CN114434012A - Laser printing path planning method and laser device - Google Patents
Laser printing path planning method and laser device Download PDFInfo
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- CN114434012A CN114434012A CN202210062102.0A CN202210062102A CN114434012A CN 114434012 A CN114434012 A CN 114434012A CN 202210062102 A CN202210062102 A CN 202210062102A CN 114434012 A CN114434012 A CN 114434012A
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- 238000007648 laser printing Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000004804 winding Methods 0.000 claims abstract description 59
- 238000009966 trimming Methods 0.000 claims description 7
- 238000004590 computer program Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 13
- 238000007639 printing Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010618 wire wrap Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The embodiment of the invention provides a laser printing path planning method and a laser device, and relates to the technical field of laser imprinting. The laser printing path planning method comprises the steps of determining a laser initial position of a target pattern; forming a path line in the target pattern by adopting winding type filling according to the initial position; adjusting the distance between the path lines; and carrying out laser imprinting along the path line after the distance is adjusted. The winding type filling mode is adopted, so that the target pattern can be filled more fully, and the laser effect is better; and the route that adopts wound-rotor type to fill can significantly reduce the idle stroke of board operation, and radium-shine efficiency is higher, saves a large amount of time.
Description
Technical Field
The invention relates to the technical field of laser imprinting, in particular to a laser lettering path planning method and a laser device.
Background
Along with the rapid development of the semiconductor industry, the requirement for laser printing is higher and higher in the packaging process, the types and styles of the logo required to be printed by customers are more and more, the logo printing mode at the present stage is machine filling, and multiple oblique line segments are adopted for sequential filling, so that too many lines are filled in the mode, too many breakpoints are caused, the logo printing mode is longer in time, and the efficiency is very low. And for the logo with a slightly complex shape, the filling degree of the plurality of oblique lines is not high, so that the laser printing effect is influenced, and the product yield is reduced.
Disclosure of Invention
The invention aims to provide a laser printing path planning method and a laser device, which can improve the laser printing efficiency, completely fill target patterns, have good laser printing effect and are beneficial to improving the product yield.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a laser printing path planning method, including:
determining a laser initial position of a target pattern;
forming a path line in the target pattern by adopting winding type filling according to the initial position;
adjusting the distance between the path lines;
and carrying out laser imprinting along the path line after the distance is adjusted.
In an optional embodiment, the step of forming a path line in the target pattern by winding filling according to the starting position includes:
and winding from the starting position along the edge of the target pattern to the center of the target pattern to form the path line.
In an alternative embodiment, the method further comprises:
after the step of forming the path lines in the target pattern, optimizing the local path lines.
In an alternative embodiment, the step of optimizing the local path line includes:
and judging a steering angle formed by two adjacent sections of the path lines, and disconnecting the two sections of the path lines by a preset distance if the steering angle is smaller than or equal to a preset angle.
In an alternative embodiment, the preset angle is 10 to 50 degrees.
In an alternative embodiment, the step of optimizing the local path line includes:
and judging whether the edge of the target pattern has a curved edge, and if so, trimming the local path line corresponding to the curved edge into a curve.
In an optional embodiment, the step of trimming the corresponding local path line at the curved edge into a curve includes:
and trimming the corresponding local path line at the curved edge into a curve, and setting the end point of the partial curve as a breakpoint.
In an alternative embodiment, the distance between two adjacent path lines is equal along the direction from the edge of the target pattern to the center of the target pattern.
In an alternative embodiment, the distance between two adjacent path lines along the direction from the edge of the target pattern to the center of the target pattern is less than 15% to 25% of the width of the path line.
In a second aspect, the present invention provides a laser apparatus comprising a processor and a memory, the memory storing one or more computer programs, the processor being configured to implement the laser lettering path planning method according to any one of the preceding embodiments when the one or more computer programs are executed.
The beneficial effects of the embodiment of the invention include, for example:
according to the laser lettering path planning method provided by the embodiment of the invention, the path lines are formed in the target pattern in a winding and filling manner, so that the filling integrity of the target pattern is higher, and the laser effect is better. And the path lines formed by adopting a winding and filling mode greatly reduce the starting points and the breakpoints of the paths, and a machine table can carry out continuous laser operation and reduce the idle stroke in the laser process, thereby greatly improving the laser efficiency and saving a large amount of time.
According to the laser device provided by the embodiment of the invention, the target pattern is subjected to laser filling by adopting the laser printing path planning method, the laser efficiency is high, the laser effect is good, the product yield is favorably improved, and the customer satisfaction is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic step diagram of a laser printing path planning method according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a shape of a target pattern in the laser printing path planning method according to the embodiment of the present invention;
fig. 3 is a schematic diagram of a shape of a target pattern after winding and filling in the laser printing path planning method provided in the embodiment of the present invention;
fig. 4 is a schematic view illustrating a first winding and filling of a target pattern in the laser printing path planning method according to the embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a second winding and filling of a target pattern in the laser printing path planning method according to the embodiment of the present invention;
fig. 6 is a schematic diagram illustrating a third winding and filling of a target pattern in the laser printing path planning method according to the embodiment of the present invention.
Icon: 100-a target pattern; 110-a first starting point; 120-a second starting point; 130-a third starting point; 210-first endpoint.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
At present, logo printing mode on the plastic package body is mostly completed through machine filling, the filling method is usually to fill by a plurality of oblique lines, the line filling mode is similar to a routing mode of a cross-sectional view, lines filled by the mode are too many, breakpoints are too many, laser printing is intermittent and continuous, the laser printing is run back and forth, and therefore a plurality of idle running steps exist, the logo printing time is longer, the breakpoints are more, the laser starting point during machine running is correspondingly increased, and when the machine runs along a path, idle strokes are more, the efficiency is very low, and a large amount of time is wasted. In addition, under the condition that the shape of the logo pattern required to be printed by a user is slightly complex, for example, the pattern has a curved edge or other irregular shapes, the completeness of oblique line filling is not high, and the logo pattern is not easy to be completely filled, so that laser printing of the logo is incomplete enough, the yield of the logo is reduced, and the product quality is affected.
In order to overcome at least one defect in the prior art, the laser printing path planning method provided by the embodiment of the invention adopts winding type filling, so that the idle stroke of a machine during operation is greatly shortened, the time is saved, and the laser printing efficiency is improved. And, adopt the wire winding formula to fill, be favorable to filling target pattern 100 completely, the completeness is higher, and target pattern 100 is fuller after the radium-shine printing, is favorable to improving radium-shine printing effect, and the product yield is higher, and the quality is better.
Referring to fig. 1, the present embodiment provides a laser printing path planning method, including:
step S100: the laser start position of the target pattern 100 is determined.
Step S200: the routing lines are formed in the target pattern 100 by wire-wrap filling according to the starting position.
Step S300: and adjusting the distance between the path lines.
Step S400: and carrying out laser imprinting along the path line after the distance is adjusted.
Because the winding filling is adopted to fill the target pattern 100, the starting point of the filling mode is less, only one starting position may be provided for some patterns, no breakpoint may exist, the laser path can be completed at one time when the machine runs, the idle stroke is greatly reduced, the laser efficiency is favorably improved, and a large amount of time is saved. Secondly, adopt the wire winding formula to fill, be favorable to more complete with target pattern 100 fills, target pattern 100 is fuller after the radium-shine printing, is favorable to improving radium-shine printing effect, and the product yield is higher.
In order to better understand the present embodiment, the target pattern 100 is illustrated as an example of the "IEK" letter combination shown in fig. 2. Of course, the target pattern 100 may be any other shape according to the requirement of the actual user, and is not limited herein. Optionally, the target pattern 100 is made into a hollow pattern, and winding is performed in the hollow area, where the winding path is the final laser printing path.
In step S100, an initial position of the target pattern 100 is determined, where the initial position is a starting point of the internal trace of the target pattern 100, and the direction of the internal trace is determined to a certain extent, so that the selection of the initial position is important. The general principle of the wire-winding filling is to sequentially fill from the edge to the center, and the routing requirement is regular and orderly, so that no intersection part exists, that is, the initial position is mostly near the frame of the target pattern 100, and the position near the edge of the target pattern 100 is determined as the laser initial position. It is understood that due to the uncertainty of the target pattern 100, a specific starting position of laser printing can be determined according to the actual shape of the target pattern 100, for example, an end position of one side of the edge of the target pattern 100 is used as the starting position, as shown by the first starting point 110 of the letter I, the second starting point 120 of the letter E, and the third starting point 130 of the letter K in fig. 3. It should be noted that, in the present embodiment, there is more than one starting point in the letter E and the letter K, and the reference numbers only show some of the starting points in the drawing.
In connection with fig. 3 and 4, the solid arrows on the winding path in fig. 4 indicate the course of the winding. In step S200, the step of forming the path line in the target pattern 100 by winding filling according to the initial position includes: from the start position, winding is performed in a direction from the edge of the target pattern 100 toward the center of the target pattern 100 to form a path line. Optionally, starting from the first starting point 110 of the starting position, winding a circle along the edge of the target pattern 100 in the hollow area, returning to the vicinity of the starting position, wherein the end point after winding the circle does not repeat with the starting point of the starting position, and the two points have a first preset distance therebetween, so as to form a winding path of the first circle; continuing to wind along the edge of the target pattern 100 with the end point after winding the first circle as a starting point, or winding along the path line direction of the first circle to form a winding path of a second circle, wherein the end point of the second circle is not overlapped with the starting point of the second circle (also the end point of the first circle), and a second preset distance is formed between the two points; and then, taking the end point after winding the second circle as a starting point to continue winding along the edge of the target pattern 100, or winding along the line direction of the path of the second circle to form a winding path of the third circle, and so on until the end point of the last circle falls in the center of the target pattern 100, and completely filling the hollow area of the target pattern 100. The end point in fig. 4 is the first end point 210, and in fig. 4, the hollow area of the target pattern 100 is a regular rectangle, and a continuous line may be used for winding and filling, i.e. there is only one start point and one end point. By the winding and filling manner, the path of the first circle surrounds the path of the second circle, the path of the second circle surrounds the path of the third circle, and so on, the closer to the center of the target pattern 100, the smaller the circumference of the path of each winding is. Like this, the route lines end to end of a plurality of circles can constitute continuous wire winding, and at actual radium-shine printing in-process, the board operation can be printed in succession, reduces the idle stroke in the operation, and save time improves radium-shine printing efficiency.
Referring to fig. 4 to 6, in step S300, the pitch of the path lines is adjusted. Alternatively, the distance between two adjacent path lines is equal along the edge of the target pattern 100 toward the center of the target pattern 100. The winding filling mode can adopt parallel and equidistant winding, namely the first preset distance is equal to the second preset distance. The route lines of two adjacent circles are equidistant setting in the direction from edge to center, for example first circle is 50 microns apart from the pattern edge, is 50 microns apart from between the lines of second circle and first circle, is 50 microns apart from between the lines of third circle and second circle, sets up like this, fills more evenly for effect after the radium-shine printing is better. In addition, it should be noted that the center described herein is relative to the pattern edge, is relatively located in the middle of the target pattern 100, and does not refer to an absolute geometric center. Depending on the actual shape of the target pattern 100, the end point of the path line may also end at the end point opposite to one end of the target pattern 100, which is not limited herein. Of course, in other alternative embodiments, the routing lines filled by the winding lines are not necessarily continuous, and may have multiple starting points and multiple ending points, as shown in fig. 3, 5 or 6, and the distances between adjacent routing lines may not be completely equidistant, depending on the shape of the actual target pattern 100.
Optionally, the distance between two adjacent path lines is affected by the shape of the target pattern 100 itself, and may be different, and then, there is a relationship with the line width of the laser line itself, if the winding distance between two adjacent circles is too small, in the actual laser process, because the laser line itself also has a certain line width, repeated laser may be caused in a part of the area, and then the laser is too deep, or the depth is different, and the like. Therefore, the line spacing between the path lines is set according to the laser line width, when the laser line widths are different, the line spacing set by people is also different, and in order to ensure that the lines of the path lines can be tightly combined after laser printing but cannot be overlapped too much after laser printing, in the embodiment, the distance between two adjacent path lines is less than 15% to 25% of the width of the path lines, namely less than 15% to 25% of the width of the laser line, along the direction from the edge of the target pattern 100 to the center of the target pattern 100. The requirement of printing can be met by the line spacing, so that the situation that printing is not full can be avoided, the superposition between the printed lines can be avoided, and the laser effect is improved. It is easy to understand that if the path lines have overlapped parts, the overlapped parts are equivalent to twice laser, and the laser depth has the risk of out-of-specification.
It should be noted that, in order to avoid the situation that the distance between the lines filled by the winding is too small to cause the laser depth to be too deep, in the embodiment, the width of the filled area of the target pattern 100 needs to be greater than a preset value, and the preset value may be 0.1mm to 0.5mm, for example, 0.25mm, according to the laser line width.
Optionally, the laser printing path planning method further includes: step S210: after the step of forming the path lines in the target pattern 100, the local path lines are optimized. Wherein the step of optimizing the local path profile comprises: and judging a steering angle formed by two adjacent path lines, and if the steering angle is smaller than or equal to a preset angle, disconnecting the two path lines by a preset distance, namely, performing breakpoint processing on the path lines at a position with a smaller steering angle. Optionally, the preset angle is 10 to 50 degrees. In this embodiment, the preset angle is 30 degrees, that is, the corner with the turning angle smaller than 30 degrees needs to be processed with a breakpoint, as shown in a in fig. 5. It can be understood that when the laser irradiates to the turning point less than or equal to 30 °, the turning angle of the laser at these places is too small, the laser speed is slower than that of the normal laser straight line, the time of stay in the vicinity of the turning point is longer than that of the normal laser straight line, and the longer the laser time is, the deeper the laser depth is than the normal area, therefore, the positions with the turning angles less than or equal to 30 ° need to be processed by breaking points to break the connection part, so as to achieve the purpose of reducing the laser depth, and further avoid the risk of laser depth over-specification.
Optionally, in other embodiments, the step of optimizing the local path line further includes: and judging whether the edge of the target pattern 100 has a curved edge, if so, trimming the corresponding local path line at the curved edge into a curve, namely performing curved edge processing. When the logo, i.e. the target pattern 100, which the customer desires to print is an irregular pattern but has curved edges, a curved edge process is performed when the winding is filled, as shown at B in fig. 6. If all adopt the straight line to carry out the wire winding, can appear filling unsatisfactorily in target pattern 100 irregularity department, fill the not high degree promptly, and some radium-shine degree of points can exceed the scheduling problem. In order to solve these problems, in the present embodiment, for the target pattern 100 having a curved edge, a curved winding manner is adopted at the corresponding curved edge, so that the path line is more adapted to the edge of the target pattern 100, and the saturation and the integrity of the filling are better. Optionally, the distance between the curves is also smaller than 15% to 25% of the laser line width, the inside of the target pattern 100 is completely filled, and the laser printing effect is better.
Alternatively, in some other embodiments, in addition to performing a separate breakpoint process or a separate curve process, the breakpoint process and the curve process may be combined to optimize the routing path of the target pattern 100 for some specific target patterns 100. For example, the corresponding local path line at the curved edge is trimmed to be a curve, and the end point of the partial curve is set as a breakpoint, as shown at B in fig. 6, the breakpoint may be an end point of the winding path, and the end point may be one or more, in this case, the start point of the winding path may also be one or more, and is not limited specifically here.
It should be noted that, the optimization steps for the local lines, including but not limited to curve processing and breakpoint processing, may be performed before or after the adjustment of the pitch of the path lines, and are not limited in this respect.
In step S400, laser imprinting is performed along the path line after the distance is adjusted. The path lines filled by the winding are the actual laser paths, and the laser machine station walks along the path lines filled by the winding to complete laser printing of the target pattern 100.
The embodiment of the invention provides a laser printing path planning method, which comprises the following specific implementation operations:
in actual operation, the logo pattern on the plastic package body, i.e. the target pattern 100 of laser printing, is determined, and the outline pattern of the target pattern 100 is drawn, for example, by using coreldaw 9 software to draw the shape of the target pattern 100. Opening the depicted outline pattern in the inkscape software, saving the outline pattern in the DXF format by using the inkscape software, opening the outline pattern in the DXF format in the CAD software, virtually printing the outline pattern by using the CAD software, wherein the printed format is PLT, and optionally, 7550A is selected as the virtual printer in the CAD software. The PowerFont software is used to open the outline pattern in PLT format, and after opening, the lines of the outline pattern are adjusted, including but not limited to changing the oblique and distorted lines into straight lines, reconnecting the points that are not connected, and setting the entire target pattern 100 to the size required by the customer.
The method comprises the steps of conducting winding filling in a target pattern 100, selecting a winding starting point, conducting winding filling along the edge of the target pattern 100 from outside to inside at equal intervals, adjusting the interval of path lines after the winding is finished, conducting breakpoint processing and curve processing on local lines according to actual conditions to ensure that the target pattern 100 is completely filled, and finally conducting laser printing along a winding path to make and finish pattern laser on a plastic package body.
An embodiment of the present invention further provides a laser apparatus, including a processor and a memory, where the memory is used to store one or more computer programs, and the processor is used to implement the laser printing path planning method according to any one of the foregoing embodiments when the one or more computer programs are executed. The laser device can be used for manufacturing patterns such as logo and the like on a plastic package body by adopting the laser printing path planning method, and the manufacturing of semiconductor products is completed. Because of adopting the wire winding type filling, the pattern filling of the laser printing is more complete, the laser efficiency is high, and the laser effect is good.
In summary, the laser printing path planning method and the laser device provided in the embodiments of the present invention have the following beneficial effects:
according to the laser printing path planning method provided by the embodiment of the invention, the path lines are formed in the target pattern 100 in a winding and filling manner, and the path lines are the actual path of laser printing. The starting point and the breakpoint of the path are greatly reduced by adopting a winding and filling mode, a machine table can perform continuous laser operation, and the idle stroke in the laser process is reduced, so that the laser efficiency is greatly improved, and a large amount of time is saved. In addition, the method can be suitable for filling any shapes of graphs such as simple graphs and complex graphs, the filling integrity of the target pattern 100 is high, the laser effect is good, the risk of out-of-specification laser depth is avoided, and the product yield is improved.
The laser device provided by the embodiment of the invention adopts the laser printing path planning method to perform laser filling on the target pattern 100, has the advantages of wide application range, high laser efficiency and good laser effect, and is beneficial to improving the product yield and the customer satisfaction.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A laser printing path planning method is characterized by comprising the following steps:
determining a laser initial position of a target pattern;
forming a path line in the target pattern by adopting winding type filling according to the initial position;
adjusting the distance between the path lines;
and carrying out laser imprinting along the path line after the distance is adjusted.
2. The laser printing path planning method according to claim 1, wherein the step of forming the path line in the target pattern by winding filling according to the start position comprises:
and winding from the starting position along the edge of the target pattern to the center of the target pattern to form the path line.
3. The laser printing path planning method according to claim 1, further comprising:
after the step of forming the path lines in the target pattern, optimizing the local path lines.
4. The laser printing path planning method according to claim 3, wherein the step of optimizing the local path lines includes:
and judging a steering angle formed by two adjacent sections of the path lines, and disconnecting the two sections of the path lines by a preset distance if the steering angle is smaller than or equal to a preset angle.
5. The laser printing path planning method according to claim 4, wherein the preset angle is 10 to 50 degrees.
6. The laser printing path planning method according to claim 3, wherein the step of optimizing the local path lines includes:
and judging whether the edge of the target pattern has a curved edge, and if so, trimming the local path line corresponding to the curved edge into a curve.
7. The laser printing path planning method according to claim 6, wherein the step of trimming the corresponding local path line at the curved edge into a curved line comprises:
and trimming the corresponding local path line at the curved edge into a curve, and setting the end point of the partial curve as a breakpoint.
8. The laser printing path planning method according to claim 1, wherein the distance between two adjacent path lines is equal along the direction from the edge of the target pattern to the center of the target pattern.
9. The laser printing path planning method according to any one of claims 1 to 8, wherein a distance between two adjacent path lines in a direction from an edge of the target pattern to a center of the target pattern is less than 15% to 25% of a width of the path line.
10. A laser apparatus comprising a processor and a memory, the memory storing one or more computer programs, the processor when executing the one or more computer programs to implement the laser lettering path planning method of any one of claims 1 to 9.
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| CN202210062102.0A CN114434012B (en) | 2022-01-19 | Laser printing path planning method and laser device |
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| CN202210062102.0A CN114434012B (en) | 2022-01-19 | Laser printing path planning method and laser device |
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