate layer and the bonding adhesive layer is strong and the comprehensive performance is good.
According to a fifth aspect of the present invention, there is provided an application of the polyolefin film in cutting an integrated circuit package substrate, which has a better cutting effect and can improve the quality of a cut product.
The invention is further illustrated by the following examples. The materials in the examples are prepared according to known methods or are directly commercially available, unless otherwise specified.
Example 1
A polyolefin film comprises an outer surface layer, a middle layer and an inner surface layer, wherein the middle layer is arranged between the outer surface layer and the inner surface layer in a laminated mode, the thickness of the outer surface layer is 30 micrometers, the thickness of the inner surface layer is 10 micrometers, and the thickness of the middle layer is 80 micrometers;
the outer surface layer is mainly prepared from the following components in parts by weight:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene; wherein the coupling agent is a titanate coupling agent KR-TTS of Kenli, the diluent is white oil, and the low-density polyethylene is Flint Hills low-density polyethylene LDPE 5050;
the middle layer is mainly prepared from the following components in parts by mass:
35 parts of metallocene linear low-density polyethylene, 65 parts of ethylene-vinyl acetate copolymer and 2 parts of antioxidant; wherein the metallocene linear low density polyethylene is Exxon chemical metallocene linear low density polyethylene 3518CB, the ethylene-vinyl acetate copolymer is Korea chemical ethylene-vinyl acetate copolymer 2319, and the antioxidant is Basff B216 antioxidant;
the inner surface layer is mainly prepared from the following components in parts by mass:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene; wherein the coupling agent is a titanate coupling agent KR-TTS of Kenli, the diluent is white oil, and the low-density polyethylene is Flint Hills low-density polyethylene LDPE 5050.
Example 2
A polyolefin film comprises an outer surface layer, a middle layer and an inner surface layer, wherein the middle layer is arranged between the outer surface layer and the inner surface layer in a laminated mode, the thickness of the outer surface layer is 10 micrometers, the thickness of the inner surface layer is 10 micrometers, and the thickness of the middle layer is 80 micrometers;
the outer surface layer is mainly prepared from the following components in parts by weight:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene; wherein the coupling agent is a titanate coupling agent KR-TTS of Kenlie, the diluent is white oil, and the low-density polyethylene is Daqing petrochemical low-density polyethylene LDPE 18G;
the middle layer is mainly prepared from the following components in parts by mass:
35 parts of metallocene linear low-density polyethylene, 65 parts of ethylene-vinyl acetate copolymer and 2 parts of antioxidant; wherein the metallocene linear low density polyethylene is Exxon chemical metallocene linear low density polyethylene 3518CB, the ethylene-vinyl acetate copolymer is Beijing organic ethylene-vinyl acetate copolymer 14-2, and the antioxidant is Basff B216 antioxidant;
the inner surface layer is mainly prepared from the following components in parts by mass:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene; wherein the coupling agent is a titanate coupling agent KR-TTS of Kenlie, the diluent is white oil, and the low-density polyethylene is Daqing petrochemical low-density polyethylene LDPE 18G.
Example 3
Compared with the polyolefin film of example 1, the outer skin layer of this example is mainly prepared from the following components in parts by mass:
10 parts of nano zinc oxide, 2 parts of coupling agent, 5 parts of diluent and 85 parts of low-density polyethylene; the coupling agent is a titanate coupling agent KR-TTS of Kenli, the diluent is commercially available white oil (molecular weight 2000), and the low-density polyethylene is Flint Hills low-density polyethylene LDPE 5050;
the interlayer of the embodiment is mainly prepared from the following components in parts by mass:
15 parts of metallocene linear low-density polyethylene, 85 parts of ethylene-vinyl acetate copolymer and 1 part of antioxidant; the metallocene polyethylene is Exon chemical metallocene linear low density polyethylene 3518CB, the ethylene-vinyl acetate copolymer Korea chemical ethylene-vinyl acetate copolymer 2319, and the antioxidant is Basff B216 antioxidant;
the inner surface layer of the embodiment is mainly prepared from the following components in parts by mass:
20 parts of nano zinc oxide, 10 parts of coupling agent, 10 parts of diluent and 70 parts of low-density polyethylene; the coupling agent is a titanate coupling agent KR-TTS of Kenli, the diluent is commercially available white oil (molecular weight 2000), and the low-density polyethylene is Flint Hills low-density polyethylene LDPE 5050;
the same procedure as in example 1 was repeated except that a polyolefin film was obtained.
Example 4
Compared with the polyolefin film of example 1, the outer skin layer of this example is mainly prepared from the following components in parts by mass:
35 parts of nano zinc oxide, 5 parts of coupling agent, 15 parts of diluent and 50 parts of low-density polyethylene; the coupling agent is a titanate coupling agent KR-TTS of Kenli, the diluent is commercially available white oil (molecular weight 2000), and the low-density polyethylene is Flint Hills low-density polyethylene LDPE 5050;
the interlayer of the embodiment is mainly prepared from the following components in parts by mass:
40 parts of metallocene linear low-density polyethylene, 60 parts of ethylene-vinyl acetate copolymer and 3 parts of antioxidant; the metallocene polyethylene is Exon chemical metallocene linear low density polyethylene 3518CB, the ethylene-vinyl acetate copolymer Korea chemical ethylene-vinyl acetate copolymer 2319, and the antioxidant is Basff B216 antioxidant;
the inner surface layer of the embodiment is mainly prepared from the following components in parts by mass:
35 parts of nano zinc oxide, 20 parts of coupling agent, 15 parts of diluent and 30 parts of low-density polyethylene; the coupling agent is a titanate coupling agent KR-TTS of Kenli, the diluent is commercially available white oil (molecular weight 2000), and the low-density polyethylene is Flint Hills low-density polyethylene LDPE 5050;
the same procedure as in example 1 was repeated except that a polyolefin film was obtained.
Example 5
Compared with the polyolefin film of example 2, the intermediate layer of this example is mainly prepared from the following components in parts by mass:
35 parts of metallocene linear low-density polyethylene, 90 parts of polyethylene elastomer and 3 parts of antioxidant; wherein the metallocene polyethylene is Exxon chemical metallocene linear low density polyethylene 3518CB, the polyethylene elastomer is Dow 8407, and the antioxidant is Basff B216 antioxidant;
the rest of the procedure was conducted in the same manner as in example 2 to obtain a polyolefin film.
Example 6
This example is a method of making the polyolefin film of examples 1-5, comprising the steps of:
preparing master batch materials of the inner surface layer and the outer surface layer: putting nano zinc oxide powder, a coupling agent and a diluent into a high-speed mixer according to a proportion, fully and uniformly mixing, then putting the mixed powder and carrier resin low-density polyethylene into a feeding bin of a double-screw granulator, starting the double-screw granulator for heating, starting the double-screw granulator for granulation after the temperature reaches set temperature 190-;
preparing an intermediate layer material: mixing metallocene linear low-density polyethylene, ethylene-vinyl acetate copolymer (or polyethylene elastomer), casting film auxiliary agent and antioxidant in proportion to obtain an intermediate layer material;
tape casting: the production is carried out by adopting a SDLZ/CPO-1700 casting machine of Nantong Sanxin, and the prepared materials of the inner surface layer, the outer surface layer and the middle layer are placed in a hopper of an extruder, wherein the temperatures of 1-3 areas of the extruder are respectively set to be 195 ℃, 210 ℃, 220 ℃, and the temperatures of other areas and a die head are set to be 240 ℃; the die head (configured with the American Koro mixing die head) is a coat-hanger type co-extrusion die head, melts of materials of the inner surface layer, the outer surface layer and the middle layer are cast on a cooling iron roller through the die head for cooling and forming, and then are respectively drawn to pass through a steel roller embossing device, a corona device and a winding mechanism to be wound into a roll-shaped base material original film, so that the polyolefin film is obtained.
Examples 7 to 11
A wafer dicing tape comprises a substrate layer and a bonding adhesive layer, wherein the bonding adhesive layer is stacked on the substrate layer;
the substrate layers of examples 7-11 were the polyolefin films provided in examples 1-5, respectively, and the tie coat thickness was 15 microns.
Example 12
This embodiment is a method for preparing the dicing tape for wafers of embodiments 7 to 11, including the steps of:
the single-sided release PET film with the thickness of 0.05mm is used for transfer coating, glue is coated on the inner surface layer or the outer surface layer of the corresponding polyolefin film through a Taicang wide-contained high-precision coating machine to form a bonding glue layer, and the thickness of the coated dry glue is 15 microns, so that the protective adhesive tape for wafer cutting, namely the wafer dicing adhesive tape, is obtained.
Comparative example 1
In comparison with the polyolefin film of example 1, the outer skin material of this comparative example did not contain nano zinc oxide, and the rest was the same as in example 1, to obtain a polyolefin film.
Comparative example 2
In this comparative example, nano-zinc oxide was equally substituted for the raw material nano-zinc oxide of the outer surface layer as compared with the polyolefin film of example 1, and the rest was the same as in example 1, to obtain a polyolefin film.
Comparative example 3
In comparison with the polyolefin film of example 1, the outer skin material of this comparative example, which does not contain low density polyethylene and is replaced with equal amount of HDPE, having the trade name of cress HDPE8008, was the same as that of example 1, to obtain a polyolefin film.
Comparative example 4
In comparison with the polyolefin film of example 1, this comparative example obtained a polyolefin film in which the metallocene linear low density polyethylene as the raw material of the intermediate layer was replaced with the same amount of the sea-weed-killed LLDPE7042, and the rest was the same as that of example 1.
Comparative example 5
In comparison with the polyolefin film of example 1, in this comparative example, the ethylene-vinyl acetate copolymer as a raw material of the middle layer was replaced with an equal amount of the Yankee chemical 2420K, and the rest was the same as in example 1, to obtain a polyolefin film.
Comparative example 6
The polyolefin film of this comparative example was a two-layer laminated structure of an outer skin layer and an inner skin layer, without providing an intermediate layer, as compared with the polyolefin film of example 1.
Comparative example 7
The polyolefin film of this comparative example was a two-layer laminated structure of an outer skin layer and an intermediate layer, and was not provided with an inner skin layer, as compared with the polyolefin film of example 1.
Comparative examples 8 to 14
The substrate layers of the dicing tapes of comparative examples 8 to 14 were the polyolefin films provided in comparative examples 1 to 7, respectively, as compared with the dicing tape of example 7, and the rest was the same as in example 7.
Comparative example 15
The wafer dicing tape of this comparative example is a foreign competitive product, japan gulhe UC363 EP.
Comparative example 16
The dicing tape of this comparative example was a foreign competitive product, japan gulhe UC343 EP.
Test example 1
The dicing tapes provided in examples 7 to 11 and comparative examples 8 to 16 were subjected to the following performance tests, and the results are shown in table 1:
tensile strength: reference ASTM D638
Surface resistance: reference is made to ASTM D257 GB/T1410-2006
Antistatic property: reference is made to GB/T14447-1993.
TABLE 1
Figure BDA0003591748610000171
Figure BDA0003591748610000181
As can be seen from the data in Table 1, examples 7 to 11 of the present inventionThe wafer dicing tape has the characteristics of low surface resistance and high antistatic performance, simultaneously gives consideration to better tensile strength, and is superior to the wafer dicing tape provided by the comparative example. Therefore, the three-layer structure prepared from the specific raw materials according to the mass ratio can be matched with each other, so that the surface resistance of the exposed inner and outer surfaces is reduced to 106-109Omega, excellent antistatic performance and better tensile strength.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A polyolefin film, characterized by comprising an outer surface layer, an intermediate layer and an inner surface layer;
the middle layer is arranged between the outer surface layer and the inner surface layer;
the outer surface layer and the inner surface layer are both independently prepared from the following components:
nano zinc oxide, a coupling agent, a diluent and low-density polyethylene;
the intermediate layer is mainly prepared from the following components:
metallocene linear low density polyethylene, ethylene-vinyl acetate copolymer and/or polyethylene elastomer and antioxidant.
2. The polyolefin film of claim 1, wherein the outer skin layer is prepared from the following components in parts by weight:
10-65 parts of nano zinc oxide, 2-20 parts of a coupling agent, 5-20 parts of a diluent and 20-50 parts of low density polyethylene;
preferably, the inner surface layer is mainly prepared from the following components in parts by mass:
10-65 parts of nano zinc oxide, 2-20 parts of coupling agent, 5-20 parts of diluent and 20-50 parts of low-density polyethylene;
preferably, the intermediate layer is mainly prepared from the following components in parts by mass:
10-40 parts of metallocene linear low-density polyethylene, 60-90 parts of ethylene-vinyl acetate copolymer and/or polyethylene elastomer and 1-3 parts of antioxidant.
3. The polyolefin film of claim 2, wherein the outer skin layer is prepared from the following components in parts by weight:
50 parts of nano zinc oxide, 2.5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene;
preferably, the inner surface layer is mainly prepared from the following components in parts by mass:
50 parts of nano zinc oxide, 5 parts of coupling agent, 10 parts of diluent and 40 parts of low-density polyethylene;
preferably, the intermediate layer is mainly prepared from the following components in parts by mass:
35 parts of metallocene linear low-density polyethylene, 65 parts of ethylene-vinyl acetate copolymer and/or polyethylene elastomer and 2 parts of antioxidant.
4. The polyolefin film of any of claims 1-3, wherein the coupling agent comprises a titanate coupling agent;
preferably, the diluent comprises white oil;
preferably, the antioxidant comprises basf B216 antioxidant.
5. Polyolefin film according to any of claims 1 to 3, wherein the outer and inner skin layers each independently have a thickness of 5 to 30 microns, preferably 10 microns;
preferably, the thickness of the intermediate layer is 70-90 microns, preferably 80 microns.
6. A method for preparing a polyolefin film according to any one of claims 1 to 5, comprising the steps of:
mixing the components of the outer surface layer to obtain an outer surface layer material;
mixing the components of the middle layer to obtain a middle layer material;
mixing the components of the inner surface layer to obtain an inner surface layer material;
and carrying out tape casting on the outer surface layer material, the middle layer material and the inner surface layer material to obtain the polyolefin film.
7. A wafer dicing tape is characterized by comprising a substrate layer and a bonding adhesive layer;
the material of the substrate layer comprises the polyolefin film described in any one of claims 1 to 5.
8. The dicing tape according to claim 7, wherein the adhesive layer has a thickness of 10 to 20 micrometers, preferably 15 micrometers.
9. A method for preparing the wafer dicing tape according to claim 7 or 8, characterized by comprising the steps of:
and coating the bonding glue on the substrate layer to obtain the wafer dicing tape.
10. Use of the polyolefin film of any one of claims 1-5 in the dicing of an integrated circuit package substrate.
CN202210379648.9A 2022-04-12 2022-04-12 Protective film base material for cutting integrated circuit packaging substrate Pending CN114603961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210379648.9A CN114603961A (en) 2022-04-12 2022-04-12 Protective film base material for cutting integrated circuit packaging substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210379648.9A CN114603961A (en) 2022-04-12 2022-04-12 Protective film base material for cutting integrated circuit packaging substrate

Publications (1)

Publication Number Publication Date
CN114603961A true CN114603961A (en) 2022-06-10

Family

ID=81868398

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210379648.9A Pending CN114603961A (en) 2022-04-12 2022-04-12 Protective film base material for cutting integrated circuit packaging substrate

Country Status (1)

Country Link
CN (1) CN114603961A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117447125A (en) * 2023-10-27 2024-01-26 浙江晶引电子科技有限公司 Environment-friendly material for ultrathin flexible film packaging substrate and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201621995A (en) * 2014-09-05 2016-06-16 琳得科股份有限公司 Dicing sheet
CN109075047A (en) * 2016-04-28 2018-12-21 琳得科株式会社 The manufacturing method of the manufacturing method and semiconductor device of protective film formation composite sheet and the semiconductor chip with protective film
CN111303789A (en) * 2020-03-24 2020-06-19 广东硕成科技有限公司 Anti-static wafer cutting protective film and preparation method thereof
CN113122154A (en) * 2021-03-06 2021-07-16 通瓦化学(上海)有限公司 Wafer cutting adhesive tape base material and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201621995A (en) * 2014-09-05 2016-06-16 琳得科股份有限公司 Dicing sheet
CN109075047A (en) * 2016-04-28 2018-12-21 琳得科株式会社 The manufacturing method of the manufacturing method and semiconductor device of protective film formation composite sheet and the semiconductor chip with protective film
CN111303789A (en) * 2020-03-24 2020-06-19 广东硕成科技有限公司 Anti-static wafer cutting protective film and preparation method thereof
CN113122154A (en) * 2021-03-06 2021-07-16 通瓦化学(上海)有限公司 Wafer cutting adhesive tape base material and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
汪多仁: "绿色化工助剂", 31 January 2006, 科学技术文献出版社, pages: 177 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117447125A (en) * 2023-10-27 2024-01-26 浙江晶引电子科技有限公司 Environment-friendly material for ultrathin flexible film packaging substrate and preparation method thereof
CN117447125B (en) * 2023-10-27 2024-04-05 浙江晶引电子科技有限公司 Environment-friendly material for ultrathin flexible film packaging substrate and preparation method thereof

Similar Documents

Publication Publication Date Title
KR102157058B1 (en) Biaxially oriented polyester film for mold release
JP2012224011A (en) Release film for ceramic green sheet manufacturing process
EP3858601A1 (en) Method for manufacturing electrical steel sheet product
CN103270124B (en) The manufacture method of reel body and reel body
CN114603961A (en) Protective film base material for cutting integrated circuit packaging substrate
KR20010096532A (en) Film for packing
TWI580578B (en) Cover Tape and Method for Manufacturing the same
TWI729931B (en) Laminated body for fuel cell
TWI706853B (en) Polyolefin releasing film and method for manufacturing the same, and thermoplastic polyurethane composite structure
JP3213115B2 (en) Method for producing conductive resin sheet
KR101998345B1 (en) Manufacturing method of polyester
EP2005433B1 (en) Biaxially oriented polyester film for molding process
JP2008255142A (en) Biaxially stretched polyester film for simultaneous forming and transfering
JP6139123B2 (en) Mold release polyester film
JP3847953B2 (en) Laminated film
JPWO2013015260A1 (en) Laminated polyester film and method for producing the same
JP5794043B2 (en) Biaxially oriented polyarylene sulfide composite film for mold release
CN113122154A (en) Wafer cutting adhesive tape base material and preparation method thereof
JP6221790B2 (en) the film
KR20220046992A (en) Heat dissipation sealant film, cell pouch including the same and method for manufacturing the same
KR101491596B1 (en) Anti-static polyester release film and manufacturing method thereof
EP1325809B1 (en) Biaxially oriented, laminated polyester film
JP7284650B2 (en) winding body
JP5202058B2 (en) Double-sided release film for fuel cells
EP3733803A1 (en) Separator, and adhesive tape or sheet with separator

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination