CN114558746A - Dispensing device for chip packaging - Google Patents
Dispensing device for chip packaging Download PDFInfo
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- CN114558746A CN114558746A CN202210186500.3A CN202210186500A CN114558746A CN 114558746 A CN114558746 A CN 114558746A CN 202210186500 A CN202210186500 A CN 202210186500A CN 114558746 A CN114558746 A CN 114558746A
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- Prior art keywords
- control
- platform
- glue
- ring
- dispensing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention provides a dispensing device for chip packaging, which comprises a processing platform, wherein the upper end of the processing platform is connected with a clamping platform for placing an electric control plate in a sliding manner, the upper end of the clamping platform is provided with a clamping mechanism for fixing the electric control plate, the upper end of the processing platform is provided with a control platform positioned above the clamping platform, a preset gap is formed between the control platform and the clamping platform, the upper end of the control platform is provided with a control opening, the dispensing device also comprises a dispensing tube, the dispensing tube is positioned in the control opening and can move up and down, the dispensing tube is divided into a glue inlet end and a glue outlet end according to the vertical height, the glue inlet end and the glue outlet end are respectively positioned at two sides of the control platform, the glue outlet end is positioned at one side close to the clamping platform, and the glue inlet end is communicated with a glue input tube. The invention solves the problem that the tail part of the glue forms a long strip to influence the packaging effect in the packaging process of the chip.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a dispensing device for chip packaging.
Background
The electronic control board is provided with a plurality of electronic components for achieving the purpose of sending instructions by the control circuit, the integrated chip is one of the important electronic components on the electronic control board, and in the final step of processing the electronic control board, the chip needs to be coated and packaged by glue, so that the chip is fixed, and part of the glue can also play a role in heat dissipation for the chip.
Due to the highly integrated development of the electric control board, part of chips are installed in a plurality of other electronic components, glue needs to be conveyed through the slender glue dispensing pipe, the glue dispensing pipe moves up and down and controls the outflow of tail glue through the control point glue pipe, the chip packaging and gluing process is achieved, wherein the glue belongs to fluid with high viscosity, in the process that the glue dispensing pipe moves upwards after flowing out of the glue, the tail glue can be acted by force, a long tail strip or a long thread-shaped structure is formed, the gluing packaging process of a single chip is influenced, the lengthened threads are adhered to other parts of other electric control boards, and the electric control board body and the subsequent processing of other electric control boards are influenced.
Disclosure of Invention
Aiming at the problems, the invention provides a glue dispensing device for chip packaging, which solves the problem that the tail part of glue forms a long strip to influence the packaging effect in the packaging process of a chip.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
a dispensing device for chip packaging comprises a processing platform, wherein the upper end of the processing platform is connected with a clamping platform for placing an electric control board in a sliding manner, a clamping mechanism for fixing the electric control board is arranged at the upper end of the clamping platform, a control platform positioned above the clamping platform is mounted at the upper end of the processing platform, a preset gap is formed between the control platform and the clamping platform, a control opening is formed in the upper end of the control platform, the dispensing device further comprises a dispensing tube, the dispensing tube is positioned in the control opening and can move up and down, the dispensing tube is divided into a glue inlet end and a glue outlet end according to the vertical height, the glue inlet end and the glue outlet end are respectively positioned on two sides of the control platform, the glue outlet end is positioned on one side close to the clamping platform, the glue inlet end is communicated with a glue inlet pipe, a snake-shaped control groove is formed in the surface of the dispensing tube, and a control block is fixedly connected in the control opening, the control block is located the control flume and cooperates with it, the inner wall fixedly connected with that some rubber tubes are located play gluey end one side keeps off the ring, be equipped with in some rubber tubes and be located the inboard ball sealer of fender ring, the intraductal operating mechanism who is equipped with control ball sealer position that some rubber tubes, through setting up the on-state that the operating mechanism controlled play gluey end one side glue, through control some rubber tubes rotation, add the fracture of some rubber tube end glue, avoid the rubber coating process to produce filiform afterbody, guarantee the rubber coating process and normally go on.
Preferably, the opening and closing mechanism comprises a first control ring, the first control ring is located below the control platform and sleeved outside the dispensing tube, a second control ring is connected in the dispensing tube in a sliding mode and fixedly connected with the sealing ball through a control rod, a magnetic block is embedded in the first control ring, and the first control ring and the second control ring are attracted magnetically.
Preferably, the inner wall of the dispensing tube is fixedly connected with a supporting protrusion located on the inner side of the sealing ball, the supporting protrusion is elastically connected with the sealing ball through an elastic piece, the sealing effect of the sealing ball can be enhanced and the closing speed of the sealing ball can be increased through the elastic piece, and the gluing process is guaranteed.
Preferably, the side wall of the first control ring is fixedly connected with an adjusting protrusion, the lower end of the control platform is rotatably connected with an adjusting rod, the adjusting rod penetrates through the adjusting protrusion and is in threaded connection with the adjusting protrusion, the position of the first control ring can be adjusted by arranging the parts, and adaptation to different processing conditions is achieved.
Preferably, the inner side wall of the baffle ring is provided with an annular air outlet, the upper end of the control platform is provided with an air outlet mechanism, and air with pressure is blown out through the air outlet mechanism to impact the tail end of the glue, so that the tail end of the glue is broken and separated, and the phenomenon that the gluing process is affected due to the overlong tail generated in the stretching process of the glue is avoided.
Preferably, the mechanism of giving vent to anger is including being located the control platform top and the cover locates the inflator outside the gluey pipe of point, it has annular chamber of calming anger to open in the inflator, the indoor sealed sliding connection of chamber of calming anger has annular piston, annular piston lateral wall fixedly connected with extrusion pipe, the extrusion pipe end run through the chamber of calming anger and with control platform lateral wall fixed connection, the chamber intercommunication of calming anger has two breather pipes, two all be equipped with the check valve in the breather pipe, first breather pipe end and annular gas outlet intercommunication, first be equipped with the magnetic control valve in the breather pipe, the magnetic control valve cooperatees with the intra-annular magnetic path of first control, through setting up the gaseous outflow of above-mentioned part automatic control, accomplishes the impact to terminal glue, makes its rapid fracture.
Preferably, the control platform is fixedly connected with an electric telescopic rod, the side wall of the inflator is fixedly connected with a driving bulge, and the telescopic tail end of the electric telescopic rod is fixedly connected with the side wall of the driving bulge.
Preferably, the clamping mechanism comprises two L-shaped limiting blocks fixed at the upper end of the clamping platform, the upper end of the clamping platform is rotatably connected with a cam, the cam is located on one side of the two L-shaped limiting blocks, the outer side of the electric control plate is tightly supported by rotating the cam, and limiting and fixing of the electric control plate are completed.
Preferably, the control platform is fixed on the upper surface of the processing platform through a telescopic device with adjustable height, and the height of the control platform, the dispensing tube and other parts is controlled by adjusting according to the actual processing condition.
The invention has the beneficial effects that:
1. through setting up parts such as control groove, control block, synchronous revolution in the middle of the process that the control point rubber tube reciprocated, the cracked speed of glue can be accelerated to the rotatory ability of play gluey end one side, avoids it to be stretched and forms long banding afterbody, has guaranteed the effect of encapsulation and has avoided the production of impurity.
2. Through setting up parts such as ball sealer, control lever, first control ring, second control ring, can realize the control to the ball sealer through the cooperation of first control ring and second control ring, and then the terminal opening and close of control point rubber tube, realize automatic rubber coating process.
3. Through setting up the inflator, the extrusion pipe, parts such as annular gas outlet, promote the inflator from the process of up moving down when electric telescopic handle, because annular piston position relatively fixed, the space in the plenum chamber dwindles gradually, and the electric control valve in the first breather pipe is opened under the effect of magnetic force, the gas that has pressure can be blown off from annular gas outlet one end, the completion is to the impact of a gluey end one end glue, the fracture of glue has further been accelerated, further guaranteed effectively going on of packaging process.
Drawings
FIG. 1 is a schematic perspective view of a first side of the present invention;
FIG. 2 is a schematic perspective view of a second side of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic side view of the present invention;
FIG. 5 is a schematic front view of the present invention;
FIG. 6 is a schematic view of the inner structure of the dispensing tube according to the present invention;
fig. 7 is a schematic view of the internal structure of the air cylinder of the present invention.
In the figure: 1. a processing platform; 2. clamping the platform; 201. a limiting block; 202. a cam; 3. a control platform; 301. a telescoping device; 302. a control port; 4. dispensing a rubber tube; 401. a glue inlet end; 402. a glue outlet end; 403. a control slot; 404. an annular air outlet; 405. a baffle ring; 5. a first control loop; 501. an adjusting projection; 502. adjusting a rod; 6. an air pressing cylinder; 601. a drive boss; 602. extruding the tube; 603. an annular piston; 604. a breather pipe; 605. a plenum chamber; 7. an electric control board; 8. a glue input pipe; 9. a sealing ball; 901. an elastic member; 902. a control lever.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
Referring to fig. 1-7, a dispensing device for chip packaging, including processing platform 1, processing platform 1 upper end sliding connection has a clamping platform 2 that is used for placing automatically controlled board 7, clamping platform 2 upper end is equipped with the clamping machine structure that is used for fixed automatically controlled board 7, clamping machine constructs including being fixed in two L type stoppers 201 of clamping platform 2 upper end, clamping platform 2 upper end rotates and is connected with cam 202, cam 202 is located two L type stoppers 201 one side, adjust the distance between two stoppers 201 according to the size of automatically controlled board 7, let it and the adaptation of automatically controlled board 7 size, set up the elasticity protection pad in the protruding one side of cam 202, realize supporting tightly in the outside of automatically controlled board 7 through rotating cam 202, accomplish the spacing fixed to automatically controlled board 7.
The control platform 3 that is located clamping platform 2 top is installed to processing platform 1 upper end, but control platform 3 is fixed in processing platform 1 upper surface through height-adjusting's telescoping device 301, but the threaded rod of telescoping device 301 option, the mode of bolt is adjusted, carry out spacing fixed to control platform 3 through upper and lower two bolts, can let control platform 3 be in the position of relative stability, and can adjust according to the processing condition of reality, predetermined clearance has between control platform 3 and the clamping platform 2, control platform 3 upper end is opened has control mouth 302, adhesive deposite device still includes some rubber tubes 4, some rubber tubes 4 are located control mouth 302 and can reciprocate, when automatically controlled board 7 is located predetermined position, it is located the below of some rubber tubes 4, some rubber tubes 4 move down and arrive predetermined position outflow glue, accomplish the rubber coating packaging process.
Glue dispensing pipe 4 is divided into according to vertical height and goes into gluey end 401 and go out gluey end 402, goes into gluey end 401 and goes out gluey end 402 and is located 3 both sides of control platform respectively, goes out gluey end 402 and is located and is close to clamping platform 2 one side, goes into gluey end 401 intercommunication and has glue input tube 8, the external glue conveyor of glue input tube 8, glue conveyor applys pressure and carries glue to a gluey end 402 one end of going out through glue input tube 8, accomplishes the full-filling of glue.
The surface of the dispensing tube 4 is provided with a snake-shaped control groove 403, a control block is fixedly connected in the control opening 302, the control block is positioned in the control groove 403 and matched with the control groove, the inner wall of the dispensing tube 4 positioned at one side of the glue outlet end 402 is fixedly connected with a retaining ring 405, a sealing ball 9 positioned at the inner side of the retaining ring 405 is arranged in the dispensing tube 4, an opening and closing mechanism for controlling the position of the sealing ball 9 is arranged in the dispensing tube 4, the gap between the sealing ball 9 and the retaining ring 405 is further controlled by controlling the position of the sealing ball 9, the outflow of glue is controlled, the glue can flow out through the gap between the sealing ball 9 and the retaining ring 405 when the sealing ball 9 leaves the retaining ring 405, the glue is coated, the flow of the glue is blocked after the sealing ball 9 abuts against the middle position of the retaining ring 405, the sealing ball 9 plays a role of a valve, in the process that the dispensing tube 4 moves upwards, the dispensing tube 4 rotates under the matching of the control groove 403 and the control block, at the moment, the retaining ring 405 can exert a force on the residual glue in the rotating process, the speed of breaking is accelerated, and the phenomenon that long tail generated in the pulling process of glue affects the filling of the glue and the packaging of the chip is avoided.
The opening and closing mechanism comprises a first control ring 5, the first control ring 5 is positioned below the control platform 3 and sleeved outside the dispensing tube 4, a second control ring is connected in the dispensing tube 4 in a sliding manner and fixedly connected with the sealing ball 9 through a control rod 902, a magnetic block is embedded in the first control ring 5, the first control ring 5 and the second control ring are magnetically attracted, the dispensing tube 4 is divided into a first working area and a second working area according to the position, the first working area is positioned above the second working area, the dispensing tube 4 moves towards the second working area from the first working area in the gluing process, in the process, the second control ring in the dispensing tube 4 moves towards the first control ring 5, and finally under the first control ring 5, at this moment under the effect of the attraction force, the second control ring moves the sealing ball 9 upward, the sealing ball 9 breaks away from the retainer ring 405; when the second control ring is located above the first control ring 5, the first control ring 5 attracts the second control ring and the sealing ball 9, the second control ring and the sealing ball 9 tend to move downwards, one end of the glue outlet end 402 is sealed at the moment, glue cannot flow out, after the glue outlet end 402 is located at the gluing position at the upper end of the electric control plate 7, the second control ring is located below the first control ring 5, the first control ring 5 also attracts the second control ring at the moment, under the action of attraction, the second control ring drives the sealing ball 9 to move upwards, the sealing ball 9 is opened, the glue flows out, and in the process that the control point rubber tube 4 moves vertically, automatic glue outflow control is completed.
5 lateral wall fixedly connected with of first control ring adjusts arch 501, and 3 lower extremes of control platform rotate to be connected with and adjust pole 502, adjusts pole 502 and runs through and adjust arch 501 and threaded connection with it, can should change through rotatory regulation pole 502 and adjust the position about protruding 501, and then adjust the position of first control ring 5, can adjust according to the automatically controlled board 7 of difference, and then the condition that the end 402 one end of controlling is opened and close, the completion is to the control of glue.
The inner wall of the dispensing tube 4 is fixedly connected with a supporting protrusion located on the inner side of the sealing ball 9, the supporting protrusion is elastically connected with the sealing ball 9 through an elastic piece 901, the elastic piece 901 is arranged to play a role in supporting tightly the sealing ball 9, the sealing ball 9 tends to move towards the direction of the baffle ring 405, the sealing ball 9 can be closed more tightly in a sealing mode, the closing speed is higher, and excessive glue is avoided.
The inner side wall of the baffle ring 405 is provided with an annular gas outlet 404, the upper end of the control platform 3 is provided with a gas outlet mechanism, gas with pressure can be blown out through the annular gas outlet 404 by the gas outlet mechanism, the blown gas can impact residual glue on one side of the baffle ring 405, the fracture removal rate is further accelerated, and the normal operation of gluing is ensured, the gas outlet mechanism comprises a gas pressing cylinder 6 which is positioned above the control platform 3 and sleeved outside the glue dispensing pipe 4, an annular gas pressing chamber 605 is arranged in the gas pressing cylinder 6, an annular piston 603 is connected in the gas pressing chamber 605 in a sealing and sliding manner, the side wall of the annular piston 603 is fixedly connected with an extrusion pipe 602, the tail end of the extrusion pipe 602 penetrates through the gas pressing chamber 605 and is fixedly connected with the side wall of the control platform 3, the gas pressing chamber 605 is communicated with two vent pipes 604, the two vent pipes 604 are both provided with a one-way valve, and the tail end of the first vent pipe 604 is communicated with the annular gas outlet 404, the magnetic control valve is arranged in the first vent pipe 604 and matched with the magnetic block in the first control ring 5, the magnetic control valve is in the prior art and can be in a conducting state under the action of magnetic force, when the dispensing tube 4 and the air pressing cylinder 6 move from top to bottom, the positions of the extrusion tube 602 and the annular piston 603 are relatively unchanged, the space of the air pressing chamber 605 is gradually increased in the process, external air is sucked into the air pressing chamber 605 through the second vent pipe 604, when the dispensing tube 4 moves to a second working interval, the magnetic control valve is in the conducting state under the action of the magnetic block in the first control ring 5, when the dispensing tube 4 moves from bottom to top, the air in the air pressing chamber 605 is finally blown out from the annular air outlet 404 through the first vent pipe 604 at the moment, the impact of the air on glue is completed, and the normal gluing is finally ensured.
The control platform 3 is fixedly connected with an electric telescopic rod, the side wall of the air pressing cylinder 6 is fixedly connected with a driving bulge 601, the telescopic tail end of the electric telescopic rod is fixedly connected with the side wall of the driving bulge 601, the electric telescopic rod is externally connected with a control circuit, the dispensing tube 4 and the air pressing cylinder 6 are controlled to regularly move up and down according to the state conveyed by the electric control plate 7, and finally the automatic gluing process is completed.
In the invention, when the chip on the electric control plate 7 needs to be subjected to dispensing packaging and fixing, the electric control plate 7 is placed at a preset position at the upper end of the clamping platform 2, the electric control plate 7 is limited and fixed by the clamping mechanism, and the clamping platform 2 can drive the electric control plate 7 to synchronously move to the lower end of the control platform 3 in the moving process, so that the preparation stage of dispensing packaging is realized.
After the electric control plate 7 moves to a preset position of the lower end of the glue outlet end 402, the electric telescopic rod is contracted to drive the air pressing cylinder 6 to descend through the driving protrusion 601, the air pressing cylinder 6 descends synchronously when the driving dispensing tube 4 descends, and one end of the glue outlet end 402 moves towards the preset position of the electric control plate 7.
When the glue outlet end 402 moves to a predetermined position, the second control ring is located below the first control ring 5, at this time, under the action of the first control ring 5 and the second control ring, the sealing ball 9 overcomes the elastic force of the elastic member 901 and is far away from the baffle ring 405, the glue input pipe 8 is externally connected with a glue conveying device, the glue with pressure flows out through the gap between the sealing ball 9 and the baffle ring 405, and the glue covers the predetermined position on the electric control plate 7 to finally complete the encapsulation and fixation.
After the encapsulation is finished, the air pressing cylinder 6 and the dispensing tube 4 are controlled by the electric telescopic rod to move upwards from bottom to top, the dispensing tube 4 is in the middle of the moving process, under the matching of the control block and the control groove 403, the dispensing tube 4 rotates directionally, and when the second control ring in the dispensing tube 4 moves upwards and is located above the first control ring 5, at the moment, the first control ring 5 generates downward attraction force on the second control ring, and under the action of the elastic piece 901, the sealing ball 9 is matched with the baffle ring 405 to seal one end of the dispensing end 402, glue in the dispensing tube 4 cannot flow out, the dispensing tube 4 synchronously rotates in the middle of the moving process, so that the glue on one side of the baffle ring 405 can be separated from the baffle ring 405 more quickly, the phenomenon that the glue is elongated under the action of force and the encapsulation effect is influenced is avoided.
And in the process that the air pressing cylinder 6 moves upwards, the position of the annular piston 603 is kept unchanged under the action of the extrusion pipe 602, at the moment, the space in the air pressing chamber 605 is smaller, the air pressure is increased, when the first air pipe 604 passes through the magnetic valve in the first control ring 5 and is opened under the action of the magnetic block, at the moment, the pressure air in the air pressing chamber 605 is finally blown out from the annular air outlet 404 through the first air pipe 604, the last part of the adhered glue can be impacted, the glue is broken, the glue is prevented from forming a longer ribbon at last, and the gluing and packaging process of the chip is prevented from being influenced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is intended to cover any modifications, equivalents, improvements, etc. within the spirit and scope of the present invention.
Claims (9)
1. The utility model provides a dispensing device for chip package, includes processing platform (1), processing platform (1) upper end sliding connection has clamping platform (2) that are used for placing automatically controlled board (7), clamping platform (2) upper end is equipped with the clamping machine structure that is used for fixed automatically controlled board (7), its characterized in that:
the glue dispensing device comprises a processing platform (1), a control platform (3) located above a clamping platform (2) is installed at the upper end of the processing platform (1), a preset gap is formed between the control platform (3) and the clamping platform (2), a control opening (302) is formed in the upper end of the control platform (3), the glue dispensing device further comprises a glue dispensing pipe (4), the glue dispensing pipe (4) is located in the control opening (302) and can move up and down, the glue dispensing pipe (4) is divided into a glue inlet end (401) and a glue outlet end (402) according to the vertical height, the glue inlet end (401) and the glue outlet end (402) are respectively located on two sides of the control platform (3), the glue outlet end (402) is located on one side close to the clamping platform (2), and the glue inlet end (401) is communicated with a glue input pipe (8);
a snake-shaped control groove (403) is formed in the surface of the glue dispensing pipe (4), a control block is fixedly connected into the control opening (302), and the control block is positioned in the control groove (403) and matched with the control groove;
inner wall fixedly connected with that some rubber tube (4) are located out and glue end (402) one side keeps off ring (405), be equipped with in some rubber tube (4) and be located the sealed ball (9) that keep off ring (405) inboard, be equipped with the starting and stopping mechanism of control sealed ball (9) position in some rubber tube (4).
2. The dispensing device for chip packaging as claimed in claim 1, wherein the opening and closing mechanism comprises a first control ring (5), the first control ring (5) is located below the control platform (3) and sleeved outside the dispensing tube (4), a second control ring is slidably connected in the dispensing tube (4), the second control ring is fixedly connected with the sealing ball (9) through a control rod (902), a magnetic block is embedded in the first control ring (5), and the first control ring (5) and the second control ring are magnetically attracted.
3. The dispensing device for chip packaging according to claim 2, wherein the inner wall of the dispensing tube (4) is fixedly connected with a pressing protrusion located at the inner side of the sealing ball (9), and the pressing protrusion and the sealing ball (9) are elastically connected through an elastic member (901).
4. The dispensing device for chip packaging according to claim 2, wherein an adjusting protrusion (501) is fixedly connected to a side wall of the first control ring (5), an adjusting rod (502) is rotatably connected to a lower end of the control platform (3), and the adjusting rod (502) penetrates through the adjusting protrusion (501) and is in threaded connection therewith.
5. The dispensing device for chip packaging according to claim 1, wherein the inner sidewall of the baffle ring (405) is provided with an annular air outlet (404), and an air outlet mechanism is disposed at the upper end of the control platform (3).
6. The dispensing device for chip packaging according to claim 1, wherein the air outlet mechanism comprises an air pressing cylinder (6) located above the control platform (3) and sleeved outside the dispensing tube (4), an annular air pressing chamber (605) is opened in the air pressing cylinder (6), an annular piston (603) is hermetically and slidably connected in the air pressing chamber (605), a pressing tube (602) is fixedly connected to a side wall of the annular piston (603), the tail end of the pressing tube (602) penetrates through the air pressing chamber (605) and is fixedly connected to a side wall of the control platform (3), the air pressing chamber (605) is communicated with two air vent tubes (604), one-way valves are arranged in the two air vent tubes (604), the tail end of the first air vent tube (604) is communicated with the annular air outlet (404), and a magnetic control valve is arranged in the first air vent tube (604), the magnetic control valve is matched with the magnetic block in the first control ring (5).
7. The dispensing device for chip packaging according to claim 6, wherein an electric telescopic rod is fixedly connected to the control platform (3), a driving protrusion (601) is fixedly connected to a side wall of the air pressing cylinder (6), and a telescopic end of the electric telescopic rod is fixedly connected to a side wall of the driving protrusion (601).
8. The dispensing device for chip packaging according to claim 1, wherein the clamping mechanism comprises two L-shaped limiting blocks (201) fixed on the upper end of the clamping platform (2), a cam (202) is rotatably connected to the upper end of the clamping platform (2), and the cam (202) is located on one side of the two L-shaped limiting blocks (201).
9. The dispensing device for chip packaging according to claim 1, wherein the control platform (3) is fixed on the upper surface of the processing platform (1) through a height-adjustable telescopic device (301).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210186500.3A CN114558746A (en) | 2022-02-28 | 2022-02-28 | Dispensing device for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210186500.3A CN114558746A (en) | 2022-02-28 | 2022-02-28 | Dispensing device for chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114558746A true CN114558746A (en) | 2022-05-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210186500.3A Pending CN114558746A (en) | 2022-02-28 | 2022-02-28 | Dispensing device for chip packaging |
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| CN (1) | CN114558746A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116487510A (en) * | 2023-06-20 | 2023-07-25 | 珠海市宏科光电子有限公司 | COB light source packaging hardware with gas tightness detects function |
-
2022
- 2022-02-28 CN CN202210186500.3A patent/CN114558746A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116487510A (en) * | 2023-06-20 | 2023-07-25 | 珠海市宏科光电子有限公司 | COB light source packaging hardware with gas tightness detects function |
| CN116487510B (en) * | 2023-06-20 | 2023-10-27 | 珠海市宏科光电子有限公司 | COB light source packaging hardware with gas tightness detects function |
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