CN114542479A - Pump device - Google Patents

Pump device Download PDF

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Publication number
CN114542479A
CN114542479A CN202111391243.9A CN202111391243A CN114542479A CN 114542479 A CN114542479 A CN 114542479A CN 202111391243 A CN202111391243 A CN 202111391243A CN 114542479 A CN114542479 A CN 114542479A
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CN
China
Prior art keywords
axial direction
frame member
heat dissipation
welding
annular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202111391243.9A
Other languages
Chinese (zh)
Other versions
CN114542479B (en
Inventor
山本岳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Sankyo Corp
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Nidec Sankyo Corp
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Filing date
Publication date
Application filed by Nidec Sankyo Corp filed Critical Nidec Sankyo Corp
Publication of CN114542479A publication Critical patent/CN114542479A/en
Application granted granted Critical
Publication of CN114542479B publication Critical patent/CN114542479B/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00Pumping installations or systems
    • F04D13/02Units comprising pumps and their driving means
    • F04D13/06Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0606Canned motor pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/58Cooling; Heating; Diminishing heat transfer
    • F04D29/5806Cooling the drive system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/58Cooling; Heating; Diminishing heat transfer
    • F04D29/586Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine

Abstract

A pump device is provided, which can realize low cost and miniaturization even under the condition of improving the heat radiation of a cover component. The pump device comprises: a rotor (5) that rotates about a rotation center axis (L); a stator (6) disposed around the rotor; an impeller (4) disposed on one side (L1) in the axial direction, in which the rotation center axis extends, with respect to the rotor; a resin sealing member (7) which covers the stator and is provided with a cylinder part (74) which is opened at the other side (L2) in the axial direction; a circuit board (8) which is accommodated in the cylindrical portion and connected to the coil (63) of the stator; and a cover member (9) that covers the tube portion from the other side. The cover member includes: a resin frame member (91) having an opening (91a) that opens in the axial direction; and a metal heat dissipation member (92) covering the opening. A welding part (94) for joining the frame member and the tube part is provided between the frame member and the tube part.

Description

Pump device
Technical Field
The present invention relates to a pump device including a heat radiating member.
Background
In the pump device, an impeller disposed in a pump chamber is rotated by a motor. This motor includes a stator covered with a partition member that partitions a pump chamber, and a circuit board for supplying power to the motor is disposed on the side of the stator opposite to the impeller.
For example, patent document 1 describes such a pump device. In the same document, a motor includes: a rotor having an impeller disposed at one end in an axial direction; and a stator assembly surrounding the rotor. An actuator for controlling the motor is disposed on the other side of the stator assembly in the axial direction. The stator assembly is covered with a cylindrical main body cover. The impeller is disposed on one side in the axial direction in which the rotation center axis of the rotor extends. The driver is covered by a driver cover closing the rear end of the main body cover. The driver cover is fixed to the main body cover by screws.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2018-108024
Disclosure of Invention
Technical problem to be solved by the invention
In patent document 1, a driver cover fixed to an end portion of the pump device opposite to the impeller has a heat radiation property, and can radiate heat of a driver that controls the motor. However, if a heat-radiating member is used as a cover member for covering the circuit board of the pump device, a die-cast cover member is used in the past, but the manufacturing cost of the die-cast cover member is high. In addition, in the case of fixing a die-cast cover member, since a screw is used, it is necessary to form a screw hole or a screw attachment portion in the cover member and the counterpart member to which the cover member is fixed. Therefore, the pump device as a whole becomes large.
In view of the above problems, an object of the present invention is to provide a pump device that can be reduced in size at low cost even when the heat dissipation of a cover member is improved.
The technical scheme adopted for solving the technical problem
In order to solve the above-described problems, the present invention provides a pump device including: a rotor that rotates around a rotation center axis; a stator disposed around the rotor; an impeller disposed on one side of the rotor in an axial direction in which the rotation center axis extends; a resin sealing member that covers the stator and includes a tube portion that is open on the other side in the axial direction; a circuit board housed in the cylindrical portion and connected to the coil of the stator; and a cover member that covers the tube portion from the other side, the cover member including: a resin frame member having an opening portion that opens in the axial direction; and a metal heat dissipation member covering the opening, wherein a welding portion for joining the frame member and the tube portion is provided between the frame member and the tube portion.
In the present invention, a cover member for covering a cylindrical portion for housing a circuit board includes: a resin frame member having an opening portion that opens in an axial direction; and a metal heat dissipation member covering the opening. Therefore, the cost of parts can be suppressed as compared with the case where the cover member is entirely formed of metal. Further, since the frame member and the cylindrical portion are made of resin, the cover member can be fixed to the cylindrical portion of the resin seal member by welding. Therefore, the cover member is fixed without using screws or the like, and thus, it is not necessary to form a portion where a screw hole is provided in the cover member and the tube portion. Therefore, the cover member and the cylindrical portion can be prevented from being enlarged, and the pump device as a whole can be made compact.
In the present invention, it is preferable that the welded portion includes: a welding projection provided on one of the frame member and the cylindrical portion and projecting in the axial direction; and a welding concave portion provided on the other of the frame member and the cylindrical portion and into which the welding convex portion is fitted. With this configuration, the frame member and the tube portion can be aligned by fitting the projection and the recess, and therefore, the cover member and the tube portion can be easily assembled. In addition, since the convex portion can be welded to the concave portion, the cover member can be easily fixed to the cylindrical portion of the resin seal member.
In the present invention, it is preferable that the cover member includes a sealing member disposed between the frame member and the heat radiating member. With this configuration, since the adhesion between the frame member and the heat dissipation member can be improved, it is possible to suppress a decrease in water resistance caused by the heat dissipation member and the frame member being separate members.
In the present invention, it is preferable that the frame member includes: a ring part having the opening part; and an annular wall portion protruding from the annular portion to the one side and fitted into an inner side of the cylindrical portion, the heat radiating member including: a shielding part for covering the opening part from one side; a peripheral wall portion extending from an outer peripheral edge of the shielding portion to the one side; and a flange portion that protrudes radially outward from an end edge of the peripheral wall portion, wherein the seal member is disposed in a radial gap between the annular wall portion and the peripheral wall portion. With such a configuration, when the radial dimensional accuracy of the heat dissipation member and the frame member is low, or the dimensional accuracy is degraded by a temperature change, or the like, the sealing property can be ensured by elastic deformation of the sealing member.
In the present invention, it is preferable that the annular portion includes an abutting portion abutting against the shielding portion from the other side. With this configuration, the position of the shielding portion in the axial direction with respect to the annular portion can be easily determined, and the heat radiating member can be positioned in the axial direction with respect to the frame member.
In the present invention, it is preferable that the heat radiating member includes a notch portion formed by cutting an outer peripheral edge of the flange portion radially inward, and the annular wall portion includes a positioning convex portion protruding radially inward, and the heat radiating member is positioned in the circumferential direction by fitting the positioning convex portion into the notch portion. With this configuration, the heat radiating member can be restricted from rotating relative to the frame member.
In the present invention, it is preferable that a heat transfer member in contact with the heat dissipation member and the circuit board is disposed between the heat dissipation member and the circuit board. With this configuration, heat generated in the circuit board can be transferred to the heat dissipation member via the heat transfer member. Therefore, heat dissipation can be accelerated, and temperature rise of the circuit board can be suppressed.
In the present invention, it is preferable that the heat transfer member is in contact with an electronic component disposed on the circuit board. With this configuration, the heat of the electronic component that generates heat can be directly transferred to the heat dissipation member via the heat transfer member. Therefore, heat dissipation can be accelerated, and temperature rise of the electronic component can be suppressed.
In the present invention, it is preferable that the shielding portion includes an opposing portion opposing the electronic component and a planar portion surrounding the opposing portion, an outer peripheral edge of the planar portion abuts against the annular portion from the one side, the opposing portion protrudes from the planar portion to the one side, and a contact avoiding space for avoiding contact between the conductive material on the circuit board and the planar portion is provided between the planar portion and the circuit board. With this configuration, the distance between the opposing portion and the electronic component can be reduced, and therefore the thickness of the heat transfer member disposed between the opposing portion and the electronic component can be reduced. This reduces the thermal resistance of the heat transfer member, and therefore, the heat of the electronic component can be easily transferred to the heat dissipation member. In addition, since the contact avoiding space can be provided between the flat surface portion and the circuit board, accidental contact between the shielding portion and a conductive material such as solder provided on the circuit board can be suppressed. This can suppress a short circuit of the circuit board.
In the present invention, it is preferable that the annular wall portion includes a claw portion for fixing an outer peripheral end portion of the flange portion, and the claw portion is formed by hot caulking. With this configuration, the heat dissipation member can be easily fixed to the frame member.
In the present invention, it is preferable that an inner peripheral surface of the annular wall portion includes a stepped portion that restricts movement of the seal member to the other side. With this configuration, the seal member can be prevented from being displaced to the other side, and therefore, the sealing property of the gap between the annular wall portion and the peripheral wall portion in the radial direction can be improved.
In the present invention, it is preferable that the annular portion has an outer surface facing the other side, and the outer surface has a plurality of gate marks arranged in a region overlapping with the annular wall portion in the axial direction. With this configuration, molding defects of the annular wall portion can be suppressed when the frame member is injection molded.
Effects of the invention
In the present invention, the cover member includes: a resin frame member having an opening portion that opens in an axial direction; and a metal heat dissipation member covering the opening. Therefore, the cost of parts can be suppressed as compared with the case where the cover member is die-cast from metal. Further, since the frame member and the cylindrical portion are fixed by welding, it is not necessary to form a portion where a screw hole is provided in the cover member and the cylindrical portion. Therefore, the pump device as a whole can be made compact.
Drawings
Fig. 1 is a perspective view of a pump device to which the present invention is applied.
Fig. 2 is a perspective view of the pump device shown in fig. 1 viewed from the other side.
Fig. 3 is a cross-sectional view of the pump apparatus shown in fig. 1.
Fig. 4 is an enlarged sectional perspective view of the other side end of the pump device shown in fig. 1.
Fig. 5 is a perspective view of the cover member.
Fig. 6 is an exploded perspective view of the cover member.
Description of the reference numerals
1 … pump device; 2 … shell; 3 … electric motor; 4 … impeller; 5 … rotor; 6 … stator; 7 … resin sealing member; 8 … circuit substrate; 8a … through holes; 9 … hood part; 10 … a magnet; 11 … supporting a shaft; 12 … a plate member; 15 … heat transfer members; 20 … pump chamber; 21 … suction tube; 21a … suction inlet; 22 … outflow tube; 22a … outflow port; 23 … opposite walls; 24 … side walls; 41 … a first panel; 42 … blade portion; 43 … a second panel; 51 … a bracket; 52 … small diameter section; 53 … abutment; 54 … major diameter portion; 56 … bearings; 61 … stator core; 62 … an insulator; 63 … coil; 71 … a first partition wall part; 72 … second divider wall section; 73 … third partition wall part; 73a … aperture; a 74 … cartridge portion; 75 … small diameter section; 76 … major diameter; 77 … flange portion; 78 … connector housing; 79 … placing part; 81 … electronic components; 82 … connector pins; 91a … opening part; 91 … frame member; 92 … heat sink member; 93 … sealing member; 94 … weld; 621 … a first flange portion; 622 … second flange portion; 791 … riveting part; 791a … projection; 911 … circular ring part; 912 … annular wall portion; 913 … outer surface; 914 … inner surface inner peripheral portion; 915 … peripheral portion of inner surface; 916 … location portion; 917 … locating the projection; 918 … a stepped portion; 919 … claw portions; 919a … deformations; 921 … shielding part; 922 … peripheral wall portion; 923 … flange portion; 924 … planar portion; 925 … opposite part; 926 … a notch portion; 951 … welding projection; 952 … recess for welding; g … gate vestige; l … center axis of rotation; one side of L1 …; the other side of L2 …; s … contact avoidance space.
Detailed Description
Next, a pump device including the impeller of the present invention will be described with reference to the drawings. In the following description, the extending direction of the rotation center axis L is referred to as an axial direction. In the axial direction, one side is denoted by L1, and the other side is denoted by L2. In the following description, the radial direction and the circumferential direction around the rotation center axis are simply referred to as "radial direction" and "circumferential direction", respectively.
(Overall Structure)
Fig. 1 is a perspective view of a pump device 1 to which the present invention is applied. Fig. 2 is a perspective view of the pump device 1 shown in fig. 1 as viewed from the other side L2. Fig. 3 is a sectional view of the pump apparatus 1 shown in fig. 1. Fig. 4 is an enlarged perspective sectional view of the end of the other side L2 of the pump device 1 shown in fig. 1. Fig. 5 is a perspective view of the cover member. Fig. 6 is an exploded perspective view of the cover member.
As shown in fig. 1 to 3, the pump device 1 includes: a housing 2; a motor 3 having a rotor 5 and a stator 6; and a resin impeller 4 disposed on one side L1 in the axial direction with respect to the rotor 5. The casing 2 accommodates the impeller 4 and partitions the pump chamber 20. The motor 3 includes: a resin sealing member 7 made of resin and covering the stator 6; a circuit board 8 connected to the coil 63 of the stator 6; and a cover member 9 covering the circuit board 8 from the other side L2. In the pump device 1, the impeller 4 and the rotor 5 rotate together about the rotation center axis L to move the fluid in the pump chamber 20.
(case)
As shown in fig. 3, the housing 2 divides the pump chamber 20 between itself and the resin seal member 7. The housing 2 includes: an opposing wall 23 opposing the impeller 4 on one side L1; and a side wall 24 extending in the circumferential direction radially outward of the impeller 4. As shown in fig. 1 and 2, the housing 2 includes: a suction pipe 21 extending in the axial direction; and an outflow tube 22 extending in a direction orthogonal to the axial direction. The suction pipe 21 and the outflow pipe 22 have a suction port 21a and an outflow port 22a at their ends, respectively. The suction pipe 21 and the suction port 21a are provided concentrically with respect to the rotation center axis L. The outflow pipe 22 is located radially outside the impeller 4.
(impeller)
The impeller 4 is made of resin. As shown in fig. 3, the impeller 4 includes: a circular first plate 41; a plurality of blade portions 42 that protrude from the first plate 41 to one side L1 and are arranged at regular intervals in the circumferential direction; and a circular second plate 43 that abuts against the tip end of the one side L1 of the blade 42. When the impeller 4 rotates around the rotation center axis L together with the rotor 5 by the driving of the motor 3, the fluid in the pump chamber 20 flows in the rotation direction by the vane portions 42. As a result, the fluid generates a centrifugal force, becomes low pressure on the radial inner side and high pressure on the radial outer side, is sucked from the suction port 21a, and flows out from the outflow port 22 a.
(electric motor)
As shown in fig. 3, the rotor 5 includes: a cylindrical holder 51 extending in the axial direction; and a cylindrical magnet 10 held on the outer peripheral surface of the holder 51. The holder 51 is made of resin. The holder 51 includes: a small diameter portion 52 for holding the magnet 10 on the outer peripheral surface; a circular abutting portion 53 abutting an end of the one side L1 of the magnet 10; and a large diameter portion 54 protruding from the outer peripheral edge of the abutting portion 53 to one side L1, wherein the outer diameter of the small diameter portion 52 is smaller than the outer diameter of the large diameter portion 54. The small diameter portion 52 and the large diameter portion 54 are coaxially disposed. The small diameter portion 52 holds a bearing 56 therein, and the rotor 5 is rotatably supported by the support shaft 11 via the bearing 56.
As shown in fig. 3, the entire magnet 10 is covered with a surface layer of resin. The outer diameter of the magnet 10 is substantially the same as the outer diameter of the large diameter portion 54. The magnet 10 and the small diameter portion 52 are bonded together by applying an adhesive between the magnet 10 and the small diameter portion 52. At this time, the magnet 10 is positioned in the axial direction by abutting against the abutting portion 53. The magnet 10 is composed of a ferrite magnet, a bonded neodymium magnet, a samarium-iron-nitrogen magnet, or the like. In the present embodiment, the magnet 10 is a ferrite magnet. In the case of a ferrite magnet, the entire surface may not be covered with a surface layer of resin.
As shown in fig. 3, the stator 6 has a stator core 61 and a coil 63 wound around the stator core 61 via an insulator 62. Although detailed description is omitted, the stator core 61 includes an annular portion surrounding the periphery of the rotor 5 and a plurality of salient poles protruding radially inward from the annular portion. The coil 63 is wound between a first flange 621 on the radially inner side and a second flange 622 on the radially outer side of the insulator 62 covering the salient poles. In the present embodiment, the motor 3 is a three-phase motor, and the coils 63 include a U-phase coil, a V-phase coil, and a W-phase coil.
As shown in fig. 3 and 4, the resin sealing member 7 includes: a first partition wall portion 71 interposed between the stator 6 and the impeller 4; a second partition wall portion 72 interposed between the stator 6 and the magnet 10; and a third partition wall 73 facing the end surface of the other side L2 of the rotor 5. The first partition wall 71 faces the impeller 4 on the other side L2, and partitions the pump chamber 20 between itself and the casing 2. In the present embodiment, the resin seal member 7 covers the stator 6 from the radially outer side and the radially inner side, and covers the stator 6 from both sides in the axial direction. The resin sealing member 7 is made of, for example, polyphenylene Sulfide (PPS) and is formed by insert molding the stator 6. The resin sealing member 7 may be formed by insert Molding the stator 6 by Bulk Molding Compound (BMC) or the like, for example.
As shown in fig. 3, the support shaft 11 is a metal rod-shaped member. The center axis of the support shaft 11 coincides with the rotation center axis L of the rotor 5. The end of the other side L2 of the support shaft 11 is press-fitted into the hole 73a formed in the third partition wall 73. An annular plate member 12 is attached to an end portion of the support shaft 11 on the side L1. The plate member 12 abuts on an end portion of the one side L1 of the bearing 56.
The resin seal member 7 includes a tube portion 74 that opens to the other side L2 at the end of the other side L2 of the pump device 1. In the present embodiment, the third partition wall 73 extends outward from the other side L2 of the rotor 5 to cover the other side L2 of the stator 6. The cylinder 74 includes: a small-diameter portion 75 connected to the third partition wall portion 73; a large diameter portion 76 connected to the end of the other side L2 of the small diameter portion 75; and a flange portion 77 that protrudes radially outward from an end of the other side L2 of the large diameter portion 76. The cylindrical portion 74 includes a connector housing 78 that covers a connector pin 82 electrically connected to the circuit board 8. The small diameter portion 75 has a cylindrical shape. The large diameter portion 76 has a cylindrical shape and has an outer diameter larger than the small diameter portion 75. The circuit board 8 is housed inside the large diameter portion 76. The flange portion 77 is provided over the entire circumference of the large diameter portion 76.
The resin sealing member 7 includes a mounting portion 79 for mounting the circuit board 8. The mounting portion 79 protrudes from the third partition wall portion 73 to the other side L2. The mounting portion 79 has a circular shape when viewed from the axial direction, and the central axis of the mounting portion 79 coincides with the rotation central axis L. A caulking portion 791 for fixing the circuit board 8 is provided on the end surface of the other side L2 of the mounting portion 79. The caulking portion 791 is formed by thermally deforming the tip of the protrusion 791a protruding from the end surface of the other side L2 of the placement portion 79. That is, the caulking portion 791 is formed by heat caulking.
As shown in fig. 3 and 4, the circuit board 8 is provided with a circuit for controlling power supply to the coil 63. The circuit board 8 is placed on the end face of the other side L2 of the placement unit 79 from the other side L2, and is fixed to the placement unit 79 by the fixing member 791. More specifically, a through hole 8a is provided in the center of the circuit board 8 at a position overlapping the mounting portion 79 when viewed from the axial direction. The tip of the protruding portion 791a is heat-caulked in a state where the protruding portion 791a is inserted into the through hole 8a, whereby the circuit board 8 is fixed to the mounting portion 79 by the caulking portion 791 formed at the tip of the protruding portion 791 a. The circuit board 8 includes an engaging portion, not shown, at an outer peripheral edge. The circuit board 8 is positioned in the circumferential direction by the engagement of the engaging portion with the cylindrical portion 74. The electronic component 81 is mounted on the other side L2 surface of the circuit board 8. The electronic component 81 is an IC chip or the like that controls power supply. The electronic component 81 serves as a heat source for generating heat when controlling the supply of power to the coil 63.
As shown in fig. 3 to 6, the cover member 9 is fixed to the flange portion 77 of the resin seal member 7 by welding, and covers the cylindrical portion 74 from the other side L2. The cover member 9 includes: a resin frame member 91 having an opening 91a that opens in the axial direction; a metal heat dissipation member 92 covering the opening 91a from one side L1; and a sealing member 93 disposed between the frame member 91 and the heat dissipation member 92. Further, a heat transfer member 15 is disposed between the heat dissipation member 92 and the circuit board 8, and the heat transfer member 15 is in contact with the heat dissipation member 92 and the circuit board 8 to transfer heat of the circuit board 8 to the heat dissipation member 92.
The frame member 91 includes: a plate-like annular portion 911 having a circular opening 91 a; and an annular wall portion 912 that protrudes from the annular portion 911 toward the side L1 at the radial center of the annular portion 911. The outer shape of the circular portion 911 is the same as the outer shape of the flange portion 77 of the cylinder portion 74. The circular portion 911 includes: an outer surface 913 facing the other side L2; an inner surface inner circumferential portion 914 facing one side L1 at a position radially inward of the annular wall portion 912; and an inner surface outer peripheral portion 915 facing the side L1 at a position radially outward of the annular wall portion 912. The outer surface 913 includes a plurality of gate marks G formed when the frame member 91 is injection molded at positions overlapping the annular wall portion 912 in the axial direction. The inner surface outer peripheral portion 915 faces the flange portion 77 from the other side L2.
As shown in fig. 4, the annular wall portion 912 is located inside the large diameter portion 76 of the tube portion 74. The outer peripheral surface of the annular wall 912 abuts against the inner peripheral surface of the large diameter portion 76 of the tube portion 74. As shown in fig. 6, the annular wall portion 912 includes a positioning protrusion 917 protruding radially inward. The positioning protrusion 917 has a semicircular shape when viewed in the axial direction, and extends in the axial direction. The positioning protrusions 917 are provided at eight locations at equal intervals in the circumferential direction. As described later, a claw portion 919 is formed at the tip of one side L1 of each positioning convex portion 917. The inner circumferential surface of the annular wall portion 912 has a stepped portion 918 recessed toward the other side L2. The stepped portion 918 extends along the entire circumference of the inner circumferential surface of the annular wall portion 912. The stepped portion 918 regulates movement of the seal member 93 to the other side L2, and positions the seal member 93 in the axial direction.
The heat dissipation member 92 is located radially inward of the annular wall portion 912. The heat dissipation member 92 is formed of a single metal plate. The heat dissipation member 92 is made of metal such as copper, brass, or aluminum. The heat dissipation member 92 is circular when viewed from the axial direction. The heat dissipation member 92 includes: a shielding portion 921 covering the opening 91a from one side L1; a peripheral wall portion 922 that is curved from the outer peripheral edge of the shielding portion 921 to one side L1 and extends in the axial direction; and a flange portion 923 that protrudes radially outward from an end edge of the peripheral wall portion 922.
The shielding portion 921 has a circular shape when viewed from the axial direction, and has an outer diameter larger than the opening 91 a. The shielding portion 921 abuts on the inner surface inner peripheral portion 914 from one side L1 in the axial direction. That is, the inner surface inner peripheral portion 914 is a contact portion with which the shielding portion 921 comes into contact from the other side L2, and functions as the positioning portion 916 that positions the shielding portion 921 in the axial direction.
The shielding section 921 includes: a planar portion 924 opposed to the circuit board 8; and an opposing portion 925 protruding from the planar portion 924 to the side L1. The facing portion 925 is a square when viewed in the axial direction, and overlaps the electronic component 81 in the axial direction. Since the flat surface portion 924 is arranged at a position receded to the other side L2 with respect to the opposing portion 925, a contact avoiding space S is formed between the flat surface portion 924 and the circuit board 8 to avoid contact between a conductive material such as solder on the circuit board 8 and the flat surface portion 924.
The heat dissipation member 92 includes a notch 926 formed by cutting the outer peripheral edge of the flange 923 to the inner peripheral side. The notch 926 is semicircular when viewed in the axial direction. The notches 926 are provided at eight locations at equal intervals in the circumferential direction. When the heat dissipation member 92 is fixed to the frame member 91, the peripheral wall 922 of the heat dissipation member 92 is inserted into the inner peripheral side of the annular wall 912 of the frame member 91, and at this time, the notch 926 engages with the positioning protrusion 917 provided on the inner peripheral surface of the annular wall 912. Thereby, the heat dissipation member 92 is positioned in the circumferential direction.
As shown in fig. 5 and 6, the frame member 91 includes a claw portion 919 provided at the tip of one side L1 of the annular wall portion 912. The claw 919 overlaps the positioning convex section 917 in the axial direction. The claw portions 919 are formed by thermally deforming deformed portions 919a protruding from the distal end portion of the one side L1 of the annular wall portion 912. That is, the claw portions 919 are caulked portions formed by thermal caulking. The claw portions 919 lock the outer peripheral edge of the flange portion 923 from the side L1. Thereby, the heat dissipation member 92 is fixed to the frame member 91.
The sealing member 93 is disposed between the frame member 91 and the heat dissipation member 92, and is in close contact with the frame member 91 and the heat dissipation member 92. The seal member 93 of the present embodiment is an O-ring. The seal member 93 is disposed in a radial gap between the annular wall portion 912 and the peripheral wall portion 922, and is in close contact with an inner peripheral surface of the annular wall portion 912 and an outer peripheral surface of the peripheral wall portion 922 in a radially elastically deformed state. Further, the movement of the seal member 93 to the other side L2 is restricted by the stepped portion 918.
The heat transfer member 15 is a thin sheet-like heat transfer member having elasticity. The heat transfer member 15 may be grease or the like. In the present embodiment, the heat transfer member 15 is disposed so as to be in contact with the opposing portion 925 and the electronic component 81.
The cover member 9 is fixed to the cylindrical portion 74 of the resin seal member 7 by welding. In the present embodiment, a welding portion 94 for joining the frame member 91 and the tube portion 74 is provided between the frame member 91 and the tube portion 74. The welded portion 94 is provided at a position where the flange portion 77 provided at the end of the other side L2 of the tube portion 74 and the annular portion 911 of the frame member 91 face each other in the axial direction. As shown in fig. 4, the frame member 91 includes a welding protrusion 951 protruding from the inner peripheral portion 915 of the annular portion 911 toward the one side L1. The welding protrusion 951 is annular and surrounds the annular wall 912. Flange 77 includes annular welding recess 952 facing welding projection 951 from one side L1. Further, a welding concave portion that is concave toward the other side L2 may be provided in the frame member 91, and a welding convex portion that is convex toward the other side L2 may be provided in the flange portion 77.
Next, a welding method for fixing the cover member 9 to the resin seal member 7 will be described. As a welding method, ultrasonic welding, vibration welding, or the like is used. In the present embodiment, in a state where the convex welding portion 951 is fitted into the concave welding portion 952, the welding head is pressed against the outer surface 913 of the annular portion 911, and the convex welding portion 951 and the concave welding portion 952 are welded. During welding, the flange portion 77 is supported by the jig from the side L2. In the present embodiment, the resin seal member 7 includes a connector housing 78 protruding radially outward from the tube portion 74, and a gap in the axial direction into which the jig can be inserted is formed between the flange portion 77 and the connector housing 78. In the present embodiment, the amount of welding between the frame member 91 and the tube 74 is adjusted, so that the heat transfer member 15 reliably contacts the opposing portion 925 and the electronic component 81.
(Effect)
As described above, the pump device 1 of the present embodiment includes: a rotor 5 that rotates about a rotation center axis L; a stator 6 disposed around the rotor 5; an impeller 4 disposed on one side L1 in the axial direction extending from the rotation center axis L with respect to the rotor 5; a resin seal member 7 covering the stator 6 and including a cylindrical portion 74 opening to the other side L2 in the axial direction; a circuit board 8 housed in the cylindrical portion 74 and connected to the coil 63 of the stator 6; and a cover member 9 covering the tube portion 74 from the other side L2. The cover member 9 includes: a resin frame member 91 having an opening 91a that opens in the axial direction; and a metal heat dissipation member 92 covering the opening 91 a. A welding portion 94 for joining the frame member 91 and the tube portion 74 is provided between the frame member 91 and the tube portion 74.
With this configuration, the component cost can be reduced as compared with the case where the cover member 9 is entirely formed of metal. Further, since the frame member 91 and the tube portion 74 are made of resin, the cover member 9 can be fixed to the tube portion 74 of the resin seal member 7 by welding. Therefore, since screws or the like are not required for fixing the cover member 9, it is not necessary to form screw holes in the cover member 9 and the tube portion 74. Therefore, the cover member 9 and the cylindrical portion 74 can be prevented from being enlarged, and the entire pump device 1 can be made compact. Further, the position of the cover member 9 in the axial direction can be adjusted by fixing by welding. Therefore, the distance between the heat dissipation member 92 provided on the cover member 9 and the circuit board 8 in the axial direction can be finely adjusted. In addition, by changing the material of the metal used for the heat dissipation member 92, the heat dissipation effect of the heat dissipation member 92 can be easily changed. For example, if the heat dissipation member 92 is made of copper, the heat dissipation effect of the heat dissipation member 92 can be improved.
In the present embodiment, the welding portion 94 includes: a welding convex portion 951 provided in the frame member 91 and protruding toward the side L1; and a welding recess 952 provided in the tube portion 74 and into which the welding convex portion 951 is fitted. Therefore, the frame member 91 and the tube portion 74 can be aligned by fitting the welding convex portion 951 and the welding concave portion 952, and therefore, the cover member 9 and the tube portion 74 can be easily assembled. Further, since the welding protrusions 951 can be welded to the welding recesses 952, the cover member 9 can be easily fixed to the cylindrical portion 74 of the resin seal member 7.
In the present embodiment, the cover member 9 includes a sealing member 93 disposed between the frame member 91 and the heat dissipation member 92. Therefore, since the adhesion between the frame member 91 and the heat dissipation member 92 can be improved, the entry of water or the like from the cover member 9 into the tube portion 74 can be suppressed, and the water resistance can be improved.
In the present embodiment, the frame member 91 includes: an annular ring portion 911 having an opening 91 a; and an annular wall portion 912 that protrudes from the annular portion 911 toward the side L1 at the radial center of the annular portion 911 and fits inside the cylinder portion 74. The heat dissipation member 92 includes: a shielding portion 921 covering the opening 91a from one side L1; a peripheral wall portion 922 that is bent from the outer peripheral edge of the shielding portion 921 to one side L1 and extends in the axial direction; and a flange portion 923 that protrudes radially outward from an end edge of the peripheral wall portion 922. The heat radiating member 92 is located radially inward of the annular wall 912, and the seal member 93 is disposed in a radial gap between the annular wall 912 and the peripheral wall 922. Therefore, when the radial dimensional accuracy of the heat dissipation member 92 and the frame member 91 is low, or the dimensional accuracy is degraded by a temperature change, the sealing property can be ensured by the elastic deformation of the sealing member 93.
In the present embodiment, the annular portion 911 includes the inner peripheral surface portion 914 which is a contact portion with the shielding portion 921 from the other side L2, and the inner peripheral surface portion 914 functions as the positioning portion 916 which positions the shielding portion 921 in the axial direction. Therefore, the position of the shielding portion 921 in the axial direction with respect to the circular portion 911 can be easily determined, and the heat dissipation member 92 can be positioned in the axial direction with respect to the frame member 91.
In the present embodiment, the heat dissipation member 92 includes a notch 926 formed by cutting the outer peripheral edge of the flange 923 radially inward. The annular wall 912 includes a positioning protrusion 917 protruding radially inward. Since the heat dissipation member 92 is fitted into the positioning protrusion 917 via the notch 926 and fixed in position in the circumferential direction, the heat dissipation member 92 can be prevented from rotating with respect to the frame member 91.
In the present embodiment, the heat transfer member 15 is disposed between the heat dissipation member 92 and the circuit board 8 so as to be in contact with the heat dissipation member 92 and the circuit board 8. Therefore, the heat generated in the circuit substrate 8 can be transmitted to the heat dissipation member 92 via the heat transfer member 15. This can accelerate heat dissipation and suppress a temperature rise of the circuit board 8.
In the present embodiment, the heat transfer member 15 is in contact with the electronic component 81 disposed on the circuit board 8. Therefore, the heat of the electronic component 81 that generates heat can be directly transmitted to the heat dissipation member 92 via the heat transfer member 15. This can accelerate heat dissipation and suppress a temperature rise of the electronic component 81.
In the present embodiment, the shielding portion 921 includes the facing portion 925 facing the electronic component 81 and the flat surface portion 924 surrounding the facing portion 925, the outer peripheral edge of the flat surface portion 924 abuts against the annular portion 911 of the frame member 91 from the side L1, and a contact avoiding space S for avoiding contact between the conductive material on the circuit board 8 and the flat surface portion 924 is formed between the flat surface portion 924 and the circuit board 8. Therefore, the distance between the opposing portion 925 and the electronic component 81 is small, and therefore the thickness of the heat transfer member 15 disposed between the opposing portion 925 and the electronic component 81 can be reduced. This makes it possible to easily transfer the heat of the electronic component 81 to the heat dissipation member 92 because the heat transfer member 15 has a low thermal resistance. Further, since the contact avoiding space S can be provided between the flat surface portion 924 and the circuit board 8, accidental contact between the shielding portion 921 and a conductive material such as solder provided on the circuit board 8 can be suppressed. This can suppress short-circuiting of the circuit board 8.
In the present embodiment, the annular wall portion 912 includes a claw portion 919 that fixes the outer peripheral end portion of the flange portion 923, and the claw portion 919 is formed by thermally deforming a deformed portion 919a provided at the distal end portion. Therefore, the heat dissipation member 92 can be easily fixed to the frame member 91 by heat caulking.
In the present embodiment, since the inner peripheral surface of the annular wall portion 912 includes the stepped portion 918 that regulates the movement of the seal member 93 to the other side L2, the seal member 93 can be prevented from shifting to the other side L2. This can improve the sealing property of the gap between the annular wall 912 and the peripheral wall 922 in the radial direction, and can improve the waterproof property.
In the present embodiment, the circular portion 911 has an outer surface 913 facing the other side L2. The outer surface 913 includes a plurality of gate marks G arranged in a region overlapping the annular wall portion 912 in the axial direction. By providing the gate at such a position, it is possible to suppress a decrease in molding accuracy when the frame member 91 is injection molded. Therefore, molding defects of the annular wall portion 912 can be suppressed.

Claims (12)

1. A pump device, comprising:
a rotor that rotates around a rotation center axis;
a stator disposed around the rotor;
an impeller disposed on one side of the rotor in an axial direction in which the rotation center axis extends;
a resin sealing member that covers the stator and includes a cylindrical portion that is open on the other side in the axial direction;
a circuit board housed in the cylindrical portion and connected to the coil of the stator; and
a cover member covering the tubular portion from the other side,
the cover member includes: a resin frame member having an opening portion that opens in the axial direction; and a metal heat dissipation member covering the opening,
a welding part for joining the frame member and the cylindrical part is provided between the frame member and the cylindrical part.
2. Pump apparatus according to claim 1,
the welding part is provided with: a welding projection provided on one of the frame member and the cylindrical portion and projecting in the axial direction; and a welding concave portion provided on the other of the frame member and the cylindrical portion and into which the welding convex portion is fitted.
3. Pump arrangement according to claim 1 or 2,
the cover member includes a sealing member disposed between the frame member and the heat radiating member.
4. Pump apparatus according to claim 3,
the frame member includes: a ring part having the opening part; and an annular wall portion projecting from the annular portion to the one side and fitted into an inner side of the cylindrical portion,
the heat dissipation member includes: a shielding part for covering the opening part from one side; a peripheral wall portion extending from an outer peripheral edge of the shielding portion to the one side; and a flange portion projecting radially outward from an end edge of the peripheral wall portion,
the seal member is disposed in a radial gap between the annular wall portion and the peripheral wall portion.
5. The pump arrangement according to claim 4,
the annular portion includes an abutting portion that abuts the shielding portion from the other side.
6. Pump arrangement according to claim 4 or 5,
the heat radiating member includes a notch portion formed by cutting an outer peripheral edge of the flange portion radially inward,
the annular wall portion has a positioning protrusion protruding radially inward,
the heat radiating member is positioned in the circumferential direction by fitting the positioning projection into the notch.
7. Pump arrangement according to any one of claims 4 to 6,
a heat transfer member is disposed between the heat dissipation member and the circuit board, the heat transfer member being in contact with the heat dissipation member and the circuit board.
8. The pump arrangement according to claim 7,
the heat transfer member is in contact with an electronic component disposed on the circuit substrate.
9. The pump arrangement according to claim 8,
the shielding part is provided with: an opposing portion opposing the electronic component; and a planar portion surrounding the opposing portion,
the outer peripheral edge of the flat surface portion abuts against the annular portion from the one side,
the opposing portion protrudes from the planar portion toward the one side,
between the planar portion and the circuit substrate, a contact avoiding space for avoiding contact between the conductive material on the circuit substrate and the planar portion is provided.
10. Pump arrangement according to any one of claims 4 to 9,
the annular wall portion includes a claw portion for fixing an outer peripheral end portion of the flange portion,
the claw portion is formed by hot riveting.
11. Pump device according to any one of claims 6 to 10,
the inner peripheral surface of the annular wall portion includes a step portion that restricts movement of the seal member to the other side.
12. Pump arrangement according to any one of claims 4 to 11,
the annular portion has an outer surface facing the other side,
the outer surface includes a plurality of gate marks arranged in a region overlapping the annular wall portion in the axial direction.
CN202111391243.9A 2020-11-19 2021-11-19 Pump device Active CN114542479B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020192197A JP2022080962A (en) 2020-11-19 2020-11-19 Pump device
JP2020-192197 2020-11-19

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CN114542479B CN114542479B (en) 2024-03-08

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CN102454641A (en) * 2010-10-27 2012-05-16 日本电产三协株式会社 Pump device
CN102900691A (en) * 2011-07-25 2013-01-30 日本电产三协株式会社 Vortex pump device
CN202856585U (en) * 2011-09-29 2013-04-03 日本电产株式会社 Pump motor, sealed pump and tableware cleaning machine
JP2013204431A (en) * 2012-03-27 2013-10-07 Nidec Sankyo Corp Pump device, and method of manufacturing pump device
JP2016003580A (en) * 2014-06-13 2016-01-12 日本電産サンキョー株式会社 Pump device
JP2017015002A (en) * 2015-07-01 2017-01-19 日本電産サンキョー株式会社 Pump device
CN206246375U (en) * 2015-09-30 2017-06-13 日本电产三协(浙江)有限公司 Pump installation
CN110301086A (en) * 2017-02-14 2019-10-01 日本电产三协株式会社 Motor and pump installation
CN111486097A (en) * 2019-01-29 2020-08-04 日本电产三协株式会社 Pump device
CN111817468A (en) * 2019-04-11 2020-10-23 日本电产三协株式会社 Motor, pump device, and method for manufacturing motor

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102454641A (en) * 2010-10-27 2012-05-16 日本电产三协株式会社 Pump device
CN102900691A (en) * 2011-07-25 2013-01-30 日本电产三协株式会社 Vortex pump device
CN202856585U (en) * 2011-09-29 2013-04-03 日本电产株式会社 Pump motor, sealed pump and tableware cleaning machine
JP2013204431A (en) * 2012-03-27 2013-10-07 Nidec Sankyo Corp Pump device, and method of manufacturing pump device
JP2016003580A (en) * 2014-06-13 2016-01-12 日本電産サンキョー株式会社 Pump device
JP2017015002A (en) * 2015-07-01 2017-01-19 日本電産サンキョー株式会社 Pump device
CN206246375U (en) * 2015-09-30 2017-06-13 日本电产三协(浙江)有限公司 Pump installation
CN110301086A (en) * 2017-02-14 2019-10-01 日本电产三协株式会社 Motor and pump installation
CN111486097A (en) * 2019-01-29 2020-08-04 日本电产三协株式会社 Pump device
CN111817468A (en) * 2019-04-11 2020-10-23 日本电产三协株式会社 Motor, pump device, and method for manufacturing motor

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