CN114525572A - Auxiliary device is electroplated to high-efficient perpendicular line sheet metal of PCB and HDI board - Google Patents
Auxiliary device is electroplated to high-efficient perpendicular line sheet metal of PCB and HDI board Download PDFInfo
- Publication number
- CN114525572A CN114525572A CN202210219262.1A CN202210219262A CN114525572A CN 114525572 A CN114525572 A CN 114525572A CN 202210219262 A CN202210219262 A CN 202210219262A CN 114525572 A CN114525572 A CN 114525572A
- Authority
- CN
- China
- Prior art keywords
- thin plate
- pcb
- electroplating
- clamping
- auxiliary device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 title claims description 17
- 238000009713 electroplating Methods 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 230000002457 bidirectional effect Effects 0.000 claims description 17
- 238000006073 displacement reaction Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 230000001360 synchronised effect Effects 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 206010063659 Aversion Diseases 0.000 claims 3
- 230000000694 effects Effects 0.000 claims 3
- 230000001105 regulatory effect Effects 0.000 claims 3
- 239000004743 Polypropylene Substances 0.000 description 17
- 230000008569 process Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210219262.1A CN114525572B (en) | 2022-03-08 | 2022-03-08 | High-efficient perpendicular line sheet metal electroplating auxiliary device of PCB and HDI board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210219262.1A CN114525572B (en) | 2022-03-08 | 2022-03-08 | High-efficient perpendicular line sheet metal electroplating auxiliary device of PCB and HDI board |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114525572A true CN114525572A (en) | 2022-05-24 |
CN114525572B CN114525572B (en) | 2024-03-05 |
Family
ID=81626364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210219262.1A Active CN114525572B (en) | 2022-03-08 | 2022-03-08 | High-efficient perpendicular line sheet metal electroplating auxiliary device of PCB and HDI board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114525572B (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201406477Y (en) * | 2009-03-17 | 2010-02-17 | 东莞市宏德电子设备有限公司 | Jig device used for electroplating PCB sheet |
CN201545930U (en) * | 2009-09-16 | 2010-08-11 | 深圳市深联电路有限公司 | Improved electroplated thin plate frame for electroplated automatic line |
CN103361707A (en) * | 2013-08-05 | 2013-10-23 | 江苏华神电子有限公司 | Electroplating clamp for thin PCB |
CN203639593U (en) * | 2013-12-31 | 2014-06-11 | 遂宁市广天电子有限公司 | Clamp for vertical electroplating of thin plate |
CN205347614U (en) * | 2016-01-28 | 2016-06-29 | 惠州市三强线路有限公司 | Electricity plate wire PCB sheet metal is electroplated and is assisted utensil |
CN206359634U (en) * | 2017-01-06 | 2017-07-28 | 鄄城县天源电子科技有限公司 | A kind of thin plate rack device for solving thin-plate electroplating buckling problem |
CN206486617U (en) * | 2017-02-15 | 2017-09-12 | 江苏联坤电子科技有限公司 | A kind of thin plate rack device for solving thin-plate electroplating buckling problem |
CN107740176A (en) * | 2017-09-29 | 2018-02-27 | 奥士康科技股份有限公司 | A kind of plating thin grillage |
-
2022
- 2022-03-08 CN CN202210219262.1A patent/CN114525572B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201406477Y (en) * | 2009-03-17 | 2010-02-17 | 东莞市宏德电子设备有限公司 | Jig device used for electroplating PCB sheet |
CN201545930U (en) * | 2009-09-16 | 2010-08-11 | 深圳市深联电路有限公司 | Improved electroplated thin plate frame for electroplated automatic line |
CN103361707A (en) * | 2013-08-05 | 2013-10-23 | 江苏华神电子有限公司 | Electroplating clamp for thin PCB |
CN203639593U (en) * | 2013-12-31 | 2014-06-11 | 遂宁市广天电子有限公司 | Clamp for vertical electroplating of thin plate |
CN205347614U (en) * | 2016-01-28 | 2016-06-29 | 惠州市三强线路有限公司 | Electricity plate wire PCB sheet metal is electroplated and is assisted utensil |
CN206359634U (en) * | 2017-01-06 | 2017-07-28 | 鄄城县天源电子科技有限公司 | A kind of thin plate rack device for solving thin-plate electroplating buckling problem |
CN206486617U (en) * | 2017-02-15 | 2017-09-12 | 江苏联坤电子科技有限公司 | A kind of thin plate rack device for solving thin-plate electroplating buckling problem |
CN107740176A (en) * | 2017-09-29 | 2018-02-27 | 奥士康科技股份有限公司 | A kind of plating thin grillage |
Also Published As
Publication number | Publication date |
---|---|
CN114525572B (en) | 2024-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Country or region after: China Address after: 518104 buildings 1, 2 and 3, No. 24, dawangshan second industrial zone, Shajing, Bao'an District, Shenzhen, Guangdong Province Applicant after: ShenZhen Brightpcb Co.,Ltd. Address before: 518104 buildings 1, 2 and 3, No. 24, dawangshan second industrial zone, Shajing, Bao'an District, Shenzhen, Guangdong Province Applicant before: SHENZHEN MINGZHENGHONG ELECTRONICS Co.,Ltd. Country or region before: China |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240129 Address after: 413000 Changchun Industrial Park, Ziyang District, Yiyang, Hunan Applicant after: YIYANG MINGZHENGHONG ELECTRONICS CO.,LTD. Country or region after: China Address before: 518104 buildings 1, 2 and 3, No. 24, dawangshan second industrial zone, Shajing, Bao'an District, Shenzhen, Guangdong Province Applicant before: ShenZhen Brightpcb Co.,Ltd. Country or region before: China |
|
GR01 | Patent grant | ||
GR01 | Patent grant |