CN114583548A

CN114583548A - Multi-bar packaged semiconductor laser array sintering clamp

Info

Publication number: CN114583548A
Application number: CN202210152199.4A
Authority: CN
Inventors: 刘成成; 刘琦; 位晓凤; 付传尚; 孙素娟
Original assignee: Shandong Huaguang Optoelectronics Co Ltd
Current assignee: Shandong Huaguang Optoelectronics Co Ltd
Priority date: 2022-02-18
Filing date: 2022-02-18
Publication date: 2022-06-03

Abstract

The invention relates to the technical field of semiconductor lasers, and particularly discloses a sintering clamp for a multi-bar packaged semiconductor laser array. The sintering jig includes: the installation base, fixing base, slope piece, limit setting element, apron, vertical gravity piece and inclined plane gravity piece. Wherein: slope pieces are symmetrically fixed on the left side and the right side of the upper surface of the fixing seat, edge positioning pieces are fixed on the front side and the rear side of the upper surface of the fixing seat, and the slope pieces and the edge positioning pieces surround to form a bar setting area. The apron sets up in the top of slope spare and limit setting element, the lower terminal surface of vertical gravity piece is vertical to pass the apron after pressing on the setting area of barre. The inclined plane gravity piece is placed on the inclined plane of the inclined plane piece, and the inner side face of the inclined plane gravity piece abuts against one end of the batten array under the action of self weight. The sintering fixture can ensure that each bar heat conduction path is equal, thereby ensuring the consistency of sintering quality.

Description

Multi-bar packaged semiconductor laser array sintering clamp

Technical Field

The invention relates to the technical field of semiconductor lasers, in particular to a sintering clamp for a multi-bar packaged semiconductor laser array.

Background

The information disclosed in this background of the invention is only for enhancement of understanding of the general background of the invention and is not necessarily to be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

The semiconductor laser is widely applied to the fields of laser radar, material modification, laser processing, solid laser pumping, military scientific research and the like by virtue of the advantages of high energy density, high power density, high directivity, easiness in realizing remote transmission and the like, the requirement on the output power of the semiconductor laser is higher and higher along with the widening and development of the application field, the packaging quality of the laser is a main factor influencing the development of a module, and the requirements of firmness, no cavity, good heat conductivity, high consistency and the like are provided for the welding between the laser and a heat sink.

At present, a semiconductor laser package generally adopts a separated sintering process, a bar array of the semiconductor laser and a heat sink are periodically stacked and packaged into the bar array by hard solder, and then the bar array, a module heat sink, an electrode and the like are sintered by low-temperature solder, wherein the packaging quality of the bar array is a key step influencing the product yield.

Disclosure of Invention

The invention provides a multi-bar packaged semiconductor laser array sintering clamp which can ensure that heat conduction paths of all bars are equal, so that the consistency of sintering quality is ensured. In order to achieve the above object, the present invention discloses the following technical solutions.

A many bar encapsulation semiconductor laser array sintering jig includes: mounting base, fixing base, slope piece, limit setting element, apron, vertical gravity piece and inclined plane gravity piece. Wherein: the fixing seat is obliquely arranged on the mounting base. Slope pieces are symmetrically fixed on the left side and the right side of the upper surface of the fixing seat, edge positioning pieces are fixed on the front side and the rear side of the upper surface of the fixing seat, and the slope pieces and the edge positioning pieces surround to form a bar setting area. The cover plate is arranged above the slope part and the side positioning part, and the lower end face of the vertical gravity part vertically penetrates through the cover plate and then is pressed on the bar arrangement area. The inclined plane gravity piece is placed on the inclined plane of slope piece, just inclined plane gravity piece medial surface under the dead weight effect with be located the outside contact of the busbar array in the busbar setting zone.

Further, the width of the lower end face of the vertical gravity piece is not larger than the width of the bar setting area. Preferably, the widths of the two are the same, and the vertical gravity piece can press the heat sink positioned in the bar arrangement area in the arrangement area, so that the levelness of the heat sink array is ensured to be consistent.

Furthermore, the mounting base is provided with a right-angled triangular groove which is obliquely arranged, the front side surface of the triangular groove is open, and the right-angled triangular groove is obliquely inclined backwards. The fixing seat is obliquely arranged in the triangular groove.

Further, the slope member includes any one of a right-angled triangle block and a right-angled trapezoid block. Wherein: the inclined gravity piece is placed on the inclined surface of the slope piece.

Furthermore, a positioning groove is formed in the inclined surface of the slope piece, and the slope piece is fixed on the fixing seat through a positioning piece in the positioning groove.

Further, the cover plate is supported above the ramp member and the side positioning member by the support posts. Wherein: the lower extreme of pillar is fixed on the fixing base, the apron can be dismantled and fix on the pillar.

Furthermore, a through hole is formed in the cover plate, and the lower end of the vertical gravity piece enters the lower portion of the cover plate after passing through the through hole.

Further, the cover plate is detachably fixed on the upper end surface of the support column through a bolt, a screw and the like.

Furthermore, the side positioning piece is detachably fixed on the fixing seat through components such as bolts or screws, so that the side positioning piece can be conveniently positioned and installed.

Furthermore, the four corners of the upper surface of the fixing seat are respectively provided with a limiting table, and a limiting groove is formed between every two adjacent limiting tables. Wherein: the two slope pieces are respectively limited in the limiting grooves on the left side and the right side of the fixing seat; the two side positioning pieces are respectively limited in the limiting grooves at the front side and the rear side of the fixing seat, so that the mounting precision of the slope piece and the side positioning pieces is better ensured.

Further, the inclined gravity piece comprises any one of a triangular block and a right-angled trapezoidal block. One side of the inclined plane gravity piece is closely attached and contacted with the inclined plane of the slope piece, and the other side of the inclined plane gravity piece is closely contacted with the heat sink array in the bar arrangement area.

Furthermore, the inclined angle of the inclined plane part is preferably controlled to be 10-80 degrees, the inclined plane gravity part is not easy to automatically slide downwards when the angle is too small, the horizontal thrust to the heat sink array is too small when the angle is too large, and a cavity between the bar and the heat sink can be formed when the solder is melted.

Compared with the prior art, the invention has the following beneficial effects:

at present, the packaging bar array is mostly arranged on a bevel fixture and then integrally sintered. However, the present invention finds that the different heat conduction paths of the respective arrays cause different melting times of the solders at different positions, and at the same time, when the number of bars is large, the problem that the bar cavity surfaces are not in the same plane occurs, which all affect the sintering quality and directly affect the packaging quality of the bar arrays. In order to overcome the problems, the invention adopts the following measures:

(1) the fixture is assembled by placing the fixed seat on the mounting base, placing the fixed seat in the right-angled triangular groove of the mounting base, and enabling the side surface and the bottom surface of the fixed seat to be respectively clung to the side wall and the bottom surface of the triangular groove, so that the fixed seat is inclined in two directions of right-side upward and backward. Through the action of gravity, incline upwards to the right and can guarantee to carry out the horizontal direction uniformity when bars, soldering lug, tungsten copper heat sink cycle array assembly become the array, incline backward can guarantee that array one end aligns.

(2) The heat sink array is ensured to be horizontal through the action of the vertical gravity block, and array bending caused by the action of horizontal force is avoided. Meanwhile, the left and right uniform stress of the heat sink array is ensured through the action of the inclined plane gravity piece, and the left and right heat capacity bodies are symmetrically distributed, which is beneficial to improving the consistency of sintering quality.

(3) The sintering fixture enables the heat sink arrays to be horizontally arranged on the fixture, the distance between each array and the hot plate is equal, and the components in contact with the periphery are symmetrically distributed, so that the heat conduction paths of the bars are equal, the heat fields around the bars are symmetrically distributed, the problem that the melting time of the solders at different positions is different due to the fact that the heat conduction paths of the arrays are different is solved, the consistency of sintering quality is guaranteed, and the overall reliability of the module is improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a cross-sectional view of a sintering jig for a multi-bar packaged semiconductor laser array in an embodiment.

Fig. 2 is a schematic structural diagram of a sintering fixture for a multi-bar packaged semiconductor laser array in an embodiment.

Fig. 3 is a schematic structural view of the slope member in the embodiment.

Fig. 4 is a schematic structural diagram of the fixing base in the embodiment.

Fig. 5 is a schematic structural diagram of the mounting base in the embodiment.

The numerical designations in the drawings represent: 1-a fixed seat, 2-a slope part, 3-a side positioning part, 4-a cover plate, 5-a vertical gravity part, 6-a slope gravity part, 7-a mounting base, 8-a triangular groove, 801-an inclined inner wall, 802-an inclined bottom surface, 9-a positioning groove, 10-a support, 11-a positioning part, 12-a limiting table, 13-a limiting groove and 14-a heat sink array.

Detailed Description

It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

For convenience of description, the words "up", "down", "left" and "right" when used in this specification shall be construed to mean that they correspond only to the directions of movement of the drawing itself, and shall not necessarily limit the structure, but merely to facilitate the description of the invention and to simplify the description, and shall not indicate or imply that the referenced device or component needs to have a particular orientation, be constructed and operated in a particular orientation, and shall not be construed as limiting the invention. The invention will now be further described with reference to the drawings and detailed description.

The utility model provides a many bar encapsulation semiconductor laser array sintering anchor clamps which mainly includes: fixing base 1, slope piece 2, limit setting element 3, apron 4, vertical gravity piece 5 and inclined plane gravity piece 6. Wherein:

taking fig. 1 as an example, the sintering jig of the present embodiment is illustrated in a state of being assembled and ready to be sintered. In this case, the fixing base 1 is a horizontally disposed rectangular plate. Slope piece 2 is right triangle-shaped piece, and the left and right bilateral symmetry of the upper surface of this fixing base 1 is provided with slope piece 2, the inclined plane of this slope piece 2 distributes towards the inboard of fixing base 1, so that make inclined plane gravity piece 6 slides to the inboard of fixing base 1. In addition, the slope part 2 may also be a right-angled trapezoid block, which is different from the slope part 2 of the right-angled triangle block in that a plane is formed between the inclined surface and the bottom surface, and the bottom surface of the slope part 2 of the right-angled triangle block is in direct contact with the inclined surface, and the plane further contributes to increasing the constraint of the slope part 2 on the heat sink array 14. The inclined plane inclination angle of the inclined plane part 2 is not too large or too small, the inclined plane gravity part 6 is not easy to automatically slide downwards when the angle is too small, the horizontal thrust on the heat sink array 14 is too small when the angle is too large, and a cavity between a bar and a heat sink can be formed when the solder is molten. Therefore, the inclination angle can be controlled to be 10-80 degrees, such as 10 degrees, 18 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 44 degrees, 50 degrees, 56 degrees, 60 degrees, 62 degrees, 70 degrees, 75 degrees, 80 degrees and the like, and can be specifically selected according to requirements.

Referring to fig. 1 and 2, fig. 2 shows a state in which the sintering jig of the present embodiment is not detached from the mounting base 7 after the assembly. In this state, the front and rear sides of the upper surface of the fixing base 1 are fixed with side positioning pieces 3, and the side positioning pieces 3 are rectangular blocks and are fastened on the upper surface of the fixing base 1 through bolts, so that the fixing base is convenient to detach and install. The two slope parts 2 and the two side positioning parts 3 surround together to form a square bar arrangement area. The heat sink array 14 is located within the batten disposed region.

The cover plate 4 is supported above the ramp 2 and the edge positioning element 3 by four support struts 10. Wherein: the lower extreme screw thread fixed connection of pillar 10 is in the four corners departments of the upper surface of fixing base 1, apron 4 passes through assemblies such as bolt or screw and can dismantle to be fixed on the up end of pillar 10. The cover plate 4 is provided with a square through hole, the vertical gravity piece 5 is a cuboid block, and the lower end of the vertical gravity piece enters the lower part of the cover plate 4 after passing through the through hole 11. The cover plate 4 can play a role in positioning and restraining the vertical gravity piece 5, and ensures that the vertical gravity piece 5 can be perpendicular to the upper surface of the fixed seat 1, so that the heat sink array 14 located in the bar setting area is positioned, the heat sink array level is ensured, the bending caused by overlong array is avoided, and the consistency of sintering quality is improved. Therefore, it should be understood that the vertical gravity member 5 may also be a cylinder, an elliptic cylinder, a trapezoid, etc., and the lower end surface thereof should be ensured to be planar.

The inclined plane gravity piece 6 is a right-angled trapezoidal block and is placed on the inclined plane of the slope piece 2, and the bottom surface of the inclined plane gravity piece 6 is tightly attached and contacted with the inclined plane of the slope piece 2. When the bar arrangement area is provided with the heat sink array 14, under the action of self gravity, the plane of the lower part of the bevel edge of the bevel gravity piece 6 is tightly contacted with one end of the heat sink array 14, so that the left end and the right end of the bar array are stressed equally. When the heat sink array 14 is arranged in the batten arrangement area, because the lower part of the bevel edge of the bevel gravity piece 6 is in contact with the heat sink array 14, the left side and the right side of the heat sink array 14 are forcefully acted, when the solder melts, the force can extrude the array, so that the solder is uniformly distributed, a hole between the batten and the heat sink is reduced, and due to the action of left and right forces, the middle of the array is protruded when the array is too long, so that the array is bent, and the levelness of the heat sink array 14 is kept consistent through the action of the vertical gravity piece 5, so that the sintering quality is guaranteed.

In addition to this, the inclined surface gravity member 6 may also adopt a triangular block, such as a right-angled triangular block, a non-right-angled triangular block, etc., which has a similar function to the inclined surface gravity member 6 of the right-angled trapezoidal block in this embodiment.

The sintering fixture of the embodiment enables the components contacting around the heat sink array 14 to be in a symmetrical distribution state, ensures that the heat conduction paths of each bar are equal, avoids the problem that the melting time of the solder at different positions is different due to different heat conduction paths of each array, and is beneficial to ensuring the consistency of sintering quality.

Referring to fig. 1 and 3, in another embodiment, a positioning groove 9 is disposed on the inclined surface of the slope component 2, a positioning hole is disposed on the bottom surface of the positioning groove 9, and a positioning component 11 (such as a bolt, a screw, etc.) detachably fixes the slope component 2 on the fixing base 1 through the positioning hole, and meanwhile, since the positioning component 11 is hidden in the positioning groove 9, the influence on the inclined surface gravity component 6 on the inclined surface of the slope component 2 is avoided. In addition, the mounting accuracy of the slope member 2 can be ensured by positioning, and the slope member 2 is prevented from being displaced during the mounting of other components, the transportation of a sintering jig, and the like, and the sintering quality of the heat sink array 14 is prevented from being affected.

Referring to fig. 1, 2 and 4, in another embodiment, four corners of the upper surface of the fixing base 1 are respectively provided with a square-shaped limiting platform 12, four limiting grooves 13 are formed between adjacent limiting platforms 12, and each limiting groove 13 is provided with a screw hole. The slope piece 2 and the side positioning piece 3 are detachably fixed in the limiting groove 13 through positioning pieces such as screws or bolts. Wherein: the two slope parts 2 are respectively limited in the limiting grooves 13 on the left side and the right side of the fixing seat 1; two limit setting element 3 is spacing respectively in the spacing groove 13 of the preceding, rear side of fixing base 1, two slope piece 2 and two limit setting element 3 surround jointly and form square barre setting zone. The limiting groove 13 formed by the limiting table 12 can better ensure the installation precision of the slope part 2 and the side positioning part 3 and improve the installation efficiency. Meanwhile, the design ensures that the components contacted with the periphery of the heat sink array 14 are in a symmetrical distribution state, ensures that the heat conduction paths of each bar are equal, and is beneficial to improving the consistency of sintering quality. The lower end of the support column 10 is in the shape of a screw, and the screw is fixedly connected to a screw hole on the upper surface of the limit table 12. Other ways can also be adopted to detachably and fixedly connect the lower end of the supporting column 10 to the limit table 12, such as inserting the lower end of the supporting column 10 into a jack on the limit table 12, and the like.

Referring to fig. 2 and 5, in another embodiment, the sintering jig for a poly-bar packaged semiconductor laser array further includes a mounting base 7, the mounting base 7 has a right-angled triangular groove 8 disposed obliquely, a front side surface of the right-angled triangular groove 8 is open, and the right-angled triangular groove 8 is inclined backwards. The fixing seat 1 is obliquely arranged in the right-angled triangular groove 8, the left wall surface of the fixing seat 1 is in parallel contact with the oblique inner wall 801 on the left side of the triangular groove 8, the bottom surface of the fixing seat 1 is in parallel contact with the oblique bottom surface 802 of the triangular groove 8, and the rear wall surface of the fixing seat 1 is in parallel contact with the rear wall surface of the triangular groove 8. When the fixing seat 1 is placed in the triangular groove 8 of the mounting base, the left side wall, the rear side wall and the bottom surface of the fixing seat 1 are respectively clung to the left wall surface, the rear wall surface and the bottom surface of the right-angled triangular groove 8, so that the fixing seat 1 is inclined in two directions of right and back. Through the action of gravity, incline upwards to the right and can guarantee to carry out the horizontal direction uniformity when bars, soldering lug, tungsten copper heat sink cycle array assembly become the array, incline backward can guarantee that array one end aligns.

The method for positioning the bar array by adopting the sintering clamp for the bar-packaged semiconductor laser array of the embodiment comprises the following steps:

(1) the fixing seat 1 is obliquely placed in the triangular groove 8 of the mounting base 7, the left wall surface of the fixing seat 1 is in parallel contact with the oblique inner wall 801 on the left side of the triangular groove 8, the bottom surface of the fixing seat 1 is in parallel contact with the oblique bottom surface 802 of the triangular groove 8, and the rear wall surface of the fixing seat 1 is in parallel contact with the rear wall surface of the triangular groove 8.

(2) A ramp element 2 is fixed in a limiting groove 13 on the left surface of the fixing base 1. One of the side positioning pieces 3 is fixed in a stopper groove 13 on the rear surface of the holder 1.

(3) Connecting the strut 10 to the fixed seat 1, arranging the hard solder sheets, the bars, the heat sink array 14 and the like to be sintered into the bar arrangement area, and placing the cavity surfaces of the bars upwards or downwards; or first to dispose the desired sintered hard solder pieces, straps, heat sink array 14, etc. into the strap disposing area.

(4) The other slope piece 2 is fixed in the limiting groove 13 on the right surface of the fixed seat 1, and the slope piece 2 is lightly contacted with the heat sink array 14 to prevent the heat sink array 14 from being displaced by touch. Similarly, another side positioning piece 3 is fixed in the limiting groove 13 on the front surface of the fixed seat 1, and the side positioning piece 3 is lightly contacted with the heat sink array 14 to prevent touch from displacing the heat sink array 14.

(5) The cover plate 4 is fixed to the upper end face of the pillar 10, the assembled clamp is taken off from the mounting base 7 and placed on a horizontal table, and the vertical gravity 5 block is passed through the square through hole in the cover plate 4 and lightly pressed on the heat sink array 14. The beveled gravity block 6 is then placed on the bevel of the ramp 2 and the ramp 2 is slid down the bevel into gentle contact with the heat sink array 14 to complete the assembly of the sinter jig, as shown in fig. 1. The materials of the slope piece 2 and the slope gravity block 6 can be selected from tungsten steel, brass or 304 steel.

(6) And (5) finally, placing the sintering fixture assembled in the step (5) into vacuum reflow soldering equipment, and loading the set sintering curve for sintering.

Finally, it should be understood that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive changes in the technical solutions of the present invention.

Claims

1. The utility model provides a many bar encapsulation semiconductor laser array sintering jig, includes wherein:

mounting a base;

a ramp member;

the fixing seat is obliquely arranged on the mounting base; the slope parts are symmetrically fixed on the left side and the right side of the upper surface of the fixed seat;

the side positioning pieces are fixed on the front side and the rear side of the upper surface of the fixing seat; the slope piece and the side positioning piece surround to form a bar arrangement area;

a cover plate disposed above the ramp and the side positioning members;

the lower end face of the vertical gravity piece vertically penetrates through the cover plate and then is pressed on the batten arranging area;

the inclined plane gravity piece is placed on an inclined plane of the slope piece, and the inner side face of the inclined plane gravity piece is in contact with the outer side of the batten array in the batten setting area under the action of self weight.

2. The array sintering fixture of dopa-bar packaged semiconductor lasers of claim 1, wherein the width of the lower end surface of the vertical gravity piece is not greater than the width of the bar placement area; preferably, both have the same width.

3. The sintering fixture for the poly-bar packaged semiconductor laser array as claimed in claim 1, wherein a positioning groove is formed on an inclined surface of the slope member, and the slope member is fixed on the fixing base by a positioning member in the positioning groove.

4. The array sintering fixture of claim 1, wherein the cover plate is supported above the ramp and the edge positioning element by pillars; the lower end of the strut is fixed on the fixed seat, and the cover plate is detachably fixed on the strut;

preferably, the cover plate is provided with a through hole, and the lower end of the vertical gravity piece passes through the through hole and then enters the lower part of the cover plate;

preferably, the cover plate is detachably fixed to the upper end surface of the pillar by a bolt or a screw.

5. The array sintering fixture of the dopa-bar packaged semiconductor laser as claimed in claim 1, wherein the edge positioning piece is detachably fixed on the fixing base by a bolt or a screw.

6. The array sintering fixture for the dopa bar packaged semiconductor laser according to claim 1, wherein each of four corners of the upper surface of the fixing base has a limiting platform, and a limiting groove is formed between adjacent limiting platforms; wherein: the two slope pieces are respectively limited in the limiting grooves on the left side and the right side of the fixing seat; the two side positioning pieces are respectively limited in the limiting grooves at the front side and the rear side of the fixing seat.

7. The dopa bar packaging semiconductor laser array sintering fixture of any one of claims 1-6, wherein the ramp piece comprises any one of a right-angled triangular block and a right-angled trapezoidal block; the sloped gravity piece rests on the slope of the ramp piece.

8. The dopa bar packaged semiconductor laser array sintering fixture of any one of claims 1-6, wherein the inclined gravity piece comprises any one of a triangular block and a right-angled trapezoidal block; one side of the inclined plane gravity piece is tightly attached and contacted with the inclined plane of the slope piece, and the other side of the inclined plane gravity piece is tightly contacted with the heat sink array in the bar arrangement area.

9. The fixture for sintering the dopa bar packaged semiconductor laser array according to any one of claims 1 to 6, wherein the inclination angle of the inclined plane of the slope member is controlled to be between 10 ° and 80 °.

10. The poly bar packaged semiconductor laser array sintering jig according to any one of claims 1 to 6, wherein the mounting base is provided with a right-angled triangular groove which is obliquely arranged, the front side surface of the triangular groove is open, and the right-angled triangular groove is obliquely inclined backwards; the fixing seat is obliquely arranged in the triangular groove.