CN114428473A - Special servo control chip SIP system, test device and method for chip atomic clock - Google Patents
Special servo control chip SIP system, test device and method for chip atomic clock Download PDFInfo
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- CN114428473A CN114428473A CN202111556310.8A CN202111556310A CN114428473A CN 114428473 A CN114428473 A CN 114428473A CN 202111556310 A CN202111556310 A CN 202111556310A CN 114428473 A CN114428473 A CN 114428473A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0423—Input/output
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- G—PHYSICS
- G04—HOROLOGY
- G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
- G04D7/00—Measuring, counting, calibrating, testing or regulating apparatus
- G04D7/004—Optical measuring and testing apparatus
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- G—PHYSICS
- G04—HOROLOGY
- G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
- G04D7/00—Measuring, counting, calibrating, testing or regulating apparatus
- G04D7/12—Timing devices for clocks or watches for comparing the rate of the oscillating member with a standard
- G04D7/1207—Timing devices for clocks or watches for comparing the rate of the oscillating member with a standard only for measuring
- G04D7/1214—Timing devices for clocks or watches for comparing the rate of the oscillating member with a standard only for measuring for complete clockworks
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- G—PHYSICS
- G04—HOROLOGY
- G04F—TIME-INTERVAL MEASURING
- G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
- G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
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- G—PHYSICS
- G04—HOROLOGY
- G04F—TIME-INTERVAL MEASURING
- G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
- G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
- G04F5/145—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks using Coherent Population Trapping
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- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G7/00—Synchronisation
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/24—Pc safety
- G05B2219/24215—Scada supervisory control and data acquisition
Abstract
The application discloses SIP system of special servo control chip of chip atomic clock, including integrated inside MCU, the optical detection signal acquisition circuit of SIP encapsulation, laser instrument drive circuit, temperature acquisition circuit, laser instrument control by temperature change circuit to and arrange the outside configuration circuit of SIP encapsulation in. The application also comprises a testing device and a testing method of the SIP system. The atomic clock system solves the problems of large volume and large power consumption of the atomic clock system in the prior art.
Description
Technical Field
The application relates to the technical field of electronics, in particular to an SIP system, a test device and a test method of a servo control chip special for a chip atomic clock.
Background
The atomic clock is a product combining modern quantum mechanics and electronics, and the principle of the atomic clock is that the frequency of electromagnetic waves emitted or absorbed by transitions between atomic energy levels is used as a standard, so that the atomic clock has the characteristics of high accuracy, high stability and the like. According to the market operation situation and development prospect prediction report of the Chinese chip atomic clock industry in 2019 plus 2025, the chip atomic clock has the advantages of low power consumption, small size and the like, can provide high-precision miniaturized frequency standard for application fields such as satellite navigation receivers, time-frequency system nodes, underwater navigation and the like, improves navigation precision and shortens the synchronization time of a communication network.
In the field of satellite navigation, due to the inherent vulnerability of the satellite navigation system, the navigation signal cannot cover all corners of the world, and in some extreme cases, the service of the satellite navigation system may be interrupted. The chip atomic clock is a key device of the autonomous navigation terminal and can be used as a time frequency source with high accuracy and high stability. In a network system, the unification of time references is an indispensable part in the system operation management. The chip atomic clock can be used for a time frequency source of the terminal equipment of the time unification system, not only provides high-precision time frequency information for the equipment, but also has a certain time keeping function, and guarantees the time precision requirement of the network system within a certain time.
At present, the CSAC SA65 of the most advanced chip atomic clock in the United states has the size of 16mm multiplied by 13.9mm multiplied by 4.6mm, the weight of less than 35g and the power consumption of less than 120mW at normal temperature; in China, the size of a chip atomic clock principle model machine which is promoted by Olympic in Chengdu province is 45mm multiplied by 36mm, and the power consumption is 0.6W; the volume of a B-AC01 type chip atomic clock developed by the wave time technology is 16.8cm3, and the power consumption at normal temperature is less than 0.55W. The miniaturization and light weight of the chip atomic clock control circuit are beneficial to further reducing the size and power consumption of the chip atomic clock. At present, no special servo control chip for the chip atomic clock designed based on the SIP technical scheme exists in China.
Disclosure of Invention
The application provides a system-In-package (SIP) system, a testing device and a method of a special servo control chip for a chip atomic clock, which solve the problems of large volume and large power consumption of an atomic clock system In the prior art.
The embodiment of the application provides an SIP system of a servo control chip special for a chip atomic clock, and the chip atomic clock can provide accurate time service for an autonomous navigation terminal, a network system, an underwater detection and remote sensing system and the like under extreme conditions that a satellite navigation signal is unavailable and the like. The SIP system comprises an MCU, a light detection signal acquisition circuit, a laser driving circuit, a temperature acquisition circuit, a laser temperature control circuit and a configuration circuit, wherein the MCU, the light detection signal acquisition circuit, the laser driving circuit, the temperature acquisition circuit and the laser temperature control circuit are integrated in an SIP package;
the optical detection signal acquisition circuit is used for generating light intensity detection data after an input signal is amplified, filtered and subjected to analog-to-digital conversion and inputting the light intensity detection data into the MCU;
the laser driving circuit is used for generating laser driving voltage after performing digital-to-analog conversion on laser driving control data output by the MCU and connecting the laser driving voltage to a laser control end to realize laser mode locking;
the temperature acquisition circuit is used for receiving temperature sensing voltage signals of the laser and the absorption bubble, generating temperature detection data after analog-to-digital conversion and inputting the temperature detection data to the MCU;
the laser temperature control circuit is used for performing digital-to-analog conversion on temperature control data output by the MCU and then generating temperature control voltage to control the TEC of the laser and the power tube of the absorption bulb to heat;
the MCU is used for processing the light intensity detection data and generating laser drive control data; processing the temperature detection data to generate temperature control data;
the configuration circuit includes: a first configuration circuit for adjusting the amplitude of the light detection signal; a second configuration circuit for varying the laser drive voltage; a third configuration circuit for changing a temperature sensing coefficient; a fourth configuration circuit for changing the temperature control coefficient; the temperature sensing coefficient comprises a proportional relation between a detected temperature value and a sensing voltage signal; the temperature control coefficient comprises a proportional relation between temperature control voltage and temperature change.
Preferably, the SIP system further includes a magnetic field control circuit integrated inside the SIP package, the magnetic field control circuit being configured to receive magnetic field control data from the MCU and control the magnetic field synthesis unit to generate the constant magnetic field after digital-to-analog conversion.
Preferably, the SIP system further includes a radio frequency phase-locked circuit integrated inside the SIP package, and configured to perform digital-to-analog conversion on the voltage-controlled data output by the MCU, and then generate a crystal oscillator control voltage to connect to the voltage-controlled terminal of the crystal oscillator, so as to implement microwave frequency locking; the configuration circuit further includes: and the fifth configuration circuit is used for adjusting the crystal oscillator control voltage.
Preferably, in the SIP system, the adjustable portion of the configuration circuit is disposed outside the SIP package and includes a resistor, a capacitor, or an inductor.
Preferably, the SIP system further comprises a 1PPS calibration circuit disposed inside the SIP package for detecting the time interval error, and measuring the synchronization error between the chip atomic clock and the standard 1PPS signal input from the 1PPS _ IN port by using a counter.
Preferably, the radio frequency phase-locked loop is further configured to frequency-multiply the 10MHz signal.
Preferably, the optical detection signal acquisition circuit comprises a photoelectric signal input port PD, and the optical detection signal acquisition circuit is divided into two frequency signals through integration, low-pass amplification, and the two frequency signals are respectively input to the MCU through analog-to-digital conversion.
The embodiment of the present application further provides a test system, which is used in the SIP system of the servo control chip dedicated for the chip atomic clock in any embodiment of the present application, and the test system includes:
a heat flux shield testing device and/or a high and low temperature testing device; the heat flux shield testing device comprises: the heat flow cover is connected with the host, compressed air is conveyed into the heat flow cover through the host, and the tested piece is placed in the heat flow cover; the high and low temperature test device comprises: a high and low temperature cabinet or a heating table;
the SIP system is used as a tested piece;
the device also comprises a counter, a frequency tester, a frequency spectrograph and an industrial personal computer;
the industrial personal computer is used for switching the test channels; the frequency tester is used for testing input and output signals of the radio frequency phase-locked loop circuit; the oscilloscope is used for testing input and output signals of the optical detection signal acquisition circuit; the frequency spectrograph is used for testing an output signal of the atomic clock; the counter is used for testing the synchronization error of the chip atom and the standard 1PPS signal.
The embodiment of the present application further provides a testing method, which is used for testing an SIP system of the servo control chip special for the chip atomic clock in any embodiment of the present application, and the testing method includes the following steps:
testing the temperature control precision of the absorption bubble and the temperature control precision of the laser under high and low temperature environments; measuring the laser frequency and testing the crystal oscillator frequency; measuring the synchronous error of the chip atomic clock and the standard 1PPS signal; testing the frequency accuracy of the chip atomic clock; the phase-locked loop output frequency is measured.
Further, the method also comprises the following steps: the temperature in the heat flow cover is raised to a specified temperature, and the following functions are tested after heat balance is achieved: testing an integrating circuit; testing a filter circuit; 1PPS _ IN circuit test.
The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects:
the invention provides a method for a special servo control chip of a chip atomic clock, and designs a test method suitable for an SIP chip. The invention designs a special servo control chip for the chip atomic clock by adopting the SIP technology, which is mainly used for the chip atomic clock and can greatly reduce the volume and the power consumption of the chip atomic clock. The SIP packaging technology can be conveniently compatible with chips of different manufacturing technologies, the line width of the chip is reduced, and the degree of integration is improved, so that the packaging is integrated from a single chip level to a system level. The development of the servo control chip special for the chip atomic clock can greatly reduce the volume and the power consumption of the atomic clock, and has important significance for the development of the current chip atomic clock and the expansion of the application range of the chip atomic clock. The atomic clock has small volume and low power consumption and has great application prospect in the fields of satellite navigation and the like.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a block diagram of a servo control circuit;
FIG. 2 is a functional block diagram of the SIP encapsulation circuit of the present application;
FIG. 3 is a SIP chip layout design;
FIG. 4 is a block diagram of a package design wherein (a) top view (b) bottom view (c) side view;
FIG. 5 is a block diagram of a test board design;
FIG. 6 is a connection diagram of a power supply and consumption testing apparatus;
FIG. 7 is a connection diagram of the functional testing apparatus;
fig. 8 is a schematic diagram of a device tested using a thermal flow mask.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
The invention provides an SIP packaging scheme of a servo control chip special for a chip atomic clock, and designs a test method suitable for the SIP chip.
The technical scheme of the invention is as follows:
SIP is a novel packaging technology based on system minimization, which loads multiple IC dies and possible passive components in the same substrate to form a standardized chip with a systematic function, and is a semiconductor technology capable of realizing system-on-chip integration. According to the scheme, the special servo control chip for the chip atomic clock is packaged and designed based on the SIP packaging design technology, and the MCU, the operational amplifier, the AND gate, the DAC, the inverter, the switch and other bare chips are integrated in the special servo control chip, so that the functions of signal acquisition and processing, drive control, acquisition and processing of temperature signals of a physical system, temperature control, generation of drive current and the like of the physical system are realized.
The structural block diagram of the servo control circuit is shown in the attached figure 1, configuration circuits are all arranged outside a chip in the figure, and the rest parts are packaged inside the chip. All configuration circuits shown in the figure are composed of capacitors, resistors and inductors, and the parameters of the configuration circuits can be conveniently adjusted by placing the configuration circuits outside a chip. Specifically, the amplitude of the optical detection signal can be adjusted by adjusting the first configuration circuit; adjusting the second configuration circuit may change the laser drive voltage; the temperature control coefficients of the physical system and the laser can be changed by adjusting the third configuration circuit and the fourth configuration circuit, so that the temperature control precision is influenced; adjusting the fifth configuration circuit may change the rf signal amplitude. Because the operating temperature points of each physical system and the laser are different, the driving voltage of the laser and the power intensity of the radio frequency signal need to be adjusted according to debugging phenomena when the laser and the physical system are in linkage adjustment, and the adjustment can be realized by changing the parameters of corresponding configuration circuits. The packaging method mainly packages the bare core of the core device and the inherent configuration circuit of the device, places the configuration circuit part to be regulated in the debugging process outside the chip, can furthest solidify the inherent circuit design of the core, and has stronger universality compared with the scheme that all circuits are packaged inside the chip.
Fig. 2 shows a functional block diagram of a specific SIP, and as shown in fig. 2, the architecture and functions of the dedicated servo control chip for the chip atomic clock are further described as follows:
the optical detection signal acquisition circuit: the circuit scheme firstly carries out photoelectric signal preprocessing on input signals with two frequencies, then utilizes high-precision ADC to collect the signals, and sends collected digital quantity to the MCU singlechip to carry out data processing.
VCSEL laser drive circuit and crystal oscillator drive circuit: and the MCU outputs the calculated feedback quantity to control two paths of high-precision DACs, and the outputs of the two paths of DACs are respectively connected with the voltage control end of the crystal oscillator and the control end of the VCSEL drive circuit to finish laser frequency locking and microwave frequency locking.
Temperature acquisition circuitry of the physical system: the temperature of the physical system also needs to be controlled by the MCU. The temperature of the laser and the temperature of the absorption bubble are converted into voltage signals through the temperature sensor, collected through the two ADC paths and input into the MCU singlechip for PID data processing.
Temperature-controlled heating drive circuit: the MCU controls the TEC of the VCSEL and the power tube of the absorption bulb to heat through the feedback of the two DACs according to the heating control quantity obtained by the PID algorithm.
Control circuit of the uniform magnetic field: the MCU outputs the accurate numerical value to the DAC, controls the magnetic field synthesis circuit and generates a high-precision constant magnetic field.
The invention adopts SIP integration technology, mainly follows the principle of main core chip and inherent configuration circuit in the integrated module in the chip design process, and places part of configuration circuit needing parameter adjustment outside the SIP chip so as to enhance the adjustability of the whole function of the chip and the compatibility and applicability to different physical systems.
Fig. 3 is a layout design of an SIP chip, and fig. 4 is a package design diagram of a module. The chip is internally and mainly integrated with bare chips such as a switch, a triode, an operational amplifier, an MCU, a phase reversal gate, an AND gate and the like, and partial configuration circuits of all modules, and is electrically interconnected with the substrate in a WB mode.
The method for testing the servo control chip special for the chip atomic clock comprises the following steps:
firstly, chip size testing: the length, width and height of the servo control chip special for the chip atomic clock are measured by a vernier caliper.
And II, power supply and power consumption testing: the equipment connection is as shown in fig. 6, a servo control chip special for a chip atomic clock is installed on a test board for testing, and a direct current voltage source supplies power to the test board; reading a voltage value and a current value of a direct current voltage source, and calculating power consumption; if the system is unstable due to accidental interference, repeating the test; and after the test is finished, disconnecting the system.
Thirdly, the functional test steps are as follows:
step 11, connecting the devices as shown in fig. 7, installing the servo control chip special for the chip atomic clock on a test board for testing, placing the test board in a high-low temperature box, and supplying power to the test board by a direct-current voltage source. After the temperature of the physical system is stable, the temperature of the high-low temperature box is read to display and detect the ambient temperature T0Acquiring the temperature T of the absorption bubble through the resistance value of the corresponding thermistor1And laser temperature T2；
Step 12, adjusting the temperature of the high-low temperature box to ensure that the ambient temperature is T'0Acquiring the temperature T 'of the absorption bubble through the resistance value of the corresponding thermistor after the temperature of the physical system is stable'1And laser temperature T'2；
Calculating the temperature control accuracy C of the absorption bubble according to the formula (2)1And laser temperature control accuracy C2；
C1＝ΔT1/ΔT0 (1)
C2＝ΔT2/ΔT0 (2)
In the formula,. DELTA.T0＝T′0-T0，ΔT1＝T′1-T1，ΔT2＝T′2-T2。
Step 13, completing acquisition, processing and control of an atomic absorption spectrum signal by a laser frequency servo loop, obtaining a differential signal of an atomic absorption spectrum, and observing the locking condition of laser frequency;
step 14, the laser frequency servo loop finishes the acquisition, processing and control of a CPT resonance spectrum signal, obtains a differential signal of the CPT resonance spectrum, and observes the locking condition of the crystal oscillator frequency;
step 15, using standard 1PPS signal, 1PPS discipline calibration loop to complete detection, processing and feedback of time interval error, completing discipline function in whole clock, using counter to measure synchronous error of chip atomic clock and standard 1PPS signal;
step 16, realizing 1PPS time synchronization and atomic clock frequency calibration, and measuring the frequency accuracy of the chip atomic clock by using a frequency tester;
step 17, the radio frequency phase-locked loop finishes frequency multiplication of the 10MHz signal, and a frequency spectrograph is used for measuring the output frequency;
step 18, changing the control word, measuring the output frequency variation by using a frequency spectrograph, and calculating the signal resolution;
and 19, online debugging of the atomic clock and normal output of the working state show that the RS232 communication function is normal.
Fourthly, the working temperature testing steps are as follows:
step 21, connecting the test equipment as shown in fig. 5, placing the chip on the test equipment in the high-low temperature test environment by using the heat flow cover temperature control system shown in fig. 8, and adjusting the heat flow cover to a proper angle to completely cover the device to be tested.
The heat flow cover system starts to work, compressed air is heated or cooled to a proper temperature through the heat flow cover system, the compressed air is continuously injected into a cavity of the heat flow cover at a high speed to carry out heat exchange, and meanwhile, a temperature control probe carries out temperature monitoring;
after a certain time, the temperature in the cavity reaches the designated index temperature, the thermal equilibrium is reached, and after the stable temperature is reached, the test of each function of the device is carried out for 1 min;
step 22, testing an integrating circuit: and the MCU on the test board controls one-out-of-four analog switches to be switched to a PD test channel. The signal generator outputs triangular waves which are applied to a PD _ Input pin and converted into square wave signals through an integrating circuit in a special servo control chip. Observing a square wave signal output test point CPTDC by using an oscilloscope, and if the square wave signal output test point is the square wave signal, enabling an integrating circuit in the chip to have normal function;
step 23, filter circuit testing: the MCU on the test board controls the one-out-of-four analog switch to be switched to a PDInput test channel. The sine wave signals output by the signal generator fre1/fre2 are applied to a PDInput pin for analog-to-digital conversion of a special servo control chip, and the oscilloscope is used for testing output test points AC1 and AC2 and recording amplitude and frequency information; and the information acquired by the MCU in the special servo control chip is sent to an upper computer by using a serial port to display amplitude and frequency information. If the error between the data tested by the oscilloscope and the data acquired by the special servo control chip is smaller than a certain threshold value, the function of the filter circuit in the chip is normal;
step 24, testing the R _ TEC circuit: and the MCU on the test board controls one-out-of-four analog switches to switch to the R _ TEC test channel. The signal generator outputs fre1 sine wave signal to be applied to the R _ TEC test pin, and TEC + is output after signal processing is completed by the special servo control chip. Testing the TEC + pin by using an oscilloscope, comparing the input and output signals, and if the error is smaller than a certain threshold value, determining that the function is normal;
step 25, testing a TEMP _ CELL circuit: the MCU on the test board controls one-out-of-four analog switches to switch to a TEMP _ CELL test channel. The signal generator outputs fre1 sine wave signal to be applied to TEMP _ CELL pin, and outputs CELL _ TC after completing signal processing by special servo control chip. Testing a CELL _ TC pin by using an oscilloscope, comparing input and output signals, and if the error is controlled within a certain threshold value, determining that the function is normal;
step 26, 1PPS _ IN circuit test: the MCU on the test board outputs a high-level signal to be applied to a 1PPS _ IN pin; the MCU in the special servo control chip applies low level to the P1 signal, VO _ PPS is low level for the MCU in the chip to collect after passing through a comparison circuit in the chip, and the collection result is low level; the MCU on the test board outputs a high-level signal to be applied to a 1PPS _ IN pin; the MCU in the chip applies high level to a P1 signal, VO _ PPS is high level for the MCU in the chip to collect after passing through the comparison circuit in the chip, and the collection result is high level;
step 27, IO function test: pins such as PLL _ LD, LOCK, PLL _ LE and the like are led out to the MCU on the test board to carry out loop back test, and if data receiving and sending are normal, the function is considered to be normal;
step 28, current source testing: the voltage of an LT _ VDC pin of a DAC in the chip is input voltage of the constant current source, the LT _ VDC pin is measured by using a universal meter, the output current of an IDC pin can be calculated according to a theory, the current of the IDC pin is measured by using the universal meter, and whether the constant current source works normally or not can be judged by comparing a theoretical value with a test value;
step 29, voltage source testing: testing the voltage of the C + pin by using a universal meter, comparing the measured value with a theoretical value, and if the amplitude error is smaller than a certain threshold value, determining that the voltage source works normally;
and after the test is finished, disconnecting the system.
In conclusion, the SIP packaging method of the special servo control chip for the chip atomic clock can greatly reduce the volume and the power consumption of the atomic clock, and has important significance for the development of the current chip atomic clock and the development of weapon models.
The SIP packaging design mainly comprises a core chip and an inherent configuration circuit, and partial configuration circuits of related modules are arranged outside the chip, so that the resistance-capacitance parameters of the partial configuration circuits are convenient to adjust, the adjustability of the integral functions of the chip is enhanced, and the compatibility and the applicability of the chip to different physical systems are enhanced.
The invention provides a set of complete testing method aiming at the SIP chip, and the indexes of the chip such as size, power consumption, function and the like can be effectively inspected.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (10)
1. A SIP system of a servo control chip special for a chip atomic clock is characterized by comprising an MCU, a light detection signal acquisition circuit, a laser driving circuit, a temperature acquisition circuit, a laser temperature control circuit and a configuration circuit, wherein the MCU, the light detection signal acquisition circuit, the laser driving circuit, the temperature acquisition circuit and the laser temperature control circuit are integrated in an SIP package;
the optical detection signal acquisition circuit is used for generating light intensity detection data after an input signal is amplified, filtered and subjected to analog-to-digital conversion and inputting the light intensity detection data into the MCU;
the laser driving circuit is used for generating laser driving voltage after performing digital-to-analog conversion on laser driving control data output by the MCU and connecting the laser driving voltage to a laser control end to realize laser mode locking;
the temperature acquisition circuit is used for receiving temperature sensing voltage signals of the laser and the absorption bubble, generating temperature detection data after analog-to-digital conversion and inputting the temperature detection data to the MCU;
the laser temperature control circuit is used for performing digital-to-analog conversion on temperature control data output by the MCU and then generating temperature control voltage to control the TEC of the laser and the power tube of the absorption bulb to heat;
the MCU is used for processing the light intensity detection data and generating laser drive control data; processing the temperature detection data to generate temperature control data;
the configuration circuit includes: a first configuration circuit for adjusting the amplitude of the light detection signal; a second configuration circuit for varying the laser drive voltage; a third configuration circuit for changing a temperature sensing coefficient; a fourth configuration circuit for changing the temperature control coefficient; the temperature sensing coefficient comprises a proportional relation between a detected temperature value and a sensing voltage signal; the temperature control coefficient comprises a proportional relation between temperature control voltage and temperature change.
2. The SIP system of the chip-atomic clock dedicated servo control chip according to claim 1, further comprising a magnetic field control circuit integrated inside the SIP package, wherein the magnetic field control circuit is configured to receive the magnetic field control data from the MCU, and control the magnetic field synthesizing unit to generate the constant magnetic field after digital-to-analog conversion.
3. The SIP system of claim 1, further comprising:
the radio frequency phase locking circuit is integrated in the SIP package and used for converting voltage-controlled data output by the MCU into a crystal oscillator control voltage after digital-to-analog conversion and connecting the crystal oscillator control voltage to a voltage-controlled end of the crystal oscillator so as to realize microwave frequency locking;
the configuration circuit further includes: and the fifth configuration circuit is used for adjusting the crystal oscillator control voltage.
4. The SIP system of chip atomic clock dedicated servo control chip of claim 1,
the adjustable portion of the configuration circuit is disposed outside the SIP package and includes a resistor, a capacitor, or an inductor.
5. The SIP system of claim 1, further comprising a 1PPS calibration circuit disposed inside the SIP package for detecting the time interval error, wherein the counter is used to measure the synchronization error between the chip atomic clock and the standard 1PPS signal inputted from the 1PPS _ IN port.
6. The SIP system of chip atomic clock dedicated servo control chip of claim 1,
the radio frequency phase-locked loop is also used for carrying out frequency multiplication on the 10MHz signal.
7. The SIP system of chip atomic clock dedicated servo control chip of claim 1,
the optical detection signal acquisition circuit comprises a photoelectric signal input port PD, is divided into two frequency signals through integration, low-pass amplification and analog-to-digital conversion, and is input to the MCU.
8. A test system for the SIP system of the servo control chip dedicated for the chip atomic clock according to any one of claims 1 to 7, comprising:
a heat flux shield testing device and/or a high and low temperature testing device; the heat flux shield testing device comprises: the heat flow cover is connected with the host, compressed air is conveyed into the heat flow cover through the host, and the tested piece is placed in the heat flow cover; the high and low temperature test device comprises: a high and low temperature cabinet or a heating table;
the SIP system is used as a tested piece;
the device also comprises a counter, a frequency tester, a frequency spectrograph and an industrial personal computer;
the industrial personal computer is used for switching the test channels; the frequency tester is used for testing input and output signals of the radio frequency phase-locked loop circuit; the oscilloscope is used for testing input and output signals of the optical detection signal acquisition circuit; the frequency spectrograph is used for testing an output signal of the atomic clock; the counter is used for testing the synchronization error of the chip atom and the standard 1PPS signal.
9. A test method for testing the SIP system of the servo control chip special for the chip atomic clock as claimed in any one of claims 1 to 7 is characterized by comprising the following steps:
testing the temperature control precision of the absorption bubble and the temperature control precision of the laser under high and low temperature environments;
measuring the laser frequency and testing the crystal oscillator frequency;
measuring the synchronous error of the chip atomic clock and the standard 1PPS signal; testing the frequency accuracy of the chip atomic clock;
the phase-locked loop output frequency is measured.
10. The test method of claim 9,
the temperature in the heat flow cover is raised to a specified temperature, and the following functions are tested after heat balance is achieved:
testing an integrating circuit; testing a filter circuit; 1PPS _ IN circuit test.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111556310.8A CN114428473A (en) | 2021-12-17 | 2021-12-17 | Special servo control chip SIP system, test device and method for chip atomic clock |
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