CN114444429B - Chip filter manufacturing method and system - Google Patents
Chip filter manufacturing method and system Download PDFInfo
- Publication number
- CN114444429B CN114444429B CN202111581358.4A CN202111581358A CN114444429B CN 114444429 B CN114444429 B CN 114444429B CN 202111581358 A CN202111581358 A CN 202111581358A CN 114444429 B CN114444429 B CN 114444429B
- Authority
- CN
- China
- Prior art keywords
- capacitance
- value
- inductance
- actual value
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
Abstract
The application provides a method and a system for manufacturing a chip filter, which take a key device filter of a receiving and transmitting system as a research object and provide a method for designing the chip filter. By adopting a preset data analysis model and a microwave simulation model, the automatic design of the gallium arsenide chip filter is realized, a user only needs to input the concerned parameters, the filter configuration parameters can be generated in the middle process without manual intervention, the time of a chip designer is saved, and the design efficiency is improved.
Description
Technical Field
The application relates to the field of chip filter design and manufacture, in particular to a chip filter manufacturing method and system.
Background
With the development of the data analysis field and the gradual application of artificial intelligence technology from research trend, the multi-disciplinary fusion becomes a popular subject of research in recent years. The radar systems at home and abroad are gradually developing to the direction of chip integration. In the face of radar and communication systems with diversified frequency bands, how to save chip design time and improve design efficiency are important points of research.
Disclosure of Invention
In order to solve at least one of the above problems, a first aspect of the present application provides a method for manufacturing a chip filter, including:
obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
and manufacturing a filter according to the filter configuration parameters.
Further, the obtaining the filter element value according to the index parameter and combining a preset data analysis model includes:
inputting index parameters into the data analysis model;
the data analysis model outputs the order required by the filter and the normalized value of each component;
and according to the index parameter and the normalized value, combining scaling transformation and translation transformation, and converting to obtain the filter element value.
Further, the obtaining the microstrip line actual value and the difference between the capacitance inductance theoretical value and the actual value according to a preset microwave simulation model includes:
invoking the microwave simulation model to acquire the actual value of the capacitance and the actual value of the microstrip line;
carrying out parameterization simulation on the characteristic quantity of the inductor by combining the microwave simulation model to form a capacitance-inductance database;
and carrying out tolerance analysis on the capacitance-inductance database by adopting the data analysis model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance-inductance.
Further, according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance, including:
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a mapping table of the theoretical value and the actual value of the capacitance, the inductance and the microstrip line;
and generating a simulation result of the capacitance and the inductance by combining the microwave simulation model according to the capacitance, the inductance and the mapping table of the theoretical value and the actual value of the microstrip line.
Further, the generating the simulation result according to the mapping table of the theoretical value and the actual value of the capacitance, the inductance and the microstrip line and the microwave simulation model includes:
obtaining capacitance inductance size information according to the data analysis model and the difference value between the theoretical value and the actual value of the capacitance inductance;
and obtaining a simulation result of the capacitance and inductance according to the capacitance and inductance size information and the microwave simulation model.
A second aspect of the present application provides a chip filter manufacturing system, including:
component value confirmation module: obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
and the data acquisition and analysis module is used for: acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
and a data simulation module: according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
the design diagram confirming module: comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
the filter manufacturing module: and manufacturing a filter according to the filter configuration parameters.
Further, the component value confirmation module includes:
index input unit: inputting index parameters into the data analysis model;
normalized value output unit: the data analysis model outputs the order required by the filter and the normalized value of each component;
element value confirmation unit: and according to the index parameter and the normalized value, combining scaling transformation and translation transformation, and converting to obtain the filter element value.
Further, the data acquisition and analysis module includes:
a data acquisition unit: invoking the microwave simulation model to acquire the actual value of the capacitance and the actual value of the microstrip line;
parameterized simulation unit: carrying out parameterization simulation on the characteristic quantity of the inductor by combining the microwave simulation model to form a capacitance-inductance database;
a data analysis unit: and carrying out tolerance analysis on the capacitance-inductance database by adopting the data analysis model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance-inductance.
A third aspect of the present application provides an electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the steps of any of the above described chip filter manufacturing methods when executing the computer program.
A fourth aspect of the present application provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of the chip filter manufacturing method of any one of the above.
The beneficial effects of the application are that
The application provides a method and a system for manufacturing a chip filter, which take a key device filter of a receiving and transmitting system as a research object and provide a method for designing the chip filter. By adopting a preset data analysis model and a microwave simulation model, the automatic design of the gallium arsenide chip filter is realized, a user only needs to input the concerned parameters, the filter configuration parameters can be generated in the middle process without manual intervention, the time of a chip designer is saved, and the design efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained from them without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a method for manufacturing a chip filter according to an embodiment of the application;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The application provides a method for manufacturing a chip filter, which is shown in fig. 1, and comprises the following steps:
obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
and manufacturing a filter according to the filter configuration parameters.
In some other embodiments, the obtaining the filter element value according to the index parameter in combination with a preset data analysis model includes:
inputting index parameters into the data analysis model;
the data analysis model outputs the order required by the filter and the normalized value of each component;
and according to the index parameter and the normalized value, combining scaling transformation and translation transformation, and converting to obtain the filter element value.
In some other embodiments, the obtaining the actual value of the microstrip line and the difference between the theoretical value and the actual value of the capacitance and inductance according to a preset microwave simulation model includes:
invoking the microwave simulation model to acquire the actual value of the capacitance and the actual value of the microstrip line;
carrying out parameterization simulation on the characteristic quantity of the inductor by combining the microwave simulation model to form a capacitance-inductance database;
and carrying out tolerance analysis on the capacitance-inductance database by adopting the data analysis model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance-inductance.
In some other embodiments, the obtaining, according to the actual value of the microstrip line and the difference between the theoretical value and the actual value of the capacitance and inductance, the simulation result of the capacitance and inductance by combining the data analysis model includes:
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a mapping table of the theoretical value and the actual value of the capacitance, the inductance and the microstrip line;
and generating a simulation result of the capacitance and the inductance by combining the microwave simulation model according to the capacitance, the inductance and the mapping table of the theoretical value and the actual value of the microstrip line.
In some other embodiments, the generating the simulation result according to the mapping table of the theoretical value and the actual value of the capacitance, the inductance and the microstrip line in combination with the microwave simulation model includes:
obtaining capacitance inductance size information according to the data analysis model and the difference value between the theoretical value and the actual value of the capacitance inductance;
and obtaining a simulation result of the capacitance and inductance according to the capacitance and inductance size information and the microwave simulation model.
Another aspect of the present application provides a chip filter manufacturing system, including:
component value confirmation module: obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
and the data acquisition and analysis module is used for: acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
and a data simulation module: according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
the design diagram confirming module: comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
the filter manufacturing module: and manufacturing a filter according to the filter configuration parameters.
In some other embodiments, the component value confirmation module includes:
index input unit: inputting index parameters into the data analysis model;
normalized value output unit: the data analysis model outputs the order required by the filter and the normalized value of each component;
element value confirmation unit: and according to the index parameter and the normalized value, combining scaling transformation and translation transformation, and converting to obtain the filter element value.
In some other embodiments, the data acquisition analysis module comprises:
a data acquisition unit: invoking the microwave simulation model to acquire the actual value of the capacitance and the actual value of the microstrip line;
parameterized simulation unit: carrying out parameterization simulation on the characteristic quantity of the inductor by combining the microwave simulation model to form a capacitance-inductance database;
a data analysis unit: and carrying out tolerance analysis on the capacitance-inductance database by adopting the data analysis model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance-inductance.
It can be understood that the data licensing model is data analysis software Python, the microwave simulation model is microwave simulation software ADS, referring to fig. 1, the chip filter manufacturing method of the present application includes: the element values of the filter schematic diagram are determined, the ideal capacitance and inductance are converted into actual inductance and capacitance, the characteristic quantity of conversion of the capacitance value and the chip capacitance parameter, the characteristic quantity of conversion of the inductance value and the chip inductance parameter, the microstrip line and multiport structure for connecting the capacitance and inductance, and the three-dimensional data of the capacitance: three-dimensional data of capacitance, size, frequency, inductance: three-dimensional data of inductance value, size, frequency, microstrip line: the size, the relation between the front and back stage inductance and capacitance position, the tolerance of the relative variation of inductance and capacitance along with the frequency variation, the data simulation, the establishment of a table look-up and mapping, the generation of layout simulation by a circuit comprising actual capacitance inductance parameters, the comparison of theory and actual indexes, the output of simulation patterns as an objective function and the generation of a layout.
In the technical method, the element value of the filter schematic diagram is determined, and the method is characterized in that a chebyshev filter is selected as a research object. Receiving, by the data analysis software Python, user input index parameters, comprising: center frequency, bandwidth, amount of attenuation, ripple characteristics. The insertion loss function characteristics of the low-pass filter are described by using chebyshev polynomials, the required orders of the filter and the normalized values of all components are reversely deduced according to the attenuation input by a user, and then the low-pass filter prototype is converted into a band-pass filter by using proportional conversion and translational conversion according to the center frequency and bandwidth indexes, so that the determination of the values of components of a filter principle graph is completed.
In the technical method, the conversion from ideal capacitance inductance to actual inductance and capacitance comprises the following steps: the converted characteristic quantity of the capacitance value and the chip capacitance parameter; three-dimensional data of capacitance: capacitance, size, frequency; the inductance value and the converted characteristic quantity of the chip inductance parameter; three-dimensional data of inductance: inductance value, size, frequency; a microstrip line and a multiport structure connected with the capacitor inductor; three-dimensional data of microstrip line: size and inductance and capacitance position relation of the front and back stages. The theoretical value and the actual value of the capacitance and the inductance are different, and the actual values of the capacitance and the inductance are determined by the capacitance and the inductance under specific frequency, the inductance value, the actual capacitance and the inductance; the actual value of the microstrip line connected with the capacitor inductor is determined by the size of the microstrip line under specific frequency and the relative position relation of the front-stage inductor and the back-stage inductor and the capacitor. The collection and extraction of the capacitance inductance and the actual value of the microstrip line can be completed by automatically calling the microwave simulation software ADS.
In the embodiment of the application, the relative variation tolerance of the inductance and the capacitance along with the frequency variation is that the theoretical inductance and the capacitance value do not change along with the frequency variation, and the actual inductance and the capacitance value change along with the frequency variation. The theoretical value and the actual value are different in different frequency states, so that the relative variation tolerance is generated. Due to the specificity of the plane structure of the chip spiral inductor, the characteristic quantity of the spiral inductor is calculated by ADS software: the method comprises the steps of carrying out parameterization simulation on an inner diameter d, a turn number t, a line width w and a gap s to obtain inductance values under different combination states of four characteristic quantities, so as to form a database of capacitance and inductance. And performing tolerance analysis on the database by adopting Python software to obtain the difference value between the theoretical capacitance inductance value and the actual capacitance inductance value.
In the embodiment of the application, the data simulation, table lookup and mapping table establishment process adopts data analysis software python to collect the difference between theoretical and actual capacitance inductance values through a character string classification and region searching method in a data analysis method to form a mapping table from capacitance, inductance and microstrip line theory to actual values.
In the embodiment of the application, the actual capacitance and inductance parameter circuit generates layout simulation, and in the program of automatically calling ADS by the data analysis software Python, the difference value is compensated to the theoretical inductance and capacitance value to form new capacitance and inductance size information, and the new capacitance and inductance size information is returned to the bottom code operated by the ADS program to perform layout simulation of the actual capacitance and inductance parameter.
In the embodiment of the application, the theory is compared with the actual index, the data analysis software Python is adopted, the condition judgment is carried out through the comparison of the theory and the actual simulation result, and if the range of the difference from the index value is within the acceptable range, the layout is generated; if the range of the difference from the index value exceeds the tolerance, returning to the tolerance of the relative variation of the inductance and the capacitance along with the frequency change, changing the relative variation, and carrying out layout simulation again.
In the embodiment of the application, the theoretical output simulation graph is used as an objective function and is used as a reference condition of an actual layout simulation result, if the theoretical output simulation graph meets the index, the theoretical output simulation graph passes through, and if the theoretical output simulation graph does not meet the index, the theoretical output simulation graph returns.
In the embodiment of the application, the generated layout, the theoretical simulation result and the actual simulation result are consistent, and the realization process of the automatic simulation of the chip filter is completed.
As can be seen from the above description, the present application provides a method and a system for manufacturing a chip filter, and a method for designing a chip filter using a key device filter of a transceiver system as a research object. By adopting a preset data analysis model and a microwave simulation model, the automatic design of the gallium arsenide chip filter is realized, a user only needs to input the concerned parameters, the filter configuration parameters can be generated in the middle process without manual intervention, the time of a chip designer is saved, and the design efficiency is improved.
In order to save chip design time from a hardware level, the present application provides an embodiment of an electronic device for implementing all or part of the content in the chip filter manufacturing method, where the electronic device specifically includes the following contents:
fig. 2 is a schematic block diagram of a system configuration of an electronic device 9600 according to an embodiment of the present application. As shown in fig. 2, the electronic device 9600 may include a central processor 9100 and a memory 9140; the memory 9140 is coupled to the central processor 9100. Notably, this fig. 2 is exemplary; other types of structures may also be used in addition to or in place of the structures to implement telecommunications functions or other functions.
In one embodiment, the chip filter fabrication design functions may be integrated into the central processor. Wherein the central processor may be configured to control:
obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
and manufacturing a filter according to the filter configuration parameters.
As can be seen from the above description, the present application provides an electronic device, which uses a key device filter of a transceiver system as a research object, and provides a method for designing a chip filter. By adopting a preset data analysis model and a microwave simulation model, the automatic design of the gallium arsenide chip filter is realized, a user only needs to input the concerned parameters, the filter configuration parameters can be generated in the middle process without manual intervention, the time of a chip designer is saved, and the design efficiency is improved.
In another embodiment, the chip filter fabrication system may be configured separately from the central processor 9100, for example, the chip filter fabrication system may be configured as a chip connected to the central processor 9100, and the chip filter fabrication function is implemented by control of the central processor.
As shown in fig. 2, the electronic device 9600 may further include: a communication module 9110, an input unit 9120, an audio processor 9130, a display 9160, and a power supply 9170. It is noted that the electronic device 9600 need not include all of the components shown in fig. 2; in addition, the electronic device 9600 may further include components not shown in fig. 2, and reference may be made to the related art.
As shown in fig. 2, the central processor 9100, sometimes referred to as a controller or operational control, may include a microprocessor or other processor device and/or logic device, which central processor 9100 receives inputs and controls the operation of the various components of the electronic device 9600.
The memory 9140 may be, for example, one or more of a buffer, a flash memory, a hard drive, a removable media, a volatile memory, a non-volatile memory, or other suitable device. The information about failure may be stored, and a program for executing the information may be stored. And the central processor 9100 can execute the program stored in the memory 9140 to realize information storage or processing, and the like.
The input unit 9120 provides input to the central processor 9100. The input unit 9120 is, for example, a key or a touch input device. The power supply 9170 is used to provide power to the electronic device 9600. The display 9160 is used for displaying display objects such as images and characters. The display may be, for example, but not limited to, an LCD display.
The memory 9140 may be a solid state memory such as Read Only Memory (ROM), random Access Memory (RAM), SIM card, etc. But also a memory which holds information even when powered down, can be selectively erased and provided with further data, an example of which is sometimes referred to as EPROM or the like. The memory 9140 may also be some other type of device. The memory 9140 includes a buffer memory 9141 (sometimes referred to as a buffer). The memory 9140 may include an application/function storage portion 9142, the application/function storage portion 9142 storing application programs and function programs or a flow for executing operations of the electronic device 9600 by the central processor 9100.
The memory 9140 may also include a data store 9143, the data store 9143 for storing data, such as contacts, digital data, pictures, sounds, and/or any other data used by an electronic device. The driver storage portion 9144 of the memory 9140 may include various drivers of the electronic device for communication functions and/or for performing other functions of the electronic device (e.g., messaging applications, address book applications, etc.).
The communication module 9110 is a transmitter/receiver 9110 that transmits and receives signals via an antenna 9111. A communication module (transmitter/receiver) 9110 is coupled to the central processor 9100 to provide input signals and receive output signals, as in the case of conventional mobile communication terminals.
Based on different communication technologies, a plurality of communication modules 9110, such as a cellular network module, a bluetooth module, and/or a wireless local area network module, etc., may be provided in the same electronic device. The communication module (transmitter/receiver) 9110 is also coupled to a speaker 9131 and a microphone 9132 via an audio processor 9130 to provide audio output via the speaker 9131 and to receive audio input from the microphone 9132 to implement usual telecommunications functions. The audio processor 9130 can include any suitable buffers, decoders, amplifiers and so forth. In addition, the audio processor 9130 is also coupled to the central processor 9100 so that sound can be recorded locally through the microphone 9132 and sound stored locally can be played through the speaker 9131.
The embodiment of the present application also provides a computer-readable storage medium capable of implementing all steps in the chip filter fabrication method in the above embodiment, the computer-readable storage medium storing a computer program thereon, the computer program implementing all steps in the chip filter fabrication method in which the execution subject in the above embodiment is a server or a client when executed by a processor, for example, the processor implementing the steps when executing the computer program of:
obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
and manufacturing a filter according to the filter configuration parameters.
As can be seen from the above description, the present application provides a computer readable storage medium, and a method for designing a chip filter using a key device filter of a transceiver system as a research object is provided. By adopting a preset data analysis model and a microwave simulation model, the automatic design of the gallium arsenide chip filter is realized, a user only needs to input the concerned parameters, the filter configuration parameters can be generated in the middle process without manual intervention, the time of a chip designer is saved, and the design efficiency is improved.
It will be apparent to those skilled in the art that embodiments of the present application may be provided as a method, apparatus, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (devices), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The principles and embodiments of the present application have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.
Claims (10)
1. A method of fabricating a chip filter, comprising:
obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
and manufacturing a filter according to the filter configuration parameters.
2. The method for manufacturing a chip filter according to claim 1, wherein the obtaining the filter element value according to the index parameter by combining a predetermined data analysis model includes:
inputting index parameters into the data analysis model;
the data analysis model outputs the order required by the filter and the normalized value of each component;
and according to the index parameter and the normalized value, combining scaling transformation and translation transformation, and converting to obtain the filter element value.
3. The method for manufacturing a chip filter according to claim 1, wherein the obtaining the actual value of the microstrip line and the difference between the theoretical value and the actual value of the capacitance and inductance according to a preset microwave simulation model comprises:
invoking the microwave simulation model to acquire the actual value of the capacitance and the actual value of the microstrip line;
carrying out parameterization simulation on the characteristic quantity of the inductor by combining the microwave simulation model to form a capacitance-inductance database;
and carrying out tolerance analysis on the capacitance-inductance database by adopting the data analysis model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance-inductance.
4. The method for manufacturing a chip filter according to claim 1, wherein the step of obtaining the simulation result of the capacitance and inductance by combining the data analysis model according to the actual value of the microstrip line and the difference between the theoretical value and the actual value of the capacitance and inductance comprises:
according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a mapping table of the theoretical value and the actual value of the capacitance, the inductance and the microstrip line;
and generating a simulation result of the capacitance and the inductance by combining the microwave simulation model according to the capacitance, the inductance and the mapping table of the theoretical value and the actual value of the microstrip line.
5. The method for manufacturing a chip filter according to claim 4, wherein the generating the simulation result by combining the microwave simulation model according to the mapping table of the theoretical values and the actual values of the capacitance, the inductance and the microstrip line comprises:
obtaining capacitance inductance size information according to the data analysis model and the difference value between the theoretical value and the actual value of the capacitance inductance;
and obtaining a simulation result of the capacitance and inductance according to the capacitance and inductance size information and the microwave simulation model.
6. A chip filter fabrication system, comprising:
component value confirmation module: obtaining a filter element value by combining a preset data analysis model according to index parameters, wherein the index parameters comprise center frequency, bandwidth, attenuation and ripple characteristics;
and the data acquisition and analysis module is used for: acquiring the actual value of the capacitance and the actual value of the microstrip line according to a preset microwave simulation model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and the inductance;
and a data simulation module: according to the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance and inductance, combining the data analysis model to obtain a simulation result of the capacitance and inductance;
the design diagram confirming module: comparing the simulation result with the capacitance-inductance theoretical value by adopting the data analysis model, and generating a filter configuration parameter if the error of the simulation result and the capacitance-inductance theoretical value accords with a standard condition;
the filter manufacturing module: and manufacturing a filter according to the filter configuration parameters.
7. The chip filter manufacturing system according to claim 6, wherein the component value confirmation module includes:
index input unit: inputting index parameters into the data analysis model;
normalized value output unit: the data analysis model outputs the order required by the filter and the normalized value of each component;
element value confirmation unit: and according to the index parameter and the normalized value, combining scaling transformation and translation transformation, and converting to obtain the filter element value.
8. The chip filter manufacturing system according to claim 6, wherein the data acquisition analysis module comprises:
a data acquisition unit: invoking the microwave simulation model to acquire the actual value of the capacitance and the actual value of the microstrip line;
parameterized simulation unit: carrying out parameterization simulation on the characteristic quantity of the inductor by combining the microwave simulation model to form a capacitance-inductance database;
a data analysis unit: and carrying out tolerance analysis on the capacitance-inductance database by adopting the data analysis model to obtain the actual value of the microstrip line and the difference value between the theoretical value and the actual value of the capacitance-inductance.
9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the steps of the chip filter manufacturing method of any one of claims 1 to 5 when the computer program is executed by the processor.
10. A computer readable storage medium having stored thereon a computer program, characterized in that the computer program when executed by a processor realizes the steps of the chip filter manufacturing method according to any of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111581358.4A CN114444429B (en) | 2021-12-22 | 2021-12-22 | Chip filter manufacturing method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111581358.4A CN114444429B (en) | 2021-12-22 | 2021-12-22 | Chip filter manufacturing method and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114444429A CN114444429A (en) | 2022-05-06 |
| CN114444429B true CN114444429B (en) | 2023-09-01 |
Family
ID=81363666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111581358.4A Active CN114444429B (en) | 2021-12-22 | 2021-12-22 | Chip filter manufacturing method and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114444429B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105024131A (en) * | 2015-08-05 | 2015-11-04 | 中国电子科技集团公司第五十四研究所 | Design method for microwave cavity band-pass filter |
| US9405875B1 (en) * | 2015-11-13 | 2016-08-02 | Resonant Inc. | Simulating effects of temperature on acoustic microwave filters |
| CN206134906U (en) * | 2016-10-20 | 2017-04-26 | 南京信息工程大学 | Miniaturized 3dB directional coupler |
| CN107169232A (en) * | 2017-06-09 | 2017-09-15 | 京信通信系统（中国）有限公司 | The extracting method and device of acoustic wave filter circuit model parameters |
| CN107508565A (en) * | 2017-08-29 | 2017-12-22 | 北京邮电大学 | A kind of wideband power amplifer of discontinuous band operation |
-
2021
- 2021-12-22 CN CN202111581358.4A patent/CN114444429B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105024131A (en) * | 2015-08-05 | 2015-11-04 | 中国电子科技集团公司第五十四研究所 | Design method for microwave cavity band-pass filter |
| US9405875B1 (en) * | 2015-11-13 | 2016-08-02 | Resonant Inc. | Simulating effects of temperature on acoustic microwave filters |
| CN206134906U (en) * | 2016-10-20 | 2017-04-26 | 南京信息工程大学 | Miniaturized 3dB directional coupler |
| CN107169232A (en) * | 2017-06-09 | 2017-09-15 | 京信通信系统（中国）有限公司 | The extracting method and device of acoustic wave filter circuit model parameters |
| CN107508565A (en) * | 2017-08-29 | 2017-12-22 | 北京邮电大学 | A kind of wideband power amplifer of discontinuous band operation |
Non-Patent Citations (1)
| Title |
|---|
| 高可靠性发夹型带通滤波器的设计与制作;李艳江 等;《电子元件与材料》;第29卷(第10期);54-57 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114444429A (en) | 2022-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109783555A (en) | Form templat storage method, device, storage medium and electronic equipment | |
| CN104102545B (en) | Mobile augmented reality browser three dimensional resource configures the optimization method with loading | |
| CN107545889A (en) | Suitable for the optimization method, device and terminal device of the model of pattern-recognition | |
| CN108959669A (en) | The Home Fashion & Design Shanghai method and system of intelligence | |
| CN104242876A (en) | On-die trim-able passive components for high volume manufacturing | |
| US8433944B2 (en) | Clock divider system and method with incremental adjustment steps while controlling tolerance in clock duty cycle | |
| CN107025037A (en) | A kind of control method and device of smart machine | |
| CN107408919A (en) | Tapped inductor voltage controlled oscillator | |
| CN105868196A (en) | Method for generating industrial data report in server | |
| CN110222407A (en) | A kind of fusion method and device of BIM data | |
| CN111353235A (en) | Component port modeling method based on model drive and terminal | |
| CN105678831A (en) | Image rendering method and apparatus | |
| CN114444429B (en) | Chip filter manufacturing method and system | |
| CN111210215B (en) | Bank payment path selection processing method and device and electronic equipment | |
| CN112735407B (en) | Dialogue processing method and device | |
| CN112560370A (en) | Chip design code generation method, terminal and storage medium | |
| CN116997901A (en) | Circuit design method and related equipment | |
| CN110008398B (en) | Data classification management recommendation method and device | |
| CN106802773A (en) | The management method and mobile terminal of a kind of memory space | |
| CN113887719B (en) | Model compression method and device | |
| CN115204092A (en) | Method and system for controlling expansion and shrinkage proportion of PCB (printed circuit board) and storable medium | |
| CN109669590A (en) | Method that progress is shown, intelligent terminal, storage device | |
| CN104866186A (en) | Character playing method and electronic equipment | |
| CN113849498A (en) | Index construction and query method | |
| CN104272294B (en) | Generate the method and system of particular system framework |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |