CN114488440A - Optical packaging structure - Google Patents
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- CN114488440A CN114488440A CN202210246274.3A CN202210246274A CN114488440A CN 114488440 A CN114488440 A CN 114488440A CN 202210246274 A CN202210246274 A CN 202210246274A CN 114488440 A CN114488440 A CN 114488440A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to the technical field of optical communication, in particular to an optical packaging structure which comprises an input port, an output port and an optical-electrical structure which is arranged in a stacked mode, wherein the optical-electrical structure comprises a first optical part, a first electrical part, a second optical part, a second electrical part and a light refraction part, the first optical part is arranged on a first layer, the second optical part is arranged on a second layer, the light refraction part is arranged between the first layer and the second layer, when an external optical signal is input from the input port, a part of the optical signal passes through the first optical part and then completes photoelectric conversion at the first electrical part, and the other part of the optical signal sequentially passes through the light refraction part and the second optical part and then completes photoelectric conversion at the second electrical part. The invention increases the channels which can be packaged in the same space through the photoelectric structure arranged in a laminated way, and realizes the purpose of packaging more optical channels under the condition that the volume of the optical device is basically unchanged.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an optical packaging structure.
Background
The optical transceiver module, the optical transmitter module and the optical receiver module are all key components in an optical communication system. The development directions of the existing optical module and the optical device basically require that optical components with more channels are integrated in the same size space. However, in the design of the conventional optical package structure, if more channels are to be integrated, the size of the package structure must be greatly increased, and the purpose of integrating more channels in the same size space cannot be achieved.
In view of this, how to overcome the defects of the prior art and solve the above problem of integrating more channels in the same size space is a problem to be solved in the art.
Disclosure of Invention
In view of the above drawbacks or needs for improvement in the prior art, the present invention provides an optical package structure that enables more optical channels to be packaged without substantially changing the volume of an optical device.
The embodiment of the invention adopts the following technical scheme:
the invention provides an optical packaging structure, which comprises an input port, an output port and a stacked photoelectric structure, wherein:
the input port is used for receiving the input of an external optical signal;
the photoelectric structure comprises a first optical part, a first electric part, a second optical part, a second electric part and a refraction component, wherein the first optical part and the first electric part are arranged on a first layer, the second optical part and the second electric part are arranged on a second layer, the refraction component is arranged between the first layer and the second layer, when an external optical signal is input from the input port, one part of the optical signal passes through the first optical part and then completes photoelectric conversion at the first electric part, and the other part of the optical signal passes through the refraction component and the second optical part in sequence and then completes photoelectric conversion at the second electric part;
the output port is used for connecting an externally provided direct current power supply and outputting a voltage signal subjected to photoelectric conversion by the first electrical part and the second electrical part.
Further, the input port includes an optical port contact pin and an incident collimator disposed in the optical port contact pin, and when an external optical signal passes through the optical port contact pin, the incident collimator converts the external optical signal into a collimated light beam.
Further, the first optical part includes a first wave-splitting element and a first group of converging lenses, the first electrical part includes a first array of optoelectronic chips and a first transimpedance amplifier array, the position of the first wave-splitting element corresponds to the position of the collimated light beam converted by the incident collimator, when the collimated light beam reaches the first wave-splitting element, a part of the optical signal is transmitted and then sequentially enters the first wave-splitting element and the first group of converging lenses and then is converged on the receiving surface of the first array of optoelectronic chips, the first array of optoelectronic chips realizes photoelectric conversion on the received optical signal, the converted electrical signal enters the first transimpedance amplifier array, and then the voltage signal is output to the output port in a differential voltage mode.
Further, the refraction component comprises a turning triangular prism, the second optical part comprises a second wave splitting element and a second group of converging lenses, the second electrical part comprises a second array photoelectric chip and a second transimpedance amplifier array, when collimated light beams reach the first wave splitting element, the other part of light signals enter the turning triangular prism, the second wave splitting element and the second group of converging lenses in sequence after being reflected, the light beams converge on a receiving surface of the second array photoelectric chip, the second array photoelectric chip realizes photoelectric conversion on the received light signals, the converted electric signals enter the second transimpedance amplifier array, and then voltage signals are output to the output port in a differential voltage mode.
Furthermore, the first wavelength division element comprises a first incident surface, the position of the first incident surface corresponds to the position of the collimated light beam converted by the incident collimator, an incident angle smaller than 21 degrees exists between the first incident surface and the incident collimated light beam, and a light splitting film layer is plated on the first incident surface, the light splitting film layer has a full transmission effect on the optical signals within the first group of wavelength ranges, so that the optical signals within the first group of wavelength ranges enter the first wavelength division element, and the light splitting film layer has a full reflection effect on the optical signals within the second group of wavelength ranges, so that the optical signals within the second group of wavelength ranges enter the second wavelength division element after passing through the turning triangular prism.
Furthermore, the first wave-splitting element further comprises a first optical filter, a second optical filter, a third optical filter, a fourth optical filter and a first total reflection surface, after the optical signals entering the first wave-splitting element are reflected and transmitted for multiple times through the first optical filter, the second optical filter, the third optical filter, the fourth optical filter and the first total reflection surface, wave-splitting of four wavelengths is realized, and the first group of converging lenses comprises four corresponding converging lenses so as to converge the optical signals of the four wavelengths to the receiving surface of the first array of photoelectric chips.
Further, the turning triangular prism comprises a triangular incident surface, a triangular reflecting surface and a triangular emergent surface, and optical signals in a second group of wavelength ranges are reflected by the first incident surface, enter the turning triangular prism from the triangular incident surface, are reflected by the triangular reflecting surface and then are emitted from the triangular emergent surface.
Further, the second wave splitting element comprises a second incident surface, a reflection inclined plane, a fifth optical filter, a sixth optical filter, a seventh optical filter, an eighth optical filter and a second total reflection surface, wherein the reflection inclined plane and the second incident surface are arranged at an angle of 45 degrees, optical signals emitted from the triangular emergent surface vertically enter the second incident surface and then are reflected into horizontal optical signals on the reflection inclined plane, and then are reflected and transmitted for multiple times through the fifth optical filter, the sixth optical filter, the seventh optical filter, the eighth optical filter and the second total reflection surface, so that wave splitting of four wavelengths is realized, and the second group of collecting lenses comprises four corresponding collecting lenses so as to collect the optical signals of four wavelengths to the receiving surface of the second array photoelectric chip.
Further, the output port comprises a ceramic component, and a first soft board and a second soft board which are arranged at one end of the ceramic component, the first array photoelectric chip, the first transimpedance amplifier array, the second array photoelectric chip and the second transimpedance amplifier array are arranged at the other end of the ceramic component, the first soft board, the first array photoelectric chip and the first transimpedance amplifier array are located on the same side of the ceramic component, a voltage signal output by the first transimpedance amplifier array is output outwards through the first soft board, the second array photoelectric chip and the second transimpedance amplifier array are located on the other side of the ceramic component, and a voltage signal output by the second transimpedance amplifier array is output outwards through the second soft board.
Further, still include the casing, the casing with the ceramic subassembly sintering is as an organic whole, the one end that is equipped with first soft board and second soft board on the ceramic subassembly is located the casing is outside, the other end that is equipped with first array photoelectricity chip, first transimpedance amplifier array, second array photoelectricity chip and second transimpedance amplifier array on the ceramic subassembly is located inside the casing, first wave splitting component, first group convergent lens, turn triangular prism, second wave splitting component and second group convergent lens all set up inside the casing, light mouth contact pin and incident collimator set up outside the casing.
Compared with the prior art, the embodiment of the invention has the beneficial effects that: by the photoelectric structure arranged in a laminated manner, channels which can be packaged in the same space are increased, and the purpose of packaging more optical channels under the condition that the volume of the optical device is basically unchanged is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a cross-sectional view of a front view of an optical package structure according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a first wave-splitting element according to embodiment 1 of the present invention;
fig. 3 is a cross-sectional view of a top view of an optical package structure according to embodiment 1 of the present invention;
fig. 4 is a schematic view of a turning triangular prism structure according to embodiment 1 of the present invention;
fig. 5 is a schematic structural diagram of a second wave-splitting element according to embodiment 1 of the present invention;
fig. 6 is a schematic structural diagram of a wavelength division component according to embodiment 1 of the present invention;
fig. 7 is a schematic view of an optical path structure of the optical package structure according to embodiment 3 of the present invention.
Detailed Description
In the description of the present invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are for convenience only to describe the present invention without requiring the present invention to be necessarily constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A preferred embodiment 1 of the present invention provides an optical package structure, which includes an input port, an output port, and an optical-electrical structure stacked in layers, where the optical-electrical structure of this embodiment is stacked in layers, and can package more optical channels with the same volume as that of a conventional package structure. The optoelectronic structure of the present embodiment is described by taking an upper layer and a lower layer as an example, and includes a first optical portion, a first electrical portion, a second optical portion, a second electrical portion, and a refractive component disposed between the first layer and the second layer, where when an external optical signal is input from the input port, a part of the optical signal passes through the first optical portion and then completes photoelectric conversion at the first electrical portion, and another part of the optical signal passes through the refractive component and the second optical portion in sequence and then completes photoelectric conversion at the second electrical portion; in addition, the input port of this embodiment is used for receiving an input of an external optical signal, and the output port is used for connecting an externally provided direct current power supply and outputting a voltage signal photoelectrically converted by the first electrical part and the second electrical part. In the preferred embodiment, the first optical portion disposed on the first layer and the second optical portion disposed on the second layer respectively have four optical channels (each layer may also be a plurality of optical channels, and this embodiment is described by taking four common channels as an example), and the upper layer and the lower layer together have eight optical channels.
Specifically, as shown in fig. 1 and referring to fig. 3, in the preferred embodiment, the input port includes, but is not limited to, an optical interface pin 10 and an incident collimator 11 disposed in the optical interface pin 10, and when an external optical signal passes through the optical interface pin 10, the incident collimator 11 converts the external optical signal into a collimated light beam. Preferably, the incident collimator 11 may be a collimating lens, the external optical signal may be a combination of signals with multiple wavelengths, and for convenience of description, the preferred embodiment is described by taking an example that the external optical signal is an optical signal with eight wavelengths, and the optical signal with eight wavelengths is divided into two groups of four wavelengths, namely a long wavelength and a short wavelength.
In the preferred embodiment, the first optical portion includes a first wave-splitting element 30 and a first group of converging lenses 60, the first electrical portion includes a first array of optoelectronic chips 70 and a first transimpedance amplifier array 80, the position of the first wave-splitting element 30 corresponds to the position of the collimated light beam converted by the incident collimator 11, when the collimated light beam reaches the first wave-splitting element 30, a part of the optical signal is transmitted and then sequentially enters the first wave-splitting element 30, and the first group of converging lenses 60 is converged on the receiving surface of the first array of optoelectronic chips 70, the first array of optoelectronic chips 70 performs optical-to-electrical conversion on the received optical signal, the converted electrical signal enters the first transimpedance amplifier array 80, and then outputs a voltage signal to the output port in a differential voltage manner. In the above process, when the collimated light beam reaches the first wavelength splitting element 30, the collimated light beam with eight wavelengths is separated into long waves with four wavelengths and short waves with four wavelengths due to the coating arrangement of the incident surface on the first wavelength splitting element 30, wherein the long waves are passed through and the short waves are reflected, or the short waves are passed through and the long waves are reflected according to the specific arrangement of the coating. Taking the example of passing long wavelengths and reflecting short wavelengths, when the collimated light beam reaches the first wavelength-splitting element 30, four kinds of long-wavelength optical signals enter the first wavelength-splitting element 30, and four kinds of short-wavelength optical signals are reflected.
In the preferred embodiment, the refractive component includes a turning triangular prism 40, the second optical portion includes a second wave-splitting element 50 and a second group of converging lenses 110, the second electrical portion includes a second array photoelectric chip 120 and a second transimpedance amplifier array 130, when a collimated light beam reaches the first wave-splitting element 30, a reflected optical signal sequentially enters the turning triangular prism 40, the second wave-splitting element 50, and the second group of converging lenses 110 and then converges to a receiving surface of the second array photoelectric chip 120, the second array photoelectric chip 120 performs photoelectric conversion on the received optical signal, a converted electrical signal enters the second transimpedance amplifier array 130, and then a voltage signal is output to the output port in a differential voltage manner.
In the preferred embodiment, the output port includes, but is not limited to, a ceramic assembly 90 and first and second soft plates 100 and 140 disposed at one end of the ceramic assembly 90, the first array of optoelectronic chips 70, the first transimpedance amplifier array 80, the second array of optoelectronic chips 120 and the second transimpedance amplifier array 130 are disposed at the other end of the ceramic package 90, and the first flexible printed circuit board 100, the first array of optoelectronic chips 70 and the first transimpedance amplifier array 80 are located on the same side of the ceramic component 90, the voltage signal output by the first transimpedance amplifier array 80 is output through the first flexible printed circuit board 100, the second soft board 140, the second array optoelectronic chip 120, and the second transimpedance amplifier array 130 are located on the other side of the ceramic component 90, and the voltage signal output by the second transimpedance amplifier array 130 is output through the second soft board 140.
In the preferred embodiment, the optical package structure further includes a housing 20, the housing 20 and the ceramic component 90 are sintered into a whole, one end of the ceramic component 90 on which the first soft board 100 and the second soft board 140 are disposed outside the housing 20, the other end of the ceramic component 90 on which the first array optoelectronic chip 70, the first transimpedance amplifier array 80, the second array optoelectronic chip 120, and the second transimpedance amplifier array 130 are disposed inside the housing 20, the first wave splitting element 30, the first set of converging lenses 60, the turning triangular prism 40, the second wave splitting element 50, and the second set of converging lenses 110 are disposed inside the housing 20, and the optical port pin 10 and the incident collimator 11 are disposed outside the housing 20.
As shown in fig. 2, referring to fig. 1, the first dichroic element 30 in the present preferred embodiment includes a first incident surface 301, a position of the first incident surface 301 corresponds to a position of the collimated light beam converted by the incident collimator 11, an incident angle smaller than 21 degrees exists between the first incident surface 301 and the incident collimated light beam, and a light splitting film layer is plated on the first incident surface 301, the light splitting film layer has a total transmission effect on the optical signals within the first group of wavelength ranges, so that the optical signals within the first group of wavelength ranges enter the first dichroic element 30, and the light splitting film layer has a total reflection effect on the optical signals within the second group of wavelength ranges, so that the optical signals within the second group of wavelength ranges enter the second dichroic element 50 after passing through the turning triangular prism 40. The optical signals in the first group of wavelength ranges, that is, the optical signals of the four long waves in the foregoing example, and the optical signals in the second group of wavelength ranges, that is, the optical signals of the four short waves in the foregoing example, may be replaced with the wavelength ranges of total reflection and total transmission, as required.
As shown in fig. 2, the first wave-splitting element 30 in the preferred embodiment further includes four filters sequentially attached to the exit surface: each optical filter 302, the second optical filter 303, the third optical filter 304, and the fourth optical filter 305 transmits a channel target wavelength and reflects other wavelength signals, in addition, one surface corresponding to the optical filter is set as a first total reflection surface 306, after the optical signals entering the first wavelength division element 30 are reflected and transmitted for multiple times by the first optical filter 302, the second optical filter 303, the third optical filter 304, the fourth optical filter 305, and the first total reflection surface 306, the four wavelength division is realized, the optical signals of four long wavelengths are distinguished, and the optical signals of four long wavelengths are respectively emitted from the four optical filters. Referring to fig. 3, the first group of condensing lenses 60 includes four corresponding condensing lenses to condense the optical signals of four wavelengths to the receiving surfaces of the first array of optoelectronic chips 70.
As shown in fig. 4, the turning triangular prism 40 in the preferred embodiment includes a triangular incident surface 401, a triangular reflecting surface 402 and a triangular emergent surface 403, and referring to fig. 1, an optical signal in a second set of wavelength ranges is reflected by the first incident surface 301, enters the turning triangular prism 40 from the triangular incident surface 401, is reflected by the triangular reflecting surface 402, and then exits from the triangular emergent surface 403. In the above process, the angle of the turning triangular prism 40 is adjusted so that the light reflected by the triangular reflecting surface 402 is emitted perpendicularly from the triangular emitting surface 403. In addition, the triangular incident surface 401 and the triangular emergent surface 403 are coated with antireflection films for the wavelengths of the optical signals in the second set of wavelength ranges, and the triangular reflecting surface 402 is coated with antireflection films for the wavelengths of the optical signals in the second set of wavelength ranges, so as to improve the performance.
As shown in fig. 5, the second wavelength division element 50 in the preferred embodiment includes a second incident surface 501, a reflection inclined surface 502, a fifth optical filter 503, a sixth optical filter 504, a seventh optical filter 505, an eighth optical filter 506, and a second total reflection surface 507, wherein the reflection inclined surface 502 is disposed at 45 degrees to the second incident surface 501, the second incident surface 501 is disposed horizontally, an optical signal emitted from the triangular exit surface 403 enters the second incident surface 501 vertically, is reflected as a horizontal optical signal by the reflection inclined surface 502, and then is reflected and transmitted multiple times by the fifth optical filter 503, the sixth optical filter 504, the seventh optical filter 505, the eighth optical filter 506, and the second total reflection surface 507 to realize four wavelength division, and separate four short-wave optical signals to be emitted from the four optical filters. The second group of focusing lenses 110 includes four corresponding focusing lenses to focus the optical signals with four wavelengths to the receiving surface of the second array optoelectronic chip 120, and the arrangement of the second group of focusing lenses 110 may refer to the arrangement of the first group of focusing lenses 60, which is not shown in the figure. In addition, the second incident surface 501 is coated with an antireflection film, and the reflection slope 502 is coated with a total reflection film to enhance performance.
As shown in fig. 6, the combination of the first wave splitting element 30, the turning triangular prism 40, and the second wave splitting element 50 in the preferred embodiment is a complete wave splitting assembly structure in the present embodiment, and the wave splitting assembly has eight optical channels, and can separate and transmit optical signals of eight wavelengths including four long waves and four short waves. It should be noted that, in the extended scheme of the present invention, more layers of photoelectric structures may also be provided, and accordingly, a layer of filter film needs to be plated on the reflection inclined plane 502 of the second wavelength division element 50 to implement a function of partial transmission and partial reflection, and then a new refractive component is provided in the added layer of photoelectric structure and the second layer of photoelectric structure, and so on, and the same is true when more layers of photoelectric structures are provided.
To sum up, in the preferred embodiment, the stacked optoelectronic structures increase the number of channels that can be packaged in the same space, and the purpose of packaging more optical channels is achieved under the condition that the volume of the optical device is basically unchanged.
Example 2
Based on the optical package structure provided in embodiment 1, embodiment 2 of the present invention describes in detail a manufacturing process of the optical package structure. Note that, before the manufacturing is started, in order to facilitate the assembly of the upper and lower two-component wave assemblies, the upper and lower surfaces of the housing 20 are opened, and the housing 20 used herein is in the form of a tube housing.
Referring to fig. 1, the case 20 and the ceramic member 90 are first sintered together, the ceramic member 90 having upper and lower surfaces, and a portion of the ceramic member 90 being inside the case 20 and a portion being outside the case 20. Through walking the line with the metal level of inside at ceramic subassembly 90 back, can realize inside and outside electric connection, in addition, this embodiment still is equipped with input and output pad respectively at ceramic subassembly 90's both ends.
After the assembly process begins, the first array photoelectric chip 70 and the first transimpedance amplifier array 80 are firstly mounted on the upper surface of the ceramic component 90 in the shell 20, and the mounting process can adopt a silver paste mounting and baking curing process or a pre-eutectic curing process; after the chip is cured, the housing 20 is turned over, and the second array of optoelectronic chips 120 and the second transimpedance amplifier array 130 are mounted and cured on the lower surface of the ceramic component 90 by a similar process. After the chip mounting process is completed, the first array photoelectric chip 70, the first transimpedance amplifier array 80, the second array photoelectric chip 120, the second transimpedance amplifier array 130 and the input pad on the surface of the ceramic component 90 are connected through wire bonding by a wire bonding device, so that the electrical communication among the elements is realized.
In this embodiment, the first flexible printed circuit board 100 and the second flexible printed circuit board 140 also include input pads and output pads, and the input pads and the output pads are connected by surface traces. The two flexible boards are respectively welded to the upper and lower surfaces of the outside of the ceramic assembly 90, the output bonding pads of the ceramic assembly 90 correspond to the input bonding pads of the flexible boards, and the bonding of the flexible board bonding pads is generally realized by means of thermocompression bonding or laser welding.
In the present embodiment, the first and second wavelength-splitting elements 30 and 50 are positioned by means of passive patches; specifically, the optical path coupling process of this embodiment is as follows: the optical port pin 10 and the incident collimator 11 are disposed at the optical port of the housing 20, and the light source enters from the optical port pin 10 and is collimated by the incident collimator 11. The light source of the present embodiment is a light beam with eight wavelengths, the collimated light beam with eight wavelengths is incident on the first incident surface 301 of the first dichroic element 30, and the first incident surface 301 is coated with a filter (i.e. a light splitting film layer) with a corresponding thickness, which transmits four wavelengths of the light source and reflects the other four wavelengths. Since the wavelength selection function of the optical filter surface depends mainly on the incident angle, for example, in order to meet the wavelength requirement of a Coarse Wavelength Division Multiplexing (CWDM) system, the incident angle of the first incident surface 301 must be less than 21 degrees, preferably less than 16 degrees. As the angle of incidence increases, mixing of the long and short wavelengths adjacent to each other may occur.
After the transmitted four wavelengths are reflected and transmitted for multiple times by the first filter 302, the second filter 303, the third filter 304, the fourth filter 305 and the first total reflection surface 306, the four wavelengths are separated. The four separated collimated light waves enter the first group of converging lenses 60 at corresponding positions, the positions and angles of the first group of converging lenses 60 are adjusted, meanwhile, the position of the incident collimator 11 is adjusted, after the response current of the first array of the photoelectric chips 70 is observed to reach an optimal value, the first group of converging lenses 60 are fixed, and curing is generally performed through ultraviolet glue. The ferrule 10 and the collimator 11 are then secured to the housing 20 using a laser welding process.
The four reflected wavelengths enter the triangular incident surface 401 of the turning triangular prism 40, and the triangular incident surface 401 is coated with an antireflection film to ensure the transmission efficiency; then, the light is reflected by a triangular reflecting surface 402, and the triangular reflecting surface 402 is plated with a full-reflection film, so that the reflecting efficiency is ensured; and finally, the light is emitted from the triangular emitting surface 403, and the triangular emitting surface 403 is coated with an antireflection film, so that the transmission efficiency is ensured.
The optical signal emitted from the turning triangular prism 40 vertically enters the second incident surface 501 of the second wavelength division element 50, the reflection inclined surface 502 of the second wavelength division element 50 is arranged at an angle of 45 degrees with the second incident surface 501, and the reflection inclined surface 502 reflects the optical signal to the horizontal direction. The second wavelength-splitting element 50, similar to the first wavelength-splitting element 30, splits the optical signal into four wavelengths of optical signals, and in this process, the second group of focusing lenses 110 needs to be adjusted to couple the optical signals with the second array of optoelectronic chips 120, and then the second group of focusing lenses 110 is fixed. Since the relative positions of the optical port pin 10 and the incident collimator 11 to the housing 20 are fixed when the first group of the collecting lenses 60 is coupled. Therefore, when the second group of converging lenses 110 is coupled, the position and angle of the incident light can be adjusted by the turning triangular prism 40.
After the arrangement and fixation of all the electrical and optical components inside the housing 20 are completed, the upper and lower surfaces of the housing 20, which are open, are finally sealed and welded with upper cover plates to complete the packaging of the device.
In summary, the optical package structure manufactured in this embodiment has two layers of optoelectronic structures and eight optical channels, and compared with the prior art, this embodiment can increase channels that can be packaged in the same space, thereby achieving the purpose of packaging more optical channels under the condition that the volume of the optical device is not changed basically.
Example 3
This embodiment 3 also provides an optical package structure, which has the same basic concept as the optical package structures of embodiments 1 and 2, except that the optical path of the optical package structure of this embodiment 3 is opposite to the optical paths of embodiments 1 and 2.
Specifically, as shown in fig. 7, the optical package structure of this embodiment 3 includes stacked optical path structures, where the optical path structure includes a first optical path structure disposed on a first layer, a second optical path structure disposed on a second layer, and a light turning element 230 disposed between the first layer and the second layer, the first optical path structure includes a first group of lasers 210, a first group of turning lenses 211, and a first combining element 212, and the second optical path structure includes a second group of lasers 220, a second group of turning lenses 221, and a second combining element 222; after light emitted by the first group of lasers 210 passes through the first group of turning lenses 211, the light is combined in the first wave combining element 212 and is emitted from a light outlet of the first wave combining element 212; light emitted by the second group of lasers 220 is combined in the second wave combining element 222 after passing through the second group of turning lenses 221, then reflected by the light outlet of the first wave combining element 212 after being refracted by the light turning piece 230, and finally is overlapped with the light path emitted by the first group of lasers 210 and emitted.
In the present embodiment, the first group of lasers 210 and the second group of lasers 220 are both arranged in parallel, the position of the first group of lasers 210 is the same as the position of the first array of optoelectronic chips 70 in embodiment 1, and the position of the second group of lasers 220 is the same as the position of the second array of optoelectronic chips 120 in embodiment 1. In contrast, the first array of optoelectronic chips 70 and the second array of optoelectronic chips 120 of embodiment 1 are used for receiving optical signals, and the first group of lasers 210 and the second group of lasers 220 of this embodiment are used for emitting optical signals.
In the present embodiment, the position arrangement of the first group turning lens 211 coincides with the position arrangement of the first group condensing lens 60 in embodiment 1, and the position arrangement of the second group turning lens 221 coincides with the position arrangement of the second group condensing lens 110 in embodiment 1. Referring to fig. 7, the first group turning lens 211 and the second group turning lens 221 of the present embodiment have trapezoidal cross sections, wherein the light emitted from the first group laser 210 enters from the bottom end of the first group turning lens 211, is reflected on the inner slope of the first group turning lens 211 into a horizontal beam, exits from the right end, and emits to the first wave combining element 212; the light emitted from the second group of lasers 220 enters from the upper end of the second group of turning lenses 221, is reflected on the inner slope of the second group of turning lenses 221 into a horizontal beam, and then exits from the right end to the second wave combining element 222.
In the present embodiment, the position of the first multiplexer element 212 is the same as that of the first demultiplexer element 30 in embodiment 1, but the light incident surface and the light emitting surface are opposite; the position of the second multiplexer 222 is the same as that of the second demultiplexer 50 in example 1, but the light incident surface and the light emitting surface are opposite to each other.
In the present embodiment, the positional arrangement of the light-bending member 230 coincides with the positional arrangement of the prism 40 in embodiment 1. It should be noted that the right end face of the second wave combining element 222 is inclined so that the light beam incident into the second wave combining element 222 is reflected and emitted from the exit port above the second wave combining element 222 to the light turning member 230, and the light beam enters the light turning member 230 and is reflected inside the light turning member 230 and emitted to the exit port of the first wave combining element 212, and it should be noted that the exit port of the first wave combining element 212 is coated to reflect the light beam within the wavelength range emitted by the first group of lasers 210 and reflect the light beam within the wavelength range emitted by the second group of lasers 220.
In this embodiment, by the above-mentioned stacked optical path arrangement, more optical path channels can be packaged in the same space, and the purpose of packaging more optical paths is achieved under the condition that the volume of the optical device is basically unchanged.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. An optical package structure comprising an input port, an output port, and an opto-electronic structure arranged in a stack, wherein:
the input port is used for receiving the input of an external optical signal;
the photoelectric structure comprises a first optical part, a first electric part, a second optical part, a second electric part and a refraction component, wherein the first optical part and the first electric part are arranged on a first layer, the second optical part and the second electric part are arranged on a second layer, the refraction component is arranged between the first layer and the second layer, when an external optical signal is input from the input port, one part of the optical signal passes through the first optical part and then completes photoelectric conversion at the first electric part, and the other part of the optical signal passes through the refraction component and the second optical part in sequence and then completes photoelectric conversion at the second electric part;
the output port is used for connecting an externally provided direct current power supply and outputting a voltage signal subjected to photoelectric conversion by the first electrical part and the second electrical part.
2. The optical package structure of claim 1, wherein the input port comprises an optical interface pin (10) and an incident collimator (11) disposed in the optical interface pin (10), and when an external optical signal passes through the optical interface pin (10), the incident collimator (11) converts the external optical signal into a collimated beam.
3. The optical package structure according to claim 2, wherein the first optical portion comprises a first wavelength-splitting element (30) and a first set of converging lenses (60), the first electrical portion comprises a first array of optoelectronic chips (70) and a first transimpedance amplifier array (80), the first wavelength-splitting element (30) is located corresponding to the position of the collimated light beam converted by the incident collimator (11), when the collimated light beam reaches the first wavelength-splitting element (30), a part of the optical signal is transmitted and sequentially enters the first wavelength-splitting element (30) and the first set of converging lenses (60) and then is converged on the receiving surface of the first array of optoelectronic chips (70), the first array of optoelectronic chips (70) performs photoelectric conversion on the received optical signal, and the converted electrical signal enters the first transimpedance amplifier array (80), and then outputs a voltage signal to the output port in a differential voltage manner.
4. The optical package structure of claim 3, wherein the light-folding component comprises a corner-folding triangular prism (40), the second optical portion comprising a second wave-splitting element (50) and a second set of converging lenses (110), the second electrical part comprises a second array of optoelectronic chips (120) and a second transimpedance amplifier array (130), the collimated beam upon reaching the first wave-splitting element (30), the other part of the optical signals are reflected and then sequentially enter the turning triangular prism (40), the second wave-splitting element (50) and the second group of converging lenses (110) to be converged on a receiving surface of the second array photoelectric chip (120), the second array photoelectric chip (120) performs photoelectric conversion on the received optical signal, the converted electrical signal enters the second transimpedance amplifier array (130), and then a voltage signal is output to the output port in a differential voltage mode.
5. Optical package according to claim 4, characterized in that the first wavelength-splitting element (30) comprises a first entrance face (301), the position of the first incidence surface (301) corresponds to the position of the collimated light beam converted by the incidence collimator (11), an incident angle smaller than 21 degrees exists between the first incident surface (301) and the incident collimated light beam, and the first incident surface (301) is coated with a light splitting film layer which has a full transmission effect on optical signals within a first group of wavelength ranges, so that the optical signals in the first group of wavelength ranges enter the first wavelength division element (30), the light splitting film layer has a total reflection effect on the optical signals in the second group of wavelength ranges, so that the optical signals in the second group of wavelength ranges enter the second wave splitting element (50) after passing through the turning triangular prism (40).
6. The optical package structure according to claim 5, wherein the first wavelength-splitting element (30) further includes a first optical filter (302), a second optical filter (303), a third optical filter (304), a fourth optical filter (305), and a first total reflection surface (306), and after multiple reflections and transmissions of the optical signal entering the first wavelength-splitting element (30) through the first optical filter (302), the second optical filter (303), the third optical filter (304), the fourth optical filter (305), and the first total reflection surface (306), four wavelength splitting is achieved, and the first set of focusing lenses (60) includes four corresponding focusing lenses to focus the optical signal with four wavelengths to the receiving surface of the first array of optoelectronic chips (70).
7. The optical package structure of claim 5, wherein the turning triangular prism (40) comprises a triangular incident surface (401), a triangular reflecting surface (402) and a triangular exit surface (403), and the optical signal in the second set of wavelength ranges is reflected by the first incident surface (301), enters the turning triangular prism (40) from the triangular incident surface (401), and then exits from the triangular exit surface (403) after being reflected by the triangular reflecting surface (402).
8. The optical package structure according to claim 7, wherein the second wavelength division element (50) comprises a second incident surface (501), a reflective slope (502), a fifth optical filter (503), a sixth optical filter (504), a seventh optical filter (505), an eighth optical filter (506), and a second total reflection surface (507), wherein the reflective slope (502) is disposed at 45 degrees with respect to the second incident surface (501), and after the optical signal emitted from the triangular exit surface (403) vertically enters the second incident surface (501), the optical signal is reflected as a horizontal optical signal at the reflective slope (502) and then passes through the fifth optical filter (503), the sixth optical filter (504), the seventh optical filter (505), the eighth optical filter (506), and the second total reflection surface (507), the four-wavelength division is realized, and the second set of collecting lenses (110) comprises four corresponding collecting lenses, so as to converge the optical signals of four wavelengths to the receiving surface of the second array photoelectric chip (120).
9. The optical package structure of claim 8, wherein the output port comprises a ceramic component (90) and a first soft board (100) and a second soft board (140) disposed at one end of the ceramic component (90), the first array of optoelectronic chips (70), the first transimpedance amplifier array (80), the second array of optoelectronic chips (120), and the second transimpedance amplifier array (130) are disposed at the other end of the ceramic component (90), and the first soft board (100), the first array of optoelectronic chips (70), and the first transimpedance amplifier array (80) are located at the same side of the ceramic component (90), the voltage signal output by the first transimpedance amplifier array (80) is output outward through the first soft board (100), the second soft board (140), the second array of optoelectronic chips (120), and the second transimpedance amplifier array (130) are located at the other side of the ceramic component (90), the voltage signal output by the second transimpedance amplifier array (130) is output to the outside through the second soft board (140).
10. An optical packaging structure is characterized by comprising an optical path structure which is arranged in a laminated manner, wherein the optical path structure comprises a first optical path structure arranged on a first layer, a second optical path structure arranged on a second layer and a light turning element (230) arranged between the first layer and the second layer, the first optical path structure comprises a first group of lasers (210), a first group of turning lenses (211) and a first wave combining element (212), and the second optical path structure comprises a second group of lasers (220), a second group of turning lenses (221) and a second wave combining element (222); light emitted by the first group of lasers (210) passes through the first group of turning lenses (211), is combined in the first wave combining element (212) and is emitted from a light outlet of the first wave combining element (212); light emitted by the second group of lasers (220) passes through the second group of turning lenses (221) and then is combined in the second wave combining element (222), then is reflected by the light outlet of the first wave combining element (212) after being refracted by the light turning piece (230), and finally is overlapped with a light path emitted by the first group of lasers (210) and emitted.
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| CN114967003A (en) * | 2022-05-27 | 2022-08-30 | 武汉光迅科技股份有限公司 | 800G optical device and production method thereof |
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Address after: No. 1, Liusu South Road, Donghu New Technology Development Zone, Wuhan, Hubei 430074 Applicant after: ACCELINK TECHNOLOGIES Co.,Ltd. Address before: 430074, No. 88, postal academy road, Hongshan District, Hubei, Wuhan Applicant before: ACCELINK TECHNOLOGIES Co.,Ltd. |
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