CN114594728A - High-precision low-cost mobile phone motherboard machining position feedback system - Google Patents
High-precision low-cost mobile phone motherboard machining position feedback system Download PDFInfo
- Publication number
- CN114594728A CN114594728A CN202210115486.8A CN202210115486A CN114594728A CN 114594728 A CN114594728 A CN 114594728A CN 202210115486 A CN202210115486 A CN 202210115486A CN 114594728 A CN114594728 A CN 114594728A
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- CN
- China
- Prior art keywords
- processing
- mobile phone
- machining position
- position feedback
- dimensional code
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37404—Orientation of workpiece or tool, surface sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a high-precision low-cost mobile phone mainboard processing position feedback system, which comprises a processing platform and a position feedback mechanism matched with the processing platform, wherein the processing platform comprises a processing plane and a processing working part erected above the processing plane, the processing plane is provided with a plurality of mobile phone mainboard processing stations, the processing working part comprises a plurality of processing ends corresponding to the mobile phone mainboard processing stations one by one, the position feedback mechanism comprises a plurality of processing positioning modules matched with the processing ends one by one, each processing positioning module comprises a positioning information two-dimensional code arranged on a mobile phone mainboard to be processed and a two-dimensional code recognition camera arranged on the processing ends, the positioning information two-dimensional code comprises part mounting point information on the mobile phone mainboard to be processed, the two-dimensional code recognition camera is connected with an information processing terminal and is connected to the processing ends through the information processing terminal, the invention has the advantages that the processing positioning information is provided by the positioning information two-dimensional code, and the cost is effectively reduced.
Description
Technical Field
The invention relates to the field of mobile phone processing, in particular to a high-precision low-cost mobile phone mainboard processing position feedback system.
Background
In the existing processing scene, in order to effectively improve the processing efficiency, mobile phone motherboards in the same batch are generally loaded on the same processing plane, and the mounting positions of the circuit components are positioned by a positioning device after being clamped.
The current commonly used positioning device is a visual identification positioning assembly formed by a plurality of visual phase mechanisms arranged above a processing plane in an array mode, the position feedback device extremely depends on the precision of the device, a high-precision visual camera needs to be configured for obtaining high-precision position feedback, the equipment cost is greatly improved, and the device is not suitable for large-scale industrial production.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a high-precision low-cost mobile phone mainboard processing position feedback system aiming at the defects of the prior art.
The technical scheme is as follows: the invention relates to a high-precision low-cost mobile phone mainboard processing position feedback system, which comprises a processing platform and a position feedback mechanism matched with the processing platform, the processing platform comprises a processing plane and a processing working part erected above the processing plane, a plurality of mobile phone main board processing stations are arranged on the processing plane, the processing working part comprises a plurality of processing ends which are in one-to-one correspondence with the processing positions of the mobile phone main board, the position feedback mechanism comprises a plurality of processing positioning modules which are matched with the processing ends one-to-one, the processing positioning module comprises a positioning information two-dimensional code arranged on a mobile phone mainboard to be processed and a two-dimensional code recognition camera arranged on a processing end, the positioning information two-dimensional code comprises information of a component mounting point on a mobile phone mainboard to be processed, and the two-dimensional code recognition camera is connected with an information processing terminal and connected to a processing end through the information processing terminal.
Preferably, each processing position of the mobile phone main board is provided with a group of processing position confirmation assemblies.
Preferably, the machining position confirming component comprises grating detection components erected on two sides of the machining position of the mobile phone main board.
Preferably, the machining position confirmation means includes an infrared positioning means.
Preferably, the mobile phone motherboard machining position is provided with a motherboard positioning groove matched with the mobile phone motherboard.
Compared with the prior art, the invention has the following beneficial effects: the positioning information two-dimensional code arranged on the mobile phone mainboard to be processed is matched with the two-dimensional code recognition camera arranged on the processing end, and the positioning information is pre-input into the processing end through the information processing terminal, so that the processing end directly starts to process after position feedback information is built in, and the whole equipment cost is effectively reduced while the high-precision position feedback is ensured.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used merely for convenience in describing and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting.
In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The technical means of the present invention will be described in detail with reference to specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
The utility model provides a cell-phone mainboard processing position feedback system of high accuracy low cost, including the position feedback mechanism of processing platform and cooperation processing platform, the processing platform includes the machined surface and erects the processing work portion in the machined surface top, be equipped with a plurality of cell-phone mainboard machining position on the machined surface, the processing work portion includes the processing end of a plurality of and cell-phone mainboard machining position one-to-one, position feedback mechanism includes a plurality of and the processing end one-to-one complex processing orientation module, processing orientation module is including setting up at the locating information two-dimensional code of treating processing cell-phone mainboard and setting up the two-dimensional code identification camera on the processing end, the locating information two-dimensional code is including the part mounting point information on the cell-phone mainboard of treating processing, be connected with information processing terminal on the two-dimensional code identification camera and connect on the processing end through information processing terminal. The technical scheme has the advantages that the positioning information two-dimensional code arranged on the mobile phone mainboard to be processed is matched with the two-dimensional code recognition camera arranged on the processing end, and the positioning information is pre-recorded into the processing end through the information processing terminal, so that the processing end directly starts to process after position feedback information is built in, the high-precision position feedback is ensured, and the whole equipment cost is effectively reduced.
For confirming the feedback to locating information the secondary, every mobile phone motherboard adds station department and all is equipped with a set of processing position and confirms the subassembly, and is concrete, and the subassembly is confirmed including erectting grating detection component or the infrared positioning subassembly in mobile phone motherboard processing position both sides to the processing position, and in addition, mobile phone motherboard adds the mainboard constant head tank that station department seted up the cooperation mobile phone motherboard.
In the present invention, unless otherwise explicitly specified or limited, the first feature "on" or "under" the second feature may be directly contacting the first feature and the second feature or indirectly contacting the first feature and the second feature through an intermediate. Also, a first feature "on," "above," and "above" a second feature may be directly or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "beneath," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lower elevation than the second feature. In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example.
Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (5)
1. The utility model provides a low-cost mobile phone motherboard of high accuracy processing position feedback system, includes the position feedback mechanism of processing platform and cooperation processing platform, its characterized in that: the processing platform includes the machined surface and erects the processing work portion in the machined surface top, be equipped with a plurality of mobile phone motherboard on the machined surface and add the station, the processing work portion includes the processing end of a plurality of and mobile phone motherboard add station one-to-one, position feedback mechanism includes a plurality of and processing end one-to-one complex processing orientation module, processing orientation module is including setting up at the locating information two-dimensional code of waiting to process mobile phone motherboard and the two-dimensional code recognition camera of setting on the processing end, the locating information two-dimensional code is including the part mounting point information on the mobile phone motherboard of waiting to process, be connected with information processing terminal on the two-dimensional code recognition camera and connect on the processing end through information processing terminal.
2. The high-precision low-cost mobile phone motherboard machining position feedback system of claim 1, characterized in that: and each mobile phone mainboard machining position is provided with a group of machining position confirmation assemblies.
3. The high-precision low-cost mobile phone motherboard machining position feedback system of claim 2, characterized in that: the machining position confirming assembly comprises grating detection assemblies erected on two sides of a machining position of a mobile phone main board.
4. The high-precision low-cost mobile phone motherboard machining position feedback system of claim 2, characterized in that: the machining position confirming assembly comprises an infrared positioning assembly.
5. The high-precision low-cost mobile phone motherboard machining position feedback system of claim 1, characterized in that: and a mainboard positioning groove matched with the mobile phone mainboard is formed in the mobile phone mainboard machining position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210115486.8A CN114594728A (en) | 2022-02-07 | 2022-02-07 | High-precision low-cost mobile phone motherboard machining position feedback system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210115486.8A CN114594728A (en) | 2022-02-07 | 2022-02-07 | High-precision low-cost mobile phone motherboard machining position feedback system |
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| Publication Number | Publication Date |
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| CN114594728A true CN114594728A (en) | 2022-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210115486.8A Withdrawn CN114594728A (en) | 2022-02-07 | 2022-02-07 | High-precision low-cost mobile phone motherboard machining position feedback system |
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| JP2018005873A (en) * | 2016-01-15 | 2018-01-11 | 施教競 | Processing method for processing machine |
| CN107855643A (en) * | 2017-11-10 | 2018-03-30 | 贺碧先 | A kind of laser beam marking device for phone housing |
| CN109186457A (en) * | 2018-09-14 | 2019-01-11 | 天津玛特检测设备有限公司 | A kind of Parts Recognition method and apparatus of binocular and production line using the device |
| CN111283325A (en) * | 2020-02-27 | 2020-06-16 | 大族激光科技产业集团股份有限公司 | Laser welding apparatus |
| CN111950669A (en) * | 2020-08-20 | 2020-11-17 | 南京中车浦镇城轨车辆有限责任公司 | Welding product production information acquisition method based on database and two-dimensional code |
| CN112620899A (en) * | 2020-12-04 | 2021-04-09 | 湖北三江航天红阳机电有限公司 | Robot welding production line |
| CN213592056U (en) * | 2020-10-19 | 2021-07-02 | 鑫和(东莞)五金科技有限公司 | Multistation cell-phone center radium carving tool |
| CN113478085A (en) * | 2021-05-31 | 2021-10-08 | 大族激光科技产业集团股份有限公司 | Press from both sides tool and laser beam machining equipment |
-
2022
- 2022-02-07 CN CN202210115486.8A patent/CN114594728A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101504364A (en) * | 2009-03-13 | 2009-08-12 | 重庆大学 | Infrared spectrum monitoring system based on MEMS optical grating optical modulator linear array |
| JP2018005873A (en) * | 2016-01-15 | 2018-01-11 | 施教競 | Processing method for processing machine |
| CN107855643A (en) * | 2017-11-10 | 2018-03-30 | 贺碧先 | A kind of laser beam marking device for phone housing |
| CN109186457A (en) * | 2018-09-14 | 2019-01-11 | 天津玛特检测设备有限公司 | A kind of Parts Recognition method and apparatus of binocular and production line using the device |
| CN111283325A (en) * | 2020-02-27 | 2020-06-16 | 大族激光科技产业集团股份有限公司 | Laser welding apparatus |
| CN111950669A (en) * | 2020-08-20 | 2020-11-17 | 南京中车浦镇城轨车辆有限责任公司 | Welding product production information acquisition method based on database and two-dimensional code |
| CN213592056U (en) * | 2020-10-19 | 2021-07-02 | 鑫和(东莞)五金科技有限公司 | Multistation cell-phone center radium carving tool |
| CN112620899A (en) * | 2020-12-04 | 2021-04-09 | 湖北三江航天红阳机电有限公司 | Robot welding production line |
| CN113478085A (en) * | 2021-05-31 | 2021-10-08 | 大族激光科技产业集团股份有限公司 | Press from both sides tool and laser beam machining equipment |
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Application publication date: 20220607 |
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| WW01 | Invention patent application withdrawn after publication |