CN114566474A - Chip packaging structure with multidirectional communication function and forming method thereof - Google Patents

Chip packaging structure with multidirectional communication function and forming method thereof Download PDF

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Publication number
CN114566474A
CN114566474A CN202210192453.3A CN202210192453A CN114566474A CN 114566474 A CN114566474 A CN 114566474A CN 202210192453 A CN202210192453 A CN 202210192453A CN 114566474 A CN114566474 A CN 114566474A
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chip
layer
metal layer
antenna
front surface
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Chinese (zh)
Inventor
陶烜
曹立强
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National Center for Advanced Packaging Co Ltd
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National Center for Advanced Packaging Co Ltd
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Priority to CN202210192453.3A priority Critical patent/CN114566474A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0233—Structure of the redistribution layers
    • H01L2224/02331—Multilayer structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02373—Layout of the redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02381—Side view

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention relates to a chip packaging structure with a multidirectional communication function, which comprises: a chip stack structure including a plurality of first chips stacked on one another, wherein the chip stack structure has a front surface, a back surface, and a plurality of side surfaces; and an antenna package structure disposed at a plurality of sides of the chip stack structure, wherein the antenna package structure is configured to receive and/or transmit signals. The invention also relates to a forming method of the chip packaging structure with the multidirectional communication function.

Description

Chip packaging structure with multidirectional communication function and forming method thereof
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a chip packaging structure with a multidirectional communication function and a forming method thereof.
Background
Ever-increasing performance, further miniaturization and ever-increasing system density are the main technical drivers for global semiconductor markets to improve and develop new chip and package technologies. 3D-IC and 2.5D TSV (through silicon Via) packaging technologies are important technologies for fabricating multilayer stack structures such as Hybrid Memory Cubes (HMCs) and High Bandwidth Memories (HBMs). As the demand for semiconductor device performance continues to increase, the internal interconnection density between each layer of interconnection structures increases significantly. In addition to design and conceptual challenges, it is also extremely important to achieve cost-effective and reliable manufacturing techniques.
At present, AiP (Antenna in Package) which is the mainstream in the industry is manufactured by performing Antenna manufacturing on the upper surface of a chip Package, mostly only the function of a directional Antenna is realized, the function of an omnidirectional Antenna which uniformly radiates 360 degrees in the horizontal direction is not realized, and a microstrip Antenna manufactured only on a plane does not fully utilize a three-dimensional structure to realize the function of the omnidirectional Antenna.
Disclosure of Invention
The invention aims to provide a chip packaging structure with a multidirectional communication function and a forming method thereof, and the chip packaging structure is arranged on the side surface of a chip stacking structure, so that the function of 360-degree uniform radiation of an omnidirectional antenna in the horizontal direction can be realized, and the method is simple and has an obvious effect.
In a first aspect of the present invention, the aforementioned task is solved by a chip package structure having a multidirectional communication function, comprising:
a chip stack structure including a plurality of first chips stacked on one another, wherein the chip stack structure has a front surface, a back surface, and a plurality of side surfaces; and
an antenna package structure disposed at a plurality of sides of the chip stack structure, wherein the antenna package structure is configured to receive and/or transmit signals.
Further, wherein:
the chip stack structure includes:
a plurality of first chips having a front surface, a side surface, and a back surface opposite the front surface;
a first metal layer on a front side of the first chip;
a second metal layer located at a side of the first chip;
a first isolation layer between the first chip and the first metal layer or the second metal layer;
a first insulating layer on a front surface of the first chip; and
a first redistribution layer within the first insulating layer and electrically connected to the first metal layer; and/or
The antenna packaging structure includes:
a second chip having a front surface, a side surface, and a back surface opposite the front surface;
a third metal layer on the front side of the second chip;
a fourth metal layer located at a side of the second chip;
a second isolation layer between the second chip and the third metal layer or the fourth metal layer;
a second insulating layer on a front surface of the second chip;
a second rewiring layer located within the second insulating layer and electrically connected to the third metal layer;
the plastic packaging layer is positioned on the back surface and the side surface of the second chip;
the conductive through hole penetrates through the plastic packaging layer and is electrically connected with the third metal layer;
and
the antenna is positioned on the surface of the plastic packaging layer and is electrically connected with the conductive through hole;
and a solder ball electrically connected to the second redistribution layer.
Further, the second metal layer is electrically connected with the first metal layer; and/or
The fourth metal layer is electrically connected to the third metal layer.
Further, the antenna packaging structure is arranged on the side face of the chip stacking structure through bonding of the solder balls and the second metal layer.
Further, the second chip is internally provided with an antenna feed network.
Further, the antenna is a microstrip antenna.
In a second aspect of the present invention, the foregoing task is solved by a method for forming a chip package structure having a multidirectional communication function, comprising:
the formation of a chip stack structure, comprising:
forming a through hole on the front surface of the wafer;
forming an isolation layer on the inner wall of the through hole and the front surface of the wafer;
filling metal in the through hole, and forming a first metal layer on the front surface of the wafer;
forming a first insulating layer on the first metal layer, and forming a first rewiring layer in the first insulating layer;
bonding a first slide glass on the front surface of the wafer;
thinning the back of the wafer to expose the through hole;
removing the first slide;
bonding a plurality of wafers to form a wafer stacking structure;
cutting the wafer stacking structure to form a chip stacking structure;
the formation of the antenna package structure includes:
providing a second chip with a second rewiring layer, wherein the second chip with the second rewiring layer comprises: a third metal layer located on the front side of the second chip; a fourth metal layer located at a side of the second chip; a second isolation layer between the second chip and the third metal layer or the fourth metal layer; a second insulating layer on the third metal layer; a second rewiring layer which is located in the second insulating layer and is electrically connected with the third metal layer, wherein part of the second rewiring layer is exposed;
bonding a second carrier on the front surface of the second chip;
carrying out plastic packaging on the back and the side of the second chip to form a plastic packaging layer;
forming a conductive through hole in the plastic packaging layer;
arranging an antenna electrically connected with the conductive through hole on the surface of the plastic packaging layer;
arranging solder balls on the second rewiring layer;
the antenna package structure is arranged at a side of the chip stack structure.
Further, when the antenna packaging structure is arranged on the side face of the chip stacking structure, the welding balls and the second metal layer are bonded by adopting vertical laser, and a vacuum clamp is adopted to assist bonding in the bonding process.
Further, at the through hole, the wafer stacking structure is cut by the invisible laser blade to form a chip stacking structure.
Further, when metal is filled in the through hole and a first metal layer is formed on the front surface of the wafer, seed deposition layers are formed on the inner wall of the through hole and the front surface of the wafer, then the metal is filled in the through hole through electroplating, and the first metal layer is formed on the front surface of the wafer.
The invention has at least the following beneficial effects: the invention provides a chip packaging structure with a multidirectional communication function and a forming method thereof, and the chip packaging structure is arranged on the side surface of a chip stacking structure, so that the function of 360-degree uniform radiation of an omnidirectional antenna in the horizontal direction can be realized, and the chip packaging structure is simple in method, obvious in effect and wide in application range.
Drawings
To further clarify the above and other advantages and features of embodiments of the present invention, a more particular description of embodiments of the invention will be rendered by reference to the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. In the drawings, the same or corresponding parts will be denoted by the same or similar reference numerals for clarity.
FIGS. 1A-1B illustrate schematic diagrams of a chip package structure with multi-directional communication capabilities according to one embodiment of the present invention;
fig. 2A shows a schematic diagram of an antenna in an antenna package structure according to an embodiment of the invention;
fig. 2B shows a schematic diagram of a feed network structure according to an embodiment of the invention;
figure 2C shows an overall expanded schematic diagram of an antenna and feed network structure according to one embodiment of the present invention;
fig. 3a is a diagram illustrating a radiation performance test result of an antenna in a chip package structure with a multi-directional communication function according to an embodiment of the present invention;
fig. 3b is a graph showing a test result of return loss characteristics of an antenna in a chip package structure having a multidirectional communication function according to an embodiment of the present invention;
FIGS. 4A-4J illustrate cross-sectional views of a chip stack structure formation process, according to one embodiment of the invention;
5A-5C illustrate cross-sectional views of an antenna package structure formation process according to one embodiment of the present invention; and
fig. 6 is a cross-sectional view illustrating bonding of a chip stack structure and an antenna package structure according to an embodiment of the present invention.
Detailed Description
It should be noted that the components in the figures may be exaggerated and not necessarily to scale for illustrative purposes. In the figures, identical or functionally identical components are provided with the same reference symbols.
In the present invention, the embodiments are only intended to illustrate the aspects of the present invention, and should not be construed as limiting.
In the present invention, the terms "a" and "an" do not exclude the presence of a plurality of elements, unless otherwise specified.
It is further noted herein that in embodiments of the present invention, only a portion of the components or assemblies may be shown for clarity and simplicity, but those of ordinary skill in the art will appreciate that, given the teachings of the present invention, required components or assemblies may be added as needed in a particular scenario.
It is also noted herein that, within the scope of the present invention, the terms "same", "equal", and the like do not mean that the two values are absolutely equal, but allow some reasonable error, that is, the terms also encompass "substantially the same", "substantially equal".
It should also be noted herein that in the description of the present invention, the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The numbering of the steps of the methods of the present invention does not limit the order of execution of the steps of the methods. Unless otherwise indicated, the method steps may be performed in a different order.
Fig. 1A-1B show schematic diagrams of a chip package structure with a multi-directional communication function according to an embodiment of the invention.
As shown in fig. 1A-1B, a chip package structure with a multi-directional communication function includes a chip stack structure and 4 antenna package structures, wherein the antenna package structures are disposed on 4 sides of the chip stack structure and electrically connected to the chip stack structure.
A chip stack structure including a plurality of first chips stacked on one another, wherein the chip stack structure has a front surface, a back surface, and a plurality of side surfaces. The chip stack structure includes:
a plurality of first chips 101 having a front surface, side surfaces, and a back surface opposite to the front surface;
a first metal layer 102 on the front side of the first chip 101;
a second metal layer 103 located on a side surface of the first chip 101 and electrically connected to the first metal layer 102;
a first isolation layer 104 located between the first chip 101 and the first metal layer 102 or the second metal layer 103 and configured to insulate the first chip 101 from the first metal layer 102 or the second metal layer 103;
a first insulating layer 105 on the front surface of the first chip 101;
and a first redistribution layer 106 located in the first insulating layer 105 and electrically connected to the first metal layer 102.
Here, there may be 3 first chip bonding stacks, and there may also be a greater or lesser number of first chip bonding stacks.
An antenna package configured to receive and/or transmit signals. The antenna packaging structure includes:
a second chip 201 having a front surface, a side surface, and a back surface opposite to the front surface;
a third metal layer 202 on the front side of the second chip 201;
a fourth metal layer 203 located on a side surface of the second chip 201 and electrically connected to the third metal layer 202;
a second isolation layer 204 located between the second chip 201 and the third metal layer 202 or the fourth metal layer 203 and configured to insulate the first chip 101 from the third metal layer 202 or the fourth metal layer 203;
a second insulating layer 205 on the front surface of the second chip 201;
a second rewiring layer 206 located within the second insulating layer 204 and electrically connected to the third metal layer 203;
a molding layer 207 located on the back surface and the side surface of the second chip 201 and configured to mold the second chip 201;
a conductive via 208 penetrating through the molding layer 207 and electrically connected to the third metal layer 202;
and the antenna 209 is positioned on the surface of the plastic packaging layer 207 and is electrically connected with the conductive through hole 208.
And solder balls 210 electrically connected to the second redistribution layer 206.
Here, the second chip has integrated therein components (not shown) such as an antenna feeding network, a microwave integrated circuit, and the like.
In one embodiment of the present invention, the antenna package structure is disposed at 4 sides of the chip stack structure by bonding the solder balls to the second metal layers of the sides of the plurality of first chips.
Fig. 2A shows a schematic diagram of an antenna in an antenna package structure according to an embodiment of the invention; fig. 2B shows a schematic diagram of a feed network structure according to an embodiment of the invention; fig. 2C shows an overall expanded schematic diagram of an antenna and feed network structure according to one embodiment of the invention.
As shown in fig. 2A, the antenna 209 in the antenna package is a microstrip antenna, and the antenna 209 has 3 radiating arms 2091. The shape of the antenna 209 can be made according to actual requirements, and can be various shapes such as rectangle, wave, ellipse, circle and the like.
As shown in fig. 2B, the feeding network structure 400 has a first feeding end 401, a second feeding end 402, a third feeding end 403, a fourth feeding end 404 and a feeding network centre 405. The feed network center 405 is connected to the first feed end 401, the second feed end 402, the third feed end 403, and the fourth feed end 404, respectively.
As shown in fig. 2C, in the chip package structure having the multidirectional communication function, the antenna 209 is electrically connected to the feeding network structure 400. The 4 antennas 209 are electrically connected to the first feeding end 401, the second feeding end 402, the third feeding end 403, and the fourth feeding end 404 of the feeding network structure 400, respectively, to form an omnidirectional conformal microstrip antenna array.
Fig. 3A is a diagram illustrating a radiation performance test result of an antenna in a chip package structure having a multi-directional communication function according to an embodiment of the present invention.
As shown in fig. 3A, the basic element antenna value of the antenna in the chip package structure with the multi-directional communication function was tested, the basic element antenna value of the center origin was-40 dB, the first circle from the inside to the outside indicated that the basic element antenna value was-30 dB, the second circle indicated that the basic element antenna value was-20 dB, the third circle indicated that the basic element antenna value was-10 dB, the fourth circle indicated that the basic element antenna value was 0dB, and the fifth circle indicated that the basic element antenna value was 10 dB. The test results of the omnidirectional conformal microstrip antenna array show that the basic element antenna values of the antenna in the chip packaging structure with the multidirectional communication function at each angle in the horizontal direction are basically the same and are about 0 dB. The test result of the antenna value of the basic oscillator shows that 360-degree uniform radiation in the horizontal direction is realized in the chip packaging structure with the multi-directional communication function, and the radiation performance in each direction is basically the same.
Fig. 3B is a graph showing a return loss characteristic test result of an antenna in a chip package structure having a multidirectional communication function according to an embodiment of the present invention.
The return loss characteristic S11 is selected as a measurement index of the performance of the antenna in the chip packaging structure with the multi-directional communication function. The return loss characteristic S11 is used to reflect the performance of the antenna, and a larger value (absolute value) indicates that the antenna itself transmits a larger signal energy, and the performance of the antenna is better. As shown in FIG. 3B, the return loss characteristics S11 of the antenna in the chip packaging structure with the multi-directional communication function at 20.71GHz-23.42GHz and 24.34GHz-42.91GHz are less than-10 dB. Here, the frequency corresponding to the return loss characteristic S11 being less than-10 dB is the frequency range in which the antenna normally operates.
Fig. 4A-4J are cross-sectional views illustrating a chip stack structure formation process according to an embodiment of the invention.
In step 1, as shown in fig. 4A, a via hole 107 is formed on the front surface of the wafer 100. A reticle 301 having mask holes is placed on the wafer 100 and then photolithography is performed to form the through holes 107.
In step 2, as shown in fig. 4B, a first isolation layer 104 is formed on the inner wall of the via hole 107 and the front surface of the wafer 100. Wherein the material of the first isolation layer 104 is an insulating material.
In step 3, as shown in fig. 4C, the via hole 107 is filled with metal, and the first metal layer 102 is formed on the front surface of the wafer 100. A seed deposition layer is formed on the inner wall of the via hole 107 and the front surface of the wafer 100, and then the via hole 107 is filled with metal by electroplating, and the first metal layer 102 is formed on the front surface of the wafer 100. Here, the metal material of the first metal layer 107 and the filling metal in the via hole 107 may be Cu, or may be other conductive metals.
In step 4, as shown in fig. 4D, a first insulating layer 105 is formed on the first metal layer 102 and a first rewiring layer 106 is formed in the first insulating layer 105. When forming the first insulating layer 105 and the first redistribution layer 106, an insulating layer is formed on the first metal layer 102, and a wiring is patterned, and then the wiring is plated, and the first insulating layer 105 and the first redistribution layer 106 are formed by repeating the above operations.
At step 5, as shown in fig. 4E, the first carrier 302 is bonded on the front side of the wafer 100 by a temporary bonding process. A first carrier sheet 302 is bonded on the first insulating layer 105 on the front side of the wafer 100.
In step 6, the backside of the wafer 100 is thinned to expose the vias 107, as shown in fig. 4F. Here, the back surface of the wafer 100 may be thinned by a chemical mechanical polishing process.
At step 7, the first slide 302 is removed, as shown in fig. 4G. The first slide 302 can be removed by heating, mechanical, chemical, laser, freezing, etc.
In step 8, as shown in fig. 4H, a plurality of wafers 100 are bonded to form a wafer stack structure. And carrying out back-to-back bonding on a plurality of wafers 100 which are subjected to the processes of the step 1 to the step 7, wherein the front surface of one wafer is bonded with the back surface of another wafer.
At step 9, the wafer stack is diced to form a chip stack, as shown in FIGS. 4I-4J. At the through hole 107, the wafer stack structure is cut by the invisible laser blade to form a chip stack structure, wherein the second metal layer 103 is left on the side of the chip stack structure.
Fig. 5A-5C are cross-sectional views illustrating an antenna package structure formation process according to one embodiment of the invention.
In step 1, as shown in fig. 5A, a second chip 201 with a second redistribution layer completed is provided, a second carrier sheet 303 is bonded to the front surface of the second chip 201, and then plastic encapsulation is performed on the back surface and the side surface of the second chip 201 to form a plastic encapsulation layer 207. The second chip 201 completing the fabrication of the second rewiring layer includes: a third metal layer 202 on the front side of the second chip 201; a fourth metal layer 203 on a side of the second chip 201; a second isolation layer 204 located between the second chip 201 and the third metal layer 202 or the fourth metal layer 203 and configured to insulate the first chip 101 from the third metal layer 202 or the fourth metal layer 203; a second insulating layer 205 on the third metal layer 202; and a second rewiring layer 206 in the second insulating layer 205 and electrically connected to the third metal layer 202, wherein a part of the second rewiring layer 206 is exposed.
In step 2, as shown in fig. 5B, a conductive via 208 is formed in the molding layer 207, and then an antenna 209 electrically connected to the conductive via 208 is disposed on the surface of the molding layer 207. When the conductive via 208 is formed, a via penetrating through the molding layer 207 is first formed by photolithography, and then the conductive via 208 is formed by plating a metal filling the via. The conductive via 208 is electrically connected to the third metal layer 202.
In step 3, as shown in fig. 5C, solder balls 210 are arranged on the second redistribution layer 206. The second redistribution layer 206 on the front surface of the second chip 201 is partially exposed, and the exposed portion may be used as a bonding pad, and solder balls 210 are disposed on the second redistribution layer 206 by a ball-mounting process.
Fig. 6 is a cross-sectional view illustrating bonding of a chip stack structure and an antenna package structure according to an embodiment of the present invention.
As shown in fig. 6, the antenna package structure is disposed at a side of the chip stack structure. The bonding of the solder balls 210 and the second metal layer 103 is performed by using a vertical laser to realize that the antenna package structure is arranged on 4 sides of the chip stack structure, and the vacuum clamp 304 is used for clamping the antenna package structure during the bonding process to assist the bonding.
The chip packaging structure with the multidirectional communication function can meet the actual requirements of a millimeter wave imaging and detecting system on miniaturization, batch and the like in the aspects of imaging and detection, and the chip packaging structure with the multidirectional communication function combines multifunctional components such as an MMIC chip, a receiving and transmitting antenna, a radio frequency circuit and the like, so that the integration level of the chip packaging structure with the multidirectional communication function and the anti-interference characteristic of the antenna are greatly improved.
In the room, the chip packaging structure with the multidirectional communication function can be applied to a life detection system or an intrusion alarm system and the like, and the chip packaging structure with the multidirectional communication function can realize different use functions in different scenes by internally integrating modules such as a vital sign detection circuit, a signal receiving and transmitting and processing module, a network connection circuit and the like, and has small volume, portability and concealment.
In cities, the chip packaging structure with the multidirectional communication function can be applied to a smart traffic system, can be effectively applied to the fields of traffic transportation and service control by combining a computer information technology, a data communication technology, a sensor technology, an electronic control technology and the like, can strengthen the relation among vehicles, roads and users, and can improve the safety degree and the scheduling efficiency of the traffic system by detecting the movement distance, the movement direction, the movement speed and the like of surrounding objects.
The invention has at least the following beneficial effects: the invention provides a chip packaging structure with a multidirectional communication function and a forming method thereof, and the antenna packaging structure is arranged on the side surface of a chip stacking structure, so that the 360-degree uniform radiation function of an omnidirectional antenna in the horizontal direction can be realized, and the method is simple, obvious in effect and wide in application range.
Although some embodiments of the present invention have been described herein, it will be understood by those skilled in the art that these embodiments are shown by way of example only. Numerous variations, substitutions and modifications will occur to those skilled in the art in light of the teachings of the present invention without departing from the scope thereof. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby.

Claims (10)

1. A chip packaging structure with a multidirectional communication function is characterized by comprising:
a chip stack structure including a plurality of first chips stacked on one another, wherein the chip stack structure has a front surface, a back surface, and a plurality of side surfaces; and
an antenna package structure disposed at a plurality of sides of the chip stack structure, wherein the antenna package structure is configured to receive and/or transmit signals.
2. The chip packaging structure with multidirectional communication function according to claim 1, wherein:
the chip stacking structure includes:
a plurality of first chips having a front surface, a side surface, and a back surface opposite the front surface;
a first metal layer located on a front side of the first chip;
a second metal layer located at a side of the first chip;
a first isolation layer between the first chip and the first metal layer or the second metal layer;
a first insulating layer on a front surface of the first chip; and
a first redistribution layer within the first insulating layer and electrically connected to the first metal layer; and/or
The antenna packaging structure includes:
a second chip having a front surface, a side surface, and a back surface opposite the front surface;
a third metal layer on the front side of the second chip;
a fourth metal layer located at a side of the second chip;
a second isolation layer between the second chip and the third metal layer or the fourth metal layer;
a second insulating layer on a front surface of the second chip;
a second rewiring layer located within the second insulating layer and electrically connected to the third metal layer;
the plastic packaging layer is positioned on the back surface and the side surface of the second chip;
the conductive through hole penetrates through the plastic packaging layer and is electrically connected with the third metal layer; and
the antenna is positioned on the surface of the plastic packaging layer and is electrically connected with the conductive through hole;
and a solder ball electrically connected to the second redistribution layer.
3. The chip package structure with multidirectional communication function as in claim 2, wherein the second metal layer is electrically connected to the first metal layer; and/or
The fourth metal layer is electrically connected to the third metal layer.
4. The chip package structure with multidirectional communication function as in claim 2, wherein the antenna package structure is disposed on a side surface of the chip stack structure by bonding the solder balls to the second metal layer.
5. The chip packaging structure with the multidirectional communication function according to claim 2, wherein an antenna feed network is arranged inside the second chip.
6. The chip package structure with multidirectional communication function of claim 2, wherein the antenna is a microstrip antenna.
7. A method for forming a chip packaging structure with a multidirectional communication function is characterized by comprising the following steps:
the formation of a chip stack structure, comprising:
forming a through hole on the front surface of the wafer;
forming an isolation layer on the inner wall of the through hole and the front surface of the wafer;
filling metal in the through hole, and forming a first metal layer on the front surface of the wafer;
forming a first insulating layer on the first metal layer, and forming a first rewiring layer in the first insulating layer;
bonding a first slide glass on the front surface of the wafer;
thinning the back of the wafer to expose the through hole;
removing the first slide;
bonding a plurality of wafers to form a wafer stacking structure;
cutting the wafer stacking structure to form a chip stacking structure;
the formation of the antenna package structure includes:
providing a second chip with a second rewiring layer, wherein the second chip with the second rewiring layer comprises: a third metal layer located on the front side of the second chip; a fourth metal layer located at a side of the second chip; a second isolation layer between the second chip and the third metal layer or the fourth metal layer; a second insulating layer on the third metal layer; a second rewiring layer which is located in the second insulating layer and is electrically connected with the third metal layer, wherein part of the second rewiring layer is exposed;
bonding a second carrier on the front surface of the second chip;
carrying out plastic package on the back and the side of the second chip to form a plastic package layer;
forming a conductive through hole in the plastic packaging layer;
arranging an antenna electrically connected with the conductive through hole on the surface of the plastic packaging layer;
disposing solder balls on the second rewiring layer;
the antenna package structure is arranged at a side of the chip stack structure.
8. The method as claimed in claim 7, wherein when the antenna package structure is disposed on the side of the chip stack structure, the bonding of the solder balls to the second metal layer is performed by using a vertical laser, and a vacuum chuck is used to assist the bonding during the bonding.
9. The method as claimed in claim 7, wherein the chip stacking structure is formed by cutting the wafer stacking structure with a stealth laser blade at the through hole.
10. The method as claimed in claim 7, wherein the through hole is filled with metal, and when the first metal layer is formed on the front surface of the wafer, the seed deposition layer is formed on the inner wall of the through hole and the front surface of the wafer, and then the through hole is filled with metal by electroplating, and the first metal layer is formed on the front surface of the wafer.
CN202210192453.3A 2022-02-28 2022-02-28 Chip packaging structure with multidirectional communication function and forming method thereof Pending CN114566474A (en)

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CN202210192453.3A CN114566474A (en) 2022-02-28 2022-02-28 Chip packaging structure with multidirectional communication function and forming method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210192453.3A CN114566474A (en) 2022-02-28 2022-02-28 Chip packaging structure with multidirectional communication function and forming method thereof

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