CN114601210A - Flexible wearable thermoelectric refrigerating device and preparation method thereof - Google Patents
Flexible wearable thermoelectric refrigerating device and preparation method thereof Download PDFInfo
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
- A41D13/002—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment
- A41D13/005—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
- A41D13/0053—Cooled garments
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
- A41D31/02—Layered materials
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
- A41D31/04—Materials specially adapted for outerwear characterised by special function or use
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- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
- A41D31/04—Materials specially adapted for outerwear characterised by special function or use
- A41D31/06—Thermally protective, e.g. insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
The invention discloses a wearable flexible thermoelectric refrigerating device, which comprises: the energy storage heat conduction substrate, the plurality of flexible radiating fins, the heat insulation layer, the plurality of semiconductor refrigeration pieces and the heat conduction fiber fabric; the flexible heat dissipation fins are formed on the surface of one side of the energy storage heat conduction substrate, and the heat insulation layer is formed on the surface of the other side of the energy storage heat conduction substrate; the semiconductor refrigerating sheets are alternately packaged in the heat insulation layer in a series connection mode, and the hot surfaces of the semiconductor refrigerating sheets are tightly attached to the energy storage heat conduction substrate; the heat-conducting fiber fabric is attached to the surface of the heat-insulating layer and is in contact with the cold surface of the semiconductor refrigerating sheet; the energy storage conductor matrix is prepared from a flexible matrix material, a heat conduction filler, a metal foam material and an organic phase change material, the flexible radiating fins are prepared from a flexible matrix material and a heat conduction filler, and the heat insulation layer is prepared from a flexible matrix material. The wearable flexible thermoelectric refrigerating device has high heat-conducting performance while ensuring flexibility.
Description
Technical Field
The invention relates to the technical field of refrigeration devices, in particular to a flexible wearable thermoelectric refrigeration device and a preparation method thereof.
Background
The wearable refrigerating equipment plays a crucial role in human comfort and health, and can effectively reduce energy consumption. On one hand, the body surface temperature of an individual can be directly and effectively reduced in a hot outdoor environment, and the heat stress reaction at high temperature is relieved; on the other hand, unlike energy-intensive cooling of large environmental spaces, personal refrigeration devices in direct local contact can quickly and efficiently achieve efficient cooling at low power supplies.
The wearable refrigeration equipment based on the thermoelectric device has the characteristics of no chemical reaction, no moving part, no working fluid, no emission causing global warming, high-efficiency and reliable refrigeration effect and the like, and has great development potential in the field of personal wearable refrigeration devices. The semiconductor refrigerating sheet is a typical refrigerating product based on thermoelectric effect, can be customized in various shapes and specifications in the market due to the mature preparation process, and has wide application field. Therefore, the development of the flexible wearable device by utilizing the semiconductor refrigeration piece has great market potential.
However, when the semiconductor refrigeration piece works, if no additional heat dissipation equipment is arranged on the hot surface, the temperature can be rapidly increased to exceed 100 ℃, the device is damaged, and meanwhile, the potential safety hazard is caused, so that a radiator with larger weight and hard material is usually added when the semiconductor refrigeration piece is used, and the application of the semiconductor refrigeration piece in the field of flexible wearable is greatly limited.
Chinese patent publication No. CN205424859U (publication No. 2016, 8, month, and 3) discloses an LED heat dissipation device using a semiconductor refrigeration sheet and a phase change material, which includes an LED device, a heat conduction substrate, heat dissipation fins, a semiconductor refrigeration sheet, a phase change material, and a heat dissipation fan. By combining the advantages of the strong refrigerating capacity of the semiconductor refrigerating sheet and the great latent heat of phase change of the phase change material and introducing closed-loop feedback control, the LED device is efficiently radiated and reliably thermally controlled. However, such semiconductor refrigeration devices also have the following disadvantages: 1. the fan is arranged in the radiator, so that the size and the weight are increased, the whole radiator is hard and has no flexibility, and the radiator cannot be applied to the field of flexible wearable; 2. the fan of the radiator requires additional energy consumption; 3. the rigidity of the whole structure is enhanced by adopting the copper or aluminum heat-conducting substrate; 4. the phase-change material is agglomerated and non-dispersed in the heat dissipation structure, so that the heat conductivity of the heat radiator is reduced, heat transmission and dissipation are not facilitated, and the problem of high-temperature leakage is easy to occur; 5. can not be combined with fabrics and worn on human body.
Therefore, the invention provides a flexible structure which can efficiently radiate heat for a semiconductor refrigeration piece, and is a key problem for solving the application of a thermoelectric device in personal refrigeration clothing.
Disclosure of Invention
The invention aims to provide a flexible wearable thermoelectric refrigerating device which has high heat conduction performance while ensuring flexibility.
The invention provides a wearable flexible thermoelectric refrigerating device, which comprises:
an energy storage and heat conduction substrate;
the flexible heat dissipation fins are formed on one side surface of the energy storage and heat conduction substrate;
the heat insulation layer is formed on the other side surface of the energy storage and heat conduction substrate;
the semiconductor refrigeration pieces are packaged in the heat insulation layer at intervals in a serial connection mode, and the hot surfaces of the semiconductor refrigeration pieces are tightly attached to the energy storage heat conduction substrate; and
the heat-conducting fiber fabric is attached to the surface of the heat insulation layer and is in contact with the cold surface of the semiconductor refrigeration piece;
the energy storage conductor matrix is prepared from a flexible matrix material, a heat conduction filler, a metal foam material and an organic phase change material, the flexible radiating fins are prepared from a flexible matrix material and a heat conduction filler, and the heat insulation layer is prepared from a flexible matrix material.
Preferably, the refrigerating device is of a block structure and can be conveniently worn on different parts of a human body.
Further, the flexible base material is double-component silicon rubber or polybutylene terephthalate-adipate.
Further, the metal foam material is one or more of copper foam, nickel foam, zinc foam and titanium foam, the porosity is preferably 95% -99%, and the thickness is preferably 1mm-2 mm.
Further, the heat conducting filler comprises one or more of carbon fiber, carbon nano tube, graphite, graphene, aluminum oxide, aluminum nitride and boron nitride, and the particle size is preferably 1-100 μm. Preferably, the thermally conductive filler is selected from one of a block-shaped, a sheet-shaped or a spherical thermally conductive filler.
Further, the organic phase change material is one or more of aliphatic hydrocarbon, aliphatic acid, alcohol and polyvinyl alcohol. Preferably, the organic phase change material is polyethylene glycol, and the molecular weight of the organic phase change material is preferably 2000.
Furthermore, in the flexible radiating fin, the mass fraction of the flexible base material is 30-70 wt%, and the mass fraction of the heat-conducting filler is 70-30%.
Furthermore, in the energy storage heat conduction matrix, the mass fraction of the flexible matrix material is 40 wt% -65 wt%, the mass fraction of the metal foam is 20 wt% -30 wt%, the mass fraction of the polyethylene glycol is 1 wt% -15 wt%, and the mass fraction of the heat conduction filler is 15 wt% -80 wt%.
Furthermore, the structure of the flexible radiating fin is cylindrical or strip-shaped, and the height of the flexible radiating fin is 3-4 mm.
Further, the heat-conducting fiber fabric is a silver fiber fabric.
The invention also provides a preparation method of the wearable flexible thermoelectric refrigerating device, which comprises the following steps:
s1, uniformly mixing a flexible matrix material, a curing agent and a heat-conducting filler, pouring the mixture into a mold, and curing at a first temperature to obtain a flexible radiating fin prefabricated product; the first temperature is 60-70 ℃;
s2, placing metal foam on the surface of the cured flexible radiating fin prefabricated product, uniformly mixing the flexible base material, the curing agent and the heat conducting filler, then adding polyethylene glycol at a second temperature, heating in a water bath, uniformly stirring, continuously pouring the obtained slurry into the mold, and defoaming in vacuum after completely soaking the metal foam; the second temperature is 55-60 ℃;
s3, curing the die at a third temperature to obtain a prefabricated product of the radiator; the third temperature is 130-150 ℃;
s4, placing the semiconductor refrigeration pieces on the surface of the solidified radiator prefabricated product at intervals and uniformly in a series connection mode, uniformly mixing the flexible base material and the curing agent, pouring the mixture into the mold, laying a heat-conducting fiber fabric on the uncured surface after the semiconductor refrigeration pieces are packaged, and performing hot-pressing solidification at a first temperature to obtain the wearable flexible thermoelectric refrigeration device.
Compared with the prior art, the technical scheme of the invention has the following advantages:
1. the wearable refrigerating design is carried out by utilizing the semiconductor refrigerating sheet, the whole device is compact in size, has no moving part, has no liquid flow, can effectively carry out individual refrigeration, reduces the energy consumption of a centralized refrigerating system aiming at the whole space, and is energy-saving and environment-friendly.
2. The flexible wearable thermoelectric refrigerating device provided by the invention has no any additional rigid material or device, the whole heat dissipation device is flexible and bendable, is small and exquisite and light, can be flexibly designed in a wearable manner, and promotes the application field of the semiconductor refrigerating sheet based on the thermoelectric effect on the refrigerating device.
3. According to the flexible wearable thermoelectric refrigerating device, the heat dissipation structure is integrated with the fin type heat dissipation structure and the energy storage heat conducting fin, so that on one hand, the heat dissipation is increased due to the shape of the fin; on the other hand, in the heat storage and heat conduction sheet, the flexible matrix, the phase change heat storage, the heat conduction filler and the heat conduction metal foam framework are effectively compounded, so that the cooperative heat dissipation operation of heat storage and heat conduction is fully exerted, and the temperature of the hot surface of the semiconductor refrigerating sheet can be effectively controlled.
4. The flexible wearable thermoelectric refrigerating device does not need any organic solvent in the preparation process, and meets the requirements of environmental protection and environmental protection.
Drawings
FIG. 1 is a schematic structural view of a flexible wearable thermoelectric cooling device of the present invention;
fig. 2 is a physical diagram of the flexible wearable thermoelectric cooling device of embodiment 1;
fig. 3 is a schematic view of the flexible wearable thermoelectric cooling device of example 1 in a worn state;
fig. 4 is a physical diagram of the flexible wearable thermoelectric cooling device of embodiment 2;
fig. 5 is a pictorial view of the flexible wearable thermoelectric cooling device of comparative example 1;
fig. 6 is a schematic diagram of temperature change of the flexible wearable thermoelectric cooling device of embodiment 1;
fig. 7 is a graph comparing temperature changes of the flexible wearable thermoelectric cooling device of example 1 and comparative example 1 and a semiconductor cooling fin alone;
wherein: 1. flexible radiating fins; 2. a heat storage and conduction substrate; 3. a thermal insulation layer; 4. a semiconductor refrigeration sheet; 5. a heat-conducting fiber fabric; 6. a flexible base material; 7. a metal foam; 8. an organic phase change material; 9. a thermally conductive filler.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, the present invention provides a flexible wearable thermoelectric cooling device comprising: the heat-insulating heat-conducting heat-insulating material comprises an energy-storing heat-conducting base body 2, a plurality of flexible heat-radiating fins 1, a heat-insulating layer 3, a plurality of semiconductor refrigerating pieces 4 and a heat-conducting fiber fabric 5. The flexible heat dissipation fins 1 are formed on one side surface of the energy storage and heat conduction substrate 2, and the heat insulation layer 3 is formed on the other side surface of the energy storage and heat conduction substrate 2. The semiconductor refrigeration pieces 4 are packaged in the heat insulation layer 3 at intervals, and the hot surfaces of the semiconductor refrigeration pieces are tightly attached to the energy storage heat conduction base body 2. The heat-conducting fiber fabric 5 is attached to the surface of the heat insulation layer 3 and is in contact with the cold surface of the semiconductor refrigeration sheet 4.
In the invention, the energy storage conductor matrix 2 is prepared from a flexible matrix material 6, a heat-conducting filler 9, metal foam 7 and an organic phase change material 8, the flexible radiating fin 1 is prepared from a flexible matrix material and a heat-conducting filler, and the heat-insulating layer 3 is prepared from a flexible matrix material.
The flexible wearable thermoelectric refrigerating device comprises a skin-attached fabric layer, a middle thermal insulation layer and flexible heat storage and conduction radiators at the outer ends, and has high thermal conductivity while flexibility is guaranteed. The heat conduction framework established by the metal foam and the high heat conduction filler effectively improves the heat conductivity of the radiator; meanwhile, the organic phase change material is added, so that the radiator has the function of storing heat, and the temperature of the hot end can be further controlled. On the other hand, the whole radiator is small in size, light in weight, flexible and bendable, and the radiator can be compounded on a fabric for wearable design.
The present invention is further described below in conjunction with specific examples to enable those skilled in the art to better understand the present invention and to practice it, but the examples are not intended to limit the present invention.
Example 1
The embodiment provides a preparation method of the flexible wearable thermoelectric refrigerating device, which comprises the following steps:
1) providing raw materials: 4 semiconductor refrigerating sheets, silver fiber fabric, a flexible matrix material polydimethylsiloxane A, B component (curing agent Daokang-184), 2mm thick metal foam 47mm multiplied by 47mm, polyethylene glycol and heat-conducting filler;
2) uniformly mixing 3gA components, 0.3gB components and 1.1g of heat-conducting filler of a flexible base material at room temperature, pouring the mixture into a cylindrical fin mold, and curing the mixture in vacuum at a first temperature for 2 hours to obtain a flexible radiating fin prefabricated product, and placing metal foam on the surface of the cured flexible radiating fin prefabricated product; the first temperature is 60-70 ℃;
3) uniformly mixing 5g of A component, 0.5g of B component curing agent and 2.75g of heat-conducting filler of the flexible base material at room temperature, then adding 1.5g of polyethylene glycol at a second temperature, heating in a water bath, uniformly stirring to obtain slurry, continuously pouring the slurry into the mold, completely soaking the metal foam, and defoaming for 1 hour in vacuum; the second temperature is 55-60 ℃;
4) placing the die in an oven at a third temperature for curing for 2 hours to obtain a prefabricated product of the radiator, and uniformly placing 4 semiconductor refrigerating sheets on the surface of the cured prefabricated product of the radiator at intervals in a series connection mode; the third temperature is 130-150 ℃;
5) uniformly mixing a flexible base material 3gA component and a flexible base material 0.3gB component curing agent at room temperature, pouring the mixture into the mold, completely packaging the semiconductor refrigeration piece, flatly paving a silver fiber fabric on the uncured surface, and then placing the semiconductor refrigeration piece under a hot press at a first temperature for curing for 2 hours to obtain a prefabricated product of the flexible thermoelectric refrigeration device.
Fig. 2-3 are physical diagrams of the prepared flexible wearable thermoelectric refrigerating device and schematic diagrams in a wearing state.
Figure 6 is a schematic diagram of the temperature change of the flexible wearable thermoelectric cooling device of embodiment 1,
as can be seen from the figure, the flexible wearable thermoelectric cooling device can greatly reduce the temperature. A minimum low temperature of 10 c below ambient temperature can be achieved and held below room temperature of 8 c for more than five hours.
Example 2
The embodiment provides a preparation method of the flexible wearable thermoelectric refrigerating device, which comprises the following steps:
1) providing raw materials: 4 semiconductor refrigerating sheets, silver fiber fabric, A, B components of flexible matrix material polybutylene terephthalate-adipate, A, B components of flexible matrix material polydimethylsiloxane (curing agent Doukan-184), 47mm multiplied by 47mm of metal foam with the thickness of 2mm, polyethylene glycol and heat-conducting filler;
2) uniformly mixing the 2gA component, the 2gB component and 0.9g of heat-conducting filler of the flexible base material at room temperature, pouring the mixture into a cylindrical fin mold, and performing vacuum curing at a first temperature for 2 hours to obtain a flexible radiating fin prefabricated product, and placing metal foam on the surface of the cured flexible radiating fin prefabricated product; the first temperature is 60-70 ℃;
3) uniformly mixing a flexible base material polydimethylsiloxane 5gA component, a flexible base material polydimethylsiloxane 0.5gB component (curing agent Doukang-184) and 2.75g of heat-conducting filler at room temperature, then adding 1.5g of polyethylene glycol at a second temperature, heating in a water bath and uniformly stirring to obtain slurry, continuously pouring the slurry into the mold, completely soaking the metal foam, and defoaming in vacuum for 1 hour; the second temperature is 55-60 ℃;
4) placing the die in an oven at a third temperature for curing for 2 hours to obtain a prefabricated product of the radiator, and uniformly placing 4 semiconductor refrigerating sheets on the surface of the cured prefabricated product of the radiator at intervals in a series connection mode; the third temperature is 130-150 ℃;
5) uniformly mixing 3gA components and 0.3gB components of flexible matrix material polydimethylsiloxane, pouring the mixture into the mould, completely packaging the semiconductor refrigerating sheet, flatly paving silver fiber fabric on the uncured surface, placing the semiconductor refrigerating sheet under a hot press at a first temperature, and curing for 2 hours to obtain a prefabricated product of the flexible thermoelectric refrigerating device.
Fig. 4 is a physical diagram of the flexible wearable thermoelectric cooling device of embodiment 2.
Through tests, the flexible wearable thermoelectric refrigeration device prepared by the embodiment can reach a low temperature of 11 ℃ lower than the ambient temperature at the lowest, and is kept at 7 ℃ lower than the room temperature for more than five hours.
Comparative example 1
The comparative example provides a preparation method of a flexible wearable thermoelectric refrigeration device, comprising the following steps:
1) providing raw materials: 4 semiconductor refrigerating sheets, silver fiber fabric, a flexible matrix material polydimethylsiloxane A, B component (curing agent Daokang-184), polyethylene glycol and a heat-conducting filler;
2) uniformly mixing 5g of the A component, 0.5g of the B component curing agent and 2.75g of the heat-conducting filler of the flexible base material at room temperature, adding 1.5g of polyethylene glycol at a second temperature, and heating in a water bath and uniformly stirring to obtain slurry; the second temperature is 55-60 ℃;
3) pouring the slurry into a mold, defoaming in vacuum at a second temperature for 1 hour, then placing the mold in an oven at a third temperature for curing for 2 hours, and placing 4 semiconductor refrigerating sheets on the surface of the cured radiator preform at intervals and uniformly in a series connection manner; the third temperature is 130-150 ℃;
4) uniformly mixing a flexible base material 3gA component and a flexible base material 0.3gB component curing agent at room temperature, pouring the mixture into the mold, completely packaging the semiconductor refrigeration piece, flatly paving a silver fiber fabric on the uncured surface, and then placing the semiconductor refrigeration piece under a hot press at a first temperature for curing for 2 hours to obtain a prefabricated product of the flexible thermoelectric refrigeration device.
Fig. 5 is a pictorial view of the flexible wearable thermoelectric cooling device of comparative example 1.
The finally prepared flexible wearable thermoelectric refrigerating device can reach a low temperature of 7 ℃ lower than the ambient temperature at the lowest, is kept at 5 ℃ lower than the room temperature for 2 hours, then slowly rises in temperature, and rises to be higher than the room temperature after four hours.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. A wearable flexible thermoelectric cooling device, comprising:
an energy storage and heat conduction substrate;
the flexible heat dissipation fins are formed on one side surface of the energy storage and heat conduction substrate;
the heat insulation layer is formed on the other side surface of the energy storage and heat conduction substrate;
the semiconductor refrigeration pieces are packaged in the heat insulation layer at intervals in a series connection mode, and the hot surfaces of the semiconductor refrigeration pieces are tightly attached to the energy storage heat conduction substrate; and
the heat-conducting fiber fabric is attached to the surface of the heat insulation layer and is in contact with the cold surface of the semiconductor refrigeration sheet;
the energy storage conductor matrix is prepared from a flexible matrix material, a heat conduction filler, a metal foam material and an organic phase change material, the flexible radiating fins are prepared from a flexible matrix material and a heat conduction filler, and the heat insulation layer is prepared from a flexible matrix material.
2. A wearable flexible thermoelectric cooling device as recited in claim 1 wherein said flexible base material is bicomponent silicone rubber or polybutylene terephthalate-adipate.
3. A wearable flexible thermoelectric cooling device according to claim 1, wherein the organic phase change material is one or more of aliphatic hydrocarbons, fatty acids, alcohols and polyvinyl alcohols.
4. A wearable flexible thermoelectric cooling device according to claim 3, wherein the organic phase change material is polyethylene glycol with a molecular weight of 2000.
5. A wearable flexible thermoelectric cooling device according to claim 1, wherein the metal foam material is one or more of copper foam, nickel foam, zinc foam, titanium foam, with a porosity of 95-99% and a thickness of 1-2 mm.
6. A wearable flexible thermoelectric cooling device according to claim 1, wherein the heat conducting filler comprises one or more of carbon fiber, carbon nanotube, graphite, graphene, alumina, aluminum nitride, boron nitride, with a particle size of 1 μm to 100 μm.
7. The wearable flexible thermoelectric cooling device according to claim 4, wherein in the flexible heat dissipation fin, the mass fraction of the flexible matrix material is 30-70 wt%, and the mass fraction of the heat conductive filler is 30-70%;
in the energy storage heat conduction matrix, the mass fraction of the flexible matrix material is 40-65 wt%, the mass fraction of the metal foam is 20-30 wt%, the mass fraction of the polyethylene glycol is 1-15 wt%, and the mass fraction of the heat conduction filler is 15-80 wt%.
8. A wearable flexible thermoelectric cooling device according to claim 1, wherein the structure of the flexible heat dissipation fin is cylindrical or long and the height thereof is 3mm-4 mm.
9. A wearable flexible thermoelectric cooling device as recited in claim 1 wherein said thermally conductive fiber fabric is silver fiber fabric.
10. A method of making a wearable flexible thermoelectric cooling device as described in any of claims 1-9, comprising the steps of:
s1, uniformly mixing a flexible matrix material, a curing agent and a heat-conducting filler, pouring the mixture into a mold, and curing at a first temperature to obtain a flexible radiating fin prefabricated product; the first temperature is 60-70 ℃;
s2, placing metal foam on the surface of the cured flexible radiating fin prefabricated product, uniformly mixing the flexible base material, the curing agent and the heat conducting filler, then adding polyethylene glycol at a second temperature, heating in a water bath, uniformly stirring, continuously pouring the obtained slurry into the mold, and defoaming in vacuum after completely soaking the metal foam; the second temperature is 55-60 ℃;
s3, curing the die at a third temperature to obtain a prefabricated product of the radiator; the third temperature is 130-150 ℃;
s4, placing the semiconductor refrigeration pieces on the surface of the solidified radiator prefabricated product at intervals and uniformly in a series connection mode, uniformly mixing the flexible base material and the curing agent, pouring the mixture into the mold, laying a heat-conducting fiber fabric on the uncured surface after the semiconductor refrigeration pieces are packaged, and performing hot-pressing solidification at a first temperature to obtain the wearable flexible thermoelectric refrigeration device.
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| CN118414069A (en) * | 2024-07-03 | 2024-07-30 | 江苏省纺织产品质量监督检验研究院 | Flexible wearable thermoelectric power generation and temperature adjustment device and preparation method thereof |
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| CN118414069A (en) * | 2024-07-03 | 2024-07-30 | 江苏省纺织产品质量监督检验研究院 | Flexible wearable thermoelectric power generation and temperature adjustment device and preparation method thereof |
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