CN114512430A - 一种气浮载台 - Google Patents

一种气浮载台 Download PDF

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CN114512430A
CN114512430A CN202210105746.3A CN202210105746A CN114512430A CN 114512430 A CN114512430 A CN 114512430A CN 202210105746 A CN202210105746 A CN 202210105746A CN 114512430 A CN114512430 A CN 114512430A
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air
plate
bearing
negative pressure
carrier
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闫兴
陶为银
巩铁建
蔡正道
乔赛赛
张伟
鲍占林
王鹏
杜磊
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Henan General Intelligent Equipment Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16CSHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00Bearings not otherwise provided for
    • F16C32/06Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F16C32/0603Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
    • F16C32/0614Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion the gas being supplied under pressure, e.g. aerostatic bearings
    • F16C32/0622Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion the gas being supplied under pressure, e.g. aerostatic bearings via nozzles, restrictors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)

Abstract

本发明公开了一种气浮载台,包括:底板,底板的上表面两侧均设置有侧板,两侧的侧板顶部固定有DD马达安装板,侧板上均安装有载台气浮平板轴承,侧板外部设置有载台气浮平板轴承,载台气浮平板轴承旋入载台气动直通接头,侧板内壁上设置有载台气动三通接头,侧板外侧设置载台气动L型接头,所述底板上设置有正压入口和负压入口。本发明经正压连通管道内的排出的气流,使得底板与大理石基座之间形成气膜,将气浮载台托起,溢出的空气一部分进入真空吸附腔从负压口排除。经载台气浮平板轴承排出的气流与横梁之间形成气膜,气浮载台通过X轴直线电机驱动,在运行过程中,通过正压与负压之间配合能够平稳的运行。

Description

一种气浮载台
技术领域
本发明涉及晶圆隐切技术领域,特别是涉及一种气浮载台。
背景技术
晶圆激光隐切和及晶圆low-k膜激光刻槽等高精度加工过程中,要求整个运动系统运行稳定性高,普通导轨在低俗运行中容易爬行,高速运行过程中生热严重,长期运行需要定期维护,运行过程中摩擦阻力大,设备精度收安装底座、导轨、滑块、滑块安装座等多因素影响。普通导轨在低俗运行中容易爬行,高速运行过程中生热严重,长期运行需要定期维护,运行过程中摩擦阻力大,设备精度收安装底座、导轨、滑块、滑块安装座等多因素影响。
常规气浮轴承多采用正压加负压方式,正压入口将大量压缩空气排出支撑起气浮轴承,负压则通过真空气腔将气浮轴承与接触面吸引,通过正压和负压的相互作用使得气浮轴承稳定运行,采用负压会引起过多资源的浪费,负压的压力不稳定会引起气浮轴承运行的波动。
发明内容
为解决上述技术问题,本发明提供一种能够在运行过程中平稳、并能减小摩擦的气浮载台。
具体方案如下:
一种气浮载台,包括:底板,底板的上表面两侧均设置有侧板,两侧的侧板顶部固定有DD马达安装板,侧板上均安装有载台气浮平板轴承,侧板外部设置有载台气浮平板轴承,载台气浮平板轴承旋入载台气动直通接头,侧板内壁上设置有载台气动三通接头,侧板外侧设置载台气动L型接头,所述底板上设置有正压入口和负压入口。
气浮载台底部分为四等分,每一等分的四角均设置有压缩空气导流槽,压缩空气导流槽为十字型,十字型中部设置有红宝石喷嘴,每一等分的其余部分均为负压吸附腔,负压吸附腔的中部为负压口。
底板的侧方设置正压通道口和负压通道口,分别于红宝石喷嘴和负压口连接。
侧板上设置有光栅窗。
DD马达安装板上设置有压线槽,压线槽上设置有压线块。
一种气浮载台,包括:底板,底板的上表面两侧均设置有侧板,两侧的侧板顶部固定有DD马达安装板,侧板上均安装有载台气浮平板轴承,侧板外部设置有载台气浮平板轴承,载台气浮平板轴承旋入载台气动直通接头,侧板内壁上设置有载台气动三通接头,侧板外侧设置载台气动L型接头,所述底板上设置有正压入口和负压入口。
本发明经正压连通管道内的排出的气流,使得底板与大理石基座之间形成气膜,将气浮载台托起,溢出的空气一部分进入真空吸附腔从负压口排除。经载台气浮平板轴承排出的气流与横梁之间形成气膜,气浮载台通过X轴直线电机驱动,在运行过程中,通过正压与负压之间配合能够平稳的运行。
附图说明
图1为气浮切割平台;
图2为横梁安装座和气浮侧板之间的连接关系图;
图3为图2的侧视图;
图4为气浮载台的结构示意图;
图5为底座的零件图;
图6为图5的俯视图;
图7为图6中A局部放大图。
1、大理石基座,2、横梁安装座,3、气浮侧板,4、磁性材料,5、第一磁铁,6、载台气浮平板轴承,7、横梁,8、底板,9、侧板 ,10、DD马达安装板,11、侧板气浮调节块,12、安装板气浮调节块,13、压缩空气导流槽,14、红宝石喷嘴,15、负压吸附腔,16、负压口,17、安装板气浮平板轴承,18、侧板气浮平板轴承,19、正压入口,20、负压入口。
具体实施方式
下面将结合本发明中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本发明一部分实施,而不是全部的实施,基于本发明的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
如图1-图7所示。一种气浮切割平台,包括:大理石基体,所述大理石基体的上表面伸出大理石基座1,大理石基座1两侧设置有横梁安装座2和气浮侧板3,横梁安装座2与气浮侧板3垂直安装构成直角,并与大理石基座1配合,大理石基座1的两侧均设置有磁性材料4;气浮侧板3上设置有与磁性材料4高度相对应的第一磁铁5,第一磁铁5的下方设置有侧板气浮平板轴承18,横梁安装座2上表面设置有横梁安装槽,横梁安装座2底部设置有安装板气浮平板轴承17,气浮侧板3在受到气浮力与磁力的作用下保持平衡,横梁安装座2在在受到重力与气浮力之间保持平衡;横梁安装槽中固定有横梁7,横梁7上移动安装有气浮载台。所述的磁性材料4包括磁铁与铁磁材料,磁性材料4与第一磁铁5之间产生吸引力,从侧板气浮平板轴承18排出的正压空气喷射在大理石基座1上,在大理石基座1上产生气膜,使得气浮侧板3受到一个远离大理石基座1的斥力,与磁性材料4与第一磁铁5之间的吸力相平衡。横梁安装座2通过Y轴直线电机驱动,沿着大理石基座1运动,在气力和磁力的共同作用下,横梁安装座2能够平稳的运行。大理石基座1上设置有多个Y轴缓冲器,使得横梁安装座2的运行能够避免超出行程。
气浮侧板3上设置有侧板气浮调节块11,侧板气浮调节块11通过旋转位于侧板气浮调节块11上的侧板气浮调节块螺丝改变气浮侧板3与大理石基座1之间的距离,横梁安装座2上设置有安装板气浮调节块12,安装板气浮调节块12通过旋转位于安装板气浮调节块12螺丝改变横梁安装座2与大理石基座1之间的距离。所述气浮载台包括:底板8,底板8的上表面两侧均设置有侧板9,两侧的侧板9顶部固定有DD马达安装板10,横梁7滑动连接在底板8的上表面,侧板9上均安装有载台气浮平板轴承6,侧板9外部设置有载台气浮平板轴承6,载台气浮平板轴承6旋入载台气动直通接头,侧板9内壁上设置有载台气动三通接头,侧板9外侧设置载台气动L型接头,所述底板8上设置有正压入口19和负压入口20。DD马达安装板10上设置有压线槽,压线槽上设置有压线块。
气浮载台底部分为四等分,每一等分的四角均设置有压缩空气导流槽13,压缩空气导流槽13为十字型,十字型中部设置有红宝石喷嘴14,每一等分的其余部分均为负压吸附腔15,负压吸附腔15的中部为负压口16。底板8的侧方设置正压连通管道口和负压通道口,分别于红宝石喷嘴14和负压口16连接。
空气从正压入口19进入,经正压连通管道将空气从压缩空气导流槽1313中喷出,气体经过红宝石喷嘴14后气体从紊流变为层流,与大理石基座1基础形成气膜,将气浮载台托起,溢出的空气一部分进入真空吸附腔从负压口排除。气浮载台通过X轴直线电机驱动,在运行过程中,通过正压与负压之间配合能够平稳的运行。
侧板9上设置有光栅窗。横梁7上设置有光栅尺,光栅尺能够反馈气浮载台的运动位置,在横梁7的两端设置有X轴缓冲器,放置气浮载台在运动过程中,防止超出行程。在横梁7的两端设置固定风琴罩,保护内部并且能够防尘。
本发明的气浮侧板3在受到气浮力与磁力的作用下保持平衡,横梁安装座2在在受到重力与气浮力之间保持平横,横梁安装座2在Y轴直线电机驱动下,沿着大理石基座1运动,在气力和磁力的共同作用下,横梁安装座2能够平稳的运行,使得在隐切过程中加工平台的平稳。大理石基座1上设置有多个Y轴缓冲器,使得横梁安装座2的运行能够避免超出行程。经正压连通管道内的排出的气流,使得底板8与大理石基座1之间形成气膜,将气浮载台托起,溢出的空气一部分进入真空吸附腔从负压口排除。经载台气浮平板轴承6排出的气流与横梁之间形成气膜,气浮载台通过X轴直线电机驱动,在运行过程中,通过正压与负压之间配合能够平稳的运行。
本发明方案所公开的技术手段不仅限于上述实施方式所公开的技术手段,还包括由以上技术特征任意组合所组成的技术方案。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。

Claims (5)

1.一种气浮载台,包括:底板,底板的上表面两侧均设置有侧板,两侧的侧板顶部固定有DD马达安装板,其特征在于,侧板上均安装有载台气浮平板轴承,侧板外部设置有载台气浮平板轴承,载台气浮平板轴承旋入载台气动直通接头,侧板内壁上设置有载台气动三通接头,侧板外侧设置载台气动L型接头,所述底板上设置有正压入口和负压入口。
2.根据权利要求1所述的气浮载台,其特征在于,气浮载台底部分为四等分,每一等分的四角均设置有压缩空气导流槽,压缩空气导流槽为十字型,十字型中部设置有红宝石喷嘴,每一等分的其余部分均为负压吸附腔,负压吸附腔的中部为负压口。
3.根据权利要求2所述的气浮载台,其特征在于,底板的侧方设置正压通道口和负压通道口,分别于红宝石喷嘴和负压口连接。
4.根据权利要求3所述的气浮载台,其特征在于,侧板上设置有光栅窗。
5.根据权利要求4所述的气浮载台,其特征在于,DD马达安装板上设置有压线槽,压线槽上设置有压线块。
CN202210105746.3A 2022-01-28 2022-01-28 一种气浮载台 Pending CN114512430A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116950996A (zh) * 2023-09-21 2023-10-27 无锡星微科技有限公司杭州分公司 一种承重台及具有该承载台的直线平台
CN117276160A (zh) * 2023-11-21 2023-12-22 上海隐冠半导体技术有限公司 一种气浮刹车装置、运动装置及气浮刹车装置的控制方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116950996A (zh) * 2023-09-21 2023-10-27 无锡星微科技有限公司杭州分公司 一种承重台及具有该承载台的直线平台
CN116950996B (zh) * 2023-09-21 2023-12-29 无锡星微科技有限公司杭州分公司 一种承重台及具有该承载台的直线平台
CN117276160A (zh) * 2023-11-21 2023-12-22 上海隐冠半导体技术有限公司 一种气浮刹车装置、运动装置及气浮刹车装置的控制方法
CN117276160B (zh) * 2023-11-21 2024-02-13 上海隐冠半导体技术有限公司 一种气浮刹车装置、运动装置及气浮刹车装置的控制方法

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