CN114517073B - UV moisture curing adhesive for joint filling - Google Patents
UV moisture curing adhesive for joint filling Download PDFInfo
- Publication number
- CN114517073B CN114517073B CN202210175332.8A CN202210175332A CN114517073B CN 114517073 B CN114517073 B CN 114517073B CN 202210175332 A CN202210175332 A CN 202210175332A CN 114517073 B CN114517073 B CN 114517073B
- Authority
- CN
- China
- Prior art keywords
- moisture
- resin
- curing
- parts
- based compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004839 Moisture curing adhesive Substances 0.000 title claims abstract description 17
- 238000011049 filling Methods 0.000 title abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 238000001723 curing Methods 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims abstract description 16
- 239000000178 monomer Substances 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 17
- 229920005862 polyol Polymers 0.000 claims description 11
- 150000003077 polyols Chemical class 0.000 claims description 11
- -1 oxime ester Chemical class 0.000 claims description 8
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 6
- 150000002513 isocyanates Chemical class 0.000 claims description 6
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 229920005906 polyester polyol Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 claims description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- KOMDZQSPRDYARS-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical compound [Ti].C1C=CC=C1.C1C=CC=C1 KOMDZQSPRDYARS-UHFFFAOYSA-N 0.000 claims description 2
- 150000002009 diols Chemical class 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003208 petroleum Substances 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- 150000003254 radicals Chemical class 0.000 claims 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract description 10
- 238000013008 moisture curing Methods 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- VPASWAQPISSKJP-UHFFFAOYSA-N ethyl prop-2-enoate;isocyanic acid Chemical compound N=C=O.CCOC(=O)C=C VPASWAQPISSKJP-UHFFFAOYSA-N 0.000 description 4
- 229920000909 polytetrahydrofuran Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- IIQWTZQWBGDRQG-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate;isocyanic acid Chemical compound N=C=O.CCOC(=O)C(C)=C IIQWTZQWBGDRQG-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002523 polyethylene Glycol 1000 Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a UV moisture curing adhesive for joint filling, which comprises the following components in parts by weight: 20-60 parts of UV moisture dual-curing resin, 5-20 parts of UV moisture dual-curing monomer, 10-40 parts of polyurethane prepolymer, 10-20 parts of tackifying resin, 0.1-4 parts of photoinitiator, 0.2-1.5 parts of silane coupling agent and 0.1-5 parts of filler; the adhesive with high initial strength after UV irradiation and high strength after pure moisture curing can be obtained through the formula design, and the adhesive is particularly suitable for caulking of structures which cannot be irradiated by UV light such as U-shaped structures, L-shaped structures and the like.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a UV moisture curing adhesive for joint filling, which is particularly suitable for blind area structures.
Background
In recent years, more and more electronic devices tend to be lighter and thinner designs; after mechanical fixing, some small gaps are usually formed, so that glue is needed for filling, and the functions of attractive appearance, adhesion or other functions are achieved; the joint compound of the pure UV system has the advantages of good wiping performance and quick surface drying, but for some U-shaped L-shaped blind area structures, the parts which cannot be found by light cannot be solidified, and the risks are brought to the use of components; some traditional UV moisture curing adhesives have the bonding force of generally less than 1MPa after pure moisture curing, and cannot meet the bonding requirement.
In response to these problems, there is a need for an adhesive that meets the requirements for adhesion after pure moisture cure.
Disclosure of Invention
In view of the defects in the prior art, the invention aims to provide a UV moisture curing adhesive for caulking, which can achieve higher bonding strength after UV irradiation curing and can achieve higher strength without irradiating UV part.
The invention aims at realizing the following scheme:
the first aspect of the invention provides a UV moisture curing adhesive for caulking, which comprises the following components in parts by weight:
preferably, the UV moisture dual cure resin is a resin having isocyanate groups and radical polymerizable groups and a molecular weight (Mw) of 500 to 5000.
Preferably, the UV moisture dual curing monomer is a compound having a molecular weight (Mw) of 300 or less containing an isocyanate group and a radical polymerizable group, and isocyanate ethyl acrylate or isocyanate ethyl methacrylate and the like may be selected, and isocyanate ethyl Acrylate (AOI) is preferred.
Preferably, the radical polymerizable group is a group having an unsaturated double bond.
Preferably, the polyurethane prepolymer is a compound with terminal isocyanate groups, which is obtained by reacting a polyol with an isocyanate curing agent.
Preferably, the polyol is selected from at least one of polyether polyols (e.g., PEG, PPG, PTMEG), polycarbonate diols, and polyester polyols polymerized from a polyacid and a polyol.
Preferably, the isocyanate curing agent is selected from at least one of MDI, HDI, TDI, IPDI.
Preferably, the tackifying resin is a resin that is miscible with the polyurethane system and is selected from at least one of TPU, petroleum resin, rosin resin, thermoplastic polyester, polyacrylic resin, and epoxy resin.
Preferably, the photoinitiator comprises at least one of benzophenone-based compounds, acetophenone-based compounds, acyl phosphine oxide-based compounds, titanocene-based compounds, oxime ester-based compounds, benzoin ether-based compounds, and thioxanthones.
Preferably, the silane coupling agent is selected from the group consisting of A-187, A-189, A-174, and the like having a trimethoxy or triethoxy group at one end and a reactive group at the other end.
Preferably, the filler is solid filling powder and is at least one selected from silicon dioxide, calcium carbonate and barium sulfate.
The second aspect of the present invention provides a method for preparing a UV moisture curable adhesive for caulking, comprising the steps of: reacting polyol with isocyanate curing agent to obtain polyurethane prepolymer; the UV moisture dual-curing resin, the UV moisture dual-curing monomer, the polyurethane prepolymer, the tackifying resin, the photoinitiator, the silane coupling agent and the nitrogen atmosphere are mixed uniformly, and then the filler is added for high-speed dispersion.
Compared with the prior art, the invention has the following beneficial effects: the UV moisture curing adhesive for joint filling can achieve a pure moisture curing adhesive force of more than 3-10kgf/die (3X 3 mm) at a position which cannot be irradiated by UV light in a blind area, and the excellent adhesive force can ensure that a product comprising the design can be used more stably, so that the UV moisture curing adhesive is particularly suitable for blind area structures.
Conventional UV wet gas adhesives often incorporate pure UV curable monomers and resins such as isobornyl acrylate and double bond terminated polyester acrylates to increase initial strength. These raw materials cannot be cured at all in places where light cannot reach, which is equivalent to adding a higher content of plasticizer into one cured product, so that the pure moisture cured strength of the formula is generally below 1kgf/die (3×3 mm), while the resin adopted by the invention contains NCO groups cured by moisture, so that the pure moisture cured can also reach higher strength; the small-molecule isocyanate acrylate monomer replaces the traditional pure acrylate monomer, so that the adhesive also keeps lower viscosity and UV initial-setting viscosity; the addition of tackifying resins such as thermoplastic acrylic resin also makes the adhesive exhibit higher initial and final strengths.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
The invention provides a preparation method of a UV moisture curing adhesive for joint filling, which comprises the following steps:
reacting polyol with isocyanate curing agent to obtain polyurethane prepolymer; and adding the photoinitiator and the UV moisture dual-curing monomer into a round bottom flask according to a proportion, mechanically stirring under a nitrogen atmosphere at 500RPM until the photoinitiator is completely dissolved, then adding the raw materials such as the UV moisture dual-curing resin, the polyurethane prepolymer, the tackifying resin, the silane coupling agent and the like, continuously stirring at 500RPM, uniformly mixing, and then adding the filler at 1500RPM for high-speed dispersion for about 30 minutes to obtain the ultraviolet light-curable resin.
The adhesive with high initial strength after UV irradiation and high strength after pure moisture curing can be obtained through the formula design, and the adhesive is particularly suitable for caulking of structures which cannot be irradiated by UV light such as U-shaped structures, L-shaped structures and the like.
Examples 1 to 6
Preparation of polyurethane prepolymer A
25 parts of polypropylene glycol (polyether polyol, PPG 1000), 30 parts of polymethylene ether glycol (PTMEG 2000), 15 parts of polyester polyol (adipic acid and hexanediol copolymer, 3500 molecular weight) were added to a 500mL three-necked flask, and mixed under stirring at 100℃under vacuum (20 mmHg) for 1.5 hours, followed by adding 30 parts of diphenylmethane diisocyanate (Wanhua, MDI-100) and stirring at 90℃for 2 hours to obtain polyurethane prepolymer A.
Preparation of polyurethane prepolymer B
10 parts of polyethylene glycol (PEG 1000), 20 parts of polymethylene ether glycol (PTMEG 2000), 5 parts of polyester polyol (terephthalic acid and hexanediol copolymer, 2000 molecular weight) were added to a 500mL three-necked flask, and mixed under stirring at 100℃under vacuum (20 mmHg) for 1.5 hours, followed by adding 30 parts of diphenylmethane diisocyanate (Wanhua, MDI-100) and stirring at 90℃for 2 hours to obtain polyurethane prepolymer B.
Preparation of polyurethane prepolymer C
70 parts of polymethylene ether glycol (PTMEG 2000) was stirred and mixed at 100℃under vacuum (20 mmHg) for 1.5 hours, and then 30 parts of diphenylmethane diisocyanate (Wanhua, MDI-100) was added thereto and stirred at 90℃for 2 hours to obtain polyurethane prepolymer C.
The raw materials are added into a flask one by one according to the proportion listed in the table 1, stirred and mixed under the protection of nitrogen, and defoamed for standby.
Table 1, UV moisture curing Adhesives obtained in examples 1 to 6, the proportions of the respective components and the results of the tests
The performance test method comprises the following steps: the adhesives prepared in examples 1 to 6 were applied to a substrate, and then a 1×1mm glass sheet was placed at the glue application point, and laminated to the substrate, and the initial strength and 24h strength after UV irradiation were tested, and the strength without UV irradiation; the UV moisture curing adhesives obtained in examples 1 to 6 were tested using a DAGA4000 pusher, and the results are shown in Table 1. As can be seen from the results in Table 1, the UV moisture curing adhesives prepared in examples 1 to 6 have initial strengths of 0.5 to 2.2kgf after UV irradiation; the intensity of 24 hours after UV irradiation is 11-19kgf; the strength after curing with pure moisture for 24 hours is 3-10kgf.
Table 2, the respective component ratios and test results of the UV moisture curing adhesives of comparative examples 1 to 7
As can be seen from the results of Table 2, the UV moisture curing adhesives prepared using the formulations of comparative examples 1 to 5 had initial strengths of 1.2 to 3kgf after UV irradiation; the intensity of 24 hours after UV irradiation is 12-20kgf; the strength after curing with pure moisture for 24 hours is only 0.3-0.8kgf. In combination with examples 1, comparative examples 1 and 2, 5, or examples 1, comparative examples 3 and 4, 5, it was found that the pure moisture cured strength was greatly reduced after the addition of the pure UV cured resin and/or UV monomer, and the pure moisture cured strength was not improved even if the amount of polyurethane prepolymer was increased, whereas in each example, the pure moisture cured strength was greatly increased after the addition of the pure UV cured resin or monomer. As can be seen from the data of comparative examples 6 and 7, the UV moisture dual curing resin, UV moisture dual curing monomer, polyurethane prepolymer and tackifying resin have reduced pure moisture curing strength after exceeding the corresponding ranges.
The invention optimizes based on the traditional formula, the UV moisture dual-curing resin, the UV moisture dual-curing monomer, the polyurethane prepolymer and the like contained in the formula contain isocyanate groups, meanwhile, the dual-curing monomer (isocyanate ethyl acrylate) plays a certain role in dissolution and dilution, the low viscosity process operability of glue is ensured, the curing rate and the basic initial strength can be ensured during UV curing, the combination has good performance in terms of pure moisture curing, higher strength can be achieved, and the adhesive is very suitable for bonding devices which are required to be rapidly fixed on the surface and have blind area filling which is not reached by UV irradiation.
The foregoing describes specific embodiments of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without affecting the spirit of the invention. The embodiments of the present application and features in the embodiments may be combined with each other arbitrarily without conflict.
Claims (5)
1. The UV moisture curing adhesive for caulking is characterized by comprising the following components in parts by weight:
the UV moisture dual-curing resin is resin containing isocyanate groups and free radical polymerizable groups and having a molecular weight of 500-50000; the UV moisture dual-curing monomer is a compound containing isocyanate groups and free radical polymerizable groups and having a molecular weight of 300 or less; the radical polymerizable group is a group having an unsaturated double bond; the polyurethane prepolymer is a compound with an isocyanate group as a terminal group, which is obtained by reacting polyol with an isocyanate curing agent, and the tackifying resin is a resin which can be mixed with a polyurethane system and is at least one of TPU, petroleum resin, rosin resin, thermoplastic polyester, polyacrylic resin and epoxy resin.
2. The UV moisture curable adhesive for caulking according to claim 1, wherein said polyol is selected from at least one of polyether polyols, polycarbonate diols, polyacids and polyol polymerized polyester polyols.
3. The UV moisture curable adhesive for caulking according to claim 1, wherein said isocyanate curing agent is selected from at least one of MDI, HDI, TDI, IPDI.
4. The UV moisture curable adhesive for caulking according to claim 1, wherein said photoinitiator comprises at least one of benzophenone-based compounds, acetophenone-based compounds, acylphosphine oxide-based compounds, titanocene-based compounds, oxime ester-based compounds, benzoin ether-based compounds, thioxanthone.
5. The UV moisture-curable adhesive for caulking according to claim 1, wherein said silane coupling agent is selected from the group consisting of compounds having trimethoxy or triethoxy groups at one end and reactive groups at the other end, and said filler is a solid filler powder selected from at least one of silica, calcium carbonate, and barium sulfate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210175332.8A CN114517073B (en) | 2022-02-24 | 2022-02-24 | UV moisture curing adhesive for joint filling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210175332.8A CN114517073B (en) | 2022-02-24 | 2022-02-24 | UV moisture curing adhesive for joint filling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114517073A CN114517073A (en) | 2022-05-20 |
| CN114517073B true CN114517073B (en) | 2024-02-13 |
Family
ID=81599623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210175332.8A Active CN114517073B (en) | 2022-02-24 | 2022-02-24 | UV moisture curing adhesive for joint filling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114517073B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114292619B (en) * | 2021-12-07 | 2023-09-08 | 深圳市摩码克来沃化学科技有限公司 | Adhesive, adhesive film and bonding method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0964012A1 (en) * | 1998-06-09 | 1999-12-15 | National Starch and Chemical Investment Holding Corporation | UV / Moisture cure adhesive |
| CN107312492A (en) * | 2017-06-30 | 2017-11-03 | 张家港康得新光电材料有限公司 | A kind of double solidification adhesives and adhesive tape |
| CN110079265A (en) * | 2019-05-10 | 2019-08-02 | 广州回天新材料有限公司 | A kind of UV+ moisture dual cure pressure sensitive adhesive and preparation method thereof |
| CN112920762A (en) * | 2021-02-25 | 2021-06-08 | 杭州宝明新材料科技有限公司 | UV/moisture dual-curing adhesive capable of being rapidly bonded and preparation method thereof |
-
2022
- 2022-02-24 CN CN202210175332.8A patent/CN114517073B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0964012A1 (en) * | 1998-06-09 | 1999-12-15 | National Starch and Chemical Investment Holding Corporation | UV / Moisture cure adhesive |
| CN107312492A (en) * | 2017-06-30 | 2017-11-03 | 张家港康得新光电材料有限公司 | A kind of double solidification adhesives and adhesive tape |
| CN110079265A (en) * | 2019-05-10 | 2019-08-02 | 广州回天新材料有限公司 | A kind of UV+ moisture dual cure pressure sensitive adhesive and preparation method thereof |
| CN112920762A (en) * | 2021-02-25 | 2021-06-08 | 杭州宝明新材料科技有限公司 | UV/moisture dual-curing adhesive capable of being rapidly bonded and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114517073A (en) | 2022-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1427790B2 (en) | Easy to manufacture meth(acrylic) adhesive compositions | |
| US8173048B2 (en) | Composition for circuit connection film and circuit connection film using the same | |
| CN110352225B (en) | Epoxy acrylic acid mixed adhesive | |
| CN111286297B (en) | High-strength ultraviolet/moisture dual-curing adhesive and preparation method and use method thereof | |
| CN114517073B (en) | UV moisture curing adhesive for joint filling | |
| CN115175945B (en) | Photo-moisture curable resin composition, adhesive for electronic component, cured body, and electronic component | |
| CN108395847A (en) | A kind of high-strength light, heat activated blocked polyurethane adhesive and preparation method thereof and application method | |
| KR101906644B1 (en) | Conductive resin composition and cured object using same | |
| TWI410474B (en) | Composition for anisotropic conductive film and anisotropic conductive film using the same | |
| JPH11263963A (en) | One-pack type moisture-curable urethane liquid type adhesive composition | |
| KR20170014090A (en) | Adhesive composition for decoration sheet, adhesive sheet and decoration panel | |
| JP6024505B2 (en) | Curable resin composition, transparent surface material with adhesive layer and laminate | |
| WO2014065048A1 (en) | Novel electronic circuit reinforcing agent | |
| JP3447555B2 (en) | One-part moisture-curable urethane liquid adhesive composition | |
| JP6084145B2 (en) | Anisotropic conductive adhesive composition and anisotropic conductive adhesive film using the same | |
| JP2003261763A (en) | Aqueous emulsion composition and aqueous adhesive composition containing the same or primer composition for water paint | |
| KR20230028207A (en) | Light moisture curable resin composition, and cured product | |
| JP5050517B2 (en) | Manufacturing method of photocurable resin composition, photocurable moisture-proof insulating coating for mounting circuit board, mounting circuit board, and manufacturing method of mounting circuit board | |
| WO2022260053A1 (en) | Photo/moisture-curable resin composition, adhesive for electronic components, cured body, and electronic component | |
| WO2023112873A1 (en) | Adhesive composition, adhesive for electronic components, and adhesive for portable electronic devices | |
| JP7537218B2 (en) | Adhesive film for circuit connection, circuit connection structure and method for producing same | |
| JP2019123785A (en) | Reactive hot-melt adhesive composition for rework | |
| CN104507992A (en) | UV-curing hot melt adhesive containing low content of oligomers | |
| WO2024143421A1 (en) | Adhesive composition, cured body, and adhesive for electronic devices | |
| CN118772830A (en) | Bi-component photo-curable acrylate composite adhesive and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A UV moisture curing adhesive for joint filling Granted publication date: 20240213 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Huangpu sub branch Pledgor: BONOTEC ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2024310000911 |