CN114600211B - Contact system with joining assistance element and method for joining - Google Patents
Contact system with joining assistance element and method for joining Download PDFInfo
- Publication number
- CN114600211B CN114600211B CN202080077198.7A CN202080077198A CN114600211B CN 114600211 B CN114600211 B CN 114600211B CN 202080077198 A CN202080077198 A CN 202080077198A CN 114600211 B CN114600211 B CN 114600211B
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- Prior art keywords
- circuit board
- printed circuit
- press
- contact
- contact system
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 15
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000004873 anchoring Methods 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 238000000465 moulding Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/58—Electric connections to or between contacts; Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7047—Locking or fixing a connector to a PCB with a fastener through a screw hole in the coupling device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
The invention relates to a contact system with a printed circuit board and at least one press-in contact. The press-in contact is designed to be pressed into a through-hole of the printed circuit board and to electrically contact the printed circuit board. According to the invention, the contact system has at least one engagement aid. The auxiliary joining element is designed for a force-locking and/or form-locking connection with the printed circuit board. The engagement aid element has a catch funnel for at least one press-in contact. The catch funnel is arranged and configured for guiding an end section of the press-in contact, which is configured for pressing in a printed circuit board, into a through-hole of the printed circuit board.
Description
Technical Field
The invention relates to a contact system with a printed circuit board and at least one press-in contact. The press-in contact is designed to be pressed into a through-hole of the printed circuit board and to electrically contact the printed circuit board.
Background
The press-in contacts in contact systems of the type mentioned at the outset can be inserted, for example, by means of a machining robot into the bores of the printed circuit board and electrically contact the printed circuit board. In this case, the tolerance during insertion is small, and the perforation in this case produces a force-locking connection between the perforated wall of the printed circuit board and the press-in contact.
Disclosure of Invention
According to the invention, a contact system of the type mentioned at the outset has at least one engagement aid element. The auxiliary joining element is designed for a force-locking and/or form-locking connection to the printed circuit board. The engagement aid element has a catch funnel for at least one press-in contact, in particular at least two or more press-in contacts. The catch funnel is arranged and configured for guiding an end section of the press-in contact, which is configured for pressing in into a printed circuit board, into a through-hole of the printed circuit board.
The press-in contact can then advantageously be guided onto the printed circuit board by the machining robot with lateral tolerances corresponding to the guide funnel and be pressed into the printed circuit board there.
Preferably, the engagement aid element has a guide rod connected to the catch funnel, which is designed to predetermine the engagement direction of the press-in contact during the press-in operation. Advantageously, the press-in contact can then be oriented in the guide shaft, in particular oriented perpendicularly to the printed circuit board, in particular oriented towards the perforation, even when it reaches obliquely into the funnel.
In a preferred embodiment, the joining aid has at least one anchoring element, in particular a centering pin, wherein the anchoring element is designed to be inserted into a recess or a perforation in the printed circuit board and then to fix the joining aid against displacement or displacement on the printed circuit board. The printed circuit board advantageously has a through-hole for receiving an anchor element, in particular a centering pin. Advantageously, the joining assistance member can then be placed precisely through the perforation in the printed circuit board.
Preferably, the joining aid is designed for soldered connection to a printed circuit board. The joining aid can then be soldered together with other electronic components to the printed circuit board at low cost.
In a preferred embodiment, the joining aid has at least one or two solder feet, wherein the solder feet are designed for soldered connection to a surface of a printed circuit board, in particular to a conductor track of the printed circuit board. The joining aid can then advantageously be provided as an SMD component at low cost and soldered together with other electronic components in a soldering oven, in particular a reflow soldering oven. In the embodiment with the anchoring element already mentioned, the joining auxiliary element, which is anchored in a form-locking manner in particular to the printed circuit board in order to prevent displacement or displacement, can be fixed in its position during reflow soldering.
The solder feet are preferably formed by a metal part or a metal layer, wherein the metal part or the metal layer is connected to the joining aid. The engagement aid is formed, for example, from plastic. The metal layer can be glued to the joining aid. Advantageously, the joining assistance element can then be provided cost-effectively. The metal part can be molded into the plastic joining aid, for example. In a preferred embodiment, the solder feet are formed by plate corners which are connected with one leg to the joining aid and the other leg of which is designed for soldered connection to the printed circuit board. The solder feet can then advantageously be connected to the joining assistance element in a cost-effective manner, for example by inserting or pressing in the legs of the design for connection to the joining assistance element.
In a preferred embodiment, the joining aid has a soldering pin for soldering in a perforation of the printed circuit board. The soldering pin can for example be molded or inserted into the joining aid. The soldering pin has an end section configured for soldering with the printed circuit board, which can be inserted into a through-hole of the printed circuit board and soldered there.
Advantageously, the joining aid can then be soldered with the printed circuit board together with other THT components (tht=through-Hole Technology).
In a preferred embodiment, the catch funnel has a cone angle of between 20 and 140 degrees, preferably between 40 and 60 degrees, further preferably between 45 and 50 degrees or 48 degrees. The end section of the press-in contact can then advantageously be guided on a bevel formed by a conical angle up to the guide shaft.
The engagement aid element can, as already described, have a catch funnel and a guide rod connected to the catch funnel. In another embodiment, the engagement aid element can have only one catch funnel and thus no guide rod.
In a preferred embodiment, the joining aid is formed from plastic. Such plastics are, for example, thermoplastics, in particular PEEK (peek=polyetheretherketone (Poly-Ether-Keton)), PPS (pps=polypropylene sulphide (Poly-Propylen-Sulfid)), LCP (lcp=liquid-crystalline Polymer (Liquid-Chrystal-Polymer)), polyolefins, for example polyethylene or polypropylene, polyamide or polycarbonate.
In a preferred embodiment, the engagement aid has at least two catch hoppers arranged along a row. The engagement aid element can have at least two, only two, at least three, only three, at least four, only four, at least five, only five, or at least six, or only six seizing funnels. The catch funnel can be arranged, for example, along a straight line. In another embodiment, the catch funnel can be arranged according to a press-in pin arrangement of a plurality of press-in pins. For example, the integrated component, in particular the molded component, on which the press-in contacts for pressing into the printed circuit board are formed, can then be press-in connected to the printed circuit board with a certain tolerance by means of the joining assistance element.
In a preferred embodiment, the contact system has a semiconductor module with electrical contacts. The electrical terminals are each configured as press-in contacts and are each further configured for pressing into a printed circuit board. The press-in contact has for this purpose, for example, a pin-hole-shaped end section or a small-boat-shaped end section. The press-in contacts are formed, for example, from copper or copper alloys, respectively.
The invention also relates to a joining aid for joining a press-in contact to a printed circuit board, in particular for a contact system of the type described above. The engagement aid has a shaped body and at least one catch funnel for centering an end section of the press-in contact. The catch funnel is formed as a tapering cavity in the shaped body. Preferably, the joining aid has at least one solder foot which is designed for soldered connection to a surface of a printed circuit board.
The invention also relates to a method for joining a printed circuit board to a semiconductor module. In the method, the printed circuit board is inserted onto press-in contacts of a semiconductor module, wherein the press-in contacts are designed to contact end sections of the printed circuit board by means of a catch funnel, preferably subsequently by means of a guide rod, up to a through-hole in the printed circuit board. The press-in contact is pressed further into a perforation of the printed circuit board and electrically contacts the printed circuit board there.
Drawings
The invention will now be described with the aid of further embodiments. Further advantageous embodiments emerge from the combination of features described in the figures and in the dependent claims. Wherein:
Fig. 1 shows an embodiment for a contact system with an engagement aid element which is designed to receive an end section of a press-in contact and to guide it into a through-hole of a printed circuit board;
fig. 2 shows the joining assistance means shown in fig. 1 in a top view.
Detailed Description
Fig. 1 shows an embodiment for a contact system 1. The contact system 1 comprises a printed circuit board 2. The printed circuit board 2 has in this embodiment four perforations 3, 4, 5 and 6 which are jointly spaced apart from one another in a row. The perforations 3, 4, 5 and 6 are each configured to receive a press-in contact. For this purpose, the perforations each have a metal layer formed on the perforated wall of the perforation or a metal cylinder. The metal layer 7 at the perforated wall of the perforation 3 is exemplarily marked.
The printed circuit board 2 also has conductor tracks 8, which are connected to the metal layer 7 in an electrically conductive manner. The press-in contacts introduced into the through-holes 3 can then be electrically connected to further electronic components connected to the printed circuit board 2.
In this embodiment, the printed circuit board 2 also has two perforations 9 and 10. The perforations 9 and 10 are each configured to receive an anchor element. The printed circuit board 2 has a conductive layer 11 in the region of the through-holes 9 and a conductive layer 13 in the region of the through-holes 10. The electrically conductive layers 11 and 13, in particular the conductor tracks, each form the Surface of the printed circuit board and are each designed for a Surface-soldering connection, in particular an SMD-soldering connection, with the solder feet (smd=surface Mounted component).
The contact system 1 also has an engagement aid 14. The joining aid is in this embodiment constructed as a plastic element.
In the present exemplary embodiment, the joining aid 14 has a plastic body in which a funnel-shaped recess for introducing the press-in contact is formed.
Fig. 1 shows for this purpose a molding module 30, in particular an inverter, by way of example. In the present exemplary embodiment, four press-in contacts 31, 32, 33 and 34, which each protrude in the same direction, are formed at the molding module 30 from the molding module 30. The press-in contacts 31, 32, 33 and 34 each have a press-in section for pressing into the printed circuit board 2 and pressing there into a perforation, for example perforation 3, 4, 5 or 6. In this embodiment, the press-in contacts form a control joint for the molding module 30.
In the present exemplary embodiment, the engagement aid 14 has a catch funnel 24 for the press-in contact 31, a catch funnel 25 for the press-in contact 32, a catch funnel 26 for the press-in contact 33 and a catch funnel 27 for the press-in contact 34. The press-in funnels 24, 25, 26 and 27 each open into a guide shaft, which in the present exemplary embodiment is embodied in the form of a column. The guide rod 23 connected to the catch funnel 24 is shown by way of example. The catch funnel 24 forms, together with the guide rod 23, a through-hole of particularly thin design in the joining aid 14, in particular in the plastic body of the joining aid 14.
In this embodiment, the cone angle 28 of the introduction funnel 24 is 48 degrees.
The joining assistance element 14 is designed for soldering, in particular SMD soldering (smd=surface mounted component), to the printed circuit board 2. For this purpose, the joining aid 14 has two solder feet 19 and 20, which are each inserted into one of the fixing journals 17 and 18 of the joining aid 14. The fixing journals 17 and 18 are molded respectively to the plastic body of the auxiliary joining element 14.
In the present exemplary embodiment, the solder feet 19 and 20 are embodied as plate corners, in particular as punched meshes or as leadframes. The solder feet 19 and 20 each have a perforation at the fastening leg for the insertion or reception of the fastening element 17 or 18. The solder feet 19 and 20 each have a solder leg 22 or 21. In the present exemplary embodiment, the soldering leg 22 of the soldering leg 19 is soldered to the metal layer 11 by means of the flux 12. In the present exemplary embodiment, the soldering leg 21 of the soldering foot 20 is connected to the metal layer 13 by soldering with the aid of the flux 12. In this embodiment, a recess for the insertion of the anchoring element, which is shown in particular in fig. 2, is formed in the soldering leg.
In this embodiment, the molding module 30 also has additional electrical connectors. In the present exemplary embodiment, the molding module 30 is embodied as a semiconductor-half bridge. The ground connection 43, the supply connection 44 and the output connection 42 are each formed as a punched mesh and protrude together, in particular extending in the same direction, out of the molding module 30.
Now, the principle of the operation of the contact system 1 and the engagement method for engaging the press-in contact will be explained below.
The auxiliary joining element 14 can be connected to the printed circuit board 2 in a plug-in manner using anchor elements 15 and 16, which are in this exemplary embodiment each configured as journals. For this purpose, the anchoring elements 15 or 16 are inserted into the corresponding through-holes 9 or 10 in the printed circuit board 2. The printed circuit board 2 is previously printed with solder paste 12. The soldering leg 22 is placed on the metal layer 11 after the joining assistance member 14 is joined to the printed circuit board 2, and the soldering leg 21 is then placed on the metal layer 13.
The printed circuit board 2 can then be soldered in a reflow soldering oven, in particular together with other electronic components not shown in fig. 1. The flux 12 extending between the printed circuit board 2, in particular the metal layer 11 or 13, and the solder feet 19 and 20, in particular the solder legs 22 and 21, can then melt and connect the solder legs 21 and 22 to the printed circuit board 2 in a material-locking manner. The perforations formed by the catch hoppers 24, 25, 26 and 27 then pass precisely into the corresponding perforations 3,4,5 and 6 in the printed circuit board 2.
The molding module 30 can then be pressed into the printed circuit board 2. The molding module 30 is, for example, already screwed or plug-connected to a further component of the inverter or the electric motor. The printed circuit board 2 can then be inserted onto the molding module 30, as outlined by arrows 36 and 37. The press-in contacts 31, 32, 33 and 34 can then be snapped and guided into the respective guide shaft by means of the respective snap-in funnel 24, 25, 26 and 27, respectively assigned to the press-in contact, with the corresponding tolerances to the snap-in funnel. The press-in sections 35 of the press-in contacts can then be pressed into corresponding bores in the printed circuit board 2 during the pressing of the printed circuit board 2 further onto the molding module 30. The press-in contact 31 is then pressed into the through-hole 3 of the printed circuit board 2, the press-in contact 32 into the through-hole 4 of the printed circuit board, the press-in contact 33 into the through-hole 5 of the printed circuit board and the press-in contact 34 into the through-hole 6 of the printed circuit board, and the printed circuit board 2 is electrically contacted there in each case.
Fig. 2 shows the joining assistance member 14 already shown in fig. 1 in a top view. The catch hoppers 24, 25, 26 and 27 are each arranged in a row along the longitudinal extension 40 of the auxiliary engagement element 14. The braze feet 19, which are inserted onto the fixed journals 17, have a void 38 at the braze leg 22. The braze feet 20, which are inserted onto the fixed journal 18, have voids 39 at the braze legs 21. In the present exemplary embodiment, the recesses 38 and 39 are each U-shaped. The soldering legs 21 and 22 can then enclose the anchoring element 15 or 16 shown in fig. 1 when being inserted onto the plastic body 41 of the joining aid 14.
In the present embodiment, the anchoring element 15 extends orthogonally to the fixing element 17. In this embodiment, the anchoring element 16 extends orthogonally to the fixing element 18.
Claims (9)
1. Contact system (1) having a printed circuit board (2) and at least one press-in contact (31, 32, 33, 34), wherein the press-in contact (31, 32, 33, 34) is designed for being pressed into a through-hole (3, 4, 5, 6) of the printed circuit board (2) and electrically contacting the printed circuit board (2) in the process,
It is characterized in that the method comprises the steps of,
The contact system (1) has at least one joining aid element (14) which is designed for a force-and/or material-locking connection with the printed circuit board (2) and which has, for the at least one press-in contact (31, 32, 33, 34), a catch funnel (24, 25, 26, 27) which is arranged and designed for guiding an end section (35) of the press-in contact (31, 32, 33, 34) through the catch funnel (24, 25, 26, 27) and into a perforation (3, 4,5, 6) of the printed circuit board (2) during pressing in of the end section (35) of the press-in contact (31, 32, 33, 34) into the printed circuit board (2),
Wherein the joining aid (14) has at least one anchoring element (15, 16) which is designed to be inserted into a recess (9, 10) or a perforation in the printed circuit board (2) and to fix the joining aid (14) against displacement on the printed circuit board (2), wherein the printed circuit board (2) has an electrically conductive layer (11, 13) in the region of the recess (9, 10) or perforation,
Wherein the joining aid (14) has at least one solder leg (19, 20) with a solder leg (22, 21) which is designed for solder connection to the electrically conductive layer (11, 13) of the printed circuit board (2), and wherein a recess for threading or receiving the anchor element (15, 16) is formed in the solder leg (22, 21).
2. The contact system (1) according to claim 1,
It is characterized in that the method comprises the steps of,
The engagement aid element (14) has a guide rod (23) connected to the catch funnel (24, 25, 26, 27), which is designed to predefine the engagement direction of the press-in contacts (31, 32, 33, 34) during the press-in operation.
3. The contact system (1) according to claim 1,
It is characterized in that the method comprises the steps of,
The anchoring elements (15, 16) are centring pins.
4. The contact system (1) according to claim 1,
It is characterized in that the method comprises the steps of,
The solder feet (19, 20) are formed by plate corners which are connected with one leg to the joining aid and whose other leg (21, 22) is designed for solder connection to the printed circuit board (2).
5. The contact system (1) according to any one of claims 1 to 4,
It is characterized in that the method comprises the steps of,
The auxiliary joining element (14) has a soldering pin for soldering in a through-hole of the printed circuit board.
6. The contact system (1) according to any one of claims 1 to 4,
It is characterized in that the method comprises the steps of,
The catch funnel (24, 25, 26, 27) has a cone angle (28) of between 20 and 140 degrees.
7. The contact system (1) according to any one of claims 1 to 4,
It is characterized in that the method comprises the steps of,
The engagement aid (14) is formed from plastic.
8. The contact system (1) according to any one of claims 1 to 4,
It is characterized in that the method comprises the steps of,
The joining aid (14) has at least two catch hoppers (24, 25, 26, 27) arranged along a row.
9. The contact system (1) according to any one of claims 1 to 4,
It is characterized in that the method comprises the steps of,
The contact system (1) has a semiconductor module (30) with electrical contacts, which are each designed as press-in contacts (31, 32, 33, 34) and are designed for pressing into the printed circuit board (2).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019217153.2A DE102019217153A1 (en) | 2019-11-07 | 2019-11-07 | Contact system with an auxiliary joining element and method for joining |
| DE102019217153.2 | 2019-11-07 | ||
| PCT/EP2020/079728 WO2021089335A1 (en) | 2019-11-07 | 2020-10-22 | Contact system with an auxiliary joining element and method for joining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114600211A CN114600211A (en) | 2022-06-07 |
| CN114600211B true CN114600211B (en) | 2024-07-16 |
Family
ID=73013428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080077198.7A Active CN114600211B (en) | 2019-11-07 | 2020-10-22 | Contact system with joining assistance element and method for joining |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4055664A1 (en) |
| CN (1) | CN114600211B (en) |
| DE (1) | DE102019217153A1 (en) |
| WO (1) | WO2021089335A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240055786A1 (en) * | 2022-08-12 | 2024-02-15 | Microsoft Technology Licensing, Llc | Assembly fixture for press-fitting contact pins in a printed circuit board assembly |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037327A (en) * | 1989-01-13 | 1991-08-06 | E. I. Du Pont De Nemours And Company | Connector with means for securing to a substrate |
| US5232379A (en) * | 1992-02-28 | 1993-08-03 | Foxconn International, Inc. | Connector with mounting means for SMT |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265508A (en) * | 1978-11-30 | 1981-05-05 | Western Electric Company, Inc. | Intermediate-web held terminal pins |
| US4679883A (en) * | 1986-09-08 | 1987-07-14 | Amp Incorporated | Shoulder eyelet board lock |
| JPH1050919A (en) * | 1996-07-31 | 1998-02-20 | Oki Electric Ind Co Ltd | Clip lead terminal bundle, connection of clip lead terminal, lead terminal connecting board and manufacture of board with lead terminals |
| US6231386B1 (en) * | 1999-12-29 | 2001-05-15 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with improved solder pads |
| JP4111796B2 (en) * | 2002-10-11 | 2008-07-02 | 富士通テン株式会社 | Press-fit terminal press-fitting method |
| JP2007103088A (en) * | 2005-09-30 | 2007-04-19 | Yazaki Corp | On-board connector |
| KR101942812B1 (en) * | 2017-07-18 | 2019-01-29 | 제엠제코(주) | Press pin amd semiconductor package having the same |
| DE102018000940A1 (en) * | 2018-02-05 | 2019-08-08 | Robert Bosch Gmbh | Connector and contact arrangement |
-
2019
- 2019-11-07 DE DE102019217153.2A patent/DE102019217153A1/en active Pending
-
2020
- 2020-10-22 CN CN202080077198.7A patent/CN114600211B/en active Active
- 2020-10-22 EP EP20796773.8A patent/EP4055664A1/en active Pending
- 2020-10-22 WO PCT/EP2020/079728 patent/WO2021089335A1/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037327A (en) * | 1989-01-13 | 1991-08-06 | E. I. Du Pont De Nemours And Company | Connector with means for securing to a substrate |
| US5232379A (en) * | 1992-02-28 | 1993-08-03 | Foxconn International, Inc. | Connector with mounting means for SMT |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021089335A1 (en) | 2021-05-14 |
| CN114600211A (en) | 2022-06-07 |
| DE102019217153A1 (en) | 2021-05-12 |
| EP4055664A1 (en) | 2022-09-14 |
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