CN114501786B - Emitter manufacturing method and emitter - Google Patents
Emitter manufacturing method and emitter Download PDFInfo
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- CN114501786B CN114501786B CN202210335312.2A CN202210335312A CN114501786B CN 114501786 B CN114501786 B CN 114501786B CN 202210335312 A CN202210335312 A CN 202210335312A CN 114501786 B CN114501786 B CN 114501786B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- A—HUMAN NECESSITIES
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
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- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/14503—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue invasive, e.g. introduced into the body by a catheter or needle or using implanted sensors
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/14532—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring glucose, e.g. by tissue impedance measurement
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/14546—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring analytes not otherwise provided for, e.g. ions, cytochromes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
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Abstract
The invention relates to the field of emitters in continuous analyte monitoring systems, and discloses a method for manufacturing an emitter and an emitter, wherein the method comprises the following steps: assembling an elastic waterproof assembly on a printed circuit board to obtain a first prefabricated part, wherein a conductive piece is assembled on the first surface of the printed circuit board, the elastic waterproof assembly comprises a waterproof main body, a first flanging and a second flanging, the waterproof main body wraps the second surface of the printed circuit board, the first flanging wraps four side surfaces of the printed circuit board, and the second flanging partially wraps the first surface of the printed circuit board; assembling the first prefabricated part and the first shell after assembling the sealing element on the conductive part to obtain a second prefabricated part; and assembling the second prefabricated part and the second shell to enable the first closing part and the second flanging to be in an elastic compression fit state, and enabling the second closing part and the waterproof main body to be in an elastic compression fit state to obtain the emitter. The invention improves the product yield, has high consistency and better waterproof and steam-proof effects.
Description
Technical Field
The present invention relates to the field of manufacturing emitters in continuous analyte monitoring systems, and more particularly, to a method for manufacturing an emitter for a continuous analyte monitoring system and an emitter manufactured thereby.
Background
Some dynamic analyte monitoring systems include analyte sensor electrodes, transmitters, and receiving devices, among others. In a continuous analyte concentration monitoring process, a transmitter is configured to transmit analyte levels detected by a sensor to a receiving device over a wireless communication link, such as an RF (radio frequency) communication link.
Generally, the sensor electrode is fixed through the sensor base, applies to the host skin on, and the transmitter can be dismantled with the sensor base and be connected, needs the cooperation transmitter to gather and transmit signal after the sensor electrode is fixed well. The transmitter generally includes a plastic casing and a printed circuit board enclosed in the plastic casing, and it is generally required to expose a conductive member for establishing electrical connection with the sensor electrode on the plastic casing so as to transmit a signal of the sensor electrode to the printed circuit board. The printed circuit board of the transmitter in the continuous analyte monitoring system is provided with components and batteries, and the printed circuit board is applied to a body, has a very small structure which needs to be designed, is a sensitive electronic component, is not resistant to temperature and pressure, and cannot be extruded and formed in a high-pressure and good-waterproofness mode like a circuit board such as a mobile phone chip.
In the process of implementing the embodiment of the invention, the inventor finds that at least the following defects exist in the background art: most of the existing emitters are manufactured in the form of epoxy potting or injection molding of a plastic housing on a chip. The epoxy encapsulation form has the advantages of long encapsulation and curing time, low efficiency, strict requirements on temperature, long production period and high cost, and subsequent machining, electroplating and other treatment are required after encapsulation and forming. The existing form of injection molding a plastic shell on a chip is to directly coat UV glue on the chip and perform curing treatment, generally, the injection molding plastic shell needs to exceed 250 ℃, when the temperature exceeds 200 ℃, soldering tin of an electronic component can be melted and fall off, high voltage is also needed, the component can be damaged, and when injection molding is performed, the electronic component needs to be prevented from deforming during injection molding, and the injection molding form has more uncontrollable factors and is irreversible in the production process. These two forms have the following drawbacks: the manufactured products have poor consistency, so that the waterproof performance of the emitter is uneven, the complex processes occupy a large amount of space and time cost, high temperature, high pressure and the like can cause destructive influence on electronic components such as sensitive chips on a printed circuit board, and the reject ratio is high.
Disclosure of Invention
The invention provides a manufacturing method of a transmitter and the transmitter, which are used for solving the technical defects in the prior art. The present invention provides a method of manufacturing an emitter for use in preparing an emitter for use in a continuous analyte monitoring system, comprising:
assembling an elastic waterproof assembly on a printed circuit board to obtain a first prefabricated part, wherein a conductive piece is assembled on a first surface of the printed circuit board, the elastic waterproof assembly comprises a waterproof main body, a first flanging and a second flanging, the waterproof main body wraps a second surface of the printed circuit board, the first flanging wraps four side surfaces of the printed circuit board, and the second flanging partially wraps the first surface of the printed circuit board;
after a sealing element is assembled on the conductive piece, assembling the first prefabricated piece and the first shell to obtain a second prefabricated piece;
and assembling the second prefabricated part and a second shell to enable the first sealing element preset in the first shell and the second flanging to be in an elastic compression fit state, and enable the second sealing element preset in the second shell and the waterproof main body to be in an elastic compression fit state, so as to obtain the emitter.
The method for manufacturing the emitter according to the present invention, wherein the first surface of the printed circuit board is assembled with the conductive member, and the method comprises: the conductive member is pre-processed to a predetermined length, and/or the surface of the conductive member is pre-plated with metal or the conductive member is made of metal.
The manufacturing method of the transmitter according to the present invention, wherein the printed circuit board is electrically connected to a sensor assembly through the conductive member, the sensor assembly includes a sensor electrode and a power supply for supplying power to the sensor electrode and the printed circuit board; the sensor electrode is used for continuously collecting analyte monitoring signals, the analyte monitoring signals comprise current values used for determining the concentration of an analyte, the current values are obtained after electrochemical reaction is generated between the sensor electrode and a specific solution, and the specific solution is the solution in which the sensor electrode is positioned.
The method for manufacturing the emitter according to the present invention, wherein the sensor electrode has a first output terminal and a second output terminal formed at an end thereof not in the specific solution, and the analyte monitoring signal is transmitted to the printed circuit board through the first output terminal and the second output terminal.
The manufacturing method of the transmitter of the invention is characterized in that a series loop is formed among the power supply, the sensor electrode and the printed circuit board through the conductive piece.
The manufacturing method of the transmitter comprises the steps that the conductive piece comprises a first conductive pin, a second conductive pin, a third conductive pin and a fourth conductive pin, and the printed circuit board comprises a first signal pin, a second signal pin, a first power connection pin and a second power connection pin; wherein, the connection mode of the series circuit comprises: the positive pole of the power supply is electrically connected with the first power connection pin through the first conductive pin, the first signal pin is electrically connected with the first output terminal through the second conductive pin, the second output terminal is electrically connected with the second signal pin through the third conductive pin, and the second power connection pin is electrically connected with the negative pole of the power supply through the fourth conductive pin.
The method for manufacturing an emitter according to the present invention, wherein the assembling of the elastic waterproof member on the printed circuit board, comprises: the elastic waterproof assembly is molded on the printed circuit board in a liquid silica gel injection molding mode.
The method for manufacturing the emitter according to the present invention, wherein the conductive member is assembled with the printed circuit board by means of a patch welding method.
The method for manufacturing the emitter according to the present invention, wherein the assembling of the sealing member on the conductive member includes: and assembling a sealing element on a limiting part on the conductive piece in an interference fit manner, wherein the limiting part is formed by a first step arranged on the conductive piece and the first surface of the printed circuit board.
According to the manufacturing method of the emitter, after the second prefabricated part and the second shell are assembled, the first shell and the sealing piece are in an elastic press fit state.
The method for manufacturing the emitter according to the present invention, wherein the assembling the first preform with the first case includes:
and assembling the first prefabricated part and the first shell by utilizing the matching of a second step arranged on the conductive piece and the limiting piece on the first shell, wherein the second step corresponds to the limiting piece in position.
The method for manufacturing the emitter according to the present invention, wherein the assembling the second preform with the second case includes:
assembling the first housing with the second housing in at least one of:
dispensing glue at the matching position of the seam allowances of the first shell and the second shell;
and carrying out ultrasonic welding at the seam allowance matching part of the first shell and the second shell.
The manufacturing method of the emitter according to the invention, wherein the seam for dispensing is arranged at the matching position of the seam allowance; and/or the section of the spigot matching part is L-shaped or U-shaped.
According to the manufacturing method of the emitter, an electrical connection surface of the conductive piece is consistent with a corresponding surface of the first shell, and the electrical connection surface is a surface of the conductive piece electrically connected with the first output terminal and the second output terminal.
According to the manufacturing method of the emitter, the inner part of the main body of the first shell is matched with the shape of the elastic waterproof component in the length direction and/or the width direction.
According to the manufacturing method of the emitter, the inner part of the main body of the second shell is matched with the shape of the elastic waterproof component in the length direction and/or the width direction.
The present invention also provides a method of manufacturing an emitter for use in a continuous analyte monitoring system, comprising:
the waterproof structure comprises an elastic waterproof component, a first flange and a second flange, wherein the elastic waterproof component is assembled on a printed circuit board and comprises a waterproof main body, the first flange and the second flange;
a conductive member assembled to a first surface of the printed circuit board, the conductive member configured to: assembling the first shell with the sealing element;
the transmitter is configured to: the waterproof shell is formed by assembling the first shell and the second shell, after the first shell and the second shell are assembled, a first sealing piece preset in the first shell and the second flanging are in an elastic compression fit state, and a second sealing piece preset in the second shell and the waterproof main body are in an elastic compression fit state.
Compared with the prior art, the scheme disclosed by the invention has the following advantages: according to the invention, an elastic waterproof component is assembled on a printed circuit board to obtain a first prefabricated component, a conductive piece is assembled on a first surface of the printed circuit board, a waterproof main body of the elastic waterproof component covers a second surface, a first flanging covers four side surfaces, and a second flanging partially covers the first surface; the printed circuit board is coated with the elastic waterproof assembly, and after the sealing element is assembled on the conductive element, the conductive element is assembled with the first shell and then assembled with the second shell, so that the first sealing element and the second flanging which are preset in the first shell are in an elastic pressing fit state, and the second sealing element and the waterproof main body which are preset in the second shell are in an elastic pressing fit state; the invention has simple integral assembly process, ensures that the elastic waterproof component is coated on a plurality of surfaces of the printed circuit board in an elastic pressing fit mode, simplifies the process, saves the cost of time, space and the like, avoids the destructive influence on sensitive electronic components caused by glue pouring, overhigh temperature and subsequent processes, improves the product yield, has high consistency and is suitable for batch production.
Drawings
FIG. 1 is a schematic diagram of a continuous analyte monitoring system attached to a host in accordance with various embodiments of the present invention.
Fig. 2 is a schematic structural diagram of an implementation environment according to various embodiments of the present invention.
Fig. 3 is a schematic flow chart of a method for manufacturing an emitter according to the present invention.
Fig. 4 is one of the schematic structural diagrams of the first preform in the manufacturing process of the emitter provided by the present invention.
Fig. 5 is a second schematic structural diagram of the first preform in the manufacturing process of the emitter provided by the present invention.
Fig. 6 is one of the structural schematic diagrams of a second preform in the manufacturing process of the emitter provided by the present invention.
Fig. 7 is a second schematic structural diagram of a second preform in the manufacturing process of the emitter provided by the present invention.
Fig. 8 is one of the structural schematic diagrams of the transmitter provided by the present invention.
Fig. 9 is a second schematic structural diagram of the transmitter provided in the present invention.
FIG. 10 is a schematic diagram of the electrical connections of the transmitter and sensor assembly provided by the present invention.
Wherein, 100, host; 200. a sensor assembly; 300. a receiver; 400. a transmitter; 500. an implanter;
210. a sensor electrode; 220. a sensor base; 230. an adhesive patch; 410. an elastic waterproof component; 420. a printed circuit board; 430. a seal member; 440. a first housing; 450. a second housing; 460. a conductive member; 470. a spigot fitting part; 480. a water-resistant coating; 490. a power source.
211. A first output terminal; 212. a second output terminal; 411. a waterproof body; 412. a first flanging; 413. second flanging; 421. a first surface; 422. a second surface; 423. a first power connection pin; 424. a second power connection pin; 425. a first signal pin; 426. a second signal pin; 441. a first closure member; 442. a limiting member; 451. a second closure member; 461. a first conductive pin; 462. a second conductive pin; 463. a third conductive pin; 464. a fourth conductive pin; 465. a limiting part; 466. a first step; 467. a second step.
Detailed Description
In order to facilitate a better understanding of the technical solutions of the present invention for those skilled in the art, the solutions of the present invention are further described below with reference to the accompanying drawings and various exemplary embodiments. It should be noted that the methods set forth in these examples do not limit the scope of the invention unless specifically noted otherwise.
Referring to FIG. 1, a schematic diagram of a continuous analyte monitoring system attached to a host 100 is shown. A continuous analyte monitoring system including an on-skin sensor assembly 200 is shown secured to the skin of a host 100 by a sensor mount. The system includes a sensor assembly 200 and a transmitter 400 for transmitting analyte information monitored by the sensor assembly 200 to a receiver 300. As shown in fig. 2, the emitter 400 is engaged with the sensor mount 220, and the sensor mount 220 is attached to the adhesive patch 230 and secured to the skin of the host 100 by the adhesive patch 230.
It is to be noted that the analyte in the present invention may be blood sugar, blood ketone, ethanol, lactic acid, creatinine (an analyte related to renal function), uric acid, an analyte causing heart failure (BNP), various analytes of infectious origin (e.g., C-reactive protein, procalcitonin, serum amyloid a, interleukin 6, etc.), and the like.
A method of manufacturing an emitter of the present invention for use in preparing an emitter in a continuous analyte monitoring system is described below in conjunction with fig. 3, comprising:
s1, assembling the elastic waterproof component 410 on the printed circuit board 420 to obtain a first preform, wherein a conductive member 460 is assembled on the first surface 421 of the printed circuit board 420, the elastic waterproof component 410 includes a waterproof main body 411, a first flange 412 and a second flange 413, the waterproof main body 411 covers the second surface 422 of the printed circuit board 420, the first flange 412 covers four sides of the printed circuit board 420, and the second flange 413 partially covers the first surface 421 of the printed circuit board 420; the structure of the first preform is shown in fig. 4-5.
In an embodiment, the elastic waterproof component 410 is molded on the printed circuit board 420 by adopting a liquid silicone injection molding mode, and is directly molded on the printed circuit board 420, the printed circuit board 420 can be used as a part of a mold, the fitting degree is better, the assembling process is completed in the injection molding process, and the assembling cost of the elastic waterproof component 410 after independent injection molding is saved. The mold temperature (generally about 120 ℃) and pressure can not cause damage to electronic components on the printed circuit board in the production process in the form of the silica gel injection molding coating printed circuit board, and the injection molding form of the silica gel injection molding coating printed circuit board is different from the requirement of the form (generally more than 250 ℃) of directly injection molding a shell on a chip in the background technology. Preferably, the silicone injection-molded coated printed circuit board adopts low-hardness liquid silicone.
Preferably, waterproof main body 411, first flange 412 and second flange 413 in the above embodiment are integrally formed to form elastic waterproof member 410.
Generally, the elastic waterproof component 410 is made of a silicone material, and may be made of other waterproof materials with good elasticity.
The printed circuit board 420 is a double-sided board, the first surface 421 and the second surface 422 are two opposite surfaces of the printed circuit board 420, and the printed circuit board 420 further has four side surfaces between the first surface 421 and the second surface 422.
S2, assembling the first prefabricated component with the first shell 440 after assembling the sealing member 430 on the conductive member 460, so as to obtain a second prefabricated component; the structure of the second preform is shown in fig. 6-7.
The sealing member 430 may be a silicone O-ring that surrounds a recessed portion of the conductive member 460 and is waterproof.
In one embodiment, the second surface 422 of the printed circuit board 420 is a surface containing electronic components.
The second surface 422 containing the electronic component is completely covered by the waterproof body 411, ensuring better waterproofness and stability of the electronic component.
S3, assembling the second prefabricated component and the second shell 450, so that the first sealing element 441 and the second flange 413 preset in the first shell 440 are in an elastic press fit state, and the second sealing element 451 and the waterproof main body 411 preset in the second shell 450 are in an elastic press fit state, thereby obtaining the emitter. The structure of the emitter is shown in fig. 8-9.
The second prefabricated part is assembled with the second shell 450, a second closing part 451 is added to the second shell 450, the second closing part 451 can be a circumferentially closed rib arranged at a position avoiding electronic components, and the second closing part 451 is in interference fit with the waterproof main body 411, so that a better waterproof effect can be achieved; a first closing member 441 is preset in the first housing 440, and the first closing member 441 may be a sealing structure that forms an interference fit at a circumferential contact position of the printed circuit board 420, that is, the second burring 413, while compressing the O-ring.
In one embodiment, the first closure member 441 is circumferential and is disposed at a position avoiding the conductive member 460; the second sealing member 451 is formed in a circumferential shape and is provided at a position avoiding the electronic component.
The first and second enclosing members 441, 451 further serve as a positioning function for the printed circuit board 420 in a direction perpendicular to the printed circuit, so as to prevent the printed circuit board 420 from shaking in the first and second housings 440, 450, thereby improving the yield of the finished emitter. The first closing piece 441 and the second closing piece 451 play roles in positioning and waterproofing, and the assembled elastic waterproof assembly 410 is in an elastic pressing fit state at the matching part of the first closing piece 441 and the second closing piece 451, so that the printed circuit board 420 is good in wrapping performance, not easy to loosen and better in sealing performance. And substances such as glue and the like cannot be remained on the surface of the finished emitter product, and secondary processing is not needed.
The invention leads the first closing piece 441 and the second flanging 413 which are preset in the first shell 440 to be in an elastic pressing fit state, and leads the second closing piece 451 and the waterproof main body 411 which are preset in the second shell 450 to be in an elastic pressing fit state; the integral assembly process is simple, the elastic waterproof component 410 is coated on a plurality of surfaces of the printed circuit board 420 in an elastic compression fit mode, the process is simplified, the time, space and other costs are saved, the destructive influence on sensitive electronic components caused by glue pouring and subsequent processes is avoided, the product yield is improved, the consistency is high, and the method, the sealing element 430, the elastic waterproof component 410 and the like are suitable for batch production, so that the waterproof and steam-proof effects are better.
In one embodiment, before the first surface 421 of the printed circuit board 420 is assembled with the conductive member 460, the method includes: the conductive member 460 is pre-processed to a predetermined length, and/or the surface of the conductive member 460 is pre-plated with metal or the conductive member 460 is made of metal.
Generally, one end of the electronic device exposed out of the conductive element 460 is just flush with the first shell 440, and the other end of the electronic device is just welded with the printed circuit board 420, so that the electronic device is convenient to assemble due to the preset length, does not need subsequent cutting steps, and simplifies the process. Preferably, the conductive member 460 is pre-plated with metal on its surface or the conductive member 460 is made of metal. The metal is preferably gold, which has good stability, and generally, the conductive member 460 may be copper with good conductivity, and the exterior is plated with gold in advance. The shape and number of the conductive elements 460 are not limited, and preferably, the conductive elements are generally integrally made into a needle shape, that is, the number of the conductive elements is generally 2 to 4, and the positions of the conductive elements are preset to correspond to the positions of the sensor electrodes 210 in the sensor assembly. The conductive pin is plated with gold firstly, so that the surface oxidation of the conductive pin can be prevented, the stability is good, the conductive pin is not subjected to subsequent processing, the gold layer on the surface of the copper pin cannot be damaged, the cost is low, and the efficiency is high.
In one embodiment, the printed circuit board 420 is electrically connected to a sensor assembly through the conductive member 460, the sensor assembly includes the sensor electrode 210, and a power source 490 for supplying power to the sensor electrode 210 and the printed circuit board 420; the sensor electrode 210 is configured to continuously collect an analyte monitoring signal including a current value for determining an analyte concentration, the current value being obtained after an electrochemical reaction between the sensor electrode 210 and a specific solution in which the sensor electrode 210 is located. For example, blood, interstitial fluid, or other solutions in the body of the subject are monitored.
In one embodiment, the end of the sensor electrode 210 not in the specific solution forms a first output terminal 211 and a second output terminal 212, and the analyte monitoring signal is transmitted to the printed circuit board 420 through the first output terminal 211 and the second output terminal 212. Preferably, the first output terminal 211 and the second output terminal 212 may be formed of a conductive material such as conductive rubber.
In one embodiment, a series circuit is formed between the power source 490, the sensor electrode 210 and the printed circuit board 420 through the conductive member 460. The first output terminal 211 and the second output terminal 212 are electrically connected to the conductive member 460 in a contact manner, and form a loop through the power source 490 and the printed circuit board 420. The power source 490 and the sensor electrode 210 are commonly disposed on the sensor assembly.
As shown in fig. 8-10, in one embodiment, the conductive member 460 includes a first conductive pin 461, a second conductive pin 462, a third conductive pin 463, and a fourth conductive pin 464, and the printed circuit board 420 includes a first signal pin 425, a second signal pin 426, a first power pin 423, and a second power pin 424; wherein, the connection mode of the series circuit comprises: the positive electrode of the power source 490 is electrically connected to the first power connection pin 423 through the first conductive pin 461, the first signal pin 425 is electrically connected to the first output terminal 211 through the second conductive pin 462, the second output terminal 212 is electrically connected to the second signal pin 426 through the third conductive pin 463, and the second power connection pin 424 is electrically connected to the negative electrode of the power source 490 through the fourth conductive pin 464. In fig. 4, 6 and 9, the third conductive pin 463 and the fourth conductive pin 464 are not fully shown for the reason of view angle.
The first power connection pin 423 and the second power connection pin 424 are not connected and respectively correspond to an anode and a cathode of the printed circuit board 420 for supplying power, the first signal pin 425 and the second signal pin 426 are also not connected and respectively correspond to two ends of a sampling circuit for collecting data in the printed circuit board 420, two ends of the sampling circuit are respectively and electrically connected to two ends of the sensor electrode 210, the first power connection pin 423 is electrically connected to the first signal pin 425, the second power connection pin 424 is electrically connected to the second signal pin 426, and the first conductive pin 461, the second conductive pin 462, the third conductive pin 463 and the fourth conductive pin 464 are electrically connected.
In one embodiment, the method comprises the following steps: before the first and second cases 440 and 450 are assembled, a waterproof coating 480 is disposed on an inner surface of the first and second cases 440 and 450, the inner surface being a surface closer to the printed circuit board 420 after the assembly, and/or the waterproof coating 480 is a nano waterproof coating, and a thickness of the nano waterproof coating is 20-30 μm.
The inner surfaces of the first shell 440 and the second shell 450 are processed by nano waterproof coating, the nano waterproof coating is a mature technology, the coating is attached to the inner surface of a product in a vacuum environment through a physical vapor deposition mode, and the parts of the first shell 440 and the second shell 450 cannot be influenced. The waterproof coating 480 is arranged on the inner surface, so that the defect that the waterproof coating is easily worn and consumed when arranged on the outer surface is overcome, and the waterproof coating can be more long-acting and stable on the inner surface.
In one embodiment, the conductive member 460 is assembled with the printed circuit board 420 by means of a patch welding method.
And (3) patch welding, which refers to a welding process of patch type elements. The welding method of the patch type element has two types: the manual soldering method includes tin plating the soldering pad with electric soldering iron, holding one end of the chip element with tweezers, fixing the other end of the element onto the soldering pad, cooling the tin, and soldering the other end of the element with the soldering iron. The second method is machine welding, which is to make a stencil, print solder paste on a circuit board, place the welded chip components manually or by machine, and finally weld the chip components in a high temperature welding furnace. The conductive member 460 is assembled with the printed circuit board 420 by a patch welding method, thereby improving welding efficiency and reliability.
In one embodiment, the assembling the sealing member 430 on the conductive member 460 includes: the sealing member 430 is assembled on the conductive member 460 by an interference fit manner using a limiting part 465, the circumferential diameter of the assembled sealing member 430 is greater than the maximum circumferential diameter of the conductive member 460, and the limiting part 465 is formed by a first step 466 arranged on the conductive member 460 and the first surface 421 of the printed circuit board 420. Preferably, the stop 465 is a concave annular ring. Each conductive pin is provided with a limiting part 465, and each sealing member 430 is assembled on the limiting part 465 of each conductive pin in an interference fit manner, so that the function of water resistance is achieved. The circumferential diameter of the assembled sealing member 430 is larger than the maximum circumferential diameter of the conductive member 460, so that a part of the conductive member 460 is exposed from the assembled sealing member 430, and the first housing 440 and the sealing member 430 (especially, the part of the conductive member) are elastically press-fitted.
In one embodiment, after the second preform is assembled with the second shell 450, the first shell 440 and the sealing member 430 are in a resilient press-fit state.
In one embodiment, the assembling the first preform with the first shell 440 includes:
the first preform is assembled with the first housing 440 by using a second step 467 disposed on the conductive member 460 and the stopper 442 on the first housing 440, where the second step 467 corresponds to the position of the stopper 442.
Each conductive pin is provided with a second step 467, the first shell 440 is provided with a stopper 442 corresponding to the position of each conductive pin, and the stoppers 442 are just connected with the second steps 467 in a matching manner, so as to well position each conductive pin.
In one embodiment, said assembling said second preform with second shell 450 comprises:
assembling the first shell 440 and the second shell 450 in at least one of the following ways:
dispensing at the seam allowance matching part 470 of the first shell 440 and the second shell 450;
ultrasonic welding is performed at the seam allowance engagement 470 of the first shell 440 and the second shell 450.
There may be a circumferential seam allowance fitting 470 between the first shell 440 and the second shell 450 for easy positioning and assembly. The first shell 440 and the second shell 450 adopt a dispensing bonding or ultrasonic welding process, and a good waterproof effect can be achieved through process control; the process is simple, the efficiency is higher, the risk is small, and the yield is high. The assembly of the first shell 440 and the second shell 450 is facilitated, the production efficiency is improved, and the assembly effect is ensured.
In one embodiment, the seam allowance fitting 470 is provided with a gap for dispensing; and/or the section of the spigot fitting part 470 is L-shaped or U-shaped. The L-shaped or U-shaped seam matching part 470 increases the partial volume of the seam for dispensing, prolongs the length of the seam, and enables glue to fill more and has better waterproof performance.
In one embodiment, the electrical connection surface of the conductive member 460 is consistent with the corresponding surface of the first housing 440, and the electrical connection surface is the surface where the conductive member 460 is electrically connected to the first output terminal 211 and the second output terminal 212.
The electrical connection surface is a surface of the conductive member 460 electrically connected to the sensor assembly, and the correspondence between the corresponding surface of the first housing 440 and the electrical connection surface is achieved by a pre-designed length of the conductive member 460, which is easy to achieve consistency, i.e. the correspondence surface and the electrical connection surface are flush.
In one embodiment, the interior of the body of first housing 440 matches the profile of elastomeric flashing assembly 410 in the lengthwise and/or widthwise directions. In one embodiment, the interior of the body of second housing 450 matches the profile of elastomeric flashing assembly 410 in the lengthwise and/or widthwise directions. In the above two modes, the first shell 440 or the second shell 450 can be matched with the shape of the elastic waterproof component 410 in the length direction and/or the width direction, and is tightly matched with the first flange 412, so as to prevent the printed circuit board 420 from shaking in the assembling and using processes.
In one embodiment, the present invention also provides a transmitter for use in a continuous analyte monitoring system, comprising:
the elastic waterproof component 410 is assembled on the printed circuit board 420, the elastic waterproof component 410 comprises a waterproof main body 411, a first flanging 412 and a second flanging 413, the waterproof main body 411 covers a second surface 422 of the printed circuit board 420, the first flanging 412 covers four side surfaces of the printed circuit board 420, and the second flanging 413 partially covers the first surface 421 of the printed circuit board 420;
the first surface 421 of the printed circuit board 420 is assembled with a conductive member 460, the conductive member 460 is configured to: the sealing member 430 is assembled with the first housing 440.
The transmitter is configured to: the first shell 440 and the second shell 450 are assembled to form a state that the first sealing element 441 preset in the first shell 440 is in elastic press fit with the second flange 413, and the second sealing element 451 preset in the second shell 450 is in elastic press fit with the waterproof main body 411.
Since the emitters correspond to the emitter manufacturing methods in the above embodiments one to one, any of the above emitter manufacturing methods is also applicable to the emitters, and the description thereof is omitted.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (17)
1. A method of manufacturing an emitter for use in preparing an emitter in a continuous analyte monitoring system, comprising:
assembling an elastic waterproof assembly on a printed circuit board to obtain a first prefabricated part, wherein a conductive piece is assembled on a first surface of the printed circuit board, the elastic waterproof assembly comprises a waterproof main body, a first flanging and a second flanging, the waterproof main body wraps a second surface of the printed circuit board, the first flanging wraps four side surfaces of the printed circuit board, and the second flanging partially wraps the first surface of the printed circuit board;
after a sealing element is assembled on the conductive piece, assembling the first prefabricated piece and the first shell to obtain a second prefabricated piece;
and assembling the second prefabricated part and the second shell to enable the first sealing element preset in the first shell and the second flanging to be in an elastic compression fit state, and enable the second sealing element preset in the second shell and the waterproof main body to be in an elastic compression fit state to obtain the emitter.
2. The method of manufacturing an emitter according to claim 1, wherein: before the first surface of the printed circuit board is assembled with the conductive piece, the printed circuit board comprises: the conductive member is pre-processed to a predetermined length, and/or the surface of the conductive member is pre-plated with metal or the conductive member is made of metal.
3. The method of manufacturing an emitter according to claim 1, wherein: the printed circuit board is electrically connected with the sensor assembly through the conductive piece, and the sensor assembly comprises a sensor electrode and a power supply for supplying power to the sensor electrode and the printed circuit board; the sensor electrode is used for continuously collecting analyte monitoring signals, the analyte monitoring signals comprise current values used for determining the concentration of an analyte, the current values are obtained after electrochemical reaction is generated between the sensor electrode and a specific solution, and the specific solution is the solution in which the sensor electrode is positioned.
4. The method of manufacturing an emitter according to claim 3, wherein: one end of the sensor electrode, which is not in the specific solution, is provided with a first output terminal and a second output terminal, and the analyte monitoring signal is transmitted to the printed circuit board through the first output terminal and the second output terminal.
5. The method of manufacturing an emitter according to claim 4, wherein: and a series loop is formed among the power supply, the sensor electrode and the printed circuit board through the conductive piece.
6. The method of manufacturing an emitter according to claim 5, wherein: the conductive piece comprises a first conductive pin, a second conductive pin, a third conductive pin and a fourth conductive pin, and the printed circuit board comprises a first signal pin, a second signal pin, a first power connection pin and a second power connection pin; wherein, the connection mode of the series circuit comprises: the positive pole of the power supply is electrically connected with the first power connection pin through the first conductive pin, the first signal pin is electrically connected with the first output terminal through the second conductive pin, the second output terminal is electrically connected with the second signal pin through the third conductive pin, and the second power connection pin is electrically connected with the negative pole of the power supply through the fourth conductive pin.
7. The method of manufacturing an emitter according to claim 1, wherein: said assembling a resilient waterproofing component on said printed circuit board comprising: the elastic waterproof assembly is molded on the printed circuit board in a liquid silica gel injection molding mode.
8. The method of manufacturing an emitter according to claim 1, wherein: the conductive piece is assembled with the printed circuit board in a patch welding mode.
9. The method of manufacturing an emitter according to claim 1, wherein: the assembling of the sealing member on the conductive member includes: and assembling a sealing element on a limiting part on the conductive piece in an interference fit manner, wherein the limiting part is formed by a first step arranged on the conductive piece and the first surface of the printed circuit board.
10. The method of manufacturing an emitter according to claim 9, wherein: and after the second prefabricated member and the second shell are assembled, the first shell and the sealing element are in an elastic compression fit state.
11. The method of manufacturing an emitter according to claim 1, wherein: the assembling the first preform with a first shell includes:
and assembling the first prefabricated part and the first shell by utilizing the matching of a second step arranged on the conductive piece and the limiting piece on the first shell, wherein the second step corresponds to the limiting piece in position.
12. The method of manufacturing an emitter according to claim 1, wherein: the assembling the second preform with a second shell includes:
assembling the first housing with the second housing in at least one of:
dispensing glue at the matching position of the seam allowances of the first shell and the second shell;
and carrying out ultrasonic welding at the seam allowance matching part of the first shell and the second shell.
13. The method of manufacturing an emitter according to claim 12, wherein: the seam matching part is provided with a gap for dispensing; and/or the section of the spigot matching part is L-shaped or U-shaped.
14. The method of manufacturing an emitter according to claim 4, wherein: the electric connection surface of the conductive piece is consistent with the corresponding surface of the first shell, and the electric connection surface is electrically connected with the first output terminal and the second output terminal.
15. The method of manufacturing an emitter according to claim 1, wherein: the interior of the main body of the first shell is matched with the shape of the elastic waterproof component in the length direction and/or the width direction.
16. The method of manufacturing an emitter according to claim 1, wherein: the interior of the main body of the second shell is matched with the appearance of the elastic waterproof component in the length direction and/or the width direction.
17. A transmitter for use in a continuous analyte monitoring system, comprising:
the waterproof device comprises an elastic waterproof component, a first flange and a second flange, wherein the elastic waterproof component is assembled on a printed circuit board and comprises a waterproof main body, the first flange and the second flange;
a conductive member assembled to the first surface of the printed circuit board, the conductive member configured to: assembling the first shell with the sealing element;
the transmitter is configured to: the waterproof shell is formed by assembling the first shell and the second shell, after the first shell and the second shell are assembled, a first sealing piece preset in the first shell and the second flanging are in an elastic compression fit state, and a second sealing piece preset in the second shell and the waterproof main body are in an elastic compression fit state.
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| JP2008171596A (en) * | 2007-01-09 | 2008-07-24 | Fujikura Ltd | Flexible flat harness and its manufacturing method |
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| JP2008171596A (en) * | 2007-01-09 | 2008-07-24 | Fujikura Ltd | Flexible flat harness and its manufacturing method |
| JP2010073554A (en) * | 2008-09-19 | 2010-04-02 | Omron Corp | Information input device |
| JP2010051023A (en) * | 2009-11-30 | 2010-03-04 | Panasonic Corp | Foldable mobile terminal and mobile terminal |
| CN102781191A (en) * | 2012-07-16 | 2012-11-14 | 何锦涛 | Waterproof embedding type electronic device |
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