CN114552376A - High-temperature protection laser driving system based on bidirectional digital communication - Google Patents
High-temperature protection laser driving system based on bidirectional digital communication Download PDFInfo
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- CN114552376A CN114552376A CN202210273273.8A CN202210273273A CN114552376A CN 114552376 A CN114552376 A CN 114552376A CN 202210273273 A CN202210273273 A CN 202210273273A CN 114552376 A CN114552376 A CN 114552376A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
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- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a high-temperature protection laser driving system based on bidirectional digital communication. Including image sensor, distance sensor, temperature sensor, radiator fan, laser drive circuit, microprocessor is connected with image sensor, distance sensor, temperature sensor through I2C voltage conversion circuit respectively, switches on and is connected with radiator fan through fan control circuit with the laser drive circuit line. According to the invention, corresponding parameters are detected by a plurality of sensors in real time, the use of laser equipment for intelligent operation scheduling of the laser module is met, the power of the heat dissipation fan can be automatically controlled by combining the temperature sensor, and the overhigh working temperature of the laser module can be effectively prevented; meanwhile, the I2C voltage conversion circuit is used for bidirectional digital communication transmission, so that data transmission among the sensors is more stable, and the information reliability is ensured.
Description
Technical Field
The invention relates to the technical field of laser equipment, in particular to a high-temperature protection laser driving system based on bidirectional digital communication.
Background
As is well known, laser devices are mechanical devices that rely on a laser beam to process a product. For the specific operation of the laser device, the operation of the laser device is often controlled by a driving system inside the digital laser driver. The laser can control and output 20W and 40W electric power, drive the laser to emit 20Khz frequency brilliance laser, and switch the laser according to the instruction given by the driving system at any time, thus achieving the function of automatically regulating and controlling the laser to work.
At present, the actuating system of current laser equipment only drives laser instrument or laser unit and normally works, and if the holistic intelligent work of laser equipment is promoted, just can need carry out real-time detection to each item work of laser module department, and surveyed all kinds of sensors that just can utilize, but apart from further again between laser module and the host computer, the signal transmission wire rod is longer, causes voltage loss and electric noise interference easily, and then brings a great deal of inconvenience to data transmission.
Disclosure of Invention
In view of the above-mentioned shortcomings in the prior art, the present invention provides a high temperature protection laser driving system based on bidirectional digital communication.
In order to achieve the purpose, the invention adopts the following technical scheme:
a high-temperature protection laser driving system based on bidirectional digital communication comprises:
the image sensors are at least one in number, are mechanically arranged on a laser module of the laser equipment, and are used for detecting the area, the detection direction of which is over against the laser module, for carrying out laser work, and acquiring the area picture in real time;
the distance sensors are at least one in number, are mechanically arranged on a laser module of the laser equipment, and are used for detecting the distance between the distance sensors and the area, wherein the detection direction of the distance sensors is over against the area where the laser module works;
the temperature sensors are at least one in number, are mechanically arranged on a laser module of the laser equipment, and a detection head of each temperature sensor is attached to the laser module and detects the temperature state of the laser module in real time;
the number of the heat dissipation fans is at least one, the heat dissipation fans are mechanically arranged on the laser module and blow air to the heat dissipation fins of the laser module;
the laser driving circuit is communicated with a laser generator circuit in the laser module and controls the power output of the laser generator so as to achieve the working control of the laser generator;
and the microprocessor is a central data control unit and is respectively connected with the image sensor, the distance sensor and the temperature sensor through an I2C voltage conversion circuit, is communicated with the laser driving circuit and is connected with the cooling fan through a fan control circuit.
Preferably, the I2C voltage converting circuit includes a first MOS transistor and a second MOS transistor, a source of the first MOS transistor is connected to the microprocessor and is connected to the power supply through a first resistor, a gate of the first MOS transistor is connected to the power supply identical to the first resistor, a drain of the first MOS transistor is connected to the power supply through a second resistor, a voltage of the power supply connected to the first resistor is lower than a voltage of the power supply connected to the second resistor, a source of the second MOS transistor is connected to the microprocessor and is connected to the power supply through a third resistor, a gate of the second MOS transistor is connected to the power supply identical to the third resistor, a drain of the second MOS transistor is connected to the power supply through a fourth resistor, and a voltage of the power supply connected to the third resistor is lower than a voltage of the power supply connected to the fourth resistor.
Preferably, the laser driving circuit includes driver chip and third MOS pipe, driver chip's DIM end foot is connected with microprocessor, driver chip's VIN end foot inserts the power and through first electric capacity ground connection, driver chip's CSN end foot inserts the power through fifth resistance and connects laser generator's positive pole through first inductance, driver chip's DRV end foot is connected with the grid of third MOS pipe, the drain electrode of third MOS pipe is connected with laser generator's negative pole, driver chip's VIN end foot still is connected with laser generator's negative pole through first diode, and power, anodal connection laser generator are connected to its negative pole of first diode, first diode has the second diode in parallel.
Preferably, the fan control circuit includes a fourth MOS transistor and a third diode, a gate of the fourth MOS transistor is connected to the microprocessor and grounded through an eleventh resistor, a drain of the fourth MOS transistor is connected to the cooling fan and an anode of the third diode, a source of the fourth MOS transistor is grounded, and a cathode of the third diode is connected to a power supply.
By adopting the scheme, the invention depends on a plurality of sensors to detect corresponding parameters in real time, meets the requirement of laser equipment on intelligent operation and scheduling of the laser module, can automatically control the power of the heat dissipation fan by combining the temperature sensor, and can effectively prevent the working temperature of the laser module from being overhigh; meanwhile, the I2C voltage conversion circuit is used for bidirectional digital communication transmission, so that data transmission among the sensors is more stable, and the information reliability is ensured.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic circuit diagram of an I2C voltage converting circuit according to an embodiment of the present invention.
Fig. 3 is a schematic circuit diagram of a laser driving circuit according to an embodiment of the present invention.
Fig. 4 is a schematic circuit diagram of a fan control circuit according to an embodiment of the invention.
FIG. 5 is a schematic diagram of a distance sensor peripheral circuit of an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1 to fig. 5, the high temperature protection laser driving system based on bidirectional digital communication according to the present embodiment includes:
the image sensor 1 is at least one in number, is mechanically arranged on a laser module of the laser equipment, and is used for detecting an area with the direction opposite to the laser module for laser work and acquiring a picture of the area in real time;
the distance sensors 2 are at least one in number, are mechanically arranged on a laser module of the laser equipment, are opposite to the working area of the laser module in the detection direction, and detect the distance between the distance sensors and the working area in real time;
the temperature sensors 4 are at least one in number, are mechanically arranged on a laser module of the laser equipment, and are adhered with detection heads thereof to the laser module and detect the temperature state of the laser module in real time;
the number of the heat radiation fans 7 is at least one, the heat radiation fans are mechanically arranged on the laser module and blow air to the heat radiation fins of the laser module;
the laser driving circuit 8 is communicated with a laser generator circuit in the laser module and controls the power output of the laser generator so as to control the work of the laser generator;
the microprocessor 3, which is a central data control unit, may adopt a STM32G031G8 processor, and is connected to the image sensor 1, the distance sensor 2, and the temperature sensor 4 through an I2C voltage conversion circuit 5, respectively, and is connected to the laser driving circuit 8 through a line and connected to the cooling fan 7 through a fan control circuit 6.
According to the invention, the corresponding parameters are detected by the plurality of sensors in real time, the intelligent operation scheduling of the laser module by the laser equipment is satisfied, the power of the heat dissipation fan 7 can be automatically controlled by combining the temperature sensor 4, and the overhigh working temperature of the laser module can be effectively prevented; meanwhile, the I2C voltage conversion circuit 5 is used for bidirectional digital communication transmission, so that data transmission among various sensors is more stable, and the reliability of information is ensured.
The concrete during operation:
the image sensor 1 can adopt a thermal infrared camera or a high-definition camera, the image sensor 1 can detect a real-time picture at a processing station in real time, and corresponding intelligent processing can be performed subsequently through picture information, such as regulation and calibration of a laser cutting track, and whether movement blockage exists or a technician mistakenly enters the processing station or not;
the distance sensor 2 can adopt an ultrasonic distance sensor or a laser distance measuring sensor, and the like, and particularly can adopt a V16180X distance measuring sensor of ST, the distance sensor 2 detects the distance from the processing station surface to the distance sensor, and then the distance from the laser head to the processing station is calculated, so that the subsequent adjustment of the focal length of the laser head can be facilitated, and the requirement of carrying out corresponding laser processing on different concave-convex surfaces can be met;
Further, in the usage environment of the digital laser, generally, the distance from the upper computer is relatively long, the signal transmission wire is relatively long, voltage loss and electrical noise interference are easily caused, and the signal transmission of the sensor is easily affected, so the I2C voltage conversion circuit 2 is adopted to perform communication, that is, the I2C voltage conversion circuit 2 includes a first MOS transistor Q1 and a second MOS transistor Q2, the source of the first MOS transistor Q1 is connected with the microprocessor 3 and is connected to the power supply through a first resistor R1, the gate of the first MOS transistor Q1 is connected to the same power supply as the first resistor R1, the drain of the first MOS transistor Q1 is connected to the corresponding sensor and is connected to the power supply through a second resistor R2, the voltage of the power supply connected to the first resistor R1 is lower than the voltage of the power supply connected to the second resistor R2, which is specifically expressed as: the voltage of the first resistor R1 is connected to a power supply of 3.3V, and the voltage of the second resistor R2 is connected to a power supply of 5V. The source of the second MOS transistor Q2 is connected to the microprocessor 3 and is connected to a power supply through a third resistor R3, the gate of the second MOS transistor Q2 is connected to a power supply identical to that of the third resistor R3, the drain of the second MOS transistor Q2 is connected to a corresponding sensor and is connected to the power supply through a fourth resistor R4, the voltage of the power supply connected to the third resistor R3 is lower than that of the power supply connected to the fourth resistor R4, which is specifically represented as: the power supply connected to the third resistor R3 is 3.3V, and the power supply connected to the fourth resistor R4 is 5V. The circuit adopts an MOS tube booster circuit to boost and restore transmission signals, thereby ensuring stable communication between the microprocessor 3 and the sensor.
Further, the main operation of the laser generator of this embodiment is controlled by the laser driving circuit 8, and the structure of the laser driving circuit 8 is as shown in fig. 3, that is, the laser driving circuit includes a driving chip U2 and a third MOS transistor Q3, a DIM terminal pin of the driving chip U2 is connected to the microprocessor 3, a VIN terminal pin of the driving chip U2 is connected to a power supply and is grounded through a first capacitor C1, a CSN terminal pin of the driving chip U2 is connected to the power supply through a fifth resistor R5 and is connected to the anode of the laser generator through a first inductor L1, a sixth resistor R5 is connected in parallel to the fifth resistor R6, a DRV terminal pin of the driving chip U2 is connected to the gate of a third MOS transistor Q3, a drain of the third MOS transistor Q3 is connected to the cathode of the laser generator, a VIN terminal pin of the driving chip U2 is connected to the cathode of the laser generator through a first diode D1, and a cathode of a first diode D1 is connected to a voltage supply 24V supply, The anode is connected with the laser generator, and the first diode D1 is connected with a second diode D2 in parallel. The working voltage is 24V, the PWM signal input by the microprocessor 3 controls the brightness, the main control of the circuit is provided with a driving chip U2, the driving chip U2 can adopt a QX5241 type chip, when the circuit works specifically, the driving chip U2 samples the voltage of a CSN terminal pin, the voltage is compared with the internal part of the chip, and then the current control is accurately achieved, namely the power of the laser generator, namely the brightness is controlled.
Further, as shown in fig. 4, the fan control circuit 6 of this embodiment includes a fourth MOS transistor Q4 and a third diode, a gate of the fourth MOS transistor Q4 is connected to the microprocessor 3 and grounded through an eleventh resistor R11, a drain of the fourth MOS transistor Q4 is connected to the cooling fan 7 and a positive electrode of the third diode D3, a source of the fourth MOS transistor Q4 is grounded, and a negative electrode of the third diode D3 is connected to a power supply. The cooling fan 7 is powered by 24V, and the on-off of the fourth MOS transistor Q4 is controlled by the PWM signal of the microprocessor 3, so as to control the power supply of the cooling fan 7 and achieve the purpose of controlling the fan speed.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (4)
1. The utility model provides a high temperature protection laser driving system based on two-way digital communication which characterized in that: the method comprises the following steps:
the image sensors are at least one in number, are mechanically arranged on a laser module of the laser equipment, and are used for detecting the area, the detection direction of which is over against the laser module, for carrying out laser work, and acquiring the area picture in real time;
the distance sensors are at least one in number, are mechanically arranged on a laser module of the laser equipment, and are used for detecting the distance between the distance sensors and the area, wherein the detection direction of the distance sensors is over against the area where the laser module works;
the temperature sensors are at least one in number, are mechanically arranged on a laser module of the laser equipment, and a detection head of each temperature sensor is attached to the laser module and detects the temperature state of the laser module in real time;
the number of the heat dissipation fans is at least one, the heat dissipation fans are mechanically arranged on the laser module and blow air to the heat dissipation fins of the laser module;
the laser driving circuit is communicated with a laser generator circuit in the laser module and controls the power output of the laser generator so as to achieve the working control of the laser generator;
and the microprocessor is a central data control unit and is respectively connected with the image sensor, the distance sensor and the temperature sensor through an I2C voltage conversion circuit, is communicated with the laser driving circuit and is connected with the cooling fan through a fan control circuit.
2. The high-temperature protection laser driving system based on bidirectional digital communication as claimed in claim 1, wherein: the I2C voltage conversion circuit comprises a first MOS tube and a second MOS tube, wherein a source electrode of the first MOS tube is connected with the microprocessor and is connected with a power supply through a first resistor, a grid electrode of the first MOS tube is connected with the power supply same with the first resistor, a drain electrode of the first MOS tube is connected with the power supply through a signal input end and a second resistor, the voltage of the power supply connected with the first resistor is lower than that of the power supply connected with the second resistor, a source electrode of the second MOS tube is connected with the microprocessor and is connected with the power supply through a third resistor, the grid electrode of the second MOS tube is connected with the power supply same with the third resistor, the drain electrode of the second MOS tube is connected with the power supply through a fourth resistor, and the voltage of the power supply connected with the third resistor is lower than that of the fourth resistor.
3. The high-temperature protection laser driving system based on bidirectional digital communication as claimed in claim 1, wherein: laser drive circuit includes driver chip and third MOS pipe, driver chip's DIM end foot is connected with microprocessor, driver chip's VIN end foot inserts the power and through first electric capacity ground connection, driver chip's CSN end foot passes through fifth resistance access power and connects laser generator's positive pole through first inductance, driver chip's DRV end foot is connected with third MOS pipe's grid, third MOS pipe's drain electrode is connected with laser generator's negative pole, driver chip's VIN end foot still is connected with laser generator's negative pole through first diode, and power, anodal laser generator are connected to its negative pole connection of first diode, first diode has the second diode in parallel.
4. The high-temperature protection laser driving system based on bidirectional digital communication as claimed in claim 1, wherein: the fan control circuit comprises a fourth MOS tube and a third diode, the grid electrode of the fourth MOS tube is connected with the microprocessor and grounded through an eleventh resistor, the drain electrode of the fourth MOS tube is connected with the cooling fan and the anode of the third diode, the source electrode of the fourth MOS tube is grounded, and the cathode of the third diode is connected with a power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210273273.8A CN114552376A (en) | 2022-03-19 | 2022-03-19 | High-temperature protection laser driving system based on bidirectional digital communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210273273.8A CN114552376A (en) | 2022-03-19 | 2022-03-19 | High-temperature protection laser driving system based on bidirectional digital communication |
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| Publication Number | Publication Date |
|---|---|
| CN114552376A true CN114552376A (en) | 2022-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210273273.8A Withdrawn CN114552376A (en) | 2022-03-19 | 2022-03-19 | High-temperature protection laser driving system based on bidirectional digital communication |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117526080A (en) * | 2024-01-08 | 2024-02-06 | 合肥金星智控科技股份有限公司 | Laser and control protection circuit thereof |
-
2022
- 2022-03-19 CN CN202210273273.8A patent/CN114552376A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117526080A (en) * | 2024-01-08 | 2024-02-06 | 合肥金星智控科技股份有限公司 | Laser and control protection circuit thereof |
| CN117526080B (en) * | 2024-01-08 | 2024-05-17 | 合肥金星智控科技股份有限公司 | Laser and control protection circuit thereof |
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Application publication date: 20220527 |
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