CN114574152A - Electromagnetic shielding glue formula and preparation method thereof - Google Patents
Electromagnetic shielding glue formula and preparation method thereof Download PDFInfo
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- CN114574152A CN114574152A CN202111310024.3A CN202111310024A CN114574152A CN 114574152 A CN114574152 A CN 114574152A CN 202111310024 A CN202111310024 A CN 202111310024A CN 114574152 A CN114574152 A CN 114574152A
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/08—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing carbon dioxide
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- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/102—Azo-compounds
- C08J9/103—Azodicarbonamide
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/02—CO2-releasing, e.g. NaHCO3 and citric acid
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/04—N2 releasing, ex azodicarbonamide or nitroso compound
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/05—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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Abstract
The application discloses an electromagnetic shielding glue formula and a preparation method thereof. The formula comprises the following components in parts by weight: 20-40 parts of resin carrier, 0.2-0.5 part of catalyst, 1.5-2.5 parts of adhesion promoter, 15-30 parts of organic solvent, 0.5-0.75 part of foaming agent, 0.75-1 part of anti-settling agent and 50-80 parts of conductive powder. The foaming process is used, a micro-bubble structure is generated in the colloid under a proper curing condition, the compression rate of the colloid can reach 50%, the compression force is low, and the damage of the base material by the colloid in a long-term compression state is reduced; the method is very suitable for the requirement scene of compression and elasticity; the glue can be cured at 90-100 ℃, the hardness is less than 45Shore A, and the adhesive force is excellent (the thrust is more than 20N/cm); the technical problem that the soft connection scene needing high compression cannot be adapted to due to low colloid compression rate, large compression force, high drying temperature and high hardness is solved.
Description
Technical Field
The application relates to the field of conductive glue, in particular to an electromagnetic shielding glue formula and a preparation method thereof.
Background
In the 5G communication base station, due to the complex circuit design, when working, each module cannot be influenced by external electromagnetic waves, and meanwhile, electromagnetic interference to the surrounding environment cannot be caused, so that a shielding space with higher reliability needs to be established in a complex space, and a plurality of conductive sealing connecting lines need to be established between an upper shell and a lower shell of the base station. In order to save space and facilitate processing, the electromagnetic shielding sealing coil in the complex space in the industry is mostly realized by using a FIP (form-in-place) dispensing process.
The inventor finds that the electromagnetic shielding glue adopted by the dispensing process does not use a foaming process, the compression ratio of the glue is low, and the compression force is large; and the drying temperature of the colloid needs 150 ℃ or more for solidification, the drying temperature is high, the hardness is high, and the colloid can not adapt to a soft connection scene needing high compression.
Aiming at the problems that the compression rate of the colloid is low, the compression force is large, the drying temperature is high, and the hardness is large in the related technology, which can not adapt to the soft connection scene needing high compression, an effective solution is not provided at present.
Disclosure of Invention
The application mainly aims to provide an electromagnetic shielding glue formula and a preparation method thereof, and aims to solve the problems caused by low compression rate, large compression force, high drying temperature and high hardness of the glue.
In order to achieve the above objects, according to one aspect of the present application, there is provided an electromagnetic shielding glue formulation.
The electromagnetic shielding glue formula comprises the following components in parts by weight: 20-40 parts of resin carrier, 0.2-0.5 part of catalyst, 1.5-2.5 parts of adhesion promoter, 15-30 parts of organic solvent, 0.5-0.75 part of foaming agent, 0.75-1 part of anti-settling agent and 50-80 parts of conductive powder.
Further, the resin carrier includes: one or more of liquid silicone rubber, MQ resin, vinyl silicone oil, phenyl-containing silicone oil and hydrogen-containing silicone oil.
Further, the catalyst comprises: one or more of platinum complex catalyst Pt 3000, Pt 5000, titanate catalyst, Nanda catalyst ND-42, and ND-72.
Further, the adhesion promoter includes: silane coupling agent KH171, KH174, KH550, KH560, Nippon 36, vinyl tributyrine oxime silane.
Further, the anti-settling agent comprises: polyethylene wax, fumed silica H20, H18, H17 and one or more of core-shell particles.
Further, the foaming aid comprises: one or more of azodicarbonamide as organic foaming agent, ammonium bicarbonate as inorganic foaming agent, sodium bicarbonate and high hydrogen silicone oil.
Further, the conductive powder includes: one or more of low-density spherical silver-nickel coating powder, low-density spherical silver-aluminum coating powder, high-density spherical nickel powder, low-density flaky nickel carbon powder and expanded graphite powder.
Further, the organic solvent is a mixture of alkanes and esters.
Further, the alkane solvent comprises: one or more of n-octane, n-decane and n-nonane-n-undecane; the ester solvent includes: one or more of propylene glycol methyl ether acetate, dimethyl adipate, butyl acetate and ethylene glycol ethyl ether acetate.
In order to achieve the above objects, according to another aspect of the present application, there is provided a method for preparing an electromagnetic shielding glue.
The preparation method of the electromagnetic shielding glue comprises the following steps: 1) preparation of premix: weighing resin, a catalyst, an adhesion promoter and various auxiliaries according to the formula ratio, mixing the raw materials in a double-planet stirring device, wherein the dispersion rotation speed is 100-1000R/min, the stirring rotation speed is 10-180R/min, and the dispersion time is 5-15 min to obtain a premix; 2) preparing conductive glue: weighing powder according to a formula, mixing the powder with the premix prepared in the step 1) in a double-planet stirring device, wherein the dispersion rotation speed is 100-1200R/min, the stirring rotation speed is 10-180R/min, the dispersion time is 30-100 min, a vacuum device is started for the last 10min, the glue is defoamed, and the temperature in the whole process needs to be controlled below 30 ℃ (by adjusting the temperature of circulating water); finally obtaining the conductive glue with viscosity of 35000-60000 Cp; 3) and (3) post-treatment stage: filtering the conductive glue obtained in the step 2) through a 100-mesh 200-mesh screen to remove impurities or large particles which are not uniformly dispersed in the slurry, extruding the glue and pouring the glue into a 100ml needle tube, and storing at a low temperature of 5 ℃.
According to the invention, the foaming process is realized by adding the organic solvent, the foaming agent and the anti-settling agent and matching with different proportions of the resin carrier, the catalyst, the adhesion promoter and the conductive powder, a micro-bubble structure is generated in the colloid under a proper curing condition, the compression ratio of the colloid can reach 50%, the compression force is low, and the damage of the glue in a long-term compression state to a base material is reduced; the method is very suitable for the requirement scene of compression and elasticity; the glue can be cured at 90-100 ℃, the hardness is less than 45Shore A, and the adhesive force is excellent (the thrust is more than 20N/cm); the technical problem that the soft connection scene needing high compression cannot be adapted to due to low colloid compression rate, large compression force, high drying temperature and high hardness is solved. In addition, on the premise of not influencing the conductive performance, several kinds of low-density high-conductivity powder are compounded (silver nickel powder, nickel carbon powder, silver aluminum powder and the like), so that the mass fraction of the conductive powder in each kilogram of products can be reduced, the cost is reduced, and the conductive powder has obvious cost advantage compared with similar products on the market.
Detailed Description
In order to make those skilled in the art better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail with reference to examples.
Example 1:
weighing 20 parts of resin carrier, 0.2 part of catalyst, 1.5 parts of adhesion promoter, 15 parts of organic solvent, 0.5 part of foaming agent and 0.75 part of anti-settling agent according to the mass percentage, mixing the raw materials in a double-planet stirring device at a dispersion rotating speed of 100-1000R/min, a stirring rotating speed of 10-180R/min and a dispersion time of 5-15 min to obtain the premix. Weighing 5 parts of nickel powder and 45 parts of nickel-carbon powder according to a formula, mixing the nickel powder and the premix in a double-planet stirring device, wherein the dispersion rotation speed is 100-1200R/min, the stirring rotation speed is 10-180R/min, the dispersion time is 30-100 min, a vacuum device is started for the last 10min, the glue is defoamed, and the temperature in the whole process needs to be controlled below 30 ℃ (the temperature of circulating water is regulated); finally obtaining the conductive glue with viscosity of 35000-60000 Cp; and filtering the obtained conductive glue through a 100-mesh 200-mesh screen to remove impurities or large particles which are not uniformly dispersed in the slurry, extruding the glue and pouring the glue into a 100ml needle tube, and storing at a low temperature of 5 ℃.
Example 2:
weighing 40 parts of resin carrier, 0.5 part of catalyst, 2.5 parts of adhesion promoter, 30 parts of organic solvent, 0.75 part of foaming agent and 1 part of anti-settling agent according to the mass percentage, mixing the raw materials in a double-planet stirring device at a dispersion rotating speed of 100-1000R/min, a stirring rotating speed of 10-180R/min and a dispersion time of 5-15 min to obtain the premix. Weighing 15 parts of nickel powder and 65 parts of nickel-carbon powder according to a formula, mixing the nickel powder and the premix in a double-planet stirring device, wherein the dispersion rotation speed is 100-1200R/min, the stirring rotation speed is 10-180R/min, the dispersion time is 30-100 min, a vacuum device is started for the last 10min, the glue is defoamed, and the temperature in the whole process needs to be controlled below 30 ℃ (the temperature of circulating water is regulated); finally obtaining the conductive glue with viscosity of 35000-60000 Cp; and filtering the obtained conductive glue through a 100-mesh 200-mesh screen to remove impurities or large particles which are not uniformly dispersed in the slurry, extruding the glue and pouring the glue into a 100ml needle tube, and storing at a low temperature of 5 ℃.
Example 3:
weighing 30 parts of resin carrier, 0.25 part of catalyst, 1.8 parts of adhesion promoter, 24 parts of organic solvent, 0.75 part of foaming agent and 0.8 part of anti-settling agent according to the mass percentage, mixing the raw materials in a double-planet stirring device at the dispersion rotating speed of 100-1000R/min, the stirring rotating speed of 10-180R/min and the dispersion time of 5-15 min to obtain the premix. Weighing 9 parts of nickel powder and 54 parts of nickel-carbon powder according to a formula, mixing the nickel powder and the premix in a double-planet stirring device, wherein the dispersion rotation speed is 100-1200R/min, the stirring rotation speed is 10-180R/min, the dispersion time is 30-100 min, a vacuum device is started for the last 10min, the glue is defoamed, and the temperature in the whole process needs to be controlled below 30 ℃ (the temperature of circulating water is regulated); finally obtaining the conductive glue with viscosity of 35000-60000 Cp; and filtering the obtained conductive glue through a 100-mesh 200-mesh screen to remove impurities or large particles which are not uniformly dispersed in the slurry, extruding the glue and pouring the glue into a 100ml needle tube, and storing at a low temperature of 5 ℃.
Example 4:
weighing 30 parts of resin carrier, 0.25 part of catalyst, 1.8 parts of adhesion promoter, 24 parts of organic solvent, 0.75 part of foaming agent and 0.8 part of anti-settling agent according to the mass percentage, mixing the raw materials in a double-planet stirring device at the dispersion rotating speed of 100-1000R/min, the stirring rotating speed of 10-180R/min and the dispersion time of 5-15 min to obtain the premix. Weighing 6 parts of nickel powder, 54 parts of nickel-carbon powder and 3 parts of silver-nickel powder according to a formula, mixing the powder with a premix in a double-planet stirring device, wherein the dispersion speed is 100-1200R/min, the stirring speed is 10-180R/min, the dispersion time is 30-100 min, a vacuum device is started for the last 10min, the glue is defoamed, and the temperature in the whole process needs to be controlled below 30 ℃ (by adjusting the temperature of circulating water); finally obtaining the conductive glue with viscosity of 35000-60000 Cp; and filtering the obtained conductive glue through a 100-mesh 200-mesh screen to remove impurities or large particles which are not uniformly dispersed in the slurry, extruding the glue and pouring the glue into a 100ml needle tube, and storing at a low temperature of 5 ℃.
The results are shown in the following table:
the above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. The electromagnetic shielding glue formula is characterized by comprising the following components in parts by weight: 20-40 parts of resin carrier, 0.2-0.5 part of catalyst, 1.5-2.5 parts of adhesion promoter, 15-30 parts of organic solvent, 0.5-0.75 part of foaming agent, 0.75-1 part of anti-settling agent and 50-80 parts of conductive powder.
2. An electromagnetic shielding glue formulation as defined in claim 1, wherein the resin carrier comprises: one or more of liquid silicone rubber, MQ resin, vinyl silicone oil, phenyl-containing silicone oil and hydrogen-containing silicone oil.
3. The electromagnetic shielding glue formulation of claim 1, wherein the catalyst comprises: one or more of platinum complex catalyst Pt 3000, Pt 5000, titanate catalyst, Nanda catalyst ND-42, and ND-72.
4. The electromagnetic shielding glue formulation of claim 1, wherein the adhesion promoter comprises: silane coupling agent KH171, KH174, KH550, KH560, Nippon 36, and/or vinyl tributyroximo silane.
5. The electromagnetic shielding glue formulation of claim 1, wherein the anti-settling agent comprises: polyethylene wax, fumed silica H20, H18, H17 and one or more of core-shell particles.
6. The electromagnetic shielding glue formulation of claim 1, wherein the foaming aid comprises: one or more of azodicarbonamide as organic foaming agent, ammonium bicarbonate as inorganic foaming agent, sodium bicarbonate and high hydrogen silicone oil.
7. The electromagnetic shielding glue formulation of claim 1, wherein the conductive powder comprises: one or more of low-density spherical silver-nickel coating powder, low-density spherical silver-aluminum coating powder, high-density spherical nickel powder, low-density flaky nickel carbon powder and expanded graphite powder.
8. The electromagnetic shielding glue formulation of claim 1, wherein the organic solvent is a mixture of alkanes and esters.
9. The electromagnetic shielding glue formulation of claim 8, wherein the alkane solvent comprises: one or more of n-octane, n-decane and n-nonane-n-undecane; the ester solvent includes: one or more of propylene glycol methyl ether acetate, dimethyl adipate, butyl acetate and ethylene glycol ethyl ether acetate.
10. The preparation method of the electromagnetic shielding glue is characterized by comprising the following steps of:
1) preparation of premix: weighing resin, a catalyst, an adhesion promoter and various auxiliaries according to the formula ratio, mixing the raw materials in a double-planet stirring device, wherein the dispersion rotation speed is 100-1000R/min, the stirring rotation speed is 10-180R/min, and the dispersion time is 5-15 min to obtain a premix;
2) preparing conductive glue: weighing powder according to a formula, mixing the powder with the premix prepared in the step 1) in a double-planet stirring device, wherein the dispersion rotation speed is 100-1200R/min, the stirring rotation speed is 10-180R/min, the dispersion time is 30-100 min, a vacuum device is started for the last 10min, the glue is defoamed, and the temperature in the whole process needs to be controlled below 30 ℃ (by adjusting the temperature of circulating water); finally obtaining the conductive glue with viscosity of 35000-60000 Cp;
3) and (3) post-treatment stage: filtering the conductive glue obtained in the step 2) through a 100-mesh 200-mesh screen to remove impurities or large particles which are not uniformly dispersed in the slurry, extruding the glue and pouring the glue into a 100ml needle tube, and storing at a low temperature of 5 ℃.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111310024.3A CN114574152A (en) | 2021-11-05 | 2021-11-05 | Electromagnetic shielding glue formula and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111310024.3A CN114574152A (en) | 2021-11-05 | 2021-11-05 | Electromagnetic shielding glue formula and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103436023A (en) * | 2013-08-31 | 2013-12-11 | 青岛承天伟业机械制造有限公司 | Novel conductive rubber |
| CN107245195A (en) * | 2017-05-31 | 2017-10-13 | 广东工业大学 | A kind of foaming type electromagnetic screen rubber and its preparation method and application |
| CN109102917A (en) * | 2018-07-03 | 2018-12-28 | 北京中科纳通电子技术有限公司 | Electromagnetic shielding conductive slurry and preparation method thereof |
| CN109438650A (en) * | 2018-10-16 | 2019-03-08 | 合肥工业大学 | A kind of high electromagnet shield effect material of high-strength light and preparation method thereof |
-
2021
- 2021-11-05 CN CN202111310024.3A patent/CN114574152A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103436023A (en) * | 2013-08-31 | 2013-12-11 | 青岛承天伟业机械制造有限公司 | Novel conductive rubber |
| CN107245195A (en) * | 2017-05-31 | 2017-10-13 | 广东工业大学 | A kind of foaming type electromagnetic screen rubber and its preparation method and application |
| CN109102917A (en) * | 2018-07-03 | 2018-12-28 | 北京中科纳通电子技术有限公司 | Electromagnetic shielding conductive slurry and preparation method thereof |
| CN109438650A (en) * | 2018-10-16 | 2019-03-08 | 合肥工业大学 | A kind of high electromagnet shield effect material of high-strength light and preparation method thereof |
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