CN114441592A - Device and method for simulation test of performance of heat-conducting silicone grease in storage device - Google Patents
Device and method for simulation test of performance of heat-conducting silicone grease in storage device Download PDFInfo
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- CN114441592A CN114441592A CN202210109149.8A CN202210109149A CN114441592A CN 114441592 A CN114441592 A CN 114441592A CN 202210109149 A CN202210109149 A CN 202210109149A CN 114441592 A CN114441592 A CN 114441592A
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- 238000004088 simulation Methods 0.000 title claims abstract description 220
- 239000004519 grease Substances 0.000 title claims abstract description 92
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 86
- 238000012360 testing method Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000009792 diffusion process Methods 0.000 claims abstract description 44
- 229920002545 silicone oil Polymers 0.000 claims abstract description 21
- 230000001105 regulatory effect Effects 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 230000001276 controlling effect Effects 0.000 claims description 17
- 239000002131 composite material Substances 0.000 claims description 4
- 239000003921 oil Substances 0.000 abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052710 silicon Inorganic materials 0.000 abstract description 13
- 239000010703 silicon Substances 0.000 abstract description 13
- 238000001514 detection method Methods 0.000 abstract description 8
- 239000007787 solid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
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- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N2013/003—Diffusion; diffusivity between liquids
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Abstract
The application discloses a device and a method for simulation test of performance of heat-conducting silicone grease in storage equipment, comprising the following steps: the chip simulation board and the shell simulation board are arranged oppositely and used for containing heat-conducting silicone grease, and a chip simulation piece used for simulating a chip in the storage device is arranged on the inner surface of the chip simulation board; the temperature regulating components are respectively arranged on the outer surfaces of the chip simulation board and the shell simulation board and are used for regulating the temperature of the chip simulation piece and the shell simulation board; the temperature sensors are arranged in the chip simulation board and the shell simulation board and are used for measuring the temperature of the chip simulation piece and the shell simulation board; the heat dissipation part is arranged on the outer side of the shell simulation plate and used for dissipating heat of the shell simulation plate; and the graduated scale is arranged on the inner surface of the shell simulation plate and is used for measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation plate. The device in this application can measure out the diffusion distance of silicon oil on the casing analog board in the heat conduction silicone grease, realizes the simulation detection of heat conduction silicone grease oil leak diffusion on storage device.
Description
Technical Field
The application relates to the field of heat dissipation of storage equipment, in particular to equipment and a method for simulating and testing the performance of heat-conducting silicone grease in the storage equipment.
Background
The storage device generates a large amount of power consumption when transmitting stored data, for example, an instantaneous current of a Solid State Drive (SSD) can reach 18A in high-speed data transmission, a temperature generated by a chip can reach 80 ℃, heat is required to be transmitted to the surface of the SSD shell by the heat-conductive silicone grease in time, and the SSD is cooled by an external air cooling device of the server. Different heat conduction silicone grease coefficient of heat conductivity is different, and the silicon oil content is different, and the higher heat conduction silicone grease of silicon oil content can produce the grease diffusion at SSD casing internal surface, because the casing is to the phenomenon is inhaled to the hair of silicon oil, under certain high temperature environment and sufficient time, silicon oil can diffuse out the casing internal surface even, makes SSD casing surface produce the oil stain, pollutes the label, influences customer's use and feels and storage device quality. Therefore, it is very important to select a proper heat-conducting silicone grease for the storage device, but at present, a test research on the diffusion of the silicone oil in the heat-conducting silicone grease on the storage device shell is lacked.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The purpose of the application is to provide a device and a method for simulation test of the performance of heat-conducting silicone grease in storage equipment, so as to realize diffusion detection of silicone oil of the heat-conducting silicone grease on a storage equipment shell.
In order to solve the above technical problem, the present application provides an apparatus for simulation test of performance of thermal grease in a storage device, comprising:
the chip simulation board and the shell simulation board are arranged oppositely and used for containing heat-conducting silicone grease, and a chip simulation piece used for simulating a chip in the storage device is arranged on the inner surface of the chip simulation board;
the temperature regulating components are respectively arranged on the outer surfaces of the chip simulation board and the shell simulation board and are used for regulating the temperature of the chip simulation piece and the temperature of the shell simulation board;
the temperature sensors are arranged in the chip simulation board and the shell simulation board and are used for measuring the temperature of the chip simulation piece and the temperature of the shell simulation board;
the heat dissipation part is arranged on the outer side of the shell simulation plate and used for dissipating heat of the shell simulation plate;
and the graduated scale is arranged on the inner surface of the shell simulation plate and is used for measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation plate.
Optionally, the method further includes:
and the console is connected with the temperature regulating component and used for controlling the temperature of the temperature regulating component arranged on the outer surface of the chip simulation board to rise and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the temperatures of the chip simulation piece and the shell simulation board.
Optionally, the console is further configured to determine a comprehensive performance score of the thermal grease for the storage device and generate a test report according to the diffusion distance and the thermal conductivity.
Optionally, the console further includes:
and the display is used for displaying the temperatures of the chip simulation piece and the shell simulation plate and the heat conductivity coefficient.
Optionally, the method further includes:
the track with scale is used for adjusting the chip simulation board with the interval of casing simulation board, the chip simulation board with the casing simulation board is located in the track.
The present application also provides a method for simulation testing of performance of thermally conductive silicone grease in a memory device, comprising:
when the heat-conducting silicone grease is clamped between the chip simulation board and the shell simulation board, controlling the chip simulation piece and the shell simulation board in the chip simulation board to simultaneously heat to a first preset maximum temperature and maintain for a first preset time so as to diffuse the silicone oil in the heat-conducting silicone grease;
controlling the temperature of the chip simulation part to rise to the working temperature of the chip and maintaining the working temperature for a second preset time, and controlling the heat dissipation part to dissipate heat of the shell simulation plate;
and measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation board by using a graduated scale.
Optionally, the method further includes:
controlling the temperature of the chip simulation piece to gradually rise from the ambient temperature to a second preset maximum temperature, and acquiring the temperature corresponding to the shell simulation board when the chip simulation piece is at a preset temperature node;
determining the difference value between the preset temperature node and the corresponding temperature;
and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the difference and the number of the preset temperature nodes.
Optionally, the determining the heat conductivity of the heat conductive silicone grease according to the difference and the number of the preset temperature nodes includes:
determining the heat conductivity coefficient according to a first preset formula, wherein the first preset formula is as follows:
M＝(△T1+△T2+△T3+...+△Tn)/n
wherein M is a heat conductivity coefficient, n is the number of preset temperature nodes, delta Ti is a difference value of the ith preset temperature node and the temperature corresponding to the shell simulation plate, and i is more than or equal to 1 and less than or equal to n.
Optionally, the method further includes:
and determining the comprehensive performance score of the heat-conducting silicone grease on the storage equipment and generating a test report according to the diffusion distance and the heat conductivity coefficient.
Optionally, the determining, according to the diffusion distance and the thermal conductivity, the comprehensive performance score of the thermal grease for the storage device includes:
determining the comprehensive performance score according to a second preset formula, wherein the second preset formula is as follows:
wherein Ta is the ambient temperature, M is the thermal conductivity, S is the diffusion distance, and N is the width of the chip simulation piece.
The application provides an equipment for simulating heat conduction silicone grease performance in test storage equipment, includes: the chip simulation board and the shell simulation board are arranged oppositely and used for containing heat-conducting silicone grease, and a chip simulation piece used for simulating a chip in the storage device is arranged on the inner surface of the chip simulation board; the temperature regulating components are respectively arranged on the outer surfaces of the chip simulation board and the shell simulation board and are used for regulating the temperature of the chip simulation piece and the temperature of the shell simulation board; the temperature sensors are arranged in the chip simulation board and the shell simulation board and are used for measuring the temperature of the chip simulation piece and the temperature of the shell simulation board; the heat dissipation part is arranged on the outer side of the shell simulation plate and used for dissipating heat of the shell simulation plate; and the graduated scale is arranged on the inner surface of the shell simulation plate and is used for measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation plate.
It can be seen that, be equipped with the casing analog board of simulation storage device casing and the chip analog board of chip in the simulation storage device in the equipment in this application, press from both sides heat conduction silicone grease between casing analog board and chip analog board, simulate the state of heat conduction silicone grease in storage device promptly, the temperature of temperature regulating part regulation chip analog piece and casing analog board, can accelerate the diffusion of silicon oil in the heat conduction silicone grease, and temperature regulating part and radiating part can simulate the operational environment of chip and casing analog board in the storage device, after the silicon oil takes place to diffuse on the casing analog board, can measure the diffusion distance of silicon oil through the scale, realize the simulation detection of heat conduction silicone grease diffusion on storage device, and then select suitable heat conduction silicone grease for storage device.
In addition, the application also provides a method with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an apparatus for simulating performance of a thermal grease in a memory device according to an embodiment of the present disclosure;
FIG. 2 is a flow chart for simulation testing of the diffusion distance of silicone oil in thermally conductive silicone grease in a storage device according to an embodiment of the present disclosure;
fig. 3 is a flowchart for simulation testing of thermal conductivity of a thermal grease in a memory device according to an embodiment of the present disclosure.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, different heat conductive silicone greases have different silicone oil contents, and the heat conductive silicone greases can conduct heat generated by chips of storage devices to the surface for heat dissipation, and meanwhile, silicone oil in the heat conductive silicone greases can diffuse on the shell of the storage devices and can diffuse to the outer surface of the shell in serious cases, thereby affecting the quality of the storage devices.
In view of the above, the present application provides an apparatus for simulating performance of thermal grease in a memory device, please refer to fig. 1, which includes:
the device comprises a chip simulation board 1 and a shell simulation board 2 which are oppositely arranged and used for containing heat-conducting silicone grease, wherein a chip simulation piece used for simulating a chip in storage equipment is arranged on the inner surface of the chip simulation board 1;
the temperature adjusting parts 3 are respectively arranged on the outer surfaces of the chip simulation board 1 and the shell simulation board 2 and are used for adjusting the temperature of the chip simulation piece and the shell simulation board 2;
the temperature sensors are arranged in the chip simulation board 1 and the shell simulation board 2 and are used for measuring the temperature of the chip simulation piece and the temperature of the shell simulation board 2;
the heat dissipation part is arranged on the outer side of the shell simulation plate 2 and used for dissipating heat of the shell simulation plate 2;
and the graduated scale is arranged on the inner surface of the shell simulation plate 2 and is used for measuring the diffusion distance of the silicon oil in the heat-conducting silicone grease on the shell simulation plate 2.
The material, the inner groove, the pattern size and other structures of the shell simulation board 2 completely simulate the shell of the storage device, and the shell simulation board 2 is ensured to be consistent with the inner environment of the shell of the real storage device.
The material quality of the chip simulation board 1 is the same according to the core sheet material quality in the storage device, and the material, size, quantity and arrangement mode of the chip simulation piece and the chip are consistent. The heat conductive silicone grease is specifically provided between the chip simulation member and the case simulation board 2.
The number of the temperature sensors in the chip simulation board 1 is the same as that of the chip simulation pieces, the mounting positions of the temperature sensors in the shell simulation board 2 are in the chip simulation pieces, and the mounting positions of the temperature sensors in the shell simulation board 2 correspond to the chip simulation pieces.
In order to enable the temperature adjusting component 3 to uniformly adjust the temperature of the chip simulation board 1 and the shell simulation board 2, the temperature adjusting component 3 is a temperature adjusting board and is arranged on the outer surfaces of the chip simulation board 1 and the shell simulation board 2.
In the silicone oil diffusion measurement process, the two temperature regulating parts 3 are heated to a first preset maximum temperature firstly, so that the silicone oil is diffused quickly, and the detection efficiency is accelerated; and then, simulating the working condition of the chip in the storage device, only heating the chip simulation board 1, and radiating the heat of the shell simulation board 2 by a radiating component.
The heat dissipation part can be a heat dissipation fan and carries out air cooling heat dissipation on the shell simulation board 2.
Do not restrict in this application to the relation of scale and casing simulation board 2, for example the scale can be integrated on casing simulation board 2, with casing simulation board 2 structure as an organic whole, perhaps, the scale bonds on casing simulation board 2.
Be equipped with the chip analog board 1 of chip in the casing analog board 2 and the analog storage equipment of analog storage equipment casing in the equipment in this application, press from both sides heat conduction silicone grease between casing analog board 2 and chip analog board 1, simulate the state of heat conduction silicone grease in storage equipment promptly, the temperature of temperature regulating part 3 regulation chip analog piece and casing analog board 2, can accelerate the diffusion of silicon oil in the heat conduction silicone grease, and temperature regulating part 3 and radiating part can simulate the operational environment of chip and casing analog board 2 in the storage equipment, silicon oil takes place the diffusion back on casing analog board 2, can measure the diffusion distance of silicon oil through the scale, realize the analog detection of heat conduction silicone grease oil leak diffusion on storage equipment, and then select suitable heat conduction silicone grease for storage equipment.
In one embodiment of the present application, the apparatus for simulating performance of a thermally conductive silicone in a test storage device may further comprise: and the console 4 is connected with the temperature regulating component 3 and is used for controlling the temperature of the temperature regulating component 3 arranged on the outer surface of the chip simulation board 1 to rise and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the temperatures of the chip simulation piece and the shell simulation board 2.
The console 4 and the temperature control element 3 may be connected by wire, for example, by an I2C bus, a CAN bus, or the like. A controller is provided in the console 4.
The control console 4 can also be used for controlling the two temperature adjusting components 3 to be heated to a first preset highest temperature and controlling the temperature adjusting components 3 on the outer surface of the chip simulation board 1 to be heated to the working temperature of the chip when measuring the diffusion of the silicone oil, and when the temperature adjusting components are controlled to be heated to the working temperature, the heating process is the same as the change condition of the working temperature of the chip from power-on to high power consumption state.
When measuring the heat conductivity coefficient, the console 4 only needs to control the temperature adjusting component 3 outside the chip simulation team to increase the temperature, and due to the existence of the heat-conducting silicone grease, the temperature at the shell simulation board 2 also increases.
The console 4 further comprises: and the display 5 is used for displaying the temperatures of the chip simulation piece and the shell simulation plate 2 and the heat conductivity coefficient.
Further, the console 4 may further include an operation keyboard 6 for providing a man-machine interface to select or set the warming algorithm.
The device in the embodiment can realize measurement of the diffusion distance of the silicon oil and measurement of the heat conductivity coefficient of the heat-conducting silicone grease. The efficiency and the accuracy of heat conduction silicone grease selection are effectively improved, and heat conduction silicone grease more suitable for storage equipment can be selected according to comprehensive evaluation.
Further, the console 4 is further configured to determine a comprehensive performance score of the thermal grease for the storage device according to the diffusion distance and the thermal conductivity, and generate a test report.
On the basis of any one of the above embodiments, in an embodiment of the present application, the apparatus for simulating performance of a thermal grease in a test storage device further includes:
and the track 7 is provided with scales 8 and is used for adjusting the distance between the chip simulation board 1 and the shell simulation board 2, and the chip simulation board 1 and the shell simulation board 2 are arranged in the track 7.
The rail 7 may be provided on the upper surface of the console 4.
The chip simulation board 1 and the shell simulation board 2 are adjusted on the rail 7, so that the pressure on the heat-conducting silicone grease is adjusted, the real thickness and pressure of the heat-conducting silicone grease between the chip and the shell of the storage device are accurately simulated, and the detection accuracy of the heat conductivity coefficient and the diffusion distance is improved.
The present application further provides a method for simulating performance of thermal grease in a memory device, please refer to fig. 2, which includes:
step S101: when the heat-conducting silicone grease is clamped between the chip simulation board and the shell simulation board, the chip simulation piece in the chip simulation board and the shell simulation board are controlled to be heated to a first preset maximum temperature simultaneously and maintained for a first preset time, so that silicone oil in the heat-conducting silicone grease is diffused.
The purpose of this step is to simulate the working temperature of the chip and accelerate the diffusion of the silicone oil in the heat-conducting silicone grease. The first preset maximum temperature is not limited in this application, and may be set by itself, for example, 85 ℃, 90 ℃, and the like. Similarly, the first preset time is not limited in this application, and may be set by itself, for example, 24 hours, or 30 hours, and so on.
The temperature raising schemes of the chip simulator and the case simulator are built in the console, that is, the schemes are selected, or the temperature raising profile data may be input into the console, for example, so that the temperature regulating member is controlled to change the temperature according to the temperature raising profile data.
Step S102: and controlling the temperature of the chip simulation part to rise to the working temperature of the chip and maintaining the working temperature for a second preset time, and controlling the heat dissipation part to dissipate heat of the shell simulation plate.
The purpose of this step is to simulate the situation when the chip of the memory component is in operation.
The operating temperature of the chip depends on the specific chip, and is not limited in this application. Further, the second preset time is not limited in this application, and may be, for example, 24 hours, 28 hours, or the like.
Step S103: and measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation board by using a graduated scale.
According to the method, the temperature of the chip simulation piece and the shell simulation board is simultaneously raised to the first preset highest temperature to accelerate diffusion of the heat-conducting silicone grease, then the working condition of the chip is simulated, namely the temperature of the chip simulation piece is controlled to be raised to the working temperature of the chip, the shell simulation board is at the ambient temperature, the diffusion distance of the silicone oil is measured, simulated detection of oil leakage diffusion of the heat-conducting silicone grease on the storage device is achieved, and therefore the proper heat-conducting silicone grease is selected for the storage device.
In one embodiment of the present application, the method further comprises measuring thermal conductivity, please refer to fig. 3, which comprises:
step S201: and controlling the chip simulation piece to gradually increase the temperature from the ambient temperature to a second preset maximum temperature, and acquiring the temperature corresponding to the shell simulation board when the chip simulation piece is at a preset temperature node.
The second preset maximum temperature is the maximum temperature that the chip can withstand, depending on the type of chip. For example, the second preset maximum temperature may be 70 ℃, or 80 ℃, and so on.
It should be noted that, the preset temperature node is not limited in this application, and may be set by itself. For example, starting from ambient temperature, the temperature of each integer point may be a preset temperature node, or one temperature node may be set every 3 ℃ intervals, and so on.
The rate of temperature increase of the chip simulator can be set by itself, for example, 1 ℃ every 20 minutes, or 1.5 ℃ every 20 minutes, and so on.
Due to the existence of the heat-conducting silicone grease, when the temperature of the chip simulation piece rises, the temperature of the shell simulation board also gradually rises. It should be noted that, when acquiring the temperature at the housing simulation board, the temperature of the chip simulation piece needs to be acquired when being stable, so as to improve the detection precision. Each preset temperature node corresponds to a temperature collected at the shell simulation board.
Step S202: and determining the difference value between the preset temperature node and the corresponding temperature.
And subtracting the corresponding temperature at the shell simulation plate by using the preset temperature node.
Step S203: and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the difference and the number of the preset temperature nodes.
Specifically, the heat conductivity coefficient is determined according to a first preset formula, where the first preset formula is:
M＝(△T1+△T2+△T3+...+△Tn)/n (1)
wherein M is a heat conductivity coefficient, n is the number of preset temperature nodes, delta Ti is a difference value of the ith preset temperature node and the temperature corresponding to the shell simulation plate, and i is more than or equal to 1 and less than or equal to n.
Further, in an embodiment of the present application, the method further includes: and determining the comprehensive performance score of the heat-conducting silicone grease on the storage equipment and generating a test report according to the diffusion distance and the heat conductivity coefficient.
The determination mode of the comprehensive performance score is as follows:
determining the comprehensive performance score according to a second preset formula, wherein the second preset formula is as follows:
wherein Ta is the ambient temperature, M is the thermal conductivity, S is the diffusion distance, and N is the width of the chip simulation piece.
The size of the chip simulator is equal to the size of the chip, namely N is the width of the chip.
The larger the composite performance score J, the better, the full score of 100. When the diffusion distance S is larger than the width N of the chip, J is a negative number at the moment, and the oil leakage effect is very poor. The test report included the various sets of temperature data records and the final composite performance score.
The following explains the simulation test process of the thermal grease in the solid state disk by taking the apparatus shown in fig. 1 as an example.
Firstly, uniformly coating the heat-conducting silicone grease to be measured on a chip simulation piece of a chip simulation board, adjusting the distance between the chip simulation board and a shell simulation board, and adjusting the distance to be consistent with the gap between an actual chip of the solid state disk and the shell.
Step 1, taking down the chip simulation board from the track, and uniformly coating the heat-conducting silicone grease to be tested on the surface of a chip simulation piece of the chip simulation board;
and 5, determining the comprehensive performance grade of the heat-conducting silicone grease by the console according to the formula (2) and generating a test report which is used as a reference for selecting the heat-conducting silicone grease for the solid state disk.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The apparatus and method for simulation testing the performance of thermally conductive silicone grease in memory devices provided herein have been described in detail above. The principles and embodiments of the present application are described herein using specific examples, which are only used to help understand the method and its core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. An apparatus for simulating the performance of thermally conductive silicone in a test storage device, comprising:
the chip simulation board and the shell simulation board are arranged oppositely and used for containing heat-conducting silicone grease, and a chip simulation piece used for simulating a chip in the storage device is arranged on the inner surface of the chip simulation board;
the temperature regulating components are respectively arranged on the outer surfaces of the chip simulation plate and the shell simulation plate and are used for regulating the temperature of the chip simulation piece and the shell simulation plate;
the temperature sensors are arranged in the chip simulation board and the shell simulation board and are used for measuring the temperature of the chip simulation piece and the temperature of the shell simulation board;
the heat dissipation part is arranged on the outer side of the shell simulation plate and used for dissipating heat of the shell simulation plate;
and the graduated scale is arranged on the inner surface of the shell simulation plate and is used for measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation plate.
2. The apparatus for modeling performance of a thermally conductive silicone in a test storage device of claim 1, further comprising:
and the console is connected with the temperature regulating component and used for controlling the temperature of the temperature regulating component arranged on the outer surface of the chip simulation board to rise and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the temperatures of the chip simulation piece and the shell simulation board.
3. The apparatus of claim 2, wherein the console is further configured to determine a composite performance score for the thermal grease for the storage device and generate a test report based on the diffusion distance and the thermal conductivity.
4. The apparatus for modeling performance of a thermally conductive silicone in a test storage device of claim 2, wherein said console further comprises:
and the display is used for displaying the temperatures of the chip simulation piece and the shell simulation plate and the heat conductivity coefficient.
5. The apparatus for analog testing of the performance of a thermally conductive silicone grease in a memory device of any of claims 1 to 4, further comprising:
the track with scale is used for adjusting the chip simulation board with the interval of casing simulation board, the chip simulation board with the casing simulation board is located in the track.
6. A method for analog testing of the performance of thermally conductive silicone grease in a memory device, comprising:
when the heat-conducting silicone grease is clamped between the chip simulation board and the shell simulation board, controlling the chip simulation piece and the shell simulation board in the chip simulation board to simultaneously heat to a first preset maximum temperature and maintain for a first preset time so as to diffuse the silicone oil in the heat-conducting silicone grease;
controlling the temperature of the chip simulation part to rise to the working temperature of the chip and maintaining the working temperature for a second preset time, and controlling the heat dissipation part to dissipate heat of the shell simulation plate;
and measuring the diffusion distance of the silicone oil in the heat-conducting silicone grease on the shell simulation board by using a graduated scale.
7. The method for simulation testing the performance of a thermally conductive silicone grease in a memory device of claim 6, further comprising:
controlling the temperature of the chip simulation piece to gradually rise from the ambient temperature to a second preset maximum temperature, and acquiring the temperature corresponding to the shell simulation board when the chip simulation piece is at a preset temperature node;
determining the difference value between the preset temperature node and the corresponding temperature;
and determining the heat conductivity coefficient of the heat-conducting silicone grease according to the difference and the number of the preset temperature nodes.
8. The method of claim 7, wherein determining the thermal conductivity of the thermally conductive silicone grease based on the difference and the number of predetermined temperature nodes comprises:
determining the heat conductivity coefficient according to a first preset formula, wherein the first preset formula is as follows:
M＝(△T1+△T2+△T3+...+△Tn)/n
wherein M is a heat conductivity coefficient, n is the number of preset temperature nodes, delta Ti is a difference value of the ith preset temperature node and the temperature corresponding to the shell simulation plate, and i is more than or equal to 1 and less than or equal to n.
9. The method for analog testing of the performance of a thermally conductive silicone grease in a memory device of claim 8 further comprising:
and determining the comprehensive performance score of the heat-conducting silicone grease on the storage equipment and generating a test report according to the diffusion distance and the heat conductivity coefficient.
10. The method of claim 9, wherein determining a composite performance score for the thermal grease for the storage device based on the diffusion distance and the thermal conductivity comprises:
determining the comprehensive performance score according to a second preset formula, wherein the second preset formula is as follows:
wherein Ta is the ambient temperature, M is the thermal conductivity, S is the diffusion distance, and N is the width of the chip simulation piece.
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