CN114530733A - Differential signal connector assembly for realizing vertical interconnection between printed boards - Google Patents

Differential signal connector assembly for realizing vertical interconnection between printed boards Download PDF

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Publication number
CN114530733A
CN114530733A CN202210101826.1A CN202210101826A CN114530733A CN 114530733 A CN114530733 A CN 114530733A CN 202210101826 A CN202210101826 A CN 202210101826A CN 114530733 A CN114530733 A CN 114530733A
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China
Prior art keywords
signal
connector
differential signal
module
contact
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CN202210101826.1A
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Chinese (zh)
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CN114530733B (en
Inventor
马陆飞
周国奇
金晓光
袁俊峰
张爽
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China Aviation Optical Electrical Technology Co Ltd
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China Aviation Optical Electrical Technology Co Ltd
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Publication of CN114530733A publication Critical patent/CN114530733A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure

Abstract

The invention relates to a differential signal connector assembly for realizing vertical interconnection between printed boards, which comprises a first connector and a second connector, wherein the two connectors respectively comprise a shell and at least two differential signal modules, and each differential signal module comprises a module insulator, signal pairs distributed at intervals and a shielding sheet; when the connectors are plugged, the shielding sheets of the first connector and the second connector are in contact conduction to form a cavity, and adjacent signals in the same cavity do not shield the plug-in terminal contacts; the thickness direction of the plug end contact of the signal pair in the first connector is consistent with that of the differential signal module, and the thickness direction of the plug end contact of the signal pair in the second connector is vertical to that of the differential signal module; the single contact of the signal opposite plugging end of one of the two connectors is a pin, and the single contact of the signal opposite plugging end of the other connector is a clip for clamping the pin. The invention simplifies the structure of the plug-in terminal, realizes double-side clamping contact between single contacts and ensures reliable contact.

Description

Differential signal connector assembly for realizing vertical interconnection between printed boards
Technical Field
The invention belongs to the technical field of high-speed connectors, and particularly relates to a differential signal connector assembly for realizing vertical interconnection between printed boards.
Background
The differential signal connector includes a housing and differential signal modules mounted in the housing in a stacked manner, the differential signal modules including module insulators and contacts enclosed in the module insulators, the contacts being arranged in pairs and forming signal pairs. Differential signal connectors are widely used in high-speed signal transmission applications.
The differential signal module of the existing differential signal connector comprises a signal pair and a grounding contact element, particularly at the insertion end of the connector, the insertion contact position of the signal pair is generally in the material thickness direction, the signal pair contact needs to be bent in order to ensure the contact position, and in order to ensure the anti-crosstalk performance between the signal pair, the contact position of the signal pair is usually surrounded by a surrounding type shielding structure, so that the structure is complex. In addition, the position of the ground pin or the ground shield needs to be considered when the differential signal connector is plugged, so that the structure is complicated, the assembly of the differential signal connector is difficult, and the overall size is large.
In addition, in the existing differential signal connector assembly, the signal pair contact at one end is generally designed into a jack structure at the plugging position, the signal pair contact at the other end is designed into a pin structure, only one side of the single contact is contacted, and the condition that one contact fails to contact can occur under the vibration environment.
Disclosure of Invention
The invention aims to provide a differential signal connector assembly for realizing vertical interconnection between printed boards, which is used for solving the technical problems of complex structure, large volume and contact failure of contacts of the conventional differential signal connector assembly at a plugging end.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The differential signal connector assembly comprises a first connector and a second connector which are matched and inserted, wherein the first connector and the second connector respectively comprise a shell and at least two differential signal modules assembled in the shell, each differential signal module comprises a module insulator, at least two signal pairs distributed at intervals and a shielding sheet, and the shielding sheet is positioned on the vertical side of the module insulator in the arrangement direction of the signal pairs and used for shielding the signal pairs of the adjacent differential signal modules; when the connectors are plugged, the shielding plates of the first connector and the second connector are in contact conduction to form a cavity, adjacent signal pairs in the same cavity are not shielded between the plug-in end contacts, and at the moment, the distance L2 between the plug-in end contacts of two signal contacts forming one signal pair, the distance L1 between each plug-in end contact of the signal contact and the shielding plates on two sides and the distance L0 between the plug-in end contacts of the adjacent signal pairs meet the requirements that the L1 is more than or equal to 0.2mm and less than or equal to 0.4mm, the L0 is more than or equal to 3mm and less than or equal to 4.5mm, and the material thickness of the signal contact is more than or equal to L2 and less than or equal to 2 times of the material width of the signal contact; the thickness direction of the plug end contact of the signal pair in the first connector is consistent with that of the differential signal module, and the thickness direction of the plug end contact of the signal pair in the second connector is vertical to that of the differential signal module; the single contact of the signal pair plugging end of one of the first connector and the second connector is a contact pin, and the single contact of the signal pair plugging end of the other connector is a clip for clamping the contact pin.
The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
Preferably, the adjacent signal pairs in the same differential signal module are not shielded between the contact terminals of the crimping end and between the wiring portions positioned between the two contact terminals, and the wiring portions of the adjacent signal pairs are filled with insulating media, so that the shielding of the single differential signal module is integrally positioned at two sides of the signal pair, and the signal pair is not shielded, so that the structure of the differential signal module is simpler.
Preferably, a single contact of the signal pair plugging end of the first connector is a clip, a signal pair of the second connector is bent by 90 degrees at the plugging end to form two pin-shaped contacts with the thickness direction perpendicular to the thickness direction of the differential signal module, and at this time, the first connector and the second connector can realize the perpendicular interconnection between the two printed boards.
Preferably, the signal pairs of the second connector are bent in opposite directions when the plugging end is bent to form two contacts.
Preferably, the signal pair of at least one differential signal module in the first connector and the second connector is provided with shielding plates on two sides perpendicular to the arrangement direction.
Preferably, the signal pair of at least one differential signal module in the first connector and the second connector is provided with a shielding plate only on one side perpendicular to the arrangement direction.
Preferably, adjacent signal pairs of at least one pair of adjacent differential signal modules in the first connector and the second connector are arranged in a staggered manner in the arrangement direction of the differential signal modules, so as to reduce the influence between the adjacent signal pairs in the arrangement direction of the differential signal modules.
Preferably, an insulating or conductive medium between the shielding plates is disposed between at least one pair of adjacent differential signal modules in each of the first connector and the second connector, so as to enhance the shielding effect between the adjacent differential signal modules.
Preferably, the contacts of the adjacent signal pair crimping ends of at least one differential signal module in the first connector and the second connector tilt to different sides of the module, so that the contact surfaces of the adjacent signal pair crimping ends face in different directions, and the crimping reliability is ensured.
Preferably, at least one pair of adjacent differential signal modules in each of the first connector and the second connector is free of any medium therebetween.
Preferably, the first connector and the second connector are plugged to realize orthogonal interconnection of the two printed boards.
Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the invention can achieve considerable technical progress and practicability, has wide industrial utilization value and at least has the following advantages:
according to the differential signal connector assembly, the shielding parts are not arranged between the signal pairs of the same differential signal module in the differential signal connector assembly which is vertically interconnected among printed boards, so that the signal pairs are not shielded from input to output, the arrangement of the grounding shielding parts at the plugging ends is not required to be considered, the structure of the plugging ends of the differential signal modules is simplified, the volume of the differential signal connector is reduced, the miniaturization of the differential connector is realized, the difficulty of subsequent assembly is reduced due to the simplification of the shielding structures in the differential signal modules, and the technical problems of large volume and difficult assembly of the differential signal connector caused by the fact that the structure of the plugging parts of the differential signal modules is complicated at present are solved.
In addition, the connector assembly realizes double-side clamping contact between the single contacts through the matching of the clip formed by the single contacts and the contact pin when the connector assembly is plugged, and ensures reliable contact between the contacts in a vibration environment.
Finally, the signal pair of the differential signal connector assembly is conducted at the contact of the plug end in the contact thickness direction and the contact width direction, so that bending in the material thickness direction is omitted, the processing procedure is reduced, and the processing cost is reduced.
Drawings
Fig. 1 is a schematic structural view of a differential signal connector in embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a differential signal module in embodiment 1 of the present invention;
fig. 3 is a sectional view of a differential signal module according to embodiment 1 of the present invention;
FIG. 4 is a schematic diagram of the structure of the signal pair and the module insulator and the shielding plate in embodiment 1 of the present invention;
fig. 5 is a schematic structural view of a crimp terminal on a signal contact in embodiment 1 of the present invention;
fig. 6 is a sectional view of two signal modules assembled in embodiment 1 of the present invention;
fig. 7 is a schematic structural view of a crimp terminal on a signal contact in embodiment 2 of the present invention;
fig. 8 is a schematic structural diagram of two signal modules after being assembled in embodiment 2 of the present invention;
fig. 9 is a schematic structural view of a crimp terminal on a signal contact in embodiment 3 of the present invention;
fig. 10 is a sectional view of two signal modules assembled in embodiment 3 of the present invention;
fig. 11 is a schematic structural view of a crimp terminal on a signal contact in embodiment 4 of the present invention;
fig. 12 is a sectional view of two signal modules assembled in embodiment 5 of the present invention;
fig. 13 is a schematic structural view of a crimp terminal on a signal contact in embodiment 5 of the present invention;
fig. 14 is a schematic structural view of a crimp terminal on a signal contact in embodiment 6 of the present invention;
fig. 15 is a schematic structural view of a crimp terminal on a signal contact in embodiment 7 of the present invention;
fig. 16 is a sectional view of two signal modules of embodiment 7 after assembly;
fig. 17 is a schematic structural view of a crimp terminal on a signal contact in embodiment 8 of the present invention;
fig. 18 is a sectional view of a differential signal module in embodiment 11 of the present invention;
fig. 19 is a schematic view of the signal pair and module insulator, shield plate in embodiment 11 of the present invention;
FIG. 20 is a schematic view showing the structure of a crimp terminal on a signal contact in example 11 of the present invention;
fig. 21 is a sectional view of two signal modules assembled in embodiment 11 of the present invention;
fig. 22 is a structural view of two signal modules after being assembled in embodiment 11 of the present invention;
fig. 23 is a schematic structural view of a crimp terminal on a signal contact in embodiment 12 of the present invention;
fig. 24 is an assembled structural schematic view of two signal modules in embodiment 12 of the present invention;
FIG. 25 is a schematic view showing the structure of a crimp terminal on a signal contact in example 13 of the present invention;
fig. 26 is a sectional view of two signal modules assembled in embodiment 13 of the present invention;
fig. 27 is a schematic structural view of a crimp terminal on a signal contact in example 14 of the present invention;
fig. 28 is a sectional view of two signal modules assembled in embodiment 15 of the present invention;
fig. 29 is a schematic structural view of a crimp terminal on a signal contact in embodiment 15 of the present invention;
FIG. 30 is a schematic view showing the structure of a crimp terminal on a signal contact in example 16 of the present invention;
FIG. 31 is a schematic view showing the structure of a crimp terminal on a signal contact in example 17 of the present invention;
fig. 32 is an assembled cross-sectional view of two signal modules in embodiment 17 of the present invention;
FIG. 33 is a schematic view showing the structure of a crimp terminal on a signal contact in example 18 of the present invention;
fig. 34 is a schematic diagram of the components of a differential signal connector assembly according to embodiment 19 of the present invention;
fig. 35 is a schematic view of a differential signal connector assembly according to embodiment 19 of the present invention in a plugged state;
fig. 36 is a cross-sectional view of a mating section of a differential signal connector assembly according to embodiment 19 of the present invention;
fig. 37 is an enlarged view of a portion of the mating field of the differential signal connector assembly of example 19 of the present invention;
fig. 38 is a schematic view of a differential signal connector assembly mating structure according to embodiment 19 of the present invention;
fig. 39 is a second schematic view of a plug-in structure of the differential signal connector assembly according to the embodiment 19 of the present invention;
fig. 40 is a schematic diagram of a differential signal connector assembly plugging structure according to an embodiment 19 of the present invention;
fig. 41 is a fourth schematic view of a differential signal connector assembly plugging structure according to embodiment 19 of the present invention;
fig. 42 is a fifth schematic view of a plug-in structure of a differential signal connector assembly according to an embodiment 19 of the present invention;
fig. 43 is a sixth schematic view of a differential signal connector assembly mating structure according to embodiment 19 of the present invention;
fig. 44 is a cross-sectional view of a mating section of a differential signal connector assembly in accordance with embodiment 20 of the present invention;
fig. 45 is an enlarged view of a portion of the mating section of a differential signal connector assembly in accordance with embodiment 20 of the present invention;
fig. 46 is a schematic view of a differential signal connector assembly of embodiment 20 of the present invention;
fig. 47 is a schematic view of a differential signal connector assembly according to embodiment 21 of the present invention;
fig. 48 is a plug-in schematic view of a differential signal connector assembly according to embodiment 23 of the present invention;
FIG. 49 is a graph of crosstalk simulation for comparative example 1 when shielding is placed on both sides of a module of the present invention;
FIG. 50 is a graph of crosstalk simulation for comparative example 2 when the module of the present invention is double-sided shielded;
FIG. 51 is a graph of crosstalk simulations of comparative example 3 with shielding on both sides of a module of the present invention;
FIG. 52 is a graph of crosstalk simulation for comparative example 4 when shielding is placed on both sides of a module of the present invention;
FIG. 53 is a cross-talk simulation of comparative example 5 when the module of the present invention is double-sided shielded;
FIG. 54 is a graph of crosstalk simulations of comparative example 6 with a module of the present invention shielded on both sides;
FIG. 55 is a graph of crosstalk simulations of comparative example 7 with shielding on both sides of a module of the present invention;
FIG. 56 is a graph of crosstalk simulation for comparative example 8 when the module of the present invention is double-sided shielded;
FIG. 57 is a crosstalk simulation diagram of Effect example 1 when shielding is provided on both sides of a module according to the present invention;
FIG. 58 is a cross-talk simulation diagram of Effect example 2 when shielding is provided on both sides of a module according to the present invention;
FIG. 59 is a cross-talk simulation diagram of Effect example 3 when shielding is provided on both sides of a module according to the present invention;
FIG. 60 is a cross-talk simulation diagram of effect example 4 when the module of the present invention is shielded on both sides;
FIG. 61 is a cross-talk simulation diagram of effect example 5 when the module of the present invention is shielded on both sides;
FIG. 62 is a cross-talk simulation diagram of effect example 6 when shielding is provided on both sides of a module according to the present invention;
FIG. 63 is a cross-talk simulation chart of effect example 7 when shielding is provided on both sides of the module according to the present invention;
FIG. 64 is a cross-talk simulation diagram of effect example 8 when shielding is provided on both sides of the module of the present invention;
FIG. 65 is a cross-talk simulation of comparative example 1 with shielding on one side of the module of the present invention;
FIG. 66 is a cross-talk simulation of comparative example 2 with shielding on one side of the module of the present invention;
FIG. 67 is a graph of crosstalk simulation for comparative example 3 with shielding on one side of a module of the present invention;
FIG. 68 is a cross-talk simulation of comparative example 4 with the single side of the module of the present invention shielded;
FIG. 69 is a graph of crosstalk simulation for comparative example 5 with shielding on one side of a module of the present invention;
FIG. 70 is a cross-talk simulation of comparative example 6 with shielding on one side of a module of the present invention;
FIG. 71 is a cross-talk simulation of comparative example 7 with shielding on one side of the inventive module;
FIG. 72 is a graph of crosstalk simulation for comparative example 8 with shielding on one side of a module of the present invention;
FIG. 73 is a cross-talk simulation of comparative example 9 with shielding on one side of a module of the present invention;
FIG. 74 is a crosstalk simulation diagram of Effect example 1 when a shield is provided on one side of a module according to the present invention;
FIG. 75 is a crosstalk simulation diagram of Effect example 2 when a shield is provided on one side of a module according to the present invention;
FIG. 76 is a crosstalk simulation diagram of Effect example 3 when a shield is provided on one side of a module according to the present invention;
FIG. 77 is a crosstalk simulation diagram of effect example 4 when a module of the present invention is provided with a shield on one side;
FIG. 78 is a crosstalk simulation diagram of effect example 5 when a shield is provided on one side of the module according to the present invention;
FIG. 79 is a crosstalk simulation diagram of Effect example 6 when a shield is provided on one side of a module according to the present invention;
FIG. 80 is a crosstalk simulation diagram of Effect example 7 in the case where a shield is provided on one side of a module according to the present invention;
fig. 81 is a crosstalk simulation diagram of effect example 8 in the case where a shield is provided on one side of the module according to the present invention.
[ description of main element symbols ]
1-shell 2-differential signal module 21-modular insulator 22-signal pair
221-signal contact 2211-conductive contact surface 2212-horizontal bend 2213-first contact
2214-90 degree bend 2215-second contact 222-first signal pair 223-second signal pair
23-shield plate 3-inter-shield plate Medium 4-first connector 5-second connector
6-insertion zone 7-first printed board 8-second printed board 9-air cavity
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be given of specific embodiments, structures, features and effects of the differential signal connector assembly for realizing vertical interconnection between printed boards according to the present invention with reference to the accompanying drawings and preferred embodiments.
The differential signal connector assembly for realizing vertical interconnection between printed boards comprises two oppositely inserted differential signal connectors, and the differential signal connectors are introduced firstly.
Example 1
As shown in fig. 1 to 6, the differential signal connector of the present invention includes a housing 1 and differential signal modules 2 stacked and mounted on the housing 1, and in the present embodiment, the differential signal modules 2 are provided in eight numbers, but the present invention is not limited thereto.
The differential signal module 2 includes a module insulator 21, signal pairs 22 and a shielding plate 23, one differential signal module 2 includes four signal pairs 22, each signal pair 22 includes two signal contacts 221, the line width of the signal contact 221 is W, the material thickness is H, each signal contact 221 is embedded in the module insulator 21, and the signal contact 221 in this embodiment is a bent contact. In this embodiment, the distances between the two signal contacts 221 of each signal pair 22 are all equal and are always L2. The module insulator 21 has a plate shape, and the differential signal modules 2 are arranged in parallel on the housing 1. The arrangement direction of the plurality of differential signal modules 2 is perpendicular to the arrangement direction of the signal pairs 22 on the same differential signal module 2. Between adjacent differential signal modules 2, there is an inter-shield-plate medium 3 having a thickness of L3, and the inter-shield-plate medium 3 is an insulating medium or a conductive medium. In this embodiment, the inter-shield-sheet medium 3 is an insulating medium of the same material as the module insulator 21. In other embodiments, when the inter-shield dielectric is an insulating dielectric, the material of the inter-shield dielectric may be different from that of the module insulator; the inter-shield dielectric may also be air. When the inter-shield-sheet medium 3 is solid, the presence of the inter-shield-sheet medium can effectively prevent deformation of the differential signal module 2.
In the present embodiment, two shielding plates 23 are disposed in the same differential signal module 2, and the two shielding plates 23 are disposed on two opposite sides of the module insulator 21 perpendicular to the arrangement direction of the signal pairs 22, and are used for shielding the signal pairs 22 on the adjacent differential signal modules. The shield blades 23 in the same differential signal module are spaced a vertical distance L1 from the signal contacts 221 in each signal pair 22, i.e., each signal contact in the same differential signal module is located on the center axis of the module insulator.
In this embodiment, there is no shielding between the signal pairs 22 of the same differential signal module 2, and the signal pairs 22 include a crimping end contact, a trace portion, and a plugging end contact, where the trace portion of the adjacent signal pairs 22 is completely filled with an insulating medium, and the crimping end contact and the plugging end contact are filled with an air medium.
In this embodiment, the insulating medium between the trace portions of adjacent signal pairs 22 is formed by a portion of the module insulator 21, and the distance between adjacent signal pairs 22 in the same differential signal module 2 is constant at L0 without shielding. The differential signal module 2 is not provided with the grounding shielding piece, the arrangement position of the grounding shielding piece at the plug-in end of the differential connector does not need to be considered, the structure of the differential connector is greatly simplified, and the volume of the differential connector is reduced. At this time, the vertical distance L1 between the shielding plate 23 and the signal contact satisfies 0.2mm ≤ L1 ≤ 0.4mm, the distance L2 between two signal contacts in the same signal pair 22 satisfies H ≤ L2 ≤ 2W, and the distance L0 between adjacent signal pairs 22 in the same differential signal module 2 satisfies 3mm ≤ L0 ≤ 4.5 mm.
In this embodiment, the crimp terminal contacts of the signal contacts have conductive contact surfaces 2211 for contacting the circuit board, and in this embodiment, the conductive contact surfaces 2211 on the same differential signal module are oriented in the same direction.
In this embodiment, the center lines of the signal pairs 22 in the same differential signal module 2 are on the same plane; in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module 2 is arranged opposite to the adjacent signal pair 22 on the other differential signal module 2 in the arrangement direction of the two differential signal modules, that is, in the arrangement direction of the differential signal modules 2, the central lines of the corresponding signal pairs 22 on the adjacent differential signal modules are in one-to-one correspondence, and there is no deviation.
According to the invention, complete shielding can be formed on two sides of the signal pair 22 in the differential signal module 2 through the shielding mode, so that interference between adjacent differential signal modules is avoided, and a better shielding effect is achieved. The adjacent differential signal pairs 22 of the same differential signal module have no shielding structure, so that the design of the insertion end of a product can be more flexible, and the miniaturization of the product is realized. The signal pair 22 in this embodiment is fixed to the insulator by injection molding, which facilitates injection molding by eliminating the grounding shield.
Example 2
The structure of the differential signal connector in the present embodiment is different from that in embodiment 1 only in that: as shown in fig. 8 and 7, in the same differential signal module 2, the crimp end contacts of adjacent signal pairs 22 are tilted to different sides of the differential signal module, so that the conductive contact surfaces 2211 on the crimp end contacts of the signal contacts of the adjacent signal pairs 22 are oppositely oriented, and the contact effect of the crimp ends in a vibration environment is ensured.
Example 3
The structure of the differential signal connector in this embodiment is different from that in embodiment 2 only in that: as shown in fig. 10 and 9, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged in a staggered manner with respect to the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the staggered distance L4 in the arrangement direction of the differential signal modules of the adjacent signal pairs of the two adjacent differential signal modules is 1mm to 1.5mm, in this embodiment, the L4 is 1 mm. That is, in the arrangement direction of the differential signal modules 2, there is a deviation of 1mm between the center lines of the corresponding signal pairs 22 on the adjacent differential signal modules 2, thereby reducing the influence between the adjacent signal pairs on the adjacent differential signal modules.
Example 4
The structure of the differential signal connector in the present embodiment is different from that in embodiment 1 only in that: as shown in fig. 11, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged to be staggered from the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the staggered distance L4 is 1.25mm in this embodiment.
Example 5
The structure of the differential signal connector in the present embodiment is different from that in embodiment 1 only in that: the adjacent differential signal modules 2 share one shielding plate, and no medium exists between the shielding plates. As shown in fig. 13 and 12, in the eight differential signal modules 2 in this embodiment, one differential signal module 2 is a double-shielding-plate signal module, the double-shielding-plate signal module is located at an end in the arrangement direction of the differential signal modules 2, the other differential signal modules are single-shielding-plate signal modules, the shielding plate 23 is fixed on one side of the module insulator 21, and when the differential signal modules are stacked, one shielding plate 23 is shared between the signal pairs 22 of two adjacent differential signal modules 2. In other embodiments, each differential signal module may also be provided with only one shielding plate, and the differential signal module may be assembled with only one shielding plate.
Example 6
The structure of the differential signal connector in the present embodiment is different from that in embodiment 5 only in that: as shown in fig. 14, in the same differential signal module 2, the conductive contact surfaces 2211 on the signal contacts 221 of adjacent signal pairs 22 face oppositely and are located on two sides of the central axis of the module. In this embodiment, the crimp end contacts of the signal contacts of adjacent signal pairs are tilted to different sides of the differential signal module.
Example 7
The structure of the differential signal connector in this embodiment is different from that in embodiment 5 only in that: as shown in fig. 16 and 15, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged to be offset from the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the offset distance L4 is 1.5mm in this embodiment.
Example 8
The structure of the differential signal connector in this embodiment is different from that in embodiment 6 only in that: as shown in fig. 17, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged to be offset from the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the offset distance L4 is 1.5mm in this embodiment.
Example 9
The structure of the differential signal connector in this embodiment differs from the above-described embodiments only in that: adjacent signal pairs of the same differential signal module are filled with module insulation and air.
Example 10
The structure of the differential signal connector in this embodiment differs from the above-described embodiments only in that: the signal contacts are direct contacts.
Example 11
The structure of the differential signal connector in the present embodiment is different from that in embodiment 1 only in that: as shown in fig. 18 to 22, in the differential signal module 2 of the present embodiment, only one shielding plate 23 is disposed on one side of the module insulator, and after a plurality of differential signal modules are stacked on the housing, one shielding plate is mounted on the other side of the differential signal module located at the end, at this time, the vertical distance L1 between the shielding plate 23 and the signal contact satisfies 0.2mm ≦ L1 ≦ 0.4mm, the distance L2 between two signal contacts in the same signal pair 22 satisfies H ≦ L2 ≦ 2W, and in the same differential signal module 2, the distance L0 between adjacent signal pairs 22 satisfies 3mm ≦ L0 ≦ 4.5 mm.
Example 12
The structure of the differential signal connector in this embodiment is different from that in embodiment 11 only in that: as shown in fig. 24 and 23, in the same differential signal module 2, the conductive contact surfaces 2211 on the signal contacts 221 of adjacent signal pairs 22 face in opposite directions. In this embodiment, the crimp end contacts of the signal contacts of adjacent signal pairs are tilted to different sides of the differential signal module.
Example 13
The structure of the differential signal connector in this embodiment is different from that in embodiment 12 only in that: as shown in fig. 26 and 25, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged to be staggered from the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the staggered distance L4 in the arrangement direction of the differential signal modules of the adjacent signal pairs of the two adjacent differential signal modules is 1mm to 1.5mm, in this embodiment, the L4 is 1 mm.
Example 14
The structure of the differential signal connector in this embodiment is different from that in embodiment 11 only in that: as shown in fig. 27, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged to be staggered from the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the staggered distance L4 in the arrangement direction of the differential signal modules between the adjacent signal pairs of the two adjacent differential signal modules is 1.5 mm.
Example 15
The structure of the differential signal connector in the present embodiment is different from that in embodiment 11 only in that: as shown in fig. 29 and 28, there is no inter-shield-plate medium between two adjacent differential signal modules in this embodiment, that is, two adjacent differential signal modules 2 share one shield plate 23, and except for one differential signal module 2 at the end, only one side of the other differential signal modules is provided with the shield plate 23.
Example 16
The structure of the differential signal connector in this embodiment is different from that in embodiment 15 only in that: as shown in fig. 30, in the same differential signal module 2, the conductive contact surfaces 2211 on the signal contacts 221 of adjacent signal pairs 22 face in opposite directions. In this embodiment, the crimp end contacts of the signal contacts of adjacent signal pairs are tilted to different sides of the differential signal module.
Example 17
The structure of the differential signal connector in this embodiment is different from that in embodiment 15 only in that: as shown in fig. 32 and 31, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged to be staggered from the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the staggered distance L4 in the arrangement direction of the differential signal modules of the adjacent signal pairs of the two adjacent differential signal modules is 1.25 mm.
Example 18
The structure of the differential signal connector in this embodiment is different from that in embodiment 16 only in that: as shown in fig. 33, in two adjacent differential signal modules 2, the signal pair 22 on one differential signal module is arranged to be staggered from the adjacent signal pair 22 on the other differential signal module in the arrangement direction of the two differential signal modules, and the staggered distance L4 in the arrangement direction of the differential signal modules between the adjacent signal pairs of the two adjacent differential signal modules is 1.25 mm.
Example 19
The differential signal connector assembly in this embodiment includes a first connector 4 and a second connector 5 that are adapted to be inserted, the first connector 4 may be the differential signal connector described in any one of embodiments 1 to 8 and 11 to 18, and the second connector 5 is different from the differential signal connectors described in embodiments 1 to 8 and 11 to 18 in that: the signal contacts in the second connector are direct contacts; because no shielding structure is arranged between the adjacent signal pairs in the same differential signal module in the first connector 4 and the second connector 5, when the first connector 4 and the second connector 5 are plugged, the shielding sheets of the corresponding differential signal modules are contacted with each other to form a plugging area shielding cavity, the plugging end contacts of the signal pairs in the corresponding differential signal modules are contacted and conducted in the plugging area shielding cavity, and the plugging end contacts of the adjacent signal pairs are not shielded.
The first connector 4 and the second connector 5 of the present embodiment also have the following features at the mating end: as shown in fig. 34-43, the signal pair in the first connector 4 is defined as a first signal pair 222, the plug terminal contact of the first signal pair 222 has a material thickness H1 and a width W1, and the distance between two adjacent plug terminal contacts is D1; the signal pair in the second connector 5 is a second signal pair 223, the plug terminal contact of the second signal pair 223 has a thickness H2 and a width W1, and the distance between two adjacent plug terminal contacts is D2; the thickness direction of the plug terminal contact of the first signal pair 222 is the same as the thickness direction of the differential signal module, and the thickness direction of the plug terminal contact of the second signal pair 223 is perpendicular to the thickness direction of the differential signal module, so that the wall surfaces of the first signal pair in the thickness direction are in contact conduction with the wall surfaces of the second signal pair in the width direction.
In this embodiment, the distance D1 between the two mating end contacts of the first signal pair is smaller than the distance D2 between the two mating end contacts of the second signal pair, so that the contacts of the second signal pair 223 are entirely located outside the contacts of the first signal pair 222 when the first connector 4 and the second connector 5 are mated, and the mating end contacts of the first signal pair 222 are clamped, thereby achieving reliable contact between the two mating ends.
In this embodiment, the specific mating structure of the mating terminal contact of the second signal pair 223 and the mating terminal contact of the first signal pair 222 includes the following:
in the first structure, as shown in fig. 38, the first signal pair 222 is not bent at the mating region, and both mating end contacts protrude outward in a direction perpendicular to the material thickness to form a first contact 2213; the two mating end contacts of the second signal pair 223 form a clamping cavity for clamping the first signal pair 222, and the width of the clamping cavity is smaller than the width of the first signal pair 222 at the position where the first contact 2213 is arranged, so that reliable contact of the signal pairs in the first connector and the second connector is realized. The root of the plug terminal contact of the second signal pair 223 is designed with a horizontal bending structure 2212 to meet the width requirement and the packaging requirement of the clamping cavity.
The inner sides of the front ends of the two plug end contacts of the second signal pair 223 are also bent to form a second contact 2215, and the second contact 2215 can be in contact with the wall surface of the plug end contact of the first signal pair along the thickness direction, so that the contact reliability between the two plug ends is enhanced.
In the second structure, as shown in fig. 39, the two mating end contacts of the first signal pair are not bent in the mating region, and a first contact 2213 is formed protruding in the direction perpendicular to the material thickness, and the two first contacts 2213 on the same signal pair are distributed in an opposite manner; the two mating end contacts of the second signal pair 223 are straight pins, the two straight pins of the second signal pair form a clamping cavity for the first signal pair to be inserted into, and the first contact 2213 is arranged to ensure reliable contact between the two mating end contacts.
In a third structure, as shown in fig. 40, the two mating end contacts of the first signal pair are not bent in the mating region, and a first contact 2213 is formed by protruding in a direction perpendicular to the material thickness, and the two first contacts 2213 on the same signal pair are distributed in an opposite manner; the material thickness direction of the plug end contact of the second signal pair 223 is perpendicular to the thickness direction of the differential signal module, the material thickness direction of other parts of the second signal pair is consistent with the thickness direction of the differential signal module, the plug end contact of the second signal pair 223 is formed by bending the root part of the plug end contact by 90 degrees, and the two bent plug end contacts form a jack structure for clamping the two plug end contacts of the first signal pair. The bending directions of the two mating end contacts of the same second signal pair 223 are the same.
Structure four, should insert the difference that closes the structure and structure three and lie in: as shown in fig. 41, the mating end contacts of the same second signal pair are bent in opposite directions.
The difference between the inserting structure and the structure III is as follows: as shown in fig. 42, the front ends of the two mating end contacts of the second signal pair are further folded inward to form second contacts 2214, the first signal pair 222 is inserted into the clamping cavity of the second signal pair 223, the first contact 2213 outside the front end of the first signal pair 222 contacts with the second signal pair, the second contact 2214 inside the front end of the second signal pair contacts with the outer wall of the first signal pair contact, and the mating structure changes the single-contact between the signal contact elements into the double-contact, so that not only is the clamping force of the jack increased, but also the contact area is increased, and the contact is more reliable.
Structure six, should insert the difference that closes the structure and structure four and lie in: as shown in fig. 43, the front ends of the two mating end contacts of the second signal pair are further folded inwards to form a second contact 2214, the first signal pair 222 is inserted into the clamping cavity of the second signal pair 223, the first contact 2213 on the outer side of the front end of the first signal pair 222 contacts with the second signal pair, the second contact 2214 on the inner side of the front end of the second signal pair contacts with the outer wall of the first signal pair contact, and the mating structure changes the single-contact between the signal contact elements into the double-contact, so that not only the clamping force of the jack is increased, but also the contact area is increased, and the contact is more reliable.
Example 20
This example differs from example 19 in that: as shown in fig. 44-46, the mating end contacts of the first signal pair 222 are entirely outside the mating end contacts of the second signal pair 223 and hold the mating end contacts of the second signal pair 223 to provide reliable contact between the two mating ends. In this embodiment, a clamping cavity of a jack structure is formed between the two mating end contacts of the first signal pair 222, the two mating end contacts are provided with a first contact 2213 opposite to the direction perpendicular to the material thickness, and the mating end contact of the second signal pair 223 is in a straight pin structure, which is inserted into the clamping cavity at the front end of the first signal pair and contacts with the first contact 2213.
Example 21
This example differs from example 19 in that: as shown in fig. 47, the two mating terminal contacts of the first signal pair are branched in the direction perpendicular to the material thickness to form independent sockets, and each branch has a first contact 2213 formed inside, and the two mating terminal contacts of the second signal pair 223 are straight pins adapted to the sockets at the front ends of the single mating terminal contacts of the corresponding first signal pair, and the single straight pin is adapted to the single socket.
Example 22
This embodiment differs from embodiment 21 in that: the two mating end contacts of the second signal pair 223 are bent by 90 degrees to be in a state where the thickness direction is perpendicular to the thickness direction of the differential signal module.
Example 23
This example differs from example 19 in that: as shown in fig. 48, the signal contacts in the first connector 4 and the second connector 5 are both bent contacts, and the first connector 4 and the second connector 5 are inserted to realize orthogonal connection between the printed boards. In this embodiment, the insertion structures between the first signal pair and the second signal pair may be the first insertion structure and the second insertion structure in embodiment 19, or may be the insertion structures in embodiment 20 or embodiment 21.
Example 24
This example differs from any of examples 19-23 in that: adjacent signal pairs 22 in the same differential signal module 2 are shielded only at the plug end contacts, and other parts are shielded. In the embodiment, when the connectors are plugged, the shielding plates 26 of the first connector 4 and the second connector 5 are in contact conduction to form a plugging area shielding cavity, and adjacent signal pairs in the same plugging area shielding cavity are not shielded between the plugging end contacts, at this time, a distance L2 between the plugging end contacts of the two signal contacts 221 forming one signal pair 22, a distance L1 between each plugging end contact of the signal contacts 221 and the shielding plates 23 on two sides, and a distance L0 between the adjacent signal pairs at the plugging end satisfy that L1 is greater than or equal to 0.2mm and less than or equal to 0.4mm, L2 is greater than or equal to 0.2W, and L0 is greater than or equal to 3mm and less than or equal to 4.5 mm. The differential signal module realizes the shielding between the signal pairs through the shielding sheets distributed along the direction vertical to the arrangement direction of the signal pairs, adjacent signal pairs are not shielded and shielded from the crimping end contact to the plugging end contact, and only the insulating medium is filled between the wiring parts to keep the module structure. The resulting package of a single wafer is a differential signal pair in the middle and ground pins on both sides. There is not shielding structure between the differential signal pair, have the flexibility when can the product design of inserting the end more, realize the miniaturization of product. The connector using the differential signal module can meet the requirement of miniaturization.
The characteristic impedance is a main parameter which is mutually related to all performance characteristics of a high-speed data system, and when the characteristic impedance of the connector is matched with the impedance value of a system link, the influence of influence factors such as loss, reflection and oscillation of signals in the connector is smaller, and higher transmission rate is easier to obtain. In order to meet the design requirement of differential impedance, the structure size of a transmission model is adjusted by adopting mathematical model calculation in the design process, and the characteristic impedance requirement of a product is ensured. And simulating the model by simulation software to obtain the crosstalk and insertion loss simulation results of the model.
The performance of the differential signal connector of the present invention will be described below by taking a connector composed of three rows of differential signal modules as an example, in combination with a comparative example and a specific effect example.
In the technical field of high-speed connectors, connectors with shielding plates on two sides of a differential signal module are generally applied to the frequency range of 0-50GHz, and the crosstalk of signal pairs is required to be less than-60 dB in the frequency range of 0-20GHz, and the crosstalk of signal pairs is required to be less than-55 dB in the frequency range of 20-30 GHz. In the following comparative example and effect example, each differential signal module is provided with shielding plates on two sides, each differential signal module comprises 3 pairs of signal pairs arranged at intervals, wherein the signal pair positioned at the middle most of the connector is influenced by the surrounding signal pairs, and the performance simulation of each comparative example and effect example is carried out on the middle most signal pair.
Comparative example 1: in this comparative example, ground pins are provided between adjacent signal pairs in the same differential signal module, and adjacent signal pairs in adjacent differential signal modules in the three rows of differential signal modules are arranged face to face in the arrangement direction of the differential signal modules, i.e., L4 is equal to 0. At this time, the ground pin between the signal pair is not connected to the shield plate, the pitch L0 between adjacent signal pairs in the same module is 2mm, the vertical distance L1 between the shield plate and the signal contact is 0.5mm, and the distance L2 between two signal contacts in the signal pair is 3 times the line width W. It can be seen from fig. 49 that in the frequency range of 0-50GHz, the amplitude of the crosstalk received by the signal pair is less than-55 dB, which can meet the use requirement of the high-speed connector. Wherein the abscissa of the graph is frequency, the ordinate is amplitude, and PSXT represents the en-route curve as the sum of crosstalk.
Comparative example 2: this comparative example differs from comparative example 1 only in that the ground pin between the signal pair is connected to the shield plate in this comparative example. Referring to fig. 50, the performance diagram of the signal pairs of the comparative example with 8 attack pairs shows that the crosstalk amplitude of the signal pairs is less than-80 dB in the frequency range of 0-50GHz, which can meet the requirement of high-speed connector.
Comparative example 3: this comparative example differs from comparative examples 1 and 2 only in that it directly removes ground pins between adjacent signal pairs without any shielding between the adjacent signal pairs. It can be seen from fig. 51 that the crosstalk amplitude of the signal pair is as high as-20 dB in the frequency range of 0-50GHz, and the use requirement of the high-speed connector cannot be met.
Comparative example 4: this comparative example differs from comparative example 3 only in that the vertical distance L1 from the shield plate to the signal contact is 0.3mm, and the distance L2 between the two signal contacts in the signal pair is 1.4 times the material thickness H. Fig. 52 shows that the crosstalk amplitude of the signal pair is as high as-35 dB in the frequency range of 0-50GHz, and the use requirement of the high-speed connector cannot be met.
Comparative example 5: this comparative example differs from comparative example 3 only in that the spacing L0 between adjacent signal pairs is taken to be 4.mm, the perpendicular distance L1 from the shield plate to the signal contact is taken to be 0.6mm, and the distance L2 between two signal contacts within the signal pair is taken to be 1.4 times the material thickness H. Fig. 53 shows that the crosstalk amplitude of the signal pair is as high as-20 dB in the frequency range of 10G-30GHz, and the crosstalk is too large to meet the use requirement of the high-speed connector.
Comparative example 6, which differs from comparative example 3 only in that the perpendicular distance L1 from the shield plate to the signal contact is 0.6mm, and the distance L2 between the two signal contacts in the signal pair is 1.4 times the material thickness H. Fig. 54 shows that the crosstalk amplitude of the signal pair is as high as-28 dB in the frequency range of 0-50GHz, and the crosstalk is too large to meet the use requirement of the high-speed connector.
Comparative example 7, which is different from comparative example 3 only in that the perpendicular distance L1 from the shield plate to the signal contact piece was taken to be 0.3 mm. It can be seen from fig. 55 that in the frequency range of 0-50GHz, the amplitude of crosstalk received by the signal pair is as high as-25 dB, and the crosstalk is too large to meet the use requirement of the high-speed connector.
Comparative example 8, which differs from comparative example 3 only in that the spacing L0 between adjacent signal pairs was taken to be 4mm and the perpendicular distance L1 from the shield plate to the signal contact was taken to be 0.6 mm. Fig. 56 shows that the crosstalk amplitude of the signal pair is as high as-30 dB in the frequency range of 0-50GHz, and the crosstalk is too large to meet the use requirement of the high-speed connector.
As can be seen from the above comparative examples, the high-speed connector that can satisfy the use requirement in the prior art cannot satisfy the use requirement after the ground pin is directly removed without changing other conditions, that is, the ground pin of the high-speed connector in the prior art is directly removed, and the use requirement of the high-speed connector cannot be satisfied, and any one of the high-speed connectors without ground pin, which is not within the scope of the present invention, among L0, L1, and L2, cannot satisfy the use requirement.
Effect example 1: the effect example differs from comparative example 3 in that: the distance L0 between adjacent signal pairs in the same module is 3mm, the vertical distance L1 between the shielding plate and the signal contact is 0.4mm, and the distance L2 between the two signal contacts in the signal pair is 1.4 times of the material thickness H. It can be known from fig. 57 that the crosstalk amplitude received by the signal pair is less than-60 dB in the frequency range of 0-20GHz, and less than-55 dB in the frequency range of 20-30GHz, which can meet the use requirement of the existing high-speed connector.
Effect example 2: the effect example differs from comparative example 3 in that: the distance L0 between adjacent signal pairs in the same module is 4mm, the vertical distance L1 from the shielding plate to the signal contact is 0.2mm, and the distance L2 between two signal contacts in the signal pair is 2 times the line width W. It can be seen from fig. 58 that the signal pair receives a crosstalk with a magnitude less than-60 dB in the frequency range of 0-50GHz, which can meet the requirements of the existing high-speed connector.
Effect example 3: the effect example differs from comparative example 3 in that: the distance L0 between adjacent signal pairs in the same module is 4mm, the vertical distance L1 between the shielding plate and the signal contact is 0.3mm, and the material thickness H is taken as the distance L2 between the two signal contacts in the signal pair. It can be seen from fig. 59 that the signal pair receives a crosstalk with a magnitude less than-65 dB in the frequency range of 0-50GHz, which can meet the requirements of the conventional high-speed connector.
Effect example 4: the effect example differs from comparative example 3 in that: the spacing L0 between adjacent signal pairs in the same module is 4.5mm, the vertical distance L1 from the shield plate to the signal contacts is 0.3mm, and the distance L2 between two signal contacts in a signal pair is 1.4H. It can be seen from fig. 60 that the signal pair receives a crosstalk amplitude smaller than-65 dB in the frequency range of 0-50GHz, which can meet the use requirement of the existing high-speed connector.
Effect example 5: the effect example differs from comparative example 3 in that: the spacing L0 between adjacent signal pairs in the same module was taken to be 4mm, the vertical distance L1 from the shield plate to the signal contacts was taken to be 0.3mm, and the distance L2 between two signal contacts in a signal pair was taken to be 1.4H. It can be seen from fig. 61 that the signal pair receives a crosstalk amplitude smaller than-68 dB in the frequency range of 0-50GHz, which can meet the use requirement of the existing high-speed connector.
Effect example 6: the effect example differs from comparative example 5 in that: as can be seen from fig. 62, in the frequency range of 0 to 50GHz, the crosstalk amplitude of the signal pair is smaller than-78 dB, which can meet the use requirement of the existing high-speed connector, and the crosstalk amplitude of the whole frequency band of the effect example is smaller than that of the effect example 5, so that the performance is better.
Effect example 7: the effect example differs from comparative example 5 only in that: as can be seen from fig. 63, the amplitude of crosstalk received by the signal pair is smaller than-85 dB in the frequency range of 0 to 50GHz, and the performance is better, when the offset distance L4 is 1.25 mm.
Effect example 8: the effect example differs from comparative example 5 in that: the staggered distance L4 is 1.5mm, and fig. 64 shows that in the frequency range of 0-50GHz, the crosstalk amplitude of the signal pair is smaller than-85 dB, which can meet the use requirement of the existing high-speed connector, and the crosstalk amplitude of the whole frequency band of the effect example is smaller than that of the effect example 5, so that the performance is better.
According to the comparative example and the effect example, the existing high-speed connector with shielding on two sides cannot meet the use requirement, but the design of the high-speed connector without the ground pin overcomes the technical bias in the field of high-speed connectors, and the use requirement of the high-speed connector can be met by removing the ground pin in the existing connector and limiting L1, L2 and L0 within a specific range. High speed connectors having shield blades on only one side of the differential signal module are typically used in the frequency range of 0-15GHz and require less than-45 dB of signal-to-signal crosstalk in this frequency range. In the following comparative example and effect example, each differential signal module is provided with a shielding plate only on one side, each differential signal module includes 3 pairs of signal pairs arranged at intervals, and performance simulation of each comparative example and effect example is performed on the central signal pair.
Comparative example 1: in this comparative example, a ground pin is provided between adjacent signal pairs in the same differential signal module, and adjacent signal pairs in adjacent differential signal modules in the three rows of differential signal modules are arranged opposite to each other in the arrangement direction of the differential signal modules, that is, L4 is 0. At this time, the ground pin between the signal pair is not connected to the shield plate, the pitch L0 between adjacent signal pairs in the same module is 2mm, the vertical distance L1 between the shield plate and the signal contact is 0.5mm, and the distance L2 between two signal contacts in the signal pair is 3 times the line width W. It can be seen from fig. 65 that in the frequency range of 0-15GHz, the amplitude of crosstalk received by the signal pair is less than-45 dB, which can meet the use requirement of the high-speed connector.
Comparative example 2: this comparative example differs from comparative example 1 in that: the ground pin between the signal pair is connected with the shielding plate. It can be seen from fig. 66 that in the frequency range of 0-15GHz, the amplitude of crosstalk received by the signal pair is less than-45 dB, which can meet the use requirement of the high-speed connector.
Comparative example 3: this comparative example differs from comparative examples 1 and 2 in that: no shield is arranged between adjacent signal pairs, and as can be seen from FIG. 67, in the frequency range of 0-15GHz, the crosstalk amplitude received by the signal pairs is greater than-20 dB, which cannot meet the use requirement of the high-speed connector.
Comparative example 4: this comparative example differs from comparative example 3 in that: as shown in fig. 68, the L1 is 0.3mm, and the L2 is 1.4H, it can be seen that, in the frequency range of 0-15GHz, the amplitude of crosstalk received by the signal pair is greater than-30 dB, which cannot meet the use requirement of the high-speed connector.
Comparative example 5: this comparative example differs from comparative example 3 in that: as can be seen from fig. 69, the crosstalk amplitude received by the signal pair is greater than-45 dB in the frequency range of 0-15GHz, and the L1 is 0.6mm, the L2 is 1.4H, and the L0 is 4mm, which cannot meet the use requirement of the high-speed connector.
Comparative example 6: this comparative example differs from comparative example 3 in that: as can be seen from FIG. 70, the L1 is 0.3mm, the L2 is 4W, and the L0 is 4mm, the amplitude of crosstalk received by the signal pair is greater than-40 dB in the frequency range of 0-15GHz, which cannot meet the operating requirements of the high-speed connector.
Comparative example 7: this comparative example differs from comparative example 3 in that: it can be seen from fig. 71 that, 0.6mm is adopted for L1, 1.4H is adopted for L2, and 2mm is adopted for L0, and the amplitude of crosstalk received by a signal pair is greater than-30 dB in the frequency range of 0-15GHz, which cannot meet the use requirement of the high-speed connector.
Comparative example 8: this comparative example differs from comparative example 3 in that: it can be seen from fig. 72 that, 0.3mm for L1, 3W for L2, and 2mm for L0, the amplitude of crosstalk received by the signal pair is greater than-20 dB in the frequency range of 0-15GHz, and the use requirement of the high-speed connector cannot be met.
Comparative example 9: this comparative example differs from comparative example 3 in that: it can be seen from fig. 73 that, 0.6mm for L1, 3W for L2, and 4mm for L0, the amplitude of crosstalk received by the signal pair is greater than-30 dB in the frequency range of 0-15GHz, and the use requirement of the high-speed connector cannot be met.
Effect example 1: the effect example differs from comparative example 3 in that: as can be seen from FIG. 74, the crosstalk amplitude received by the signal pair is less than-45 dB in the frequency range of 0-15GHz, and the L1, L2 and L0 are respectively 0.4mm, 1.4H and 3mm, so that the use requirement of the high-speed connector can be met.
Effect example 2: the effect example differs from comparative example 3 in that: as can be seen from FIG. 75, the crosstalk amplitude received by the signal pair is less than-50 dB in the frequency range of 0-15GHz, and the L1, L2 and L0 are respectively 0.2mm, 2W and 4mm, so that the use requirement of the high-speed connector can be met.
Effect example 3: the effect example differs from comparative example 3 in that: as can be seen from FIG. 76, the L1 is 0.3mm, the L2 is H, and the L0 is 4mm, and the amplitude of crosstalk received by the signal pair is less than-50 dB in the frequency range of 0-15GHz, so that the use requirement of the high-speed connector can be met.
Effect example 4: the effect example differs from comparative example 3 in that: as can be seen from FIG. 77, the L1 is 0.3mm, the L2 is 1.4H, and the L0 is 4.5mm, and the amplitude of crosstalk received by the signal pair is less than-55 dB in the frequency range of 0-15GHz, which can meet the use requirements of the high-speed connector.
Effect example 5: the effect example is different from comparative example 3 in that: as can be seen from FIG. 78, the crosstalk amplitude received by the signal pair is less than-48 dB in the frequency range of 0-15GHz, and the L1 is 0.3mm, the L2 is 1.4H, and the L0 is 4mm, which can meet the use requirement of the high-speed connector.
Effect example 6: the effect example differs from comparative example 5 in that: as can be seen from fig. 79, in the frequency range of 0 to 15GHz, the amplitude of crosstalk received by the signal pairs is smaller than-55 dB, and the use requirement of the high-speed connector can be met.
Effect example 7: the effect example differs from comparative example 5 in that: as can be seen from fig. 80, the offset distance L4 is 1.25mm, and the amplitude of crosstalk received by the signal pair is smaller than-55 dB in the frequency range of 0 to 15GHz, which can meet the requirements for use of the high-speed connector.
Effect example 8: the effect example differs from comparative example 5 in that: as can be seen from fig. 79, the offset distance L4 is 1.5mm, and the amplitude of crosstalk received by the signal pair is smaller than-55 dB in the frequency range of 0 to 15GHz, which can meet the use requirement of the high-speed connector.
It can be seen from the above comparative examples and effect examples that the existing high-speed connector with shielding plate on one side of the module can not meet the requirement of use, while the design of the high-speed connector without ground pin of the present invention overcomes the technical prejudice in the field of high-speed connectors, and it can meet the requirement of use of high-speed connectors by removing ground pins in the existing connector and limiting L1, L2 and L0 within a specific range.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A differential signal connector assembly for realizing vertical interconnection between printed boards comprises a first connector (4) and a second connector (5) which are matched and inserted, wherein each of the first connector (4) and the second connector (5) comprises a shell (1) and at least two differential signal modules (2) assembled in the shell (1), each differential signal module (2) comprises a module insulator (21), at least two signal pairs (22) distributed at intervals and a shielding sheet (23), and the shielding sheet (23) is positioned on the vertical side of the arrangement direction of the module insulator (21) and the signal pairs (22) and used for shielding the signal pairs (22) of the adjacent differential signal modules; when the connectors are plugged, the shielding sheets (26) of the first connector (4) and the second connector (5) are in contact conduction to form cavities, and no shielding structure is arranged between adjacent signal pairs (22) plugging end contacts in the same cavity; the thickness direction of the plug-in terminal contact of the signal pair in the first connector (4) is consistent with that of the differential signal module (2), and the thickness direction of the plug-in terminal contact of the signal pair in the second connector (5) is vertical to that of the differential signal module (2); the single contact of the signal pair plugging end of one of the first connector and the second connector is a contact pin, and the single contact of the signal pair plugging end of the other connector is a clip for clamping the contact pin.
2. A differential signal connector assembly for enabling vertical interconnection between printed boards according to claim 1, wherein: and no shielding structure is arranged between the crimping end contacts of the adjacent signal pairs (22) in the same differential signal module (2) and between the wiring parts positioned between the two contacts.
3. A differential signal connector assembly for enabling vertical interconnection between printed boards according to claim 1 or 2, wherein: the distance L2 between the plug-end contacts of the two signal contacts (221) forming one signal pair (22) in the same differential signal module, the vertical distance L1 from the shielding sheet (23) to the signal contacts (221) and the distance L0 between the adjacent signal pairs (22) satisfy the following conditions: l1 is more than or equal to 0.2mm and less than or equal to 0.4mm, L0 is more than or equal to 3mm and less than or equal to 4.5mm, and the material thickness of the signal contact piece is more than or equal to L2 and less than or equal to 2 times of the material width of the signal contact piece.
4. A differential signal connector assembly for enabling vertical interconnection between printed boards according to claim 3, wherein: the single contact of the signal pair plug-in end of the first connector is a clip, and the signal pair of the second connector forms two pin-shaped contacts with the thickness direction perpendicular to the thickness direction of the differential signal module after the plug-in end is bent by 90 degrees.
5. The differential signal connector assembly of claim 4, wherein: and the bending directions of the signal pairs of the second connector are opposite when the plugging end is bent to form two contacts.
6. A differential signal connector assembly for enabling vertical interconnection between printed boards according to any one of claim 3, wherein: and shielding sheets are arranged on both sides of the signal pair (22) of at least one differential signal module (2) in the first connector and the second connector, which are perpendicular to the arrangement direction.
7. A differential signal connector assembly for enabling vertical interconnection between printed boards according to any one of claim 3, wherein: at least one pair of adjacent signal pairs (22) of the first connector and the second connector in the adjacent differential signal modules (2) are arranged in a staggered manner in the arrangement direction of the differential signal modules.
8. A differential signal connector assembly for enabling vertical interconnection between printed boards as claimed in any one of claims 3 wherein: and an insulating or conductive inter-shield piece medium (3) is arranged between at least one pair of adjacent differential signal modules (2) in the first connector and the second connector.
9. A differential signal connector assembly for enabling vertical interconnection between printed boards according to any one of claim 3, wherein: the contacts of the crimping ends of adjacent signal pairs (22) of at least one differential signal module (2) in each of the first and second connectors are tilted to different sides of the module.
10. A differential signal connector assembly for enabling vertical interconnection between printed boards according to claim 1, wherein: the first connector and the second connector are inserted to realize orthogonal interconnection of the two printed boards.
CN202210101826.1A 2021-02-09 2022-01-27 Differential signal connector assembly for realizing vertical interconnection between printed boards Active CN114530733B (en)

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CN114530732A (en) 2022-05-24

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