CN114447254A - Display module, manufacturing method and display device - Google Patents
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- CN114447254A CN114447254A CN202210149703.5A CN202210149703A CN114447254A CN 114447254 A CN114447254 A CN 114447254A CN 202210149703 A CN202210149703 A CN 202210149703A CN 114447254 A CN114447254 A CN 114447254A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a display module, a manufacturing method and a display device, wherein the display module comprises a display panel, a first side and a second side, wherein the first side and the second side are oppositely arranged; the composite film comprises a bonding layer, a buffer layer and a heat dissipation layer which are arranged from near to far from the display panel in a laminated mode, the buffer layer comprises a buffer body and a plurality of grooves formed in one side, close to the heat dissipation layer, of the buffer body, and heat conduction materials are filled in each groove; the second surface is a light-emitting side of the display panel. The embodiment of this application is through the heat conduction material that sets up in the fluting of buffer layer, on the basis of guaranteeing the heat dissipation function, effectively reduces the unit area of heat conduction material in order to improve the cohesion of unit area heat conduction material, can solve among the prior art problem that the compound film easily takes place the bulging phenomenon during follow-up maintenance, has simplified the manufacturing process of complex film, has practiced thrift the manufacturing cost of display module assembly.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a manufacturing method and a display device.
Background
Organic Light Emitting Diode (OLED) display modules are widely used in various display devices due to their advantages of self-luminescence, wide viewing angle, wide color gamut, foldability, and flexibility.
In the prior art, an OLED display module generally includes a display panel and a composite film located on a side opposite to a light-emitting side of the display panel. The composite film can play a role in buffering stress acting on the display panel and has a certain protection effect on the display panel. However, the composite film is easy to bulge during subsequent maintenance, thereby increasing the maintenance cost.
Disclosure of Invention
In order to solve at least one of the above problems, a first embodiment of the invention provides a display module, including:
the display panel comprises a first surface and a second surface which are oppositely arranged; and
a composite film disposed on the first side, wherein
The composite film comprises an adhesive layer, a buffer layer and a heat dissipation layer which are arranged from near to far away from the display panel in a stacking mode, wherein the buffer layer comprises a buffer body and a plurality of grooves which are formed in one side of the buffer body, close to the heat dissipation layer, and each groove is filled with a heat conduction material;
the second surface is a light emitting side of the display panel.
In a specific embodiment, the slot is a via hole penetrating through the buffer layer;
or
The slot is a buried hole arranged in the buffer layer.
In a specific embodiment, an orthographic projection of the slot on the display panel is circular or polygonal.
In a specific embodiment, an orthographic projection of the slot on the display panel is a polygon, the polygon comprises a chamfer, and a fillet radius of the chamfer is greater than or equal to 2 mm.
In a specific embodiment, the buffer layer includes a plurality of slot groups, each slot group includes a plurality of slots arranged in an array, an orthographic projection of the slot group on the display panel is circular, and an orthographic projection of the slot group on the display panel is circular or polygonal.
In a specific embodiment, the set of slots comprises 7 slots arranged at equal intervals.
In a specific embodiment, the buffer body is foam, and the heat conductive material is graphite.
In a specific embodiment, the adhesive layer is a double-sided adhesive tape;
and/or
The heat dissipation layer is made of metal.
A second embodiment of the invention provides a display device, comprising the display module according to any one of claims 1 to 8.
A third embodiment of the present invention provides a method for manufacturing a display module according to the first embodiment, including:
punching a hole on the buffer body material layer and filling a heat conduction material to form a buffer layer;
respectively attaching the bonding layer, the buffer layer and the heat dissipation layer to form a composite film;
the composite film is attached to the first surface of the display panel through the bonding layer, and the second surface, opposite to the first surface, of the display panel is a light emergent side.
The invention has the following beneficial effects:
aiming at the existing problems, the invention provides a display module, a manufacturing method and a display device, wherein the display module comprises a display panel and a composite film which are sequentially stacked, the composite film effectively reduces the unit area of the heat conduction material through the heat conduction material arranged in the groove of the buffer layer on the basis of ensuring the heat dissipation function so as to improve the cohesion of the heat conduction material in the unit area, and can solve the problem that the composite film is easy to bulge in the subsequent maintenance in the prior art, simplify the manufacturing process of the composite film and save the manufacturing cost of the display module.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the invention;
FIGS. 2a-2b are schematic structural views illustrating grooving of a composite membrane according to another embodiment of the present invention;
FIG. 3 is a schematic view of the array of slots according to one embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display module according to an embodiment of the invention;
fig. 5 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the invention.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
It is noted that references herein to "on … …", "formed on … …" and "disposed on … …" can mean that one layer is formed or disposed directly on the other layer or that one layer is formed or disposed indirectly on the other layer, i.e., there is another layer between the two layers. As used herein, unless otherwise specified, the term "on the same layer" means that two layers, components, members, elements or portions can be formed by the same patterning process, and the two layers, components, members, elements or portions are generally formed of the same material. Herein, unless otherwise specified, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like. The expression "one-time patterning process" means a process of forming a patterned layer, member, or the like using one mask plate.
In the production process of an OLED module product, a composite film is generally required to be attached to the surface of the side, opposite to the light emergent side, of a display panel, the production process is limited by the influence of comprehensive factors such as equipment, processes and personnel operation, the display panel generally has a certain proportion of defective products, and in order to reduce the production cost, pursue lean production management and carry out rework repair operation on the defective products. When the display panel is disassembled and repaired, the composite film can bulge after the disassembly. This phenomenon seriously affects the control of the quality of the product after the repair and mass production of the display panel, and the cost is also greatly increased.
In view of the above situation, the inventor has made extensive research and experiments to propose that the reason why the composite film is prone to bulge during subsequent maintenance is that the composite film includes a graphite layer, and since the graphite material is light in weight, free from constraint, low in cohesive force and low in intermolecular relative constraint capacity, the graphite layer is not enough in cohesive force under the influence of an external force, so that the bulge is prone to occur.
In view of the above-mentioned problems and the causes for the problems, as shown in fig. 1, an embodiment of the present invention provides a display module including:
a display panel 10 including a first face and a second face which are oppositely disposed; and
a composite film 20 disposed on the first side, wherein
The composite film 20 comprises an adhesive layer 201, a buffer layer 202 and a heat dissipation layer 203 which are stacked from near to far away from the display panel, wherein the buffer layer 202 comprises a buffer body 2021 and a plurality of slots which are arranged on one side of the buffer body close to the heat dissipation layer, and each slot is filled with a heat conduction material 2022;
the second surface is a light emitting side of the display panel.
The display module in this embodiment includes display panel and the complex film that stacks gradually, the complex film set up with the surface of the light-emitting side opposite side of display panel for dispel the heat and protect display panel. This complex film is through setting up the heat conduction material in the fluting of buffer layer, on the basis of guaranteeing the heat dissipation function, has effectively reduced the unit area of heat conduction material in order to improve the cohesion of unit area heat conduction material, can solve among the prior art problem that the complex film easily takes place the bulging phenomenon during follow-up maintenance, has simplified the manufacturing process of complex film, has practiced thrift the manufacturing cost of display module assembly.
In this embodiment, the tie coat can be used for bonding buffer layer and heat dissipation layer in display panel's first face, first face be with the surface of the relative one side in light-emitting side of display panel, and this tie coat has the flexibility, can avoid influencing display module's flexible design. Optionally, the material of the adhesive layer comprises a hydrophobic material. The buffering body is made of foam, the heat conduction material is made of graphite, the foam in the buffering layer can restrain the graphite, reduce the unit area of the graphite, improve the cohesion of the graphite in the unit area to solve the problem of graphite bulging, play a role in buffering stress acting on the display panel to protect the display panel, and can be used for shading to ensure that the display panel has a good display effect; the filled heat conduction material not only can play a role in reinforcing and protecting the display panel, and avoids the display panel from being damaged by external force, but also can be used for enhancing the heat dissipation function of the heat dissipation layer or assisting the heat dissipation layer to dissipate heat. Optionally, the material of the buffer body is foam (foam), and the color of the buffer body is dark color, for example, black. The heat dissipation layer is used for dissipating heat generated by the display panel during working so as to avoid damage to the display panel caused by higher heat of the display panel. Optionally, the material of the heat dissipation layer is a metal material, for example, one of copper and aluminum, or an alloy structure thereof, so as to achieve a heat dissipation effect; the heat dissipation layer material of this embodiment is copper cu.
It is worth mentioning that the foam can play a role in buffering and shading. The graphite not only can play a role in reinforcement, but also can increase the reliability of the composite film. In other embodiments, the thermally conductive material may also be replaced with a Polyimide (PI) or polyethylene terephthalate (PET) material.
In a specific embodiment, the adhesive layer is a double-sided adhesive tape; the adhesive linkage is attached display panel keeps away from the surface of light-emitting side, the adhesive linkage can be grid glue (Embo), grid glue has the carminative effect of laminating, and has the flexibility, can not influence display module's flexible design. In other embodiments, the adhesive layer may be another adhesive layer.
The first surface of the display panel is a surface opposite to the light exit side of the display panel, the second surface of the display panel is the light exit side of the display panel, and a user views the content displayed by the display panel through the light exit side of the display panel.
In order to better improve the cohesion of the heat conductive material per unit area, in a specific embodiment, as shown in fig. 2a and 2b, the buffer layer includes a plurality of slot groups 2023, each slot group includes a plurality of slots arranged in an array, each slot is filled with the heat conductive material 2022, an orthographic projection of the slot group on the display panel is a circle, and an orthographic projection of the slot on the display panel is a circle or a polygon.
In this embodiment, the arrangement, number and shape of the slots in each slot group are designed according to practical application requirements. In an alternative embodiment, for example, the set of slots comprises 7 polygonal slots arranged at equal intervals,
when a plurality of slots arranged in an array are formed, a plurality of slot areas can be divided on one side, close to the heat dissipation layer, of the buffer body, wherein each slot area is a circle with the radius of 25mm, and each adjacent circular slot area is intersected. For example, as shown in fig. 3, six dividing lines 20241 with an angle of 60 degrees are formed on a circular slotted region 2024, so that the slotted region is divided into six identical fan-shaped regions 20242, and polygonal slots with equal width and depth are formed at the position where each dividing line is the same from the center of the circle and the position of the center of the circular slotted region, each polygonal slot is filled with a heat conductive material 2022, so that 7 polygonal slots arranged in an array are formed, and the orthographic projection of the slot group on the display panel is circular. As shown in fig. 3, wherein each slot on each dividing line has a slot distance from the center of the circle
Wherein a is the distance between the centers of the adjacent circular slotted regions, and alpha is the separation angle between the two adjacent dividing lines.
In the embodiment, the distance a between the centers of two adjacent circular slotted regions is 25mm of the radius of the slotted region, alpha is 60 degrees, and then the distance from the center of the slotted region to the center of the circle is
I.e. from the centre of the circle on each dividing line
And the center of the circle is slotted, so that 7 polygonal slots arranged in an array are formed. In this embodiment, receive under the external force condition at display module assembly, evenly distributed's each fluting atress is even, can effectively avoid the bulging phenomenon and the layering phenomenon of the complex film that appear among the prior art.
It should be noted that the above embodiments are only used for illustrating specific embodiments of the present application, and the structure, distribution and size of the grooving groups and the grooving are not limited in the present application, and those skilled in the art should select an appropriate grooving according to the actual application requirement, and details are not described herein again.
In an alternative embodiment, in order to ensure that the buffer layer is not wrinkled or torn due to stress concentration during slotting, when the slotting is polygonal, the slotting comprises a chamfer with a fillet radius of 2mm or more.
In this embodiment, through setting up each grooved chamfer, can evenly release the stress of receiving, further improve grooved stability, thereby through setting up the heat conduction material of intussuseption in every fluting, can be when reducing the unit area of heat conduction material in order to improve the cohesion of unit area heat conduction material, ensure the heat-sinking capability of heat conduction material, thereby avoid the phenomenon of bulging and the layering phenomenon of complex film, effectively simplified the manufacturing process of complex film, practiced thrift the manufacturing cost of display module assembly.
It will be appreciated that when the slots are circular, there is no problem of stress concentration and so there is no need to consider the problem of wrinkling or tearing of the cushioning layer.
It should be noted that the above examples are only examples for better understanding of the technical solutions of the embodiments of the present invention, and are not to be taken as the only limitation to the embodiments of the present invention, and the arrangement and shape of the slots may be designed according to the practical application, for example, the slots may be not only regular polygons, such as squares, but also non-regular polygons, such as rectangles or diamonds.
In an optional embodiment, the trench is a via hole penetrating through the buffer layer.
In this embodiment, as shown in fig. 1, the buffer layer includes a buffer body 2021, and a plurality of slots penetrating through the buffer layer, each slot being filled with a thermally conductive material 2022. Specifically, the slot may be formed by hollowing a side of a buffer body material layer formed by the buffer body, which is close to the heat dissipation layer, i.e., the top wall of the slot is the surface of the adhesive layer, which is far from the display panel, and the bottom wall of the slot is the surface of the heat dissipation layer, which is close to the display panel, i.e., the length of the slot is equal to the thickness of the buffer body. It can be understood that the thickness direction of the buffer body may be perpendicular to the carrying surface of the display panel.
The heat conductive material is filled in the groove in consideration of the light shielding function of the buffer layer. Specifically, a graphite material is filled in the slots.
The complex film in this embodiment is in through setting up the buffering body in the buffer layer and setting the buffering body is close to a plurality of link up of heat dissipation layer one side the fluting of buffer layer, every fluting are filled the heat conduction material, on the basis of guaranteeing even heat dissipation function, effectively reduce the unit area of heat conduction material in order to improve the cohesion of unit area heat conduction material, improve the holding power of buffer layer, can solve among the prior art problem that the complex film easily takes place the bulging phenomenon during follow-up maintenance, simplified the manufacturing process of complex film, practiced thrift the manufacturing cost of display module assembly.
In another alternative embodiment, the slot is a buried hole disposed in the buffer layer.
In this embodiment, as shown in fig. 4, the buffer layer includes a buffer body 2021, and a plurality of slots, a thickness of the slots is smaller than a thickness of the buffer layer, and each slot is filled with a thermally conductive material 2022. Each slot is formed in one side, close to the heat dissipation layer, of the buffer body, and specifically, the slots can be obtained by partially hollowing out a material layer of the buffer body, namely, the top wall of each slot is the surface, close to the heat dissipation layer, of the buffer body, and the bottom wall of each slot is the surface, close to the display panel, of the heat dissipation layer, namely, the length of each slot is smaller than the thickness of the buffer body. It can be understood that the thickness direction of the buffer body is perpendicular to the carrying surface of the display panel.
The heat conductive material is filled in the groove in consideration of the light shielding function of the buffer layer. Specifically, a graphite material is filled in the slots.
It can be understood that the length and width of the slot can be designed according to the practical application requirement, for example, when the display panel area is large, the length of the slot can be two thirds of the thickness of the buffer body; when the area of the display panel is small, the length of the slot may be half of the thickness of the buffer body.
The composite film in this embodiment is through the heat conduction material that sets up in the fluting of buffer layer, on the basis of guaranteeing even heat dissipation function, not only effectively reduce the unit area of heat conduction material in order to improve the cohesion of unit area heat conduction material, can solve among the prior art the problem that the composite film easily takes place the bulging phenomenon during follow-up maintenance, further reduced the quantity of heat conduction material to the manufacturing process of composite film has been simplified, the manufacturing cost of display module assembly has been practiced thrift.
It can be understood that the display module has been widely applied to various electronic products as the display component of the electronic device, the design of the narrow frame and the ultra-thin module is more and more favored by terminal manufacturers and consumers, and the realization of the narrow frame scheme mainly depends on the binding area to be bent, so that the driving chip is bent to the back of the display module to realize the purpose. In order to realize an ultra-thin module, the bending radius of the bending region needs to be designed to be smaller, and the height of the bending region is generally determined by the thickness of the film layer below the display panel. In the embodiment, the graphite layer in the composite film is eliminated, so that the total height of the bending region can be reduced, and the structural design requirement of the display module with the bending radius of 0.2 mm or less can be better met. Meanwhile, graphite is filled into the buffer layer as a heat conduction material, so that the problem that the composite film is prone to bulging in subsequent maintenance in the prior art is solved while the reinforcing protection effect and the auxiliary heat dissipation effect of the original graphite layer are not lost.
Based on the display module, an embodiment of the invention further provides a display device, which includes the display module according to the above embodiment.
In this embodiment, the display device may be: a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), a display device, an active matrix AMOLED display device, a mobile phone, a tablet computer, a flexible display device, a television, a display and any other product or component with a display function.
Corresponding to the display module provided in the above embodiment, as shown in fig. 5, another embodiment of the present invention provides a method for manufacturing a display module, including:
punching a hole on the buffer body material layer and filling a heat conduction material to form a buffer layer;
respectively attaching the bonding layer, the buffer layer and the heat dissipation layer to form a composite film;
the composite film is attached to the first surface of the display panel through the bonding layer, and the second surface, opposite to the first surface, of the display panel is a light emergent side.
In one embodiment, when the buffer body material layer is perforated, the buffer layer may be formed by directly perforating the buffer body material layer and filling the buffer layer with a heat conductive material, or by dividing a plurality of perforated regions and then perforating each perforated region to form slots arranged in an array, for example, as shown in fig. 3, each perforated region is divided into circles with a radius of 25mm, and each adjacent circular perforated region intersects with each other. Six dividing lines with the angle of 60 degrees are formed on the circular punching area, punching is carried out at the position with the same distance from the circle center of each dividing line and the circle center of the circular punching area, and therefore the slots which are arranged in an array mode are formed, and the heat conduction materials are filled to form the buffer layer.
And then attaching the bonding layer, the buffer layer and the heat dissipation layer to form a composite film, and installing the composite film on the first surface of the display panel, namely, on the surface opposite to the second surface of the light emergent side of the display panel, so as to form a display module, wherein the composite film is used for heat dissipation and protection of the display panel.
In this embodiment, through the heat conduction material of filling after punching on buffering body material layer, on the basis of guaranteeing the heat dissipation function, effectively reduce the unit area of heat conduction material in order to improve the cohesion of unit area heat conduction material, can solve among the prior art the problem that the compound film easily takes place the bulging phenomenon during subsequent maintenance, simplified the manufacturing process of complex film, practiced thrift the manufacturing cost of display module assembly.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (10)
1. A display module, comprising:
the display panel comprises a first surface and a second surface which are oppositely arranged; and
a composite film disposed on the first side, wherein
The composite film comprises an adhesive layer, a buffer layer and a heat dissipation layer which are arranged from near to far away from the display panel in a stacking mode, wherein the buffer layer comprises a buffer body and a plurality of grooves which are formed in one side of the buffer body, close to the heat dissipation layer, and each groove is filled with a heat conduction material;
the second surface is a light emitting side of the display panel.
2. The display module of claim 1,
the groove is a through hole penetrating through the buffer layer;
or
The slot is a buried hole arranged in the buffer layer.
3. The display module of claim 2, wherein an orthographic projection of the slot on the display panel is circular or polygonal.
4. The display module of claim 1, wherein an orthographic projection of the slot on the display panel is a polygon, the polygon comprising a chamfer having a fillet radius of 2mm or more.
5. The display module of claim 1, wherein the buffer layer comprises a plurality of groove sets, each groove set comprises a plurality of grooves arranged in an array, an orthographic projection of the groove set on the display panel is a circle, and an orthographic projection of the groove set on the display panel is a circle or a polygon.
6. The display module of claim 5, wherein the set of slots comprises 7 slots disposed at equal intervals.
7. The display module according to any one of claims 1-6, wherein the buffer body is foam and the thermally conductive material is graphite.
8. The display module of claim 7,
the bonding layer is a double-sided adhesive tape;
and/or
The heat dissipation layer is made of metal.
9. A display device comprising a display module according to any one of claims 1 to 8.
10. A method for manufacturing a display module according to any one of claims 1 to 8, comprising:
punching a hole on the buffer body material layer and filling a heat conduction material to form a buffer layer;
respectively attaching the bonding layer, the buffer layer and the heat dissipation layer to form a composite film;
the composite film is attached to the first surface of the display panel through the bonding layer, and the second surface, opposite to the first surface, of the display panel is a light emergent side.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114994967A (en) * | 2022-05-27 | 2022-09-02 | 武汉天马微电子有限公司 | Display module and display device |
Citations (7)
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| CN114447254B (en) | 2024-04-05 |
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