CN114473115A - Welding method for device with dense welding spots - Google Patents
Welding method for device with dense welding spots Download PDFInfo
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- CN114473115A CN114473115A CN202011143623.6A CN202011143623A CN114473115A CN 114473115 A CN114473115 A CN 114473115A CN 202011143623 A CN202011143623 A CN 202011143623A CN 114473115 A CN114473115 A CN 114473115A
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- welding
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- soldering flux
- soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention is suitable for the technical field of welding of devices. The invention discloses a method for welding a device with dense welding spots, which is used for welding the device on a substrate and comprises the steps of arranging soldering flux, wherein the surface of each welding flux of the dense welding spots is provided with the soldering flux which can be heated by microwaves; establishing a microwave welding temperature field, and establishing a temperature field capable of heating soldering flux at the position of the dense welding spots; heating the soldering flux, namely continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot; and a device fixing step, wherein each solder of the dense welding points is melted and forms infiltration connection with the device and the substrate, and the welding is completed after the solder is cooled. Because the microwave welding temperature field only directly heats the soldering flux, other parts are not affected, and even if the welding time is increased to ensure that each welding point of dense welding points can be well welded, devices such as integrated circuits are not affected.
Description
Technical Field
The invention relates to the technical field of welding, in particular to a welding method for a device with dense welding spots.
Background
Integrated circuits are the basis of modern electronic information industry, and as the integration level of integrated circuits is higher and higher, the volume of packages is not obviously increased, but is reduced. This presents challenges to integrated circuit packaging.
The conventional integrated circuit is usually packaged by adopting BGA (Ball Grid Array-Ball pin Grid Array), the conventional BGA package is usually welded by hot air heating, and because the welding mode cannot ensure that each welding spot can form good and stable connection, the welding mode is usually set for a long time to ensure that each welding spot of the Array is melted, although the problem of welding leakage can be solved, the performance of the long-time high-temperature integrated circuit (also called IC chip) is adversely affected, and the phenomenon of damaging the integrated circuit even occurs. How to effectively ensure the welding quality of the high-density welding spot distribution of the integrated circuit and not to influence the integrated circuit.
Disclosure of Invention
The invention mainly solves the technical problem of providing a welding method of a device with dense welding spots, which can avoid the welding quality of a high-dense welding spot device product and reduce the influence on the device in the welding process.
In order to solve the above problems, the present invention provides a device soldering method with dense pads for soldering a device to a substrate, comprising,
setting soldering flux, namely setting the soldering flux which can be heated by microwave on the surface of each solder of the dense soldering points;
establishing a microwave welding temperature field, namely establishing a temperature field capable of heating soldering flux at the position of the dense welding spot;
heating the soldering flux, namely continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot;
and a device fixing step, wherein each solder of the dense welding points is melted and forms infiltration connection with the device and the substrate, and the welding is completed after the solder is cooled.
Furthermore, the quality of the soldering flux on each solder surface of the intensive soldering points in the step of setting the soldering flux is uniform.
Furthermore, the flux on each solder surface of the dense soldering points is uniformly distributed.
The present invention also provides a method of soldering a device having dense spots to a substrate, comprising,
setting a solder, namely setting a solder capable of being heated by microwave on each welding point of the dense welding points, wherein the solder comprises at least one solder ball and soldering flux coated on the surface of the solder ball;
establishing a microwave welding temperature field, namely establishing a temperature field capable of heating soldering flux at the position of the dense welding spot;
heating the soldering flux, namely continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot;
and a device fixing step, wherein each solder of the dense welding points is melted and forms infiltration connection with the device and the substrate, and the welding is completed after the solder is cooled.
The invention discloses a method for welding a device with dense welding spots, which is used for welding the device on a substrate and comprises the steps of setting soldering flux, wherein the surface of each welding flux of the dense welding spots is provided with the soldering flux which can be heated by microwave; establishing a microwave welding temperature field, and establishing a temperature field capable of heating soldering flux at the position of the dense welding spots; heating the soldering flux, namely continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot; and a device fixing step, wherein each solder of the dense welding points is melted and forms infiltration connection with the device and the substrate, and the welding is completed after the solder is cooled. Because the microwave welding temperature field only directly heats the soldering flux, other parts are not affected, and even if the welding time is increased to ensure that each welding point of dense welding points can be well welded, devices such as integrated circuits are not affected.
Drawings
In order to illustrate the embodiments of the invention or the technical solutions in the prior art more clearly, the drawings that are needed in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the description only show some embodiments of the invention and therefore should not be considered as limiting the scope, and for a person skilled in the art, other related drawings can also be obtained from these drawings without inventive effort.
FIG. 1 is a flow chart of an embodiment of a method for welding a device with dense welding spots.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The following claims of the present invention are further detailed in conjunction with the detailed description of the embodiments and the accompanying drawings, and it is to be understood that the described embodiments are only a subset of the embodiments of the present invention, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work shall fall within the protection scope of the present invention.
It should be understood that in the description of the embodiments of the present invention, all directional terms, such as "upper", "lower", "left", "right", "front", "back", etc., indicate orientations or positional relationships based on the orientations, positional relationships, or the orientations or positional relationships that the products of the present invention usually use, which are only used for the convenience of simplifying the description of the present invention, and do not indicate or imply that the devices, elements, or components that are referred to must have specific orientations and specific orientation configurations, and should not be construed as limiting the present invention. For the purpose of explaining only the relative positional relationship between the respective components, the movement, and the like, as shown in the drawings, when the specific posture is changed, the directional indication may be changed accordingly.
Furthermore, the use of ordinal terms such as "first", "second", etc., in the present application is for distinguishing between similar elements and not intended to imply or imply relative importance or the number of technical features indicated. The features defining "first" and "second" may be explicit or implicit in relation to at least one of the technical features. In the description of the present invention, "a plurality" means at least two, i.e., two or more, unless expressly defined otherwise; the meaning of "at least one" is one or both.
In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be understood in a broad sense, and for example, the positional relationship between the components may be fixed relatively, or the components may be physically fixed, or may be detachably connected, or may be integrated into a single structure; the connection can be mechanical connection or electrical signal connection; either directly or indirectly through intervening media or components; the two elements can be communicated with each other or can be mutually interacted, and unless the specification explicitly defines otherwise, the corresponding function or effect cannot be realized in other understanding manners, and the specific meaning of the terms in the invention can be understood by a person skilled in the art according to specific conditions.
The controller and the control circuit that may be involved in the present invention are conventional control techniques or units for those skilled in the art, and the control circuit of the controller may be implemented by those skilled in the art by using conventional techniques, such as simple programming. The power supply also adopts the prior art, and the main technical point of the invention lies in the improvement of mechanical devices, so the invention does not need to describe the specific circuit control relation and circuit connection in detail.
As shown in fig. 1, the present invention provides an embodiment of a method for soldering a device having dense pads.
The method for welding the device with dense welding spots to the substrate comprises,
s1, namely, a soldering flux setting step, wherein the soldering flux which can be heated by microwave is set on the surface of each solder of the dense soldering points;
s2, namely, establishing a microwave welding temperature field, and establishing a temperature field capable of heating soldering flux at the position of the dense welding spot;
s3, heating the soldering flux, namely, continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot;
and step S4, namely, a device fixing step, wherein each solder of the dense welding spots is melted and forms wetting connection with the device and the substrate, and the welding is completed after the solder is cooled.
Specifically, the microwave welding temperature field refers to a microwave space with a uniform distribution and a specific wavelength capable of heating a specific soldering flux. The microwave refers to industrial special frequency 915MHz and 2450MHz, the corresponding wavelength is 32.79cm and 12.26cm respectively, and the power is usually about 500-1000 watts. The flux contains components, such as water molecules, etc., which can be heated by specific microwaves. The step of establishing the microwave welding temperature field and the step of setting the soldering flux can be carried out in no sequence. In other words, the microwave welding temperature field can be established first, and then the flux step is set. The boiling point of the soldering flux is higher than the melting point of the solder balls.
In the embodiment, the step of setting the flux is first described, and a specific soldering method is provided.
The flux which can be heated by microwave is arranged on the surface of each solder of the dense welding spots, and the welding spots are dense and have high precision when an integrated circuit is packaged. And then the position of the integrated circuit corresponding to the welding array is placed on the welding ball array with the flux so that each welding point corresponds to the welding ball. And then the integrated circuit is placed in a microwave welding temperature field to synchronously heat the soldering flux of each specially-made welding point until each corresponding welding ball is melted and forms infiltration connection with the device and the substrate, and the welding is finished after the welding flux is cooled.
Because the microwave welding temperature field only directly heats the soldering flux, other parts are not affected, and even if the welding time is increased to ensure that each welding point of dense welding points can be well welded, devices such as integrated circuits are not affected. Meanwhile, as the welding is carried out by adopting the wave micro heating, physical contact is not needed, the limitation on the distribution density and the precision of welding points is small, and the density of the welding points which can be welded depends on the welding flux theoretically.
In order to better ensure that each solder can be melted synchronously, the flux quality on each solder surface of the dense welding spots in the flux setting step can be uniform. The flux on the surface of each solder of the dense solder joint is uniformly distributed, and the flux is also used for ensuring that each solder is synchronously melted and ensuring that other fluxes can be synchronously completed after one solder in the solder joint array is melted.
The invention provides another embodiment of a welding method for a device with dense welding spots.
A method for bonding a device having dense solder joints to a substrate, comprising,
setting a solder, namely setting a solder capable of being heated by microwave on each welding point of the dense welding points, wherein the solder comprises at least one solder ball and soldering flux coated on the surface of the solder ball;
establishing a microwave welding temperature field, namely establishing a temperature field capable of heating soldering flux at the position of the dense welding spot;
heating the soldering flux, namely continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot;
and a device fixing step, wherein each solder of the dense welding points is melted and forms infiltration connection with the device and the substrate, and the welding is completed after the solder is cooled.
Specifically, the microwave welding temperature field refers to a microwave space with a uniform distribution and a specific wavelength capable of heating a specific soldering flux. The flux contains components, such as water molecules, etc., which can be heated by specific microwaves. The step of establishing the microwave welding temperature field and the step of arranging the solder are not required to be in sequence. . In other words, the microwave welding temperature field can be established first, then the welding flux step is set, and other steps are not changed. The solder in the embodiment contains at least one solder ball and a soldering flux capable of being heated by microwave, and the boiling point of the soldering flux is higher than the melting point of the solder ball.
In the embodiment, the step of setting the flux is first described, and the soldering method is specific.
The welding points are dense and the precision is high when the welding points are dense and each welding point can be heated by microwave, for example, when an integrated circuit is packaged. And then the position of the integrated circuit corresponding to the welding array is placed on the welding material, so that each welding point corresponds to the welding ball. And then the integrated circuit is placed in a microwave welding temperature field to synchronously heat the soldering flux contained in the welding flux of each specially-made welding point until each corresponding welding ball is melted and forms infiltration connection with the device and the substrate, and the welding flux is cooled to finish welding.
Because the microwave welding temperature field only directly heats the soldering flux, other parts are not affected, and even if the welding time is increased to ensure that each welding point of dense welding points can be well welded, devices such as integrated circuits are not affected. Meanwhile, wave micro-heating welding does not need physical contact, the limitation on the distribution density and precision of welding spots is small, and theoretically, the density of the weldable welding spots depends on welding fluxes.
In order to better ensure that each solder can be melted synchronously, the flux quality on each solder surface of the dense welding spots in the flux setting step can be uniform. The flux on the surface of each solder of the dense solder joint is uniformly distributed, and the flux is also used for ensuring that each solder is synchronously melted and ensuring that other fluxes can be synchronously completed after one solder in the solder joint array is melted.
Because the microwave welding temperature field only directly heats the soldering flux, other parts are not affected, and even if welding time is increased to ensure that each welding point of dense welding points can form good welding, devices such as integrated circuits are not affected.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: it is to be understood that modifications may be made to the above-described arrangements in the embodiments or equivalents may be substituted for some of the features of the embodiments without departing from the spirit or scope of the present invention.
Claims (4)
1. A method of soldering a device having dense spots to a substrate, comprising,
setting soldering flux, namely setting the soldering flux which can be heated by microwave on the surface of each solder of the dense soldering points;
establishing a microwave welding temperature field, namely establishing a temperature field capable of heating soldering flux at the position of the dense welding spot;
heating the soldering flux, namely continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot;
and a device fixing step, wherein each solder of the dense welding points is melted and forms infiltration connection with the device and the substrate, and the welding is completed after the solder is cooled.
2. The method of soldering a device having dense solder joints of claim 1, wherein: the quality of the soldering flux on the surface of each solder of the intensive soldering points in the step of setting the soldering flux is uniform.
3. The method for soldering a device having dense solder joints according to claim 1 or 2, wherein: and the flux on each solder surface of the dense welding spots is uniformly distributed.
4. A method for bonding a device having dense spots to a substrate, comprising,
setting a solder, namely setting a solder capable of being heated by microwave on each welding point of the dense welding points, wherein the solder comprises at least one solder ball and soldering flux coated on the surface of the solder ball;
establishing a microwave welding temperature field, namely establishing a temperature field capable of heating soldering flux at the position of the dense welding spot;
heating the soldering flux, namely continuously heating the soldering flux on the surface of the welding spot welding material by utilizing a microwave welding temperature field until each welding material of the intensive welding spot is molten, wherein the boiling point of the soldering flux is higher than the melting point of the welding material of the welding spot;
and a device fixing step, wherein each solder of the dense welding points is melted and forms infiltration connection with the device and the substrate, and the welding is completed after the solder is cooled.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011143623.6A CN114473115A (en) | 2020-10-23 | 2020-10-23 | Welding method for device with dense welding spots |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011143623.6A CN114473115A (en) | 2020-10-23 | 2020-10-23 | Welding method for device with dense welding spots |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57132334A (en) * | 1981-02-06 | 1982-08-16 | Mitsubishi Electric Corp | Soldering method |
| CN1830609A (en) * | 2005-03-09 | 2006-09-13 | 株式会社电装 | Manufacturing method, brazing apparatus and metal article |
| CN102136436A (en) * | 2010-12-17 | 2011-07-27 | 无锡中微高科电子有限公司 | Welding column welding method for integrated circuit package |
| JP2013105809A (en) * | 2011-11-11 | 2013-05-30 | Fujitsu Ltd | Semiconductor device and manufacturing method of the same |
| US20150028021A1 (en) * | 2012-03-28 | 2015-01-29 | Alstom Technology Ltd | Method for processing a modular hybrid component |
-
2020
- 2020-10-23 CN CN202011143623.6A patent/CN114473115A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57132334A (en) * | 1981-02-06 | 1982-08-16 | Mitsubishi Electric Corp | Soldering method |
| CN1830609A (en) * | 2005-03-09 | 2006-09-13 | 株式会社电装 | Manufacturing method, brazing apparatus and metal article |
| CN102136436A (en) * | 2010-12-17 | 2011-07-27 | 无锡中微高科电子有限公司 | Welding column welding method for integrated circuit package |
| JP2013105809A (en) * | 2011-11-11 | 2013-05-30 | Fujitsu Ltd | Semiconductor device and manufacturing method of the same |
| US20150028021A1 (en) * | 2012-03-28 | 2015-01-29 | Alstom Technology Ltd | Method for processing a modular hybrid component |
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