CN114506889A

CN114506889A - Electroplating liquid purifying equipment

Info

Publication number: CN114506889A
Application number: CN202210158961.XA
Authority: CN
Inventors: 向铖; 付艺; 谭松
Original assignee: Peking University Founder Group Co Ltd; Zhuhai Founder Technology Multilayer PCB Co Ltd
Current assignee: New Founder Holdings Development Co ltd; Zhuhai Founder Technology Multilayer PCB Co Ltd
Priority date: 2022-02-21
Filing date: 2022-02-21
Publication date: 2022-05-17

Abstract

The embodiment of the disclosure relates to the technical field of circuit boards, in particular to electroplating solution purifying equipment, which is used for solving the technical problem that carbon powder and waste liquid in a reaction container are difficult to treat after electroplating solution purification in the related art. The electroplating solution purification equipment comprises a reaction container and a collecting tank, wherein a reaction cavity is arranged in the reaction container, an opening is formed in the bottom of the reaction cavity, a movable part is arranged at the opening, and the movable part is used for opening or closing the opening; the collecting tank is arranged at the bottom of the reaction container and communicated with the reaction container through an opening; one side of the collecting tank is provided with a cleaning opening communicated with the collecting tank, and the collecting tank is provided with a closing piece used for closing the cleaning opening. The bottom of the reaction container is provided with the collecting tank communicated with the reaction container, and the collecting tank is provided with the cleaning opening, so that a worker can clean waste liquid and carbon powder in the collecting tank through the cleaning opening, the cleaning difficulty is effectively reduced, and the purification efficiency of electroplating liquid is improved.

Description

Electroplating liquid purifying equipment

Technical Field

The embodiment of the disclosure belongs to the technical field of circuit boards, and particularly relates to electroplating solution purifying equipment.

Background

Electroplating is a key process in the manufacturing process of printed circuit boards, in the electroplating process, the circuit board is usually placed in an electroplating solution, and power is supplied to replace metal ions in the electroplating solution with a metal layer on the circuit board so as to complete electroplating; during the electroplating process, metal residues are generated in the electroplating solution, and the metal residues easily affect the subsequent electroplating.

In the related art, generally, when a certain amount of metal residue in the plating liquid is reached, the plating liquid is subjected to carbon treatment; specifically, the electroplating solution is transferred into a treatment tank manually, then carbon powder is added and is precipitated, the carbon powder adsorbs metal residues in the electroplating solution and precipitates to the bottom of the treatment tank, and finally the electroplating solution on the upper part of the treatment tank is conveyed into electroplating equipment through a conveying pump so as to finish carbon treatment of the electroplating solution.

However, after the electroplating solution is purified, the carbon powder and the waste liquid in the treatment tank need to be manually treated, and the treatment tank has a large volume, so that the manual treatment is time-consuming and labor-consuming, and the purification efficiency of the electroplating solution is affected.

Disclosure of Invention

The embodiment of the disclosure provides electroplating solution purifying equipment, which is used for solving the technical problem that carbon powder and waste liquid in a reaction container are difficult to treat after electroplating solution is purified in the related technology.

The scheme for solving the technical problems in the embodiment of the disclosure is as follows:

a plating liquid purifying apparatus includes a plating liquid supply unit,

the reaction device comprises a reaction container, a reaction cavity and a control valve, wherein the reaction container is internally provided with the reaction cavity, the bottom of the reaction cavity is provided with an opening, and the opening is provided with the control valve which is used for opening or closing the opening;

the collecting tank is arranged at the bottom of the reaction vessel and communicated with the reaction vessel through the opening; one side of the collecting tank is provided with a cleaning opening communicated with the collecting tank, and the collecting tank is provided with a closing piece used for closing the cleaning opening.

The beneficial effects of the embodiment of the disclosure are: the collecting groove communicated with each other is arranged at the bottom of the reaction container, so that residual waste liquid and carbon powder in the purified electroplating solution in the reaction container after being discharged fall into the collecting groove through the opening, the collecting groove is located at the bottom of the reaction container, and a cleaning opening is formed in the collecting groove, so that a worker can clean the waste liquid and the carbon powder in the collecting groove through the cleaning opening, the cleaning difficulty is effectively reduced, and the purification efficiency of the electroplating solution is improved. Therefore, the technical problem that carbon powder and waste liquid in the reaction vessel are difficult to treat after electroplating liquid purification in the related art is effectively solved.

On the basis of the technical scheme, the embodiment of the disclosure can be further improved as follows.

In a possible realization, the bottom of the reaction chamber has a powder collection groove extending towards the collection groove, the cross section of the powder collection groove parallel to the horizontal plane decreases gradually in the direction close to the collection groove, and the opening is provided at the groove bottom of the powder collection groove.

In a possible implementation manner, one side of the collecting tank is provided with a cleaning opening communicated with the collecting tank, and the collecting tank is provided with a closing piece used for closing the cleaning opening.

In a possible implementation manner, the electroplating solution purification equipment further comprises a gas supply device and a gas supply pipe communicated with the gas supply device, wherein the gas supply pipe is arranged in the reaction cavity, and the gas supply pipe is arranged close to the bottom of the reaction cavity; the spaced a plurality of air feed holes that are provided with on the pipe wall of air supply pipe, air feeder be used for to the air supply pipe air delivery.

In a possible implementation manner, the reactor further comprises a stirring device, one end of the stirring device is connected with the top of the reaction container, the other end of the stirring device is provided with a stirring piece, and the stirring piece is located in the reaction cavity.

In a possible implementation manner, the stirring device comprises a motor and a stirring rod, the motor is arranged at the top of the reaction container, and the stirring rod is in transmission connection with a main shaft of the motor; the stirring piece is a plurality of, and a plurality of stirring piece interval sets up on the puddler.

In a possible implementation manner, an air outlet is arranged on the reaction container, and an air exhaust device is arranged at the air outlet.

In a possible implementation manner, the air outlet is disposed at the top of the reaction container, and the cross-sectional area of the air outlet gradually increases from bottom to top.

In one possible implementation manner, the plating solution purification apparatus further includes a heating device and a cooling device, and both the heating device and the cooling device are disposed in the reaction chamber.

In one possible implementation mode, the device further comprises a medicine inlet pipe, a medicine outlet pipe and a waste discharge pipe assembly;

one end of the medicine inlet pipe is inserted into the reaction cavity, and the other end of the medicine inlet pipe is communicated with an electroplating liquid cylinder on a production line;

one end of the medicine outlet pipe is inserted into the reaction cavity, and the other end of the medicine outlet pipe is communicated with a standing medicine cylinder outside the reaction container;

the waste discharge pipe assembly comprises the control valve, the control valve comprises a first outlet, a second outlet and a third outlet, the first outlet is connected with a first liquid discharge pipe, the second outlet is connected with a second liquid discharge pipe, and the third outlet is connected with a third liquid discharge pipe;

the first liquid discharge pipe is used for discharging maintenance electroplating liquid, the second liquid discharge pipe is used for discharging waste liquid and carbon powder, and the third liquid discharge pipe is used for discharging maintenance wastewater.

In a possible implementation manner, the reaction vessel and the reaction chamber are both cylindrical, and a plurality of reinforcing ribs extending along the direction of the central line of the reaction chamber are arranged on the side wall of the reaction chamber.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or technical solutions in the related art, the drawings used in the description of the embodiments or the related art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural view of a plating liquid purifying apparatus provided in an embodiment of the present disclosure;

in the drawings, the components represented by the respective reference numerals are listed below:

100. a reaction vessel; 110. an opening; 120. an air outlet; 130. a medicine inlet pipe; 140. a medicine outlet pipe; 150. a first control valve; 160. a first drain pipe; 170. a second drain pipe; 180. a third drain pipe; 190. a powder collecting groove;

200. collecting tank; 210. cleaning the bin; 220. a closure;

300. a gas supply device; 310. a gas supply pipe; 320. an air outlet nozzle;

400. a stirring device; 410. a stirring rod; 420. a stirring member; 430. a motor;

500. an air draft device;

600. a production line medicine tank;

700. standing the medicine cylinder;

800. a waste water tank;

900. waste liquid medicine tank.

Detailed Description

However, after the electroplating solution is purified, the carbon powder and the waste liquid in the treatment tank need to be manually treated, and the treatment tank has large volume, so that time and labor are wasted during manual treatment, and the production efficiency is affected.

In view of this, the embodiment of the present disclosure provides an electroplating solution purification apparatus, in which an opening is disposed at a bottom of a reaction container, a movable member is disposed at the opening, a collecting tank is disposed at the bottom of the reaction container, the collecting tank is communicated with the reaction container through the opening at the bottom of the reaction container, and meanwhile, opening and closing of the opening can be controlled by the movable member. Remaining waste liquid and carbon dust fall to the collecting vat through the opening after the plating solution after purifying in the reaction vessel discharges in, because the collecting vat is located reaction vessel's bottom, and is provided with clean mouthful on the collecting vat to make the staff clear up waste liquid and carbon dust in the collecting vat through this clean mouthful, and then the effectual clearance degree of difficulty that has reduced has improved the purification efficiency of plating solution.

In order to make the aforementioned objects, features and advantages of the embodiments of the present disclosure more comprehensible, embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a subset of the disclosed embodiments and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

Referring to fig. 1, an embodiment of the present disclosure provides a plating solution purification apparatus, which includes a reaction container 100 and a collection tank 200, wherein a reaction chamber is disposed in the reaction container 100, an opening 110 is disposed at a bottom of the reaction chamber, and a movable member is disposed at the opening 110, and is used for opening or closing the opening 110; the collecting tank 200 is arranged at the bottom of the reaction vessel 100, and the collecting tank 200 is communicated with the reaction vessel 100 through the opening 110; one side of the collecting tank 200 is provided with a cleaning opening communicated with the collecting tank, and the collecting tank is provided with a closing piece 200, and the closing piece 200 is used for closing the cleaning opening.

The reaction vessel 100 is used for containing the electroplating solution to be purified, that is, the electroplating solution is purified in the reaction chamber of the reaction vessel 100. Illustratively, the material of the reaction vessel 100 may be an acid-base salt and high temperature resistant material, for example, it may be made of PPN (polypropylene) material, and the wall thickness of the reaction vessel 100 may be greater than or equal to 15mm, so as to ensure that the reaction vessel 100 has excellent strength, and thus, the safety of the purification process can be ensured.

In this embodiment, the reaction vessel 100 and the reaction chamber are both cylindrical, and the sidewall of the reaction chamber is provided with a plurality of reinforcing ribs extending along the central line direction thereof. Specifically, how many strengthening ribs encircle the spaced setting of the central line of reaction chamber to the strengthening rib can be connected with reaction vessel through welded mode, perhaps the strengthening rib is through modes such as moulding plastics and reaction vessel structure as an organic whole.

Illustratively, the reaction vessel 100 may be triple welded, that is, the reaction vessel 100 forms a reaction chamber through a welding process, and in addition, a plurality of PVC reinforcing ribs are disposed on an outer wall surface of the reaction vessel 100, wherein a part of the PVC reinforcing ribs are sequentially disposed around a central axis of the reaction vessel 100 and welded to the outer wall surface of the reaction vessel 100, and another part of the PVC reinforcing ribs extend in a direction consistent with the central axis of the reaction vessel, and the part of the PVC reinforcing ribs are uniformly welded to the wall surface of the reaction vessel, thereby achieving the triple welding. By adopting the triple welding process, the strength of the reaction vessel 100 can be further increased, so that the reaction vessel is not easy to deform under the action of water pressure, and the leakage of the reaction vessel 100 can be prevented.

In some embodiments, the volume of the reaction chamber within the reaction vessel 100 may be between 15000L and 20000L, such as: 15000L, 17000L, 20000L and the like, thereby enabling the reaction vessel 100 to contain more electroplating solution and further improving the purification efficiency of the electroplating solution. In addition, a liquid level detection device can be arranged in the reaction cavity to detect the liquid level height in the reaction cavity so as to obtain the volume of the electroplating liquid in the reaction cavity; illustratively, the liquid level detection device may include: a liquid level meter, a double high-low probe sensor and the like.

Illustratively, the bottom of the reaction vessel 100 is provided with an opening 110, and carbon powder deposited in the reaction chamber falls into the collection tank 200 through the opening 110. Meanwhile, a movable member is disposed at the opening 110, and the opening or closing of the opening 110 can be controlled by the movable member.

In some embodiments, the movable member may include a rotating shaft rotatably disposed at the opening 110 and a cover fixedly connected to the rotating shaft. The cover body can be plate-shaped, and the size of the cover body is matched with that of the opening, so that the cover body can completely cover the opening. When waste liquid and carbon dust need discharge to the collecting vat in, only need rotate the axis of rotation and make the lid open, and then make waste liquid and carbon dust can fall to the collecting vat in through the opening, after the emission is accomplished, only need through rotate the axis of rotation make the lid seal cover the opening can.

When the electroplating solution in the reaction chamber is in the purification process or the purified electroplating solution is still in the reaction chamber, the movable member is in a closed state at the moment, that is, the opening 110 is in a closed state; when the purified plating liquid has been discharged, the movable member is opened, and the waste liquid and the carbon powder fall into the collection tank 200 through the opening 110.

The collecting tank 200 is disposed at the bottom of the reaction vessel 100, and a cleaning opening is disposed on the collecting tank 200.

For example, the material of the collecting tank 200 may be an acid, alkali, salt and high temperature resistant material, for example, the material may be made of PVC (polyethylene) material, and the wall thickness of the reaction vessel 100 may be greater than or equal to 20mm, so as to ensure that the collecting tank 200 has excellent strength, and further prevent the collecting tank 200 from being damaged to cause omission of carbon powder and waste liquid. Meanwhile, since the reaction vessel 100 is disposed above the collecting tank 200, the collecting tank 200 is set to have a thick wall surface, so that the stability of the reaction vessel 100 can be further ensured, and the safety of the purification process can be further ensured.

Illustratively, the outer diameter of the collection tank 200 may be equal to the outer diameter of the reaction vessel 100, thereby enabling a stable interface between the reaction vessel 100 and the collection tank 200, while enabling the collection tank 200 to provide better support for the reaction vessel 100.

Meanwhile, one side of the collecting tank 200 is provided with a cleaning port communicated with the collecting tank 200, and a closing member 220 is arranged on the collecting tank 200, and the closing member 220 is used for closing the cleaning port.

Illustratively, the closing member 220 may have a plate shape, which is rotatably disposed at the cleaning opening. The top and the bottom of the cleaning opening may be relatively provided with a rotation hole, and the top and the bottom of the closing member 200 may be provided with a rotation shaft, and the rotation shaft is rotatably provided in the rotation hole, so that the closing member 200 may rotate around the rotation shaft, thereby opening or closing the cleaning opening by rotating the closing member 200.

Of course, the closing member 200 may include a cover plate, the top end of the cover plate is hinged to the collecting tank 200, the bottom end of the cover plate may be detachably connected to the collecting tank 200 by means of clamping or bolting, and the cover plate covers the cleaning opening to close the cleaning opening; when the cleaning device is opened, the bottom end of the cover plate is firstly separated from the collecting groove 200, and then the cover plate is rotated, so that the opening of the cleaning opening can be realized. By providing this closure member 220, the carbon powder and waste liquid in the collection tank can be prevented from flowing out. From this, the staff clears up waste liquid and carbon dust in the collecting vat 200 through this clean mouthful, and then effectual clearance degree of difficulty that has reduced.

The plating solution clarification plant that this embodiment provided, through the collecting vat 200 that is linked together in the bottom setting of reaction vessel 100, make remaining waste liquid and carbon dust after the plating solution discharge after purifying in the reaction vessel 100 fall to the collecting vat 200 in through opening 110, because the collecting vat 200 is located reaction vessel 100's bottom, and be provided with clean mouthful on the collecting vat 200, thereby make the staff clear up waste liquid and carbon dust in the collecting vat 200 through this clean mouthful, and then the effectual clearance degree of difficulty that has reduced, the purification efficiency of plating solution has been improved.

With continued reference to fig. 1, the bottom of the reaction chamber has a powder collecting groove 190 extending toward the collecting groove 200, and the cross section of the powder collecting groove 190 parallel to the horizontal plane gradually decreases in the direction close to the collecting groove 200, and the opening 110 is disposed at the bottom of the powder collecting groove 190. It can be understood that the powder collecting groove 190 can be an inverted cone-shaped structure, and the waste liquid and the carbon powder can be conveniently collected to the opening 110 by arranging the powder collecting groove 190 into the cone-shaped structure, i.e. the waste liquid and the carbon powder in the reaction cavity can be fully dropped into the collecting groove 200.

Illustratively, a cleaning bin 210 is arranged on one side of the collecting tank 200, the cleaning bin 210 is communicated with the collecting tank 200, the cleaning bin 210 extends in the horizontal direction, a cleaning opening is formed in the cleaning bin 210, a sealing element 220 is arranged at the cleaning opening, and when waste liquid and carbon powder in the collecting tank 200 need to be cleaned, a worker can treat the waste liquid and the carbon powder by opening the sealing element 220. In other words, one side of the collecting tank 200 extends to form a cleaning bin 210, the cleaning bin 210 can further enlarge storage space for waste liquid and carbon powder, namely when the waste liquid and the carbon powder are too much, the waste liquid and the carbon powder of the collecting tank 200 can be firstly moved into the cleaning bin 210, so that enough space can be always kept in the collecting tank 200 to store the waste liquid and the carbon powder, and a worker can clean the waste liquid and the carbon powder in the cleaning bin 210 through a cleaning opening, so that the purification efficiency of the electroplating solution can be further improved.

In some embodiments, the plating solution purifying apparatus further comprises a stirring device 400, wherein one end of the stirring device 400 is connected to the top of the reaction vessel 100, and the other end thereof is provided with a stirring member, and the stirring member is located in the reaction chamber.

Illustratively, the stirring device 400 may include a motor and a stirring rod 410, the motor 430 may be disposed at the top of the reaction vessel 100, and the stirring rod 410 is in driving connection with a main shaft of the motor 430; the stirring member may be a plurality of stirring members, and the plurality of stirring members are arranged on the stirring rod 410 at intervals. In this embodiment, one end of the stirring rod 410 is connected to the power output end of the motor, and the other end thereof extends toward the bottom of the reaction chamber. In addition, the stirring members may be a sheet structure, and the plurality of stirring members are divided into a plurality of groups, and the plurality of groups of stirring members are sequentially arranged from bottom to top along the length direction of the stirring rod 410; simultaneously, each group contains three stirring pieces which are uniformly arranged along the circumferential direction. Illustratively, the material of the stirring rod 410 and the stirring member may be SUS316, wherein SUS is a code of stainless steel in JIS standard in japan, and 316 stainless steel is a brand of stainless steel produced according to ASTM standard in the united states, and japan refers to the nomenclature of the united states and refers to SUS 316. Through setting up above agitating unit 400 for puddler 410 rotates under the drive of motor, thereby makes the stirring piece stir the plating solution, thereby has maintained the homogeneity of plating solution.

In some embodiments, the plating solution purifying apparatus further includes a gas supply device 300 and a gas supply pipe 310 driven by the communication of the gas supply device 300, the gas supply pipe 310 is disposed in the reaction chamber, the gas supply pipe 310 is disposed near the bottom of the reaction chamber, a plurality of gas supply holes are disposed at intervals on a wall of the gas supply pipe 310, and the gas supply device 300 is configured to supply air to the gas supply pipe 310.

Illustratively, a wall of the reaction vessel 100 is provided with a through hole, one end of the gas supply pipe 310 passes through the through hole to be connected to the gas supply device 300, and the other end of the gas supply pipe 310 may extend in a horizontal direction, so that the gas supply pipe 310 can cross the bottom of the reaction vessel 100 in the horizontal direction, and a plurality of gas supply holes are formed at intervals on a wall of the gas supply pipe 310, and a plurality of gas outlet nozzles 320 may be arranged at the gas supply holes, and the gas outlet direction of the gas outlet nozzles 320 may be arranged along a vertical direction or towards an obliquely upward direction. Through setting up this structure for when gas from the gas supply hole blowout to the come-up, can drive the plating solution motion, can also further drive simultaneously and stir the piece and rotate in order further to strengthen stirring effect, thereby make plating solution and carbon dust more even in the stirring of reaction chamber, reach plating solution treatment effect, promoted the product quality, improved the maintenance effect of plating solution.

In some embodiments, the reaction vessel 100 is provided with an air outlet 120, and an air extracting device 500 is disposed at the air outlet 120. For example, the air outlet 120 may be disposed at the top of the reaction container 100, and the cross-sectional area of the air outlet 120 may gradually increase from bottom to top.

In this embodiment, the air outlet 120 is disposed at the top of the reaction container 100, and the distance between the air outlet 120 and the opening 110 at the top of the reaction chamber along the horizontal direction may be 30-50cm, that is, the opening 110 may be disposed at the top of the reaction container 100, the opening 110 may be used for installing the stirring apparatus 400, and the distance between the opening 110 and the air outlet 120 along the horizontal direction is 30-50 cm. In addition, an exhaust pipe is arranged in the reaction cavity, one end of the exhaust pipe extends into the reaction cavity, the other end of the exhaust pipe extends to the air outlet 120 and is connected with a main air pipe, and the main air pipe is connected with the air draft device 500. Through setting up updraft ventilator 500 above, harmful gas such as hydrogen peroxide solution steam that can produce among the electroplating process is siphoned away to avoid plating solution purification process to cause the pollution to the environment.

In some embodiments, the plating liquid purification apparatus further comprises a heating device and a cooling device, both of which are within the reaction chamber.

For example, the heating device may include a first pipeline and a second control valve, wherein the first pipeline is disposed in the reaction chamber, while the first pipeline may be a plurality of stainless steel pipes, and the plurality of stainless steel pipes are disposed at the bottom of the reaction chamber side by side. Because the temperature of the electroplating solution is required to be maintained at 65 +/-5 ℃ when the carbon powder is added into the electroplating solution in the reaction chamber, the temperature of the electroplating solution can be lower than the required temperature, at the moment, the second control valve can be opened to enable the central hot water at 90 ℃ to heat the electroplating solution in the reaction chamber through the first pipeline, so that the electroplating solution can reach 65 +/-5 ℃, and the carbon treatment time is less than or equal to 8 hours, wherein the second control valve can be a stainless steel electric valve.

For example, the cooling device may include a second pipe and a third control valve, wherein the second pipe is disposed in the reaction chamber, while the second pipe may be a plurality of stainless steel pipes, and the plurality of stainless steel pipes are disposed side by side at the bottom of the reaction chamber. Since the plating solution releases heat during the carbon treatment process, the plating solution needs to be cooled by cooling water, and at this time, the third control valve can be opened to allow the central cooling water of 10 ℃ to cool the plating solution in the reaction chamber through the second pipeline, so that the temperature of the plating solution can be maintained at 65 +/-5 ℃. Wherein, the third control valve can be a stainless steel electric valve.

In conclusion, the electroplating solution can be always maintained at 65 +/-5 ℃ by arranging the heating device and the cooling device in the reaction cavity, so that the electroplating solution can be subjected to efficient purification treatment by the carbon powder.

In some embodiments, the plating solution purifying apparatus further includes a feed line 130, a discharge line 140, and a waste line assembly. One end of the chemical inlet pipe 130 is inserted into the reaction cavity, and the other end is communicated with an electroplating liquid cylinder on the production line; one end of the medicine outlet pipe 140 is inserted into the reaction chamber, and the other end thereof is communicated with a standing medicine cylinder outside the reaction vessel 100.

Illustratively, the number of the chemical inlet tube 130 and the chemical outlet tube 140 may be two, that is, two chemical inlet ports and two chemical outlet ports are provided on the reaction vessel 100, and one end of each of the two chemical inlet tubes 130 extends into the reaction chamber through the corresponding chemical inlet port, so that the electroplating solution to be purified enters the reaction chamber through the two chemical inlet tubes. One end of each of the two discharging tubes 140 extends into the reaction chamber through a corresponding discharging opening, so that the purified electroplating solution flows into the standing cylinder outside the reaction vessel 100 through the discharging tube 140. Through setting up into pencil 130 and play pencil 140 and all setting up to two, set up to two into two out structures promptly, the effectual efficiency of adding and exporting of plating solution that has improved to the purification efficiency of plating solution has been improved.

In addition, the waste pipe assembly includes a movable member, which may include a first control valve 150, the first control valve 150 including a first outlet, a second outlet, and a third outlet, the first outlet being connected with a first waste pipe 160, the second outlet being connected with a second waste pipe 170, and the third outlet being connected with a third waste pipe 180. The first drain pipe 160 is used for discharging maintenance plating solution, the second drain pipe 170 is used for discharging waste liquid and carbon powder, and the third drain pipe 180 is used for discharging maintenance waste water.

For example, the waste pipe assembly may discharge the chemicals through a three-stage pipe, and the reaction vessel 100 may be further provided with a water inlet pipe through which the maintenance water for cleaning the reaction vessel 100 is added into the reaction chamber.

After the purified purification liquid in the reaction chamber is discharged through the chemical discharging pipe 140, the second outlet is communicated with the opening 110 at the bottom of the reaction chamber by adjusting the first control valve 150, so that the waste liquid and the carbon powder at the bottom of the reaction chamber are discharged through the second liquid discharging pipe 170.

After the waste liquid and carbon powder are discharged, the opening 110 at the bottom of the reaction chamber is closed by adjusting the first control valve 150. Then, the maintenance water is added through the water inlet pipe and stirred by the stirring device 400, so as to clean the reaction chamber, and then the third outlet is communicated with the opening 110 at the bottom of the reaction chamber through the first control valve 150, so that the maintenance wastewater after the reaction chamber is cleaned is discharged into the wastewater tank 900 through the third liquid discharge pipe 180.

After the reaction chamber is cleaned, the opening 110 at the bottom of the reaction chamber is closed by adjusting the first control valve 150, and then a certain amount of maintenance electroplating solution without impurities is added through the chemical inlet pipe 130 to maintain the reaction chamber, which is equivalent to performing secondary cleaning on the reaction chamber to remove the maintenance wastewater in the reaction chamber, so that the maintenance wastewater is prevented from being mixed into the electroplating solution to be purified next time; after the reaction chamber is cleaned by the maintenance plating solution, the opening 110 at the bottom of the reaction chamber is communicated with the first outlet by adjusting the first control valve 150, so that the maintenance plating solution after the reaction chamber is cleaned is discharged into the waste liquid tank 800 through the first drain pipe 160.

In some embodiments, a pedestrian stand, a material addition stand, and an observation stand are further provided on one side of the reaction vessel 100. Wherein, pedestrian's rack can include first frame, and the height of first frame highly cooperatees with reaction vessel, and is provided with a plurality of steps in the first frame to be convenient for the staff through this step motion to certain height, and monitor the purification process of plating solution. In addition, the observation rack is arranged on one side of the pedestrian rack and comprises a support frame, a bearing table is arranged on the support frame, the height of the support frame can be close to that of the pedestrian rack, and therefore a worker can move to the bearing table of the observation rack through the pedestrian rack, and the worker can observe the purification situation of electroplating solution better. Simultaneously, the material adds the frame and can set up side by side with observing the rack, and the height that the material added the frame can be according to the actual required height when reinforced and carry out the reality to the staff of being convenient for adds the material.

The above stands can be made of SUS304 steel, of which SUS304 material is JIS standard in japan and is also the most commonly used stainless steel containing 18% of Cr (chromium) and 8% of Ni (nickel), and which can maintain good strength and heat resistance in high-temperature and low-temperature environments and also has good corrosion resistance, weldability, cold workability, and mechanical properties in a mild atmosphere. In addition, guard rails can be arranged around each rack.

Illustratively, the widths of the pedestrian stand, the material adding stand and the observation stand may be set to be greater than or equal to 80 cm.

In some embodiments, the plating liquid purifying apparatus may further be provided with a material elevator, which may be made of SUS304 material and may have a carrying weight of 100KG or more.

In addition, one side of reaction chamber still is provided with the maintenance squirt, and this maintenance squirt includes hose and high-pressure squirt, and wherein the length of hose can be selected to be more than or equal to 20m and connect the water pipeline from beginning, can wash plating solution clarification plant through this maintenance squirt.

Based on the above embodiment, be provided with opening 110 through the bottom at reaction vessel 100, opening 110 department is provided with the moving part, collecting vat 200 sets up in reaction vessel 100's bottom, and collecting vat 200 is linked together with reaction vessel 100 through opening 110 of reaction vessel 100 bottom, can control opening 110's opening and closing through the moving part simultaneously, make remaining waste liquid and carbon dust after the plating solution discharge after purifying in reaction vessel 100 fall into collecting vat 200 through opening 110, because collecting vat 200 is located reaction vessel 100's bottom, and be provided with the cleaning mouth on the collecting vat 200, thereby make the staff clear up waste liquid and carbon dust in the collecting vat 200 through this cleaning mouth, and then the effectual clearance degree of difficulty that has reduced, the purification efficiency of plating solution has been improved. Meanwhile, the stirring device 400 is also arranged, so that the electroplating solution and the carbon powder can be uniformly reacted through the stirring device 400, and the purification purity and efficiency of the electroplating solution are improved. In addition, the bottom of the reaction vessel 100 is also provided with a gas supply device 300 and a gas supply pipe 310, and the gas can be sprayed from the gas supply hole to float upwards by the gas supply device, so that the electroplating solution can be driven to move, the mixing uniformity between the electroplating solution and the carbon powder is further improved, and the purification purity and efficiency of the electroplating solution are further improved.

In the description of the embodiments of the present disclosure, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the embodiments of the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered as limiting the embodiments of the present disclosure.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the embodiments of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

In the embodiments of the present disclosure, unless otherwise specifically stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.

In the embodiments of the present disclosure, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the embodiments of the present disclosure, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the embodiments of the present disclosure.

Claims

1. A plating liquid purification apparatus, comprising,

the reaction device comprises a reaction container, a reaction cavity is arranged in the reaction container, an opening is formed in the bottom of the reaction cavity, a movable piece is arranged at the opening, and the movable piece is used for opening or closing the opening;

2. The plating liquid purifying apparatus as recited in claim 1, wherein a bottom of said reaction chamber has a powder collection groove extending toward said collection groove, a cross section of said powder collection groove parallel to a horizontal plane in a direction approaching said collection groove is gradually reduced, and said opening is provided at a groove bottom of said powder collection groove.

3. The plating solution purification apparatus as recited in claim 1 or 2, further comprising a gas supply device and a gas supply tube communicating with said gas supply device, said gas supply tube being disposed within said reaction chamber, said gas supply tube being disposed near a bottom of said reaction chamber; the spaced a plurality of air feed holes that are provided with on the pipe wall of air supply pipe, air feeder be used for to the air supply pipe air delivery.

4. The plating liquid purification apparatus as recited in claim 1 or 2, further comprising a stirring device having one end connected to a top of said reaction vessel and the other end provided with a stirring member, wherein said stirring member is located in said reaction chamber.

5. The plating liquid purification apparatus as recited in claim 4, wherein said stirring device comprises a motor and a stirring rod, said motor is disposed at the top of said reaction vessel, and said stirring rod is drivingly connected to a main shaft of said motor; the stirring piece is a plurality of, and a plurality of the interval setting of stirring piece is in on the puddler.

6. The electroplating solution purification apparatus as claimed in claim 1 or 2, wherein the reaction vessel is provided with an air outlet, and an air draft device is arranged at the air outlet.

7. The plating solution purification apparatus as recited in claim 6, wherein the air outlet is disposed at a top of the reaction vessel, and a cross-sectional area of the air outlet gradually increases from bottom to top.

8. The plating liquid purifying apparatus as recited in claim 1 or 2, further comprising a heating device and a cooling device, both of which are provided in said reaction chamber.

9. The plating liquid purifying apparatus as recited in claim 1 or 2, further comprising a charge pipe, a discharge pipe, and a waste pipe assembly;

the waste discharge pipe assembly comprises the moving part, the moving part comprises a first control valve, the first control valve comprises a first outlet, a second outlet and a third outlet, the first outlet is connected with a first liquid discharge pipe, the second outlet is connected with a second liquid discharge pipe, and the third outlet is connected with a third liquid discharge pipe;

10. The plating liquid purifying apparatus as recited in claim 1 or 2, wherein said reaction vessel and said reaction chamber each have a cylindrical shape, and a plurality of ribs extending in a direction of a center line of the reaction chamber are provided on a side wall of said reaction chamber.