CN114441592A - Device and method for simulation test of performance of heat-conducting silicone grease in storage device - Google Patents

Abstract

The application discloses a device and a method for simulation test of performance of heat-conducting silicone grease in storage equipment, comprising the following steps: the chip simulation board and the shell simulation board are arranged oppositely and used for containing heat-conducting silicone grease, and a chip simulation piece used for simulating a chip in the storage device is arranged on the inner surface of the chip simulation board; the temperature regulating components are respectively arranged on the outer surfaces of the chip simulation board and the shell simulation board and are used for regulating the temperature of the chip simulation piece and the shell simulation board; the temperature sensors are arranged in the chip simulation board and the shell simulation board and are used for measuring the temperature of the chip simulation piece and the shell simulation board; the heat dissipation part is arranged on the outer side of the shell simulation plate and used for dissipating heat of the shell simulation plate; and the graduated scale is arranged on the inner surface of the shell simulation plate and is used for measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation plate. The device in this application can measure out the diffusion distance of silicon oil on the casing analog board in the heat conduction silicone grease, realizes the simulation detection of heat conduction silicone grease oil leak diffusion on storage device.

Description

A device and method for simulating and testing the performance of thermally conductive silicone grease in storage devices

technical field

The present application relates to the field of heat dissipation of storage devices, and in particular, to a device and method for simulating and testing the performance of thermally conductive silicone grease in storage devices.

Background technique

The storage device will generate a lot of power consumption when transferring stored data. For example, the solid state drive (SSD) can achieve an instantaneous current of 18A during high-speed data transmission, and the temperature generated by the chip can reach 80°C. Thermal grease is required in time. The heat is conducted to the surface of the SSD casing, and the SSD is dissipated through the external air cooling device of the server. Different thermal conductive silicone grease has different thermal conductivity and different silicone oil content. Thermal grease with higher silicone oil content will cause grease diffusion on the inner surface of the SSD casing. Under high pressure, the silicone oil will even diffuse out of the inner surface of the casing, causing oil stains on the outer surface of the SSD casing, contaminating the label, and affecting the customer's sense of use and the quality of the storage device. Therefore, it is very important to select a suitable thermal grease for the storage device, but there is currently a lack of testing and research on the diffusion of the silicone oil in the thermal grease on the housing of the storage device.

Therefore, how to solve the above technical problems should be the focus of those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of the present application is to provide a device and method for simulating and testing the performance of thermally conductive silicone grease in a storage device, so as to realize the diffusion detection of the silicone oil of the thermally conductive silicone grease on the housing of the storage device.

In order to solve the above-mentioned technical problems, the present application provides a device for simulating and testing the performance of thermally conductive silicone grease in a storage device, including:

The oppositely arranged chip simulation board and the shell simulation board are used for accommodating thermally conductive silicone grease, and the inner surface of the chip simulation board is provided with a chip simulation piece for simulating the chip in the storage device;

temperature adjustment components respectively arranged on the outer surfaces of the chip simulation board and the shell simulation board, for adjusting the temperature of the chip simulation piece and the shell simulation board;

temperature sensors arranged in the chip simulation board and the casing simulation board, for measuring the temperature of the chip simulation piece and the casing simulation board;

a heat dissipation component arranged on the outer side of the casing simulation board, used for radiating heat to the casing simulation board;

A scale set on the inner surface of the casing simulation board is used to measure the diffusion distance of the silicone oil in the thermal conductive silicone grease on the casing simulation board.

Optionally, also include:

The console connected with the temperature regulation component is used to control the temperature of the temperature regulation component disposed on the outer surface of the chip simulation board, and determine the temperature of the temperature regulation component according to the temperature of the chip simulation piece and the shell simulation board Thermal conductivity of thermal grease.

Optionally, the console is further configured to determine a comprehensive performance score of the thermally conductive silicone grease for the storage device and generate a test report according to the diffusion distance and the thermal conductivity.

Optionally, the console further includes:

a display for displaying the temperature of the chip simulation part and the casing simulation board, and the thermal conductivity.

Optionally, also include:

A track with a scale is used to adjust the distance between the chip simulation board and the housing simulation board, and the chip simulation board and the housing simulation board are arranged in the track.

The present application also provides a method for simulating and testing the performance of thermally conductive silicone grease in a storage device, comprising:

When the thermal grease is sandwiched between the chip simulation board and the shell simulation board, the chip simulation part and the shell simulation board in the chip simulation board are controlled to heat up to the first preset maximum temperature at the same time and maintain the first temperature. a preset time to diffuse the silicone oil in the thermally conductive silicone grease;

Controlling the temperature of the chip simulation part to the chip working temperature and maintaining it for a second preset time, and controlling the heat dissipation component to dissipate heat to the casing simulation board;

Use a scale to measure the diffusion distance of the silicone oil in the thermal conductive silicone grease on the housing simulation board.

Optionally, also include:

controlling the chip simulation piece to gradually increase from the ambient temperature to a second preset maximum temperature, and acquiring the temperature corresponding to the casing simulation board when the chip simulation piece is at a preset temperature node;

determining the difference between the preset temperature node and the corresponding temperature;

The thermal conductivity of the thermally conductive silicone grease is determined according to the difference and the number of the preset temperature nodes.

Optionally, the determining the thermal conductivity of the thermally conductive silicone grease according to the difference and the number of the preset temperature nodes includes:

The thermal conductivity is determined according to a first preset formula, and the first preset formula is:

M=(△T1+△T2+△T3+...+△Tn)/n

Among them, M is the thermal conductivity, n is the number of preset temperature nodes, ΔTi is the difference between the temperature corresponding to the i-th preset temperature node and the shell simulation board, 1≤i≤n.

Optionally, also include:

According to the diffusion distance and the thermal conductivity, a comprehensive performance score of the thermally conductive silicone grease for the storage device is determined and a test report is generated.

Optionally, determining the comprehensive performance score of the thermally conductive silicone grease for the storage device according to the diffusion distance and the thermal conductivity includes:

The comprehensive performance score is determined according to a second preset formula, and the second preset formula is:

Among them, Ta is the ambient temperature, M is the thermal conductivity, S is the diffusion distance, and N is the width of the chip analog.

A device for simulating and testing the performance of thermally conductive silicone grease in a storage device provided by the present application includes: a chip simulation board and a housing simulation board that are arranged opposite to each other for accommodating the thermally conductive silicone grease, and the inner surface of the chip simulation board is A chip simulation piece for simulating a chip in a storage device is provided; temperature adjustment components respectively arranged on the outer surfaces of the chip simulation board and the casing simulation board are used to adjust the chip simulation piece and the casing simulation board temperature; temperature sensors arranged in the chip simulation board and the shell simulation board are used to measure the temperature of the chip simulation piece and the shell simulation board; A heat-dissipating component is used to dissipate heat to the casing simulation board; a scale arranged on the inner surface of the casing simulation board is used to measure the diffusion distance of the silicone oil in the thermal conductive silicone grease on the casing simulation board .

It can be seen that the device in this application is provided with a shell simulation board for simulating the housing of the storage device and a chip simulation board for simulating the chip in the storage device, and the thermal grease is sandwiched between the shell simulation board and the chip simulation board, that is, the simulation The state of the thermal grease in the storage device is obtained, and the temperature adjustment component adjusts the temperature of the chip simulation part and the shell simulation board, which can accelerate the diffusion of the silicone oil in the thermal grease, and the temperature adjustment component and the heat dissipation component can simulate the chip and the heat dissipation component in the storage device. In the working environment of the shell simulation board, after the silicone oil spreads on the shell simulation board, the diffusion distance of the silicone oil can be measured through the scale, so as to realize the simulation detection of the oil leakage and diffusion of the thermal conductive silicone grease on the storage device, and then for the storage device Choose a suitable thermal grease.

In addition, the present application also provides a method with the above-mentioned advantages.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application or the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only For some embodiments of the present application, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a device for simulating and testing the performance of thermally conductive silicone grease in a storage device according to an embodiment of the present application;

2 is a flow chart for simulating the diffusion distance of silicone oil in thermally conductive silicone grease in a test storage device provided by an embodiment of the present application;

FIG. 3 is a flowchart for simulating and testing the thermal conductivity of thermally conductive silicone grease in a storage device according to an embodiment of the present application.

Detailed ways

In order to make those skilled in the art better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways different from those described herein, and those skilled in the art can do so without departing from the connotation of the present invention. Similar promotion, therefore, the present invention is not limited by the specific embodiments disclosed below.

As mentioned in the background section, different thermal greases have different silicone oil contents. Thermal grease can conduct heat generated by the chips of the storage device to the surface for heat dissipation. At the same time, the silicone oil in the thermal grease will be on the housing of the storage device. Diffusion occurs, and in severe cases, it spreads to the outer surface of the casing, affecting the quality of the storage device.

In view of this, the present application provides a device for simulating and testing the performance of thermal grease in storage devices, please refer to Figure 1, including:

The oppositely arranged chip simulation board 1 and the housing simulation board 2 are used for accommodating thermally conductive silicone grease, and the inner surface of the chip simulation board 1 is provided with a chip simulation piece for simulating a chip in a storage device;

The temperature regulating components 3 respectively arranged on the outer surfaces of the chip simulation board 1 and the housing simulation board 2 are used to adjust the temperature of the chip simulation piece and the housing simulation board 2;

The temperature sensors arranged in the chip simulation board 1 and the housing simulation board 2 are used to measure the temperature of the chip simulation piece and the housing simulation board 2;

The heat dissipation component arranged on the outer side of the housing simulation board 2 is used to dissipate heat to the housing simulation board 2;

The scale provided on the inner surface of the casing simulation plate 2 is used to measure the diffusion distance of the silicone oil in the thermal conductive silicone grease on the casing simulation plate 2 .

The material, internal groove, pattern size and other structures of the shell simulation board 2 completely simulate the shell of the storage device, ensuring that the shell simulation board 2 is consistent with the internal environment of the real storage device shell.

The material of the chip simulation board 1 is the same according to the material of the chip in the storage device, and the material, size, quantity and arrangement of the chip simulation piece and the chip are the same. The thermally conductive silicone grease is specifically arranged between the chip simulation part and the casing simulation board 2 .

The number of temperature sensors in the chip simulation board 1 is the same as that of the chip simulation pieces, and the installation positions are in the chip simulation pieces. The installation positions of the temperature sensors in the housing simulation board 2 correspond to the chip simulation pieces.

In order to make the temperature adjustment component 3 uniformly adjust the temperature of the chip simulation board 1 and the case simulation board 2 , the temperature adjustment component 3 is a temperature adjustment board and is provided on the outer surfaces of the chip simulation board 1 and the case simulation board 2 .

In the process of silicone oil diffusion measurement, the two temperature adjustment components 3 are first heated to the first preset maximum temperature, so that the silicone oil diffuses rapidly, so as to speed up the detection efficiency; The temperature rises at the board 1, and the outer side of the shell simulation board 2 is dissipated by the heat dissipation component.

The heat dissipation component may be a heat dissipation fan, which performs air cooling and heat dissipation on the casing analog board 2 .

In this application, the relationship between the scale and the casing simulation board 2 is not limited. For example, the scale can be integrated on the casing simulation board 2, and the scale can be integrated with the casing simulation board 2, or the scale can be glued to the casing. on analog board 2.

The device in this application is provided with a shell simulation board 2 that simulates the housing of the storage device and a chip simulation board 1 that simulates a chip in the storage device, and the thermally conductive silicone grease is sandwiched between the shell simulation board 2 and the chip simulation board 1, That is, the state of the thermal grease in the storage device is simulated, and the temperature adjustment part 3 adjusts the temperature of the chip simulation part and the shell simulation board 2, which can accelerate the diffusion of the silicone oil in the thermal grease, and the temperature adjustment part 3 and the heat dissipation part can simulate The working environment of the chip and the shell simulation board 2 in the storage device. After the silicone oil spreads on the shell simulation board 2, the diffusion distance of the silicone oil can be measured by the scale, so as to realize the oil leakage and diffusion of the thermal grease on the storage device. Simulate the detection, and then select the appropriate thermal grease for the storage device.

In an embodiment of the present application, the device for simulating and testing the performance of thermally conductive silicone grease in a storage device may further include: a console 4 connected to the temperature regulating component 3 for controlling the chip simulation board 1 The temperature of the temperature-adjusting component 3 on the outer surface is heated, and the thermal conductivity of the thermally conductive silicone grease is determined according to the temperature of the chip simulation piece and the housing simulation board 2 .

The connection between the console 4 and the temperature regulating component 3 may be wired connection, for example, through an I2C bus, a CAN bus, or the like. A controller is provided in the console 4 .

The console 4 can also be used to control the temperature of the two temperature regulating components 3 to simultaneously increase to the first preset maximum temperature when measuring the diffusion of the silicone oil, and to control the temperature regulating component 3 on the outer surface of the chip analog board 1 to increase the temperature to the chip operating temperature. When the chip analog is heated up to the working temperature, the temperature rise process is the same as the change of the working temperature of the chip from power-on to high power consumption state.

When measuring the thermal conductivity, the console 4 only needs to control the temperature adjustment component 3 outside the chip simulation class to heat up. Due to the existence of thermal grease, the temperature at the housing simulation board 2 will also increase.

The console 4 further includes: a display 5 for displaying the temperature of the chip simulation part and the casing simulation board 2 , and the thermal conductivity.

Further, the console 4 may also include an operating keyboard 6 for providing a human-computer interaction interface for selecting or setting the heating algorithm.

The device in this embodiment can not only measure the diffusion distance of silicone oil, but also measure the thermal conductivity of thermally conductive silicone grease. Effectively improve the efficiency and accuracy of thermal grease selection, and can select thermal grease more suitable for storage devices based on comprehensive evaluation.

Further, the console 4 is further configured to determine a comprehensive performance score of the thermally conductive silicone grease for the storage device and generate a test report according to the diffusion distance and the thermal conductivity.

On the basis of any of the foregoing embodiments, in an embodiment of the present application, the device for simulating the performance of the thermally conductive silicone grease in the testing storage device further includes:

A track 7 with a scale 8 is used to adjust the distance between the chip simulation board 1 and the housing simulation board 2 , and the chip simulation board 1 and the housing simulation board 2 are arranged in the track 7 .

The rail 7 may be provided on the upper surface of the console 4 .

Adjust the chip simulation board 1 and the shell simulation board 2 on the track 7, so as to adjust the pressure of the thermal grease, so as to accurately simulate the real thickness and pressure of the thermal grease between the chip and the shell of the storage device, and improve the thermal conductivity. and the detection accuracy of diffusion distance.

The present application also provides a method for simulating and testing the performance of thermal grease in a storage device, please refer to FIG. 2 , including:

Step S101 : when the thermal conductive silicone grease is sandwiched between the chip simulation board and the casing simulation board, control the chip simulation part and the casing simulation board in the chip simulation board to heat up to a first preset maximum temperature at the same time and The first preset time is maintained to diffuse the silicone oil in the thermally conductive silicone grease.

The purpose of this step is to simulate the working temperature of the chip and to accelerate the diffusion of the silicone oil in the thermal grease. The first preset maximum temperature is not limited in this application, and can be set by yourself, for example, it can be 85° C., 90° C., and so on. Similarly, the first preset time is not limited in this application, and can be set by yourself, for example, it can be 24 hours, or 30 hours, and so on.

The heating scheme of the chip simulation part and the shell simulation board is built in the console, that is, the scheme can be selected or input in the console. For example, the heating curve data can be input, so as to control the temperature adjustment components to change the temperature according to the heating curve data. .

Step S102 : control the temperature of the chip simulation component to increase to the chip working temperature and maintain the temperature for a second preset time, and control the heat dissipation component to dissipate heat from the casing simulation board.

The purpose of this step is to simulate the operation of the chip of the memory component.

The working temperature of the chip is determined according to the specific chip, and is not limited in this application. Further, the second preset time is also not limited in this application, for example, it may be 24 hours, or 28 hours, and so on.

Step S103 : using a scale to measure the diffusion distance of the silicone oil in the thermal conductive silicone grease on the housing simulation board.

The method in this embodiment accelerates the diffusion of thermal grease by controlling the chip simulation part and the casing simulation board to heat up to the first preset maximum temperature at the same time, and then simulates the working condition of the chip, that is, controls the chip simulation part to heat up to the chip working temperature , the shell simulation board is at the ambient temperature, the diffusion distance of the silicone oil is measured, and the simulation detection of the oil leakage and diffusion of the thermal conductive silicone grease on the storage device is realized, and then the appropriate thermal conductive silicone grease is selected for the storage device.

In an embodiment of the present application, the method further includes the measurement of thermal conductivity, please refer to FIG. 3 , including:

Step S201 : controlling the chip simulation piece to gradually increase from the ambient temperature to a second preset maximum temperature, and acquiring the temperature corresponding to the casing simulation board when the chip simulation piece is at a preset temperature node.

The second preset maximum temperature is the maximum temperature that the chip can withstand, which is determined according to the type of the chip. For example, the second preset maximum temperature may be 70°C, or 80°C, and so on.

It should be pointed out that the preset temperature node is not limited in this application, and can be set by yourself. For example, starting from the ambient temperature, the temperature of each integer point can be a preset temperature node, or, every 3°C, a temperature node can be set, and so on.

The heating rate of the chip simulation can be set by itself, for example, it increases by 1°C every 20 minutes, or 1.5°C every 20 minutes, and so on.

Due to the presence of thermal grease, when the chip simulation part heats up, the temperature at the housing simulation board will also gradually increase. It should be pointed out that, when acquiring the temperature at the housing analog board, it needs to be collected when the temperature of the chip analog part is stable, so as to improve the detection accuracy. Each preset temperature node corresponds to a temperature collected at the shell simulation board.

Step S202: Determine the difference between the preset temperature node and the corresponding temperature.

Subtract the corresponding temperature at the shell simulation plate from the preset temperature node.

Step S203: Determine the thermal conductivity of the thermally conductive silicone grease according to the difference and the number of the preset temperature nodes.

Specifically, the thermal conductivity is determined according to a first preset formula, and the first preset formula is:

M=(△T1+△T2+△T3+...+△Tn)/n (1)

Among them, M is the thermal conductivity, n is the number of preset temperature nodes, ΔTi is the difference between the temperature corresponding to the i-th preset temperature node and the shell simulation board, 1≤i≤n.

Further, in an embodiment of the present application, the method further includes: determining a comprehensive performance score of the thermally conductive silicone grease for the storage device and generating a test report according to the diffusion distance and the thermal conductivity.

The comprehensive performance score is determined as follows:

The comprehensive performance score is determined according to a second preset formula, and the second preset formula is:

Among them, Ta is the ambient temperature, M is the thermal conductivity, S is the diffusion distance, and N is the width of the chip analog.

The size of the chip simulation piece is equal to the size of the chip, that is, N is the width of the chip.

The larger the comprehensive performance score J, the better, with a full score of 100. When the diffusion distance S is greater than the chip width N, J is a negative number at this time, which proves that the oil leakage effect is extremely poor. The test report includes each group of temperature data records and the final comprehensive performance score.

Taking the device shown in Figure 1 as an example, the simulation test process of thermal grease in a solid-state hard disk will be described below.

First, evenly apply the thermal grease to be tested to the chip simulation part of the chip simulation board, adjust the distance between the chip simulation board and the casing simulation board, and adjust it to be consistent with the gap between the actual chip and the casing of the solid-state drive.

Step 1. Remove the chip simulation board from the track, and evenly apply the thermal conductive silicone grease to be tested to the surface of the chip simulation part of the chip simulation board;

Step 2. Install the chip simulation board in its original position, and adjust the distance between the chip simulation board and the casing simulation board to be consistent with the gap between the chip and the casing in the SSD;

Step 3. Set the maximum temperature that the chip can withstand on the console, and start the thermal conductivity test of thermal grease: After the console receives the test command, it will automatically carry out the preset test plan to adjust the temperature of the temperature control board on the outer surface of the chip simulation board. The temperature increases the temperature of the chip simulation board to 85°C. When each preset temperature node is reached, the temperature at the housing simulation board is obtained, and the thermal conductivity of the thermal grease is determined by formula (1);

Step 4. After the thermal conductivity test is completed, it will automatically enter the silicone oil diffusion test: first stabilize the temperature of the chip simulation board and the shell simulation board to the ambient temperature, and then control the two temperature adjustment boards to heat up at the same time, so that the chip simulation board and the shell simulation board are simulated. The temperature at the board is raised to 85°C at the same time, and maintained for 24 hours, and then enters the junction temperature difference alternating test, that is, only the temperature at the chip simulation board is raised to the chip operating temperature of 55°C, and the cooling fan dissipates the heat on the housing simulation board. To simulate the real working environment of the shell simulation board, remove the shell simulation board with a scale after 24 hours, read the diffusion distance S, and input it to the console through the operation keyboard;

Step 5. The console determines the comprehensive performance score of thermal grease according to formula (2) and generates a test report, which is used as a reference for selecting thermal grease for solid-state drives.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments may be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the description of the method.

The device and method for simulating and testing the performance of thermally conductive silicone grease in a storage device provided by the present application have been described in detail above. Specific examples are used herein to illustrate the principles and implementations of the present application, and the descriptions of the above embodiments are only used to help understand the methods and core ideas of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the principles of the present application, several improvements and modifications can also be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims (10)

1. An apparatus for simulating the performance of thermally conductive silicone in a test storage device, comprising:

the chip simulation board and the shell simulation board are arranged oppositely and used for containing heat-conducting silicone grease, and a chip simulation piece used for simulating a chip in the storage device is arranged on the inner surface of the chip simulation board;

the temperature regulating components are respectively arranged on the outer surfaces of the chip simulation plate and the shell simulation plate and are used for regulating the temperature of the chip simulation piece and the shell simulation plate;

the temperature sensors are arranged in the chip simulation board and the shell simulation board and are used for measuring the temperature of the chip simulation piece and the temperature of the shell simulation board;

the heat dissipation part is arranged on the outer side of the shell simulation plate and used for dissipating heat of the shell simulation plate;

and the graduated scale is arranged on the inner surface of the shell simulation plate and is used for measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation plate.

2. The apparatus for modeling performance of a thermally conductive silicone in a test storage device of claim 1, further comprising:

and the console is connected with the temperature regulating component and used for controlling the temperature of the temperature regulating component arranged on the outer surface of the chip simulation board to rise and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the temperatures of the chip simulation piece and the shell simulation board.

3. The apparatus of claim 2, wherein the console is further configured to determine a composite performance score for the thermal grease for the storage device and generate a test report based on the diffusion distance and the thermal conductivity.

4. The apparatus for modeling performance of a thermally conductive silicone in a test storage device of claim 2, wherein said console further comprises:

and the display is used for displaying the temperatures of the chip simulation piece and the shell simulation plate and the heat conductivity coefficient.

5. The apparatus for analog testing of the performance of a thermally conductive silicone grease in a memory device of any of claims 1 to 4, further comprising:

the track with scale is used for adjusting the chip simulation board with the interval of casing simulation board, the chip simulation board with the casing simulation board is located in the track.

6. A method for analog testing of the performance of thermally conductive silicone grease in a memory device, comprising:

when the heat-conducting silicone grease is clamped between the chip simulation board and the shell simulation board, controlling the chip simulation piece and the shell simulation board in the chip simulation board to simultaneously heat to a first preset maximum temperature and maintain for a first preset time so as to diffuse the silicone oil in the heat-conducting silicone grease;

controlling the temperature of the chip simulation part to rise to the working temperature of the chip and maintaining the working temperature for a second preset time, and controlling the heat dissipation part to dissipate heat of the shell simulation plate;

and measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation board by using a graduated scale.

7. The method for simulation testing the performance of a thermally conductive silicone grease in a memory device of claim 6, further comprising:

controlling the temperature of the chip simulation piece to gradually rise from the ambient temperature to a second preset maximum temperature, and acquiring the temperature corresponding to the shell simulation board when the chip simulation piece is at a preset temperature node;

determining the difference value between the preset temperature node and the corresponding temperature;

and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the difference and the number of the preset temperature nodes.

8. The method of claim 7, wherein determining the thermal conductivity of the thermally conductive silicone grease based on the difference and the number of predetermined temperature nodes comprises:

determining the heat conductivity coefficient according to a first preset formula, wherein the first preset formula is as follows:

M＝(△T1+△T2+△T3+...+△Tn)/n

wherein M is a heat conductivity coefficient, n is the number of preset temperature nodes, delta Ti is a difference value of the ith preset temperature node and the temperature corresponding to the shell simulation plate, and i is more than or equal to 1 and less than or equal to n.

9. The method for analog testing of the performance of a thermally conductive silicone grease in a memory device of claim 8 further comprising:

and determining the comprehensive performance score of the heat-conducting silicone grease on the storage equipment and generating a test report according to the diffusion distance and the heat conductivity coefficient.

10. The method of claim 9, wherein determining a composite performance score for the thermal grease for the storage device based on the diffusion distance and the thermal conductivity comprises:

determining the comprehensive performance score according to a second preset formula, wherein the second preset formula is as follows:

wherein Ta is the ambient temperature, M is the thermal conductivity, S is the diffusion distance, and N is the width of the chip simulation piece.

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