CN114519872A

CN114519872A - Fingerprint living body recognition device and fingerprint module

Info

Publication number: CN114519872A
Application number: CN202011299082.6A
Authority: CN
Inventors: 王宇; 黄志雷
Original assignee: Beijing Heguang Technology Co ltd
Current assignee: Beijing Heguang Technology Co ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2022-05-20

Abstract

The embodiment of the invention provides a fingerprint living body identification device and a fingerprint module, wherein the fingerprint living body identification device comprises a display screen, a light source module, a spectral imaging chip, a signal processing circuit module and an identification module, a fingerprint detection area is arranged on the display screen, an object to be detected in the fingerprint detection area is irradiated by the light source module, a target light beam obtained after being reflected by the object to be detected is incident on the spectral imaging chip, frequency spectrum information and light intensity information are determined by the spectral imaging chip, the spectral information and image information of the object to be detected are determined by the signal processing circuit module, and finally whether the object to be detected is a living body fingerprint of a target user is identified by the identification module. The fingerprint living body identification device provided by the embodiment of the invention can realize fingerprint living body identification, is beneficial to improving the stability of the performance of a device, simultaneously reduces the volume, the weight and the cost of a spectrum device, and greatly improves the anti-counterfeiting capacity of a fingerprint identification system.

Description

Fingerprint living body recognition device and fingerprint module

Technical Field

The invention relates to the technical field of imaging, in particular to a fingerprint living body identification device and a fingerprint module.

Background

In the modern information society, a large number of scenes that a user needs to perform fingerprint identity authentication exist in daily life, and the convenience of life of people is greatly improved.

In the prior art, whether a user is the user is often verified through fingerprint image information, but the technology can be cracked through stickers, 3D printed models and the like, and the safety of the technology cannot be guaranteed.

Disclosure of Invention

The embodiment of the invention provides a fingerprint living body identification device and a fingerprint module, which are used for overcoming the defects in the prior art.

The embodiment of the invention provides a fingerprint living body identification device, which comprises: the fingerprint detection device comprises a display screen, a light source module, a spectrum imaging chip, a signal processing circuit module and an identification module, wherein a fingerprint detection area is arranged on the display screen; the light source module is used for irradiating an object to be detected in the fingerprint detection area, and a target light beam obtained after the object to be detected is reflected is incident on the spectral imaging chip; the spectral imaging chip and the signal processing circuit module are two independent parts or the signal processing circuit module is integrated in the spectral imaging chip;

the spectral imaging chip is used for determining the spectral information of the pixel point corresponding to each modulation unit in the light modulation layer of the spectral imaging chip after the target light beam is irradiated and the light intensity information of the pixel point corresponding to each non-modulation unit in the light modulation layer; the signal processing circuit module is used for determining the spectral information of the object to be detected based on the spectral information and determining the image information of the object to be detected based on the light intensity information; the identification module is used for identifying whether the object to be detected is the living fingerprint of the target user or not based on the spectral information and the image information of the object to be detected.

According to an embodiment of the invention, the fingerprint living body identification device comprises a spectrum imaging chip and a fingerprint identification device, wherein the spectrum imaging chip comprises: a light modulation layer and an image sensing layer which are sequentially stacked in a thickness direction; the light modulation layer is distributed with at least one modulation unit and at least one non-modulation unit along the surface; the image sensing layer is distributed with a plurality of sensing units along the surface, and each modulation unit and each non-modulation unit respectively correspond to at least one sensing unit along the thickness direction; the signal processing circuit module is electrically connected with the sensing unit.

According to an embodiment of the fingerprint identification apparatus, the signal processing circuit module is specifically configured to:

determining fitting light intensity information of pixel points corresponding to each modulation unit based on light intensity information of pixel points corresponding to a plurality of non-modulation units around each modulation unit after the target light beam is irradiated;

and determining the image information of the object to be detected based on the fitting light intensity information of the pixel points corresponding to each modulation unit and the light intensity information of the pixel points corresponding to each non-modulation unit.

based on a smooth filtering method, filtering light intensity information of pixel points corresponding to at least one non-modulation unit around any modulation unit to obtain fitting light intensity information of the pixel points corresponding to any modulation unit.

According to an embodiment of the fingerprint identification apparatus, the signal processing circuit module is further specifically configured to:

inputting initial images obtained by the spectral imaging chips of pixel points corresponding to all non-modulation units after the target light beam is irradiated to a fitting model to obtain image information of the object to be detected output by the fitting model;

the fitting model is constructed on the basis of a confrontation neural network, and is obtained by training on the basis of a vacant sample image with vacant pixels and a complete sample image corresponding to the vacant sample image without the vacant pixels.

According to the living fingerprint identification device of one embodiment of the invention, each modulation unit in the light modulation layer comprises a plurality of modulation subunits, and each modulation subunit is in a hole-shaped structure or a column-shaped structure.

According to the fingerprint living body identification device of one embodiment of the invention, the hole cross-sectional shapes of different modulation subunits of the hole-shaped structure in each modulation unit are not identical; and/or the presence of a gas in the atmosphere,

the structural parameters of the different modulation subunits of the hole-like structure in each modulation unit are not identical.

According to the fingerprint living body identification device of one embodiment of the invention, the structural shapes and the column heights of different modulation subunits which are in the columnar structures in each modulation unit are the same, and the arrangement of all the modulation subunits in each modulation unit has C4 symmetry.

According to the fingerprint living body identification device provided by the embodiment of the invention, the modulation subunits of the columnar structures are integrally formed or formed by laminating a plurality of layers of modulation columns.

The fingerprint living body identifying device according to one embodiment of the present invention further includes: a lens group;

the light source module is arranged between the display screen and the spectral imaging chip, and the lens group is arranged between the light source module and the spectral imaging chip; alternatively, the first and second electrodes may be,

the light source module is arranged below a non-fingerprint detection area of the display screen, and the lens group and the spectral imaging chip are sequentially arranged below the fingerprint detection area;

the lens group is used for collimating and incidence of the target light beam onto the spectral imaging chip so as to enable the target light beam to be imaged on the spectral imaging chip.

The embodiment of the invention provides a fingerprint module, which comprises: the device comprises a spectral imaging chip and a circuit board, wherein the spectral imaging chip is electrically connected to the circuit board;

the spectral imaging chip comprises a light modulation layer, an image sensing layer and a signal processing circuit module which are sequentially stacked in the thickness direction; wherein, the light modulation layer is distributed with at least one modulation unit and at least one non-modulation unit along the surface; the image sensing layer is distributed with a plurality of sensing units along the surface, and each modulation unit and each non-modulation unit respectively correspond to at least one sensing unit along the thickness direction.

According to a fingerprint module of an embodiment of the present invention, still include: a stiffener attached to the circuit board.

According to a fingerprint module of an embodiment of the present invention, still include: and the packaging part is formed on the upper surface of the circuit board.

According to a fingerprint module of an embodiment of the present invention, still include: a light shielding portion disposed on an upper surface of the encapsulation portion.

The fingerprint living body identification device comprises a display screen, a light source module, a spectrum imaging chip, a signal processing circuit module and an identification module, wherein a fingerprint detection area is arranged on the display screen, an object to be detected in the fingerprint detection area is irradiated by the light source module, a target light beam obtained after the object to be detected is reflected is incident on the spectrum imaging chip, spectrum information and light intensity information are determined by the spectrum imaging chip, the spectrum information and image information of the object to be detected are determined by the signal processing circuit module, and finally whether the object to be detected is a living body fingerprint of a target user is identified by the identification module according to the spectrum information and the image information of the object to be detected. Compared with the existing fingerprint identification device, the fingerprint living body identification device provided by the embodiment of the invention can realize fingerprint living body identification, is beneficial to improving the performance stability of a device, simultaneously reduces the volume, weight and cost of a spectrum device, and greatly improves the anti-counterfeiting capacity of a fingerprint identification system. Moreover, compared with the traditional image sensor, the spectral imaging chip adopted in the embodiment of the invention can obtain spectral information while not influencing the spatial resolution and the imaging quality of the formed image, and is convenient for mastering more comprehensive information of the object to be detected. In addition, the spectrum information of the object to be detected can be used for uniquely identifying the object to be detected, so that whether the object to be detected is the living fingerprint of the target user can be judged through the spectrum information of the object to be detected, the detection accuracy can be improved, and the fingerprint identity verification realized through the fingerprint living body identification device is safer and more reliable.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1a is a schematic structural diagram of a fingerprint identification device provided by the present invention;

FIG. 1b is a top view of a fingerprint identification device provided by the present invention;

FIG. 2 is a schematic structural diagram of a spectral imaging chip in the fingerprint identification apparatus provided by the present invention;

FIG. 3 is a schematic structural diagram of a light modulation layer in a spectral imaging chip provided by the present invention;

FIG. 4 is a schematic structural diagram of a light modulation layer in a spectral imaging chip provided by the present invention;

FIG. 5 is a schematic structural diagram of a light modulation layer in a spectral imaging chip provided by the present invention;

FIG. 6 is a schematic diagram of a light modulation layer in a spectral imaging chip according to an embodiment of the present invention;

FIG. 7 is a schematic structural shape diagram of a modulation column in a spectral imaging chip provided by the present invention;

FIG. 8 is a schematic diagram of a longitudinal cross-sectional shape of a modulation column in a spectral imaging chip provided by the present invention;

FIG. 9 is a schematic structural diagram of a spectral imaging chip in the fingerprint identification apparatus provided by the present invention;

FIG. 10 is a schematic structural diagram of a modulation column in a spectral imaging chip provided by the present invention;

FIG. 11 is a schematic structural diagram of a fingerprint identification device provided by the present invention;

FIG. 12 is a schematic structural diagram of a fingerprint identification device provided by the present invention;

FIG. 13 is a schematic structural diagram of a light modulation layer in a spectral imaging chip provided by the present invention;

FIG. 14 is a schematic structural diagram of a light modulation layer in a spectral imaging chip provided by the present invention;

FIG. 15 is a schematic structural diagram of a light modulation layer in a spectral imaging chip provided by the present invention;

FIG. 16 is a schematic structural diagram of a light modulation layer in a spectral imaging chip provided by the present invention;

FIG. 17 is a schematic structural diagram of an optical modulation layer and an image sensing layer in a spectral imaging chip according to the present invention;

fig. 18 is a schematic structural diagram of a CIS wafer in a spectral imaging chip according to the present invention;

fig. 19 is a schematic structural diagram of a CIS wafer in a spectral imaging chip according to the present invention;

FIG. 20a is a schematic structural diagram of a spectral imaging chip provided in the present invention;

FIG. 20b is a schematic structural diagram of a spectral imaging chip provided in the present invention;

FIG. 21 is a schematic structural diagram of a spectral imaging chip provided by the present invention;

FIG. 22 is a schematic structural diagram of a spectral imaging chip provided by the present invention;

FIG. 23 is a schematic structural diagram of a spectral imaging chip provided by the present invention;

FIG. 24 is a schematic structural diagram of a spectral imaging chip provided by the present invention;

FIG. 25 is a schematic structural diagram of a spectral imaging chip provided by the present invention;

FIG. 26 is a schematic structural diagram of a spectral imaging chip provided by the present invention;

FIG. 27 is a schematic diagram of an optical fingerprint recognition assembly provided by the present invention;

FIG. 28 is a schematic structural diagram of a fingerprint module according to the present invention;

fig. 29 is a schematic structural diagram of a fingerprint module according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the modern information society, a large number of scenes that a user needs to perform fingerprint identity authentication exist in daily life, and the convenience of life of people is greatly improved. In the prior art, whether a user is the user is often verified through fingerprint image information, but the technology can be cracked through stickers, 3D printing models and the like, and the safety of the technology cannot be guaranteed. Therefore, the embodiment of the invention provides a fingerprint living body identification device which is used for determining whether an object to be detected is a living body fingerprint of a user.

Fig. 1a is a schematic structural diagram of an apparatus for identifying a living fingerprint according to an embodiment of the present invention, and fig. 1b is a top view of the apparatus for identifying a living fingerprint according to an embodiment of the present invention. As shown in fig. 1a and 1b, the fingerprint living body recognition device includes: the system comprises a display screen 300, a light source module 200, a spectral imaging chip 100, a signal processing circuit module and an identification module 400. The signal processing circuit module is not separately shown in fig. 1a and 1b, because the signal processing circuit module may be integrated in the spectral imaging chip 100, or may be a part independent from the spectral imaging chip 100 in the fingerprint living body identification apparatus, such as a computer, and the like, which is not particularly limited in the embodiment of the present invention. The display screen 300 may include a cover glass, a touch module, and a display module. The display screen 300 is provided with a fingerprint detection area 301, and the object 500 to be detected can be placed in the fingerprint detection area 301. The object 500 to be detected may be a live fingerprint of the user himself, a live fingerprint of another person, a sticker carrying fingerprint information, a 3D printing model, or the like, which is not specifically limited in the embodiment of the present invention.

The light source module 200 is used to illuminate the object 500 to be detected in the fingerprint detection area, and the light source module 200 may be a separate part independent of the display screen, such as an LED light source, or a laser light source with a certain wavelength, such as a 940nm laser. In addition, the light source module can be integrated into the display screen 300 and is a part of the self-luminous display module in the display screen 300, which is not limited in the embodiment of the invention. The upper surface of the light source module 200 may be provided with a lens for converging the light beam emitted from the light source module.

After being reflected by the object 500 to be detected, a target light beam can be obtained, and the target light beam is incident on the spectral imaging chip 100. After the target light beam is irradiated, the pixel point corresponding to each modulation unit in the light modulation layer of the spectral imaging chip 100 has spectrum information, and the pixel point corresponding to each non-modulation unit in the light modulation layer has light intensity information. The spectrum information refers to light intensity information corresponding to light with different wavelengths at the pixel point corresponding to each modulation unit. Different modulation units may have the same or different modulation effects on different wavelengths, and may be set according to needs, which is not specifically limited in the embodiment of the present invention. Therefore, the spectral imaging chip 100 can determine the spectral information as well as the light intensity information. Then, the signal processing circuit module respectively determines the spectrum information and the image information of the object 500 to be detected according to the spectrum information and the light intensity information. When the signal processing circuit module is integrated in the spectral imaging chip, it can be considered that the spectral imaging chip has a function of determining spectral information and image information of the object 500 to be detected.

In the fingerprint living body identification device, the vertical distance from the light source module to the display screen can be between 0mm and 30mm, and correspondingly, the vertical distance from the light source module to the spectral imaging chip can be between 0mm and 30 mm. The vertical distance from the light source module to the display screen can be between 0.5mm and 20mm, and correspondingly, the vertical distance from the light source module to the spectral imaging chip can be between 0.5mm and 20 mm. It should be noted that, in the respective embodiments in which the spectral imaging chip is attached to the display screen by an adhesive, even if there is an adhesive between the spectral imaging chip and the display screen, the distance therebetween can be understood as 0mm, i.e. errors due to assembly, fixing, etc. do not affect the starting point of the present invention.

The recognition module 400 is electrically connected to the signal processing circuit module, and the recognition module 400 can acquire the spectral information and the image information of the object 500 to be detected determined by the signal processing circuit module, and recognize whether the object 500 to be detected is a living fingerprint of the target user according to the spectral information and the image information of the object 500 to be detected. The fingerprint image information and the fingerprint spectrum information of the target user may be stored in the identification module 400 in advance, the image information of the object 500 to be detected determined by the spectrum imaging chip 100 may be compared with the fingerprint image information of the target user stored in advance in the identification module 400, and if the image information and the fingerprint image information are the same or the error is within a preset range, the object to be detected may be determined to be the object belonging to the target user. Then, the spectral information of the object 500 to be detected determined by the spectral imaging chip 100 is compared with the fingerprint spectral information stored in the recognition model 400 in advance, and if the two are the same or the error is within a preset range, the object to be detected can be determined to be the live fingerprint of the target user.

The fingerprint living body identification device provided by the embodiment of the invention comprises a display screen, a light source module, a spectrum imaging chip, a signal processing circuit module and an identification module, wherein a fingerprint detection area is arranged on the display screen, an object to be detected in the fingerprint detection area is irradiated by the light source module, a target light beam obtained after the object to be detected is reflected is incident on the spectrum imaging chip, spectrum information and light intensity information are determined by the spectrum imaging chip, the spectrum information and image information of the object to be detected are determined by the signal processing circuit module, and finally whether the object to be detected is a living body fingerprint of a target user is identified by the identification module according to the spectrum information and the image information of the object to be detected. Compared with the existing fingerprint identification device, the fingerprint living body identification device provided by the embodiment of the invention can realize fingerprint living body identification, is beneficial to improving the performance stability of a device, simultaneously reduces the volume, weight and cost of a spectrum device, and greatly improves the anti-counterfeiting capacity of a fingerprint identification system. Moreover, compared with the traditional image sensor, the spectral imaging chip adopted in the embodiment of the invention can obtain spectral information while not influencing the spatial resolution and the imaging quality of the formed image, and is convenient for mastering more comprehensive information of the object to be detected. In addition, the spectrum information of the object to be detected can be used for uniquely identifying the object to be detected, so that whether the object to be detected is the living fingerprint of the target user can be judged through the spectrum information of the object to be detected, the detection accuracy can be improved, and the fingerprint identity verification realized through the fingerprint living body identification device is safer and more reliable.

On the basis of the foregoing embodiments, the fingerprint living body identification device provided in the embodiments of the present invention, the spectral imaging chip includes: a light modulation layer and an image sensing layer which are sequentially stacked in a thickness direction; the light modulation layer is distributed with at least one modulation unit and at least one non-modulation unit along the surface; the image sensing layer is distributed with a plurality of sensing units along the surface, and each modulation unit and each non-modulation unit respectively correspond to at least one sensing unit along the thickness direction; the signal processing circuit module is electrically connected with the sensing unit.

Specifically, fig. 2 is a schematic structural diagram of a spectral imaging chip in the fingerprint living body identification device provided in the embodiment of the present invention. As shown in fig. 2, the spectral imaging chip 100 may include: the light modulation layer 110, the image sensing layer 120 and the signal processing circuit module 130, i.e., the signal processing circuit module 130 in the embodiment of the present invention, are integrated in the spectral imaging chip 100. The light modulation layer 110, the image sensing layer 120, and the signal processing circuit module 130 are sequentially stacked in the thickness direction. The light modulation layer 110 has at least one modulation unit 1101 and at least one non-modulation unit 1102 distributed along the surface. The image sensing layer 120 is distributed with a plurality of sensing units 1201 along the surface, each modulation unit 1101 and each non-modulation unit 1102 respectively correspond to at least one sensing unit 1201 along the thickness direction, and at least one modulation unit 1101, a plurality of non-modulation units 1102 around the modulation unit 1101 and the corresponding sensing unit 120 form a pixel point of the spectral imaging chip 100. The signal processing circuit module 130 is electrically connected to the sensing unit 1201 on the image sensing layer 120, and the signal processing circuit module 130 is configured to determine image information and spectrum information of the object to be detected.

The thickness of the light modulation layer 110 is 60nm to 1200nm, and the light modulation layer 110 may be directly formed on the image sensing layer 120. Specifically, one or more layers of materials may be directly grown on the image sensing layer 120 and then etched to form the modulation unit, or the modulation unit may be directly etched on the image sensing layer 120 to form the light modulation layer 110. The image sensing layer 120 may be specifically a CIS wafer, and each sensing unit in the image sensing layer 120 corresponds to one pixel in the CIS wafer and is used for detecting a light beam passing through the light modulation layer. The light modulation layer is integrated on the CIS wafer from the wafer level through a single chip, and the preparation of the spectral imaging chip can be completed through CMOS technology primary flow sheet.

Each modulating unit 1101 may be a micro-nano structure unit, and is configured to modulate a target light beam, and each non-modulating unit 1102 has no modulation capability and cannot modulate the target light beam. Each non-modulating cell 1102 may be a blank cell or a solid cell that has no modulating capability but can directly transmit the target beam and is made of the same material as the modulating cell. Each modulation unit 1101 on the light modulation layer 110 may be fabricated directly on the surface of a photosensitive region of a CIS wafer, where the regions of the CIS wafer where no modulation unit is fabricated are also conventional RGB or black and white pixels, and the regions of the CIS wafer where no modulation unit is fabricated correspond to the non-modulation units on the light modulation layer. Because the light modulation layer of the spectral imaging chip comprises the modulation units and the non-modulation units, the spectral information of the pixel points corresponding to each modulation unit, namely the spectral information modulated by each modulation unit and detected by the corresponding sensing units, and the light intensity information of the pixel points corresponding to each non-modulation unit, namely the light intensity information modulated by each non-modulation unit and detected by the corresponding sensing units can be obtained.

The signal processing circuit module 130 may determine spectral information of the object to be detected according to spectral information of a pixel point corresponding to each modulation unit after irradiation of the target light beam, specifically, the spectral information obtained by each modulation unit may be encoded on a corresponding sensing unit of the CIS wafer, and then reconstructed by using a unit array response processing method. The spectrum reconstruction algorithm may specifically include, but is not limited to, a least squares method, a non-negative least squares method, a simulated annealing method, a Tikhonov regularization method, a truncated singular value decomposition method, a sparse optimization method, and the like.

Because the spectrum information of the pixel point corresponding to each modulation unit cannot be used for determining the image information of the object to be detected, the image information of the object to be detected needs to be determined according to the light intensity information of the pixel point corresponding to each non-modulation unit after the target light beam is irradiated. The specific mode can ignore the light intensity information of the pixel points corresponding to each modulation unit, and only adopt the light intensity information of the pixel points corresponding to all non-modulation units to determine the image information of the object to be detected; the light intensity information of the pixel points corresponding to each modulation unit can be determined through the light intensity information of the pixel points corresponding to each non-modulation unit, and then the image information of the object to be detected is determined jointly by combining the light intensity information of the pixel points corresponding to all the non-modulation units. This is not particularly limited in the embodiments of the present invention.

On the basis of the foregoing embodiment, in the fingerprint living body identification apparatus provided in the embodiment of the present invention, the signal processing circuit module is specifically configured to:

Specifically, when the signal processing circuit module determines the image information of the object to be detected, the fitting light intensity information of the pixel point corresponding to each modulation unit can be determined according to the light intensity information of the pixel point corresponding to at least one non-modulation unit around each modulation unit after the target light beam is irradiated. The periphery of each modulation unit refers to a position where a distance from the modulation unit is within a preset range, and the preset range may be set according to needs, which is not specifically limited in the embodiment of the present invention. For example, the periphery of each modulation unit may be 8 positions, such as the left, upper right, lower right, and lower left, which are closest to the modulation unit, or may be a position next closest to the modulation unit. The number of non-modulating cells around each modulating cell is related to the structure of the light modulating layer, which is generally rectangular, and as an example, the position around each modulating cell closest to the modulating cell is described, 3 cells are around each cell at the vertex position, 5 cells are around each cell at the edge positions other than the vertex position, and 8 cells are around each cell at the edge positions other than the vertex position. If the structure of the light modulation layer is as shown in fig. 3, there are at most 5 non-modulation units and at least 3 non-modulation units around each modulation unit; if the structure of the light modulation layer is as shown in fig. 4, there are 6 non-modulation units at most and 0 non-modulation units at least around each modulation unit; if the structure of the light modulation layer is as shown in fig. 5, there are 4 non-modulation units at most and 0 non-modulation units at least around each modulation unit; if the light modulation layer is structured as shown in fig. 6, there are 8 non-modulation units around each modulation unit.

Taking the structure of the light modulation layer shown in fig. 6 as an example, the light intensity information of the pixel point corresponding to at least one non-modulation unit around each modulation unit may be fitted, and then the fitted light intensity information of the pixel point corresponding to each modulation unit may be determined. The fitting manner may be an arithmetic average, a weighted average, or a manner of selecting a median of the light intensity information, which is not particularly limited in the embodiment of the present invention.

Then, according to the fitting light intensity information of the pixel point corresponding to each modulation unit and the light intensity information of the pixel point corresponding to each non-modulation unit, the image information of the object to be detected can be determined. The image information is complete image information, which includes light intensity information of each pixel.

In the embodiment of the invention, the fitting light intensity information of the pixel point corresponding to each modulation unit is determined through the light intensity information of the pixel point corresponding to at least one non-modulation unit around each modulation unit after the target light beam is irradiated, so that the determined image information of the object to be detected is complete image information according to the fitting light intensity information of the pixel point corresponding to each modulation unit and the light intensity information of the pixel point corresponding to each non-modulation unit, the integrity of the image is ensured, and the integral imaging is not influenced.

based on a smooth filtering method, filtering light intensity information of pixel points corresponding to a plurality of non-modulation units around any modulation unit to obtain fitting light intensity information of the pixel points corresponding to any modulation unit.

Specifically, in the embodiment of the present invention, when fitting light intensity information of a pixel point corresponding to each modulation unit is determined, the fitting light intensity information may be specifically implemented by a smoothing filtering method. The smoothing filtering method may include median filtering, smoothing filtering, gaussian filtering, and the like.

For the median filtering, if the size of the filtering window is 3 × 3 pixel points, the light intensity information of the pixel point corresponding to any modulation unit a is:

f(x,y)＝median[f(x-1,y-1),f(x,y-1),f(x+1,y-1),f(x-1,y),f(x+1,y),f(x-1,y+1),f(x,y+1),f(x+1,y+1)]

wherein, mean represents the operation of taking the median, f (x, y) is the light intensity information of the pixel point corresponding to the modulation unit A, and (x, y) is the coordinate value of the pixel point corresponding to the modulation unit A; f (x-1, y-1) is the light intensity information of the pixel point corresponding to the non-modulation unit at the left lower side of the modulation unit A, and if the left lower side of the modulation unit A is not the non-modulation unit, the value is 0; f (x, y-1) is the light intensity information of the pixel point corresponding to the non-modulation unit below the modulation unit A, and if the non-modulation unit is not below the modulation unit A, the value is 0; f (x +1, y-1) is a pixel point corresponding to a non-modulation unit at the lower right of the modulation unit A, and if the lower right of the modulation unit A is not the non-modulation unit, the value is 0; f (x-1, y) is a pixel point corresponding to the non-modulation unit on the left of the modulation unit A, and if the non-modulation unit on the left of the modulation unit A is not the non-modulation unit, the value is 0; f (x +1, y) is a pixel point corresponding to the non-modulation unit at the right of the modulation unit A, and if the modulation unit A is not the non-modulation unit at the right, the value is 0; f (x-1, y +1) is a pixel point corresponding to a non-modulation unit above the left of the modulation unit A, and if the non-modulation unit is not above the left of the modulation unit A, the value is 0; f (x, y +1) is a pixel point corresponding to a non-modulation unit above the modulation unit A, and if the non-modulation unit is not above the modulation unit A, the value is 0; f (x +1, y +1) is a pixel point corresponding to the non-modulation unit at the upper right of the modulation unit A, and if the non-modulation unit is not at the upper right of the modulation unit A, the value is 0.

For the average filtering, if the size of the filtering window is 3 × 3 pixels, the light intensity information of the pixel corresponding to any modulation unit a is:

f(x,y)＝[f(x-1,y-1)+f(x,y-1)+f(x+1,y-1)+f(x-1,y)+f(x+1,y)+f(x-1,y+1)+f(x,y+1)+f(x+1,y+1)]/8

for gaussian filtering, if the size of the filtering removal window is 3 × 3 pixels, the light intensity information of the pixel corresponding to any modulation unit a is:

f(x,y)＝0.111*[f(x-1,y-1)+f(x+1,y-1)+f(x-1,y+1)+f(x+1,y+1)]+0.139*[f(x,y-1)+f(x-1,y)+f(x+1,y)+f(x,y+1)]

wherein, 0.11 and 0.139 are the weight of the light intensity information of the corresponding pixel points respectively.

inputting initial images obtained based on light intensity information of pixel points corresponding to all non-modulation units after the target light beams are irradiated to a fitting model to obtain image information of the object to be detected output by the fitting model;

the fitting model is constructed on the basis of an antagonistic neural network, and is obtained by training on the basis of a blank sample image with blank pixels and a complete sample image label corresponding to the blank sample image without the blank pixels.

Specifically, when determining the image information of the object to be detected, the embodiment of the invention can be specifically realized by a machine learning method such as a neural network. In the embodiment of the invention, a fitting model is constructed through an anti-neural network, and the fitting model is trained through a blank sample image with blank pixels and a complete sample image label without the blank pixels corresponding to the blank sample image. And finally, inputting an initial image obtained based on the light intensity information of the pixel points corresponding to all the non-modulation units after the target light beam is irradiated to a fitting model, and obtaining the image information of the object to be detected output by the fitting model. The complete sample image label refers to an actual complete sample image corresponding to the vacant sample image.

In the embodiment of the invention, the fitting model constructed based on the antagonistic neural network is introduced, so that the image information of the object to be detected can be determined more quickly and accurately.

On the basis of the above embodiment, the fingerprint living body identification device provided in the embodiment of the present invention further includes: a fitting model training module to:

training generators in the antagonistic neural network based on the vacancy sample images and the complete sample image labels corresponding to the vacancy sample images, and performing competitive identification on the trained generators based on the identifiers in the antagonistic neural network;

and taking the generator obtained by training as the fitting model.

Specifically, the antagonistic neural network comprises a generator and a discriminator, wherein the generator takes the vacant sample image as input and generates a complete sample image corresponding to the vacant sample image as output. The discriminator takes as input a plurality of complete sample images including complete sample image labels and complete sample images generated by the generator. In training, the generator and the discriminator compete with each other. The generator aims to output the complete sample image with high discrimination score through the discriminator as much as possible, and the discriminator aims to make the label score of the complete sample image as high as possible and simultaneously make the score of the complete sample image output by the generator as low as possible. And obtaining a generator after training, and taking the generator obtained by training as a fitting model.

On the basis of the above embodiments, in the living fingerprint identification device provided in the embodiments of the present invention, each modulation unit in the light modulation layer includes a plurality of modulation subunits, and each modulation subunit is a hole-shaped structure or a column-shaped structure.

Specifically, in the embodiment of the present invention, each modulation unit in the light modulation layer includes a plurality of modulation subunits distributed along the surface. The modulation subunits can be in a hole-shaped structure or a column-shaped structure. The modulation subunits having a pore structure may be referred to as modulation pores, and the modulation subunits having a pillar structure may be referred to as modulation pillars. It should be noted that the same modulation unit may only include modulation holes or modulation columns, or may include both modulation holes and modulation columns, so that the modulation unit including modulation holes may be referred to as a hole modulation unit, and the modulation unit including modulation columns may be referred to as a column modulation unit.

Preferably, the light modulation layer may be silicon nitride having a thickness of 200nm to 500 nm. 1000-250000 units can be distributed on the light modulation layer, and the size of each unit is 100 mu m²～40000μm². Wherein, the modulation unit accounts for 10% of the total unit number, and the rest 90% is a non-modulation unit.

Preferably, the light modulation layer may also be silicon with a thickness of 100-400 nm. 1000-250000 units can be distributed on the light modulation layer, and the size of each unit is 100 mu m²～40000μm². Wherein, the modulation unit accounts for 15% of the total units, and the rest 85% is non-modulation unit.

On the basis of the foregoing embodiment, in the fingerprint living body identification device provided in the embodiment of the present invention, the modulation unit in the light modulation layer may specifically be a micro-nano structure unit, and is obtained by etching. The structure of the light modulation layer is shown in fig. 3 to 6. In fig. 3, a plurality of different modulation units are distributed at an edge position of the light modulation layer, each modulation unit may correspond to one or more sensing units, the modulation units may or may not occupy the edge position, may be distributed continuously or discontinuously, and may be located at any edge position, the rest positions of the light modulation layer are non-modulation units, that is, modulation units are not etched, and are blank units, and the target light beam may be directly transmitted to the CIS wafer RGB or black and white pixels below the light modulation layer. And a corresponding sensing unit is arranged below each unit (including a modulation unit and a non-modulation unit) of the light modulation layer. Each modulation unit in the light modulation layer has different modulation effects on light with different wavelengths, the modulation modes of the input spectrum between the modulation units can be the same or different, the different modulation modes can include but are not limited to scattering, absorption, transmission, reflection, interference, excimer, resonance enhancement and the like, and the final effect of the modulation effects is that the transmission spectrums of the light with different wavelengths after passing through the modulation units are different. After the light is modulated by the modulation unit, the light intensity information is detected by the corresponding sensing unit below the modulation unit. Each unit and the sensing unit below the unit form a pixel point. The intensity distribution of each wavelength on one pixel point can be obtained through an algorithm.

In fig. 4, a plurality of different modulation units are distributed at the edge position and the middle position of the light modulation layer, each modulation unit may correspond to one or more sensing units, the modulation units may be located at any edge position or middle position, and may be distributed continuously or discontinuously, and the positions may be selected arbitrarily. Each modulation unit may be an array composed of a plurality of identical modulation subunits, or may be an array composed of a plurality of different modulation subunits.

In fig. 5, every four modulation units on the light modulation layer are a group of modulation units, every four non-modulation units are a group of non-modulation units, and each group of modulation units and each group of non-modulation units are distributed at intervals.

In fig. 6, 8 positions around each modulation element on the light modulation layer are all non-modulation elements, and no other modulation elements exist.

On the basis of the above embodiment, in the fingerprint living body identification device provided in the embodiment of the present invention, the cross-sectional shapes of the holes of the different modulation subunits of each modulation unit, which are in the hole-shaped structure, are not completely the same; and/or the presence of a gas in the gas,

Specifically, in the embodiment of the present invention, the hole cross-sectional shapes of the different modulation holes in each modulation unit may be the same, may be completely different, or may be partially the same and partially different. That is, all the modulation holes in the same modulation unit have the same or different hole sectional shapes. The structural parameters of the modulation apertures in each modulation unit may also be the same, may also be completely different or may be partly the same. Whether the hole cross-sectional shapes of the different modulation holes in each modulation unit are the same does not affect whether the structural parameters are the same. The cross-sectional shape of the hole includes a circle, an ellipse, a cross, a regular polygon, a star or a rectangle. The configuration parameters may include, but are not limited to, the period, radius, side length, duty cycle, thickness, major axis length, minor axis length, rotation angle, or number of angles of the modulation aperture in each modulation unit. The modulation holes can be arranged row by row or column by column according to a preset periodic sequence, or arranged in an array according to a gradual change sequence of the size of the structural parameter.

Since the modulation effect is influenced by the different hole cross-sectional shapes and/or the different structural parameters of the modulation holes in the modulation unit, the modulation effect can be changed by changing the shapes of the modulation holes in the modulation unit. The change in the structural parameter may be a change in any combination of the structural parameters described above.

The period of the modulation hole in each column modulation unit can be between 50nm and 800nm, and the duty ratio can be between 5% and 95%. The period of the modulation hole can also be between 80nm and 600nm, and the duty ratio can also be between 10 percent and 90 percent.

The different modulation units have different spectral modulation effects, which may include, but are not limited to, scattering, absorption, transmission, reflection, interference, surface plasmons, resonance, and the like. The modulation effect can be changed by changing the structural parameters (including but not limited to one or any combination of parameters such as period, radius, side length, duty ratio and thickness) and arrangement mode of the modulation holes in the column modulation unit, and the sensitivity to the difference between different spectrums can be improved by increasing the number of modulation columns.

On the basis of the above embodiment, the fingerprint living body identification device provided in the embodiment of the present invention has the same structural shape and column height of the different modulation subunits which are in the columnar structure in each modulation unit, and the arrangement of all the modulation subunits in each modulation unit has the symmetry of C4.

Specifically, each column modulation unit comprises a plurality of modulation columns, all modulation columns in the same column modulation unit have the same structural shape, and the modulation columns are arranged row by row or column by column according to a preset periodic sequence and have C4 symmetry. All the modulating columns in the same column modulating unit have the same height, and the modulating column heights of different column modulating units can be the same or different. The structural parameters of the modulation column may include height, longitudinal section structural parameters, cross-section structural parameters, and the like. The structural shape of the modulating column may be as shown in fig. 7, including but not limited to a cylinder, cube, truncated cone, bell, etc. The longitudinal cross-sectional shape of the modulating column may be as shown in fig. 8, including but not limited to rectangular, trapezoidal, triangular, bell-shaped, etc. The cross-sectional shape of the modulating column includes rectangular, circular, etc.

The height of the modulation column can be between 100nm and 400 nm. For a cylindrical modulation column, the diameter of the modulation column may be between 10nm and 300 nm. For a cubic modulation column, the cross section of the modulation column can be square or rectangular, and the side length can be between 10nm and 400 nm. For a truncated cone-shaped modulation column, the diameter of the two circular sections of the modulation column can be between 10nm and 400 nm. For a conical shaped modulation column, the diameter of the bottom circle of the modulation column may be between 10nm and 400 nm. For a bell-shaped modulating column, the diameter of the bottom circle of the modulating column may be between 10nm and 400 nm.

On the basis of the above embodiments, in the fingerprint living body identification device provided in the embodiments of the present invention, the modulation subunits of the columnar structure are integrally formed, or are formed by stacking multiple layers of modulation columns.

Specifically, as shown in fig. 9, the spectral imaging chip includes: the light modulation layer 110, the image sensing layer 120 and the signal processing circuit module 130, i.e., the signal processing circuit module 130 in the embodiment of the present invention, are integrated in the spectral imaging chip 100. The modulation unit of the light modulation layer 110 includes a modulation column, which is integrally formed. As shown in fig. 10, the modulation column may also be formed by stacking a plurality of sub-modulation columns, the structural shape of each sub-modulation column may be the same or different, the sub-modulation columns of each layer may be cubes, cylinders, etc., and the material of each sub-modulation column may be the same or different, and may be any one of metal or dielectric. In fig. 10, the modulation column is formed by stacking a plurality of layers of rectangular parallelepipeds.

The same column modulation unit can only contain modulation columns obtained by integral forming, can also only contain stacked modulation columns, and can also contain different modulation columns which are integrally formed and stacked.

On the basis of the above embodiment, the fingerprint living body identification device provided in the embodiment of the present invention further includes: a lens group;

the light source module is arranged between the display screen and the spectral imaging chip, and the lens group is arranged between the light source module and the spectral imaging chip; alternatively, the first and second liquid crystal display panels may be,

Specifically, as shown in fig. 11, the lens assembly 600 is disposed between the display screen 300 and the spectral imaging chip 100, and the lens assembly 600 is disposed between the light source module 200 and the spectral imaging chip 100.

As shown in fig. 12, the light source module 200 is disposed below the non-fingerprint detection area of the display screen 300, and the lens assembly 600 and the spectral imaging chip 100 are sequentially disposed below the fingerprint detection area of the display screen 300.

The lens set may be integrated with a filter for filtering out light in a specific wavelength band of interest, for example, light in a range of 400nm to 598nm, and removing other interference light. The vertical thickness of the lens module can be 0.5mm-20 mm. Preferably, the vertical thickness of the lens module may be 5mm to 10 mm.

The target light beam can be smoothly guided to be incident on the spectral imaging chip through the lens group so as to ensure that the target light beam is imaged on the spectral imaging chip.

On the basis of the above embodiments, the modulation unit includes, but is not limited to, a one-dimensional photonic crystal, a two-dimensional photonic crystal, a surface plasmon, a metamaterial, a super surface, and the like. Specific materials may include silicon, germanium, silicon germanium materials, compounds of silicon, compounds of germanium, metals, group III-V materials, and the like, wherein compounds of silicon include, but are not limited to, silicon nitride, silicon dioxide, silicon carbide, and the like.

On the basis of the above embodiment, in the longitudinal direction, the light modulation layer may include at least one sub-modulation layer disposed along the thickness direction, and the material of each sub-modulation layer may be the same or different, so as to increase the modulation capability of the light modulation layer on the spectrum of the target beam, so that the target beam sampling capability is stronger, which is beneficial to improving the spectrum recovery accuracy. The light modulation layer may have the following four cases in the longitudinal direction.

1) As shown in fig. 13, the polarization independent light modulation layer is a single material layer, and includes a first sub-modulation layer 117, and the light modulation layer has a thickness of 60nm to 1200 nm.

2) As shown in fig. 14 and 15, the polarization independent light modulation layer 110 may include a plurality of sub-modulation layers, each of which is made of a different material. The thickness of each sub-modulation layer is 60nm to 1200 nm. The material of each sub-modulation layer may include silicon, germanium, silicon germanium materials, compounds of silicon, compounds of germanium, metals, III-V materials, and the like, wherein compounds of silicon include, but are not limited to, silicon nitride, silicon dioxide, silicon carbide, and the like. For example, in the embodiment shown in fig. 14, the light modulation layer includes a first sub-modulation layer 117 and a second sub-modulation layer 118; such as the embodiment shown in fig. 15, the light modulation layer includes a first sub-modulation layer 117, a second sub-modulation layer 118 and a third sub-modulation layer 119.

3) As shown in fig. 16, the polarization independent light modulation layer 110 may include multiple sub-modulation layers, each of which is of a different material. The thickness of each sub-modulation layer is 60nm to 1200 nm. One or more of the sub-modulation layers may not be penetrated by modulation aperture 116. The material of each sub-modulation layer may include silicon, germanium, silicon germanium materials, compounds of silicon, compounds of germanium, metals, III-V materials, and the like, wherein compounds of silicon include, but are not limited to, silicon nitride, silicon dioxide, silicon carbide, and the like.

4) As shown in fig. 17, the polarization independent light modulation layer 110 is prepared by directly etching a structure on the light detection layer 122 of the back-illuminated CIS wafer, and the etching depth is 60nm to 1200 nm.

On the basis of the above embodiments, in the longitudinal structure, the light modulation layer may not be penetrated by the modulation pillars or the modulation holes, the modulation pillars may have a certain thickness, specifically, 60nm to 1200nm, and the thickness of the entire light modulation layer may be 120nm to 2000 nm. The thickness of the modulation hole may be 160nm to 1000nm, and the thickness of the entire light modulation layer is 220nm to 1500 nm.

On the basis of the above embodiment, in the longitudinal structure, the light modulation layer may be formed of two different materials, i.e., a silicon layer and a gold layer, and the thickness of the silicon layer may be 60nm to 1200nm and the thickness of the gold layer may be 60nm to 1200 nm.

On the basis of the above embodiments, the image sensing layer in the embodiments of the present invention is specifically a CIS wafer, and the CIS wafer may be a front-illuminated type or a back-illuminated type. As shown in fig. 18, the front-illuminated CIS wafer includes a light detection layer 122 and a metal line layer 121 connected in a thickness direction of an image sensing layer; the light detection layer 122 is below the metal line layer 121, the CIS wafer does not integrate microlenses and filters, and the light modulation layer is directly integrated onto the metal line layer 121. The metal wire layer 121 is used for performing preliminary signal processing on the spectrum signal received by the wafer to convert the optical signal data of the target beam into an electrical signal in advance, so that the processing efficiency of the signal processing circuit module can be improved, and the signal conversion and signal operation processing are more stable and accurate.

As shown in fig. 19, the back-illuminated CIS wafer includes a photo-detection layer 122 and a metal line layer 121 connected in a thickness direction of an image sensing layer; the photo-detection layer 122 is above the metal wire layer 121, the CIS wafer does not integrate micro-lenses and filters, and the light modulation layer is directly integrated onto the photo-detection layer 122. Because the target beam directly irradiates the light detection layer 122 after passing through the light modulation layer, the adverse effect of the metal wire layer on the target beam can be effectively eliminated, and the quantum efficiency of the spectral imaging chip is improved.

On the basis of the above embodiment, as shown in fig. 20a and 20b, the spectral imaging chip further includes: and a light-transmissive dielectric layer 160, the light-transmissive dielectric layer 160 being located between the light modulation layer 110 and the image sensing layer 120. The modulation cells of the light modulation layer 110 in fig. 20a comprise modulation holes 116, and the modulation cells of the light modulation layer 110 in fig. 20b comprise modulation columns 1103. The thickness of the light-transmitting medium layer 160 is 50 nm-1 μm, and the material can be silicon dioxide. If the process scheme is a direct deposition growth process scheme, the light-transmitting dielectric layer 160 may be covered on the image sensing layer 120 by chemical vapor deposition, sputtering, spin coating, and the like, and then the deposition and etching of the light modulation layer may be performed thereon. If a transfer process is used, the light modulating layer may be fabricated on silicon dioxide and then the two portions are transferred integrally to the image sensing layer 120.

In some embodiments, as shown in fig. 21-26, the spectral imaging chip 100 further comprises: at least one of a lens 140 and a filter 150, and at least one of the lens 140 and the filter 150 are attached to a side of the light modulation layer 110 facing away from or near the image sensing layer 120.

As shown in fig. 21, the spectral imaging chip 100 integrates a lens 140, and the lens 140 is located on a side of the light modulation layer 110 close to the image sensing layer 120, i.e., the lens 140 is located between the light modulation layer 110 and the image sensing layer 120.

As shown in fig. 22, the spectral imaging chip 100 integrates a lens 140, and the lens 140 is located on a side of the light modulation layer 110 away from the image sensing layer 120.

As shown in fig. 23, the spectral imaging chip 100 integrates the optical filter 150, and the optical filter 150 is located on a side of the light modulation layer 110 close to the image sensing layer 120, that is, the optical filter 150 is located between the light modulation layer 110 and the image sensing layer 120.

As shown in fig. 24, the spectral imaging chip 100 integrates a filter 150, and the filter 150 is located on a side of the light modulation layer 110 away from the image sensing layer 120.

As shown in fig. 25, the spectral imaging chip 100 integrates a lens 140 and a filter 150, the lens 140 and the filter 150 are located on the side of the light modulation layer 110 away from the image sensing layer 120, and the filter 150 is located between the lens 140 and the light modulation layer 110.

As shown in fig. 26, the spectral imaging chip 100 integrates a lens 140 and a filter 150, and the lens 140 and the filter 150 are located on a side of the light modulation layer 110 close to the image sensing layer 120, that is, the lens 140 and the filter 150 are located between the light modulation layer 110 and the image sensing layer 120, and the filter 150 is located between the lens 140 and the image sensing layer 120.

In summary, the spectral imaging chip adopted in the embodiment of the present invention has the following effects: 1) the spectrum imaging chip can acquire image information and spectrum information at the same time, and provides spectrum information of different points in a visual field while providing complete image information. 2) The preparation of the spectrum chip can be completed through one-time chip flow of the CMOS process, the failure rate of the device is reduced, the finished product yield of the device is improved, and the cost is reduced. 3) The light modulation layer and the image sensing layer are integrated in a single chip mode, discrete elements are omitted, stability of devices is improved, and miniaturization and light weight of the image sensor are greatly promoted. 4) Monolithic integration is achieved at the wafer level, the distance between the sensor and the light modulation layer can be reduced to the greatest extent, the size of a unit is reduced, higher resolution is achieved, and packaging cost is reduced.

Further, as shown in fig. 27, the present invention provides an optical fingerprint identification assembly, which includes a display screen 300 and a fingerprint module 1000, wherein the fingerprint module 1000 is disposed at a lower end of the display screen 300, wherein the display screen 300 can be implemented as an LCD screen, an OLED screen, or the like; further, the optical fingerprint identification assembly further includes a light source module 200, the light source module 200 is disposed on the fingerprint identification device, and the light source module 200 and the fingerprint module 1000 are disposed correspondingly. During identification, the light source module 200 emits light to the object 500 to be detected, and a target light beam can be obtained after the light is reflected by the object 500 to be detected, and the target light beam is incident to the fingerprint module 1000 to be received.

In some embodiments, the fingerprint module is not necessarily used in combination with the display screen, that is, in the application of the embodiment, the terminal product does not need to be provided with the display screen, and the fingerprint module can also realize fingerprint identification.

It should be noted that, in some embodiments, the light source module 200 is integrated into the display screen 300, for example, when the display screen 300 is implemented as an OLED screen, a light beam projected by the display screen itself can be used to assist in identifying the object 500 to be detected.

Further, as shown in fig. 28, the fingerprint module 1000 includes a spectral imaging chip 100 and a circuit board 1001, the spectral imaging chip 100 is electrically connected to the circuit board 1001, and preferably, the spectral imaging chip 100 is attached to the circuit board 1001. The Circuit Board 1001 may be implemented as a hard Board (PCB), a Flexible Printed Circuit (FPC), a Flexible-rigid Board (F-PCB), a ceramic substrate, or the like, which is mainly used to conduct and/or support the spectral imaging chip 100.

Further, for example, the spectral imaging chip 100 is attached to a circuit board 1001, and the spectral imaging chip 100 may be conducted with the circuit board 1001 by a wire bonding, or may be conducted by directly placing a pad on the back; in some embodiments, the fingerprint module further includes a stiffener 1002, and the stiffener 1002 is attached to the circuit board 1001 to enhance the reliability of the fingerprint module 1000. In some embodiments, the fingerprint module 1000 further includes a package portion 1003 formed on the upper surface of the circuit board 1001, and the package portion 1003 may be implemented as a molding process integrally formed on the circuit board or as a glue applied to the circuit board 1001. It should be noted that the encapsulating portion 1003 may also integrally wrap the lead for conduction, the encapsulating portion 1003 is favorable for improving the reliability of the fingerprint module, and further the encapsulating portion 1003 has a flat surface, so that the fingerprint module is better attached to the display screen 300. Due to the existence of the reinforcing plate 1002, the circuit board can be implemented as a flexible board, so that the thickness of the fingerprint module is reduced. In some embodiments, the fingerprint module 1000 may further include a light shielding portion 1004, where the light shielding portion 1004 is disposed on an upper surface of the encapsulating portion 1003 to prevent stray light from entering and affecting imaging. The light-shielding portion may be implemented as foam.

In another embodiment of the present invention, as shown in fig. 29, the fingerprint module 1000 includes a spectrum imaging chip 100, a circuit board 1001, a bracket 1005 and a light source module 200, the spectrum imaging chip 100 and the bracket 1005 are fixed on the circuit board 1001, and the light source module 200 is fixed on the bracket 1005.

Further, the fingerprint module in the embodiment of the present invention may further include a lens set for optical focusing, where the lens set is disposed on the photosensitive path of the spectral imaging chip 100. The lens component can be a vertical collimating lens, a thin film lens, a micro lens array, a wide-angle lens and the like.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment may be implemented by software plus a necessary general hardware platform, and may also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A fingerprint living body identification device, comprising: the fingerprint detection device comprises a display screen, a light source module, a spectrum imaging chip, a signal processing circuit module and an identification module, wherein a fingerprint detection area is arranged on the display screen; the light source module is used for irradiating an object to be detected in the fingerprint detection area, and a target light beam obtained after the object to be detected is reflected is incident on the spectral imaging chip; the spectral imaging chip and the signal processing circuit module are two independent parts or the signal processing circuit module is integrated in the spectral imaging chip;

2. The fingerprint identification device of claim 1, wherein the spectral imaging chip comprises: a light modulation layer and an image sensing layer which are sequentially stacked in a thickness direction; the light modulation layer is distributed with at least one modulation unit and at least one non-modulation unit along the surface; the image sensing layer is distributed with a plurality of sensing units along the surface, and each modulation unit and each non-modulation unit respectively correspond to at least one sensing unit along the thickness direction; the signal processing circuit module is electrically connected with the sensing unit.

3. The fingerprint liveness identification device according to claim 1, wherein the signal processing circuit module is specifically configured to:

4. The apparatus for fingerprint identification according to claim 3, wherein the signal processing circuit module is specifically configured to:

5. The apparatus for fingerprint identification according to claim 1, wherein the signal processing circuit module is further configured to:

6. The fingerprint identification device of claim 2, wherein each modulation unit in the light modulation layer comprises a plurality of modulation subunits, and each modulation subunit is a hole-shaped structure or a column-shaped structure.

7. The fingerprint living body identification device according to claim 6, wherein the hole cross-sectional shapes of the different modulation subunits of the hole-like structure in each modulation unit are not identical; and/or the presence of a gas in the gas,

8. The fingerprint identification apparatus of claim 6, wherein the different modulation subunits in each modulation unit having the columnar structure have the same structural shape and column height, and all modulation subunits are arranged in each modulation unit with C4 symmetry.

9. The fingerprint living body identification device according to claim 6, wherein the modulation subunits of the columnar structures are integrally formed or formed by laminating a plurality of layers of modulation columns.

10. The fingerprint living body identification device according to any one of claims 1-9, further comprising: a lens group;

11. The utility model provides a fingerprint module which characterized in that includes: the spectral imaging chip is electrically connected to the circuit board;

the spectrum imaging chip comprises a light modulation layer, an image sensing layer and a signal processing circuit module which are sequentially stacked along the thickness direction; wherein, the light modulation layer is distributed with at least one modulation unit and at least one non-modulation unit along the surface; the image sensing layer is distributed with a plurality of sensing units along the surface, and each modulation unit and each non-modulation unit respectively correspond to at least one sensing unit along the thickness direction.

12. The fingerprint module of claim 11, further comprising: a stiffener attached to the circuit board.

13. The fingerprint module of claim 11, further comprising: and the packaging part is formed on the upper surface of the circuit board.

14. The fingerprint module of claim 13, further comprising: a light shielding portion disposed on an upper surface of the encapsulation portion.