CN114434554A - Structure of knife-die stamping gas diffusion layer - Google Patents
Structure of knife-die stamping gas diffusion layer Download PDFInfo
- Publication number
- CN114434554A CN114434554A CN202210133822.1A CN202210133822A CN114434554A CN 114434554 A CN114434554 A CN 114434554A CN 202210133822 A CN202210133822 A CN 202210133822A CN 114434554 A CN114434554 A CN 114434554A
- Authority
- CN
- China
- Prior art keywords
- diffusion layer
- gas diffusion
- die
- cutting
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
- B26D2007/322—Means for performing other operations combined with cutting for conveying or stacking cut product the cut products being sheets, e.g. sheets of paper
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Fuel Cell (AREA)
Abstract
The invention provides a structure of a knife-die stamping gas diffusion layer, which comprises: the cutting die comprises a conveying roller, a cutting die and a protective film attaching piece, wherein the conveying roller is used for conveying a gas diffusion layer to be cut to the cutting die; the cutting die is used for cutting the gas diffusion layer and transmitting the cut gas diffusion layer to the protective film attaching piece; the protective film attaching piece is used for attaching the protective film to the surface of the cut gas diffusion layer so as to obtain a product, so that the size, the appearance and the hairline length precision of the product obtained by cutting the gas diffusion layer are improved, the product precision requirement after cutting the gas diffusion layer is met, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of gas diffusion layer processing, in particular to a structure of a gas diffusion layer punched by a cutter die.
Background
In recent years, proton exchange membrane fuel cell stacks have received much attention at home and abroad due to their advantages of cleanliness and high efficiency. With the increasing of the investment of domestic enterprises to proton exchange membrane fuel cells and the rapid development of the fuel cell industry chain, a Gas Diffusion Layer (GDL) is taken as an important component of a membrane electrode of a fuel cell core assembly, usually consists of a porous material with good conductivity, has anisotropic porous microstructure in structure, plays a plurality of roles of Gas transmission distribution, electronic conduction, supporting a catalyst Layer, improving water management and the like in a stack, and is one of key components influencing the electrochemical performance of the fuel cell.
The gas diffusion layer is inevitably cut in the proton exchange membrane fuel cell, so the precision requirement of a product obtained after the gas diffusion layer is cut is higher, the existing gas diffusion layer cutting process adopts laser to fire the gas diffusion layer, the length of the broken filament of the traditional laser-fired gas diffusion layer is about 1mm, the size, the appearance and the length precision of the broken filament of the traditional laser-fired gas diffusion layer are not ideal, and the precision requirement of the product after the gas diffusion layer is cut cannot be met.
Disclosure of Invention
In order to solve the technical problem, the invention provides a structure of a cutter die punching gas diffusion layer, which improves the size, appearance and filament length precision of a product obtained by cutting the gas diffusion layer, meets the precision requirement of the product after cutting the gas diffusion layer, and reduces the production cost.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a structure of a die-stamped gas diffusion layer, comprising:
the conveying roller is used for conveying the gas diffusion layer to be cut to the cutting die;
the cutting die is used for cutting the gas diffusion layer to be cut and transmitting the cut gas diffusion layer to the protective film attaching part;
and the protective film attaching piece is used for attaching a protective film to the surface of the cut gas diffusion layer so as to obtain a product.
The invention provides a structure of a cutter die punching gas diffusion layer, which improves the size, appearance and hairline length precision of a product obtained by cutting the gas diffusion layer, meets the precision requirement of the product after cutting the gas diffusion layer, and reduces the production cost.
The preferable technical scheme comprises the following steps: the winding piece is arranged corresponding to the protective film attaching piece and used for winding a product.
The preferable technical scheme comprises the following steps: treater and position sensor are equipped with the correction ware in the gas diffusion layer feedstock location department of waiting to cut, position sensor with the treater electricity is connected, treater and correction ware controller, correction ware controller control correction ware running state is invariable with the gas diffusion layer feedstock route that can rectify and wait to cut.
The preferable technical scheme comprises the following steps: the cutting die comprises a cutting waste recycling piece and a cutting die, wherein the cutting waste recycling piece and the cutting die are arranged oppositely, and the cutting waste recycling piece is used for extracting waste from the cutting waste.
According to the preferable technical scheme, a CCD detector is arranged between the protective film attaching piece and the cutting die and electrically connected with a processor, the processor is electrically connected with a cutting die controller, and the cutting die controller is used for controlling the distance between every two cutting teeth on the cutting die.
The preferable technical scheme comprises the following steps: and the gas diffusion layer is connected with a bottom supporting film to form the gas diffusion layer to be cut.
The preferable technical scheme comprises the following steps: the gas diffusion layer thickness detector is used for monitoring the thickness of the gas diffusion layer and is electrically connected with the processor, the processor is electrically connected with the cutting die controller, and the cutting die controller is used for regulating and controlling the cutting layer of the cutting die so as to enable the gas diffusion layer to be cut off and the bottom supporting film to be not cut off.
The preferable technical scheme comprises the following steps: a transmission belt, transmission belt one end with the conveying running roller is connected, the transmission belt other end with the rolling piece is connected.
As a preferred technical scheme, be equipped with conveying running roller, cutting die in proper order on the transmission band one side, cut waste material recovery piece, CCD detector, protection film laminating piece and receipts roll up the piece, evenly be connected with a plurality of running rollers on the transmission band another side.
The preferable technical scheme comprises the following steps: the protective film feeding piece and the protective film attaching piece are arranged correspondingly.
Drawings
Fig. 1 is a structural view of a structure of a die-stamping gas diffusion layer;
fig. 2 is a circuit diagram of a structure of a knife-die stamping gas diffusion layer;
fig. 3 is a circuit diagram of a structure of a knife-die stamping gas diffusion layer;
wherein, 1-a conveying roller; 2-cutting the die; 3-protective film attaching member; 4-rolling up; 5-cutting the waste recycling piece; 6-protective film feeding piece; 7-a deviation rectifier; 8-CCD detector; 9-conveying belt; 10-rolling a roller; 11-gas diffusion layers to be cut; 12-position sensor.
Detailed Description
It should be noted that the terms "first", "second", etc. are used to define the components, and are only used to facilitate the distinction of the corresponding components, and the terms have no special meaning if not stated, and therefore, should not be construed as limiting the scope of the present invention.
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
It is understood that the invention achieves the objects of the invention by means of some embodiments.
As shown in fig. 1, the present invention provides a structure of a die-stamping gas diffusion layer, including: the device comprises a gas diffusion layer and a conveyor belt 9, wherein a backing film is connected to the gas diffusion layer to form a gas diffusion layer 11 to be cut, one end of the conveyor belt 9 is connected with a conveying roller 1, and the other end of the conveyor belt 9 is connected with a winding piece 4; one side of the transmission belt 9 is sequentially provided with a transmission roller 1, a cutting die 2, a cutting waste recycling part 5, a CCD detector 8, a protective film attaching part 3 and a winding part 4, and the other side of the transmission belt 9 is uniformly connected with a plurality of rollers 10; the conveying roller 1 is used for conveying the gas diffusion layer 11 to be cut to the cutting die 2; the cutting die 2 is used for cutting the gas diffusion layer 11 to be cut and transmitting the cut gas diffusion layer to the protective film attaching part 3; the cutting waste recycling member 5 and the cutting die 2 are arranged oppositely, and the cutting waste recycling member 5 is used for recycling cutting waste and extracting waste; the protective film feeding piece 6 and the protective film attaching piece 3 are arranged correspondingly, the protective film attaching piece 3 is used for attaching a protective film to the surface of the cut gas diffusion layer so as to obtain a product, and the function of attaching the protective film to the surface of the cut gas diffusion layer is to protect a carbon layer of the product when the product is rolled; the rolling piece 4 and the protective film attaching piece 3 are arranged correspondingly, and the rolling piece 4 is used for rolling a product; the device comprises a processor, a deviation corrector controller, a position sensor 12, a position sensor 7, a deviation corrector controller and a cutter die, wherein the deviation corrector 7 is arranged at the feeding position of a gas diffusion layer to be cut, the position sensor 12 is electrically connected with the processor, the processor is connected with the deviation corrector controller, and the deviation corrector controller controls the running state of the deviation corrector 7 so as to correct the constant feeding route of the gas diffusion layer 11 to be cut, thereby ensuring the normal running of the structure of the gas diffusion layer punched by the cutter die; a CCD detector 8 is arranged between the protective film attaching piece 3 and the cutting die 2, the CCD detector 8 is electrically connected with a processor, the processor is electrically connected with a cutting die controller, and the cutting die controller is used for controlling the distance between every two cutting teeth on the cutting die 2; the failure that the size of the cut product is not within the preset threshold range to influence the subsequent process is effectively prevented; therefore, the size, the appearance and the hairline length precision of a product obtained by cutting the gas diffusion layer are improved, the precision requirement of the product after cutting the gas diffusion layer is met, and the production cost is further reduced.
As shown in fig. 2, the present invention provides a structure of a die-stamping gas diffusion layer, including: the device comprises a processor and a position sensor 12, wherein a deviation corrector 7 is arranged at the feeding position of the gas diffusion layer to be cut, the position sensor 12 is electrically connected with the processor, the processor is connected with a deviation corrector controller, and the deviation corrector controller controls the running state of the deviation corrector 7 to correct the constant feeding route of the gas diffusion layer to be cut; presetting threshold data of a gas diffusion layer feeding route to be cut, acquiring actual signals of the gas diffusion layer feeding route to be cut by a position sensor, sending the actual signals of the gas diffusion layer feeding route to be cut to a processor, detecting the signals by the processor, processing the signals, sending the actual data of the gas diffusion layer feeding route to be cut to a deviation corrector controller, receiving the actual data of the gas diffusion layer feeding route to be cut by the deviation corrector controller, comparing the actual data of the gas diffusion layer feeding route to be cut with the threshold data of the gas diffusion layer feeding route to be cut, and correcting and controlling the deviation corrector to operate and correct the constant gas diffusion layer feeding route to be cut.
As shown in fig. 3, the present invention provides a structure of a die stamping gas diffusion layer, wherein a CCD detector 8 is disposed between the protective film attaching member 3 and the die 2, the CCD detector 8 is electrically connected to a processor, the processor is electrically connected to a die controller, and the die controller is configured to control a distance between every two cutting teeth on the die 2; presetting width threshold data of the gas diffusion layer after cutting, acquiring width actual signals of the gas diffusion layer after cutting by the CCD detector 8, sending the width actual signals of the gas diffusion layer after cutting to the processor, detecting the signals by the processor, processing the signals, sending the width actual data of the gas diffusion layer after cutting to the cutting die controller, receiving the width actual data of the gas diffusion layer after cutting by the cutting die controller, comparing the width actual data of the gas diffusion layer after cutting with the width threshold data of the gas diffusion layer after preset cutting, and correcting the distance between every two cutter teeth on the cutting die 2 so that the width actual value of the gas diffusion layer after cutting by the cutter teeth accords with the width threshold of the gas diffusion layer after preset cutting.
The invention provides a structure of a knife die punching gas diffusion layer, which comprises: the gas diffusion layer thickness detector is arranged on the conveying belt 9 and used for monitoring the thickness of the gas diffusion layer, the gas diffusion layer thickness detector is electrically connected with the processor, the processor is electrically connected with the cutting die controller, and the cutting die controller is used for regulating and controlling the cutting layer of the cutting die so that the gas diffusion layer can be cut off and the bottom supporting film is not cut off; the gas diffusion layer thickness detector collects actual thickness signals of the gas diffusion layer and sends the actual thickness signals of the gas diffusion layer to the processor, the processor detects the signals and processes the signals, actual thickness data of the gas diffusion layer are sent to the cutting die controller, the cutting die controller receives the actual thickness data of the gas diffusion layer and regulates and controls the cutting layer of the cutting die according to the actual thickness data of the gas diffusion layer so that the gas diffusion layer can be cut off, the bottom supporting film is not cut off, the cutting waste recycling part is used for stripping and extracting waste from the bottom film of a gas diffusion raw material and cutting waste, and therefore the gas diffusion layer cut in the cutting process can automatically clean and extract waste, and pollution to the surrounding environment and products is avoided.
The dimensions and effects of conventional laser fired stamping gas diffusion layers are shown in table 1 below:
table 1 conventional laser fired stamped gas diffusion layer dimensions and effects
The laser XY dimension is controlled within +/-0.06 mm, and the lengths of the filaments of the traditional laser sintering stamping gas diffusion layer are measured to be 0.69 mm, 0.782 mm, 0.889 mm, 0.756mm and 0.810mm respectively.
The die stamping gas diffusion layer dimensions and effects are given in table 2 below:
table 2 die stamping gas diffusion layer dimensions and effects
The XY size of the cutter die is controlled within +/-0.06 mm, the lengths of the hairline of the product of the cutter die stamping gas diffusion layer provided by the invention are measured to be 0.0826 mm, 0.137 mm, 0.136 mm, 0.146mm and 0.123mm respectively, and from the measured experimental data, the size, the appearance and the hairline length of the product obtained by the cutter die stamping gas diffusion layer provided by the invention are obviously superior to those of the product obtained by traditional laser sintering stamping gas diffusion layer.
Therefore, the structure of the gas diffusion layer punched by the cutter die provided by the invention not only improves the size, appearance and filament length precision of a product obtained by cutting the gas diffusion layer, meets the precision requirement of the product after cutting the gas diffusion layer, reduces the production cost, but also can automatically clean and waste, and avoids pollution to the surrounding environment and the product.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all modifications and equivalents falling within the scope of the claims of the present application. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A structure of a die-stamping gas diffusion layer, comprising:
the conveying roller is used for conveying the gas diffusion layer to be cut to the cutting die;
the cutting die is used for cutting the gas diffusion layer to be cut and transmitting the cut gas diffusion layer to the protective film attaching piece;
and the protective film attaching piece is used for attaching a protective film to the surface of the cut gas diffusion layer so as to obtain a product.
2. The structure of a die-stamped gas diffusion layer according to claim 1, comprising: the winding piece is arranged corresponding to the protective film attaching piece and used for winding a product.
3. The structure of a die-stamped gas diffusion layer according to claim 1, comprising: treater and position sensor are equipped with the correction ware in the gas diffusion layer feedstock location department of waiting to cut, position sensor with the treater electricity is connected, treater and correction ware controller, correction ware controller control correction ware running state is invariable with the gas diffusion layer feedstock route that can rectify and wait to cut.
4. The structure of a die-stamped gas diffusion layer according to claim 1, comprising: the cutting die comprises a cutting waste recycling piece and a cutting die, wherein the cutting waste recycling piece and the cutting die are arranged oppositely, and the cutting waste recycling piece is used for extracting waste from the cutting waste.
5. The structure of the die stamping gas diffusion layer according to claim 1, wherein a CCD detector is disposed between the protective film attachment member and the die, the CCD detector is electrically connected to a processor, the processor is electrically connected to a die controller, and the die controller is configured to control a distance between every two cutting teeth on the die.
6. The structure of a die-stamped gas diffusion layer according to claim 1, comprising: the gas diffusion layer is connected with a bottom supporting film to form the gas diffusion layer to be cut.
7. The structure of the die-stamped gas diffusion layer according to claim 6, comprising: the gas diffusion layer thickness detector is used for monitoring the thickness of the gas diffusion layer and is electrically connected with the processor, the processor is electrically connected with the cutting die controller, and the cutting die controller is used for regulating and controlling the cutting layer of the cutting die so as to enable the gas diffusion layer to be cut off and the bottom supporting film to be not cut off.
8. The structure of a die-stamped gas diffusion layer according to claim 2, comprising: transmission band and rolling spare, transmission band one end with the conveying running roller is connected, the transmission band other end with the rolling spare is connected.
9. The structure of the die stamping gas diffusion layer according to claim 8, wherein one side of the conveyor belt is sequentially provided with a conveying roller, a die, a cutting waste recycling part, a CCD detector, a protective film attaching part and a winding part, and the other side of the conveyor belt is uniformly connected with a plurality of rollers.
10. The structure of a die-stamped gas diffusion layer according to claim 1, comprising: the protective film feeding piece and the protective film attaching piece are arranged correspondingly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210133822.1A CN114434554A (en) | 2022-02-14 | 2022-02-14 | Structure of knife-die stamping gas diffusion layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210133822.1A CN114434554A (en) | 2022-02-14 | 2022-02-14 | Structure of knife-die stamping gas diffusion layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114434554A true CN114434554A (en) | 2022-05-06 |
Family
ID=81373932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210133822.1A Pending CN114434554A (en) | 2022-02-14 | 2022-02-14 | Structure of knife-die stamping gas diffusion layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114434554A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116031417A (en) * | 2023-02-16 | 2023-04-28 | 山东华滋自动化技术股份有限公司 | Membrane electrode diffusion layer packaging technology |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204278059U (en) * | 2014-11-28 | 2015-04-22 | 瑞纳智绝缘材料（苏州）有限公司 | A kind of from volume sleeve pipe cutting apparatus |
| CN105922325A (en) * | 2016-06-20 | 2016-09-07 | 无锡鼎茂机械制造有限公司 | Cutting device for electromechanical equipment |
| CN106827051A (en) * | 2017-04-06 | 2017-06-13 | 苏州丰鑫机械设备有限公司 | One kind cuts paster all-in-one automatically |
| US20190240856A1 (en) * | 2018-02-06 | 2019-08-08 | Toyota Jidosha Kabushiki Kaisha | Cutting apparatus for membrane electrode and gas diffusion layer assembly |
| CN210414658U (en) * | 2019-05-21 | 2020-04-28 | 深圳市依莱特光电技术有限公司 | Cutting machine for producing mobile phone protective film |
| CN212412092U (en) * | 2020-06-22 | 2021-01-26 | 佛山隆深机器人有限公司 | Fuel cell membrane electrode gas diffusion layer cutting device |
| CN215393711U (en) * | 2021-06-24 | 2022-01-04 | 无锡先导智能装备股份有限公司 | Cutting device |
-
2022
- 2022-02-14 CN CN202210133822.1A patent/CN114434554A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204278059U (en) * | 2014-11-28 | 2015-04-22 | 瑞纳智绝缘材料（苏州）有限公司 | A kind of from volume sleeve pipe cutting apparatus |
| CN105922325A (en) * | 2016-06-20 | 2016-09-07 | 无锡鼎茂机械制造有限公司 | Cutting device for electromechanical equipment |
| CN106827051A (en) * | 2017-04-06 | 2017-06-13 | 苏州丰鑫机械设备有限公司 | One kind cuts paster all-in-one automatically |
| US20190240856A1 (en) * | 2018-02-06 | 2019-08-08 | Toyota Jidosha Kabushiki Kaisha | Cutting apparatus for membrane electrode and gas diffusion layer assembly |
| CN210414658U (en) * | 2019-05-21 | 2020-04-28 | 深圳市依莱特光电技术有限公司 | Cutting machine for producing mobile phone protective film |
| CN212412092U (en) * | 2020-06-22 | 2021-01-26 | 佛山隆深机器人有限公司 | Fuel cell membrane electrode gas diffusion layer cutting device |
| CN215393711U (en) * | 2021-06-24 | 2022-01-04 | 无锡先导智能装备股份有限公司 | Cutting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116031417A (en) * | 2023-02-16 | 2023-04-28 | 山东华滋自动化技术股份有限公司 | Membrane electrode diffusion layer packaging technology |
| CN116031417B (en) * | 2023-02-16 | 2023-06-16 | 山东华滋自动化技术股份有限公司 | Membrane electrode diffusion layer packaging technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110690457B (en) | Method and apparatus for manufacturing electrode sheet | |
| US8173204B2 (en) | Method and device for producing membrane-electrode units | |
| GB2605712A (en) | Method of producing membrane-electrode assemblies and machine therefore | |
| KR101776755B1 (en) | Manufacturing device of fuel cell component and manufacturing method | |
| CN114434554A (en) | Structure of knife-die stamping gas diffusion layer | |
| US20200266459A1 (en) | Method and system for setting cutting time of gasket during manufacture of mea | |
| CN113695451B (en) | Universal pole piece feeding die cutting method | |
| WO2023151247A1 (en) | Gas diffusion layer bonding structure and process method, and storage medium | |
| CN210040414U (en) | Membrane electrode production equipment | |
| CN114583143A (en) | Negative electrode lithium-supplementing lithium tape and preparation method and application thereof | |
| JP7000889B2 (en) | Membrane electrode gas diffusion layer joint cutting device | |
| JP2001093515A (en) | Method of manufacturing electrode plate and apparatus using same | |
| CN108987822A (en) | Electrical core of power battery winding device | |
| CN210060131U (en) | Battery pole piece cutting and forming device with multiple coating belts | |
| CN214848688U (en) | Battery pole piece processing equipment | |
| CN115332542B (en) | Battery core pole piece substrate and pole piece production equipment | |
| EP4254531A1 (en) | Electrode driving roller and notching apparatus comprising same | |
| CN114506722A (en) | Gas diffusion layer divides strip to cut rolling structure | |
| CN217691262U (en) | Thermal composite lamination device and battery production line | |
| CN215657283U (en) | Pole piece cutting device based on ceramic knife rest | |
| CN115117207B (en) | HJT battery passivation method, HJT battery and assembly thereof | |
| CN217062232U (en) | Utmost point ear unwinding device and coiling all-in-one | |
| CN215094091U (en) | Roll paper online die cutting easily-tearing device | |
| CN215941182U (en) | Universal pole piece feeding die-cutting machine | |
| CN212071050U (en) | Copper strip cuts off edge milling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |