CN114582760A - Temperature control equipment for integrated circuit manufacturing process and integrated circuit manufacturing process system - Google Patents

Temperature control equipment for integrated circuit manufacturing process and integrated circuit manufacturing process system Download PDF

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Publication number
CN114582760A
CN114582760A CN202210197684.3A CN202210197684A CN114582760A CN 114582760 A CN114582760 A CN 114582760A CN 202210197684 A CN202210197684 A CN 202210197684A CN 114582760 A CN114582760 A CN 114582760A
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China
Prior art keywords
temperature
temperature control
circulating
integrated circuit
refrigerating sheet
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CN202210197684.3A
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Chinese (zh)
Inventor
常鑫
宋朝阳
冯涛
李文博
芮守祯
何茂栋
曹小康
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Beijing Jingyi Automation Equipment Co Ltd
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Beijing Jingyi Automation Equipment Co Ltd
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Priority to CN202210197684.3A priority Critical patent/CN114582760A/en
Publication of CN114582760A publication Critical patent/CN114582760A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application discloses a temperature control device for integrated circuit manufacturing process and an integrated circuit manufacturing process system. The temperature control device comprises at least two circulating flow channels which are respectively connected to different positions of the load to provide circulating liquid; the semiconductor refrigerating sheet group is used for cooling or heating circulating liquid in the circulating flow channel; the pump is used for pressurizing and conveying the circulating liquid; the information acquisition unit is used for acquiring physical quantity data of the circulating liquid; the controller is used for sending out an adjusting instruction according to the physical quantity data and the preset temperature value; and the adjustable direct current power supply receives the adjusting instruction and controls the working mode and the output temperature of the semiconductor refrigerating sheet set. The temperature control equipment has the characteristics of small occupied space, simple structure, accurate position temperature control, energy conservation, environmental protection and the like, so that the industrial requirement of the integrated circuit manufacturing process is met.

Description

Temperature control equipment for integrated circuit manufacturing process and integrated circuit manufacturing process system
Technical Field
The application relates to the technical field of industrial production temperature control, in particular to a temperature control device for integrated circuit manufacturing process and an integrated circuit manufacturing process system.
Background
Wafers are the base semiconductor material used to fabricate integrated circuits. In the manufacturing process of an integrated circuit, particularly in the photoetching process, etching equipment can release a large amount of heat energy, so that the temperature of a wafer is sharply increased, and the temperature value can reach hundreds or even thousands of degrees centigrade. Higher temperature can affect the performance of the wafer and affect the yield of the wafer. If the original wafer in the integrated circuit has defects, the resulting integrated circuit will also have defects.
Therefore, in order to ensure that the integrated circuit manufacturing process is not interfered by the external environment, the temperature of the load (such as the main process equipment for manufacturing the integrated circuit) in the integrated circuit manufacturing process needs to be controlled.
At present, a temperature control device is often connected to a main process device in an integrated circuit manufacturing process in the prior art to adjust the temperature of the main process device in the integrated circuit manufacturing process.
For example, one common temperature control device is a compression refrigerator, which relies on a compressor to increase the pressure of a refrigerant to implement a refrigeration cycle.
However, the inventor found that the following problems exist in controlling the temperature of the main process equipment in the integrated circuit manufacturing process by such a temperature control device.
1. The compression refrigerating machine has more components and occupies a large area.
2. The compression refrigerator needs to adopt a refrigerant in the working process, which is not beneficial to energy conservation and environmental protection.
3. The compressor of the compression refrigerator is a mechanical moving part, and the noise generated in the working process is large.
4. The conventional compression refrigerating machine mainly achieves the purpose of controlling the temperature of main process equipment by cooling the whole environment, but cannot control the temperature of local positions of the main process equipment.
Disclosure of Invention
The application discloses a temperature control device for integrated circuit manufacturing process and an integrated circuit control system.
According to an aspect of the present application, there is provided a temperature control apparatus for integrated circuit fabrication processes, comprising: at least two circulation flow channels respectively connected to different positions of the load to provide circulation liquid; the semiconductor refrigerating sheet set comprises a first end, wherein the first end is arranged in the circulating flow channel and used for cooling or heating circulating liquid in the circulating flow channel; the pump is arranged in the circulating flow passage and used for pressurizing and conveying circulating liquid; the information acquisition unit is arranged at a circulating flow channel section between the semiconductor refrigerating sheet set and the load and used for acquiring physical quantity data of circulating liquid; the controller is used for receiving the physical quantity data acquired by the information acquisition unit and sending out an adjusting instruction according to the acquired physical quantity data and a preset temperature value; and the adjustable direct current power supply receives the adjusting instruction and controls the working mode and the output temperature of the semiconductor refrigerating sheet set.
According to some embodiments of the present application, the circulation flow path includes a first inlet and a first outlet, the circulation flow path being connected to the load through the first inlet and the first outlet; the information acquisition unit includes: the first temperature sensor is used for acquiring temperature data of the circulating liquid at the first inlet; the second temperature sensor is used for acquiring temperature data of the circulating liquid at the first outlet; and the flow sensor is used for acquiring circulating liquid flow data.
According to some embodiments of the present application, a temperature control apparatus for integrated circuit fabrication further comprises a cooling channel; the semiconductor cooling fin group further comprises a second end, the second end is arranged in the cooling flow channel, and the cooling flow channel is used for cooling the second end.
According to some embodiments of the present disclosure, the temperature control apparatus for integrated circuit manufacturing process further includes a liquid tank disposed in the circulation flow channel for storing the circulation liquid.
According to some embodiments of the present application, the circulation flow path is connected to the load by a snap-in manner or a ferrule manner.
According to some embodiments of the present application, the semiconductor cooling fin group further comprises a heat sink for dissipating heat of the semiconductor cooling fin group.
According to some embodiments of the present application, the semiconductor chilling plate pack further comprises a heat exchanger exchanging heat with the circulating liquid.
According to some embodiments of the application, the controller sends a heating adjustment instruction when judging that the temperature data of the circulating liquid at the first inlet is smaller than a preset temperature value, and sends a cooling adjustment instruction when judging that the temperature data of the circulating liquid at the first inlet is larger than or equal to the preset temperature value; the adjustable direct current power supply adjusts the current direction of the semiconductor refrigerating sheet set according to the heating adjusting instruction, so that the first end of the semiconductor refrigerating sheet set is in a heating mode, and the adjustable direct current power supply adjusts the current direction of the semiconductor refrigerating sheet set according to the refrigerating adjusting instruction, so that the first end of the semiconductor refrigerating sheet set is in a refrigerating mode.
According to some embodiments of the present application, the output temperature of the semiconductor refrigeration sheet group of at least one of the at least two circulation flow channels is-10 ℃ to 40 ℃; the output temperature of the semiconductor refrigerating sheet group of the other circulation flow channel is 40-80 ℃.
According to another aspect of the present application, there is also provided an integrated circuit manufacturing process system including a temperature control apparatus as described above for integrated circuit manufacturing.
The temperature control equipment for the integrated circuit manufacturing process provided by the application provides circulating liquid with certain temperature to different positions of a load (such as main process equipment of the integrated circuit manufacturing process) through a plurality of circulating flow channels so as to realize accurate temperature control on the load.
The application provides a temperature control device adopts semiconductor refrigeration piece group as the control by temperature change source. Due to the physical characteristics of the semiconductor refrigerating sheet set, compared with a traditional compression refrigerating machine, the temperature control equipment has the characteristics of simple structure, small occupied space, quick temperature control, energy conservation and environmental friendliness, and can meet the working requirements of integrated circuit manufacturing processes.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram illustrating a temperature control apparatus for integrated circuit fabrication according to an exemplary embodiment of the present application.
Description of reference numerals:
a temperature control device 1; a first circulation flow path 11; a second circulation flow path 12; a semiconductor refrigerating sheet group 13; a first end 131; a second end 133; a heat sink 135; a heat exchanger 137; a pump 14; an information acquisition unit 15; a first temperature sensor 151; a second temperature sensor 153; a flow sensor 155; a controller 16; an adjustable dc power supply 17; a cooling flow passage 18; a liquid tank 19; a first position 101; a second position 103; a first inlet in 1; first outlet out1
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar parts in the drawings, and thus, a repetitive description thereof will be omitted.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the disclosure can be practiced without one or more of the specific details, or with other means, components, materials, devices, etc. In such cases, well-known structures, methods, devices, implementations, materials, or operations are not shown or described in detail.
Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The terms "first," "second," and the like in the description and claims of the present application and in the foregoing drawings are used for distinguishing between different objects and not for describing a particular sequential order.
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, not all, of the embodiments of the present application. All other embodiments obtained by a person skilled in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
An integrated circuit is a micro-structure having a desired circuit function, which is manufactured by interconnecting elements such as transistors, resistors, capacitors, and inductors, and wiring, which are required in one circuit, by using a certain manufacturing process.
Integrated circuit fabrication processes are the means by which integrated circuits are implemented. The integrated circuit manufacturing process comprises the process flows of oxidation, photoetching, diffusion, epitaxy, aluminum evaporation and the like. Photolithography, an important process in integrated circuit fabrication, uses exposure and development to scribe a bonded pattern structure on a photoresist layer, and then transfers the pattern on a photomask to a carrier wafer of an integrated circuit by an etching process.
During the photolithography process, the etching equipment releases a large amount of heat energy, which causes the temperature of the load equipment (such as the main process equipment) in the integrated circuit manufacturing process to rise sharply, thereby affecting the yield of the integrated circuit. Therefore, the method has great significance for temperature control in the integrated circuit manufacturing process.
According to one aspect of the present application, a temperature control apparatus for use in an integrated circuit manufacturing process is provided, which can provide a circulating fluid with a certain temperature value to a load (e.g., a main process apparatus for manufacturing an integrated circuit) of the integrated circuit manufacturing process to control the temperature of the load.
The technical solution provided by the present application will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic diagram illustrating a temperature control apparatus for integrated circuit fabrication according to an exemplary embodiment of the present application.
According to an exemplary embodiment, the temperature control apparatus 1 for integrated circuit manufacturing process provided herein includes at least two circulation flow paths respectively connected to different positions of a load to provide a circulation fluid.
For example, as shown in fig. 1, the temperature control device 1 includes two circulation flow paths, a first circulation flow path 11 and a second circulation flow path 12. The load comprises a first position 101 and a second position 103.
For example, the load is etching equipment used in a photolithography process in an integrated circuit manufacturing process, and a large amount of heat energy is released when the etching equipment is in a working state. And the temperatures at different locations of the etching apparatus may also vary depending on the operating characteristics of the etching apparatus.
Referring to fig. 1, a first circulation flow path 11 is connected to a first location 101, and supplies a circulation fluid to the first location 101 of the load to control a temperature at the first location 101 of the load.
The second circulation flow channel 12 is connected to the second location 103 and supplies the circulation fluid to the second location 103 of the load to control the temperature at the second location 103 of the load.
Optionally, the circulation flow path includes a first inlet in1 and a first outlet out1, and the circulation flow path is connected to the load through the first inlet in1 and the first outlet out 1.
For example, the first outlet out1 of the first circulation flow path 11 is connected to one end of the first location 101 of the load, and the first inlet in1 is connected to the other end of the first location 101 of the load, so that the first circulation flow path 11 establishes a closed circulation path with the first location 101 of the load.
The circulation liquid in the first circulation flow path 11 flows out from the first outlet out1 to enter the first position 101 of the load, and the circulation liquid flows through the first position 101 and re-enters the first circulation flow path 11 from the first inlet in1 to form circulation of the circulation liquid.
According to an exemplary embodiment, when the temperature control device 1 is in the operating state, the temperature of the circulating liquid in the first circulating flow channel 11 is lower than the temperature at the first position 101. Therefore, according to the heat transfer principle, the circulating liquid in the first circulating flow channel 11 can absorb the heat at the first position 101, so that the purpose of cooling the first position 101 can be achieved.
Optionally, the circulation flow path is connected to the load by a snap-in or a bayonet manner.
For example, the first inlet in1 and the first outlet out1 of the first circulation flow path 11 are connected with the interfaces of both ends of the first location 101 by means of plug-in connection to establish physical connection of the first circulation flow path 11 and the load.
Also for example, the first inlet in1 and the first outlet out1 of the first circulation flow path 11 are connected with the interfaces at both ends of the first location 101 by means of a ferrule-embedded manner to establish a physical connection of the first circulation flow path 11 and the load.
Similarly, the second circulating flow channel 12 is connected to the second position 103 of the load through the first outlet out1 and the first inlet in1, so that the circulating liquid in the second circulating flow channel 12 cools the second position 103 of the load.
The temperature control device 1 provided by the present application includes at least two circulation flow paths, and the circulation flow paths are respectively connected to different positions (for example, a first position 101 and a second position 103) of a load (for example, an etching device) for manufacturing an integrated circuit, so as to control the temperature of the entire load. Therefore, the whole load equipment has a relatively stable temperature value, and the integrated circuit manufacturing process cannot be influenced due to overhigh temperature at a certain position of the load.
The temperature control device 1 provided by the present application includes at least two circulation flow channels, and the structures of the plurality of circulation flow channels are completely the same. The structure of the temperature control device 1 will be described in detail below taking the first circulation flow path 11 as an example.
According to an exemplary embodiment, the temperature control device 1 further includes a semiconductor cooling fin group 13, the semiconductor cooling fin group 13 includes a first end 131, and the first end 131 is disposed in the circulation flow channel to cool or heat the circulation fluid in the circulation flow channel.
The semiconductor refrigerating sheet group 13 is formed by stacking and connecting a plurality of semiconductor refrigerating sheets in series. The semiconductor refrigerating sheet is also called as thermoelectric refrigerating sheet, and is an accessory which is made of semiconductor material and has the cooling/heating function.
The semiconductor refrigerating chip is characterized in that the semiconductor refrigerating chip is a current transduction type chip. When current is introduced into the semiconductor refrigerating sheet, one end absorbs heat and the other end releases heat. Therefore, the semiconductor refrigerating sheet can refrigerate and also heat.
Since the semiconductor refrigerating sheet set 13 is formed by stacking and connecting a plurality of semiconductor refrigerating sheets in series, the semiconductor refrigerating sheet set 13 can cool the receptor thereof and can also heat the receptor thereof.
For example, as shown in fig. 1, the semiconductor chilling plate group 13 includes a first end 131, and the first end 131 is disposed on the first circulation flow channel 11. The physical characteristics of the semiconductor refrigerating sheet enable one end of the semiconductor refrigerating sheet set 13 to be a heat absorption end and the other end to be a heat release end when current is introduced into the semiconductor refrigerating sheet set. Therefore, the first terminal 131 can be controlled to be a heat absorption terminal or a heat release terminal by controlling the direction of the current of the semiconductor cooling fin group 13.
When the first end 131 is a heat absorbing end, the semiconductor chilling plate group 13 cools the circulating liquid in the first circulating flow channel 11.
When the first end 131 is a heat radiation end, the semiconductor chilling plate group 13 heats the circulating liquid in the first circulating flow channel 11.
Optionally, semiconductor cooling fin group 13 further includes a heat sink 135 for dissipating heat of semiconductor cooling fin group 13.
Optionally, the semiconductor chilling plate group 13 further comprises a heat exchanger 137 for exchanging heat with the circulating liquid.
For example, referring to fig. 1, semiconductor chilling plate group 13 is provided with a radiator 135 and a heat exchanger 137. Radiator 135 radiates heat for semiconductor cooling fin group 13.
The heat exchanger 137 is provided at the first end 131, and exchanges heat between the first end 131 of the semiconductor chilling plate and the circulation fluid in the first circulation flow path 11.
When the first end 131 is a heating end, the heat exchanger 137 transfers heat of the first end 131 to the circulation liquid of the first circulation flow channel 11.
When the first end 131 is a cooling end, the heat exchanger 137 transfers heat of the circulation liquid of the first circulation flow channel 11 to the first end 131.
Optionally, the temperature control device 1 further includes a pump 14 disposed on the circulation flow channel for pressurizing and delivering the circulation liquid.
The pump 14 is a mechanical component that delivers or pressurizes a fluid. The pump 14 is used to transfer mechanical energy of the prime mover or other external energy to the circulating fluid.
For example, referring to fig. 1, the first circulation flow path 11 is provided with a pump 14. The pump 14 is used for pressurizing the circulation liquid on the first circulation flow channel 11 to ensure the circulation of the circulation liquid on the first circulation flow channel 11.
According to an exemplary embodiment, the temperature control device 1 further includes an information acquisition unit 15, and the information acquisition unit 15 is disposed at a circulation flow path section between the semiconductor refrigeration sheet group 13 and the load, and is used for acquiring physical quantity data of the circulation liquid.
For example, the physical quantity data of the circulating liquid may be temperature data and flow rate data of the circulating liquid. The operating state of the temperature control device 1 and the circulating speed of the circulating liquid can be known according to the temperature data and the flow data of the circulating liquid.
Optionally, the information acquisition unit 15 comprises a first temperature sensor 151 and a second temperature sensor 153. The first temperature sensor 151 collects temperature data of the circulation liquid at the first inlet in1, and the second temperature sensor 153 collects temperature data of the circulation liquid at the first outlet out 1.
For example, referring to fig. 1, the information collecting unit 15 includes a first temperature sensor 151, a second temperature sensor 153, and a flow sensor 155.
When the temperature control device 1 is in an operating state, the circulating liquid of the first circulating flow path 11 enters the first position 101 of the load from the first outlet out 1.
The circulation liquid of the first circulation flow path 11 flows into the first circulation flow path 11 again from the first inlet in1 of the first circulation flow path 11 after passing through the first location 101 of the load and absorbing a certain amount of heat at the first location 101 according to the heat transfer principle. The first temperature sensor 151 collects a temperature value of the circulation liquid at the first inlet in1 of the first circulation flow path 11.
The circulation liquid, which again flows into the first circulation flow path 11 from the first inlet in1 of the first circulation flow path 11, continues to circulate in the first circulation flow path 11 under the pressure control of the pump 14. When the circulating liquid flows through semiconductor chilling plate group 13, first end 131 of semiconductor chilling plate group 13 cools the circulating liquid.
After the circulating liquid is cooled by the group of semiconductor refrigerating fins 13, the circulating liquid continues to enter the first position 101 of the load through the first outlet out1 in the first circulating flow channel 11 under the pressure control of the pump 14, so as to cool the first position 101. The second temperature sensor 153 collects a temperature value of the circulating liquid at the first outlet out 1.
According to an exemplary embodiment, the information collecting unit 15 further includes a flow sensor 153, and the flow sensor 153 collects flow data of the circulation liquid.
For example, referring to fig. 1, the flow sensor 153 is disposed adjacent to the first outlet out1 of the first circulation flow path 11, and collects a flow value of the circulation liquid of the first circulation flow path 11.
The information acquisition unit 15 transmits the temperature value of the circulation liquid at the first inlet in1 of the first circulation flow path 11, the temperature value of the circulation liquid at the first outlet out1, and the flow rate value of the circulation liquid of the first circulation flow path 11 to the controller 16 of the temperature control apparatus 1.
According to an exemplary embodiment, the temperature control device 1 further comprises a controller 16. The controller 16 receives the collected physical quantity data of the information collection unit 15. The controller 16 issues an adjustment instruction according to the physical quantity data and the preset temperature value.
For example, the physical quantity data includes a temperature value of the first outlet out1 of the first circulation flow path 11, a temperature value of the first inlet in1, and a flow rate value of the circulation liquid of the first circulation flow path 11. The preset temperature value is the temperature value of the circulating liquid required for the first position 101 of the preset load.
Optionally, the controller 16 determines that the temperature data of the circulating liquid is less than a preset temperature value, and issues a heating adjustment instruction.
For example, the controller 16 receives a temperature value of the first outlet out1, a temperature value of the first inlet in1, and a preset temperature value. If the temperature value of the first inlet in1 is smaller than the preset temperature value, the controller 16 sends a heating adjustment instruction, so that the first end 131 of the semiconductor chilling plate group 13 is in a heating state, and the circulating liquid in the first circulating flow channel 11 is heated.
The principle is that when the temperature control device 1 is in a non-working state, the temperature of the circulating liquid in each circulating flow channel in the temperature control device 1 is the same as the indoor temperature. Therefore, when the temperature control device 1 is just in the working state, the temperature value of the circulating liquid and the preset temperature value of the circulating liquid required by the load have a certain temperature difference.
For example, in winter or in cold weather, the temperature of the circulating liquid is low. For example, the temperature at the first inlet in1, which is sensed by the first temperature sensor 151, is 0 ℃, and the desired preset temperature value of the circulating liquid at the first position 101 of the load is 30 ℃.
Therefore, when the temperature control device 1 is just in the operating state, the temperature of the circulating liquid at the first inlet in1 is less than the preset temperature value. At this time, the circulating liquid needs to be heated, so that the temperature value of the circulating liquid at the first position 101 where the first outlet out1 is connected to the load reaches a preset temperature value.
Optionally, the controller 16 determines that the temperature data of the circulating liquid is greater than or equal to a preset temperature value, and sends a refrigeration adjustment instruction.
For example, the controller 16 receives a temperature value of the first outlet out1, a temperature value of the first inlet in1, and a preset temperature value.
If the temperature value of the first inlet in1 is greater than the preset temperature value, the controller 16 sends a heating adjustment instruction, so that the first end 131 of the semiconductor cooling fin group 13 is in a cooling state, and the circulating liquid in the first circulating flow channel 11 is cooled.
The principle is that the temperature value of the first inlet in1 is greater than a preset temperature value, that is, the temperature control device 1 is in a normal working state. The circulating liquid of the first position 101, which is connected to the load from the first outlet out1, absorbs the heat of the first position 101 so that the temperature of the circulating liquid is increased. Therefore, the circulating liquid entering the first circulating flow passage 11 from the first inlet in1 needs to be cooled, so that the temperature value of the circulating liquid at the first position 101 where the load is connected at the first outlet out1 is reduced to the preset temperature value.
According to an example embodiment, the controller 16 compares the first outlet out1 detected by the second temperature sensor 153 with a preset temperature value to verify whether the actual circulating liquid temperature of the first outlet out1 reaches the preset temperature value.
According to an exemplary embodiment, the controller 16 controls the pumping pressure of the pump 14 based on the actual flow value of the circulating fluid to ensure that the pump 14 outputs the circulating fluid at a stable flow value.
For example, the flow rate value of the circulation liquid in the first circulation flow path 11 is 15LPM to 20 LPM.
According to an exemplary embodiment, the temperature control device 1 further comprises an adjustable dc power supply 17. The adjustable direct current power supply 17 receives the adjusting instruction, and controls the working mode and the output temperature of the semiconductor refrigerating sheet set 13 according to the adjusting instruction.
The adjustable dc power supply 17 adjusts the current direction of the semiconductor cooling fin set 13 according to the heating adjustment instruction, so that the first end 131 of the semiconductor cooling fin set 13 is in the heating mode.
For example, the controller 16 calculates the adjustment value based on the temperature value of the first inlet in1 and a preset temperature value. The controller 16 issues a heating adjustment command to the adjustable dc power supply 17 according to the adjustment value. The adjustable dc power supply 17 adjusts the voltage value of the adjustable dc power supply 17 according to the heating adjustment instruction to adjust the heating amount so that the actual temperature value at the first outlet out1 coincides with the preset temperature value.
And the adjustable direct current power supply 17 adjusts the current direction of the semiconductor refrigerating sheet set 13 according to the refrigerating adjustment instruction, so that the first end 131 of the semiconductor refrigerating sheet set 13 is in a heating mode.
For example, the controller 16 calculates the adjustment value based on the temperature value of the first inlet in1 and a preset temperature value. The controller 16 sends a refrigeration adjustment instruction to the adjustable dc power supply 17 according to the adjustment value. The adjustable dc power supply 17 adjusts the voltage value of the adjustable dc power supply 17 according to the refrigeration adjustment instruction to adjust the refrigeration capacity, so that the actual temperature value at the first outlet out1 is consistent with the preset temperature value.
According to an example embodiment, the adjustable dc power supply 17 also controls the output temperature of the semiconductor chilling block set 13 according to the cooling adjustment command/heating adjustment command.
The output temperature of the semiconductor refrigerating sheet group 13 of at least one of the at least two circulation flow channels included in the temperature control device 1 is-10 ℃ to 40 ℃. The output temperature of the semiconductor refrigerating sheet group 13 of the other circulation flow channel is 40-80 ℃.
According to an exemplary embodiment, the adjustable dc power supply 17 determines the output temperature of the first circulation flow path 11 and the second circulation flow path 12 based on the temperature requirements of the first position 101 and the second position 103 of the load.
For example, the adjustable dc power supply 17 controls the output temperature of the first end 131 of the semiconductor chilling plate group 13 of the first circulation flow channel 11 to-10 ℃ to 40 ℃ by the cooling adjustment command/heating adjustment command.
And the adjustable direct current power supply 17 controls the output temperature of the first end 131 of the semiconductor refrigerating sheet group 13 of the second circulation flow channel 12 to be 40-80 ℃ through a refrigerating regulation instruction/a heating regulation instruction.
The two circulating flow channels respectively output a relatively low temperature interval and a relatively high temperature interval according to the temperature requirements of different positions of the load. Through accurate temperature control, the circulating liquid with the required temperature is provided for the load, and the purpose of controlling the temperature of the load is achieved.
Through the above embodiment, the temperature control device 1 provides the circulating liquid in different temperature ranges to different positions (such as the first position 101 and the second position 103) of the load through the plurality of circulating flow channels, so as to achieve the purpose of accurately controlling the temperature of the load.
The semiconductor refrigerating sheet set 13 is used as a temperature control source, and the semiconductor refrigerating sheet set 13 is simple in structure and small in occupied space. The semiconductor refrigerating sheet group 13 does not need any refrigerant, does not have mechanical transmission parts and sliding parts, and does not produce pollution and noise, so that the temperature control device 1 provided by the application has the characteristics of energy conservation and environmental protection compared with the traditional compressor refrigerating machine.
The thermal inertia of the semiconductor refrigerating sheet group 13 is very small, the refrigerating and heating time is very short, and the refrigerating sheet can reach the maximum temperature difference when the power is on for less than one minute under the condition that the heat dissipation of the hot end is good and the cold end is idle. Therefore, the temperature adjusting speed of the temperature control equipment 1 provided by the application is high, the working efficiency is improved, and the effect of saving energy consumption is achieved.
Optionally, the temperature control device 1 further comprises a cooling flow channel 18. Semiconductor cooling fin group 13 further includes a second end 133, where second end 133 is disposed on cooling channel 18, and cooling channel 18 is used to cool second end 133.
For example, referring to fig. 1, the temperature control device 1 further includes a cooling flow passage 18. When the first end 131 of the semiconductor cooling fin group 13 is a heat absorbing end, the second end 133 is a heat releasing end.
Therefore, the second end 133 is provided on the cooling flow passage 18, and the cooling liquid is provided in the cooling flow passage 18 to cool the second stage 133. This can prevent the performance of semiconductor cooling fin group 13 from being damaged due to an excessively high temperature when second end 133 serves as a heat radiating end, so as to protect semiconductor cooling fin group 13.
Water is typically selected as the cooling fluid to provide a stable cooling fluid to second end 133 for passage of cooling channel 18 into the service water system.
Optionally, the temperature control device 1 further includes a liquid tank 19, and the liquid tank 19 is disposed in the circulation flow channel and is used for storing circulation liquid.
For example, referring to fig. 1, the first circulation flow path 11 is provided with a liquid tank 19. First circulation flow path 11 the circulation liquid enters the first circulation flow path 11 again from the first inlet in1, and then enters the liquid tank 19.
The liquid tank 19 is used to store the circulation liquid so that the first circulation flow path 11 has sufficient circulation liquid to circulate.
In accordance with another aspect of the present application, an integrated circuit fabrication process system is provided. The integrated circuit processing system includes a temperature control apparatus for integrated circuit processing as described above. A
Finally, it should be noted that the above-mentioned embodiments are only preferred embodiments of the present application, and are not intended to limit the present application, and although the present application is described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the above-mentioned embodiments, or equivalents may be substituted for some of the technical features. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A temperature control apparatus for integrated circuit fabrication processes, comprising:
at least two circulation flow channels respectively connected to different positions of the load to provide circulation liquid;
the semiconductor refrigerating sheet set comprises a first end, wherein the first end is arranged in the circulating flow channel and used for cooling or heating the circulating liquid in the circulating flow channel;
the pump is arranged in the circulating flow passage and is used for pressurizing and conveying the circulating liquid;
the information acquisition unit is arranged at a circulating flow channel section between the semiconductor refrigerating sheet set and the load and used for acquiring physical quantity data of the circulating liquid;
the controller is used for receiving the physical quantity data acquired by the information acquisition unit and sending out an adjusting instruction according to the physical quantity data and a preset temperature value;
and the adjustable direct current power supply receives the adjusting instruction and controls the working mode and the output temperature of the semiconductor refrigerating sheet set.
2. The temperature control apparatus of claim 1, wherein the circulation flow path includes a first inlet and a first outlet, the circulation flow path being connected to the load through the first inlet and the first outlet;
the information acquisition unit includes:
the first temperature sensor is used for acquiring temperature data of the circulating liquid at the first inlet;
the second temperature sensor is used for acquiring temperature data of the circulating liquid at the first outlet;
and the flow sensor is used for acquiring the flow data of the circulating liquid.
3. The temperature control apparatus according to claim 1, further comprising:
a cooling flow channel;
the semiconductor cooling fin group further comprises a second end, the second end is arranged on the cooling flow channel, and the cooling flow channel is used for cooling the second end.
4. The temperature control apparatus according to claim 1, further comprising:
and the liquid tank is arranged on the circulating flow channel and used for storing the circulating liquid.
5. The temperature control apparatus of claim 1, wherein the circulation flow path is connected to the load by a snap-in or a ferrule.
6. The temperature control apparatus of claim 1, wherein the semiconductor cold plate pack further comprises:
and the radiator is used for radiating the semiconductor refrigerating sheet set.
7. The temperature control apparatus of claim 6, wherein the semiconductor cold plate pack further comprises:
a heat exchanger exchanging heat with the circulating liquid.
8. The temperature control device according to claim 2, wherein the controller determines that the temperature data of the circulating fluid at the first inlet is less than the preset temperature value, and issues a heating adjustment command, and the controller determines that the temperature data of the circulating fluid at the first inlet is greater than or equal to the preset temperature value, and issues a cooling adjustment command;
the adjustable direct current power supply adjusts the current direction of the semiconductor refrigerating sheet set according to the heating adjusting instruction, so that the first end of the semiconductor refrigerating sheet set is in a heating mode; and
and the adjustable direct current power supply adjusts the current direction of the semiconductor refrigerating sheet set according to the refrigeration adjusting instruction, so that the first end of the semiconductor refrigerating sheet set is in a refrigeration mode.
9. The temperature control device according to claim 1, wherein the output temperature of the semiconductor refrigerating sheet group of at least one of the at least two circulating flow channels is-10 ℃ to 40 ℃;
the output temperature of the semiconductor refrigerating sheet group of the other circulating flow channel is 40-80 ℃.
10. An integrated circuit processing system comprising the temperature control apparatus for integrated circuit processing as claimed in any one of claims 1 to 9.
CN202210197684.3A 2022-03-02 2022-03-02 Temperature control equipment for integrated circuit manufacturing process and integrated circuit manufacturing process system Pending CN114582760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210197684.3A CN114582760A (en) 2022-03-02 2022-03-02 Temperature control equipment for integrated circuit manufacturing process and integrated circuit manufacturing process system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210197684.3A CN114582760A (en) 2022-03-02 2022-03-02 Temperature control equipment for integrated circuit manufacturing process and integrated circuit manufacturing process system

Publications (1)

Publication Number Publication Date
CN114582760A true CN114582760A (en) 2022-06-03

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Country Status (1)

Country Link
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