CN114458890A

CN114458890A - Heat dissipation support and electronic equipment

Info

Publication number: CN114458890A
Application number: CN202210123450.4A
Authority: CN
Inventors: 马昌明; 罗冲
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2022-02-09
Filing date: 2022-02-09
Publication date: 2022-05-10

Abstract

The application discloses heat dissipation support and electronic equipment belongs to electronic equipment accessory field. The heat dissipation bracket comprises a body, a heat conduction assembly and a clamping piece; the heat dissipation bracket comprises a body, a heat conduction assembly and a clamping piece; the heat conduction assembly is arranged on the body, one side of the heat conduction assembly is connected with the clamping piece, and the clamping piece is used for driving the heat conduction assembly to move; under the condition that the equipment host is placed on the heat dissipation bracket, the clamping piece and the body are in a first relative position, the clamping piece clamps the equipment host, and the heat conduction assembly is in an unfolded state; under the condition that the equipment host is far away from the heat dissipation bracket, the clamping piece and the body are in a second relative position, and the heat conduction assembly is in a folded state or an overlapped state; wherein, along being perpendicular to the direction of body, the projection that heat conduction subassembly is in the expansion state is greater than the projection that heat conduction subassembly is in folded condition or overlapping state.

Description

Heat dissipation support and electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment accessories, and particularly relates to a heat dissipation support and electronic equipment.

Background

With the improvement of the life quality of people, the mobile phone, the tablet and other devices occupy most of the daily life time of people, and are not only used as simple communication tools, but also more used as media tools for playing videos. In order to improve the comfort of users who watch videos by utilizing the equipment, a heat dissipation support gradually appears in the field of equipment accessories. The heat dissipation support can support equipment, liberates user's both hands, makes the light comfortable video of watching of user, can dispel the heat to equipment simultaneously, avoids the equipment operation in-process to appear overheated, the phenomenon of scalding excessively.

However, the existing heat dissipation support is generally of a fixed structure and cannot be compatible with devices with different models and sizes, so that when a user changes the devices for use, the heat dissipation support needs to be changed synchronously, operation is troublesome, and user experience is greatly reduced.

Disclosure of Invention

The embodiment of the application aims to provide a heat dissipation support and electronic equipment, and the problem that the existing heat dissipation support cannot meet the heat dissipation requirements of equipment with different sizes can be solved.

In a first aspect, an embodiment of the present application provides a heat dissipation bracket, where the heat dissipation bracket includes a body, a heat conduction assembly, and a clamping member; the heat conduction assembly is arranged on the body, one side of the heat conduction assembly is connected with the clamping piece, and the clamping piece is used for driving the heat conduction assembly to move; under the condition that the equipment host is placed on the heat dissipation bracket, the clamping piece and the body are in a first relative position, the clamping piece clamps the equipment host, and the heat conduction assembly is in an unfolded state; under the condition that the equipment host is far away from the heat dissipation bracket, the clamping piece and the body are in a second relative position, and the heat conduction assembly is in a folded state or an overlapped state; wherein, along being perpendicular to the direction of body, the projection that heat conduction subassembly is in the expansion state is greater than the projection that heat conduction subassembly is in folded condition or overlapping state.

Optionally, the heat conducting assembly includes at least two heat conducting plates, and at least two heat conducting plates are sequentially hinged or slidably connected.

Optionally, at least two heat conducting plates are hinged in sequence; under the condition that the clamping piece and the body are in a first relative position, the heat conducting plate rotates to a position parallel to the surface of the body; under the condition that the clamping piece and the body are in a second relative position, the heat conducting plate rotates to a position inclined to the surface of the body.

Optionally, the at least two heat-conducting plates comprise a first heat-conducting plate and a second heat-conducting plate, and the first heat-conducting plate and the second heat-conducting plate are connected in a sliding manner; under the condition that the clamping piece and the body are located at a first relative position, the first heat-conducting plate slides to a position flush with one side edge of the second heat-conducting plate; under the condition that the clamping piece and the body are located at a second relative position, the first heat-conducting plate slides to a position flush with the two side edges of the second heat-conducting plate.

Optionally, the clamping member includes a first clamping member and a second clamping member, and both the first clamping member and the second clamping member are movably connected to the body.

Optionally, the number of the heat conduction assemblies is two, one of the two heat conduction assemblies is connected with the first clamping piece, and the other heat conduction assembly is connected with the second clamping piece.

Optionally, the heat dissipation bracket further comprises an elastic member, and the elastic member is connected between the two heat conduction assemblies.

Optionally, the clamping member comprises a pressing block and a telescopic rod; one end of the telescopic rod is fixedly connected with the pressing block, and the other end of the telescopic rod is fixedly connected with the body; the heat conduction assembly is connected with the pressing block, and the pressing block is used for clamping the equipment host.

Optionally, the heat dissipation bracket further comprises a heat dissipation fan and a cooling fin; the body is close to heat-conducting component's surface has seted up the dead slot, be provided with in the dead slot radiator fan, the refrigeration piece lid closes the dead slot, the cold junction orientation of refrigeration piece heat-conducting component.

In a second aspect, an embodiment of the present application provides an electronic device, which includes a device host and the heat dissipation bracket of any one of the foregoing embodiments.

In this application embodiment, based on the motion of the relative body of holder and the change of heat-conducting component self state, can make the not unidimensional equipment host computer of heat dissipation support centre gripping and dispel the heat to it, satisfy the heat dissipation demand of the not unidimensional equipment host computer, simultaneously when the user need not use the heat dissipation support, through the relative position who changes holder and body, can reduce the holistic occupation space of heat dissipation support, be convenient for accomodate and deposit or the user hand-carries.

Drawings

Fig. 1 is a schematic view of a heat dissipation bracket without a device host in an embodiment of the present application;

FIG. 2 is a schematic diagram of a heat dissipation bracket after being placed on a device host according to an embodiment of the present application;

FIG. 3 is a top view of a thermally conductive assembly in a first state in an embodiment of the present application;

FIG. 4 is a schematic view of a heat conducting assembly hinged to a clamping member according to an embodiment of the present application;

fig. 5 is an operation diagram of a heat dissipation bracket placing device host in an embodiment of the present application.

Description of the reference numerals

10-a body, 11-a first clamping piece, 12-a second clamping piece, 20-a heat conducting plate, 21-an elastic piece, 31-a pressing block, 32-a telescopic rod, 33-a spring, 34-an anti-slip pad, 41-a cooling fan, 42-a refrigerating piece, 45-a heat conducting layer and 50-an equipment host.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

A heat dissipation bracket and an electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 5, the heat dissipation bracket includes a body 10, a heat conductive assembly, and a clamping member; the heat conducting assembly is arranged on the body 10, one side of the heat conducting assembly is connected with the clamping piece, and the clamping piece is used for driving the heat conducting assembly to move; under the condition that the equipment host 50 is placed on the heat dissipation bracket, the clamping piece and the body 10 are at a first relative position, the clamping piece clamps the equipment host 50, and the heat conduction assembly is in an unfolded state; under the condition that the equipment host 50 is far away from the heat dissipation bracket, the clamping piece and the body 10 are in a second relative position, and the heat conduction assembly is in a folded state or an overlapped state; wherein, along being perpendicular to the direction of body, the projection that heat conduction subassembly is in the expansion state is greater than the projection that heat conduction subassembly is in folded condition or overlapping state.

Specifically, the body 10 may be made of aluminum alloy, and has good rigidity, light weight and portability. The clamping members are connected to opposite sides of the body 10 for clamping the apparatus main body 50. The clamping piece and the body 10 are movably connected, and can move relative to the body 10, wherein the clamping piece on one side of the body 10 can be arranged to be in a movable connection structure, and the clamping pieces on two sides of the body 10 can also be arranged to be in a movable connection structure, so that the embodiment is not limited. The present embodiment refers to the clamp movably connected to the body 10 as a movable clamp, and the subsequent embodiments are similar. The movable connection between the movable clamping piece and the body 10 can change the relative position between the movable clamping piece and the body 10, so as to change the distance between the two clamping pieces, widen or narrow the distance, and clamp the device hosts 50 with different sizes.

The heat conducting component is made of heat conducting materials, and can absorb heat generated in the operation process of the equipment main machine 50 and reduce the operation temperature of the equipment main machine 50. The heat conducting assembly is disposed above the body 10 and supported by the body 10. The heat conduction assembly has freedom degree, can move relatively under the action of external force, and changes the state and the volume of the heat conduction assembly, such as structures of a telescopic plate, a drawing plate, a chain plate and the like. One side of the heat conduction assembly is connected with the clamping piece, and the heat conduction assembly is driven to move along the surface of the body 10 through the movement of the clamping piece relative to the body 10. Wherein, the heat conduction assembly is connected with the movable clamping piece. The movable clamping piece moves relative to the body 10 to drive the heat conducting assembly to move along the surface of the body 10. The other side of the heat conducting assembly can be freely placed on the body 10, and can also be connected with the body 10, and the heat conducting assembly can be in an unfolding state or a folding state or an overlapping state only by meeting the requirement that the heat conducting assembly can move under the driving of the movable clamping piece. Under the condition that the device host 50 is placed on the heat dissipation bracket, the clamping piece moves to a position which is at a first relative position with the body 10, the device host 50 is stably clamped on the heat dissipation bracket, at the moment, the heat conduction assembly is in an unfolded state, and the contact area between the heat conduction assembly and the surface of the body 10 is the largest. With the device main unit 50 away from the heat dissipation bracket, the clamping member moves to a second relative position with respect to the main body 10, and the heat conduction assembly is in a folded or overlapped state. In the folded state, the heat conduction assembly inclines relative to the heat conduction assembly to form an inclination angle with the surface of the body 10; in the stacked state, the heat-conducting members themselves are in a stacked relationship or in the same plane, parallel to the surface of the body 10. No matter the heat conduction assembly is in the folded state or the overlapped state, the space of the surface of the body 10 occupied by the heat conduction assembly is small, so that the whole volume of the heat dissipation support is small. Fig. 1 shows a case where the device main unit 50 is away from the heat dissipation support, the holder moves to a second relative position with respect to the body 10, and the heat conduction assembly is in a folded state or an overlapped state, and fig. 2 shows a case where the device main unit 50 is placed on the heat dissipation support, the holder moves to a first relative position with respect to the body 10, and the heat conduction assembly is in an unfolded state. Along the direction perpendicular to the body 10, the projection of the heat conducting assembly in the unfolded state is larger than the projection of the heat conducting assembly in the folded state or the overlapped state, that is, the volume of the heat dissipating bracket is larger than the volume of the heat dissipating bracket in the idle state when the heat dissipating bracket is used for dissipating heat of the device host 50.

When the device host 50 is placed on the heat dissipation support and the heat dissipation support is used for dissipating heat of the device host 50, the device host 50 is placed on the surface of the heat conduction assembly, the two sides of the device host 50 are clamped through the clamping pieces, and the device host is fixed on the heat dissipation support. The heat conducting component is in the unfolded state to dissipate heat of the device host 50, and the contact area between the heat conducting component and the surface of the body 10 is large, so that the heat dissipation effect of the device host 50 is good. It should be noted that the total length of the heat conducting assembly after being unfolded is greater than the total length of the body 10, which refers to the linear distance between the clamping members at the two sides of the body 10. Since the overall length of the heat conductive member after being unfolded is long, the heat conductive member extends out of the body 10, thereby resulting in a large overall volume of the heat dissipating bracket. And when heat-conducting component is in fold condition or overlap state, the volume is less, and its total length is not more than the total length of body 10, consequently can not extend body 10 to make the whole volume of heat dissipation support less, occupation space is less, is convenient for accomodate and deposits or the user carries with oneself.

According to the heat dissipation bracket provided by the embodiment of the application, the heat conduction assembly is driven to move along the surface of the body 10 through the clamping piece, when the clamping piece moves to a position which is opposite to the body 10 in a first position, the equipment host 50 is clamped on the heat dissipation bracket by the clamping piece, and under the condition that the heat conduction assembly is in an unfolded state, the heat conduction assembly dissipates heat to the equipment host 50, at the moment, the contact area between the heat conduction assembly and the body 10 is large, and the heat dissipation effect on the equipment host 50 is good; when the clamping piece moves to a second relative position with the body 10 and the heat conducting assembly is in a folded state or an overlapped state, the volume of the heat conducting assembly is small, the overall occupied space of the heat dissipation support is small, and the heat dissipation support is convenient for a user to carry. Based on the motion of the clamping piece relative to the body 10 and the change of the self state of the heat conducting component, the heat dissipation support can clamp the equipment hosts 50 with different sizes and dissipate heat of the equipment hosts, the equipment hosts meet the heat dissipation requirements of the equipment hosts 50 with different sizes, and meanwhile, when a user does not need to use the heat dissipation support, the relative position of the clamping piece and the body 10 is changed, the overall occupied space of the heat dissipation support can be reduced, and the heat dissipation support is convenient to store and carry or is carried about by the user.

Optionally, the heat conducting assembly comprises at least two heat conducting plates 20, and at least two heat conducting plates 20 are hinged or slidably connected in sequence.

Specifically, the heat conducting assembly is formed by connecting at least two heat conducting plates 20, and the more the heat conducting plates 20 are, the greater the degree of freedom of the heat conducting assembly is, and the better the range and the capability of the state change of the heat conducting assembly are. The heat conducting plate 20 may be made of any one or more of heat conducting materials such as heat conducting silicone, heat conducting rubber, and heat conducting silicone grease, and may also be made of heat conducting metal. Preferably, the heat conducting plate 20 of this embodiment is a metal plate, and the surface of the metal plate is relatively flat and smooth, so that the heat conducting plate can be well attached to the device host 50, and the adjustment of the self state of the heat conducting plate can be facilitated. At least two heat-conducting plates 20 are sequentially hinged or connected in a sliding manner to form an integral heat-conducting assembly, wherein the heat-conducting plates 20 at the edge positions are connected with the movable clamping piece together and can move under the driving of the movable clamping piece. Because the heat conducting plates 20 are sequentially hinged or connected in a sliding manner, the other heat conducting plates 20 move by sliding or rotating with each other under the driving of the heat conducting plates 20 at the edge positions, so that the state of the heat conducting assembly is changed.

Alternatively, with reference to fig. 1 and 2, at least two of said heat-conducting plates 20 are hinged in sequence; under the condition that the clamping piece and the body 10 are in a first relative position, the heat conducting plate 20 rotates to a position parallel to the surface of the body 10; with the clamp in a second relative position to the body 10, the heat-conducting plate 20 rotates to a position inclined to the surface of the body 10.

Specifically, two or more heat conducting plates 20 are sequentially hinged, as shown in fig. 2, when the clamping member moves to a first relative position with the body 10, the heat conducting plates 20 rotate to a position parallel to the surface of the body 10 and are in an unfolded state, at this time, the two or more heat conducting plates 20 form a flat plate structure parallel to the surface of the body 10, and the heat conducting plate 20 right above the body 10 is attached to the surface of the body 10, so that the device host 50 can be placed on the heat conducting plates 20 in this state, and heat dissipation is performed in the clamping state of the clamping member. As shown in fig. 1, when the clamping member moves to a second relative position with the body 10, the heat conducting plate 20 rotates to a position inclined with the surface of the body 10 to assume a folded state, at this time, the end portions of the heat conducting plates 20 hinged to each other abut against the surface of the body 10, the inclination angle of the heat conducting plate 20 with respect to the body 10 is determined according to the number and size of the heat conducting plates 20, and if the number of the heat conducting plates 20 is larger and the size is larger, the inclination angle with respect to the body 10 is larger, and the specific number and size of the heat conducting plates 20 are not limited in this embodiment.

Optionally, the at least two heat-conducting plates 20 comprise a first heat-conducting plate and a second heat-conducting plate, the first heat-conducting plate and the second heat-conducting plate being slidably connected; the holder with under the condition that body 10 is in first relative position, first heat-conducting plate slide to with the position of a side edge parallel and level of second heat-conducting plate the holder with under the condition that body 10 is in the second relative position, first heat-conducting plate slide to with the position of the equal parallel and level of both sides edge of second heat-conducting plate.

Specifically, the heat-conducting plate 20 comprises a first heat-conducting plate and a second heat-conducting plate, which are slidably connected. The sliding connection can be telescopic sliding connection or pull-out sliding connection. Under telescopic sliding connection's the condition, the marginal sliding connection of one side of first heat-conducting plate and second heat-conducting plate realizes the relative slip of the two along this edge, moves to the condition that is in first relative position with body 10 at the centre gripping spare under, and first heat-conducting plate and second heat-conducting plate are in similar "Z" style of calligraphy structure, and first heat-conducting plate and second heat-conducting plate all can be guaranteed on the coplanar to this slip mode, the better laminating equipment host computer 50 of being convenient for. Under the condition of pull formula sliding connection, the equal sliding connection in both sides edge of first heat-conducting plate and second heat-conducting plate, realize the relative slip of the two along both sides edge, be equivalent to the drawer structure, move to being in under the condition of first relative position with body 10 at the holder, first heat-conducting plate and second heat-conducting plate are equivalent to the state that the drawer pulled open promptly, move to being in under the condition of second relative position with body 10 at the holder, first heat-conducting plate and second heat-conducting plate are equivalent to the state that the drawer closed promptly, the heat conduction area that first heat-conducting plate and second heat-conducting plate can be guaranteed to this slip mode is great, promote the radiating effect. The embodiment is not limited to the specific sliding connection manner of the first heat conducting plate and the second heat conducting plate.

Under the condition that the clamping pieces move to be in the first relative position with the body 10, the first heat-conducting plate slides to the position which is flush with one side edge of the second heat-conducting plate, at the moment, the total length of the first heat-conducting plate and the second heat-conducting plate is the longest, the heat dissipation can be carried out on the equipment main frame 50, and the total length refers to the linear distance between the clamping pieces on the two sides of the body 10. Under the condition that the clamping piece moves to be in the second relative position with the body 10, the first heat-conducting plate slides to the position which is flush with the two side edges of the second heat-conducting plate, the total length of the first heat-conducting plate and the second heat-conducting plate is minimum at the moment, and the heat-radiating support is convenient to store or carry.

Optionally, referring to fig. 2, the clamping member includes a first clamping member 11 and a second clamping member 12, and both the first clamping member 11 and the second clamping member 12 are movably connected to the body 10.

Particularly, the holder includes first holder 11 and second holder 12, and first holder 11 and second holder 12 all with body 10 swing joint to can follow the both sides of body 10 and adjust the holder, make the regulation of holder more nimble, also be more convenient for put into the heat dissipation support with equipment host 50.

Optionally, there are two heat conduction assemblies, one of the two heat conduction assemblies is connected to the first clamping member 11, and the other is connected to the second clamping member 12.

Specifically, the number of the heat conduction assemblies is two, one end of one heat conduction assembly is connected to the first clamping member 11, and one end of the other heat conduction assembly is connected to the second clamping member 12, so that the heat conduction assemblies can be adjusted from both sides of the body 10. Under the condition that the clamping piece moves to be located at the first relative position with the body 10, the two heat conduction assemblies radiate the heat of the equipment host 50, the heat radiation area is increased, effective heat radiation of two end positions of the equipment host 50 can be guaranteed, and the heat radiation effect is further improved. Of course, the other ends of the two heat conducting assemblies can be freely placed on the body 10, or can be connected with the body 10, and only the requirement that the two heat conducting assemblies can move under the driving of the first clamping piece 11 and the second clamping piece 12 is met, and the two heat conducting assemblies can be in an unfolding state, a folding state or an overlapping state.

Optionally, referring to fig. 1 to 3, the heat dissipation bracket further includes an elastic member 21, and the elastic member 21 is connected between the two heat conduction assemblies.

Specifically, the heat dissipation bracket further comprises an elastic member 21, and the elastic member 21 is connected between the two heat conduction assemblies to fix the two heat conduction assemblies together. The elastic member 21 may be any one of a spring 33 or a rubber rope, and the two heat conducting assemblies are fixed together by the elastic member 21, in the process of heat dissipation of a large-sized electronic product, the spring 33 receives a large pulling force, and in the process of heat dissipation of a small-sized electronic product, the spring 33 receives a small pulling force, and under the pulling of the spring 33 and the extrusion of the main device 50, the heat conducting assemblies are kept attached to the surface of the main body 10. When the heat dissipation support is not used, the spring 33 drives the two heat conduction assemblies to contract under the action of self elasticity, so that the two heat conduction assemblies are always kept in the contracted state, and the heat dissipation support is always stored in a small-volume state.

Alternatively, referring to fig. 1 to 4, the clamping member includes a pressing block 31 and a telescopic rod 32; one end of the telescopic rod 32 is fixedly connected with the pressing block 31, and the other end of the telescopic rod is fixedly connected with the body 10; the heat conducting assembly is connected with the pressing block 31, and the pressing block 31 is used for clamping the equipment main machine 50.

Specifically, the clamping piece comprises a pressing block 31 and an expansion link 32, one end of the expansion link 32 is fixedly connected with the pressing block 31, the other end of the expansion link is fixedly connected with the body 10, and the position of the pressing block 31 relative to the body 10 is changed through expansion and contraction of the expansion link 32, so that clamping of electronic products with different sizes is achieved. A spring 33 is further connected between the pressing block 31 and the body 10 in this embodiment, and the pressing block 31 can move smoothly relative to the body 10 by the pulling of the spring 33. As shown in fig. 4, the heat conducting assembly may be hinged to the pressing block 31, or may be fixedly connected to the pressing block 31, and the specific connection mode is determined according to the movement property of the heat conducting assembly itself. In order to fix the heat conduction assembly at the corresponding position of the two pressing blocks 31, positioning structures such as a bump or a groove can be arranged on the pressing blocks 31 in advance, and the heat conduction assembly can be directly installed at the corresponding position when being installed. In addition, in order to improve the stability of the two pressing blocks 31 for clamping the device main unit 50, the anti-slip pad 34 may be disposed on the surface of the pressing block 31 close to the device main unit 50, and the anti-slip pad 34 may be made of any one or more anti-slip materials such as rubber, silica gel, resin, foam, and the like, so that the electronic device can be prevented from slipping, and the surface of the device main unit 50 can be prevented from being scratched by the pressing block 31 when the device main unit 50 is placed into the heat dissipation bracket.

Optionally, referring to fig. 1, the heat dissipation bracket further includes a heat dissipation fan 41 and a cooling fin 42; the body 10 is close to the surface of heat-conducting component has seted up the dead slot, be provided with in the dead slot radiator fan 41, refrigeration piece 42 lid closes the dead slot, the cold junction orientation of refrigeration piece 42 the heat-conducting component.

Specifically, the cooling fan 41 and the cooling fins 42 are both used for enhancing the cooling effect of the cooling support, the cooling fins 42 are also called thermoelectric semiconductor cooling assemblies or peltier devices, when the cooling fins 42 are powered on, the cold end face of the cooling fins 42 absorbs heat, and the hot end face of the cooling fins dissipates heat, so that the cooling effect is achieved. The surface of the body 10 close to the heat conducting component is provided with an empty groove, and a heat radiation fan 41 is arranged in the empty groove. The dead slot is the blind slot that does not run through body 10, places radiator fan 41 in this blind slot and bloies the heat dissipation, certainly, for radiator fan 41's change and maintenance, can set up body 10 and be detachable construction, behind split body 10, can change and maintain radiator fan 41. The empty groove is closed to refrigeration piece 42 lid, and the cold junction surface of refrigeration piece 42 and the upper surface parallel and level of body 10 can promote the security when refrigeration piece 42 uses. The cold junction of refrigeration piece 42 is towards heat-conducting component, and after the cold junction absorbed the heat that heat-conducting component transmitted and comes, through the hot junction release, radiator fan 41 was in the below of refrigeration piece 42 hot junction, bloies the heat dissipation to the hot junction to guarantee the normal work of refrigeration piece 42. In addition, in this embodiment, can add heat-conducting layer 45 on the surface of refrigeration piece 42 cold junction, this heat-conducting layer 45 can be the cotton or silica gel piece of graphite bubble, and the cotton heat conduction effect of graphite bubble is better, but life is shorter, and the life of silica gel piece is higher, but the heat conduction effect is lower relatively. Those skilled in the art can freely set up as needed.

The embodiment of the application further provides electronic equipment which comprises an equipment host and the heat dissipation support.

Specifically, electronic equipment includes equipment host and heat dissipation support, and the equipment host can be mobile terminal such as cell-phone, flat board, and the model of heat dissipation support and equipment host matches, and is placing the equipment host on the heat dissipation support and carries out radiating in-process, and the area of contact of the last heat-conducting component of heat dissipation support and equipment host reaches the biggest, and is the best to the radiating effect of equipment host.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A heat dissipation support is characterized by comprising a body, a heat conduction assembly and a clamping piece;

the heat conduction assembly is arranged on the body, one side of the heat conduction assembly is connected with the clamping piece, and the clamping piece is used for driving the heat conduction assembly to move;

under the condition that the equipment host is placed on the heat dissipation bracket, the clamping piece and the body are in a first relative position, the clamping piece clamps the equipment host, and the heat conduction assembly is in an unfolded state;

under the condition that the equipment host is far away from the heat dissipation bracket, the clamping piece and the body are in a second relative position, and the heat conduction assembly is in a folded state or an overlapped state;

wherein, along being perpendicular to the direction of body, the projection that heat conduction subassembly is in the expansion state is greater than the projection that heat conduction subassembly is in folded condition or overlapping state.

2. The heat dissipation bracket of claim 1, wherein the heat conductive assembly comprises at least two heat conductive plates, at least two of which are sequentially hinged or slidably connected.

3. The heat dissipation bracket of claim 2, wherein at least two of the thermally conductive plates are hinged in sequence;

under the condition that the clamping piece and the body are in a first relative position, the heat conducting plate rotates to a position parallel to the surface of the body;

under the condition that the clamping piece and the body are in a second relative position, the heat conducting plate rotates to a position inclined to the surface of the body.

4. The heat dissipation bracket of claim 2, wherein at least two of the thermally conductive plates comprise a first thermally conductive plate and a second thermally conductive plate, the first and second thermally conductive plates being slidably coupled;

under the condition that the clamping piece and the body are located at a first relative position, the first heat-conducting plate slides to a position flush with one side edge of the second heat-conducting plate;

under the condition that the clamping piece and the body are located at a second relative position, the first heat-conducting plate slides to a position flush with the two side edges of the second heat-conducting plate.

5. The heat dissipating bracket of claim 1, wherein the retaining member comprises a first retaining member and a second retaining member, the first retaining member and the second retaining member both being movably connected to the body.

6. The heat dissipating bracket of claim 5, wherein there are two of said heat conducting assemblies, one of said two heat conducting assemblies being connected to said first clamping member and the other of said two heat conducting assemblies being connected to said second clamping member.

7. The heat dissipating bracket of claim 6, further comprising a resilient member connected between two of said heat conducting components.

8. The heat dissipation bracket of claim 5, wherein the clamp comprises a compression block and a telescoping rod;

one end of the telescopic rod is fixedly connected with the pressing block, and the other end of the telescopic rod is fixedly connected with the body;

the heat conduction assembly is connected with the pressing block, and the pressing block is used for clamping the equipment host.

9. The heat dissipation bracket of claim 1, further comprising a heat dissipation fan and a cooling fin;

the body is close to heat-conducting component's surface has seted up the dead slot, be provided with in the dead slot radiator fan, the refrigeration piece lid closes the dead slot, the cold junction orientation of refrigeration piece heat-conducting component.

10. An electronic device comprising a device host and the heat dissipation mount of any of claims 1-9.