CN114477068A - Micromechanical membrane structure of MEMS device - Google Patents
Micromechanical membrane structure of MEMS device Download PDFInfo
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- CN114477068A CN114477068A CN202210061112.2A CN202210061112A CN114477068A CN 114477068 A CN114477068 A CN 114477068A CN 202210061112 A CN202210061112 A CN 202210061112A CN 114477068 A CN114477068 A CN 114477068A
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- 239000012528 membrane Substances 0.000 title claims description 31
- 239000010409 thin film Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 230000007704 transition Effects 0.000 claims description 17
- 230000007423 decrease Effects 0.000 claims description 7
- 229910001006 Constantan Inorganic materials 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 abstract description 36
- 230000003313 weakening effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a micro-mechanical film structure of MEMS device, which comprises: a substrate; the anchor point seat is arranged on the substrate; the thin film piece, thin film piece connection anchor point seat, thin film piece have keep away from anchor point seat set for the direction and along a plurality of effective width that set gradually of set for the direction, effective width is thin film piece cross-sectional width or cross-sectional width sum on the section plane of the direction is set for to the perpendicular to, and a plurality of effective width reduce along setting for the direction gradually. The invention makes the effective width of the film piece gradually reduced along the set direction, so that the stress on the film piece is uniformly distributed, and stress concentration points are eliminated, thereby weakening the phenomena of fatigue, creep deformation, plastic deformation and the like and improving the reliability.
Description
Technical Field
The invention relates to the technical field of parts of MEMS (micro-electromechanical systems) devices, in particular to a micro-mechanical film structure of an MEMS device.
Background
The micro-mechanical film structure is a typical component in an MEMS (micro electro mechanical system) device, is usually a suspended structure, and is provided with a driving electrode, so that the movement and deformation of the micro-mechanical film structure can be realized. Materials of the micro-mechanical film structure are generally divided into metal, nonmetal, mixed film layers and the like, and for the materials, stress concentration points basically exist under the condition of mechanical stress in the working process, for example, a single-end clamped beam made of metal materials is bent and deformed under the static force action of a driving electrode, the stress concentration points are positioned at the root of the single-end clamped beam, irrecoverable damage such as fatigue, creep deformation, plastic deformation and the like can be easily caused at the stress concentration points, and hidden troubles are brought to the reliability and the service life of an MEMS device.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a micro-mechanical film structure of the MEMS device, which can eliminate stress concentration points, improve the reliability and prolong the service life.
According to an embodiment of the invention, a micromechanical thin film structure of a MEMS device comprises: a substrate; the anchor point seat is arranged on the substrate; the thin film piece is connected with the anchor point seat, the thin film piece is provided with a set direction far away from the anchor point seat and a plurality of effective widths sequentially arranged along the set direction, the effective widths are the cross section widths or the sum of the cross section widths of the thin film piece on a section plane perpendicular to the set direction, and the effective widths are gradually reduced along the set direction.
According to the micromechanical film structure disclosed by the embodiment of the invention, the effective width of the film piece is gradually reduced along the set direction, so that the stress on the film piece is uniformly distributed, and stress concentration points are eliminated, thus the phenomena of fatigue, creep deformation, plastic deformation and the like are weakened, and the reliability is improved.
In some embodiments, the membrane member is provided with an aperture, and the cutting plane passes through the aperture such that at least two sections are formed on the membrane member, and the effective width is the sum of the widths of at least two of the sections.
Further, the hole portion includes a plurality of hole units, and the plurality of hole units are arranged at intervals in the setting direction.
Still further, each of the hole units comprises at least one through hole, and the distribution of the through holes of a plurality of the hole units is compliant with a constantan set.
In some embodiments, the width of the plurality of the hole units arranged along the set direction is gradually increased.
Specifically, the widths of the plurality of the hole units follow a sequence of numbers, which is any one of an equal ratio number, an equal difference number, a difference ratio number, and a power number.
In some embodiments, the aperture portion extends in the setting direction, and a width of the aperture portion gradually increases in the setting direction.
Specifically, the hole walls of the hole portion located on two sides of the set direction are in arc transition or step transition.
In some embodiments, the film member is configured such that a width of the film member gradually decreases in the setting direction.
Specifically, the end portions of the film member located on both sides of the set direction are in arc transition or step transition.
In some embodiments, the membrane member includes a mass member and at least two beam members, each of the beam members having one end connected to the anchor point and the other end connected to the mass member, and each of the beam members having a width that decreases in the set direction.
In some embodiments, the membrane member is configured as a beam or membrane.
Specifically, the beam body is a single-end clamped beam or a double-end clamped beam, wherein when the beam body is the double-end clamped beam, the set direction includes a first direction and a second direction which are opposite in direction, the plurality of effective widths includes two groups, one group of the two groups of effective widths is arranged along the first direction, and the other group of the two groups of effective widths is arranged along the second direction.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a micromechanical membrane structure according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a micromechanical membrane structure according to a second embodiment of the present invention;
FIG. 3 is a schematic diagram of a micro-mechanical membrane structure according to a third embodiment of the present invention;
FIG. 4 is a schematic diagram of a micromachined thin film structure according to a fourth embodiment of the present invention;
FIG. 5 is a schematic diagram of a micro-machined thin film structure according to a fifth embodiment of the present invention;
FIG. 6 is a schematic diagram of a micromachined thin film structure according to a sixth embodiment of the present invention;
FIG. 7 is a schematic diagram of a micro-machined thin film structure according to a seventh embodiment of the present invention;
FIG. 8 is a schematic diagram of a micromachined thin film structure according to an eighth embodiment of the present invention;
FIG. 9 is a schematic diagram of a micromachined thin film structure according to a ninth embodiment of the present invention;
FIG. 10 is a schematic view of a micromachined thin film structure according to a tenth embodiment of the present invention;
fig. 11 is a schematic view of a micromechanical membrane structure according to an eleventh embodiment of the present invention.
Reference numerals:
100. a micromechanical membrane structure;
10. a substrate; 20. an anchor point seat;
30. a thin film member; 31. a hole portion; 311. a hole unit; 312. a through hole; 32. a mass member; 33. a beam member.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.
In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The micromechanical thin-film structure 100 according to embodiments of the present invention is described below with reference to the drawings.
As shown in fig. 1, a micromechanical thin-film structure 100 according to an embodiment of the present invention, micromechanical thin-film structure 100 includes: substrate 10, anchor 20, membrane element 30.
The thin film member 30 is connected with the anchor point seat 20, the thin film member 30 has a set direction far away from the anchor point seat 20 and a plurality of effective widths sequentially arranged along the set direction, the effective widths are the section widths or the sum of the section widths of the thin film member 30 on a section plane perpendicular to the set direction, and the effective widths are gradually reduced along the set direction. It should be noted that, the farther from the anchor point seat 20, the longer the moment arm is, the more easily the deformation occurs, and the effective width of the thin film element 30 is designed, so that the effective width of the thin film element 30 away from the anchor point seat 20 is reduced, the magnitude of the electrostatic force applied to the thin film element is reduced, and the uniformity of the stress is realized.
In the case where the film member 30 has the hole 31, the film member 30 has a plurality of cross-sectional widths in a cross-sectional plane perpendicular to the predetermined direction, and it can be understood that the hole 31 divides the cross-sectional plane into a plurality of cross-sectional widths, and the effective width is the sum of the plurality of cross-sectional widths.
For example, the anchor point seat 20 is located at the left end of the thin film element 30, the setting direction is a left-right direction, the width of the thin film element 30 refers to the size of the thin film element 30 in the front-back direction, the thin film element 30 has a plurality of effective widths in the left-right direction, the effective width close to the anchor point seat 20 is large, and the effective width far away from the anchor point seat 20 is small, so that the electrostatic force applied to the part far away from the thin film element 30 and far away from the anchor point seat 20 is small, and the stress on the whole thin film element 30 is uniform.
According to the micromechanical thin film structure 100 of the embodiment of the present invention, the effective width of the thin film member 30 is gradually reduced along the set direction, so that the stress on the thin film member 30 is uniformly distributed, and stress concentration points are eliminated, thereby reducing fatigue, creep deformation, plastic deformation, and the like, and improving reliability.
As shown in fig. 1 to 4, in some embodiments, the film member 30 is provided with a hole portion 31, and the cutting plane passes through the hole portion 31 so that at least two sections are formed on the film member 30, and the effective width is the sum of the widths of the at least two sections, so that the effective width can sufficiently represent the width of the film member 30 on the cutting plane, thereby facilitating the setting of the stress on the film member 30. For example, the film member 30 is formed with two sections arranged in front and back, and the effective width is the width of the front section plus the width of the rear section; alternatively, the film member 30 is formed with three sections arranged front-to-middle-to-rear, and the effective width is the width of the front section plus the width of the middle section plus the width of the rear section. Of course, there may be more sections, such as four, five, etc., and the effect is the same as that of two sections and three sections, which will not be described herein.
As shown in fig. 1 to 2, further, the hole portion 31 includes a plurality of hole units 311, the plurality of hole units 311 are spaced apart along a set direction, and by disposing the plurality of hole units 311 spaced apart along the set direction, the hole portion 31 is conveniently processed. For example, the setting direction is the left-right direction, the hole portion 31 includes five hole units 311, and the five hole units 311 are sequentially spaced from left to right. Of course, the hole portion 31 may also include two hole units 311, three hole units 311, four hole units 311, or even more hole units 311, which are all possible, and the specific effects are the same as those described above, and are not described here again.
As shown in fig. 1, further, each hole unit 311 includes at least one through hole 312, the distribution of the through holes 312 of the plurality of hole units 311 complies with the constrainer set, and by providing the distribution of the through holes 312 of the plurality of hole units 311 complies with the constrainer set, the effect of stress uniformity is further improved, and the manufacturing is facilitated.
Wherein, the receptacle set may be a receptacle trimaran set or a generalized receptacle set, which is not limited herein; meanwhile, the through holes 312 of the plurality of hole units 311 may be the first few items of the compliance set, and may also be the middle items of the compliance set. For example, five hole units 311 are disposed on the thin film member 30 from left to right, and counted from left to right, the first hole unit 311 includes sixteen through holes 312, the second hole unit 311 includes eight through holes 312, the third hole unit 311 includes four through holes 312, the fourth hole unit 311 includes two through holes 312, the fifth hole unit 311 includes one through hole 312, and the through holes 312 comply with the first five items of the constantan set. Of course, four hole units 311 may be further disposed on the thin film member 30 from left to right, the first hole unit 311 includes sixteen through holes 312, the second hole unit 311 includes eight through holes 312, the third hole unit 311 includes four through holes 312, the fourth hole unit 311 includes two through holes 312, and the through holes 312 obey the middle four items of the constantan set. The thin film member 30 may be provided with other through holes 312 in a similar manner as described above, and will not be described herein.
As shown in fig. 2, in some embodiments, the width of the plurality of hole units 311 arranged along the set direction is gradually increased, and the uniformity of the stress is achieved by gradually increasing the width of the plurality of hole units 311 along the set direction. For example, the direction is set to the left-right direction from left to right, five hole units 311 are provided on the film member 30, and the width of the five hole units 311 gradually increases from left to right.
As shown in fig. 2, in particular, the widths of the plurality of hole units 311 follow a series sequence, achieving the effect of uniform stress on the thin-film member 30.
Alternatively, the sequence of sequences of numbers may be any one of an equal ratio sequence, an equal difference sequence, a difference ratio sequence, and a power sequence. For example, the series is an equal ratio series; or the number sequence is an arithmetic number sequence; or the number sequence is a difference ratio number sequence; or, the number series is a power number series; of course, the number sequence may be other number sequences, which are not described herein again.
As shown in fig. 3 and 4, in some embodiments, the hole portions 31 extend along the setting direction, and the width of the hole portions 31 gradually increases along the setting direction, so that the effect of uniform stress on the film member 30 is achieved by arranging the width of the hole portions 31 to gradually increase along the setting direction. For example, the setting direction is the left-right direction, the hole 31 extends rightward, and the width of the hole 31 gradually increases from left to right.
As shown in fig. 3 and 4, specifically, the hole walls of the hole portion 31 on both sides in the set direction are in arc transition or step transition, and the processing of the hole portion 31 is facilitated by providing the arc transition or step transition. For example, the direction is set to be the left-right direction, the hole walls of the hole portion 31 located at both sides in the left-right direction are front and rear hole walls, the front and rear hole walls are in arc transition, and the width of the hole portion 31 gradually changes in the left-right direction; alternatively, the front and rear hole walls are in step transition, and the width of the hole portion 31 changes in the left-right direction by one step.
As shown in fig. 5 and 6, in some embodiments, the thin film member 30 is configured such that the width of the thin film member 30 gradually decreases along the set direction, and the thin film member 30 is configured such that the width thereof gradually decreases along the set direction, so that the portion of the thin film member 30 away from the anchor point 20 receives less electrostatic force.
As shown in fig. 5 and 6, in particular, the ends of the film member 30 on both sides of the setting direction are in arc transition or step transition. For example, the direction is set to be the left-right direction, the end portions of the film member 30 located at both sides in the left-right direction are front and rear end portions, the front and rear end portions are arc-shaped transitions, and the width of the film member 30 gradually changes in the left-right direction; alternatively, the front and rear end portions are step-transitional, and the width of the film member 30 is changed in the left-right direction by one step.
As shown in fig. 7, in some embodiments, the thin film member 30 includes a mass member 32 and at least two beam members 33, one end of each beam member 33 is connected to the anchor point 20 and the other end is connected to the mass member 32, the width of each beam member 33 gradually decreases along a predetermined direction, and the pressure applied to a single beam member 33 is reduced by providing at least two beam members 33 to share a mass. For example, the set direction is the left-right direction, the number of the beam members 33 is two, the two beam members 33 are distributed in the front-back direction, the left end of each beam member 33 is connected with the anchor point base 20, and the right end of each beam member 33 is connected with the same mass block. Or, the number of the beam members 33 is three, the three beam members 33 are distributed in the front, middle and rear directions, the left end of each beam member 33 is connected with the anchor point seat 20, and the right end of each connecting member is connected to the same mass block. Of course, the number of beam members 33 can be more, such as four, five, etc., and will not be described herein.
As shown in fig. 1 to 8, in some embodiments, the thin film member 30 is configured as a beam or a thin film, and the effect of the micromechanical thin film structure 100 is fully exerted by configuring the thin film member 30 as a beam or a thin film for structure driving and signal sensing. For example, the film member 30 is configured as a beam body, and it is understood that the beam body of the MEMS device is thin and small, and can be regarded as the film member 30 in a long shape, with the direction set as the length direction of the beam body; alternatively, the film member 30 is constructed as a film, and the set direction is the radial direction. The film may be a circular film or a polygonal film, which is not described herein.
As shown in fig. 9 to 11, specifically, the beam body is a single-end clamped beam or a double-end clamped beam, wherein when the beam body is a double-end clamped beam, the setting direction includes a first direction and a second direction opposite to each other, the plurality of effective widths include two groups, one of the two groups of effective widths is arranged along the first direction, the other group is arranged along the second direction, and by setting the first direction and the second direction, the effect of uniform stress on the double-end clamped beam is achieved, and the application range is expanded. For example, the direction is set to a left-right direction, the first direction is a direction from left to right, the second direction is a direction from right to left, one of the two sets of effective widths is gradually reduced from left to right, and the other set of effective widths is gradually reduced from right to left. Of course, the beam body may also be a three-end clamped beam, a four-end clamped beam or more end clamped beams, which are not described herein.
One embodiment of the micromechanical thin-film structure 100 according to the present invention is described below with reference to fig. 1 to 11.
A micromechanical thin-film structure 100 comprising: substrate 10, anchor 20, and membrane element 30.
The material of the substrate 10 is silicon. Anchor pads 20 are provided on the substrate 10. The thin film member 30 is a single-end clamped beam, the left end of the thin film member 30 is connected to the anchor point seat 20, the thin film member 30 is provided with a hole portion 31, the hole portion 31 comprises five hole units 311, the five hole units 311 are arranged from left to right, the first hole unit 311 comprises sixteen through holes 312, the second hole unit 311 comprises eight through holes 312, the third hole unit 311 comprises four through holes 312, the fourth hole unit 311 comprises two through holes 312, the fifth hole unit 311 comprises one through hole 312, and the number and the width of the through holes 312 meet the first five items of the constantan set.
Other configurations and operations of the micromechanical thin-film structure 100 according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description herein, references to the description of the terms "embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (13)
1. A micromechanical membrane structure of a MEMS device, comprising:
a substrate;
the anchor point seat is arranged on the substrate;
the thin film piece is connected with the anchor point seat, the thin film piece is provided with a set direction far away from the anchor point seat and a plurality of effective widths sequentially arranged along the set direction, the effective widths are the cross section widths or the sum of the cross section widths of the thin film piece on a section plane perpendicular to the set direction, and the effective widths are gradually reduced along the set direction.
2. The micromachined membrane structure of a MEMS device of claim 1 wherein a hole portion is provided in said membrane member, said cut plane passing through said hole portion such that at least two cross-sections are formed in said membrane member, said effective width being the sum of the widths of at least two of said cross-sections.
3. The micromachined thin film structure of a MEMS device of claim 2, wherein the aperture portion includes a plurality of aperture cells, the plurality of aperture cells being disposed at intervals along the set direction.
4. The micromechanical membrane structure of a MEMS device according to claim 3, characterized in that each of said hole cells comprises at least one via, the distribution of said vias of a plurality of said hole cells being compliant with a constantan set.
5. The micromachined thin film structure of the MEMS device of claim 3, wherein the width of the plurality of the hole units arranged in the set direction is gradually increased.
6. The micromachined thin film structure of a MEMS device of claim 5, wherein a width of a plurality of the hole units follows a sequence of numbers, the sequence of numbers being any one of an equal ratio number, an equal difference number, a difference ratio number, and a power number.
7. The micromechanical membrane structure of a MEMS device according to claim 2, characterized in that said aperture portion extends along said set direction and the width of said aperture portion gradually increases along said set direction.
8. The micromechanical membrane structure of a MEMS device according to claim 7, characterized in that the hole wall of the hole portion on both sides of the set direction is an arc transition or a step transition.
9. The micromechanical membrane structure of a MEMS device according to claim 1, characterized in that said membrane member is configured such that the width of said membrane member gradually decreases in said set direction.
10. The micromechanical membrane structure of a MEMS device according to claim 9, characterized in that the ends of the membrane on both sides of the set direction are arc-shaped transitions or step-shaped transitions.
11. The micromachined membrane structure of a MEMS device of claim 1 wherein the membrane member includes a mass member and at least two beam members, each beam member having one end connected to the anchor mount and another end connected to the mass member, each beam member having a width that decreases in the set direction.
12. Micromechanical membrane structure of a MEMS device according to one of claims 1 to 11, characterized in that the membrane is configured as a beam or a membrane.
13. The micromachined thin film structure of a MEMS device of claim 12, wherein the beam body is a single-ended clamped beam or a double-ended clamped beam, wherein when the beam body is a double-ended clamped beam, the set direction includes a first direction and a second direction opposite to each other, the plurality of effective widths includes two sets, one of the two sets of effective widths is disposed along the first direction, and the other set is disposed along the second direction.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210061112.2A CN114477068A (en) | 2022-01-19 | 2022-01-19 | Micromechanical membrane structure of MEMS device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210061112.2A CN114477068A (en) | 2022-01-19 | 2022-01-19 | Micromechanical membrane structure of MEMS device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101385392A (en) * | 2006-03-20 | 2009-03-11 | 沃福森微电子股份有限公司 | MEMS device |
| CN101559913A (en) * | 2009-05-15 | 2009-10-21 | 中国科学院上海微系统与信息技术研究所 | Structure for increasing strength and service life of deformable beam and application thereof |
| US20150255407A1 (en) * | 2014-03-07 | 2015-09-10 | Infineon Technologies Ag | System and Method for a Microfabricated Fracture Test Structure |
| CN105321821A (en) * | 2014-07-11 | 2016-02-10 | 中国科学院上海微系统与信息技术研究所 | Stress-adjustable suspension strain film structure and preparation method thereof |
| WO2021242443A1 (en) * | 2020-05-26 | 2021-12-02 | Microsoft Technology Licensing, Llc | Thin film actuator having transversely oriented structural stiffeners to increase actuator stroke |
-
2022
- 2022-01-19 CN CN202210061112.2A patent/CN114477068A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101385392A (en) * | 2006-03-20 | 2009-03-11 | 沃福森微电子股份有限公司 | MEMS device |
| CN101559913A (en) * | 2009-05-15 | 2009-10-21 | 中国科学院上海微系统与信息技术研究所 | Structure for increasing strength and service life of deformable beam and application thereof |
| US20150255407A1 (en) * | 2014-03-07 | 2015-09-10 | Infineon Technologies Ag | System and Method for a Microfabricated Fracture Test Structure |
| CN105321821A (en) * | 2014-07-11 | 2016-02-10 | 中国科学院上海微系统与信息技术研究所 | Stress-adjustable suspension strain film structure and preparation method thereof |
| WO2021242443A1 (en) * | 2020-05-26 | 2021-12-02 | Microsoft Technology Licensing, Llc | Thin film actuator having transversely oriented structural stiffeners to increase actuator stroke |
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