CN114454656A

CN114454656A - Shell, preparation method thereof and electronic equipment

Info

Publication number: CN114454656A
Application number: CN202210062185.3A
Authority: CN
Inventors: 黄志勇
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-01-19
Filing date: 2022-01-19
Publication date: 2022-05-10

Abstract

The application provides a shell, a preparation method thereof and electronic equipment; the preparation method of the shell comprises the following steps: preparing and forming a glass fiber plate; and embossing the surface of the glass fiber plate to form texture. The shell preparation method provided by the embodiment of the application forms the texture by impressing on the glass fiber plate, and utilizes the characteristic of high strength of the glass fiber plate, so that the whole thickness of the shell can be thinned, and on the other hand, the texture is directly impressed on the surface of the glass fiber plate, the thickness of the shell cannot be additionally increased, the texture effect of the shell is realized, and the shell preparation method has the characteristics of simple process, low cost and good texture effect.

Description

Shell, preparation method thereof and electronic equipment

Technical Field

The invention relates to the technical field of electronic equipment shells, in particular to a shell, a preparation method of the shell and electronic equipment.

Background

The housing (e.g., battery cover) of the electronic product has been upgraded from visual to tactile, i.e., the previous smooth surface effect is updated to the surface texture touch effect, while the visual effect is maintained.

Common battery covers are classified into metal, glass, ceramic, and plastic. The advantages and disadvantages of various materials are as follows:

(1) metal: the receiving and transmitting of 5G signals are influenced, and the cost is high;

(2) glass: the performance and the effect are good, but the process difficulty is high and the cost is high;

(3) ceramic: the effect is single, and the cost is higher;

(4) plastic cement: the thickness (large) and the effect are limited; the plastic battery cover has a low overall cost, but has a limitation in thickness, and the thickness is 0.5mm or more while satisfying the requirements for strength and appearance, which is very disadvantageous for the light and thin design of electronic devices.

Disclosure of Invention

The present application has been made to solve, or at least partially solve, the above technical problems. According to a first aspect, embodiments of the present application provide a method for preparing a housing, the method for preparing including:

preparing and forming a glass fiber board;

and embossing the surface of the glass fiber plate to form a texture.

According to a second aspect, embodiments of the present application provide a housing, the housing including a glass fiber plate and a texture integrally formed on a surface of the glass fiber plate, the texture having the same material composition as the glass fiber plate, the housing being manufactured by the above manufacturing method.

According to a third aspect, an embodiment of the present application further provides an electronic device, where the electronic device includes a display screen module, a control circuit board, and the above-mentioned housing; the display screen module is matched with the shell to form an accommodating space, the control circuit board is arranged in the accommodating space, and the control circuit board is electrically connected with the display screen module and used for controlling the working state of the display screen module.

The shell preparation method provided by the embodiment of the application forms the texture by impressing on the glass fiber plate, and utilizes the characteristic of high strength of the glass fiber plate, so that the whole thickness of the shell can be thinned, and on the other hand, the texture is directly impressed on the surface of the glass fiber plate, the thickness of the shell cannot be additionally increased, the texture effect of the shell is realized, and the shell preparation method has the characteristics of simple process, low cost and good texture effect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural view of a housing according to the conventional art;

FIG. 2 is a schematic flow chart diagram of one embodiment of a method of making the shell of the present application;

FIG. 3 is a schematic flow diagram of one embodiment of a process for making a formed glass fiber sheet;

FIG. 4 is a schematic structural diagram of a formed solid-effect glass fiber board;

FIG. 5 is a schematic diagram of a glass fiber plate structure with solid color and glass powder combined effect;

FIG. 6 is a schematic structural diagram of an embodiment of the present application for embossing a texture on a surface of a glass fiber sheet;

FIG. 7 is a schematic structural diagram of another embodiment of the present application for embossing a texture on a surface of a glass fiber sheet;

FIG. 8 is a schematic structural view of a shell formed after texture stamping;

FIG. 9 is a schematic diagram of a back structure of an embodiment of the electronic device of the present application;

FIG. 10 is a schematic cross-sectional view of the electronic device at A-A in the embodiment of FIG. 9;

fig. 11 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.

The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a housing in the conventional art, in which a UV resin is additionally coated on a surface of a glass fiber plate 1a to form a texture layer 1b or a texture film 1b is attached to form a composite plate structure, which substantially increases the overall thickness of the housing and does not allow the housing to have a thickness range meeting requirements.

As mentioned above, the composite board scheme in the conventional technology is the lowest compared with other materials, but the thickness is limited, and at present, the thinnest thickness of the composite board can only be 0.5mm (the thickness of the glass fiber plate is 0.25mm, the thickness of the texture layer or the texture film formed by the UV resin is 0.25mm, and the thickness of the bonding glue is not calculated yet).

In addition, the scheme of adopting the glass fiber plate and the texture membrane is adopted, the texture membrane needs to be processed separately, the laminating process is complex, and the cost is high; the scheme of coating the UV resin on the glass fiber board to form the texture layer also has the problems of complex process and high cost.

In view of the above problems, an embodiment of the present application provides a method for manufacturing a housing, please refer to fig. 2, and fig. 2 is a schematic flow chart of an embodiment of the method for manufacturing a housing according to the present application. The housing in the embodiment of the present application is mainly used in an electronic device, and specifically may be a rear case (battery cover), a side frame, a camera decoration, and the like of the electronic device. The preparation method of the shell includes, but is not limited to, the following steps.

Step S100, preparing and forming a glass fiber plate.

Referring to fig. 3, fig. 3 is a schematic flow chart of an embodiment of a method for manufacturing a glass fiber sheet. The method for preparing the glass fiber board may specifically include: and step S110, obtaining the glass fiber and the resin material.

In the composite plate structure in the conventional technical scheme, because the texture membrane (generally a PET sheet) has inflammability, fireproof ink needs to be coated on the outer surface of the composite plate, so that the thickness of the shell is increased, and the process is complex. In comparison, the resin material in this embodiment may be epoxy resin, and the glass fiber and the epoxy resin have good fire-proof properties. Therefore, extra fireproof treatment is not needed, the process is simpler, and extra thickness is not needed.

Alternatively, the resin material may be mixed with toner, and a glass fiber sheet having a solid color may be formed. The color of the toner can be proportioned according to the color forming requirement, and is not limited specifically here. In addition, in some embodiments, the resin material can be mixed with glass powder, glass powder particles are added into the epoxy resin, and the glass powder particles form different light reflection due to irregular anisotropy and anisotropy, so that the overall light reflection effect can be enhanced, and a certain gloss effect can be achieved; meanwhile, the glass powder and the glass fiber are made of the same material, and can be well combined with epoxy resin without special treatment. Here, the resin material may be mixed with toner or glass frit alone, or may be mixed with both toner and glass frit to provide an appearance effect combining solid color and glass frit luster.

In the conventional technical scheme, in order to realize the color effect, the coating or silk-screen printing of the ink layer is generally used, and in comparison, in the embodiment, the toner is directly mixed in the resin material, so that the desired color effect is directly made in the glass fiber board.

With continued reference to fig. 3, the method for preparing a glass fiber sheet further includes step S120: and (3) carrying out pressure polymerization on the glass fiber and the resin material to form the glass fiber board.

In step S120, the resin material used is generally an epoxy resin, and includes epoxidized polyolefin, peracetic acid epoxy resin, epoxy olefin polymer, epichlorohydrin resin, bisphenol a resin, epichlorohydrin-bisphenol a polycondensate, epichlorohydrin resin, and 2, 2-bis (p-hydroxyphenyl) propane diglycidyl ether. In the pressure polymerization process of the glass fiber and the resin material, the pressure of 3-10Mpa can be adopted, and the values of 3Mpa, 4Mpa, 5Mpa, 5.2Mpa, 6Mpa, 8Mpa, 10Mpa and the like can be adopted. The polymerization temperature is generally 120 ℃ to 180 ℃, and specifically may be a value such as 130 ℃, 140 ℃, 145 ℃, 150 ℃, 160 ℃, and 180 ℃, which is not limited herein.

Referring to fig. 4 and 5, fig. 4 is a schematic diagram of a glass fiber board with a solid color effect, and fig. 5 is a schematic diagram of a glass fiber board with a solid color and glass powder combined effect. Optionally, the thickness T of the glass fiber board 100 in this embodiment may range from 0.1mm to 0.3mm, and specifically may be a value such as 0.1mm, 0.11mm, 0.12mm, 0.15mm, 0.2mm, 0.25mm, and 0.3mm, wherein when the strength requirement of the electronic device is satisfied, it is generally about 0.25 mm.

Referring to fig. 2, the method for manufacturing the housing of the present embodiment further includes: and step S200, stamping and forming textures on the surface of the glass fiber plate.

Optionally, in this step, specifically, the glass fiber plate may be punched by using a die having a punched surface with a texture, so as to form the texture on the surface of the glass fiber plate. Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of embossing a texture on a surface of a glass fiber sheet according to the present application. In this embodiment, the texture 10b may be formed on the stamping surface of the mold 10a, and then the molding is directly rubbed onto the surface of the glass fiber sheet 100.

Optionally, referring to fig. 7, fig. 7 is a schematic structural diagram of another embodiment of the present application for forming a texture on a surface of a glass fiber plate by stamping, in this embodiment, the step of forming the texture on the surface of the glass fiber plate may specifically be to provide a film 10c with a texture on a surface of a stamping die 10a, and rub the texture on the film 10c on a surface of the glass fiber plate 100. The method for forming the texture by stamping in the embodiment can repeatedly utilize the diaphragm with the texture, reduce the cost and simultaneously make the texture more refined.

Alternatively, referring to fig. 8, fig. 8 is a schematic structural view of a housing formed after texture stamping, a texture 110 is integrally formed on a surface of the glass fiber sheet 100, and a material composition of the texture 110 is the same as that of the glass fiber sheet 100. The height H of the texture 110 on the surface of the glass fiber board 100 is in the range of 10 μm to 20 μm, and may be 10 μm, 11 μm, 12 μm, 15 μm, 18 μm, 20 μm, 30 μm, or the like. Generally, the texture effect will not be apparent if the texture height is less than 10 μm, and the texture 110 may be used on the housing of the electronic device with a height in the range of 12 μm to 15 μm.

Correspondingly, under the condition that the thickness of the shell in the embodiment meets the strength requirement and the texture effect, the total thickness T0 can be about 0.262mm-0.265mm (the thickness T of the glass fiber plate is 0.25mm, and the height H of the texture 110 is 12 μm-15 μm), and the thickness is obviously thinner compared with the technical scheme of the conventional composite plate.

Compared with the conventional technical scheme, the preparation method of the shell provided by the embodiment of the application has at least the following characteristics. Firstly, the cost is reduced, the board scheme with the same effect is adopted, and the process flow in the conventional technology is as follows: processing a mother film, coating an outer texture layer on a composite board by spraying, rubbing, baking, printing fireproof ink, or: processing a mother film, attaching an external texture film, and printing fireproof ink. In contrast, in the embodiment of the present application, the texture is directly formed on the glass fiber plate by stamping, and the number of processes is reduced to two compared with the conventional technical scheme. Secondly, the thickness is reduced, the thickness of the composite board with the same effect is at least 0.527mm (wherein the thickness of the motherboard is 0.25mm, the thickness of the coating texture layer is 0.25mm, and the thickness of the fireproof ink is 0.027mm), and the total thickness of the shell can be 0.262-0.265 mm, and the thickness is reduced by half. In addition, the color and the flashing effect can be directly formed by adding the toner and the glass powder in the preparation of the glass fiber board, and a coating film or color ink does not need to be additionally attached, so that the process steps are further reduced, and the preparation cost of the shell is further reduced.

Further, an electronic device is provided in an embodiment of the present application, please refer to fig. 9 and fig. 10 together, fig. 9 is a back structure schematic diagram of an embodiment of the electronic device of the present application, and fig. 10 is a cross-sectional structure schematic diagram of the electronic device at a-a in the embodiment of fig. 9. The electronic device in this embodiment includes a display module 30, a housing 10, and a control circuit board 20. The housing 10 may be a rear case of the electronic device, i.e., a battery cover. In addition, in some other embodiments, the housing may also be a camera decoration of an electronic device, and the housing 10 in this embodiment is prepared by the method in the foregoing embodiments.

Optionally, the display screen module 30 and the housing 10 cooperate to form an accommodating space 1000, and the control circuit board 20 is disposed in the accommodating space 1000. The control circuit board 20 is electrically connected to the display screen module 30, and the control circuit board 20 is used for controlling the operating state of the display screen module 30. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein.

Referring to fig. 11, fig. 11 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment), a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is operable to provide power to the entire electronic device 10.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiments, and detailed descriptions thereof will not be provided herein.

In the electronic device in the embodiment, the shell is embossed on the glass fiber board to form the texture, and the high strength of the glass fiber board is utilized, so that the whole thickness of the shell can be thinned, and on the other hand, the texture is directly embossed on the surface of the glass fiber board, the thickness of the shell is not additionally increased, the texture effect of the shell is realized, and the electronic device has the characteristics of simple process, low cost and good texture effect.

The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A method of making a housing, the method comprising:

preparing and forming a glass fiber board;

and embossing the surface of the glass fiber board to form a texture.

2. The method of claim 1, wherein the step of embossing the texture on the surface of the glass fiber sheet comprises: and stamping the glass fiber board by using a die with a texture on the stamping surface, and further forming the texture on the surface of the glass fiber board.

3. The method of claim 1, wherein the step of embossing the texture on the surface of the glass fiber sheet comprises: and arranging a diaphragm with textures on the surface of a stamping die, and rubbing the textures on the diaphragm on the surface of the glass fiber board through the stamping die.

4. The method of manufacturing according to claim 1, wherein the step of manufacturing to form a glass fiber sheet comprises: obtaining glass fiber and resin materials, and carrying out pressure polymerization on the glass fiber and the resin materials to form the glass fiber board.

5. The production method according to claim 4, wherein the resin material is mixed with toner.

6. The method according to claim 5, wherein a glass frit is further mixed in the resin material.

7. The method of any one of claims 1-6, wherein the fiberglass plate has a thickness in the range of 0.1mm to 0.3 mm.

8. The method of claim 7, wherein the glass fiber board surface has a grain height in the range of 10 μm to 20 μm.

9. A casing comprising a glass fiber sheet and a texture integrally formed on a surface of the glass fiber sheet, the texture having the same material composition as the glass fiber sheet, wherein the casing is produced by the production method as set forth in any one of claims 1 to 8.

10. An electronic device, comprising a display screen module, a control circuit board, and the housing of claim 9; the display screen module is matched with the shell to form an accommodating space, the control circuit board is arranged in the accommodating space, and the control circuit board is electrically connected with the display screen module and used for controlling the working state of the display screen module.