CN114443406A

CN114443406A - Processor temperature detection method and device, electronic equipment and computer storage medium

Info

Publication number: CN114443406A
Application number: CN202011203496.4A
Authority: CN
Inventors: 唐文海
Original assignee: MSI Computer Shenzhen Co Ltd
Current assignee: MSI Computer Shenzhen Co Ltd
Priority date: 2020-11-02
Filing date: 2020-11-02
Publication date: 2022-05-06

Abstract

The disclosure provides a processor temperature detection method and device, electronic equipment and a computer storage medium, and relates to the technical field of temperature measurement. The processor temperature detection method comprises the following steps: acquiring the working temperature fed back by a built-in performance testing tool of the processor; determining a temperature correction patch according to the working temperature and the preset temperature deviation; acquiring the actual working temperature of the processor detected by the embedded controller; and correcting the actual working temperature according to the temperature correction patch. Through the technical scheme disclosed by the invention, the detection temperature of the processor is corrected, so that the read actual working temperature is more accurate and reliable.

Description

Processor temperature detection method and device, electronic equipment and computer storage medium

Technical Field

The present disclosure relates to the field of temperature measurement technologies, and in particular, to a processor temperature detection method and apparatus, an electronic device, and a computer storage medium.

Background

Because a large number of power consumption components and complex circuit wiring are integrated in the processor, a large amount of heat is generated during the operation of the processor, and performance parameters such as the operating temperature and frequency of the processor must be monitored in order to ensure the reliability of the processor.

For example, the existing monitoring tool includes the following four new monitoring plug-in modules, and the read hardware data can include:

dll insert: and monitoring the read-write speed and the temperature of the hard disk.

Dll plug-in: and showing the performance counter of the hard disk of the operating system.

Aid a64.dll insert: reading a plurality of series of data of the temperature of the mainboard, the temperature/the rotating speed/the voltage of the CPU, and the PSU +3.3V/+5V/+ 12V.

HwInfo plug-in: the function is similar to AIDA64.

However, the temperature read by the aid a64.dll plug-in and the HwInfo plug-in is seriously deviated and is far higher than the actual operating temperature of the processor, and if the actual operating temperature is detected to be higher than the temperature threshold in advance, the processor is protected, for example, the operating frequency and power consumption of the processor are reduced, and a high-temperature alarm is issued, which obviously affects the operating performance of the processor and the use experience of a user.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

An object of the present disclosure is to provide a processor temperature detection method, apparatus, electronic device and computer storage medium, which overcome, at least to some extent, the problem of inaccurate actual operating temperature of a processor in the related art.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows, or in part will be obvious from the description, or may be learned by practice of the disclosure.

According to one aspect of the present disclosure, there is provided a processor temperature detection method, including: acquiring the working temperature fed back by a built-in performance testing tool of the processor; determining a temperature correction patch according to the working temperature and the preset temperature deviation; acquiring the actual working temperature of the processor detected by the embedded controller; and correcting the actual working temperature according to the temperature correction patch.

In one embodiment of the present disclosure, the operating temperature includes an idle state temperature, and determining the temperature correction patch according to the operating temperature and a preset temperature deviation includes: acquiring a temperature sampling value of the processor in an idle state according to a first preset time interval; and calculating the weighted average value of the sampling values in the idle state, and determining the sampling values as the idle state temperature.

In an embodiment of the present disclosure, the operating temperature further includes a non-idle state temperature, and determining the temperature correction patch according to the operating temperature and a preset temperature deviation further includes: acquiring a temperature sampling value of the processor in a non-idle state according to a second preset time interval; and calculating the weighted average value of the sampling values in the non-idle state, and determining the weighted average value as the non-idle state temperature.

In an embodiment of the present disclosure, determining the temperature correction patch according to the operating temperature and the preset temperature deviation further includes: and determining the corresponding relation among the working temperature, the preset temperature deviation and the preset actual working temperature, and determining the corresponding relation as the temperature correction patch.

In an embodiment of the present disclosure, correcting the actual operating temperature according to the temperature correction patch includes: and correcting the actual working temperature according to the actual working temperature, the preset actual working temperature and the corresponding relation.

In an embodiment of the present disclosure, the correcting the actual operating temperature according to the temperature correction patch further includes: determining version information of the temperature correction patch; determining version information of the embedded controller; determining a temperature deviation value for correcting the actual working temperature according to the version information of the temperature correction patch and the version information of the embedded controller; and correcting the actual working temperature according to the temperature deviation value.

In an embodiment of the present disclosure, the correcting the actual operating temperature according to the temperature correction patch further includes: determining an operating temperature range to which the actual operating temperature belongs; determining a thermal noise reduction coefficient according to the working temperature range; carrying out thermal noise reduction processing on the actual working temperature according to the thermal noise reduction coefficient; and correcting the actual working temperature after the thermal noise reduction treatment through the temperature correction patch.

According to another aspect of the present disclosure, there is provided a processor temperature detection apparatus including: the first acquisition module is used for acquiring the working temperature fed back by the built-in performance testing tool of the processor; the determining module is used for determining a temperature correction patch according to the working temperature and the preset temperature deviation; the second acquisition module is used for acquiring the actual working temperature of the processor detected by the embedded controller; and the correction module is used for correcting the actual working temperature according to the temperature correction patch.

According to still another aspect of the present disclosure, there is provided an electronic device including: a processor; and a memory for storing executable instructions for the processor; wherein the processor is configured to perform any one of the above-described processor temperature detection methods via execution of executable instructions.

According to yet another aspect of the present disclosure, there is provided a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the processor temperature detection method of any one of the above.

According to the processor temperature detection scheme provided by the embodiment of the disclosure, the temperature correction patch is determined through the working temperature and the preset temperature deviation, and then the actual working temperature is corrected through the temperature correction patch, so that the accuracy and the reliability of the actual working temperature are improved, the working performance of the processor is ensured, and the use experience of a user is favorably improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

FIG. 1 is a schematic diagram illustrating a processor temperature detection system configuration according to an embodiment of the present disclosure;

FIG. 2 is a flow chart illustrating a method for processor temperature detection in an embodiment of the present disclosure;

FIG. 3 is a flow chart illustrating another method of processor temperature detection in an embodiment of the present disclosure;

FIG. 4 is a flow chart illustrating a method for processor temperature detection in an embodiment of the present disclosure;

FIG. 5 is a flow chart illustrating a method for processor temperature detection in an embodiment of the present disclosure;

FIG. 6 is a flow chart illustrating a method for processor temperature detection in an embodiment of the present disclosure;

FIG. 7 is a flow chart illustrating a method for processor temperature detection in an embodiment of the present disclosure;

FIG. 8 is a schematic diagram illustrating a temperature test of a method for detecting a processor temperature according to an embodiment of the disclosure;

FIG. 9 is a schematic diagram illustrating a temperature test of another method for detecting a temperature of a processor according to an embodiment of the present disclosure;

FIG. 10 is a schematic diagram illustrating temperature testing of another method for detecting processor temperature in an embodiment of the present disclosure;

FIG. 11 is a schematic diagram illustrating a temperature test of another method for detecting a temperature of a processor according to an embodiment of the disclosure;

FIG. 12 is a schematic diagram illustrating a processor temperature sensing arrangement according to an embodiment of the present disclosure;

fig. 13 shows a schematic diagram of an electronic device in an embodiment of the disclosure.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor devices and/or microcontroller devices.

The scheme that this application provided, confirm the temperature correction patch through operating temperature and preset temperature deviation, and then revise actual operating temperature through the temperature correction patch to improve actual operating temperature's accuracy and reliability, with the working property of guaranteeing the treater, be favorable to promoting user's use and experience.

In embodiments of the present disclosure, involving the 3d mark technology, the following explanation is given:

the 3Dmark supports cross-platform test of a desktop and a mobile platform and supports test of Windows, Android, iOS and Windows RT system platforms.

Scenarios of different loads, FireStrike (designed for high-end products based on DirectX11 graphics), CloudGate (supporting mainstream hardware based on DirectX 10), and IceStorm (manufactured for entry-level DirectX9 devices).

In a brand-new interface, the 3d mark can give out a test score and also give out a real-time curve graph in each scene test period, and the frame rate, the CPU temperature, the GPU temperature and the CPU power consumption are recorded in the whole process.

The 3d park eliminates E, P, X and other grade division modes, and is replaced by pure numbers, and the 3d park has no uniform total score but only has four scene scores.

Required configuration of 3 Dmark: the operating system supports Windows 8, Windows 7, Windows Vista, Windows RT, iOS 5.0+, Android 3.1 +.

Windows lowest configuration for 3 Dmark: windows Vista system (DX 11 update patch must be installed), 1.8GHz dual-core processor, 2GB memory, DX9/SM3.0 video card and 3GB hard disk space.

Windows recommendation configuration for 3 Dmark: windows 7/8 system, 1.8GHz dual-core processor, 4GB memory, display card fully supporting all the characteristics of DX11, and 3GB hard disk space.

Windows RT configuration requirement for 3 Dmark: theoretically, all Windows RT system devices can run, but some products have low configuration and may not run all tests.

iOS lowest configuration for 3 Dmark: iOS 5.0 system, iPhone 4/iPad 2/iPod touch 5, 300MB storage space.

Android minimum configuration of 3 Dmark: an Android 3.1 system, a 1GB memory, an OpenGL ES 2.0 compatible graphics core and a 300MB storage space. Among them, OpenGL (Open Graphics Library) is a specification defining a cross-programming language, cross-platform programming interface, which is used for three-dimensional images (two-dimensional). OpenGL is a professional graphical program interface, and is a bottom-layer graphics library which is powerful in function and convenient to call.

Hereinafter, each step of the processor temperature detection method in the present exemplary embodiment will be described in more detail with reference to the drawings and examples.

FIG. 1 is a flow chart illustrating a method for detecting a processor temperature according to an embodiment of the disclosure. The method provided by the embodiment of the disclosure can be executed by any electronic equipment with computing processing capacity

As shown in fig. 1, a processor temperature detection method of an embodiment of the present disclosure includes the following steps:

and step S102, acquiring the working temperature fed back by the built-in performance testing tool of the processor.

And step S104, determining a temperature correction patch according to the working temperature and the preset temperature deviation.

And step S106, acquiring the actual working temperature of the processor detected by the embedded controller.

And S108, correcting the actual working temperature according to the temperature correction patch.

In the above embodiment, the temperature correction patch is determined by the working temperature and the preset temperature deviation, and then the actual working temperature is corrected by the temperature correction patch, so that the accuracy and reliability of the actual working temperature are improved, the working performance of the processor is ensured, and the use experience of a user is promoted.

On the basis of the steps shown in fig. 1, as shown in fig. 2, the determining the temperature correction patch according to the deviation between the operating temperature and the preset temperature includes:

step S2042, obtaining a temperature sampling value of the processor in an idle state according to a first preset time interval.

Step S2044, calculating a weighted average of the sampling values in the idle state, and determining the weighted average as the idle state temperature.

In the above embodiment, by obtaining the temperature sampling value of the processor in the idle state at the first preset time interval, and by calculating the weighted average value of the sampling values in the idle state and determining the sampling value as the idle state temperature, a more accurate and reliable idle state temperature can be obtained.

The first predetermined time interval may be set to a millisecond, such as 10 milliseconds, 100 milliseconds, 1000 milliseconds, etc., but is not limited thereto. The idle state temperature may be determined, for example, every 5 seconds.

On the basis of the steps shown in fig. 1, as shown in fig. 3, the determining the temperature correction patch according to the operating temperature and the preset temperature deviation further includes:

step S3042, obtaining a temperature sampling value of the processor in a non-idle state according to a second preset time interval.

Step S3044, calculating a weighted average of the sampling values in the non-idle state, and determining the weighted average as the non-idle state temperature.

In the above embodiment, more accurate and reliable non-idle state temperature can be obtained by obtaining temperature sampling values of the processor in a non-idle state at a second preset time interval, calculating a weighted average of the sampling values in the non-idle state, and determining the sampling values as the non-idle state temperature.

The second predetermined time interval may be set to a millisecond, such as 10 milliseconds, 100 milliseconds, 1000 milliseconds, etc., but is not limited thereto. The non-idle state temperature may be determined, for example, every 5 seconds.

Based on the steps shown in fig. 1, as shown in fig. 4, determining the temperature correction patch according to the operating temperature and the preset temperature deviation further includes:

step S4042, determining the corresponding relationship between the working temperature, the preset temperature deviation and the preset actual working temperature, and determining the corresponding relationship as the temperature correction patch.

In the above embodiment, by determining the corresponding relationship among the operating temperature, the preset temperature deviation, and the preset actual operating temperature, the corresponding relationship is packed into the temperature correction patch according to the time sequence, so as to improve the reliability, accuracy, and timeliness of correcting the actual operating temperature.

Based on the steps shown in fig. 1 and fig. 4, as shown in fig. 5, the correcting the actual operating temperature according to the temperature correction patch includes:

and S5082, correcting the actual working temperature according to the actual working temperature, the preset actual working temperature and the corresponding relation.

In the above embodiment, the actual working temperature is corrected according to the actual working temperature, the preset actual working temperature and the corresponding relationship, so as to obtain a more accurate actual working temperature, so that the running performance of the processor is fully exerted, and the use experience of a user is improved.

Based on the steps shown in fig. 1, as shown in fig. 6, the correcting the actual operating temperature according to the temperature correction patch further includes:

step S6082, determine version information of the temperature correction patch.

Step S6084, determine version information of the embedded controller.

Step S6086, determining a temperature deviation value for correcting the actual working temperature according to the version information of the temperature correction patch and the version information of the embedded controller.

And step S6088, correcting the actual working temperature according to the temperature deviation value.

In the above embodiment, whether the temperature correction patch needs to be added to the embedded controller is determined according to the version information of the temperature correction patch and the version information of the embedded controller, for example, if the version of the temperature correction patch is lower than the version of the thermal information detection tool, the embedded controller does not need to be packed with the patch, and the data interaction amount, the memory pressure, and the time duration for updating the thermal information detection tool are reduced.

Based on the steps shown in fig. 1, as shown in fig. 7, the correcting the actual operating temperature according to the temperature correction patch further includes:

step S7082, determining an operating temperature range to which the actual operating temperature belongs.

And step S7084, determining a thermal noise reduction coefficient according to the working temperature range.

And S7086, performing thermal noise reduction treatment on the actual working temperature according to the thermal noise reduction coefficient.

And step S7088, correcting the actual working temperature after the thermal noise reduction treatment through the temperature correction patch.

In the above example, the working temperature range to which the actual working temperature belongs is determined, the actual working temperature is subjected to the thermal noise reduction treatment according to the thermal noise reduction coefficient, and the actual working temperature subjected to the thermal noise reduction treatment is corrected through the temperature correction patch, so that the noise interference of the actual working temperature is favorably reduced, and the reliability, the timeliness and the stability of the actual working temperature are further improved.

It is noted that the above-mentioned figures are merely schematic illustrations of processes involved in methods according to exemplary embodiments of the present disclosure, and are not intended to be limiting. It will be readily understood that the processes shown in the above figures are not intended to indicate or limit the chronological order of the processes. In addition, it is also readily understood that these processes may be performed synchronously or asynchronously, e.g., in multiple modules.

As will be appreciated by one skilled in the art, aspects of the present disclosure may be embodied as a system, method or program product. Accordingly, various aspects of the present disclosure may be embodied in the form of: an entirely hardware embodiment, an entirely software embodiment (including firmware, microcode, etc.) or an embodiment combining hardware and software aspects that may all generally be referred to herein as a "circuit," module "or" system.

Referring to fig. 8 to 11, a temperature correction method according to another embodiment of the present disclosure is shown.

The processor temperature measurement results shown in fig. 8 to 11 are summarized in tables 1 and 2 below.

TABLE 1 temperature test results of old embedded controllers on processors

	Performance testing tool	Thermal information
			3dmark test	95℃	100℃
Idle test	46.8℃	56℃

TABLE 2 temperature test results for embedded controller to processor with temperature correction patch

	Performance testing tool	Thermal information
			3dmark test	95℃	95℃
Idle test	60.9℃	59℃

The inventor, in conjunction with a number of practices, has learned from the processor temperature sensing schemes shown in fig. 8-11, table 1 and table 2 that the embedded controller uses ThermalInfo to read that the APU temperature is significantly higher than the APU actual temperature, and a new temperature revision patch is added to the embedded controller, and the use of ThermalInfo to read that the APU temperature substantially coincides with the APU actual operating temperature.

The performance testing tool is built in the processor, i.e. a built-in performance testing tool, and is usually provided by the manufacturer of the processor, for example, if the processor produced by AMD is temperature tested, i.e. the built-in performance testing tool is preferably, but not limited to, the ADM System deck.

In one embodiment, the new temperature revision patch reduces the average temperature of the APU read for 5 seconds by 5 ℃, and under the condition of not increasing the cost, the temperature revision patch of the embedded controller is modified to enable a user to obtain the temperature closer to the actual temperature of the APU when the user reads the temperature of the APU by using a temperature reading tool, so that better experience is brought to the user, and the running performance of the processor is fully exerted.

The processor temperature detection apparatus 1200 according to this embodiment of the present disclosure is described below with reference to fig. 12. The processor temperature detection apparatus 1200 shown in fig. 12 is only an example, and should not bring any limitation to the function and the scope of use of the embodiments of the present disclosure.

The processor temperature detection apparatus 1200 is represented in the form of a hardware module. The components of the processor temperature detection device 1200 may include, but are not limited to: a first acquisition module 1202, a determination module 1204, a second acquisition module 1206, and a correction module 1208.

The first obtaining module 1202 is configured to obtain an operating temperature fed back by a built-in performance testing tool of a processor.

A determining module 1204, configured to determine a temperature correction patch according to the operating temperature and a preset temperature deviation.

A second obtaining module 1206, configured to obtain an actual operating temperature of the processor detected by the embedded controller.

A correcting module 1208, configured to correct the actual operating temperature according to the temperature correction patch.

An electronic device 1300 according to this embodiment of the disclosure is described below with reference to fig. 13. The electronic device 1300 shown in fig. 13 is only an example and should not bring any limitations to the function and scope of use of the embodiments of the present disclosure.

As shown in fig. 13, the electronic device 1300 is in the form of a general purpose computing device. The components of the electronic device 1300 may include, but are not limited to: the at least one processing unit 1310, the at least one memory unit 1320, and the bus 1330 connecting the various system components including the memory unit 1320 and the processing unit 1310.

Where the memory unit stores program code, the program code may be executed by the processing unit 1310 to cause the processing unit 1310 to perform the steps according to various exemplary embodiments of the present disclosure described in the above section "exemplary methods" of this specification. For example, the processing unit 1310 may perform the method steps as shown in the figures, as well as other steps defined in the processor temperature detection methods of the present disclosure.

The storage 1320 may include readable media in the form of volatile memory units, such as a random access memory unit (RAM)13201 and/or a cache memory unit 13202, and may further include a read-only memory unit (ROM) 13203.

Storage unit 1320 may also include a program/utility 13204 having a set (at least one) of program modules 13205, such program modules 13205 including, but not limited to: a powered device, one or more application programs, other program modules, and program data, each of which examples or some combination thereof may include an implementation of a network environment.

Bus 1330 may be any bus representing one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

The electronic device 1300 may also communicate with one or more external devices 1340 (e.g., keyboard, pointing device, bluetooth device, etc.), with one or more devices that enable a user to interact with the electronic device, and/or with any devices (e.g., router, modem, etc.) that enable the electronic device 1300 to communicate with one or more other computing devices. Such communication may occur via input/output (I/O) interfaces 1350. Also, the electronic device 1300 may communicate with one or more networks (e.g., a Local Area Network (LAN), a Wide Area Network (WAN), and/or a public network, such as the internet) through the network adapter 1360. As shown, the network adapter 1360 communicates with the other modules of the electronic device 1300 via the bus 1330. It should be appreciated that although not shown in the figures, other hardware and/or software modules may be used in conjunction with the electronic device, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems, among others.

Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein may be implemented by software, or by software in combination with necessary hardware. Therefore, the technical solution according to the embodiments of the present disclosure may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (which may be a CD-ROM, a usb disk, a removable hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which may be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the embodiments of the present disclosure.

In an exemplary embodiment of the present disclosure, there is also provided a computer-readable storage medium having stored thereon a program product capable of implementing the above-described method of the present specification. In some possible embodiments, various aspects of the disclosure may also be implemented in the form of a program product comprising program code for causing a terminal device to perform the steps according to various exemplary embodiments of the disclosure described in the above-mentioned "exemplary methods" section of this specification, when the program product is run on the terminal device.

According to the program product for implementing the above method of the embodiments of the present disclosure, it may employ a portable compact disc read only memory (CD-ROM) and include program codes, and may be run on a terminal device, such as a personal computer. However, the program product of the present disclosure is not limited thereto, and in this document, a readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

A computer readable signal medium may include a propagated data signal with readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A readable signal medium may also be any readable medium that is not a readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.

Program code embodied on a readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

Program code for carrying out operations for the present disclosure may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server. In the case of a remote computing device, the remote computing device may be connected to the user computing device through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computing device (e.g., through the internet using an internet service provider).

It should be noted that although in the above detailed description several modules or units of the device for action execution are mentioned, such a division is not mandatory. Indeed, the features and functionality of two or more modules or units described above may be embodied in one module or unit, according to embodiments of the present disclosure. Conversely, the features and functions of one module or unit described above may be further divided into embodiments by a plurality of modules or units.

Moreover, although the steps of the methods of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that the steps must be performed in this particular order, or that all of the depicted steps must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc.

Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein may be implemented by software, or by software in combination with necessary hardware. Therefore, the technical solution according to the embodiments of the present disclosure may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (which may be a CD-ROM, a usb disk, a removable hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which may be a personal computer, a server, a mobile terminal, or a network device, etc.) to execute the method according to the embodiments of the present disclosure.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A method for detecting processor temperature, comprising:

acquiring the working temperature fed back by a built-in performance testing tool of the processor;

determining a temperature correction patch according to the working temperature and the preset temperature deviation;

acquiring the actual working temperature of the processor detected by the embedded controller;

and correcting the actual working temperature according to the temperature correction patch.

2. The processor temperature detection method of claim 1, wherein the operating temperature comprises an idle state temperature, and wherein determining a temperature correction patch based on the operating temperature and a preset temperature deviation comprises:

acquiring a temperature sampling value of the processor in an idle state according to a first preset time interval;

and calculating the weighted average value of the sampling values in the idle state, and determining the sampling values as the idle state temperature.

3. The processor temperature detection method of claim 1, wherein the operating temperature further comprises a non-idle state temperature, and wherein determining a temperature correction patch based on the operating temperature and a preset temperature deviation further comprises:

acquiring a temperature sampling value of the processor in a non-idle state according to a second preset time interval;

and calculating the weighted average value of the sampling values in the non-idle state, and determining the weighted average value as the non-idle state temperature.

4. The processor temperature detection method of claim 1, wherein determining a temperature correction patch based on the operating temperature and a preset temperature deviation further comprises:

and determining the corresponding relation among the working temperature, the preset temperature deviation and the preset actual working temperature, and determining the corresponding relation as the temperature correction patch.

5. The processor temperature detection method of claim 4, wherein correcting the actual operating temperature according to the temperature correction patch comprises:

and correcting the actual working temperature according to the actual working temperature, the preset actual working temperature and the corresponding relation.

6. The processor temperature detection method of any one of claims 1 to 5, wherein correcting the actual operating temperature according to the temperature correction patch further comprises:

determining version information of the temperature correction patch;

determining version information of the embedded controller;

determining a temperature deviation value for correcting the actual working temperature according to the version information of the temperature correction patch and the version information of the embedded controller;

and correcting the actual working temperature according to the temperature deviation value.

7. The processor temperature detection method of any one of claims 1 to 5, wherein correcting the actual operating temperature according to the temperature correction patch further comprises:

determining an operating temperature range to which the actual operating temperature belongs;

determining a thermal noise reduction coefficient according to the working temperature range;

carrying out thermal noise reduction processing on the actual working temperature according to the thermal noise reduction coefficient;

and correcting the actual working temperature after the thermal noise reduction treatment through the temperature correction patch.

8. A processor temperature detection apparatus, comprising:

the first acquisition module is used for acquiring the working temperature fed back by the built-in performance testing tool of the processor;

the determining module is used for determining a temperature correction patch according to the working temperature and the preset temperature deviation;

the second acquisition module is used for acquiring the actual working temperature of the processor detected by the embedded controller;

and the correction module is used for correcting the actual working temperature according to the temperature correction patch.

9. An electronic device, comprising:

a processor; and

a memory for storing executable instructions of the processor;

wherein the processor is configured to execute the processor temperature detection method of any one of claims 1-7 via execution of the executable instructions.

10. A computer-readable storage medium, on which a computer program is stored, the computer program, when being executed by a processor, implementing the processor temperature detection method according to any one of claims 1 to 7.