CN114447253A - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN114447253A CN114447253A CN202210118796.5A CN202210118796A CN114447253A CN 114447253 A CN114447253 A CN 114447253A CN 202210118796 A CN202210118796 A CN 202210118796A CN 114447253 A CN114447253 A CN 114447253A
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- 239000000758 substrate Substances 0.000 title claims abstract description 219
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 182
- 238000000034 method Methods 0.000 claims abstract description 34
- 230000008569 process Effects 0.000 claims abstract description 29
- 230000003287 optical effect Effects 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 185
- 239000002346 layers by function Substances 0.000 claims description 44
- 239000011159 matrix material Substances 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 230000006872 improvement Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 9
- 239000002131 composite material Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Abstract
The application provides a display substrate and a manufacturing method thereof, and a display device, wherein an optical function layer in the display substrate comprises a planarization layer and a plurality of photoresist blocks arranged at intervals, the plurality of photoresist blocks correspond to the plurality of touch electrode blocks one to one, the planarization layer covers the plurality of photoresist blocks, and the refractive index of the planarization layer is larger than that of the photoresist blocks. By arranging the photoresist blocks and the planarization layer, light rays emitted by the array substrate can be totally reflected at the junction of the photoresist blocks and the planarization layer, so that the light rays emitted by the array substrate can be concentrated right above the display substrate, the brightness of the display substrate is improved under a normal viewing angle, and the improvement of the luminous efficiency of the display substrate is realized. A plurality of photoresist blocks can be formed by reserving part of photoresist when the plurality of touch electrode blocks are manufactured by the composition process, the manufacturing procedure is not additionally increased, the manufacturing cost is saved, a film layer structure capable of improving the luminous efficiency is not required to be arranged, and the thickness of the display substrate is reduced.
Description
Technical Field
The application relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
An Organic Light Emitting Diode (OLED) is an Organic thin film electroluminescent device, and has the advantages of simple manufacturing process, low cost, easy formation of flexible structure, wide viewing angle, high contrast, and the like, so that a display technology using the OLED has become an important display technology. Among them, the OLED-based curved display panel has been widely used.
In order to improve the light emitting efficiency of the OLED display panel, a microlens structure or a reflective cup structure is generally disposed on the OLED light emitting device in the prior art, and the total reflection of light is utilized to improve the light emitting efficiency of the OLED light emitting device. However, this also increases the thickness and manufacturing cost of the OLED display panel, and is complicated in process.
Disclosure of Invention
The application provides a display substrate, a manufacturing method thereof and a display device aiming at overcoming the defects of the existing mode, and aims to solve the problems of high manufacturing cost and complex process of the existing OLED display panel.
In a first aspect, embodiments of the present application provide a display substrate,
an array substrate;
the touch functional layer is arranged on one side of the array substrate and comprises a plurality of touch electrode blocks arranged at intervals;
the optical function layer is arranged on one side, far away from the array substrate, of the touch function layer and comprises a flattening layer and a plurality of photoresist blocks arranged at intervals, the photoresist blocks are located on one side, far away from the array substrate, of the touch electrode blocks and are in one-to-one correspondence with the touch electrode blocks, orthographic projections of the photoresist blocks on the array substrate are overlapped with orthographic projections of the touch electrode blocks on the array substrate, the flattening layer covers the touch function layer and the photoresist blocks, and the refractive index of the photoresist blocks is smaller than that of the flattening layer.
Optionally, a plurality of protrusions and a plurality of grooves are arranged on the surface of one side of the photoresist block, which is far away from the array substrate.
Optionally, a black matrix is disposed on a side of the photoresist block away from the array substrate, and an orthogonal projection of the black matrix on the array substrate overlaps an orthogonal projection of the photoresist block on the array substrate.
Optionally, an orthographic projection area of the black matrix on the array substrate is smaller than an orthographic projection area of the photoresist block on the array substrate.
Optionally, one side of the photoresist block, which is away from the array substrate, is provided with at least one refractive index matching layer, and the refractive index of the refractive index matching layer is greater than the refractive index of the photoresist block and smaller than the refractive index of the planarization layer.
Optionally, the photoresist block covers the touch electrode block.
In a second aspect, embodiments of the present application provide a display device, including a display substrate in embodiments of the present application.
In a third aspect, an embodiment of the present application provides a method for manufacturing a display substrate, including:
providing an array substrate;
manufacturing a touch functional layer on one side of the array substrate through a composition process, wherein the touch functional layer comprises a plurality of touch electrode blocks arranged at intervals;
the touch control functional layer is kept away from one side of the array substrate is manufactured to form an optical functional layer, the optical functional layer comprises a planarization layer and a plurality of photoresist blocks arranged at intervals, the photoresist blocks are located on one side, away from the array substrate, of the touch control electrode blocks and are in one-to-one correspondence with the touch control electrode blocks, orthographic projections of the photoresist blocks on the array substrate and orthographic projections of the touch control electrode blocks on the array substrate are overlapped, and the planarization layer covers the touch control functional layer and the photoresist blocks.
Optionally, the manufacturing a touch functional layer on one side of the array substrate through a patterning process, and manufacturing an optical functional layer on one side of the touch functional layer away from the array substrate includes:
manufacturing a first touch layer on one side of the array substrate through a composition process;
manufacturing an insulating layer on one side of the first touch layer, which is far away from the array substrate, and depositing a metal layer on the insulating layer;
coating photoresist on the metal layer, and exposing the photoresist by using a mask;
removing the exposed photoresist, and etching by using the residual photoresist as a mask to form a second touch layer, wherein the first touch layer and the second touch layer respectively comprise a plurality of touch electrode blocks arranged at intervals;
and manufacturing a planarization layer on one side of the reserved photoresist far away from the array substrate, wherein the reserved photoresist serves as a plurality of photoresist blocks, and the planarization layer covers the plurality of photoresist blocks and the touch function layer.
Optionally, after the optical function layer is manufactured on the side of the touch function side away from the array substrate, the method further includes:
and manufacturing a black matrix on one side of the photoresist block, which is far away from the array substrate, wherein the orthographic projection of the black matrix on the array substrate is overlapped with the orthographic projection of the photoresist block on the array substrate.
The beneficial technical effects brought by the technical scheme provided by the embodiment of the application comprise:
the display substrate in the embodiment of the application comprises an array substrate, a touch control functional layer arranged on one side of the array substrate, and an optical functional layer arranged on one side, far away from the array substrate, of the touch control functional layer. The optical function layer comprises a planarization layer and a plurality of photoresist blocks arranged at intervals, the photoresist blocks are located on one side, away from the display substrate, of the touch electrode blocks and are in one-to-one correspondence with the touch electrode blocks, orthographic projections of the photoresist blocks on the display substrate are overlapped with orthographic projections of the touch electrode blocks on the display substrate, the planarization layer covers the touch function layer and the photoresist blocks, and the refractive index of the planarization layer is larger than that of the photoresist blocks. Through setting up photoresist piece and planarization layer, the light that array substrate sent can take place the total reflection at the juncture of photoresist piece and planarization layer for the light that array substrate sent can concentrate directly over display substrate, and display substrate's luminance obtains improving under the normal viewing angle, has realized the promotion of display substrate luminous efficacy from this. A plurality of photoresist blocks can be formed by reserving partial photoresist when the composition process is used for manufacturing the plurality of touch electrode blocks, the manufacturing procedure is not additionally increased, the manufacturing cost is saved, a film layer structure capable of improving the luminous efficiency is not required to be arranged, and the thickness of the display substrate is reduced.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic cross-sectional view illustrating an OLED display substrate according to the related art;
fig. 2 is a schematic cross-sectional structure diagram of a first display substrate according to an embodiment of the present disclosure;
fig. 3 is a schematic top view of a pixel arrangement in a display substrate according to an embodiment of the present disclosure;
FIG. 4 is a schematic view of the structure of FIG. 3 at section A-A;
fig. 5 is a schematic cross-sectional structure diagram of a second display substrate according to an embodiment of the present disclosure;
FIG. 6 is an enlarged view of FIG. 5 at area B;
FIG. 7 is a schematic cross-sectional view of an optical block according to an embodiment of the present disclosure;
FIG. 8 is a schematic cross-sectional view of an optical block according to an embodiment of the present disclosure;
FIG. 9 is a schematic cross-sectional view illustrating a third display substrate according to an embodiment of the present disclosure;
fig. 10 is a schematic cross-sectional structure view of a fourth display substrate according to an embodiment of the present disclosure;
fig. 11 is a schematic cross-sectional structure view of a fifth display substrate according to an embodiment of the disclosure;
fig. 12 is a schematic cross-sectional structure view of a sixth display substrate according to an embodiment of the present disclosure;
fig. 13 is a schematic view illustrating a manufacturing process of a display substrate according to an embodiment of the present disclosure;
fig. 14a to 14k are schematic structural diagrams of different processes for manufacturing a display substrate according to an embodiment of the present disclosure.
In the figure:
10-a display substrate; 11-an array substrate; 110-a substrate; 111-a light emitting device; 112-an encapsulation layer;
12-a touch functional layer; 121 — a first insulating layer; 122 — a second insulating layer; 123-a first touch layer; 124-a second touch layer; 1200-a touch electrode block;
13-an optically functional layer; 131-photoresist; 1310-a photoresist block; 1311-bumps; 1312-a groove; 132-a planarization layer;
14-a composite functional layer; 141-black matrix; 142-a color filter;
15-an index matching layer; 151-first index matching layer; 152-a second index matching layer; 21-a metal layer; 30-low refractive index lens; 40-mask.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The inventor of the present application considers that, in the existing OLED display panel, in order to improve the light emitting efficiency of the OLED device and reduce power consumption, a mode of providing a structure such as a microlens structure or a reflective cup is generally adopted. As shown in fig. 1, one side of the OLED display substrate in the related art is provided with a plurality of low refractive index lenses 30 distributed at intervals, one side of the OLED display substrate 10 is further provided with a planarization layer 132, the refractive index of the planarization layer 132 is higher than that of the low refractive index lenses 30, and the planarization layer 132 covers the plurality of low refractive index lenses 30. Part of light emitted by the OLED light-emitting device 111 is totally reflected at the junction between the planarization layer 132 and the low refractive index lens 30 (after a certain incident angle is reached, light is totally reflected when entering the optically thinner medium from the optically denser medium), so that the light emitted by the OLED display substrate 10 can be concentrated right above the OLED display substrate 10, the brightness of the OLED display substrate is improved under a normal viewing angle, and the improvement of the light-emitting efficiency of the OLED display substrate is realized.
However, the conventional method for providing a plurality of low refractive index lenses 30 may increase the manufacturing cost and the manufacturing process of the OLED display panel, and the plurality of low refractive index lenses 30 and the planarization layer 132 may increase the thickness of the OLED display panel.
The application provides a display substrate, a manufacturing method thereof and a display device, and aims to solve the technical problems in the prior art.
The display substrate, the manufacturing method thereof, and the display device provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
As shown in fig. 2, 3 and 4, a display substrate 10 provided in an embodiment of the present application includes:
an array substrate 11;
the touch functional layer 12 is arranged on one side of the array substrate 11 and comprises a plurality of touch electrode blocks 1200 arranged at intervals;
the optical function layer 13 is disposed on one side of the touch function layer 12 away from the array substrate 11, and includes a planarization layer 132 and a plurality of photoresist blocks 1310 arranged at intervals, the plurality of photoresist blocks 1310 are located on one side of the plurality of touch electrode blocks 1200 away from the array substrate 11 and are in one-to-one correspondence with the plurality of touch electrode blocks 1200, orthographic projections of the plurality of photoresist blocks 1310 on the array substrate 11 are overlapped with orthographic projections of the plurality of touch electrode blocks 1200 on the array substrate 11, the planarization layer 132 covers the touch function layer 12 and the plurality of photoresist blocks 1310, and a refractive index of the photoresist blocks 1310 is smaller than a refractive index of the planarization layer 132.
Specifically, the array substrate 11 includes a substrate 110 and a plurality of light emitting devices 111 disposed on the substrate 110, the substrate 110 may be made of a flexible material, the light emitting devices 111 are arranged in an array, and may be Micro light-emitting semiconductors (Micro-emitting diodes), Organic light-emitting semiconductors (OLED) light emitting devices 111, and the like, which may be determined according to actual conditions. An encapsulation layer 112 is disposed on the array substrate 11, and the encapsulation layer 112 covers the plurality of light emitting devices 111 to prevent air and moisture from entering the inside of the array substrate 11 to affect the performance of the light emitting devices 111. The side of the encapsulation layer 112 away from the array substrate 11 is provided with a touch functional layer 12, the touch functional layer 12 includes a first touch layer 123 and a second touch layer 124 (distributed along a first direction in fig. 2), the first touch layer 123 and the second touch layer 124 may be made of a metal material, and the first touch layer 123 and the second touch layer 124 each include a plurality of touch electrode blocks 1200 therein. The touch functional layer 12 further includes an insulating layer for insulating the first touch layer 123 and the second touch layer 124 from each other. A plurality of photoresist blocks 1310 are disposed on a side of the plurality of touch electrode blocks 1200 in the second touch layer 124 away from the array substrate 11, and the plurality of photoresist blocks 1310 are in one-to-one correspondence with the plurality of touch electrode blocks 1200 in the second touch layer 124 (an orthographic projection of the photoresist blocks 1310 on the array substrate 11 falls into an orthographic projection of the touch electrode blocks 1200 on the array substrate 11). The side of the touch functional layer 12 away from the array substrate 11 is further provided with a planarization layer 132, the planarization layer 132 covers the touch functional layer 12 and the plurality of touch electrode blocks 1200, and the refractive index of the material of the planarization layer 132 is greater than that of the material of the photoresist block 1310.
As shown in fig. 2, by providing the photoresist block 1310 and the planarization layer 132, light emitted from the array substrate 11 can be totally reflected at the boundary between the photoresist block 1310 and the planarization layer (after reaching a certain incident angle, the light is totally reflected when entering the optically thinner medium from the optically denser medium), so that the light emitted from the array substrate 11 can be concentrated right above the display substrate 10, and the brightness of the display substrate 10 is improved under the front viewing angle, thereby improving the light emitting efficiency of the display substrate 10. And a film structure capable of improving the light emitting efficiency is not required to be arranged, which is beneficial to reducing the thickness of the display substrate 10.
It should be noted that, in the manufacturing process of the display substrate 10, the plurality of touch electrode blocks 1200 in the first touch layer 123 and the second touch layer 124 are manufactured and formed through the patterning process (including the processes of coating, exposing, developing, etching, and removing part or all of the photoresist blocks 1310) and the photoresist blocks 1310 on the plurality of touch electrode blocks 1200 in the second touch layer 124 are obtained by retaining part of the photoresist during the manufacturing of the plurality of touch electrode blocks 1200 through the patterning process (after the plurality of touch electrode blocks 1200 in the second touch layer 124 are formed, the photoresist on the touch electrode blocks 1200 is not peeled), so that the manufacturing process is not additionally increased and the manufacturing cost is saved.
As shown in fig. 5 and fig. 6, optionally, in the embodiment of the present application, a surface of the photoresist block 1310 on a side away from the array substrate 11 is provided with a plurality of protrusions 1311 and a plurality of grooves 1312, so that the effect of reducing the reflection of the ambient light can be achieved. Specifically, when the external ambient light satisfies a certain incident angle, the external ambient light is incident into the planarization layer 132 and irradiates the surface of the photoresist block 1310 (at the boundary between the photoresist block 1310 and the planarization layer 132), and is reflected (the ambient light is incident into the photoresist block 1310 from the planarization layer 132, i.e. enters into the optically thinner medium from the optically denser medium), and the reflected ambient light is emitted from the side surface of the display substrate 10, so that the reflected light is incident into the human eye at the side view angle, and the light reflection phenomenon is caused. Moreover, since half-wave loss does not occur when ambient light enters the optically thinner medium from the optically denser medium, only a part (about 50%) of the reflected ambient light is filtered by the polarizer (not shown in fig. 5), so that the reflection phenomenon is more obvious, which affects the display quality. By arranging the plurality of protrusions 1311 and the plurality of grooves 1312 on the surface of the side of the photoresist block 1310 away from the array substrate 11, that is, the surface of the photoresist block 1310 forms an uneven surface by arranging the plurality of protrusions 1311 and the plurality of grooves 1312, when external ambient light irradiates the surface of the photoresist block 1310, diffuse reflection occurs, that is, the direction of the reflected light is not concentrated in one direction, so that the phenomenon that the light reflection is severe when human eyes are at a certain viewing angle can be improved.
As shown in fig. 5, 6, 7 and 8, the sectional shapes of the plurality of projections 1311 and the grooves 1312 may be circular, square, triangular, or the like in the section along the first direction in fig. 5, and the sectional shapes and sizes of the plurality of projections 1311 and the grooves 1312 may be adjusted according to actual circumstances. The plurality of protrusions 1311 and the plurality of grooves 1312 may be formed by a patterning process, or may be formed by roughening the surface of the photoresist block 1310 away from the array substrate 11 by a grinding process (e.g., changing the roughness of the surface of the photoresist block 1310), which may be determined according to actual conditions.
Optionally, as shown in fig. 9, in an embodiment of the present application, a black matrix 141 is disposed on a side of the photoresist block 1310 away from the array substrate 11, and an orthogonal projection of the black matrix 141 on the array substrate 11 overlaps an orthogonal projection of the photoresist block 1310 on the array substrate 11.
As shown in fig. 9, in a specific embodiment, a composite functional layer 14 is disposed on a side of the planarization layer 132 away from the array substrate 11, and specifically, the composite functional layer 14 is formed by using a coe (colofilter on encapsulation) technology, that is, the composite functional layer 14 integrates functions of the color filter 142, the black matrix 141 and the polarizer, so that the polarizer can be removed, and the thickness of the display substrate 10 can be reduced. The composite functional layer 14 includes color filters 142 and black matrixes 141, and the black matrixes 141 are arranged in one-to-one correspondence with the photoresist blocks 1310, that is, an orthogonal projection of the black matrixes 141 on the array substrate 11 overlaps an orthogonal projection of the photoresist blocks 1310 on the array substrate 11.
After the black matrix 141 is disposed in the embodiment of the application, the ambient light reflected on the surface of the photoresist block 1310 can be shielded by the black matrix 141, so that the reflection phenomenon can be improved. The larger the area size of the black matrix 141 is, the better the shielding effect for the reflected ambient light is, and the better the reflective phenomenon is, but when the area size of the black matrix 141 is too large, the light emitted from the array substrate 11 is also shielded, and the light emitting efficiency of the display substrate 10 is affected. Optionally, the area size of the black matrix 141 is smaller than the area size of the photoresist block 1310, that is, the orthographic projection area of the black matrix 141 on the array substrate 11 is smaller than the orthographic projection area of the photoresist block 1310 on the array substrate 11. This embodiment requires that the surface of the photoresist block 1310 be uneven (when the area of the black matrix 141 is small, part of the reflected light cannot be blocked). In the first direction of fig. 9, the smaller the distance between the black matrix 141 and the photoresist block 1310 is, the better the shielding effect for the reflected ambient light is. The area size of the black matrix 141 and the distance between the black matrix 141 and the photoresist block 1310 may be adjusted according to actual conditions, and may be calculated according to the incident angle of the ambient light, the refractive indexes of the planarization layer 132 and the photoresist block 1310, and other factors.
As shown in fig. 10, in another specific embodiment, the black matrix 141 is disposed on the surface of the photoresist block 1310, i.e., the distance between the black matrix 141 and the photoresist block 1310 is zero in the first direction, and the black matrix 141 covers the surface of the photoresist block 1310. Therefore, the ambient light irradiated onto the surface of the photoresist block 1310 is absorbed by the black matrix 141, and the reflection is prevented, i.e., the reflection phenomenon is prevented. By adjusting the area size of the black matrix 141 (for example, the area of the black matrix 141 on the array substrate 11 is smaller than the area of the photoresist block 1310 on the array substrate 11), the light reflection phenomenon can be avoided, and at the same time, the shielding of the black matrix 141 on the light emitted by the array substrate 11 can be reduced, so as to avoid the influence of the black matrix 141 on the light emitting efficiency of the display substrate 10.
Optionally, as shown in fig. 11, in an embodiment of the present application, at least one refractive index matching layer 15 is disposed on a side of the photoresist block 1310 away from the array substrate 11, and a refractive index of the refractive index matching layer 15 is greater than a refractive index of the photoresist block 1310 and smaller than a refractive index of the planarization layer 132. Specifically, the refractive index matching layer 15 includes a first refractive index matching layer 151 and a second refractive index matching layer 152 distributed along the direction (the first direction in fig. 11) from the array substrate 11 to the encapsulation layer 112, the refractive index of the second refractive index matching layer 152 is smaller than the refractive index of the planarization layer 132 and larger than the refractive index of the first refractive index matching layer 151, and the refractive index of the first refractive index matching layer 151 is larger than the refractive index of the photoresist block 1310. By providing the index matching layer 15, the refractive index gradient between the planarization layer 132 and the photoresist block 1310 is reduced, even though there is a slow transition of refractive index between the planarization layer 132 and the photoresist block 1310, so that the total reflection of ambient light from the optically denser medium (the planarization layer 132) into the optically thinner medium (the photoresist block 1310) can be reduced, and the light reflection phenomenon of the display substrate 10 can be improved. The specific number of the index matching layers 15 may be adjusted according to the actual situation, and is not limited herein.
As shown in fig. 12, optionally, the photoresist block 1310 covers the touch electrode block 1200. Specifically, in the manufacturing process of the display substrate 10, the photoresist block 1310 is formed in an arc shape to cover the touch electrode block 1200 through a low-temperature curing reflow process, so that the area where light emitted by the array substrate 11 is fully emitted can be enlarged, which is beneficial to improving the light-emitting efficiency of the display substrate 10.
Based on the same inventive concept, the embodiment of the present application further provides a display device, which includes the above display substrate 10 provided in the embodiment of the present application. Since the display device includes the display substrate 10 provided in the embodiments of the present application, the display device has the same beneficial effects as the display substrate 10, and the description thereof is omitted here.
Specifically, the display device in the embodiment of the present application includes a mobile phone, a tablet computer, and the like, and may be determined according to actual conditions.
Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing a display substrate 10, as shown in fig. 13, including:
s101, providing an array substrate;
s102, manufacturing a touch functional layer on one side of the array substrate through a composition process, wherein the touch functional layer comprises a plurality of touch electrode blocks arranged at intervals;
s103, an optical function layer is manufactured on one side, far away from the array substrate, of the touch function layer, the optical function layer comprises a flattening layer and a plurality of photoresist blocks arranged at intervals, the photoresist blocks are located on one side, far away from the array substrate, of the touch electrode blocks and are in one-to-one correspondence with the touch electrode blocks, orthographic projections, on the array substrate, of the photoresist blocks are overlapped with orthographic projections, on the array substrate, of the touch electrode blocks, and the flattening layer covers the touch function layer and the photoresist blocks.
In the manufacturing method of the display substrate 10 provided in the embodiment of the application, by providing the photoresist block 1310 and the planarization layer 132, the light emitted by the array substrate 11 can be totally reflected at the boundary between the photoresist block 1310 and the planarization layer, so that the light emitted by the array substrate 11 can be concentrated right above the display substrate 10, and the brightness of the display substrate 10 is improved under a front viewing angle, thereby improving the light emitting efficiency of the display substrate 10. By reserving a part of the photoresist when the plurality of touch electrode blocks 1200 are manufactured by the composition process, a plurality of photoresist blocks 1310 can be formed, the manufacturing process is not additionally increased, the manufacturing cost is saved, a film structure capable of improving the light emitting efficiency is not required to be arranged, and the thickness of the display substrate 10 is reduced.
Optionally, the manufacturing of the touch functional layer 12 on one side of the array substrate 11 by a patterning process, and the manufacturing of the optical functional layer on one side of the touch functional layer 12 away from the array substrate 11 include:
manufacturing a first touch layer on one side of the array substrate through a composition process;
manufacturing an insulating layer on one side of the first touch layer, which is far away from the array substrate, and depositing a metal layer on the insulating layer;
coating photoresist on the metal layer, and exposing the photoresist by using a mask plate;
removing the exposed photoresist, and etching by using the residual photoresist as a mask to form a second touch layer, wherein the first touch layer and the second touch layer respectively comprise a plurality of touch electrode blocks arranged at intervals;
and manufacturing a planarization layer on one side of the reserved photoresist, which is far away from the array substrate, wherein the reserved photoresist is used as a plurality of photoresist blocks, and the planarization layer covers the photoresist blocks and the touch functional layer.
A detailed process of manufacturing the display substrate 10 according to the embodiment of the present application will be described in detail below with reference to the drawings.
Specifically, the patterning process in the embodiment of the present application includes a part or all of processes of coating, exposing, developing, etching, and removing the photoresist.
As shown in fig. 14a, firstly, an array substrate 11 is provided, where the array substrate 11 includes a substrate 110 and a plurality of light emitting devices 111 disposed on the substrate 110, a package layer 112 is disposed on the array substrate 11, and a specific manufacturing process of the array substrate 11 is similar to that of the prior art and is not described herein again.
As shown in fig. 14b, next, a first insulating layer 121 is formed on the side of the encapsulation layer 112 away from the substrate 110.
As shown in fig. 14c, a metal layer is deposited on the first insulating layer 121, and the metal layer is patterned by a patterning process to fabricate a plurality of touch electrode blocks 1200 on a side of the first insulating layer 121 away from the substrate 110, wherein the patterning process in this step includes a process of removing the photoresist on the touch electrode blocks 1200 after etching to form the first touch layer 123.
As shown in fig. 14d, next, a second insulating layer 122 is formed on a side of the first touch layer 123 away from the substrate 110, and the second insulating layer 122 covers the first touch layer 123.
As shown in fig. 14e, next, a metal layer 21 is deposited on a side of the second insulating layer 122 away from the substrate 110, and a material of the metal layer 21 may be specifically the same as a material of a metal layer forming the first touch layer 123, so as to save material cost.
As shown in fig. 14f, next, a photoresist 131 is coated on the surface of the metal layer 21 away from the substrate 110.
As shown in fig. 14g, the photoresist 131 is exposed by the mask 40, and the light-transmitting portion of the mask 40 corresponds to a region of the photoresist 131 where the photoresist block 1310 is not required to be formed, and the light-shielding portion of the mask 40 corresponds to a region of the photoresist 131 where the photoresist block 1310 is required to be formed.
As shown in fig. 14h, the exposed photoresist 131 is developed, specifically, the exposed portion of the photoresist 131 is removed by a developing solution, and the remaining photoresist 131 remains, and the remaining photoresist 131 is used as a plurality of photoresist blocks 1310.
As shown in fig. 14i, the metal layer 21 is etched to form a second touch layer 124 including a plurality of touch electrode blocks 1200, and the first touch layer 123, the second touch layer 124, the first insulating layer 121, and the second insulating layer 122 form the touch function layer 12.
Note that in step 14f, the coated photoresist 131 may be a positive photoresist 131 (the exposed portion is dissolved by the solvent) or a negative photoresist 131 (the unexposed portion is dissolved by the solvent, and the exposed portion is cured). If the different photoresists 131 are exposed with different masks 40 (the mask 40 in fig. 14g is the mask 40 used when the photoresist 131 is a positive photoresist), and the photoresist blocks 1310 may be exposed again after step 14i if the photoresist 131 is a negative photoresist 131, so as to further cure the photoresist blocks 1310.
As shown in fig. 14j, next, a planarization layer 132 is formed on the side of the touch functional layer 12 away from the array substrate 11, and the photoresist block 1310 and the touch functional layer 12 are covered by the planarization layer 132. The refractive index of the material of the planarization layer 132 is greater than that of the material of the photoresist block 1310, and the photoresist block 1310 and the planarization layer 132 constitute the optical function layer 13.
It should be noted that before the planarization layer 132 is formed, the black matrix 141 (not shown in fig. 14 j) may be formed on the surface of the photoresist block 1310 away from the substrate 110, or at least one refractive index matching layer 15 (not shown in fig. 14 j) may be formed on the surface of the photoresist block 1310 away from the substrate 110 to reduce the reflection of the ambient light. The concrete can be determined according to actual conditions.
In a specific embodiment, after the optical function layer 13 is fabricated on the side of the touch function side away from the array substrate 11, the method further includes:
and manufacturing a black matrix on one side of the photoresist block, which is far away from the array substrate, wherein the orthographic projection of the black matrix on the array substrate is overlapped with the orthographic projection of the photoresist block on the array substrate.
Specifically, as shown in fig. 14k, after the optical function layer 13 is manufactured, a composite function layer 14 (including the black matrix 141 and the color filter 142) is provided, the composite function layer 14 is attached to the side of the optical function layer 13 away from the substrate 110, and the black matrices 141 are in one-to-one correspondence with the photoresist blocks 1310.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
1. in the embodiment of the application, by arranging the photoresist block 1310 and the planarization layer 132, the light emitted by the array substrate 11 can be totally reflected at the boundary between the photoresist block 1310 and the planarization layer, so that the light emitted by the array substrate 11 can be concentrated right above the display substrate 10, the brightness of the display substrate 10 is improved under the front viewing angle, and the improvement of the light emitting efficiency of the display substrate 10 is realized. By reserving a part of the photoresist 131 when the plurality of touch electrode blocks 1200 are manufactured by the composition process, a plurality of photoresist blocks 1310 can be formed, the manufacturing process is not additionally increased, the manufacturing cost is saved, a film structure capable of improving the light emitting efficiency is not required to be arranged, and the thickness of the display substrate 10 is reduced.
2. By arranging the plurality of protrusions 1311 and the plurality of grooves 1312 on the surface of the side of the photoresist block 1310 away from the array substrate 11, that is, the surface of the photoresist block 1310 forms an uneven surface by arranging the plurality of protrusions 1311 and the plurality of grooves 1312, when external ambient light irradiates the surface of the photoresist block 1310, diffuse reflection occurs, that is, the direction of the reflected light is not concentrated in one direction, so that the phenomenon that the light reflection is severe when human eyes are at a certain viewing angle can be improved.
3. In the embodiment of the present application, by disposing the black matrix 141 on the side of the photoresist block 1310 far from the array substrate 11, the orthogonal projection of the black matrix 141 on the array substrate 11 overlaps the orthogonal projection of the photoresist block 1310 on the array substrate 11, and after the external ambient light is reflected on the surface of the photoresist block 1310 (the interface between the photoresist block 1310 and the planarization layer 132), the black matrix 141 can block and absorb the reflected light, thereby improving the light reflection phenomenon of the display substrate 10.
4. By disposing the index matching layer 15 between the photoresist block 1310 and the planarization layer 132, the refractive index gradient between the planarization layer 132 and the photoresist block 1310 is reduced, even though there is a slow transition of refractive index between the planarization layer 132 and the photoresist block 1310, thereby reducing the total reflection of ambient light from the optically denser medium (the planarization layer 132) into the optically thinner medium (the photoresist block 1310), and improving the light reflection phenomenon of the display substrate 10.
5. In the embodiment of the application, the photoresist block 1310 is formed by a low-temperature curing reflow process to cover the touch electrode block 1200 in an arc shape, so that the area where the light emitted by the array substrate 11 is fully emitted can be enlarged, which is beneficial to improving the light-emitting efficiency of the display substrate 10.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. A display substrate, comprising:
an array substrate;
the touch functional layer is arranged on one side of the array substrate and comprises a plurality of touch electrode blocks arranged at intervals;
the optical function layer is arranged on one side, far away from the array substrate, of the touch function layer and comprises a flattening layer and a plurality of photoresist blocks arranged at intervals, the photoresist blocks are located on one side, far away from the array substrate, of the touch electrode blocks and are in one-to-one correspondence with the touch electrode blocks, orthographic projections of the photoresist blocks on the array substrate are overlapped with orthographic projections of the touch electrode blocks on the array substrate, the flattening layer covers the touch function layer and the photoresist blocks, and the refractive index of the photoresist blocks is smaller than that of the flattening layer.
2. The display substrate of claim 1, wherein a surface of the photoresist block on a side away from the array substrate is provided with a plurality of protrusions and a plurality of grooves.
3. The display substrate according to claim 1, wherein a side of the photoresist block away from the array substrate is provided with a black matrix, and an orthographic projection of the black matrix on the array substrate overlaps with an orthographic projection of the photoresist block on the array substrate.
4. The display substrate of claim 3, wherein an area of the black matrix orthographically projected on the array substrate is smaller than an area of the photoresist blocks orthographically projected on the array substrate.
5. The display substrate of claim 1, wherein a side of the photoresist block away from the array substrate is provided with at least one index matching layer, and the index matching layer has a refractive index greater than that of the photoresist block and less than that of the planarization layer.
6. The display substrate according to any one of claims 1 to 5, wherein the photoresist block covers the touch electrode block.
7. A display device comprising the display substrate according to any one of claims 1 to 6.
8. A method for manufacturing a display substrate is characterized by comprising the following steps:
providing an array substrate;
manufacturing a touch functional layer on one side of the array substrate through a composition process, wherein the touch functional layer comprises a plurality of touch electrode blocks arranged at intervals;
the touch control functional layer is kept away from one side of the array substrate is manufactured to form an optical functional layer, the optical functional layer comprises a planarization layer and a plurality of photoresist blocks arranged at intervals, the photoresist blocks are located on one side, away from the array substrate, of the touch control electrode blocks and are in one-to-one correspondence with the touch control electrode blocks, orthographic projections of the photoresist blocks on the array substrate and orthographic projections of the touch control electrode blocks on the array substrate are overlapped, and the planarization layer covers the touch control functional layer and the photoresist blocks.
9. The manufacturing method according to claim 8, wherein the manufacturing of the touch functional layer on the side of the array substrate by the patterning process and the manufacturing of the optical functional layer on the side of the touch functional layer away from the array substrate comprise:
manufacturing a first touch layer on one side of the array substrate through a composition process;
manufacturing an insulating layer on one side of the first touch layer, which is far away from the array substrate, and depositing a metal layer on the insulating layer;
coating photoresist on the metal layer, and exposing the photoresist by using a mask;
removing the exposed photoresist, and etching by using the residual photoresist as a mask to form a second touch layer, wherein the first touch layer and the second touch layer respectively comprise a plurality of touch electrode blocks arranged at intervals;
and manufacturing a planarization layer on one side of the reserved photoresist far away from the array substrate, wherein the reserved photoresist serves as a plurality of photoresist blocks, and the planarization layer covers the plurality of photoresist blocks and the touch control function layer.
10. The manufacturing method according to claim 8, further comprising, after manufacturing an optical function layer on a side of the touch function side away from the array substrate:
and manufacturing a black matrix on one side of the photoresist block, which is far away from the array substrate, wherein the orthographic projection of the black matrix on the array substrate is overlapped with the orthographic projection of the photoresist block on the array substrate.
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| WO2018223691A1 (en) * | 2017-06-05 | 2018-12-13 | 京东方科技集团股份有限公司 | Method for manufacturing array substrate, array substrate and display apparatus |
| CN111584594A (en) * | 2020-05-25 | 2020-08-25 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method thereof |
| WO2020224317A1 (en) * | 2019-05-09 | 2020-11-12 | 京东方科技集团股份有限公司 | Color filter substrate, liquid crystal display device, manufacturing method for color filter substrate, and manufacturing method for liquid crystal display device |
| US20210226175A1 (en) * | 2020-12-29 | 2021-07-22 | Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. | Display panel, method for manufacturing the same, and display device |
| CN113193152A (en) * | 2021-04-29 | 2021-07-30 | 京东方科技集团股份有限公司 | Display substrate and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018223691A1 (en) * | 2017-06-05 | 2018-12-13 | 京东方科技集团股份有限公司 | Method for manufacturing array substrate, array substrate and display apparatus |
| WO2020224317A1 (en) * | 2019-05-09 | 2020-11-12 | 京东方科技集团股份有限公司 | Color filter substrate, liquid crystal display device, manufacturing method for color filter substrate, and manufacturing method for liquid crystal display device |
| CN111584594A (en) * | 2020-05-25 | 2020-08-25 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method thereof |
| US20210226175A1 (en) * | 2020-12-29 | 2021-07-22 | Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. | Display panel, method for manufacturing the same, and display device |
| CN113193152A (en) * | 2021-04-29 | 2021-07-30 | 京东方科技集团股份有限公司 | Display substrate and display device |
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