Disclosure of Invention
The invention provides a grinding wheel, which solves the problems of poor cooling effect and low processing efficiency of a monocrystalline silicon rod when the grinding wheel grinds the monocrystalline silicon rod.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the present invention provides a grinding wheel comprising: a substrate, a grinding material layer and a water injection channel;
the abrasive layer is arranged on one side of the base body close to the workpiece and is annularly arranged along the periphery of the base body;
the water injection channel penetrates through the base body, and cooling water is injected into the base body, the abrasive layer and the workpiece through the water injection channel.
In one possible implementation, the water injection channel comprises a water reservoir and a water hole;
the water storage tank is arranged on one side of the base body far away from the workpiece and is annular;
one end of the water hole is communicated with the water storage tank, and the other end of the water hole extends through one side of the base body close to the workpiece;
the number of the water holes is one or more than one.
In one possible implementation, the reservoir includes an outer sidewall and an inner sidewall; wherein, the liquid crystal display device comprises a liquid crystal display device,
the water storage tank is arranged on one side of the water hole far away from the rotation center line of the matrix, and is an outer side wall;
the water storage tank is arranged on one side of the water hole, which is close to the rotation center line of the matrix, and is provided with the inner side wall;
the inside wall includes the water conservancy diversion section, and the water conservancy diversion section is kept away from the one end in the water hole on the inside wall, the water conservancy diversion section is the slope setting, and the contained angle of the rotation central line of water conservancy diversion section and base member is less than 90 degrees.
In one possible implementation, the outer side wall is tangential to the contour of the water hole at one end of the water storage tank, the outer side wall extends from one side of the water hole to one side far away from the water hole, and the extending direction of the outer side wall is parallel to the rotation center line of the base body.
In one possible implementation, the water hole is inclined toward the outer edge of the base body with respect to the rotation center line of the base body as a normal line, and with respect to one end communicating with the water storage tank.
In one possible implementation, the axis of the water hole is at an angle of 15 ° to 25 ° to the normal.
In one possible implementation, the water injection channel further comprises a water deflector;
the breakwater extends from the outer side wall along the rotation center close to the matrix, and gaps for cooling water to pass through are formed between the breakwater and the water storage tank and between the breakwater and the water holes.
In one possible implementation, the grinding wheel further includes a power mechanism disposed at a center of rotation of the base;
the power mechanism is used for driving the matrix to rotate so as to enable the abrasive layer to grind the surface of the workpiece;
the power mechanism is also used for driving the base body to be close to or far away from the workpiece so as to enable the abrasive layer to be contacted with or separated from the surface of the workpiece.
In one possible implementation, the water holes have a diameter of 3 mm 5 mm.
In one possible implementation, the workpiece is a single crystal silicon rod.
According to the scheme provided by the embodiment of the invention, the water injection channel is arranged on the base body and penetrates through the base body, so that the cavity formed by the base body, the abrasive layer and the workpiece is communicated with the outside, and cooling water can be injected into the cavity through the water injection channel to cool the grinding contact surface. Meanwhile, the cooling water can be used for wrapping the grinding waste and discharging the grinding waste in time along with water flow, so that the surface of a workpiece is prevented from being scratched by secondary grinding.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.
Fig. 1 is a schematic view of a grinding wheel structure provided in the related art, and referring to fig. 1, when an abrasive layer 12 contacts a workpiece 2, a base 11 drives the abrasive layer 12 to rotate to grind the workpiece 2. When the substrate 11 rotates at a high speed, the temperature of the grinding contact surface can be rapidly increased, but most of the cooling water sprayed from the outside is splashed out and cannot reach the inside of the grinding contact surface, so that the cooling effect is poor, the rotation speed of the grinding wheel 1 cannot be increased to improve the processing efficiency, and the burnt workpiece 2 can be caused, so that the defective rate is increased. Therefore, it is necessary to provide a grinding wheel 1 having a cooling function, which grinding wheel 1 can effectively cool the inside of the grinding contact surface
Fig. 2 to 4 are schematic structural views of a grinding wheel according to an embodiment of the present invention, and referring to fig. 2 to 4, the grinding wheel 1 includes a base 11, an abrasive layer 12, and a water injection channel 13.
The abrasive layer 12 is disposed on a side of the base 11 near the workpiece 2, and is disposed annularly along an outer circumference of the base 11. The abrasive layer 12 is annular and has a certain thickness, so when the abrasive layer 12 is attached to the surface of the workpiece 2 for grinding, the base 11, the abrasive layer 12 and the workpiece 2 can form a cavity, heat generated by grinding cannot be discharged in the cavity, and cooling water sprayed from outside cannot reach the cavity. Meanwhile, the waste generated by grinding can not be discharged in time and is remained on the grinding contact surface to participate in secondary grinding. This may scratch the surface of the workpiece 2.
The water injection passage 13 penetrates the base 11, and cooling water is injected into a cavity formed by the base 11, the abrasive layer 12 and the workpiece 2 through the water injection passage 13 when the abrasive layer 12 grinds the workpiece 2. In order to solve the problem that the cooling effect is poor when the grinding wheel 1 grinds a monocrystalline silicon rod, the scheme provided by the implementation is that the base body 11 is provided with the water injection channel 13, the water injection channel 13 penetrates through the base body 11, so that a cavity formed by the base body 11, the abrasive layer 12 and the workpiece 2 is communicated with the outside, and cooling water can be injected into the cavity through the water injection channel 13 to cool the grinding contact surface. Meanwhile, the cooling water in the cavity can be used for wrapping and clamping the grinding waste in the grinding layer 12, so that the grinding waste is timely discharged along with cooling water flow, and the surface of the workpiece 2 is prevented from being scratched by secondary grinding.
Optionally, the water filling channel 13 comprises a water reservoir 131 and a water hole 132. The water storage tank 131 is arranged on one side of the base body 11 far away from the workpiece 2, and the water storage tank 131 is annular; one end of the water hole 132 is communicated with the water storage tank 131, and the other end of the water hole 132 extends through one side of the base body 11 close to the workpiece 2; the water holes 132 are formed in a plurality of parts and uniformly distributed around the water storage tank 131. In order to ensure the injection amount of the cooling water by the water injection channel 13, a groove is formed at one end of the base body 11 far away from the workpiece 2, and the groove is a water storage groove 131. The water storage tank 131 can store a certain amount of cooling water and can continuously supplement the cooling water. The water storage tank 131 is annular and is adapted to the shape of the base 11, so that the injection of cooling water at each moment in the rotation process of the base 11 is ensured. The water injection channel 13 further comprises a water hole 132, one end of the water hole 132 is communicated with the water storage tank 131, and the other end of the water hole 132 penetrates through the base body 11 and is positioned at one end of the base body 11 close to the workpiece 2. In this way, the water hole 132 can be communicated with the cavity formed by the water storage tank 131, the base 11, the abrasive layer 12 and the workpiece 2, so that cooling water is injected into the cavity to cool the grinding contact surface. The quantity of water holes 132 is one or more, and when the quantity of water holes 132 is a plurality of, a plurality of water holes 132 evenly set up along the a week of aqua storage tank 131, like this can be when base member 11 rotates, guarantee the cooling water in the aqua storage tank 131 at every moment can all be through the even injection of water hole 132 to the cavity in.
Optionally, the water storage tank 131 includes an outer sidewall 131b and an inner sidewall 131a, and the water storage tank 131 is an outer sidewall on a side of the water hole 132 away from the rotation center line of the base 11; the water storage tank 131 is provided with an inner side wall 131a at one side of the water hole 132, which is close to the rotation center line of the base body 11, of the water storage tank 131; the inner sidewall 131a includes a guiding section 131c, the guiding section 131c is disposed at one end of the inner sidewall 131a far away from the water hole 132, the guiding section 131c is inclined, and an included angle between the guiding section 131c and a rotation center line of the substrate 11 is smaller than 90 degrees, the included angle is oriented to one side of the abrasive layer 12, and cooling water can flow into the water hole 132 through the guiding section 131c by setting the guiding section 131 c. . .
Optionally, the outer side wall 131b is tangent to the contour of the water hole 132 at one end of the water storage tank 131, the outer side wall 131b extends from one side of the water hole 132 toward the side far from the water hole 132, and the extending direction of the outer side wall 131b is parallel to the rotation center line of the base 11. When the grinding wheel 1 rotates at a high speed, the cooling water in the water storage tank 131 flows to the grinding contact surface through the water hole 132 by centrifugal force. Therefore, the end of the water hole 132 communicating with the water storage tank 131 is opened on the outer side wall of the water storage tank 131 away from the rotation center line of the base 11, so that the cooling water can more easily enter the water hole 132.
Alternatively, the water hole 132 is inclined toward the outer edge of the base 11 with respect to the rotation center line of the base 11 as a normal line, and with one end communicating with the water storage tank 131. Optionally, the axis of the water hole 132 is at an angle of 15 ° to 25 ° to the normal. From the above, the cooling water flows from the water storage tank 131 to the water hole 132, passes through the water hole 132, and then sprinkles on the inner side of the grinding contact surface to cool the grinding contact surface. The water holes 132 are obliquely arranged, the rotation center line of the substrate 11 is taken as a normal line, one end communicated with the water storage tank 131 is inclined to the outer edge of the substrate 11, so that the outflow of cooling water is facilitated, the cooling water can be directly sprayed onto the grinding layer 12, and the cooling effect is good. The inclination angle of the water hole 132 is 15 ° to 25 °, and more preferably, the inclination angle of the water hole 132 may be set to 20 °.
Optionally, the water injection channel 13 further comprises a water baffle 133; the water baffle 133 extends from the outer side wall along the rotation center near the base 11, and gaps for the cooling water to pass through are formed between the water baffle 133 and the water storage tank 131 and between the water baffle 133 and the water hole 132. The cooling water flows into the water hole 132 through the gap, a water storage space for accommodating the cooling water is formed at the outer edge of the base plate 11 by the water storage tank 131 in combination with the water blocking plate 133, and the cooling water flows into the water hole 132 through the space by centrifugal force. The water baffle 133 can store the cooling water in the water storage tank 131, and the cooling water is not thrown outward by the high-speed rotation of the grinding wheel 1.
Specifically, the water hole 132 is covered along the projection of the rotation center line direction of the substrate 11 by the water baffle 133, so that the water storage space of the profile on one side close to the edge of the substrate 11 can cover the cross section of the water hole 132 by the water baffle 133 and the water storage tank 131, so that cooling water can cover the water hole 132 when cooling water is in the water storage space, and saturated water entering into the water hole 132 is realized, if the water baffle 133 only partially covers the water hole 132, the cooling water in the water storage space cannot cover the water hole 132 under the action of centrifugal force, and then the saturated water entering into the water hole 132 cannot be realized, the abrasive layer 12 cannot be fully cooled and the waste is flushed when grinding is performed easily, and the grinding efficiency and the cooling effect are affected.
In this embodiment, the inclination angle of the guiding section 131c is 30-40 degrees, preferably, the inclination angle of the guiding section 131c is 35 degrees, when the cooling water is injected into the water storage tank 131, the cooling water flows toward the water hole 132 through the guiding section 131c, and when the substrate 11 rotates, the cooling water can flow into the water hole 132 through the guiding of the guiding section 131c due to the inclination angle of the guiding section 131c facing the centrifugal direction of the substrate 11 during rotation, so that the cooling water is prevented from being directly injected through the water hole 132, and the cooling liquid cannot be injected into the through hole in a saturated manner due to the aperture limitation of the water hole 132 and the rotation of the substrate 11, thereby affecting the grinding heat dissipation of the abrasive layer 12; through setting up the water conservancy diversion section 131c that is the slope for can have certain water conservancy diversion direction when cooling water and the aqua storage tank 131 are interior, when making organism rotational speed lower, the cooling water is through water conservancy diversion section 131c combination centrifugal force approval realization to the inside injection of through-hole.
Further, the included angle between the flow guiding section 131c and the axis of the water hole 132 is 15 degrees, so that the flow guiding of the cooling water in the water storage tank 131 can obtain the flow guiding similar to the inclination of the water hole 132, the situation that the cooling water cannot obtain a certain flow velocity to flow into the water hole 132 due to the fact that the rotating speed is low is avoided, the flow guiding similar to the inclination direction of the water hole 132 is formed in the water storage tank 131, the flow injection efficiency of the cooling water is further improved, the situation that the outside water flow pushes the water flow close to the water hole 132 side while the turbulence is too high is avoided, and the constant of the water flow can be realized.
The inner side wall 131a further comprises a buffer segment 131d connected with the guide segment 131c, the buffer segment 131d is located at one side close to the water hole 132, the buffer segment 131d is further arranged on the inner side surface of the buffer segment 131d when the buffer segment is used for injection, the buffer segment 131d is perpendicular to the rotation center line of the base body 11, so that water flows through the guide segment 131c and then flows into the water hole 132 through the buffer segment 131d in a buffer manner, and the phenomenon that the water flow of the guide segment 131c directly flows into the water hole 132 due to too high flow speed cannot fully enter the water hole 132 is avoided, and the cooling water inflow rate of the water hole 132 is influenced; or the flow rate of the water flow is too fast to flow into a certain water hole 132, so that uniform heat dissipation of the circumference cannot be realized; the buffer section 131d is used for buffering cooling water flow flowing to one end of the water hole 132 while forming a certain guiding flow rate, so that the cooling water can be buffered in the water hole 132 while the water hole 132 obtains a guiding effect, and the cooling heat dissipation effect and the uniform heat dissipation effect of grinding are improved.
Specifically, in the section perpendicular to the rotation center line of the substrate 11, the ratio between the length of the buffer segment 131d and the length of the guide segment 131c is 1:1.5, so that the cooling water can obtain a certain guide speed and then flows through the buffer segment 131d in a buffering manner, the problem that the effect of the guide segment 131c on the cooling liquid on the position of the water hole 132 is poor due to the fact that the guide effect of the buffer segment 131d on the cooling liquid is too long compared with the guide segment 131c is avoided, and the water injection flow to the water hole 132 cannot be improved is avoided; meanwhile, the problem that the cooling water inflow rate of the water holes 132 is affected due to insufficient inflow into the water holes 132 caused by too high flow rate when the water flow of the diversion section 131c directly flows into the water holes 132 due to too short buffer section 131d compared with the buffer section 131d is avoided, or the uniform heat dissipation of the circumference cannot be realized due to too high flow rate of the water flow flowing into a certain water hole 132.
Moreover, the included angle between the buffer segment 131d and the guide segment 131c is 120-130 degrees, so that the transition effect from the guide segment 131c to the buffer segment 131d caused by the too small included angle and the buffer effect from the guide segment 131c to the buffer segment 131d caused by the too large included angle are avoided, the combination of the guide effect and the buffer effect is ensured, and preferably, the included angle between the buffer segment 131d and the guide segment 131c is 125 degrees; further combining the length ratio of the buffer segment 131d and the guide segment 131c, the uniform heat dissipation effect of the cooling water on the abrasive layer 12 in the grinding process is satisfied.
Referring to fig. 3, in this embodiment, the water hole 132 is located at a side close to the abrasive layer 12 and has a distance from the abrasive layer 12, so that after cooling water is injected into the abrasive layer 12 through the water hole 132, the cooling water is injected radially from the periphery after being injected into the workpiece, due to the distance between the through hole and the abrasive layer 12, a certain vortex space 134 exists between the cooling water and the abrasive layer 12 after the cooling water enters the workpiece, and after the cooling water is refracted to the abrasive layer 12, due to the distance between the abrasive layer 12 and the water hole 132, the cooling water further forms vortex flow in the space between the abrasive layer 12 and the water hole 132, and the cooling water flows to the abrasive layer 12 to the distance to wash out the reserved space, thereby increasing the water flow scouring direction in grinding, improving the scouring effect on grinding waste, and better realizing cooling and flushing from the periphery to the center.
Optionally, the grinding wheel 1 further includes a power mechanism provided at a rotation center of the base 11. And the power mechanism is used for driving the base body 11 to rotate so as to enable the abrasive layer 12 to grind the surface of the workpiece 2. The power mechanism is also used for driving the base body 11 to approach or depart from the workpiece 2 so as to enable the abrasive layer 12 to contact or depart from the surface of the workpiece 2. The power mechanism can drive the base body 11 to move and rotate, the power mechanism firstly drives the base body 11 to approach the workpiece 2 until the surface of the workpiece 2 is contacted, and then the power mechanism drives the base body 11 to rotate so that the abrasive layer 12 grinds the surface of the workpiece 2. Then the power mechanism stops rotating and drives the substrate 11 to leave the surface of the abrasive layer 12, and the cooling water injected into the inner side of the grinding contact surface through the water injection channel 13 can flow out by wrapping the grinding waste.
Optionally, the diameter of the water hole 132 is 3 mm-5 mm, so that the influence on the cooling effect caused by too little cooling water flowing in due to too small water hole 132 is avoided, and meanwhile, the water hole 132 is prevented from being too large to provide flushing pressure, so that the aperture is smaller than the aperture of 3 mm-5 mm, and the influence on the cooling effect caused by too low flow of the cooling water is avoided while a certain flushing pressure is ensured.
Specifically, when grinding is performed on a photovoltaic single crystal silicon rod by adopting a grinding wheel in the related art with the specification of 250-300 mm and the grinding wheel 1 provided by the embodiment, the grinding wheel in the related art is trimmed once every 7000 mm of the processing, and the grinding wheel 1 provided by the embodiment is trimmed once every 12000 mm of the processing; the grinding wheel in the related technology can process 150 tons of single crystal silicon rods in total, and the grinding wheel 1 provided by the embodiment can process 220 tons of single crystal silicon rods in total; the yield of the single crystal silicon rod processed by the grinding wheel in the related art is 95.2%, and the yield of the single crystal silicon rod processed by the grinding wheel 1 provided by the embodiment is 99.67%. Thus, the present embodiment provides significant improvements in the processing speed, processing quality and dressing frequency of the grinding wheel 1, and can adapt to the efficiency improvement and yield increase process of the processing enterprises.
The foregoing is merely illustrative of specific embodiments of the present invention, and the scope of the present invention is not limited thereto, but any changes or substitutions within the technical scope of the present invention should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.