CN114449832A

CN114449832A - Communication equipment

Info

Publication number: CN114449832A
Application number: CN202011228940.8A
Authority: CN
Inventors: 李晓东; 林沛庆; 邹恒龙
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-11-06
Filing date: 2020-11-06
Publication date: 2022-05-06
Anticipated expiration: 2040-11-06
Also published as: CN114449832B

Abstract

The embodiment of the application provides a communication device, through setting up heat dissipation area and mobilizable first heat-conducting component in the quick-witted incasement, when the veneer was inserted to quick-witted incasement, first heat-conducting component moved to the second position from the first position automatically under the effect of veneer, first heat-conducting component one side and the second heat-conducting component thermal contact that is located the veneer, first heat-conducting component opposite side and heat dissipation area thermal contact, thereby make the heat transfer that the heat source sent on the veneer to second heat-conducting component, and realize the heat exchange heat dissipation through first heat-conducting component and heat dissipation area contact. When the single plate is pulled out of the case, the driving piece automatically drives the first heat conduction part to move and restore to the first position, so that the single plate can be conveniently inserted into the case again.

Description

Communication equipment

Technical Field

The embodiment of the application relates to the technical field of communication, in particular to communication equipment.

Background

The electronic communication equipment is composed of electronic devices such as an integrated circuit, a transistor, an electron tube and the like, and a case of the communication equipment is used as a carrier of various electronic devices to protect the communication equipment. In the use process of communication equipment, a large amount of heat is often generated, and in order to prevent the problems of equipment overheating, failure and the like, the heat dissipation of electronic devices in a case is very important.

At present, communication equipment generally comprises a chassis, a plurality of single boards are arranged in the chassis in parallel, electronic devices can be arranged on the single boards, and the existing single boards are arranged in the chassis in a pluggable manner. Because the temperature of the side case wall is low or an externally hung radiator is arranged in the case, the electronic device on the single plate can be radiated in a side radiating mode, and the case of side radiating exists in the aspect of liquid cooling radiating at present.

However, in the above-mentioned heat dissipation structure, the step of manually pushing the water-cooled wall needs to be performed in the process of inserting and pulling out the veneer, the operation is complex, the maintenance efficiency of the veneer is affected, and the operation and maintenance requirements of the user cannot be met.

Disclosure of Invention

The application provides a communication device, which solves the problems that in the heat dissipation structure of the existing communication device, the single board needs to be manually in thermal contact, complex in operation and low in single board maintenance efficiency in the process of inserting and pulling out the single board.

The communication equipment provided by the embodiment of the application comprises a case and a single board, wherein the single board is arranged in the case in a pluggable manner, and a heat dissipation area is arranged on one side of the case in the plugging direction of the single board; a first heat-conducting component is movably arranged in the case, is positioned on one side of the single board in the plugging direction, and moves towards the direction close to or far away from the single board; the single plate is provided with a second heat-conducting component on one side close to the first heat-conducting component, and the second heat-conducting component is in thermal contact with a heat source arranged on the single plate; the single board is inserted into the chassis, the first heat-conducting component moves from a first position to a second position under the action of the single board, when the first heat-conducting component is located at the second position, one side of the first heat-conducting component is in thermal contact with the second heat-conducting component, and the other side of the first heat-conducting component is in thermal contact with the heat dissipation area; when the single plate is pulled out of the case, the driving part is used for driving the first heat conduction part to move from the second position to the first position.

When the single plate is inserted into the case, the first heat conducting part automatically moves under the action of the single plate and moves from the first position to the second position, and when the single plate moves to the second position, the second heat conducting part is in thermal contact with the first heat conducting part, and the first heat conducting part is in thermal contact with the heat dissipation area, so that heat emitted by a heat source on the single plate is transferred to the second heat conducting part and is subjected to heat exchange heat dissipation with the heat dissipation area through the first heat conducting part. When the single board is pulled out of the case, the driving part can automatically drive the first heat-conducting part to move and restore to the first position due to the pulling-out of the single board, so that the single board can be conveniently inserted into the case again. When the single board is inserted into the chassis, the second heat-conducting component on the single board is in automatic thermal contact with the first heat-conducting component, namely, the single board is in automatic thermal contact with the heat dissipation area; when the single board is pulled out of the case, the first heat-conducting component automatically restores to the original position without influencing the reinsertion and heat dissipation contact of the single board. When the single board is maintained, the single board is directly pulled out and inserted after maintenance without a manual pushing step, the operation is simple, and the maintenance efficiency of the single board is improved; and meanwhile, the risk of burning out of the electronic device caused by forgetting the pushing operation can be avoided.

In a possible implementation manner, the driving member is an elastic member, and the first heat conduction member is disposed on an inner side wall of the chassis through the elastic member; when the single board is pulled out of the case, the first heat-conducting component moves from the second position to the first position through the elastic component. Therefore, the first heat conducting component can move in the direction close to or far away from the veneer through the elastic piece, and when the veneer is pulled out of the case, the first heat conducting component moves from the second position to the first position under the effect of the resilience force of the elastic piece.

In a possible implementation manner, when the first heat conduction member is located at the first position, a part of the first heat conduction member is located within a plugging track of the single plate; when the single plate is inserted into the case, the single plate pushes the first heat-conducting member, so that the first heat-conducting member moves from the first position to the second position, and the elastic member is compressed.

When the single plate is inserted into the case, the single plate pushes the first heat-conducting component located in the plugging track to move towards the direction far away from the single plate, so that the first heat-conducting component moves from the first position to the second position, namely, the first heat-conducting component moves from the inside of the plugging track to the outside of the plugging track and is in thermal contact with the second heat-conducting component, and then the heat of the heat source on the single plate is transferred to the second heat-conducting component, and the second heat-conducting component realizes heat exchange and heat dissipation through the contact of the first heat-conducting component, the elastic heat-conducting component and the heat-conducting substrate with the inner side wall of the case.

When the veneer was extracted outside quick-witted case, the veneer will disappear to first heat-conducting component's motive force, and the resilience force of compressed elastic component self just can drive first heat-conducting component and remove to the primary importance from the second place like this, moves to the plug orbit outside the plug orbit promptly, and when the veneer reinserted quick-witted incasement, can promote first heat-conducting component once more to can not influence the reinsertion of veneer.

In a possible implementation, the heat dissipation device further comprises an elastic heat conduction member, wherein the elastic heat conduction member is located between the first heat conduction member and the heat dissipation area; when the single board is inserted into the chassis, the first heat-conducting member is in thermal contact with the heat dissipation area through the elastic heat-conducting member. On one hand, the first heat conducting component is in thermal contact with the heat dissipation area through the elastic heat conducting component, and therefore the heat dissipation effect can be improved. On the other hand, elasticity heat-conducting component can also play the effect of buffering, and when the veneer inserted quick-witted incasement, elasticity heat-conducting component can play the cushioning effect that removes to the veneer driving force and the elastic component resilience force that first heat-conducting component and second heat-conducting component received, reduces the damage to first heat-conducting component and second heat-conducting component.

In a possible implementation manner, the heat dissipation device further comprises a heat conduction substrate, and the heat conduction substrate is located between the elastic heat conduction component and the heat dissipation area. The heat conduction substrate can improve the heat conduction effect between the elastic heat conduction component and the heat dissipation area, and is favorable for further improving the heat dissipation effect on a heat source.

In one possible implementation manner, the heat dissipation area is formed on an inner side wall of the chassis. The heat dissipation area for dissipating heat of the heat source can be formed by utilizing the larger temperature difference between the inner side wall of the case and the heat source on the single plate, the first heat conduction component can be contacted with the inner side wall of the case, and the area on the inner side wall of the case, which is in thermal contact with the first heat conduction component, is the heat dissipation area.

In a possible implementation manner, the heat dissipation device further includes a heat dissipation member, the heat dissipation member is fixedly disposed on an inner side wall of the chassis, the heat dissipation member forms the heat dissipation area, and the first heat conduction member is disposed on a side of the heat dissipation member close to the single board through the elastic member. The heat dissipation member forms a heat dissipation region, and the heat dissipation effect can be further improved.

In a possible implementation manner, the heat dissipation device further includes a heat dissipation member, the first heat conduction member is fixedly disposed on a side of the heat dissipation member close to the single board, the heat dissipation member is disposed on an inner side wall of the chassis through the elastic member, and the heat dissipation member forms the heat dissipation area. Therefore, the heat dissipation part and the first heat conduction part can move in the direction close to the veneer or far away from the veneer as a whole through the elastic part, the structure is simple, and the assembly is convenient.

In a possible implementation manner, the heat dissipation device further includes a heat dissipation member, the first heat conduction member is fixedly disposed on a side of the heat dissipation member close to the single board, the heat dissipation member is disposed on an inner side wall of the chassis through the elastic member, and the heat dissipation member forms the heat dissipation area;

the heat dissipation device also comprises a trigger assembly, wherein when the first heat conduction component is positioned at the first position, the first heat conduction component is positioned at one side, close to the heat dissipation area, outside the single board plugging track; when the single board is inserted into the chassis, the single board drives the heat dissipation component and the first heat conduction component to move from the first position to the second position through the trigger component, and the elastic component is stretched.

Therefore, when the single board is not inserted into the chassis, the first heat-conducting member is located at the first position, the first heat-conducting member is located at one side of the single board plugging track close to the heat dissipation area, and a certain distance is reserved between the first heat-conducting member and the single board second heat-conducting member. When the single board is inserted into the case, the movement of the single board drives the trigger assembly, the single board drives the first heat-conducting component and the radiating component to move towards the direction close to the single board through the trigger assembly, so that the first heat-conducting component moves to the second position and is in thermal contact with the second heat-conducting component, heat emitted by a heat source on the single board is transferred to the second heat-conducting component, and heat exchange and radiation are realized through the contact of the first heat-conducting component and the radiating component.

When the veneer was extracted outside quick-witted case, the effect of triggering the subassembly to first heat conduction part and radiating part disappears, and the resilience force of stretched elastic component self just can drive first heat conduction part and radiating part and resume to the primary importance from the second place like this, and outside the veneer plug orbit was originally got back to promptly, when the veneer reinserted quick-witted incasement, the subassembly was triggered in the redriving, can not influence reinsertion of veneer.

In a possible implementation manner, the heat dissipation device further includes a rotating member disposed in the chassis, one end of the heat dissipation member is rotatably disposed in the chassis through the rotating member, and when the first heat conduction member is located at the first position, the other end of the heat dissipation member is inclined toward a direction away from the single board; the trigger assembly comprises a connecting rod structure and a fixing piece matched with the connecting rod structure, the connecting rod structure is arranged at the other end of the heat dissipation part, and the fixing piece is fixedly arranged on the single plate; when the single board is inserted into the chassis, the fixing member is matched with the connecting rod structure to drive the heat dissipation member and the first heat conduction member to move from the first position to the second position. When the veneer is inserted into the case, the connecting rod structure is matched with the fixing piece, the other end of the heat dissipation part is pulled to move close to the veneer in the movement process of the veneer, so that the heat dissipation part and the first heat conduction part can be driven to move close to the veneer, and finally when the veneer is inserted into the case, the first heat conduction part moves to the second position and is in thermal contact with the second heat conduction part, so that heat emitted by a heat source on the veneer can be transferred to the second heat conduction part and is in contact with the heat dissipation part through the first heat conduction part to realize heat exchange.

In a possible implementation manner, the connecting rod structure is V-shaped and comprises a first connecting rod part and a second connecting rod part which are connected, a rotating shaft is arranged at the connecting part of the first connecting rod part and the second connecting rod part, and the connecting rod structure is rotatably arranged in the case through the rotating shaft; the first connecting rod part is connected with the heat dissipation part, the end part of the second connecting rod part is provided with a hook structure, and when the single board is inserted into the case, the hook structure is hung on the fixing part.

When the single plate is inserted into the case, the hook structure is hung on the fixing piece, the single plate can drive the second connecting rod part to move along with the hook structure along with the continuous insertion movement of the single plate, meanwhile, the second connecting rod part and the first connecting rod part rotate relative to the rotating shaft, the first connecting rod part moves close to the direction of the single plate, the other ends of the heat dissipation part and the first heat conduction part are driven by the first connecting rod part to move towards the direction close to the single plate, finally, the heat dissipation part and the first heat conduction part are pulled to the second position, and the thermal contact of the first heat conduction part and the second heat conduction part is realized.

In one possible implementation, the trigger assembly comprises an electromagnet located within the second heat-conducting member and a magnetic body located within the first heat-conducting member; when the single board is inserted into the case and the electromagnet is electrified, the electromagnet and the magnetic body are attracted. The attractive force between the electromagnet and the magnetic body can pull the first heat-conducting component to move close to the single plate, so that the first heat-conducting component moves from the first position to the second position, and the first heat-conducting component is in thermal contact with the second heat-conducting component, so that heat emitted by a heat source on the single plate can be transferred to the second heat-conducting component and is in contact with the heat dissipation component through the first heat-conducting component to realize heat exchange.

In a possible implementation manner, the heat dissipation device further includes a heat dissipation member movably disposed in the chassis, the heat dissipation member forms the heat dissipation area, the first heat conduction member is disposed on a side of the heat dissipation member close to the single board, and when the first heat conduction member is located at the first position, the first heat conduction member is located on a side of the single board outside the plugging track close to the heat dissipation area;

when the single board is inserted into the chassis, the single board and the heat dissipation part are respectively connected with the driving part in a matching manner, and the single board drives the heat dissipation part and the first heat conduction part to move from the first position to the second position through the driving part; when inserting the veneer into quick-witted incasement promptly, the veneer can produce the cooperation with the driving piece, and the removal of veneer drives the driving piece to make the driving piece drive heat dissipation part and first heat-conducting component produce the removal that is close to the veneer direction, thereby remove to the second position, make first heat-conducting component and second heat-conducting component contact, realize the heat dissipation to the heat source on the veneer.

When the single plate is pulled out of the case, the single plate acts on the driving piece to drive the heat dissipation piece and the first heat conduction piece to move from the second position to the first position. When the veneer is pulled out to the outside of the case, the veneer is matched with the driving piece, the driving piece can be driven by the reverse movement of the veneer, and then the driving piece drives the first heat-conducting part to move away from the veneer and restore to the first position, so that the veneer can be inserted again.

In a possible implementation manner, the heat dissipation device further includes a rotating member, one end of the heat dissipation member is rotatably disposed in the chassis through the rotating member, and when the first heat conduction member is located at the first position, the other end of the heat dissipation member is inclined toward a direction away from the single plate;

the driving piece comprises a first rack, a gear and a second rack, the first rack is arranged on one side, close to the second heat-conducting part, of the heat dissipation part, the second rack is arranged on one side, close to the first heat-conducting part, of the veneer, and the gear is located on the first rack or the second rack;

when the single plate is inserted into the chassis, the gear is respectively meshed with the first rack and the second rack, and the single plate drives the gear to move along the second rack from one end close to the rotating part to one end far away from the rotating part through the first rack; this gradually reduces the inclination angle between the heat dissipating member and the single plate, that is, the heat dissipating member and the first heat conductive member thereon move closer to the single plate. When the single board is inserted into the case, the heat dissipation part and the first heat conduction part move from the first position to the second position, and the first heat conduction part and the second heat conduction part are in thermal contact, so that heat dissipation of a heat source is realized.

When the single plate is pulled out of the case, the first rack drives the gear to move from one end far away from the rotating part to one end close to the rotating part along the second rack. The reverse motion of veneer can drive the gear through first rack and move on the second rack like this, make the gear from keeping away from the one end that rotates the piece and remove to the one end that is close to the rotation piece, thereby the slope between radiating part and the veneer grow gradually, radiating part and the first heat-conducting component on it take place to keep away from the ascending removal of veneer side promptly, when the veneer was extracted outside the quick-witted case, make radiating part and first heat-conducting component get back to the first position from the second position, so that the reinsertion of veneer.

In a possible implementation manner, the heat-conducting plate further comprises a third heat-conducting member, and the second heat-conducting member is connected with a heat source on the single plate through the third heat-conducting member.

Drawings

Fig. 1 is a schematic structural diagram of a communication device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a single board of a communication device provided in an embodiment of the present application, which is not inserted into a chassis;

fig. 3 is a schematic structural diagram of a communications device according to an embodiment of the present disclosure, in which a single board is inserted into a chassis;

fig. 4 is a schematic structural diagram of a single board of another communication device provided in the embodiment of the present application, which is not inserted into a chassis;

fig. 5 is a schematic structural diagram illustrating that a board of another communication device provided in the embodiment of the present application is inserted into a chassis;

fig. 6 is a schematic structural diagram of another communication device according to an embodiment of the present disclosure, in which a single board is not inserted into a chassis;

fig. 7 is a schematic structural diagram illustrating that a single board of another communication device according to an embodiment of the present disclosure is inserted into a chassis;

fig. 8 is a schematic structural diagram of another communication device according to an embodiment of the present disclosure, in which a single board is not inserted into a chassis;

fig. 9 is a schematic structural diagram illustrating a board of another communication device according to an embodiment of the present disclosure being inserted into a chassis;

FIG. 10 is a schematic structural diagram of a connecting rod structure provided in an embodiment of the present application;

fig. 11 is a schematic structural diagram of another communication device according to an embodiment of the present disclosure, in which a single board is not inserted into a chassis;

fig. 12 is a schematic structural diagram illustrating a board of another communication device according to an embodiment of the present disclosure being inserted into a chassis;

fig. 13 is a schematic structural diagram of another communication device according to an embodiment of the present disclosure, in which a single board is not inserted into a chassis;

fig. 14 is a schematic structural diagram of another communication device according to an embodiment of the present disclosure, in which a single board is inserted into a chassis.

Description of reference numerals:

100-a communication device; 10-a chassis; 11-a first heat-conducting member;

111-a transition surface; 20-single board; 21-a second heat-conducting member;

22-a heat source; 23-a third heat-conducting member; 30-a drive member;

31-a gear; 40-an elastic heat-conducting member; 50-a thermally conductive substrate;

60-a heat-dissipating component; 70-a trigger assembly; 71-a link structure;

711-a first link section; 712-a second link portion; 713-a spindle;

714-hook structure; 72-a fastener; 73-an electromagnet;

74-a magnetic body; 80-a rotating member; 90-fastener.

Detailed Description

The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.

The communication equipment is composed of various electronic devices such as an integrated circuit, an electron tube and the like, a large amount of heat is often generated in the using process, and the heat dissipation of the electronic devices in the communication equipment is very necessary for ensuring the normal work of the communication equipment. Generally, a communication device includes a chassis and a single board, where multiple single boards are arranged in parallel in the chassis, electronic devices are arranged on the single boards, and the single boards can be arranged in the chassis in a pluggable manner. At present, the electronic device is mostly cooled by air, specifically, a fan can be arranged in a case, a plurality of single boards are arranged in the case in parallel, and a gap is left between two adjacent single boards so that airflow can flow through the single boards, thereby performing heat exchange with the electronic device on the single boards, however, the cooling effect of the cooling manner by air is poor, and especially the cooling effect of the large-power-consumption chip devices such as a CPU arranged in the single boards is poor.

In the prior art, a side auxiliary heat dissipation mode is adopted, specifically, a water-cooling wall is arranged in a case, the water-cooling wall is located on one side of a veneer, a heat conducting piece can be arranged on one side, close to the water-cooling wall, of the veneer, the heat conducting piece is in thermal contact with an electronic device on the veneer, after the veneer is completely inserted into the case, the water-cooling wall can be manually pushed to be in contact with the heat conducting piece on the veneer, heat of the electronic device on the veneer is firstly transferred to one side of the veneer through the heat conducting piece, then the heat exchange is carried out with the water-cooling wall, and the heat dissipation of the veneer is realized. When the veneer maintenance is needed, namely the veneer is pulled out, the water-cooled wall is manually pushed, and the veneer is pulled out after being separated from the veneer.

However, in the above-mentioned side auxiliary heat dissipation structure, when the veneer needs to be maintained, the water-cooled wall needs to be pushed manually in the process of inserting and pulling out the veneer, the operation is complicated, and the maintenance efficiency of the veneer is reduced. And there may be instances where water-cooled wall operations are forgotten, with the risk of electronic device burn-out. In addition, when one of the boards needs to be maintained, all the boards need to be powered off, which affects the normal operation of the communication equipment.

Based on the above technical problem, an embodiment of the present application provides a communication device, where a first heat conducting member is movably disposed in a chassis, and a second heat conducting member in thermal contact with a heat source is disposed on a single board, where when the single board is inserted into the chassis, the first heat conducting member automatically moves from a first position to a second position under the action of the single board, and when the single board is located at the second position, the second heat conducting member is in thermal contact with the first heat conducting member, and the first heat conducting member is in thermal contact with a heat dissipation area, so that heat generated by the heat source on the single board is transferred to the second heat conducting member, and heat exchange heat dissipation is performed by the contact between the first heat conducting member and the heat dissipation area. When the single plate is pulled out of the case, the driving piece can automatically drive the first heat-conducting component to move and restore to the first position due to the pulling-out of the single plate, so that the single plate can be conveniently inserted into the case again. When the single board is inserted into the chassis, the second heat-conducting component on the single board is in automatic thermal contact with the first heat-conducting component, namely, the single board is in automatic thermal contact with the heat dissipation area; when the single board is pulled out of the case, the first heat-conducting component automatically restores to the original position without influencing the reinsertion and heat dissipation contact of the single board. When the single board is maintained, the single board is directly pulled out and inserted after maintenance without a manual pushing step, the operation is simple, and the maintenance efficiency of the single board is improved; and meanwhile, the risk of burning out of the electronic device caused by forgetting the pushing operation can be avoided.

The communication device provided by the present application is described in detail below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a communication device 100 according to an embodiment of the present disclosure. Referring to fig. 1, the communication device 100 includes a chassis 10 and a single board 20, where the single board 20 is disposed in the chassis 10 in a pluggable manner, that is, the single board 20 may be inserted into the chassis 10, and the single board 20 may also be pulled out from the chassis 10 to the outside of the chassis 10, where a plugging track and a plugging structure for enabling the single board 20 to be plugged in may be disposed on the chassis 10.

A heat dissipation area S is disposed on one side of the chassis 10 in the plugging direction of the board 20, that is, an area capable of forming a large temperature difference with the heat source 22 on the board 20 is disposed on one side of the chassis 10 in the plugging direction of the board 20, and can exchange heat with heat dissipated by the heat source 22, so as to dissipate heat of the heat source 22 on the board 20. The heat source 22 may be an electronic device, such as a chip, a control board, etc., disposed on the single board 20.

The first heat conducting member 11 is movably disposed in the chassis 10, the first heat conducting member 11 is located on one side of the single board 20 in the inserting and pulling direction, and the first heat conducting member 11 moves toward the direction close to or away from the single board 20, that is, the first heat conducting member 11 can move toward the single board 20 or away from the single board 20. The single plate 20 is provided with a second heat-conducting member 21 on a side close to the first heat-conducting member 11, the second heat-conducting member 21 is in thermal contact with a heat source 22 provided on the single plate 20, and heat generated by the heat source 22 can be transferred to the second heat-conducting member 21. The first heat-conducting member 11 and the second heat-conducting member 21 may be formed of a metal material having a high heat conductivity.

The communication device 100 further includes a driving member 30, when the single board 20 is inserted into the housing 10, the first heat-conducting member 11 is moved from the first position to the second position by the single board 20, that is, the first heat-conducting member 11 is automatically moved from the first position to the second position due to the movement of the single board 20 inserted into the housing 10. Specifically, referring to fig. 2 and fig. 3, taking an example that the first heat conduction member 11 is located in the insertion and extraction track of the single plate 20 when the first heat conduction member 11 is at the first position, when the single plate 20 is inserted into the chassis 10 in the x direction as shown in the figure, the single plate 20 may act on the first heat conduction member 11, for example, push the first heat conduction member 11 to move toward a direction away from the single plate 20, so that the first heat conduction member 11 moves out of the insertion and extraction track of the single plate 20, that is, the first heat conduction member 11 automatically moves from the first position to the second position.

Referring to fig. 1 and 3, when the first heat-conducting member 11 is located at the second position, one side of the first heat-conducting member 11 is in thermal contact with the second heat-conducting member 21, and the other side of the first heat-conducting member 11 is in thermal contact with the heat dissipation area S, that is, the second heat-conducting member 21 is in thermal contact with the heat dissipation area S through the first heat-conducting member 11, so that heat generated by the heat source 22 on the single plate 20 is transferred to the second heat-conducting member 21 located at one side of the single plate 20, and then the second heat-conducting member 21 is in thermal contact with the heat dissipation area S through the first heat-conducting member 11 to perform heat exchange, thereby achieving heat dissipation of the heat source 22 on the single plate 20.

When the single board 20 is pulled out of the chassis 10, the driving member 30 is used to drive the first heat conducting member 11 to move from the second position to the first position, that is, if the single board 20 needs to be maintained, the single board 20 can be pulled out of the chassis 10, and at this time, the driving member 30 can automatically drive the first heat conducting member 11 to return to the original first position from the second position, and the single board 20 is not affected to be maintained and then inserted into the chassis 10 again. Continuing to refer to fig. 2 and fig. 3, taking the first heat conducting member 11 disposed on the inner sidewall of the chassis 10 through the elastic member, and the heat dissipation area S is located on the inner sidewall of the chassis 10 as an example, when the single plate 20 is inserted into the chassis 10, the single plate 20 pushes the first heat conducting member 11 to compress the elastic member, and finally the first heat conducting member 11 is located at the second position, when the single plate 20 is pulled out of the chassis 10, the pushing force of the single plate 20 on the first heat conducting member 11 disappears, and the resilience of the elastic member itself will drive the first heat conducting member 11 to return to the first position from the second position, that is, the first heat conducting member 11 automatically returns to the first position from the second position.

That is, when the single board 20 is inserted into the chassis 10, the first heat conducting member 11 moves under the action of the single board 20, and moves from the first position to the second position, and when the single board moves to the second position, the second heat conducting member 21 thermally contacts with the first heat conducting member 11, and the first heat conducting member 11 thermally contacts with the heat dissipation area S, so as to dissipate heat from the heat source 22 on the single board 20. When the single board 20 is pulled out of the casing 10, the driving member 30 automatically drives the first heat conducting member 11 to move to the first position due to the pulling-out of the single board 20, so that the single board 20 is inserted into the casing 10 again.

Thus, when the single board 20 is inserted into the chassis 10, the second heat-conducting member 21 on the single board 20 is in automatic thermal contact with the first heat-conducting member 11, that is, the single board 20 is in automatic thermal contact with the heat dissipation area S; when the single plate 20 is pulled out of the case 10, the first heat conducting member 11 automatically returns to the original position without affecting the reinsertion and heat dissipation contact of the single plate 20, compared with the existing mode of manually pushing the water-cooled wall, the method has the advantages that when the single plate 20 is maintained, the step of manually pushing is not needed, the single plate 20 is directly pulled out, and the single plate 20 is inserted after maintenance, so that the operation is simple, and the maintenance efficiency of the single plate 20 is improved; and also can avoid the risk of burning out of the heat source 22 such as an electric appliance due to forgetting the pushing operation.

In addition, the movable first heat conduction member 11 and the driving member 30 are disposed at one side of the single plate 20 in the case 10, so as to utilize the space outside the single plate 20 as much as possible to achieve the automatic contact between the single plate 20 and the heat dissipation area S, and the position of the first heat conduction member 11 is restored after the single plate 20 is pulled out, which does not affect the use of the space in the single plate 20, and is helpful to improve the utilization rate of the space in the single plate 20.

A plurality of single boards 20 may be arranged in parallel in the chassis 10, and a heat dissipation gap may be formed between two adjacent single boards 20, so that the heat source 22 on the single board 20 may also dissipate heat in an air cooling heat dissipation manner, thereby further enhancing the heat dissipation effect of the heat source 22.

In addition, each single plate 20 may be provided with a second heat conduction member 21, and the chassis 10 may be provided with a plurality of first heat conduction members 11 and driving members 30, where each first heat conduction member 11 and driving member 30 corresponds to one single plate 20. Therefore, when each single board 20 is inserted, the thermal contact with the heat dissipation area S can be realized, and the single board 20 can not be inserted again after being pulled out, so that a certain single board can be maintained independently without affecting other single boards, and power failure of all single boards is not required when one single board is maintained, which helps to reduce the influence on the operation of the communication device 100 and ensures the stability of the operation of the communication device 100.

In this embodiment, the communication device 100 may further include a third heat conduction member 23, the second heat conduction member 21 is connected to the heat source 22 on the single board 20 through the third heat conduction member 23, so that thermal contact between the second heat conduction member 21 and the heat source 22 can be achieved through the third heat conduction member 23, heat generated by the heat source 22 is transferred to the second heat conduction member 21 on the side of the single board 20 through the third heat conduction member 23, and then the second heat conduction member 21 is in thermal contact with the heat dissipation area S through the first heat conduction member 11, so as to dissipate heat from the heat source 22.

The third heat conducting member 23 may be a heat pipe or a Vapor Chamber (VC) or other heat transfer device.

In the communication device 100 according to the embodiment of the present application, specifically, the driving member 30 may be an elastic member, and the first heat conducting member 11 is disposed on the inner sidewall of the chassis 10 through the elastic member, so that the first heat conducting member 11 can move toward or away from the board 20 through the elastic member. When the single plate 20 is pulled out of the chassis 10, the first heat conducting member 11 moves from the second position to the first position through the elastic member, that is, the first heat conducting member 11 moves from the second position to the first position under the resilience of the elastic member itself.

Referring to fig. 1 to 7, in a communication device 100 according to an embodiment of the present application, when the first heat conducting member 11 is located at the first position, a portion of the first heat conducting member 11 is located in a plugging track of the single board 20.

Specifically, referring to fig. 2, when the single board 20 is not inserted into the chassis 10, the first heat conduction member 11 is located at the first position, a portion of the first heat conduction member 11 is located in the insertion track of the single board 20, and the first heat conduction member 11 is in thermal contact with the heat dissipation area S, so that when the single board 20 is inserted into the chassis 10, the single board 20 pushes the first heat conduction member 11 located in the insertion track, so that the first heat conduction member 11 moves toward a direction away from the single board 20, as shown in fig. 3, so that the first heat conduction member 11 moves from the first position to the second position, that is, moves from the insertion track to the outside of the insertion track and is in thermal contact with the second heat conduction member 21, and meanwhile, the elastic member connected to the first heat conduction member 11 is compressed.

When the veneer 20 is pulled out to the outside of the case 10, the pushing force of the veneer 20 to the first heat conducting member 11 disappears, so that the elastic member itself with the compressed resilience force can drive the first heat conducting member 11 to move from the second position to the first position, namely, move from the outside of the plugging track to the plugging track, and when the veneer 20 is inserted into the case 10 again, the first heat conducting member 11 can be pushed again, thereby not affecting the reinsertion of the veneer 20.

Referring to fig. 1 to 3, the communication device 100 further includes an elastic heat-conducting member 40, the elastic heat-conducting member 40 is located between the first heat-conducting member 11 and the heat dissipation area S, and when the single board 20 is inserted into the chassis 10, the first heat-conducting member 11 is in thermal contact with the heat dissipation area S through the elastic heat-conducting member 40. Because the first heat-conducting member 11 is disposed between the heat dissipation area S and the heat dissipation area S through the elastic member, even if the elastic member is compressed, a certain gap is still formed between the first heat-conducting member 11 and the heat dissipation area S to affect the heat dissipation contact, and the elastic heat-conducting member 40 is disposed between the first heat-conducting member 11 and the heat dissipation area S, so that the first heat-conducting member 11 is in thermal contact with the heat dissipation area S through the elastic heat-conducting member 40, and the heat dissipation effect can be improved. On the other hand, the elastic heat conducting member 40 can also play a role of buffering, and when the single board 20 is inserted into the chassis 10, the elastic heat conducting member 40 can play a role of buffering the movement of the single board pushing force and the elastic member resilience force applied to the first heat conducting member 11 and the second heat conducting member 21, so that the damage to the first heat conducting member 11 and the second heat conducting member 21 is reduced.

The communication device 100 may further include a heat conducting substrate 50, and as shown in fig. 1 to fig. 3, the heat conducting substrate 50 may be located between the elastic heat conducting member 40 and the heat dissipation area S, that is, the first heat conducting member 11 is located on a side of the elastic heat conducting member 40 close to the single board 20, the heat conducting substrate 50 is located between the elastic heat conducting member 40 and the heat dissipation area S, the first heat conducting member 11 is in thermal contact with the elastic heat conducting member 40, the elastic heat conducting member 40 is in thermal contact with the heat conducting substrate 50, and the heat conducting substrate 50 is in thermal contact with the heat dissipation area S.

The heat conducting substrate 50 may be formed of a metal material with a high thermal conductivity, and the heat conducting substrate 50 may improve the heat conducting effect between the elastic heat conducting member 40 and the heat dissipating region S, which may help to further improve the heat dissipating effect of the heat source 22.

As shown in fig. 2 and 3, a transition surface 111 may be provided at an end portion of the first heat-conducting member 11 in the insertion and extraction direction, an insertion opening (not shown) is provided in the casing 10 for insertion of the single plate 20, and the transition surface 111 may be provided at least at an end portion of the first heat-conducting member 11 near the insertion opening, or, as shown in fig. 2, the transition surfaces 111 may be provided at both end portions of the first heat-conducting member 11. The transition surface 111 is an inclined surface, and the transition surface 111 is inclined gradually toward the single plate 20 from one end close to the insertion port to one end far from the insertion port. Because the first heat conduction member 11 is located in the insertion and extraction track of the single board 20, when the single board 20 is inserted into the chassis 10, the single board first contacts with the transition surface 111, and the transition surface 111 can perform the transition and guiding functions, so that the single board 20 can more easily push the first heat conduction member 11 and finally contact with the first heat conduction member 11 in a fitting manner.

In one possible implementation manner, the heat dissipation area S may be a partial area of an inner side wall of the chassis 10, or when there is a large space on the side of the single board 20 in the chassis 10, the heat dissipation area S may be a heat dissipation component 60, such as a fin-shaped heat sink, disposed in the chassis 10.

Specifically, referring to fig. 1, a heat dissipation area S is formed on an inner sidewall of a chassis 10, where the chassis 10 may be formed by a sheet metal structure, taking an example that a communication device 100 is disposed in a data center or a machine room, a temperature in a general machine room is within 25 ± 3 °, and even when a machine room air conditioner fails and maintains an air conditioner, the temperature of the machine room may be controlled within 45 °, such that a wall temperature of the chassis 10 is within a range of 23-45 °, and a temperature of a heat source 22 on a board 20, such as a CPU chip, is substantially 100 ° when operating, that is, a large temperature difference exists between an inner sidewall of the chassis 10 and the heat source 22 on the board 20, and a heat dissipation area S for dissipating heat from the heat source 22 may be formed, the first heat conduction member 11 may contact with the inner sidewall of the chassis 10, and a region of the inner sidewall of the chassis 10 in thermal contact with the first heat conduction member 11 is the heat dissipation area S, as shown in fig. 1, the first heat conducting member 11 is in contact with the inner sidewall of the casing 10 through the elastic heat conducting member 40 and the heat conducting substrate 50, that is, the region of the inner sidewall of the casing 10 in contact with the heat conducting substrate 50 is the heat dissipation region S.

When the single board 20 is inserted into the chassis 10, the single board 20 pushes the first heat conducting member 11 to move the first heat conducting member 11 from the first position to the second position, the first heat conducting member 11 compresses the elastic heat conducting member 40 and the elastic member, the second heat conducting member 21 on the single board 20 is in thermal contact with the first heat conducting member 11, the first heat conducting member 11 is in thermal contact with the elastic heat conducting member 40, the elastic heat conducting member 40 is in thermal contact with the heat conducting substrate 50, the heat conducting substrate 50 is in thermal contact with the heat dissipating area S on the inner side wall of the chassis 10, so that the heat of the heat source 22 on the single board 20 is transferred to the second heat conducting member 21, and the second heat conducting member 21 is in thermal contact with the inner side wall of the chassis 10 through the first heat conducting member 11, the elastic heat conducting member 40 and the heat conducting substrate 50 to achieve heat exchange.

Alternatively, as shown in fig. 4 and 5, the communication device 100 further includes a heat dissipating member 60, the heat dissipating member 60 is fixedly disposed on the inner sidewall of the housing 10, the heat dissipating member 60 forms the heat dissipating region S, and the first heat conducting member 11 is disposed on a side of the heat dissipating member 60 close to the board 20 through an elastic member. The provision of the heat dissipation member 60 forms a heat dissipation region, and the heat dissipation effect can be further improved. The heat dissipating member 60 may be a heat sink of an air-cooling heat dissipating method, or a heat sink of a liquid-cooling heat dissipating method, wherein, as shown in fig. 4 and 5, the elastic heat conductive member 40 may be provided between the heat dissipating member 60 and the first heat conductive member 11.

When the single board 20 is inserted into the chassis 10, the single board 20 pushes the first heat conducting member 11, so that the first heat conducting member 11 moves from a first position (for example, the first heat conducting member 11 is located in the plugging track in fig. 4) to a second position (for example, the first heat conducting member 11 is located outside the plugging track and thermally contacts with the second heat conducting member 21 in fig. 5), the elastic heat conducting member 40 and the elastic member are compressed, the second heat conducting member 21 on the single board 20 thermally contacts with the first heat conducting member 11, the first heat conducting member 11 thermally contacts with the elastic heat conducting member 40, the elastic heat conducting member 40 thermally contacts with the heat dissipating member 60, so that heat of the heat source 22 on the single board 20 is transferred to the second heat conducting member 21, and the second heat conducting member 21 contacts with the heat dissipating member 60 through the first heat conducting member 11 and the elastic heat conducting member 40 to achieve heat exchange.

As shown in fig. 5, the heat dissipation member 60 may be fixed to an inner side wall of the chassis 10 by a fastening member 90 such as a screw.

In another possible implementation manner, referring to fig. 6 and 7, the communication device 100 includes a heat dissipating member 60, the heat dissipating member 60 forms the heat dissipating area S, the first heat conducting member 11 is fixedly disposed on a side of the heat dissipating member 60 close to the single board 20, and the heat dissipating member 60 is disposed on an inner side wall of the chassis 10 through an elastic member, so that the heat dissipating member 60 and the first heat conducting member 11 can move as a whole in a direction close to the single board 20 or away from the single board 20, and the structure is simple and convenient to assemble.

When the single board 20 is inserted into the chassis 10, the single board 20 pushes the first heat conducting member 11, the first heat conducting member 11 and the heat dissipating member 60 move from a first position (e.g., the first heat conducting member 11 is located in the plugging track in fig. 6) to a second position (e.g., the first heat conducting member 11 is located outside the plugging track and in thermal contact with the second heat conducting member 21 in fig. 7), the elastic member is compressed, the second heat conducting member 21 on the single board 20 is in thermal contact with the first heat conducting member 11, the first heat conducting member 11 is in contact with the heat dissipating member 60, so that heat generated by the heat source 22 is transferred to the second heat conducting member 21, and the second heat conducting member 21 is in contact with the heat dissipating member 60 through the first heat conducting member 11 to achieve heat exchange.

Referring to fig. 8 to fig. 12, in the communication apparatus 100 according to the embodiment of the present invention, the driving member 30 is still an elastic member, and when the first heat conduction member 11 is located at the first position, the first heat conduction member 11 is located outside the plugging track of the single board 20 and is located at a side close to the heat dissipation area (i.e., the heat dissipation member 60).

Specifically, the communication device 100 may further include a heat dissipating member 60, the heat dissipating member 60 forms a heat dissipating area S, the first heat conducting member 11 is fixedly disposed on one side of the heat dissipating member 60 close to the single board 20, the heat dissipating member 60 is disposed on an inner side wall of the chassis 10 through an elastic member, and the heat dissipating member 60 and the first heat conducting member 11 move together in a direction close to the single board 20 or away from the single board 20.

The communication device 100 further includes a trigger assembly 70, when the first heat conducting member 11 is located at the first position, the first heat conducting member 11 is located outside the insertion and extraction track of the board 20 and located at a side close to the heat dissipation area (i.e. the heat dissipation member 60), when the board 20 is inserted into the chassis 10, the board 20 drives the heat dissipation member 60 and the first heat conducting member 11 to move from the first position to the second position through the trigger assembly 70, that is, the trigger assembly 70 pulls the first heat conducting member 11 and the heat dissipation member 60 to move towards a direction close to the board 20, finally, the first heat conducting member 11 is in thermal contact with the second heat conducting member 21, and the elastic member is stretched.

Specifically, as shown in fig. 8, when the single board 20 is not inserted into the chassis 10, the first heat conducting member 11 is located at the first position, and at this time, the first heat conducting member 11 is located at a side, outside the insertion and extraction track of the single board 20, close to the heat dissipation area (i.e., the heat dissipation member 60), and a certain distance is provided between the first heat conducting member 11 and the second heat conducting member 21 of the single board 20. When the single board 20 is inserted into the chassis 10, as shown in fig. 9, the trigger assembly 70 may be driven, the single board 20 drives the first heat conducting member 11 and the heat dissipating member 60 to move toward the direction close to the single board 20 through the trigger assembly 70, so that the first heat conducting member 11 moves to the second position and is in thermal contact with the second heat conducting member 21, thereby transferring heat emitted by the heat source 22 on the single board 20 to the second heat conducting member 21, and realizing heat exchange through the contact between the first heat conducting member 11 and the heat dissipating member 60, while the elastic member is in a stretched state.

When the single board 20 is pulled out of the chassis 10, the triggering component 70 has no effect on the first heat-conducting member 11 and the heat-dissipating member 60, so that the resilience of the stretched elastic member can drive the first heat-conducting member 11 and the heat-dissipating member 60 to recover from the second position to the first position, i.e., the first heat-conducting member 11 and the heat-dissipating member 60 return to the plugging track of the single board 20, and when the single board 20 is inserted into the chassis 10 again, the triggering component 70 can be driven again, and the reinsertion of the single board 20 is not affected.

In a possible implementation manner, referring to fig. 8, the communication device 100 further includes a rotating member 80 disposed in the chassis 10, and one end of the heat dissipation member 60 is rotatably disposed in the chassis 10 through the rotating member 80, specifically, one end of the heat dissipation member 60 close to the insertion opening is rotatably disposed through the rotating member 80. When the first heat-conducting member 11 is located at the first position, the first heat-conducting member 11 and the heat-dissipating member 60 are located outside the insertion and extraction track of the single plate 20, and a certain distance is provided between the first heat-conducting member 11 and the second heat-conducting member 21, and the other end of the heat-dissipating member 60 is inclined toward a direction away from the single plate 20.

The triggering assembly 70 includes a connecting rod structure 71 and a fixing member 72 engaged with the connecting rod structure 71, the connecting rod structure 71 is disposed at the other end of the heat dissipating member 60, the fixing member 72 is fixedly disposed on the single board 20, and when the single board 20 is inserted into the chassis 10, the fixing member 72 engages with the connecting rod structure 71 to drive the heat dissipating member 60 and the first heat conducting member 11 to move from the first position to the second position.

Referring to fig. 8 and 9, when the single board 20 is inserted into the chassis 10, the fixing element 72 on the single board 20 is engaged with the link structure 71 on the other end of the heat dissipating member 60, and the other end of the heat dissipating member 60 is pulled to move close to the single board 20 during the movement of the single board 20, so that the heat dissipating member 60 and the first heat conducting member 11 can be driven to move close to the single board 20, and finally, when the single board 20 is inserted into the chassis 10, the first heat conducting member 11 moves to the second position and is in thermal contact with the second heat conducting member 21, so that heat generated by the heat source 22 on the single board 20 can be transferred to the second heat conducting member 21, and the heat can be exchanged through the first heat conducting member 11 and the heat dissipating member 60.

Specifically, referring to fig. 10, the link structure 71 may have a V-shape, and the link structure 71 includes a first link portion 711 and a second link portion 712 connected to each other, wherein a rotating shaft 713 is disposed at a connection portion of the first link portion 711 and the second link portion 712, and the link structure 71 is rotatably disposed in the chassis 10 through the rotating shaft 713, that is, the link structure 71 may rotate in the chassis 10.

The first link portion 711 is connected to the heat dissipating member 60, wherein the end of the second link portion 712 may be provided with a trigger structure, the trigger structure may be matched with the fixing member 72, and the specific matching manner may be a matching manner of a clip and a buckle, or a magnetic attraction matching manner.

As in a possible implementation, the end of the second link portion 712 may have a hook structure 714, and when the single board 20 is inserted into the chassis 10, the hook structure 714 is hung on the fixing member 72. Specifically, the single plate 20 is inserted in the vertical direction x as shown in fig. 10, the heat dissipation member 60 and the first heat conduction member 11 are inclined with respect to the single plate 20, when the single board 20 is inserted into the chassis 10, the hook structure 714 is hung on the fixing element 72, and as the single board 20 continues to be inserted, the single board 20 can drive the second connecting rod portion 712 to move along with the hook structure 714, at the same time, the second link portion 712 and the first link portion 711 rotate relative to the rotation shaft 713, so that the first link portion 711 moves in a direction approaching the single plate 20, the heat dissipation member 60 and the other end of the first heat conduction member 11 are driven by the first connecting rod 711 to move toward the direction close to the single plate 20, and finally the heat dissipation member 60 and the first heat conduction member 11 are pulled to the second position, the heat dissipation member 60, the first heat conduction member 11 and the second heat conduction member 21 are parallel to each other, and the first heat conduction member 11 is in thermal contact with the second heat conduction member 21.

When the single board 20 is pulled out of the chassis 10, the hook structure 714 is separated from the fixing member 72 on the single board 20, and the elastic member drives the first heat conducting member 11 and the heat dissipating member 60 to return to the first position from the second position under the action of the self resilience force, so that the reinsertion of the single board 20 is not affected.

In another possible implementation manner, referring to fig. 11 and 12, the triggering assembly 70 may include an electromagnet 73 and a magnetic body 74, the electromagnet 73 is located in the second heat conduction member 21, the magnetic body 74 is located in the first heat conduction member 11, when the single plate 20 is inserted into the chassis 10 and the electromagnet 73 is powered on, the electromagnet 73 and the magnetic body 74 attract each other, so that an attractive force between the electromagnet 73 and the magnetic body 74 can pull the first heat conduction member 11 to move close to the single plate 20, so that the first heat conduction member 11 moves from the first position to the second position, and the first heat conduction member 11 is in thermal contact with the second heat conduction member 21.

When the single board 20 is pulled out of the chassis 10, the power may be first cut off to eliminate the attraction between the electromagnet 73 and the magnetic body 74, and the first heat-conducting member 11 and the heat-dissipating member 60 may move from the second position to the first position under the resilience of the elastic member, without affecting the reinsertion of the single board 20.

Specifically, the first heat conduction member 11 is located at the first position, that is, the first heat conduction member 11 is located outside the insertion and extraction track of the single plate 20, and has a gap with the second heat conduction member 21. When the single board 20 is inserted into the chassis 10, as shown in fig. 12, the electromagnet 73 on the single board 20 may be energized, and the energized electromagnet 73 may generate an attractive force to the magnetic body 74 in the first heat-conducting member 11, so as to pull the heat-dissipating member 60 and the first heat-conducting member 11 to move close to the single board 20, and finally move the heat-dissipating member 60 and the first heat-conducting member 11 to the second position, so that the first heat-conducting member 11 and the second heat-conducting member 21 are in thermal contact, so that heat generated by the heat source 22 on the single board 20 can be transferred to the second heat-conducting member 21, and heat exchange is achieved through the first heat-conducting member 11 and the heat-dissipating member 60 in contact.

The electromagnet 73 may be an electromagnet, and the magnetic body 74 may be a permanent magnet.

Referring to fig. 13 and 14, in the communication device 100 according to the embodiment of the present invention, when the single board 20 is inserted into the chassis, the driving member 30 may act on the first heat sink 11 to move the first heat sink to the second position, and when the single board 20 is pulled out of the chassis, the driving member 30 may also move the first heat sink 11 back to the first position.

Specifically, the communication device 100 further includes a heat dissipation member 60 movably disposed in the housing 10, and the heat dissipation member 60 forms a heat dissipation area S. Referring to fig. 13 and 14, the first heat-conducting member 11 is disposed at a side of the heat-dissipating member 60 close to the single plate 20, and when the first heat-conducting member 11 is located at the first position, the first heat-conducting member 11 is located at a side close to the heat-dissipating area (i.e., the heat-dissipating member 60) outside the insertion and extraction locus of the single plate 20.

Referring to fig. 13 and 14, when the single board 20 is inserted into the chassis 10, the single board 20 and the heat dissipating member 60 are respectively connected to the driving member 30 in a matching manner, the single board 20 drives the heat dissipating member 60 and the first heat conducting member 11 to move from the first position to the second position through the driving member 30, that is, when the single board 20 is inserted into the chassis 10, the single board 20 is matched with the driving member 30, the driving member 30 is driven by the movement of the single board 20, so that the driving member 30 drives the heat dissipating member 60 and the first heat conducting member 11 to move in a direction close to the single board 20, and then moves to the second position, so that the first heat conducting member 11 is in contact with the second heat conducting member 21, and heat dissipation of the heat source 22 on the single board 20 is achieved.

When the single plate 20 is pulled out of the chassis 10, the single plate 20 acts on the driving member 30 to drive the heat dissipating member 60 and the first heat conducting member 11 to move from the second position to the first position, that is, when the single plate 20 is pulled out of the chassis 10, the single plate 20 is matched with the driving member 30, the driving member 30 is also driven by the reverse movement of the single plate 20, and then the driving member 30 drives the first heat conducting member 11 to move away from the single plate 20, and the first position is recovered, so that the single plate 20 can be inserted again.

Specifically, referring to fig. 13, the communication device 100 further includes a rotating member 80, one end of the heat dissipating member 60 is rotatably disposed in the chassis 10 through the rotating member 80, specifically, one end of the heat dissipating member 60 close to the insertion port is rotatably connected through the rotating member 80, and when the first heat conducting member 11 is located at the first position, that is, when the single board 20 is not inserted into the chassis 10, the other end of the heat dissipating member 60 is inclined toward a direction away from the single board 20.

The driving member 30 includes a first rack (not shown), a gear 31 and a second rack (not shown), the first rack is disposed on the side of the heat dissipating member 60 close to the second heat conducting member 21, the second rack is disposed on the side of the single plate 20 close to the first heat conducting member 11, the gear 31 can be disposed on the first rack, or the gear 31 can be disposed on the second rack.

Referring to fig. 13, the gear 31 is located on the first rack, when the single board 20 is inserted into the chassis 10, the gear 31 is respectively engaged with the first rack and the second rack, the single board 20 drives the gear 31 to move along the second rack from the end close to the rotating member 80 to the end away from the rotating member 80 through the first rack, specifically, the single board 20 is inserted into the chassis 10 in the vertical direction x as shown in the drawing, one end of the heat dissipation member 60 close to the insertion port is rotatably disposed through the rotating member 80, and the other end of the heat dissipation member 60 is inclined toward the direction away from the single board 20, that is, the heat dissipation member 60 is inclined with respect to the single board 20.

When the single board 20 is inserted into the chassis 10, the gear 31 is engaged with the first rack and the second rack, and the movement of the single board 20 drives the gear 31 to move on the second rack through the first rack (and the gear 31 also moves on the first rack), so that the gear 31 moves from the end close to the rotating member 80 to the end away from the rotating member 80, which gradually reduces the inclination angle between the heat dissipating member 60 and the single board 20, that is, the heat dissipating member 60 and the first heat conducting member 11 thereon move in the direction close to the single board 20. When the single board 20 is inserted into the enclosure 10, referring to fig. 14, the heat dissipation member 60 and the first heat conduction member 11 are moved from the first position to the second position, the heat dissipation member 60, the first heat conduction member 11, and the second heat conduction member 21 may be kept parallel to each other, and the first heat conduction member 11 and the second heat conduction member 21 are in thermal contact, so as to dissipate heat from the heat source 22.

When the single board 20 is pulled out of the casing 10, the first rack drives the gear 31 to move along the second rack from the end far away from the rotating member 80 to the end near the rotating member 80. When the single board 20 is pulled out, the reverse motion of the single board 20 drives the gear 31 to move on the second rack through the first rack, so that the gear 31 moves from the end far away from the rotating member 80 to the end close to the rotating member 80, and thus the inclination between the heat dissipating member 60 and the single board 20 gradually increases, and the heat dissipating member 60 and the first heat conducting member 11 thereon move in the direction far away from the single board 20, and when the single board 20 is pulled out of the chassis 10, the heat dissipating member 60 and the first heat conducting member 11 return to the first position from the second position, so that the single board 20 can be inserted again.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A communication device is characterized by comprising a case and a single board, wherein the single board is arranged in the case in a pluggable manner, and one side of the case, which is positioned in the plugging direction of the single board, is provided with a heat dissipation area;

a first heat-conducting component is movably arranged in the case, is positioned on one side of the single board in the plugging direction, and moves towards the direction close to or far away from the single board;

the single plate is provided with a second heat-conducting component on one side close to the first heat-conducting component, and the second heat-conducting component is in thermal contact with a heat source arranged on the single plate;

the single board is inserted into the chassis, the first heat-conducting component moves from a first position to a second position under the action of the single board, when the first heat-conducting component is located at the second position, one side of the first heat-conducting component is in thermal contact with the second heat-conducting component, and the other side of the first heat-conducting component is in thermal contact with the heat dissipation area;

when the single plate is pulled out of the case, the driving member is used for driving the first heat-conducting member to move from the second position to the first position.

2. The communication apparatus according to claim 1, wherein the driving member is an elastic member, and the first heat conducting member is disposed on an inner sidewall of the housing through the elastic member;

when the single board is pulled out of the case, the first heat-conducting component moves from the second position to the first position through the elastic component.

3. The communication device according to claim 2, wherein when the first heat conduction member is located at the first position, a part of the first heat conduction member is located within a plugging track of the single board;

when the single plate is inserted into the case, the single plate pushes the first heat-conducting member, so that the first heat-conducting member moves from the first position to the second position, and the elastic member is compressed.

4. The communication device according to claim 2 or 3, further comprising an elastic heat-conducting member located between the first heat-conducting member and the heat dissipation area;

when the single board is inserted into the chassis, the first heat conduction member is in thermal contact with the heat dissipation area through the elastic heat conduction member.

5. The communication device of claim 4, further comprising a thermally conductive substrate positioned between the resilient thermally conductive member and the heat dissipation area.

6. The communication device as claimed in any one of claims 3 to 5, wherein the heat dissipation area is formed on an inner sidewall of the housing.

7. The communication device according to any one of claims 3 to 5, further comprising a heat dissipating member fixedly disposed on an inner sidewall of the housing, wherein the heat dissipating member forms the heat dissipating area, and the first heat conducting member is disposed on a side of the heat dissipating member close to the single board via the elastic member.

8. The communication device according to claim 3, further comprising a heat dissipating member, wherein the first heat conducting member is fixedly disposed on a side of the heat dissipating member close to the single board, the heat dissipating member is disposed on an inner sidewall of the housing through the elastic member, and the heat dissipating member forms the heat dissipating area.

9. The communication device according to claim 2, further comprising a heat dissipating member, wherein the first heat conducting member is fixedly disposed on a side of the heat dissipating member close to the single board, the heat dissipating member is disposed on an inner sidewall of the chassis through the elastic member, and the heat dissipating member forms the heat dissipating area;

the heat dissipation device also comprises a trigger assembly, wherein when the first heat conduction component is positioned at the first position, the first heat conduction component is positioned at one side, close to the heat dissipation area, outside the single board plugging track;

when the single board is inserted into the chassis, the single board drives the heat dissipation component and the first heat conduction component to move from the first position to the second position through the trigger component, and the elastic component is stretched.

10. The communication device according to claim 9, further comprising a rotating member disposed in the housing, wherein one end of the heat dissipating member is rotatably disposed in the housing via the rotating member, and when the first heat conducting member is located at the first position, the other end of the heat dissipating member is inclined toward a direction away from the single board;

the trigger assembly comprises a connecting rod structure and a fixing piece matched with the connecting rod structure, the connecting rod structure is arranged at the other end of the heat dissipation part, and the fixing piece is fixedly arranged on the single plate;

when the single board is inserted into the chassis, the fixing member is matched with the connecting rod structure to drive the heat dissipation member and the first heat conduction member to move from the first position to the second position.

11. The communication device according to claim 10, wherein the link structure is V-shaped and comprises a first link portion and a second link portion connected with each other, a rotating shaft is disposed at a connecting portion of the first link portion and the second link portion, and the link structure is rotatably disposed in the housing through the rotating shaft;

the first connecting rod part is connected with the heat dissipation part, the end part of the second connecting rod part is provided with a hook structure, and when the single board is inserted into the case, the hook structure is hung on the fixing part.

12. The communication device of claim 9, wherein the trigger assembly comprises an electromagnet positioned within the second thermally conductive member and a magnetic body positioned within the first thermally conductive member;

when the single board is inserted into the case and the electromagnet is electrified, the electromagnet and the magnetic body are attracted.

13. The communication device according to claim 1, further comprising a heat dissipating member movably disposed in the chassis, wherein the heat dissipating member forms the heat dissipating area, the first heat conducting member is disposed at a side of the heat dissipating member close to the board, and when the first heat conducting member is located at the first position, the first heat conducting member is located at a side of the board outside a plugging track of the board close to the heat dissipating area;

when the single board is inserted into the chassis, the single board and the heat dissipation part are respectively connected with the driving part in a matching manner, and the single board drives the heat dissipation part and the first heat conduction part to move from the first position to the second position through the driving part;

when the single plate is pulled out of the case, the single plate acts on the driving piece to drive the heat dissipation part and the first heat conduction part to move from the second position to the first position.

14. The communication device according to claim 13, further comprising a rotating member disposed in the housing, wherein one end of the heat dissipating member is rotatably disposed in the housing via the rotating member, and when the first heat conducting member is located at the first position, the other end of the heat dissipating member is inclined toward a direction away from the board;

when the single plate is inserted into the chassis, the gear is respectively meshed with the first rack and the second rack, and the single plate drives the gear to move along the second rack from one end close to the rotating part to one end far away from the rotating part through the first rack, so that the heat dissipation part and the first heat conduction part move from the first position to the second position;

when the single plate is pulled out of the case, the first rack drives the gear to move from one end far away from the rotating piece to one end close to the rotating piece along the second rack, so that the heat radiating part and the first heat conducting part move from the second position to the first position.

15. The communication device according to any of claims 1-14, further comprising a third heat conducting member, wherein said second heat conducting member is connected to a heat source located on said single plate via said third heat conducting member.