CN114501771A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN114501771A CN114501771A CN202011164223.3A CN202011164223A CN114501771A CN 114501771 A CN114501771 A CN 114501771A CN 202011164223 A CN202011164223 A CN 202011164223A CN 114501771 A CN114501771 A CN 114501771A
- Authority
- CN
- China
- Prior art keywords
- impedance
- circuit board
- printed circuit
- signal
- signal via
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
An embodiment of the present invention provides a printed circuit board, including: the device comprises a plurality of stacked plates, conductive layers arranged between the adjacent plates, signal via holes penetrating through the plates and the conductive layers, and impedance adjusting parts arranged around the signal via holes, wherein the impedance adjusting parts are used for adjusting the impedance of the signal via holes. The invention also provides a manufacturing method of the printed circuit board, which comprises the following steps: determining initial impedance of the signal via hole of the printed circuit board; determining a difference between the initial impedance and a target impedance of the signal via; if the difference value is larger than the preset threshold value, the impedance adjusting part is arranged to surround the signal via hole, so that the difference value between the impedance of the signal via hole and the target impedance is smaller than the preset threshold value. According to the printed circuit board and the manufacturing method thereof provided by the embodiment of the invention, the impedance of the signal via hole in the printed circuit board can be effectively adjusted through the impedance adjusting part arranged around the signal via hole, so that the stability of the signal in the printed circuit board is improved.
Description
Technical Field
The embodiment of the application relates to the field of communication, in particular to a printed circuit board and a manufacturing method thereof.
Background
As system signal rates become higher and higher, the effect of impedance continuity of signal vias on printed circuit boards becomes more pronounced. Especially, in the 112G + system, a board with a low dielectric constant and a low loss angle is required to be designed to ensure the performance of high-speed signals, and simultaneously, with the increase of chip density, the size of the signal via holes used in the design is smaller and smaller in order to control the hole-to-hole and line-to-hole crosstalk.
However, in the case of low dielectric constant and small-sized via, the introduced high impedance will cause very serious impedance discontinuity due to the parasitic parameters of the signal via, thereby greatly affecting the performance of the high-speed signal via.
Therefore, how to improve the impedance continuity of the signal via hole and ensure the stability of signal transmission under the condition that the signal rate of the printed circuit board is higher and higher becomes a problem to be solved urgently in the design and manufacturing process of the printed circuit board.
Disclosure of Invention
The embodiment of the application mainly aims to provide a printed circuit board and a manufacturing method thereof, which can improve the impedance continuity of a signal via hole and ensure the stability of signal transmission under the condition that the signal rate of the printed circuit board is higher and higher.
To achieve the above object, an embodiment of the present application provides a printed circuit board, including: the device comprises a plurality of stacked plates, conductive layers arranged between the adjacent plates, signal via holes penetrating through the plates and the conductive layers, and impedance adjusting parts arranged around the signal via holes, wherein the impedance adjusting parts are used for adjusting the impedance of the signal via holes.
In order to achieve the above object, an embodiment of the present application further provides a method for manufacturing a printed circuit board, including: determining initial impedance of the signal via hole of the printed circuit board; determining a difference between the initial impedance and a target impedance of the signal via; if the difference value is larger than the preset threshold value, the impedance adjusting part is arranged to surround the signal via hole, so that the difference value between the impedance of the signal via hole and the target impedance is smaller than the preset threshold value.
According to the printed circuit board and the manufacturing method thereof, the impedance adjusting part arranged around the signal via hole is adopted to adjust the impedance of the signal via hole in the printed circuit board, so that the difference value between the impedance of the signal via hole and the target impedance is smaller than the preset threshold value, the impedance continuity of the signal via hole is improved, and the stability of signal transmission is ensured.
Drawings
Fig. 1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
fig. 3 is a flowchart of a method for manufacturing a printed circuit board according to a second embodiment of the invention;
FIG. 4 is a graph illustrating the impedance gain of the signal via after the impedance adjustment unit is disposed in the second embodiment of the present invention;
fig. 5 is a cross-sectional view of a printed circuit board according to a third embodiment of the present invention;
fig. 6 is a cross-sectional view of a printed circuit board according to a fourth embodiment of the present invention;
fig. 7 is a cross-sectional view of a printed circuit board according to a fifth embodiment of the present invention;
fig. 8(1) is a cross-sectional view of a first printed circuit board according to a sixth embodiment of the present invention;
fig. 8(2) is a cross-sectional view of a second printed circuit board according to a sixth embodiment of the present invention;
fig. 8(3) is a cross-sectional view of a third printed circuit board according to a sixth embodiment of the present invention;
fig. 8(4) is a cross-sectional view of a fourth printed circuit board according to a sixth embodiment of the present invention;
fig. 8(5) is a cross-sectional view of a fifth printed circuit board according to a sixth embodiment of the present invention;
fig. 8(6) is a cross-sectional view of a sixth printed circuit board according to a sixth embodiment of the present invention.
Detailed Description
An embodiment of the present invention provides a printed circuit board, including: the device comprises a plurality of stacked plates, conductive layers arranged between the adjacent plates, signal via holes penetrating through the plates and the conductive layers, and impedance adjusting parts arranged around the signal via holes, wherein the impedance adjusting parts are used for adjusting the impedance of the signal via holes.
In order to achieve the above object, an embodiment of the present application further provides a method for manufacturing a printed circuit board, including: determining initial impedance of the signal via hole of the printed circuit board; determining a difference between the initial impedance and a target impedance of the signal via; if the difference value is larger than the preset threshold value, the impedance adjusting part is arranged to surround the signal via hole, so that the difference value between the impedance of the signal via hole and the target impedance is smaller than the preset threshold value.
According to the printed circuit board and the manufacturing method thereof, the impedance adjusting part arranged around the signal via hole is adopted to adjust the impedance of the signal via hole in the printed circuit board, so that the difference value between the impedance of the signal via hole and the target impedance is smaller than the preset threshold value, the impedance continuity of the signal via hole is improved, and the stability of signal transmission is ensured.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in the examples of the present application, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present application, and the embodiments may be mutually incorporated and referred to without contradiction.
Referring to fig. 1 and 2, fig. 1 is a sectional view of a printed circuit board cut down through a top surface according to an embodiment of the present invention; fig. 2 is a partially enlarged view of a portion a in fig. 1. An embodiment of the present invention provides a printed circuit board, including: the circuit board comprises a plurality of stacked plate materials 101, conductive layers 104 arranged between the adjacent plate materials 101, signal through holes 102 penetrating through part of the plate materials 101 and part of the conductive layers 104 from the top of the printed circuit board downwards, and impedance adjusting parts 110 arranged around the signal through holes 102, wherein the impedance adjusting parts 110 are used for adjusting the impedance of the signal through holes 102. In addition, the printed circuit board is provided with a ground hole 103 penetrating through the printed circuit board and an inner fan-out line layer 105 surrounding the signal via hole 102, wherein the inner fan-out line layer 105 is arranged on the same layer as a layer of plate material 101 positioned at the lower part of the printed circuit board.
In this embodiment, the impedance adjustment unit 110 is formed by connecting the non-metal medium 106 and the signal copper 107, the signal copper 107 surrounds the signal via 102, and the non-metal medium 106 surrounds the signal copper 107. The conductive layer 104 is provided with an anti-pad area 108, and the impedance adjusting part is arranged in the anti-pad area 108 of the conductive layer 104, so that the difference value between the impedance of the signal via hole 102 and the target impedance is smaller than a preset threshold value, the impedance continuity of the signal via hole 102 is improved, and the stability of signal transmission is ensured.
Referring to fig. 3 and 4, fig. 3 is a flowchart of a method for manufacturing a printed circuit board according to a second embodiment of the present invention; fig. 4 is an impedance gain graph of the signal via after the impedance adjustment unit is disposed in the second embodiment of the present invention.
The second embodiment of the invention provides a flow chart of a manufacturing method of a printed circuit board. The manufacturing method of the second printed circuit board comprises the following steps:
an initial impedance of the printed circuit board signal via is determined S11.
The initial impedance of the signal via hole 102 of the printed circuit board is determined, that is, the initial impedance of the signal via hole 102 is determined through simulation of parameters such as the dielectric constant of the original medium in the signal via hole 102 of the printed circuit board, the aperture of the signal via hole 102, the structure of the signal via hole 102, the diameter of the anti-pad of the signal via hole 102, and the like.
Specifically, the inductive reactance and the capacitive reactance of the signal via 102 can be calculated by the following equations:
ZL＝jωL..............................................................(1)
ZC＝1/jωC.............................................(2)
L＝5.08H[l(4H/d)+1]....................................(3)
C＝πεHD/(D2-D).........................................(4)
in the above formulas (1), (2), (3) and (4), ZL is the inductance of the signal via, j is the imaginary unit, ω is the angular frequency of the signal via, L is the parasitic inductance of the signal via, ZC is the capacitive reactance of the signal via, C is the parasitic capacitance of the signal via, H is the length of the signal via, D is the diameter of the signal via pad, D is the inner diameter of the signal via, D2 is the antipad diameter, π is the circumferential ratio, and ε is the dielectric constant of the original medium in the signal via.
As can be seen from the above equations (1), (2), (3) and (4), the impedance decreases as the capacitance value increases and as the inductance value decreases. Therefore, when a low-k dielectric and a small finished aperture hole are used for design in a higher-speed system (e.g., 112G, etc.) to ensure signal performance, the impedance of the via hole will be higher, which affects the impedance continuity of the signal via hole and thus the signal integrity of the whole system.
The initial impedance of the signal via includes the inductive reactance as well as the capacitive reactance of the signal via. The inductive reactance and the capacitive reactance of the signal via hole can be calculated according to the formulas (1), (2), (3) and (4).
A difference between the initial impedance and the target impedance of the signal via is determined S12.
And a target impedance value is set, so that the target impedance value is ensured not to influence the impedance continuity of the signal via hole, and the signal integrity of the whole system can be ensured. The initial impedance minus the target impedance of the signal via yields a difference between the initial impedance and the target impedance of the signal via.
And S13, if the difference is larger than the preset threshold value.
Comparing the difference between the initial impedance and the target impedance of the signal via with a preset threshold.
If the difference minus the preset threshold is positive, determining that the difference is greater than the preset threshold, and executing step S14;
if the difference minus the preset threshold is 0 or negative, the difference is not greater than the preset threshold, and the signal via hole does not need to be adjusted.
And S14, determining a target capacitance value corresponding to the target impedance of the signal through hole.
Specifically, after determining the target impedance (i.e., the target capacitive reactance), the target capacitance value may be obtained inversely according to the above formula 2.
S15, arranging signal copper surrounding signal via holes and arranging non-metal medium surrounding signal copper; and determining the thickness and the area of the signal copper and the dielectric constant of the non-metal medium through three-dimensional electromagnetic field parametric simulation.
In this embodiment, the impedance adjustment unit is formed by connecting a non-metal medium and a signal copper, the signal copper surrounds the signal via hole, and the non-metal medium surrounds the signal copper.
Specifically, the principle of planar capacitance can be used:
C＝εA/h.................................................(5)
in the above formula (5), C is the parasitic capacitance of the signal via, epsilon is the dielectric constant of the dielectric, a is the area of the plate, and h is the plate pitch.
And then signal copper is added at the corresponding positions of certain layers of the signal via holes and is filled with nonmetal media with different dielectric constants. In order to obtain the dielectric constant of the non-metal medium and the thickness and the area of the signal copper more conveniently, the dielectric constant of the non-metal medium and the area and the thickness of the signal copper which need to be provided with the impedance adjusting part can be simulated through three-dimensional electromagnetic field parameterization.
The impedance body adjusting part is arranged in the anti-pad area on the third, fifth, seventh and ninth conductive layers of the printed circuit board from top to bottom through simulation calculation. Specifically, a non-metal medium with the dielectric constant of 3 is filled in the area of the reverse bonding pad of the third conductive layer, signal copper is added on the corresponding signal via hole, the signal copper is a circular ring, the radius of the signal copper is 6 mils, the copper thickness of the signal copper is 0.5oz (ounce), the radius of the reverse bonding pad corresponding to the signal copper is 10 mils, the signal copper surrounds the signal via hole, and the non-metal medium surrounds the signal copper; and non-metal media with the dielectric constant of 3 are filled in the anti-pad areas 108 on the conductive layers 104 of the fifth layer, the seventh layer and the ninth layer, the thickness of the signal copper added on the corresponding signal via holes is 0.5oz, the non-metal media are circular rings, the radius of the non-metal media is 7mil, the radius of the corresponding anti-pad is also 10mil, the signal copper surrounds the signal via holes, and the non-metal media surround the signal copper. In this embodiment, the conductive layer is a signal layer, and the material of the signal layer is copper.
With further reference to fig. 4, fig. 4 is an impedance gain graph of the signal via after the impedance adjustment unit is disposed in the second embodiment of the present invention, and after the above scheme is adopted, a dotted line in the graph is an impedance change curve that changes with time when the printed circuit board without the impedance adjustment unit is transmitting data, so that when the time is 0.135ns (ns: nanosecond), the impedance of the signal via is 99ohm (ohm: ohm); the solid line in the figure is an impedance change curve of the printed circuit board after the impedance adjusting part is arranged, which changes along with time when the printed circuit board transmits data, and when the time is 0.135ns, the impedance of the signal via hole is 90.5ohm, the impedance of the signal via hole is reduced by 8.5ohm, the impedance continuity is better, the performance is better, and the application scene of high-speed design can be better satisfied. In addition, as can be understood by those skilled in the art, different initial impedances of different signal via holes are different from a target impedance difference value, and the initial impedances of different portions of the signal via holes are different from the target impedance difference value, so that each parameter of the impedance adjusting unit is adjusted, so that the impedance of each portion of the signal via hole approaches to the target impedance, the impedance continuity of the signal via hole is improved, and the stability of signal transmission is ensured. Further simulating the thickness and/or area of the signal copper and the dielectric constant of the non-metal medium by three-dimensional electromagnetic field parameterization simulation, wherein the shape of the signal copper, the shape of the non-metal medium and the shape of the anti-bonding pad are not limited to a ring shape; meanwhile, the optimized object is not limited to the differential hole in the figure, and can also be a high-frequency single hole; it is noted that the conductive layer may be a signal layer or a planarization layer.
Referring to fig. 5, fig. 5 is a cross-sectional view of a printed circuit board cut down through a top surface according to a third embodiment of the present invention. The printed circuit board provided by the third embodiment of the present invention is substantially the same as the printed circuit board provided by the first embodiment, and is different from the first embodiment in that: the impedance adjusting part is a non-metal medium 106, and the non-metal medium 106 surrounds the signal via hole 102. In this embodiment, the conductive layer 104 is a signal layer made of copper.
In this embodiment, the impedance adjusting portion is a non-metal medium 106 and is disposed in the anti-pad region of the conductive layer 104, and the impedance of the signal via 102 can be effectively adjusted by adjusting the capacitance of the signal via 102, thereby ensuring the continuity of the impedance of the signal via 102.
As will be understood by those skilled in the art, the difference between the initial impedance and the target impedance of different signal vias 102 is different, and the initial impedance and the target impedance of different portions of the same signal via 102 are also different, so that the dielectric constant of the non-metal medium 106 required to be set in different signal vias 102 and different portions of the same signal via 102 is simulated through parametric simulation of a three-dimensional electromagnetic field, so that the initial impedance of each signal via 102 and each portion of the signal via 102 approaches the target impedance corresponding thereto. Furthermore, the filled non-metallic media 106 shape and the anti-pad shape are not limited to a ring shape.
Referring to fig. 6, fig. 6 is a cross-sectional view of a printed circuit board cut down through a top surface according to a fourth embodiment of the present invention. The printed circuit board provided by the fourth embodiment of the present invention is substantially the same as the printed circuit board provided by the first embodiment of the present invention, and is different from the first embodiment of the present invention in that the impedance adjusting unit is a signal copper 107, the signal copper 107 surrounds the signal via 102, and a gap 109 is left between the signal copper 107 and the conductive layer 104. In this embodiment, the conductive layer 104 is a signal layer, and the material of the signal layer is copper.
In this embodiment, the impedance adjusting portion is the signal copper 107 and is disposed in the anti-pad region of the conductive layer 104, and the impedance of the signal via 102 can be effectively adjusted by adjusting the capacitance of the signal via 102, thereby ensuring the continuity of the impedance of the signal via 102.
As will be understood by those skilled in the art, the difference between the initial impedance and the target impedance of different signal vias 102 is different, and the initial impedance and the target impedance of different portions of the same signal via 102 are also different, so that the thickness and/or the area of the signal copper 107 required to be disposed in different signal vias 102 and different portions of the same signal via 102 are simulated through the parametric simulation of the three-dimensional electromagnetic field, so that the initial impedance of each signal via 102 and each portion of the signal via 102 approaches the target impedance corresponding thereto. Further, the signal copper 107 shape and the anti-pad shape are not limited to the ring shape.
Referring to fig. 7, fig. 7 is a cross-sectional view of a printed circuit board cut down through a top surface according to a fifth embodiment of the present invention. The printed circuit board according to the fifth embodiment of the present invention is substantially the same as the printed circuit board according to the first embodiment, and is different from the first embodiment in that the impedance adjusting unit is the signal copper 107, the plate (not shown) is located between the conductive layers 104 laid adjacently, the impedance adjusting unit and one of the plate are disposed on the same layer, and a gap is left between the signal copper 107 and the plate. In this embodiment, the conductive layer 104 is a signal layer, and the material of the signal layer is copper.
In this embodiment, the impedance adjusting portion is the signal copper 107, and is disposed on the same layer as one of the plates, and the impedance of the signal via 102 can be effectively adjusted by adjusting the capacitance of the signal via 102, thereby ensuring the continuity of the impedance of the signal via 102.
As will be understood by those skilled in the art, the difference between the initial impedance and the target impedance of different signal vias 102 is different, and the initial impedance and the target impedance of different portions of the same signal via 102 are also different, so that the thickness and/or the area of the signal copper 107 required to be disposed in different signal vias 102 and different portions of the same signal via 102 are simulated through the parametric simulation of the three-dimensional electromagnetic field, so that the initial impedance of each signal via 102 and each portion of the signal via 102 approaches the target impedance corresponding thereto. In addition, the shape of the signal copper 107 and the through holes of the plate material disposed corresponding to the reverse pad region of the signal layer 104 are not limited to the ring shape.
Fig. 8(1) shows a printed circuit board according to a sixth embodiment of the present invention, which is substantially the same as the printed circuit board according to the first embodiment of the present invention, except that the impedance adjustment unit is a non-metal medium 106, and the non-metal medium 106 surrounds the signal via 102; and the non-metallic medium 106 extends throughout the printed circuit board. In this embodiment, the conductive layer 104 is a signal layer, and the material of the signal layer is copper. It will be appreciated that the impedance adjustment section described above may also be adjusted accordingly throughout the entire printed circuit board, see fig. 8(2), the impedance adjustment section extending from above the printed circuit board through a portion of the conductive layer 104 of the printed circuit board; referring to fig. 8(3), the impedance adjustment section penetrates through a part of the conductive layer 104 of the printed circuit board from below the printed circuit board; referring to fig. 8(4), the impedance adjustment section penetrates through the middle part conductive layer 104 of the printed circuit board; referring to fig. 8(5), the impedance adjusting section includes: a first portion of the mid-upper portion conductive layer 104 through the printed circuit board and a second portion of the mid-lower portion conductive layer 104 through the printed circuit board, the first portion running through the printed circuit board with the same number of mid-upper portion conductive layers 104 as the second portion running through the printed circuit board; referring to fig. 8(6), the impedance adjusting section includes: a first portion of the mid-upper conductive layer 104 extending through the printed circuit board and a second portion of the mid-lower conductive layer 104 extending through the printed circuit board, the first portion extending through the printed circuit board and the mid-upper conductive layer 104 being a different number than the second portion extending through the printed circuit board and the mid-lower conductive layer 104.
In this embodiment, the impedance adjusting portion is the non-metal medium 106, but the position of the impedance adjusting portion is not limited to the above, and the position of the impedance adjusting portion can be determined through three-position electromagnetic field parametric simulation according to actual conditions, so that the impedance of the signal via hole can be effectively adjusted by adjusting the capacitance of the signal via hole, and the continuity of the impedance of the signal via hole is further ensured.
In addition, the above embodiments are only specific embodiments for implementing the invention, and the above embodiments are not conflicting, and the technical solution formed by the permutation and combination of the above embodiments should be within the protection scope of the invention, and in practical application, various changes in form and detail can be made without departing from the spirit and scope of the invention.
Claims (17)
1. A printed circuit board, comprising: the circuit board comprises a plurality of stacked plates, a conductive layer arranged between every two adjacent plates, a signal via hole penetrating through the plates and the conductive layer, and an impedance adjusting part surrounding the signal via hole, wherein the impedance adjusting part is used for adjusting the impedance of the signal via hole.
2. The printed circuit board of claim 1, wherein the impedance adjustment unit comprises a signal copper and a non-metallic medium connected to the signal copper, the signal copper surrounds the signal via, and the non-metallic medium surrounds the signal copper.
3. A printed circuit board of claim 2, wherein said conductive layer has an anti-pad region disposed thereon, and said signal copper and said non-metallic dielectric are disposed on said anti-pad region of at least one of said conductive layers.
4. The printed circuit board of claim 1, wherein the impedance adjustment section is a signal copper or non-metallic medium.
5. A printed circuit board according to claim 4, wherein the impedance adjustment portion is a non-metallic medium, an anti-pad region is disposed on the conductive layer, and the impedance adjustment portion is disposed in the anti-pad region of at least one of the conductive layers.
6. The printed circuit board of claim 4, wherein the impedance adjustment portion is a non-metallic medium, and the conductive layer has an anti-pad region disposed thereon, and the impedance adjustment portion penetrates through the plurality of plates and the anti-pad region of the plurality of conductive layers.
7. A printed circuit board according to claim 4, wherein the impedance adjustment section is signal copper, an anti-pad area is provided on the conductive layer, and the impedance adjustment section is provided in the anti-pad area of at least one of the conductive layers with a gap therebetween.
8. The printed circuit board according to claim 4, wherein the impedance adjustment unit is a signal copper, the impedance adjustment unit is disposed on the same layer as one of the plates, and a gap is left between the signal copper and the plate.
9. A printed circuit board according to any of claims 1 to 8, wherein the conductive layer is a planar layer.
10. A printed circuit board according to any of claims 1 to 8, wherein the conductive layer is a signal layer.
11. A printed circuit board according to any one of claims 1 to 8, wherein the signal vias are differential vias or high frequency single vias.
12. A printed circuit board according to any one of claims 1 to 8, wherein the impedance adjustment section is annular.
13. A method of manufacturing a printed circuit board, comprising:
determining initial impedance of the signal via hole of the printed circuit board;
determining a difference between the initial impedance and a target impedance of the signal via;
if the difference is larger than a preset threshold value, an impedance adjusting part is arranged to surround the signal via hole, so that the difference between the impedance of the signal via hole and the target impedance is smaller than the preset threshold value.
14. The method for manufacturing a printed circuit board according to claim 13, wherein the disposing an impedance adjustment section around the signal via comprises:
determining a target capacitance value corresponding to the target impedance of the signal via hole;
the impedance adjusting part is provided with the dielectric constant, the area and/or the thickness, and the dielectric constant, the area and/or the thickness of the impedance adjusting part are determined according to the target capacitance value;
and arranging an impedance adjusting part surrounding the signal via hole.
15. The method for manufacturing a printed circuit board according to claim 14, wherein the determining the dielectric constant, the area and/or the thickness of the impedance adjustment section according to the target capacitance value comprises:
the dielectric constant, area and/or thickness is determined by three-dimensional electromagnetic field parametric simulation.
16. The method of manufacturing a printed circuit board according to claim 15,
setting signal copper as the impedance adjustment part, and determining the dielectric constant, the area and/or the thickness through parametric simulation of a three-dimensional electromagnetic field, wherein the method comprises the following steps of: determining the thickness and/or area of the signal copper through three-dimensional electromagnetic field parametric simulation;
or, setting a non-metal medium as the impedance adjusting part, and determining the dielectric constant, the area and/or the thickness through three-dimensional electromagnetic field parametric simulation includes: and determining the dielectric constant of the non-metallic medium through three-dimensional electromagnetic field parametric simulation.
17. The method according to claim 15, wherein the step of arranging a signal copper to be connected with a non-metallic medium as the impedance adjustment unit, arranging the signal copper to surround the signal via, arranging the non-metallic medium to surround the signal copper, and determining the dielectric constant, the area and/or the thickness by parametric simulation of a three-dimensional electromagnetic field comprises: and determining the thickness and/or area of the signal copper and the dielectric constant of the non-metal medium through three-dimensional electromagnetic field parametric simulation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011164223.3A CN114501771A (en) | 2020-10-27 | 2020-10-27 | Printed circuit board and manufacturing method thereof |
| PCT/CN2021/122266 WO2022089155A1 (en) | 2020-10-27 | 2021-09-30 | Printed circuit board and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011164223.3A CN114501771A (en) | 2020-10-27 | 2020-10-27 | Printed circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114501771A true CN114501771A (en) | 2022-05-13 |
Family
ID=81381878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011164223.3A Pending CN114501771A (en) | 2020-10-27 | 2020-10-27 | Printed circuit board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114501771A (en) |
| WO (1) | WO2022089155A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115135034A (en) * | 2022-06-30 | 2022-09-30 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board) differential via hole impedance capacitive compensation optimization method and PCB |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050072881A (en) * | 2004-01-07 | 2005-07-12 | 삼성전자주식회사 | Multi layer substrate with impedance matched via hole |
| CN1916915A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Method for improving resistance of via hole |
| CN103717012B (en) * | 2012-09-28 | 2018-05-18 | 新华三技术有限公司 | A kind of method and structure of PCB board via impedance control |
| TWI590735B (en) * | 2014-12-15 | 2017-07-01 | 財團法人工業技術研究院 | Signal transmission board and manufacturing method thereof |
| CN111010797A (en) * | 2018-10-08 | 2020-04-14 | 中兴通讯股份有限公司 | Circuit board, equipment and via hole forming method |
-
2020
- 2020-10-27 CN CN202011164223.3A patent/CN114501771A/en active Pending
-
2021
- 2021-09-30 WO PCT/CN2021/122266 patent/WO2022089155A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115135034A (en) * | 2022-06-30 | 2022-09-30 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board) differential via hole impedance capacitive compensation optimization method and PCB |
| CN115135034B (en) * | 2022-06-30 | 2024-01-16 | 苏州浪潮智能科技有限公司 | PCB differential via impedance capacitive compensation optimization method and PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022089155A1 (en) | 2022-05-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107969065B (en) | Printed circuit board | |
| KR100283508B1 (en) | Non-solid reference plane with bidirectional impedance control | |
| CN100512593C (en) | High frequency printed circuit board via VIA | |
| CN101677487B (en) | Printed wiring board and method for manufacturing the same | |
| KR101035528B1 (en) | Common mode choke coil and manufacturing method thereof | |
| JP4056525B2 (en) | Multilayer via structure | |
| CN102196662B (en) | Test point for high-speed bus designs | |
| US6617943B1 (en) | Package substrate interconnect layout for providing bandpass/lowpass filtering | |
| KR102537254B1 (en) | Multilayered printed wiring board and connection structure of multilayered printed wiring board and connector | |
| JP6845118B2 (en) | High frequency transmission line | |
| US8536464B2 (en) | Multilayer substrate | |
| CN203040005U (en) | Printed circuit board | |
| JP7178764B2 (en) | Method for forming circuit board, device and via hole structure | |
| TW201526727A (en) | Circuit board having via and manufacturing method thereof | |
| CN114501771A (en) | Printed circuit board and manufacturing method thereof | |
| JP2013074256A (en) | Multilayer wiring board and high frequency circuit mounted on the same | |
| JP2004241680A (en) | Multilayer printed circuit board | |
| US9301386B2 (en) | Printed circuit board and method of manufacturing the same | |
| CN113079623A (en) | W-band millimeter wave chip multilayer dielectric substrate | |
| CN105323956A (en) | Wiring board | |
| JP2004056144A (en) | Printed wiring board | |
| US10129974B2 (en) | Multi-layer circuit structure | |
| US8487195B2 (en) | Via structure for multi-gigahertz signaling | |
| CN211531426U (en) | Circuit board | |
| KR101466774B1 (en) | Circuit device suppressing common mode noise and method for manufacturing the same, printec circuit board, and mobile terminal equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |