CN114540760B - Mask plate and manufacturing method thereof - Google Patents

Mask plate and manufacturing method thereof Download PDF

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Publication number
CN114540760B
CN114540760B CN202210126293.2A CN202210126293A CN114540760B CN 114540760 B CN114540760 B CN 114540760B CN 202210126293 A CN202210126293 A CN 202210126293A CN 114540760 B CN114540760 B CN 114540760B
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China
Prior art keywords
strip
mask
correction
frames
bar
Prior art date
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CN202210126293.2A
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Chinese (zh)
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CN114540760A (en
Inventor
韩超杰
请求不公布姓名
欧建兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Guangzhou China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202210126293.2A priority Critical patent/CN114540760B/en
Publication of CN114540760A publication Critical patent/CN114540760A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Abstract

The application provides a mask plate and a manufacturing method thereof, comprising the following steps: the mask frame comprises a plurality of frames which are connected in sequence, and the frames are enclosed to form a window; the two ends of the first mask strip are respectively fixed with two opposite frames in the plurality of frames; one end of the second mask bar is fixed with one of the frames, the other end of the second mask bar is fixed with the first mask bar, and the extending direction of the second mask bar is perpendicular to the extending direction of the first mask bar; and the correction mask strip at least comprises a first correction strip, the first correction strip is laminated on the first mask strip, the width of the first correction strip is larger than that of the first mask strip, the projection of the first mask strip on the first correction strip is positioned in the first correction strip, and the first correction strip and the second mask strip jointly divide the window into a plurality of vapor deposition openings with different sizes.

Description

Mask plate and manufacturing method thereof
Technical Field
The application relates to the technical field of display, in particular to a mask plate for film forming and a manufacturing method thereof.
Background
OLED (organic light emitting display) unlike conventional LCD display, a backlight is not required, and a very thin organic coating and glass substrate (or flexible organic substrate) are used, which emit light when a current is passed through them. The OLED is lighter and thinner, low in energy consumption, high in brightness, good in luminous efficiency, capable of displaying pure black, and capable of being bent, such as a current curved television, a mobile phone and the like. The research and development investment of OLED technology is strengthened after various international factories are strived for, so that the OLED technology is applied to the fields of televisions, computers, mobile phones, flat panels and the like.
By adopting a vacuum evaporation technology, a glass substrate is attached to a metal mask plate, an organic material is deposited on the glass substrate to form a required pattern, in the process, the metal mask plate plays a key role, the accuracy of the pattern of the metal mask plate restricts the development of an OLED, strict requirements are put on the expanded metal of the metal mask plate, and particularly for large-size non-array typesetting metal mask plates, the mask plate is easy to deform after being stressed in the expanded metal process, so that the shape of an evaporation opening is deformed, and the shape of the evaporated pattern is deformed.
Therefore, the prior art has defects and needs to be solved urgently.
Disclosure of Invention
The application provides a mask plate and a manufacturing method thereof, which can solve the problem of deformation of an evaporation opening caused by deformation of a metal strip in a screen opening process.
In order to solve the problems, the technical scheme provided by the application is as follows:
a reticle, comprising:
the mask frame comprises a plurality of frames which are connected in sequence, and the frames are enclosed to form a window;
the two ends of the first mask strip are respectively fixed with two opposite frames in the plurality of frames;
one end of the second mask bar is fixed with one of the frames, the other end of the second mask bar is fixed with the first mask bar, and the extending direction of the second mask bar is perpendicular to the extending direction of the first mask bar; and
the mask correction strip at least comprises a first correction strip, wherein the first correction strip is laminated on the first mask strip, the width of the first correction strip is larger than that of the first mask strip, the projection of the first mask strip on the first correction strip is positioned in the first correction strip, and the first correction strip and the second mask strip jointly divide the window into a plurality of vapor deposition openings with different sizes.
In some embodiments of the invention, the thickness of the first correction stripe is not greater than the thickness of the first mask stripe.
In some embodiments of the present invention, the correction mask strip further includes a second correction strip, the second correction strip being stacked on the second mask strip and fixed with the second mask strip, the second correction strip having a width greater than a width of the second mask strip, and a projection of the second mask strip on the second correction strip being located within the second correction strip.
In some embodiments of the invention, the thickness of the second correction stripe is not greater than the thickness of the second mask stripe.
In some embodiments of the present invention, the first mask strip and the second mask strip are respectively provided with a drain hole.
A manufacturing method of a mask plate comprises the following steps:
providing a mask frame, wherein the mask frame comprises a plurality of frames which are connected in sequence, and a plurality of frames are enclosed to form a window;
providing a first mask strip, and stretching the first mask strip to a preset position to fix the first mask strip and two opposite frames in the frames;
providing a metal mask strip, stretching the metal mask strip to a preset position to enable two ends of the metal mask strip to be fixed with one of the remaining two frames of the plurality of frames and the first mask strip respectively, and cutting off redundant parts to enable one end, close to the first mask strip, of the metal mask strip to be located on the first mask strip so as to form a second mask strip; and
the method comprises the steps of providing a correction mask strip, tensioning the first correction strip to cover the first mask strip, enabling two ends of the first correction strip to be fixed with the mask frame, enabling the width of the first correction strip to be larger than that of the first mask strip, enabling projection of the first mask strip on the first correction strip to be located in the first correction strip, and enabling the first correction strip and the second mask strip to jointly divide the opening window into a plurality of evaporation openings with different sizes.
In some embodiments of the invention, the thickness of the first correction stripe is not greater than the thickness of the first mask stripe.
In some embodiments of the present invention, the provided correction mask strip further comprises a second correction strip, and before tensioning and fixing the first correction strip, tensioning the second correction strip to be fixed with the second mask strip, wherein the width of the second correction strip is larger than that of the second mask strip, and the projection of the second mask strip on the second correction strip is located in the second correction strip.
In some embodiments of the invention, the thickness of the second correction stripe is not greater than the thickness of the metal mask stripe.
In some embodiments of the invention, the first mask strip and the second mask strip are respectively provided with a drain hole.
The beneficial effects of this application are: according to the mask and the manufacturing method thereof, after the first screen opening divides the window of the mask frame into a plurality of openings with different sizes, the second screen opening is performed, and the correction strips are provided to cover the mask strips which deform when the first screen opening is performed, so that the shape of each corrected opening can meet the requirement of film forming precision.
Drawings
Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic plan view of a mask frame and fixing a first mask strip in the mask frame according to a first embodiment of the present application;
FIG. 2 is a schematic plan view of the metal mask strip provided on the basis of FIG. 1 and secured to a mask frame;
FIG. 3 is a schematic plan view of a second mask blank formed by cutting the metal mask blank from the redundant portion of FIG. 2;
FIG. 4 is a schematic plan view of a second masking strip on the surface of the second masking strip of FIG. 3;
fig. 5 is a schematic plan view of a mask plate obtained by disposing a first metal strip on the surface of a first mask strip on the basis of fig. 4.
Description of the reference numerals
100-mask plate; 1-mask frame; 2-a first mask strip; 3-a second mask stripe;
4-a first correction bar; 5-a second correction bar; 110-windowing; 120-evaporation openings;
11-a first bezel; 12-a second frame; 13-a third border; 14-fourth frame;
101-a mounting groove; 102-positioning holes; 104-a liquid discharge hole; 15-upper surface;
30-a first sub-mask strip; 32-a second sub-mask strip; 6-metal mask strips;
50-a first sub-correction bar; 52-second sub-correction stripes.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
In the description of the present application, it should be understood that the terms "longitudinal," "transverse," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," and the like indicate an orientation or a positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. The mask 100 and the manufacturing method thereof are described in detail below with reference to specific embodiments.
For large-size masks, to form multi-size evaporation openings, openings of a mask frame are generally divided by metal transverse strips and metal longitudinal strips, one end of each partial metal transverse strip is fixed with each metal longitudinal strip, and the tension applied to the connecting positions of the metal transverse strips and the metal longitudinal strips is different from the tension applied to the end parts of the metal transverse strips and the metal longitudinal strips, so that the metal transverse strips and the metal longitudinal strips deform.
Referring to fig. 5, the present invention provides a mask 100 capable of correcting a deformed position to meet the requirement of precision required for film formation. The mask 100 includes: mask frame 1, first mask bar 2, second mask bar 3, first correction bar 4, and second correction bar 5.
The mask frame 1 includes a first frame 11, a second frame 12, a third frame 13, and a fourth frame 14. The first frame 11, the second frame 12, the third frame 13, and the fourth frame 14 are sequentially enclosed to form a window 110. The mask frame 1 further comprises a plurality of positioning holes 102 and a plurality of mounting grooves 101, the positioning holes 102 can form a coordinate system, the mounting grooves 101 can be formed based on the coordinate system formed by the positioning holes 102, the mounting grooves 101 are used for fixing the end parts of the first mask strip 2, the second mask strip 3, the second correction strip 5 and the first correction strip 4, and accordingly the mounting grooves 101 can ensure the mounting accuracy of the mask strips and the correction strips.
The two ends of the first mask strip 2 are respectively fixed with a first frame 11 and a second frame 12 which are opposite. In the present embodiment, only one first mask stripe 2 is illustrated. In other embodiments, a plurality of first mask stripes 2 may be provided according to the size of the mask frame 1. In other embodiments, two ends of the first mask strip 2 may be fixed to the third frame 13 and the fourth frame 14 opposite to each other.
The second mask strip 3 at least comprises a first sub mask strip 30 fixed with the third frame 13 and the first mask strip 2. That is, one end of the first sub-mask bar 30 is fixed to the first mask bar 2, so that the first mask bar 2 is subjected to a single-side tension and a cutting tension when the first sub-mask bar 30 is formed, and thus, the first mask bar 2 is deformed.
In this embodiment, in order to obtain more vapor deposition openings 120 with different sizes, the second mask bar 3 further includes a second sub-mask bar 32 fixed to the fourth frame 14 and the first mask bar 2. Wherein the number of the first sub-mask stripes 30 is not equal to the number of the second sub-mask stripes 32. Thereby causing one side of the first mask strip 2 to be subjected to one tension and the other side to be subjected to two tensions, so that the first mask strip 2 is deformed.
In the present embodiment, only one first sub-mask bar 30 and two second sub-mask bars 32 are illustrated. In other embodiments, the first sub-mask stripes 30 and the second sub-mask stripes 32 may be configured according to the size of the mask frame 1 and the size of the pattern to be vapor deposited.
For the large-size mask 100, the number of the first sub-mask strips 30 is not equal to the number of the first sub-mask strips 30, so that the first mask strips 2 are subjected to different tensions at the left and right sides, and the first mask strips 2 are deformed, so that the vapor deposition openings 120 need to be corrected in order to ensure that the vapor deposition openings 120 do not affect the deformation of the vapor deposition pattern.
The second correction strip 5 is used for correcting the deformation of the second mask strip 3. In this embodiment, the second correction strip 5 includes a first sub-correction strip 50 for correcting the deformation of the first sub-mask strip 30 and a second sub-correction strip 52 for correcting the deformation of the second sub-mask strip 32. The first sub-correction strip 50 covers the surface of the first sub-mask strip 30 and two ends of the first sub-correction strip are fixed with the third frame 13 and the first sub-mask strip 30; the second sub-correction strip 52 covers the surface of the second sub-mask strip 32 and has two ends fixed to the fourth frame 14 and the second sub-mask strip 32. The first sub-correction stripe 50 has a width greater than the width of the first sub-mask stripe 30 and the second sub-correction stripe 52 has a width greater than the width of the second sub-mask stripe 32. Thus, the bending of the first and second sub-mask stripes 30 and 3 due to the deformation can be covered by the first and second sub-correction stripes 50 and 52, respectively. And the force at which the first sub-correction strip 50 is tensioned is smaller than the force at which the first sub-mask strip 30 is tensioned, so that the deformation of the first sub-correction strip 50 is smaller than the first sub-mask strip 30.
The first correction strips 4 are stacked on the first mask strips 2, the width of the first correction strips 4 is larger than that of the first mask strips 2, the projection of the first mask strips 2 on the first correction strips 4 is located in the first correction strips 4, and the first correction strips 4 and the second mask strips 3 jointly divide the window 110 into a plurality of vapor deposition openings 120 with different sizes and regular.
In this embodiment, the thickness of the first correction strip 4 is not greater than the thickness of the first mask strip 2. The thickness of the second correction strip 5 is not greater than the thickness of the second mask strip 3. The first correction bar 4 and the second correction bar 5 are mainly used for shielding the deformation of the first mask bar 2 and the second mask bar 3, so that the vapor deposition opening 120 is a regular opening, and the thickness can be slightly reduced to reduce the cost.
In the embodiment, the first mask strip 2 and the second mask strip 3 are respectively provided with a drain hole 104. The liquid discharge holes 104 are arranged, so that the residual cleaning liquid between the first mask strip 2 and the first correction strip 4 can be discharged through the liquid discharge holes 104, and the residual liquid between the second mask strip 3 and the second correction strip 5 can be discharged through the corresponding liquid discharge holes 104. The number of drain holes 104 may be set as desired. Because the mask 100 is used for a certain number of times, the organic material on the mask needs to be dissolved by using the organic solvent liquid medicine for several times, and then dried for reuse. In this process, once the residual liquid medicine exists on the mask plate, the service life performance of the vapor deposition device is affected in the process of vapor deposition by using the residual liquid medicine.
The mask 100 of this embodiment is made of a Invar alloy, which has an extremely low expansion coefficient, and is resistant to corrosion, oxidation, wear, etc., so that the accuracy of the process can be ensured in the use process, or stainless steel (SUS) or Kovar alloy (Kovar) can be used instead, so that the mask has good corrosion resistance, oxidation resistance, etc.
When the mask 100 is in use, the substrate to be coated is disposed on the upper surface 15 of the mask 100, that is, the substrate to be coated is disposed closer to the top surface of the first correction bar 4, and the substrate to be coated contacts with the surface of the correction bar, so that the evaporation opening 120 is in a regular shape, thereby meeting the requirement of coating accuracy.
Referring to fig. 1-5, the present invention further relates to a method for manufacturing a mask 100, which includes the following steps:
s1: referring to fig. 1, a mask frame 1 is provided, wherein the mask frame 1 includes a plurality of frames connected in sequence, and a plurality of frames enclose to form a window 110; mounting grooves 101 are formed in preset positions of the frames of the mask frame 1.
S2: a first mask strip 2 is provided and is stretched to a preset position and welded and fixed with mounting grooves 101 arranged at two opposite side frames in the plurality of side frames.
S3: referring to fig. 2 and 3, a metal mask bar 6 is provided, the metal mask bar 6 is stretched to a predetermined position so that two ends of the metal mask bar 6 are respectively fixed with one of the two remaining frames and the first mask bar 2, and then the redundant portion is cut off so that one end of the metal mask bar near the first mask bar 2 is located on the first mask bar 2 to form a second mask bar 3.
S4: referring to fig. 4 and 5, a correction mask strip is provided, the correction mask strip at least includes a first correction strip 4, the first correction strip 4 is stretched to cover the first mask strip 2 and fix two ends thereof with the mask frame 1, the width of the first correction strip 4 is larger than that of the first mask strip 2, the projection of the first mask strip 2 on the first correction strip 4 is located in the first correction strip 4, and the first correction strip 4 and the second mask strip 3 jointly divide the window 110 into a plurality of vapor deposition openings 120 with different sizes. The thickness of the first correction strip 4 is not greater than the thickness of the first mask strip 2.
In this embodiment, the provided correction mask strip further includes a second correction strip 5, before tensioning and fixing the first correction strip 4, tensioning the second correction strip 5 to be fixed with the second mask strip 3, where the width of the second correction strip 5 is greater than the width of the second mask strip 3, and the projection of the second mask strip 3 on the second correction strip 5 is located in the second correction strip 5.
In this embodiment, since the second correction strip 5 is formed by cutting after fixing the metal mask strip 6 to the predetermined position, the second correction strip 5 is formed prior to the first correction strip 4 in order to avoid cutting residues. That is, in the present embodiment, the second correction bar 5 includes a first sub-correction bar 50 for correcting the deformation of the first sub-mask bar 30 and a second sub-correction bar 52 for correcting the deformation of the second sub-mask bar 32. The first sub-correction strip 50 covers the surface of the first sub-mask strip 30 and two ends of the first sub-correction strip are fixed with the third frame 13 and the first sub-mask strip 30; the second sub-correction strip 52 covers the surface of the second sub-mask strip 32 and has two ends fixed to the fourth frame 14 and the second sub-mask strip 32. After the second correction strip 5 is fixed, the first correction strip 4 is tensioned and fixed, so that the first correction strip 4 and the first mask strip 2 clamp the second correction strip 5 and the second mask strip 3 between the two.
In this embodiment, the thickness of the second correction strip 5 is not greater than the thickness of the metal mask strip. The first mask strip 2 and the second mask strip 3 are respectively provided with a liquid drain hole 104.
In other embodiments, the second correction strip 5 may not be provided on the surface of the second mask strip 3, since the deformation of the second mask strip 3 is small and is not illustrated in the drawings.
Since the second correction bar 5 is disposed on the surface of the second mask bar 3 to correct the deformation of the second mask bar 3 in the present embodiment, the vapor deposition opening 120 is actually formed by dividing the mask frame 1, the first correction bar 4 and the first mask bar 2 which are stacked, and the second correction bar 5 and the second mask bar 3 which are stacked.
In summary, in the mask 100 and the manufacturing method thereof provided in the present application, after the first screen opening divides the window 110 of the mask frame 1 into a plurality of vapor deposition openings 120 with different sizes, the second screen opening is performed, and the correction strip is provided to cover the mask strip deformed during the first screen opening, so that the shape of each vapor deposition opening 120 after correction can meet the requirement of film forming precision.
In summary, although the present application has been described with reference to the preferred embodiments, the preferred embodiments are not intended to limit the application, and those skilled in the art can make various modifications and adaptations without departing from the spirit and scope of the application, and the scope of the application is therefore defined by the claims.

Claims (8)

1. The manufacturing method of the mask plate is characterized by comprising the following steps of:
providing a mask frame, wherein the mask frame comprises a plurality of frames which are connected in sequence, and a plurality of frames are enclosed to form a window;
providing a first mask strip, and stretching the first mask strip to a preset position to fix the first mask strip and two opposite frames in the frames;
providing a metal mask strip, stretching the metal mask strip to a preset position to enable two ends of the metal mask strip to be fixed with one of the remaining two frames of the plurality of frames and the first mask strip respectively, and cutting off redundant parts to enable one end, close to the first mask strip, of the metal mask strip to be located on the first mask strip so as to form a second mask strip; and
providing a correction mask strip, wherein the correction mask strip at least comprises a first correction strip, the first correction strip is stretched to cover the first mask strip, two ends of the first correction strip are fixed with the mask frame, the width of the first correction strip is larger than that of the first mask strip, the projection of the first mask strip on the first correction strip is positioned in the first correction strip, and the first correction strip and the second mask strip jointly divide the opening window into a plurality of evaporation openings with different sizes;
the provided correction mask strip further comprises a second correction strip, the second correction strip is stretched and fixed to the second mask strip before the first correction strip is stretched and fixed, the width of the second correction strip is larger than that of the second mask strip, and the projection of the second mask strip on the second correction strip is positioned in the second correction strip;
the correction mask strip is in contact with the substrate.
2. The method of claim 1, wherein the thickness of the first correction strip is not greater than the thickness of the first mask strip.
3. The method of claim 1, wherein the thickness of the second correction strip is not greater than the thickness of the metal mask strip.
4. The method for manufacturing a mask plate according to claim 1, wherein the first mask strip and the second mask strip are respectively provided with a drain hole.
5. A mask plate, characterized in that the mask plate is manufactured by the manufacturing method according to any one of claims 1 to 4;
the mask plate comprises:
the mask frame comprises a plurality of frames which are connected in sequence, and the frames are jointly enclosed to form a window;
the two ends of the first mask strip are respectively fixed with two opposite frames in the plurality of frames;
one end of the second mask bar is fixed with one of the frames, the other end of the second mask bar is fixed with the first mask bar, and the extending direction of the second mask bar is perpendicular to the extending direction of the first mask bar; and
the mask correction strip at least comprises a first correction strip, wherein the first correction strip is laminated on the first mask strip, the width of the first correction strip is larger than that of the first mask strip, the projection of the first mask strip on the first correction strip is positioned in the first correction strip, and the first correction strip and the second mask strip jointly divide the window into a plurality of vapor deposition openings with different sizes;
the correction mask strip further comprises a second correction strip, the second correction strip is stacked on the second mask strip and is fixed with the second mask strip, the width of the second correction strip is larger than that of the second mask strip, and the projection of the second mask strip on the second correction strip is positioned in the second correction strip;
the correction mask strip is in contact with the substrate.
6. The reticle of claim 5, wherein the thickness of the first correction stripe is no greater than the thickness of the first reticle stripe.
7. The reticle of claim 5, wherein the thickness of the second correction stripe is no greater than the thickness of the second reticle stripe.
8. The mask plate according to claim 5, wherein the first mask strip and the second mask strip are respectively provided with a drain hole.
CN202210126293.2A 2022-02-10 2022-02-10 Mask plate and manufacturing method thereof Active CN114540760B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210126293.2A CN114540760B (en) 2022-02-10 2022-02-10 Mask plate and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN202210126293.2A CN114540760B (en) 2022-02-10 2022-02-10 Mask plate and manufacturing method thereof

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CN114540760A CN114540760A (en) 2022-05-27
CN114540760B true CN114540760B (en) 2024-02-02

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110894587A (en) * 2018-09-12 2020-03-20 三星显示有限公司 Mask frame assembly
CN112376016A (en) * 2020-11-24 2021-02-19 昆山工研院新型平板显示技术中心有限公司 Evaporation mask plate assembly and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110894587A (en) * 2018-09-12 2020-03-20 三星显示有限公司 Mask frame assembly
CN112376016A (en) * 2020-11-24 2021-02-19 昆山工研院新型平板显示技术中心有限公司 Evaporation mask plate assembly and manufacturing method thereof

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