CN114532868A - Kitchen appliance, cooking box body and manufacturing method thereof - Google Patents

Kitchen appliance, cooking box body and manufacturing method thereof Download PDF

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Publication number
CN114532868A
CN114532868A CN202210034357.6A CN202210034357A CN114532868A CN 114532868 A CN114532868 A CN 114532868A CN 202210034357 A CN202210034357 A CN 202210034357A CN 114532868 A CN114532868 A CN 114532868A
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China
Prior art keywords
heat
component
layer
cooking
resistant
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Granted
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CN202210034357.6A
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Chinese (zh)
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CN114532868B (en
Inventor
张振华
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Midea Group Co Ltd
Guangdong Midea Kitchen Appliances Manufacturing Co Ltd
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Midea Group Co Ltd
Guangdong Midea Kitchen Appliances Manufacturing Co Ltd
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Priority to CN202210034357.6A priority Critical patent/CN114532868B/en
Publication of CN114532868A publication Critical patent/CN114532868A/en
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    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00Baking; Roasting; Grilling; Frying
    • A47J37/06Roasters; Grills; Sandwich grills
    • A47J37/0623Small-size cooking ovens, i.e. defining an at least partially closed cooking cavity
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00Cooking-vessels
    • A47J27/04Cooking-vessels for cooking food in steam; Devices for extracting fruit juice by means of steam ; Vacuum cooking vessels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50Multilayers
    • B05D7/52Two layers
    • B05D7/54No clear coat specified
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00Other substrates
    • B05D2203/30Other inorganic substrates, e.g. ceramics, silicon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00Other substrates
    • B05D2203/30Other inorganic substrates, e.g. ceramics, silicon
    • B05D2203/35Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2504/00Epoxy polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2518/00Other type of polymers
    • B05D2518/10Silicon-containing polymers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Food Science & Technology (AREA)
  • Cookers (AREA)

Abstract

The application discloses kitchen appliance, culinary art box and preparation method thereof, this culinary art box is equipped with the culinary art chamber, includes: a heat-resistant substrate; a heat insulating layer laminated on the surface of the heat-resistant base material; the heat-insulating layer is arranged on one side of the heat-resisting base material; wherein the soaking layer forms the inner surface of the cooking cavity. In this way, this application can reduce cavity itself to thermal absorption for the air of intracavity is given more to the heat, thereby improves the culinary art efficiency, can also improve the homogeneity that the interior food of culinary art was heated simultaneously.

Description

Kitchen appliance, cooking box body and manufacturing method thereof
Technical Field
The application relates to the field of household appliances, in particular to a kitchen appliance, a cooking box body and a manufacturing method of the cooking box body.
Background
With the improvement of living standard, people put forward higher requirements on food cooking, and a steam box, an oven, a newly-developed steam oven, a micro-steam oven and the like become one of the necessary household appliances in the family of modern people, so that the market scale is very considerable.
However, the problems of low cooking energy efficiency and uneven heating of the existing steam box, oven, newly-developed steam box, micro-steam oven and the like always affect the consumption experience of people, and further limit the further expansion of the market scale.
Disclosure of Invention
The application mainly provides a kitchen appliance, a cooking box body and a manufacturing method thereof, so that the absorption of the cooking cavity body to heat is reduced, the heat is more transferred to the air in the cavity, the cooking energy efficiency is improved, and the problem that food in the cooking cavity is not uniformly heated can be solved.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a cooking cabinet provided with a cooking cavity, including: a heat-resistant substrate; a heat insulating layer laminated on the surface of the heat-resistant base material; the heat-insulating layer is arranged on one side of the heat-resisting base material; wherein the soaking layer forms the inner surface of the cooking cavity.
Optionally, the soaking layer includes a thermally conductive component and a bonding component, the thermally conductive component and the bonding component being homogeneously mixed.
Optionally, the heat conducting component comprises at least one of heat conducting copper powder, heat conducting aluminum powder and heat conducting graphene; the grain diameter of the heat conduction component is in the range of 1 micron to 40 microns, and the weight proportion of the heat conduction component in the soaking layer is in the range of 1 percent to 21 percent.
Optionally, the bonding component is a high temperature resistant epoxy resin or a high temperature resistant silicone resin, and the weight ratio of the bonding component in the heat-equalizing layer is in the range of 0.5% to 1.8%.
Optionally, the soaking layer further comprises a support component, and the support component, the heat conducting component and the bonding component are uniformly mixed, wherein the hardness of the support component is greater than that of the heat conducting component.
Optionally, the support component is ceramic particles or glass particles; the particle size of the support component is in the range of 10 nanometers to 20 micrometers, and the weight proportion of the support component in the heat-equalizing layer is in the range of 1% to 6%.
Optionally, the soaking layer further comprises a solvent component, and the support component, the heat conduction component and the bonding component are uniformly distributed in the solvent component; wherein, the solvent component comprises at least one of acetone, ethanol, glycol, isopropanol, ethyl acetate, N-methyl pyrrolidone and ethylene glycol butyl ether acetate.
Optionally, the heat insulation layer comprises a filler and a binder, the filler and the binder are uniformly mixed, and the filler is at least one of glass cenospheres and aerogel powder.
Optionally, the particle size of the filler is in the range of 10 nanometers to 30 micrometers, and the weight proportion of the filler in the heat insulation layer is in the range of 5% to 30%; the adhesive is high temperature resistant epoxy resin or high temperature resistant organic silicon resin.
Optionally, the heat-resistant substrate is one of a metal substrate, a ceramic substrate, a mica substrate, and a glass substrate.
In order to solve the above technical problem, another technical solution adopted by the present application is: a kitchen appliance is provided. Kitchen appliance includes heating member, air-out spare and above-mentioned arbitrary culinary art box, and heating member and air-out spare set up in culinary art box, and air-out spare drive air current flows through heating member and flows in the culinary art intracavity.
In order to solve the above technical problem, another technical solution adopted by the present application is: a method for manufacturing a cooking box body. The cooking box body is provided with a cooking cavity, and the manufacturing method comprises the following steps: providing a heat-resistant base material, wherein the heat-resistant base material is provided with an accommodating cavity; coating a heat-insulating layer on the heat-resistant base material, wherein the heat-insulating layer is positioned on the inner surface of the accommodating cavity; and coating a heat equalizing layer on the side of the heat insulating layer, which is far away from the heat-resistant substrate, wherein the heat equalizing layer forms the inner surface of the cooking cavity.
Optionally, the step of coating a thermal equalizing layer on a side of the thermal insulating layer facing away from the heat-resistant substrate comprises: mixing the support component, the heat conducting component and the bonding component in the solvent component to prepare a soaking layer coating solution; coating the heat-insulating layer with the soaking layer coating liquid; and curing the soaking layer coating solution to form the soaking layer.
Optionally, the heat conducting component may be reinforced to include at least one of heat conducting copper powder, heat conducting aluminum powder and heat conducting graphene; the grain diameter of the heat conduction component is in the range of 1 micron to 40 microns, and the weight proportion of the heat conduction component in the soaking layer is in the range of 1 percent to 21 percent; the support component is ceramic particles or glass particles; the particle size of the support component is in the range of 10 nanometers to 20 micrometers, and the weight proportion of the support component in the heat-equalizing layer is in the range of 1 percent to 6 percent; the bonding component is high-temperature-resistant epoxy resin or high-temperature-resistant organic silicon resin, and the weight ratio of the bonding component in the heat-equalizing layer is within the range of 0.5-1.8%; the solvent component comprises at least one of acetone, ethanol, ethylene glycol, isopropanol, ethyl acetate, N-methyl pyrrolidone and ethylene glycol butyl ether acetate.
Optionally, the step of coating a heat-resistant substrate with a heat-insulating layer comprises: uniformly mixing a filler and a bonding agent to prepare a heat insulation coating liquid, wherein the filler is at least one of glass hollow microspheres and aerogel powder; coating the heat-insulating coating liquid on a heat-resistant base material; and curing the heat insulation masking liquid to form the heat insulation layer.
Optionally, the particle size of the filler is in the range of 10 nanometers to 30 micrometers, and the weight proportion of the filler in the heat insulation layer is in the range of 5% to 30%; the adhesive is high-temperature resistant epoxy resin or high-temperature resistant organic silicon resin.
The beneficial effect of this application is: different from the prior art, the application discloses kitchen appliance, cooking box and manufacturing method thereof, and the cooking box uses heat-resistant base material to form a cavity foundation structure, and the mode of successively stacking a heat insulation layer and a heat equalization layer on the heat-resistant base material is adopted to reduce the absorption of the cavity of the cooking cavity to heat, so that more heat is transferred to the air in the cavity, and the cooking energy efficiency is improved. Meanwhile, the setting on soaking layer can strengthen the horizontal heat conduction homogeneity everywhere of culinary art box, and it can also be with heat conversion infrared radiation energy under being heated, and under the separation of insulating layer, this infrared radiation energy is very big partially to the transmission of culinary art box intracavity, and then under the cooperation on insulating layer and soaking layer, both can improve the heating homogeneity to gas in the culinary art box, also can promote the rate of temperature rise of culinary art box intracavity gas, and infrared radiation energy's penetrability is stronger, it is darker to the depth of penetration of eating the material, be favorable to promoting the rate of heating to eating the material.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts, wherein:
FIG. 1 is a schematic structural diagram of an embodiment of a kitchen appliance provided herein;
FIG. 2 is a schematic view of the airflow cycle in the kitchen appliance of FIG. 1;
FIG. 3 is a schematic cross-sectional view of a cooking chamber of the kitchen appliance of FIG. 2;
FIG. 4 is a schematic flow chart illustrating an embodiment of a method for manufacturing a cooking chamber according to the present disclosure;
FIG. 5 is a schematic flow chart of one embodiment of step 20 shown in FIG. 4;
FIG. 6 is a flowchart illustrating an embodiment of step 30 shown in FIG. 4.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In order to make baking more uniform, more and more steam boxes, ovens, steam ovens, micro-steam ovens and the like are provided with 3D hot air baking modes, and the hot air baking modes mainly depend on a hot air system to heat air in cavities and cavities of products. However, the enthalpy of the cavities of the cooking cavities such as the traditional steam box, the oven, the steam oven and the micro-steam oven is high, and the absorbed heat is more, so that the heat absorbed by the air in the cavity is reduced, the temperature rise speed is slow, and the cooking energy efficiency is low. Moreover, the problems of poor transverse heat-conducting performance, uneven surface heat and the like of the cavity of the cooking cavity often cause uneven heating of food in the cooking cavity, so that the cooking effects of a steam box, an oven, a steam oven, a micro-steam oven and the like are affected. In addition, the heat radiation mode of the traditional steam box, oven, steaming oven, micro-steaming oven and the like is generally uniform radiation, and the radiation heat is difficult to penetrate into the food to heat the food.
Based on this, the present application provides a kitchen appliance 100, a cooking box 10 and a manufacturing method thereof, so as to solve the problems of slow temperature rising speed, low cooking energy efficiency, uneven heating of food, poor cooking effect and the like of the conventional steam box, oven, steam oven, micro-steam oven and the like.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an embodiment of a kitchen appliance 100 provided in the present application, and fig. 2 is a schematic view of an airflow circulation in the kitchen appliance 100 shown in fig. 1.
Specifically, the kitchen appliance 100 claimed in the present application may be any one of a steam box, an oven, a steaming oven or a micro-steaming oven, which has similar structure and similar function.
The kitchen appliance 100 generally includes a cooking chamber 10, a heating element 20, an air outlet element 30, a hot air hood 40, an electric control system (not shown), and the like, wherein the heating element 20 and the air outlet element 30 are disposed on the cooking chamber 10, and the air outlet element 30 drives an air flow to flow through the heating element 20 and flow in the cooking chamber 11. The heating member 20 may be any one or more heating devices such as a metal heating tube, a quartz heating tube, a ceramic heating tube, or a semiconductor heating device. It should be noted that the heating member 20 may be a heating device made of other materials as long as the food heating function can be achieved, and the application is not limited herein. The air outlet member 30 can convey the heat generated by the heating member 20 to the cavity of the cooking cavity 11 by wind. The kitchen appliance 100 of the present application is further provided with a hot air cover 40, and hot air can be convected through the opening on the hot air cover 40. In addition, the kitchen appliance 100 is further provided with an electric control system, and the switching and control of different operation modes of the kitchen appliance 100 can be realized by connecting the heating element 20 with the electric control system.
Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the cooking chamber 10 of the kitchen appliance 100 shown in fig. 2.
The cooking cabinet 10 of the present application is provided with a cooking cavity 11, and as shown in fig. 3, the cooking cabinet 10 includes a heat-resistant base material 101, a heat insulating layer 102, and a heat equalizing layer 103.
Specifically, the cooking chamber 10 is constructed by a heat-resistant base material 101, and the heat-resistant base material 101 is a base support material having high hardness and high heat resistance, and is preferably capable of withstanding a high temperature of 100 degrees celsius or higher. Optionally, the heat-resistant substrate 101 may be one or more of a metal substrate, a ceramic substrate, a mica substrate, and a glass substrate, and the present application is not limited thereto, as long as a firm and heat-resistant base frame can be built for the cooking box 10, and the shape of the base frame may be a polyhedron or a rotating body, and the like, depending on the actual needs of the user.
Further, the present application provides a heat insulating layer 102 on the surface of the heat-resistant substrate 101.
In particular, the thermal barrier layer 102 is a coating formed from a range of materials that can effectively conduct heat. This application sets up insulating layer 102 range upon range of in the surface of heat-resisting substrate 101, and through selecting suitable material and coating method, insulating layer 102 can reduce the absorptive heat of cavity itself for the more air of transmitting the intracavity of heat, thereby can obviously accelerate the programming rate of gas in the culinary art chamber 11 and promote the energy efficiency of culinary art box 10.
Optionally, the thermal insulation layer 102 includes a filler and a binder, and the filler and the binder are uniformly mixed to form a coating material of the thermal insulation layer 102.
The filler can be at least one of glass hollow microspheres and aerogel powder, and the particle size of the filler is in the range of 10 nanometers to 30 micrometers, and specifically can be 10 nanometers, 100 nanometers, 1000 nanometers, 10 micrometers, 20 micrometers, 30 micrometers and the like. The weight ratio of the filler in the heat insulating layer 102 is in the range of 5% to 30%, specifically 5%, 10%, 15%, 20%, 25%, 30%, or the like. The smaller particle size of the filler is beneficial to reducing the heat exchange efficiency, improving the heat preservation efficiency of the heat insulation layer 102, and facilitating heat diffusion, so that the heat can be uniformly distributed in the heat insulation layer 102, and further the heat insulation performance of each part of the cooking box body 10 is more balanced. Meanwhile, the weight ratio of the filler is controlled within the range of 5% to 30%, so that the heat insulation performance and the heat insulation balance of the heat insulation layer 102 can be effectively improved. The adhesive can be high temperature resistant epoxy resin or high temperature resistant organic silicon resin. The above-described arrangement of the components and weight ratios of the filler and the adhesive enables the heat insulating layer 102 to be firmly attached to the heat-resistant base material 101 and to be less likely to fall off.
It should be noted that the above limitations on the material, particle size and weight ratio of the filler and the adhesive are preferred technical solutions obtained by the inventors of the present application through long-term practice, and can better ensure the heat insulation performance of the heat insulation layer 102. In practice, the material, particle size and weight ratio of the filler and the adhesive can be any values as long as good heat insulation effect and coating effect can be achieved, for example, the filler can be made of other materials with low thermal conductivity, and the adhesive can be ABS resin or the like.
Optionally, the insulation layer 102 may be made of a material with better thermal insulation performance, such as foam or asbestos board.
Further, the present application is further provided with a soaking layer 103, wherein the soaking layer 103 is laminated on the side of the heat insulation layer 102 away from the heat-resistant base material 101 and forms the inner surface of the cooking cavity 11.
Specifically, the soaking layer 103 is a coating layer formed of a series of materials that can achieve uniform heat diffusion. The heat insulating layer 102 is further laminated with a heat equalizing layer 103, so that the heat equalizing layer 103 forms an inner surface of the cooking cavity 11. By selecting proper materials and coating methods, the soaking layer 103 can quickly transfer local heat in the cooking cavity 11 to the whole surface, namely the soaking layer 103 has excellent transverse heat conduction performance and balanced temperature rise at each position, so that food in the cavity is heated more uniformly, and the cooking effect is improved. Meanwhile, the heat-equalizing layer 103 has an infrared radiation function, and can convert heat into infrared band radiation energy and transfer the infrared band radiation energy to food in the cavity. Because infrared band radiation penetration ability is obviously higher than hot-blast, consequently, this application still can further promote culinary art efficiency through the mode of deepening the heat penetration depth.
Alternatively, the soaking layer 103 includes a heat conductive component, an adhesive component, a support component, and a solvent component, and any two or more of the heat conductive component, the adhesive component, and the support component may be uniformly mixed and finally uniformly distributed in the solvent component.
Wherein, the horizontal heat conductivility of heat-sharing layer 103 is further strengthened to the mode that the heat conduction component accessible changes composition, particle diameter and weight ratio, and then heat radiation that each position department of heat-sharing layer 103 was launched to culinary art chamber 11 because of being heated is more even for the heat transmits the air of intracavity more, makes the edible material in the culinary art chamber 11 be heated more evenly, thereby improves the culinary art efficiency.
Specifically, the thermally conductive component may include at least one of thermally conductive copper powder, thermally conductive aluminum powder, and thermally conductive graphene. The particle size of the heat conducting component is in the range of 1 micron to 40 microns, and specifically can be 1 micron, 10 microns, 20 microns, 30 microns or 40 microns and the like. The weight ratio of the heat conductive component in the soaking layer 103 is in the range of 1% to 21%, and specifically may be 1%, 5%, 10%, 15%, 20%, 21%, or the like. The smaller particle size of the heat conducting component is beneficial to reducing the heat exchange efficiency, improving the heat preservation efficiency of the uniform heating layer 103, and facilitating heat diffusion, so that the heat can be uniformly distributed in the uniform heating layer 103, and further the heat distribution at each position of the cooking box body 10 is more balanced. Meanwhile, the weight ratio of the filler is controlled within the range of 1 to 21 percent, so that the heat preservation performance and the heat preservation balance of the heat-homogenizing layer 103 can be effectively improved.
The diffusion of heat conduction component in soaking layer 103, can strengthen the horizontal heat conduction homogeneity everywhere of soaking layer 103, and it can also be with heat conversion infrared radiation energy under being heated, and under the separation of insulating layer 102, this infrared radiation energy is very big partly to the transmission in the culinary art chamber 11, and then under the cooperation of insulating layer 102 and soaking layer 103, both can improve the heating homogeneity to the gas in the culinary art chamber 11, also can promote the intensification rate of gaseous in the culinary art chamber 11, and infrared radiation energy's penetrability is stronger, it is darker to the depth of penetration of eating the material, be favorable to promoting the rate of heating to eating the material.
The conventional cooking box 10 is usually formed by an insulating material forming an inner surface of the cooking cavity 11, the insulating material has a weak transverse heat conductivity, and cannot well heat gas in the cooking cavity 11, and heat radiation generated by heating is uniform radiation, which is medium radiation energy, and has weak penetrability and small depth penetrating through food materials; relatively speaking, the culinary art box 10 that this application provided can conduct the heat for the gas in the culinary art chamber 11 fast and self heat absorption is minimum, can obviously improve gaseous programming rate in the culinary art chamber 11 and improve kitchen appliance 100's efficiency, makes food be heated more evenly in the culinary art chamber 11, promotes the culinary art effect, and it still is favorable to promoting the heating effect to food inside.
The bonding component mainly plays a role in structural bonding, so that the components in the uniform heat layer 103 can be tightly bonded, and the uniform heat layer 103 can be firmly bonded on the heat insulation layer 102 and is not easy to fall off.
Specifically, the bonding component can be any material capable of achieving component bonding, such as high-temperature-resistant epoxy resin or high-temperature-resistant organic silicon resin. The weight ratio of the adhesive component in the soaking layer 103 is in the range of 0.5% to 1.8%, specifically, 0.5%, 1%, 1.5%, 1.8%, or the like. The above-mentioned setting of the components and weight ratio of the bonding component can greatly improve the bonding performance of the bonding component, and also does not affect the performance of other components in the uniform heat layer 103.
Alternatively, the heat conductive component and the adhesive component may be uniformly mixed to constitute the uniform heat layer 103. The heat-conducting component can perform heat preservation and heat soaking, and the bonding component can uniformly adhere the heat-conducting component to the heat-insulating layer 102. The two are used in cooperation with each other to improve the cooking efficiency of the cooking chamber 10 and the uniformity of heating food in the cooking chamber 11.
The hardness of the support component is set to be greater than that of the heat-conducting component, so that the heat-conducting component with lower hardness can be better protected by the support component, the heat-conducting component is prevented from being damaged, and the hardness of the heat-equalizing layer 103 can be further increased. Specifically, the support component may be ceramic particles or glass particles, or may be other materials capable of supporting and protecting the heat conductive component, such as metal particles. The particle size of the support component is in the range of 10 nm to 20 microns, and specifically may be 10 nm, 100 nm, 1000 nm, 10 microns, 20 microns or the like. The weight ratio of the heat conductive component in the soaking layer 103 is in the range of 1% to 6%, and specifically may be 1%, 2%, 3%, 4%, 5%, or 6%, etc. The components, the particle size and the weight ratio of the support component can improve the protection and support functions of the support component, and meanwhile, the uniform heat layer 103 is not too hard to realize smooth bonding between the uniform heat layer 103 and the heat insulation layer 102.
Alternatively, the support component, the thermally conductive component, and the bonding component may be mixed uniformly to constitute the soaking layer 103. The heat-conducting component can play a role in heat preservation and heat equalization, the supporting component can protect the heat-conducting component and enhance the hardness of the heat equalization layer 103, and the bonding component can uniformly adhere the heat-conducting component and the supporting component to the heat insulation layer 102. The three are used cooperatively, so that the cooking efficiency of the cooking box body 10 can be improved, and the uniformity of heating food in the cooking cavity 11 can be improved.
Wherein, the solvent component can make support component, heat conduction component and bonding component carry out evenly distributed wherein, further improves the degree of fusion and the distribution degree of consistency between each composition in the heat-uniforming layer 103, improves the heat conductivility of heat-uniforming layer 103 and promotes the heat conduction homogeneity to can be fast with local heat transfer to whole face in the cavity, make the food be heated more evenly in the cavity, and finally play the effect that promotes the culinary art effect.
Specifically, the solvent component may include at least one or more of acetone, ethanol, ethylene glycol, isopropyl alcohol, ethyl acetate, N-methylpyrrolidone, and butyl cellosolve acetate, as long as the uniform distribution of the heat conductive component, the adhesive component, and the support component therein can be achieved.
It should be noted that the above limitations on the material, particle size and weight ratio of the heat conducting component, the adhesive component, the supporting component and the solvent component are preferred technical solutions obtained by the inventors of the present application through long-term practice, and can better ensure the heat conducting performance and the heat conducting uniformity of the uniform heat layer 103. In practice, the material, particle size and weight ratio of the heat conducting component, the bonding component, the supporting component and the solvent component may be any values as long as uniform heat distribution in the cavity can be achieved, for example, the heat conducting component may also be a heat conducting silica gel sheet or a heat conducting silicone grease, the bonding component may also be ABS resin, the supporting component may also be a metal particle, and the solvent component may also be methanol, methyl butanone or methyl isobutyl ketone.
Alternatively, the soaking layer 103 may also be a metal plating layer or the like.
In another embodiment of the present application, a method of making a cooking enclosure 10 is also provided. Referring to fig. 4, fig. 4 is a schematic flowchart illustrating a manufacturing method of the cooking box 10 according to an embodiment of the present application, wherein the manufacturing method specifically includes:
s10: a heat-resistant substrate 101 is provided, and the heat-resistant substrate 101 is provided with a receiving cavity.
Specifically, the heat-resistant base material 101 is a basic support material having high hardness and high heat resistance, and is preferably able to withstand a high temperature of 100 degrees celsius or higher. Alternatively, the heat-resistant substrate 101 may be one or more of a metal substrate, a ceramic substrate, a mica substrate, and a glass substrate, or other basic materials that can provide support.
This application utilizes heat-resisting substrate 101 can build the basic frame that a inside was equipped with the culinary art box 10 in holding chamber, and the concrete mode of building can be for welding, bolted connection, riveting or bonding etc. any mode that can realize mutual fixed connection between heat-resisting substrate 101. The containing cavity can contain food to be cooked, and the containing cavity can be in the shape of a polyhedron or a rotator and the like, and is specifically determined according to the actual needs of a user.
S20: a heat insulating layer 102 is coated on the heat resistant substrate 101, wherein the heat insulating layer 102 is located on the inner surface of the accommodating cavity.
In particular, the thermal barrier layer 102 is a coating formed from a range of materials that can effectively conduct heat. One way of making the thermal barrier layer 102 is shown in fig. 5.
S201: and uniformly mixing the filler and the adhesive to prepare the heat insulation coating liquid, wherein the filler is at least one of glass hollow microspheres and aerogel powder.
Optionally, the thermal insulation layer 102 of the present application includes a filler and a binder, and the composition and function of the filler and the binder are as described above and will not be described herein again. The heat-insulating coating liquid is prepared by uniformly mixing the filler and the adhesive.
S202: the heat-shielding coating liquid is applied to the heat-resistant base material 101.
Further, the heat-insulating coating liquid is coated on the heat-resistant substrate 101 in the present application, and the coating manner may be various manners such as electrostatic spraying, dip coating, roll coating or blade coating, which can realize uniform distribution of the heat-insulating coating liquid on the heat-resistant substrate 101, so as to ensure that the heat-insulating coating liquid can be uniformly coated on the inner surface of the accommodating cavity, including one or more of the side surface, the rear surface, the top surface or the bottom surface of the accommodating cavity.
S203: the insulating coating liquid is cured to form the insulating layer 102.
On the basis of the above operation, the present application can form the thermal insulation layer 102 on the inner surface of the accommodating chamber by curing the thermal insulation coating liquid.
Specifically, the cooking box 10 coated with the thermal insulation coating liquid can be placed at 25-300 ℃ for drying for 10-600 minutes, the drying temperature can be specifically 25-50 ℃, 100-. Through the above-mentioned high-temperature drying operation, a thermal insulation layer 102 can be formed on the inner surface of the cooking chamber 10.
The drying temperature and the drying time are set in consideration of the composition of the heat-insulating coating liquid, so that the drying efficiency can be improved, the drying effect can be improved and the formation and adhesion of the heat-insulating layer 102 can be facilitated on the premise of avoiding the damage of the composition in the heat-insulating coating liquid due to overhigh temperature.
It should be noted that the curing method of the present invention is not limited to high temperature drying, and various curing methods such as convection heating curing or radiation curing can be used to cure the heat insulating coating liquid on the inner surface of the cooking box 10.
In summary, the heat insulation layer 102 may be formed on the surface of the cooking cavity 11 by selecting a suitable material, a suitable coating method, and a suitable curing manner, and the heat insulation layer 102 may reduce the heat absorbed by the cavity itself, so that more heat is transferred to the air in the cavity, thereby significantly increasing the temperature rise speed of the gas in the cooking cavity 11 and improving the energy efficiency of the cooking box 10.
S30: a soaking layer 103 is coated on the side of the heat insulating layer 102 facing away from the heat-resistant base material 101, wherein the soaking layer 103 constitutes the inner surface of the cooking cavity 11.
Specifically, the soaking layer 103 is a coating layer formed of a series of materials that can achieve uniform heat diffusion. Optionally, the thermal equalization layer 103 of the present application includes a heat conduction component, an adhesive component, a support component, and a solvent component, and the components and functions of the heat conduction component, the adhesive component, the support component, and the solvent component are as described above, and are not described herein again. Please refer to fig. 6 for one of the methods of fabricating the thermal equalization layer 103.
S301: the support component, the thermally conductive component, and the bonding component are mixed in the solvent component to make a soaking layer coating solution.
Alternatively, the present application mixes the support component, the heat conductive component, and the bonding component in the solvent component to prepare the coating liquid of the soaking layer 103, and coats the coating liquid of the soaking layer 103 on the thermal insulation layer 102.
S302: the soaking layer coating solution is coated on the thermal insulation layer 102.
Specifically, the coating solution of the soaking layer 103 may be applied by various methods such as electrostatic spraying, dip coating, roll coating or blade coating, which can achieve uniform distribution of the coating solution of the soaking layer 103 on the heat insulating layer 102, so that the soaking layer 103 forms the inner surface of the cooking cavity 11, including one or several surfaces of the side surface, the back surface, the top surface or the bottom surface of the cooking cavity 11.
S303: the soaking layer coating liquid is cured to form the soaking layer 103.
In addition to the above operation, the present application can form the uniform heat layer 103 on the heat insulating layer 102 by curing the coating liquid of the uniform heat layer 103.
Specifically, the cooking box 10 coated with the heat-equalizing layer 103 is firstly placed at normal temperature for airing for 20-40 minutes, wherein the airing temperature may be 10-20 ℃, 20-30 ℃, or 30-40 ℃, and the airing time may be 20-25 minutes, 30-35 minutes, or 35-40 minutes. And then, the dried cooking box body 10 needs to be placed in an environment of 30-120 ℃ for heating and drying, wherein the heating and drying temperature can be 30-50 ℃, 70-90 ℃ or 100-120 ℃ and the like. Finally, the oven-dried cooking box 10 is placed in an environment of 120-350 ℃ for oven-drying for 30-600 minutes, the oven-drying temperature can be 150 ℃, 200-250 ℃ or 300-350 ℃, and the oven-drying time can be 30-100 minutes, 200-300 minutes, 400-500 minutes or 500-600 minutes. Through the above operations of airing and drying, a uniform heat layer 103 can be formed on the side of the heat-insulating layer 102 away from the heat-resistant base material 101.
The temperature and time for airing and drying are set by considering the composition of the coating liquid of the uniform heat layer 103, so that the airing and drying efficiency can be improved, the airing and drying effect can be improved, and the formation and adhesion of the uniform heat layer 103 can be facilitated on the premise of avoiding the damage of the composition in the coating liquid of the uniform heat layer 103 caused by overhigh temperature.
It should be noted that the curing method in the present application may not be limited to high-temperature drying or normal-temperature airing, but may be various curing methods such as convection heating curing or radiation curing, which can cure the heat-equalizing layer 103 on the side of the heat-insulating layer 102 away from the heat-resistant base material 101.
In summary, the heat-insulating layer 102 can be formed with a heat-equalizing layer 103 on the side away from the heat-resistant substrate 101 by selecting appropriate materials, coating methods and curing methods. The heat equalizing layer 103 can quickly transfer local heat in the cooking cavity 11 to the whole surface, so that food in the cavity is heated more uniformly, and the cooking effect is improved. Meanwhile, the heat-equalizing layer 103 has an infrared radiation function, can convert heat into infrared band radiation energy and transfer the infrared band radiation energy to food in the cavity, and has the advantage that the infrared band radiation penetrating capacity is obviously higher than that of hot air, so that the cooking efficiency can be further improved by deepening the heat penetrating depth.
For example, the kitchen appliance 100 and the cooking chamber 10 thereof claimed in the present application may be implemented such that the kitchen appliance 100 includes the cooking chamber 10, the heating element 20, the air outlet 30 and the electronic control system. The heating member 20 is located in the cavity of the cooking chamber 10, and performs a thermal process on food in the cavity of the cooking chamber 10. The heating element 20 can be any one or more heating elements such as a metal heating element, a quartz heating element, a ceramic heating element or a semiconductor heating element, and the power can be between 10 and 3600 watts.
In addition, the cooking chamber 10 is further provided with an electronic control system, and the heating element 20 is connected with the electronic control system, so that the operation mode of the kitchen appliance 100 can be controlled under the control of the electronic control system.
Further, the cooking cabinet 10 specifically includes a heat-resistant base material 101, a heat insulating layer 102, and a heat equalizing layer 103.
The heat-resistant substrate 101 may be made of a metal substrate, ceramic, mica substrate, glass, or the like, and can withstand a high temperature of 100 degrees celsius or higher.
The thermal insulation layer 102 is composed of filler and adhesive. The filler can be glass hollow micro-beads or aerogel powder; the resin can be high temperature resistant epoxy resin or high temperature resistant organic silicon resin. Wherein the particle size of the glass hollow micro-bead or aerogel powder is between 10 nanometers and 30 micrometers; the filler accounts for 5-30% of the weight of the thermal insulation layer 102.
The soaking layer 103 includes a heat conductive component, an adhesive component, a support component, and a solvent component. The support component, the thermally conductive component, and the bonding component are uniformly distributed in the solvent component. The temperature resistance range of the uniform heating layer 103 is-30-480 ℃, and the heat conduction efficiency is 500-3000W/mK.
The heat conducting component material can be heat conducting copper powder, heat conducting aluminum powder, heat conducting graphene or a composition of any of the above substances. The grain diameter of the heat-conducting component grains is between 1 and 40 microns, and the weight of the heat-conducting component in the soaking layer 103 is between 1 and 21 percent.
The support component material can be ceramic particles, and the ceramic particles can further be one or more of boron nitride, aluminum oxide, aluminum nitride, silicon carbide, magnesia-alumina spinel powder, aluminum oxynitride, zirconium dioxide, quartz or zirconium diboride. The weight percentage of the supporting component in the soaking layer 103 is between 1 and 6 percent, and the grain diameter of the ceramic grains is between 10 nanometers and 20 micrometers.
The adhesive component mainly plays a role in structural adhesion, and can be high-temperature-resistant epoxy resin or high-temperature-resistant organic silicon resin. The weight percentage of the bonding component in the soaking layer 103 is between 0.5 and 1.8 percent.
The solvent component may be one or more of acetone, ethanol, ethylene glycol, isopropanol, ethyl acetate, N-methylpyrrolidone, and ethylene glycol butyl ether acetate.
For example, the present application claims a method for manufacturing a cooking chamber 10, which specifically includes:
in a first step, the heat-resistant base material 101 is molded and constitutes a base structure of the cavity of the cooking chamber 10.
Secondly, the heat insulation layer 102 is coated on one or more of the side surface, the rear surface, the top surface and the bottom surface of the heat-resistant substrate 101 on the inner side of the cavity of the cooking box 10 by electrostatic spraying, dip coating, roll coating or blade coating.
After the thermal insulation layer 102 is coated, the cooking box 10 needs to be dried at 25-300 ℃ for 10-600 minutes.
Thirdly, further coating the soaking layer 103 on the side of the heat-insulating layer 102 away from the heat-resistant base material 101 on the surface of the dried heat-insulating layer 102 by spraying, dip coating, roll coating or blade coating, so that the soaking layer 103 becomes the inner surface of the cooking box body 10, specifically, one or more of the side surface, the back surface, the top surface and the bottom surface.
The cooking box 10 coated with the heat equalizing layer 103 needs to be placed at room temperature for airing for 20-40 minutes, then placed in an environment of 30-120 ℃ for heating and drying, and finally dried in an environment of 120-350 ℃ for 30-600 minutes.
Wherein, the materials of each component are as described above, and are not described in detail herein. The cooking chamber 10 claimed in the present application is formed through the above steps. Further, the cooking box 10, the heating element 20 and the electronic control system formed by the above steps are assembled together to form the claimed kitchen appliance 100, such as a steam box, an oven, a steam oven or a micro-steam oven.
In this way, the kitchen appliance 100 and culinary art box 10 that this application obtained can be inside the cavity with the more reservation of the heat of cavity inside on the one hand, and the resistance of heat to temperature resistant substrate and the outside diffusion of cavity in the increase cavity to solve the problem such as the programming rate that exists such as traditional steam ager, oven, steaming oven and little steaming oven slow, the culinary art efficiency is lower, shorten cooking duration. On the other hand, can also transversely switch on other positions in the cavity fast with local heat, avoid causing the culinary art to eat material and be heated uneven scheduling problem emergence because of the too big difference in temperature of each point of the internal planes of culinary art box 10. In addition, kitchen appliance 100 and culinary art box 10 thereof of this application still have the infrared radiation function, can convert the heat into infrared wave band radiant energy and give food, and the penetration depth is darker, can further promote the culinary art efficiency of cavity.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.

Claims (16)

1. A cooking cabinet, characterized in that, the cooking cabinet is provided with a cooking chamber, the cooking cabinet includes:
a heat-resistant substrate;
a heat insulating layer laminated on the surface of the heat-resistant base material;
the heat-insulating layer is arranged on one side, away from the heat-resistant base material, of the heat-insulating layer in a laminated mode;
wherein the soaking layer constitutes an inner surface of the cooking cavity.
2. The cooking cabinet of claim 1, wherein the heat equalizing layer comprises a heat conductive component and a bonding component, and the heat conductive component and the bonding component are uniformly mixed.
3. The cooking oven of claim 2, wherein the thermally conductive component comprises at least one of thermally conductive copper powder, thermally conductive aluminum powder, and thermally conductive graphene;
the particle size of the heat-conducting component is in the range of 1-40 microns, and the weight proportion of the heat-conducting component in the heat-equalizing layer is in the range of 1-21%.
4. The cooking chamber of claim 2, wherein the adhesive component is a high temperature epoxy resin or a high temperature silicone resin, and the weight ratio of the adhesive component in the heat equalizing layer is in a range of 0.5% to 1.8%.
5. The cooking cabinet of claim 2, wherein the heat equalizing layer further comprises a support component, the heat conductive component and the bonding component are uniformly mixed, wherein the support component has a hardness greater than that of the heat conductive component.
6. The cooking cabinet according to claim 5, wherein the support component is ceramic particles or glass particles;
the particle size of the support component is in the range of 10 nanometers to 20 micrometers, and the weight proportion of the support component in the heat equalizing layer is in the range of 1% to 6%.
7. The cooking cabinet as claimed in claim 5, wherein the heat equalizing layer further comprises a solvent component in which the support component, the heat conductive component and the adhesive component are uniformly distributed;
wherein the solvent component comprises at least one of acetone, ethanol, ethylene glycol, isopropanol, ethyl acetate, N-methyl pyrrolidone and ethylene glycol butyl ether acetate.
8. The cooking cabinet of claim 1, wherein the heat insulation layer comprises a filler and a binder, the filler and the binder are uniformly mixed, and the filler is at least one of glass cenospheres and aerogel powder.
9. The cooking cabinet according to claim 8, wherein the filler has a particle size in a range of 10 nm to 30 μm, and the filler is contained in the heat insulating layer in a range of 5% to 30% by weight; the adhesive is high-temperature-resistant epoxy resin or high-temperature-resistant organic silicon resin.
10. The cooking cabinet of claim 1, wherein the heat-resistant substrate is one of a metal substrate, a ceramic substrate, a mica substrate, and a glass substrate.
11. A kitchen appliance comprising a heating element, a vent element and a cooking chamber as claimed in any one of claims 1 to 10, the heating element and the vent element being disposed in the cooking chamber, the vent element driving an airflow through the heating element and within the cooking chamber.
12. A method for manufacturing a cooking chamber, characterized in that it is provided with a cooking cavity, comprising:
providing a heat-resistant base material, wherein the heat-resistant base material is provided with an accommodating cavity;
coating a heat-insulating layer on the heat-resistant base material, wherein the heat-insulating layer is positioned on the inner surface of the accommodating cavity;
and coating a heat equalizing layer on one side of the heat insulating layer, which is far away from the heat-resistant substrate, wherein the heat equalizing layer forms the inner surface of the cooking cavity.
13. The method of claim 12, wherein the step of applying a thermal spreader layer to a side of the thermal insulation layer facing away from the heat-resistant substrate comprises:
mixing the support component, the heat conducting component and the bonding component in the solvent component to prepare a soaking layer coating solution;
coating the heat-insulating layer with the heat-homogenizing layer coating liquid;
and curing the soaking layer coating solution to form the soaking layer.
14. The method of claim 13, wherein the thermally conductive component comprises at least one of thermally conductive copper powder, thermally conductive aluminum powder, and thermally conductive graphene; the particle size of the heat-conducting component is in the range of 1-40 microns, and the weight proportion of the heat-conducting component in the heat-equalizing layer is in the range of 1-21%;
the support component is ceramic particles or glass particles; the particle size of the support component is in the range of 10 nanometers to 20 micrometers, and the weight proportion of the support component in the heat equalizing layer is in the range of 1% to 6%;
the bonding component is high-temperature-resistant epoxy resin or high-temperature-resistant organic silicon resin, and the weight ratio of the bonding component in the heat-equalizing layer is within the range of 0.5-1.8%;
the solvent component comprises at least one of acetone, ethanol, ethylene glycol, isopropanol, ethyl acetate, N-methyl pyrrolidone and ethylene glycol butyl ether acetate.
15. The method of claim 12, wherein the step of coating the heat-resistant substrate with a thermal insulation layer comprises:
uniformly mixing a filler and a bonding agent to prepare a heat insulation coating liquid, wherein the filler is at least one of glass hollow microspheres and aerogel powder;
coating the heat-insulating masking liquid on the heat-resistant base material;
and curing the heat insulation masking liquid to form the heat insulation layer.
16. The method of claim 15, wherein the filler has a particle size in a range of 10 nm to 30 μm, and the filler is present in the thermal insulation layer in an amount in a range of 5% to 30% by weight; the adhesive is high-temperature-resistant epoxy resin or high-temperature-resistant organic silicon resin.
CN202210034357.6A 2022-01-12 2022-01-12 Kitchen appliance, cooking box and manufacturing method thereof Active CN114532868B (en)

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