CN114428164A - Marking device and marking method for tracing surface defects of metal strip - Google Patents
Marking device and marking method for tracing surface defects of metal strip Download PDFInfo
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- CN114428164A CN114428164A CN202210041571.4A CN202210041571A CN114428164A CN 114428164 A CN114428164 A CN 114428164A CN 202210041571 A CN202210041571 A CN 202210041571A CN 114428164 A CN114428164 A CN 114428164A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/204—Structure thereof, e.g. crystal structure
- G01N33/2045—Defects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
- B41J3/413—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material for metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0058—Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
Abstract
The invention discloses a defect marking device and a marking method for tracing surface defects of metal strips, wherein the marking device comprises a defect marking control system and a defect marking online monitoring system, and the defect marking control system comprises a control MCU unit, a multi-path defect high-speed input module, a high-speed electromagnetic valve driving module, a welding seam signal input module, an encoder signal input module, a marking state monitoring module and a two-path Ethernet communication module; the defect marking online monitoring system comprises an Ethernet communication module, a defect input real-time monitoring module, a field encoder input monitoring module, a field welding seam signal information monitoring module, a marking parameter configuration module, a marking result display module and a marking result query module. The invention improves the data processing capacity of the defect mark through a dual-core master-slave control structure, realizes the plug-in combination of a defect mark control system and a defect mark on-line monitoring system, is convenient for flexible deployment on site and is suitable for various scenes.
Description
Technical Field
The invention belongs to the technical field of metal strip defect detection, and particularly relates to a marking device and a marking method for tracing surface defects of a metal strip.
Background
Metal strip materials can produce surface defects during the manufacturing process that can be detected by surface defect inspection equipment and the metal strip material with the major defects is cut away. The detected defects can only be prompted by a circulation card (paper) when circulating in the process, and the defects can not be marked clearly by the circulation card mode, so that the surface detection instrument cannot exert the maximum value. The effective reminding of the defect can facilitate the subsequent process to cut off the strip area with the fatal defect, and can also avoid repeated detection when the final customer uses the metal strip, so that the delivery of the strip with the defect becomes practical.
At present, domestic metal strip surface defect detection instruments are deployed in large quantity, but a matched defect marking device is also lacked for marking the surface defects on the metal strips, and the sound-light alarm is generally only carried out on the defects output by the metal strip surface defect detection instruments on site.
Disclosure of Invention
In view of the above, the present invention provides a metal strip defect marking apparatus, which clearly marks the defects detected by the surface defect detecting apparatus on the metal strip, so as to provide value for other processes after the metal strip defect detecting process, and also to provide benefits for the delivery of the defects to the final customers.
The marking device for tracing the surface defects of the metal strip, disclosed by the first aspect of the invention, comprises a defect marking control system and a defect marking online monitoring system, wherein the defect marking control system comprises a control MCU unit 1, a multi-path defect high-speed input module 2, a high-speed electromagnetic valve driving module 3, a welding seam signal input module 4, an encoder signal input module 5, a marking state monitoring module 6 and a two-path Ethernet communication module 7;
the defect marking online monitoring system comprises an Ethernet communication module 8, a defect input real-time monitoring module 9, a field encoder input monitoring module 10, a field welding seam signal information monitoring module 11, a marking parameter configuration module 12, a marking result display module 13 and a marking result query module 14;
the field multi-path defect high-speed input module 2, the welding seam signal input module 4 and the encoder signal input module 5 are used as the input of the control MCU control unit 1;
the real-time state of the control MCU unit 1 is output through a marking state monitoring module 6;
the marking output result calculated in real time by the MCU unit 1 is controlled to be output through the high-speed electromagnetic valve driving module 3; the control MCU unit 1 communicates with the on-site L1 electrical system and the defect mark on-line monitoring system through the two-way Ethernet communication module 7.
Further, the output result of the defect marking control system is output to the defect input real-time monitoring module 9, the field encoder input monitoring module 10, the field weld information monitoring module 11, the marking result display 13 and the marking result query module 14 through the ethernet communication module 8, respectively.
Further, the marking parameter configuration module 12 configures the marking parameters of the defect marking control system.
The marking method for tracing the surface defects of the metal strip, disclosed by the second aspect of the invention, comprises the following steps:
when the defect marking device receives the welding seam signal, the new metal strip detection is started, the defect cache and the encoder cache are cleared, and a defect IO signal sent by the surface detector is received;
the defect IO signals positioned in the head and tail dead zones of the metal are not marked, and the defects counted into the marking and merging process are merged according to a defect merging algorithm;
when a defect reaches the spray head, marking and outputting according to the initial position and the end of the defect counted in the cache;
when a weld signal arrives, the current metal strip marking is finished.
Further, the defect merging algorithm comprises the following steps:
s1: the defect marking device receives the welding seam signal as an initial signal for starting detection of a new metal strip, and clears the defect buffer and the encoder buffer; the metal strip has a belt head dead zone and a belt tail dead zone, the size of the belt head dead zone is Hb, the size of the belt tail dead zone is Tb, the length of the metal strip is L, the interval [0, Hb ] is the belt head dead zone, the interval [ L-Tb, L ] is the belt tail dead zone, and L-Tb is larger than Hb;
s2: the defect marking apparatus receives the nth defect DnAt the time of rising edge signal, defect start position EsnWhen receiving the signal of the falling edge of the defect IO, the defect end position EenThen D isnHas an interval of (Es)n，Een) D is judged according to a preset rulenWhether a marking process is included;
s3: counting defects in the marking process, when D is receivednIf there is a defect D in the last marked flown-1When Esn<＝Een-1Then D will benAnd Dn-1Merging, new DnThe initial position is Esn-1End position is Een；
If Esn>Een-1Defect DnCalculating the next merging flow judgment;
if D is not presentn-1Defect DnThe next merging process judgment is also included;
s4: merged defect DnAnd when the position of the spray head is reached, marking the defects according to the combined initial position and end position.
Further, the preset rule is as follows:
when Esn<Hb and Een<Hb or Esn>L-Tb and Een>The defect signal is not included in the marking process;
when Esn<Hb and Een>Hb, or Esn>Hb and Een<L-Tb, or Esn<L-Tb and Een>When L-Tb, the defect signal is included in the marking process; wherein when Esn<Hb and Een>Hb time DnThe initial position is modified into Hb; when Esn<L-Tb and Een>When L-Tb is, DnEnd position modificationL–Tb。
Further, counting Es every preset number of marking processesn<Hb and Een<The number of Hb times is marked as a, and Es is countedn>Hb and Een<The number of times of L-Tb is recorded as b, and Es is countedn<L-Tb and Een>The number of times of L-Tb is marked as c, and Es is countedn<Hb and Een<The number of Hb times, denoted as d, and Es was countedn>L-Tb and Een>B is calculated according to the following formula, the number of times L-Tb is denoted as eh：
Where α, β, γ are proportionality coefficients, if BhAnd if the number of the defect marks is larger than the preset threshold value, the defect mark control system sends the early warning signal to the defect mark online monitoring system and displays the early warning signal through the mark result display module.
Compared with the prior art, the invention has the following beneficial effects:
the defect marking device can receive the defects detected by the surface defect detecting instrument in real time on line through the high-speed IO port, simultaneously receive encoder signals and welding line signals in the production process of the metal strip through the high-speed IO port, and receive the metal strip information from the on-site L1 system through the Ethernet port, so that each defect can have accurate position information and metal strip information, and the follow-up data processing is convenient.
The defect marking device realizes parallel input of multiple paths of defects through multiple paths of high-speed IO, and realizes combination processing of the defects of the metal strip in two dimensions, namely the transverse dimension and the longitudinal dimension, through a defect combination algorithm of a built-in MCU.
The defect marking device provides output in an active mode and a passive mode, and the high-speed electromagnetic valve is driven to drive the ink jet nozzle to mark the defect at the defect position of the metal strip, so that the purpose of marking the metal strip is achieved.
The dual-core master-slave control structure improves the data processing capacity of the defect mark and realizes the plug-in combination of a defect mark control system and a defect mark on-line monitoring system.
Drawings
FIG. 1 is a schematic block diagram of a metal strip defect marking apparatus according to the present invention;
FIG. 2 is a schematic block diagram of information interaction of a metal strip defect marking apparatus of the present invention;
FIG. 3 is a flowchart of a defect merging method of the present invention;
FIG. 4 is a schematic diagram of a defect accounting for the defect flow of the present invention;
FIG. 5 is a flowchart of a defect marking method according to the present invention.
In the figure, 1-a control MCU unit, 2-a multi-path defect high-speed input module, 3-a high-speed solenoid valve driving module, 4-a welding seam signal input module, 5-an encoder signal input module, 6-a marking state monitoring module, 7-a two-way Ethernet communication module, 8-an Ethernet communication module, 9-a defect input real-time monitoring module, 10-a field encoder input monitoring module, 11-a field welding seam information monitoring module, 12-a marking parameter configuration module, 13-a marking result display module and 14-a marking result query module.
Detailed Description
The invention is further described with reference to the accompanying drawings, but the invention is not limited in any way, and any alterations or substitutions based on the teaching of the invention are within the scope of the invention.
The device is arranged in a metal strip production workshop, receives a surface defect signal sent by an online metal strip surface defect online detection instrument, accurately positions the surface defect signal in the strip production process by combining a welding seam detection signal and a strip encoder signal, and drives the spray head to mark the defect at the position where the metal strip surface defect appears.
Referring to fig. 1, the defect marking device for tracing the surface defects of the metal strip has a dual-core master-slave control structure, and comprises a defect marking control system and a defect marking online monitoring system, so that the data processing capacity of the defect marks is improved, the defect marking control system is a master computer, and the defect marking online monitoring system is a slave computer, so that the defect marking control system and the defect marking online monitoring system can be combined in a plug-in manner.
The defect marking control system comprises a control MCU unit 1, a multi-path defect high-speed input module 2, a high-speed electromagnetic valve driving module 3, a welding seam signal input module 4, an encoder signal input module 5, a marking state monitoring module 6 and a two-path Ethernet communication module 7.
The defect marking online monitoring system comprises an Ethernet communication module 8, a defect input real-time monitoring module 9, a field encoder input monitoring module 10, a field weld information monitoring module 11, a marking parameter configuration module 12, a marking result display module 13 and a marking result query module 14; the field multi-path defect high-speed input module 2, the welding seam signal input module 4 and the encoder signal input module 5 are used as the input of the control MCU control unit 1; controlling the real-time state of the MCU unit 1 to be output through the marking state monitoring module 6; the marking output result calculated in real time by the MCU unit 1 is controlled to be output through the high-speed electromagnetic valve driving module 3; the MCU unit 1 is controlled to communicate with a field L1 electrical system and a defect marking online monitoring system through a two-way Ethernet communication module 7; the output result of the defect marking control system is output to the defect marking on-line monitoring system through the Ethernet communication module 8, and respectively corresponds to a defect input real-time monitoring module 9, a field encoder input monitoring module 10, a field weld information monitoring module 11, a marking parameter configuration module 12, a marking result display 13 and a marking result query module 14; the marking parameters of the defect marking control system are configured by the marking parameter configuration module 12.
The defect marking control system is connected with the field encoder, the surface defect detector and the welding seam detector through an IO interface, connected with the field L1 electrical system through an Ethernet interface and connected with the spray head through hard wiring. FIG. 2 shows a graph of the interaction of a metal strip defect marker as it is deployed in the field. The defect sprayer device is placed at a fixed position behind the metal strip surface defect detector, the time when the detected defect reaches the defect sprayer device can be calculated through time delay, and the defect marking control system can mark when the defect reaches the defect sprayer device. The defect marking control system receives the metal strip information including the number of the metal strip, production time, length, width, thickness, end customer, etc. from the field L1 electrical system through the ethernet port. And all output results in the defect marking control system are output to the defect marking on-line monitoring system for a user to monitor the defect marking result of the metal strip in real time.
The defect marking device provides active and passive output modes, wherein the marking device provides a 24V direct current driving voltage signal when the active output mode is adopted, and a driving electromagnetic valve is not required to provide a power supply signal; when the passive output is carried out, the marking device only provides on-off signals, and the driving electromagnetic valve needs to be independently powered.
Fig. 3 shows a defect merging process of a metal strip, which comprises the following steps:
(1) the defect marking device receives the welding seam signal as an initial signal for starting detection of a new metal strip, and clears the defect buffer and the encoder buffer; the metal strip has head and tail blind areas, the defects of the blind areas are not subjected to defect combination treatment, the size of the head blind area of the metal strip is Hb, and the size of the tail blind area of the metal strip is Tb. And if the length of the metal strip is L, the zone [0, Hb ] is a dead zone with the head, the zone [ L-Tb, L ] is a dead zone with the tail, and L-Tb is larger than Hb.
(2) The defect marking apparatus receives the Nth defect (D)n) Setting the defect initial position Es during rising edge signalnWhen receiving the signal of the falling edge of the defect IO, setting the defect ending position EenThen D isn(Esn，Een)。DnThere are several situations whether a marker is included:
a. when Esn<Hb and Een<Hb or Esn>L-Tb and Een>＝L-Tb，The defect signal is not included in the labeling process.
b. As shown in FIG. 4, the rectangle in the figure represents the defect signal Dn, when Esn<Hb and Een>Hb (FIG. 4a), or Esn<L-Tb and Een>L-Tb (FIG. 4b), or Esn>Hb and Een<When L-Tb (fig. 4c), the defect signal is included in the marking process. Wherein when Esn<Hb and Een>Hb time DnThe starting position is modified to Hb; when Esn<L-Tb and Een>When L-Tb is, DnThe end position is modified to L-Tb.
(3) Considering only the defects of the statistical incorporation marking process, when receiving DnWhen D is presentn-1When Esn<＝Een-1Then D isnAnd Dn-1Merging, new DnThe initial position is Esn-1End position is Een(ii) a When Esn>Een-1，DnThe next marking process is included for judging whether to merge. If D is not presentn-1，DnThe next marking process is also included for determining whether to merge.
(4) Merged defect DnAnd when the position of the spray head is reached, marking the defects according to the combined initial position and end position.
Fig. 5 shows a metal strip defect marking flow. When the defect marking device receives the welding seam signal, the new metal strip detection starts, the defect cache and the encoder cache are cleared, and the defect IO signal sent by the surface detector is received. And (4) the defect IO signals positioned in the head and tail dead zones of the metal are not marked, and the defects counted in the marking and merging process are merged according to a defect merging algorithm. And when the defect reaches the spray head, marking and outputting according to the initial position and the end of the defect counted by the cache. When a weld signal arrives, the current metal strip marking is finished.
Preferably, the Es is counted every several marking processesn<Hb and Een<The number of Hb times is marked as a, and Es is countedn>Hb and Een<The number of times of L-Tb is recorded as b, and Es is countedn<L-Tb and Een>The number of times of L-Tb is marked as c, and Es is countedn<Hb and Een<The number of Hb times, denoted as d, and Es was countedn>L-Tb and Een>B is calculated according to the following formula, the number of times L-Tb is denoted as eh：
Where α, β, γ are proportionality coefficients, if BhIf the defect number is larger than the preset threshold value, the defect number in the production process exceeds the early warning range, the defect marking control system sends the early warning signal to the defect marking on-line monitoring system, and the defect marking on-line monitoring system is displayed through the marking result display module for manual intervention.
Compared with the prior art, the invention has the following beneficial effects:
the defect marking device can receive the defects detected by the surface defect detecting instrument in real time on line through the high-speed IO port, simultaneously receive encoder signals and welding line signals in the production process of the metal strip through the high-speed IO port, and receive the metal strip information from the on-site L1 system through the Ethernet port, so that each defect can have accurate position information and metal strip information, and the follow-up data processing is convenient.
The defect marking device realizes parallel input of multiple paths of defects through multiple paths of high-speed IO, and realizes combination processing of the defects of the metal strip in two dimensions, namely the transverse dimension and the longitudinal dimension, through a defect combination algorithm of a built-in MCU.
The defect marking device provides output in an active mode and a passive mode, and the high-speed electromagnetic valve is driven to drive the ink jet nozzle to mark the defect at the defect position of the metal strip, so that the purpose of marking the metal strip is achieved.
The dual-core master-slave control structure improves the data processing capacity of the defect mark and realizes the plug-in combination of a defect mark control system and a defect mark on-line monitoring system.
The word "preferred" is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as "preferred" is not necessarily to be construed as advantageous over other aspects or designs. Rather, use of the word "preferred" is intended to present concepts in a concrete fashion. The term "or" as used in this application is intended to mean an inclusive "or" rather than an exclusive "or". That is, unless specified otherwise or clear from context, "X employs A or B" is intended to include either of the permutations as a matter of course. That is, if X employs A; b is used as X; or X employs both A and B, then "X employs A or B" is satisfied in any of the foregoing examples.
Also, although the disclosure has been shown and described with respect to one or an implementation, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. The present disclosure includes all such modifications and alterations, and is limited only by the scope of the appended claims. In particular regard to the various functions performed by the above described components (e.g., elements, etc.), the terms used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the disclosure. In addition, while a particular feature of the disclosure may have been disclosed with respect to only one of several implementations, such feature may be combined with one or other features of the other implementations as may be desired and advantageous for a given or particular application. Furthermore, to the extent that the terms "includes," has, "" contains, "or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising.
Each functional unit in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or a plurality of or more than one unit are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium. The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc. Each apparatus or system described above may execute the storage method in the corresponding method embodiment.
In summary, the above-mentioned embodiment is an implementation manner of the present invention, but the implementation manner of the present invention is not limited by the above-mentioned embodiment, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be regarded as equivalent replacements within the protection scope of the present invention.
Claims (8)
1. A marking device for tracing surface defects of metal strips is characterized by comprising a defect marking control system and a defect marking online monitoring system, wherein the defect marking control system comprises a control MCU unit (1), a multi-path defect high-speed input module (2), a high-speed electromagnetic valve driving module (3), a welding seam signal input module (4), an encoder signal input module (5), a marking state monitoring module (6) and a two-path Ethernet communication module (7);
the defect marking online monitoring system comprises an Ethernet communication module (8), a defect input real-time monitoring module (9), a field encoder input monitoring module (10), a field welding seam signal information monitoring module (11), a marking parameter configuration module (12), a marking result display module (13) and a marking result query module (14);
the field multi-path defect high-speed input module (2), the welding seam signal input module (4) and the encoder signal input module (5) are used as the input of the control MCU control unit (1);
the real-time state of the MCU (1) is controlled to be output through a marking state monitoring module (6);
the marking output result calculated in real time by the MCU (1) is controlled to be output through the high-speed electromagnetic valve driving module (3); and the control MCU unit (1) is communicated with the field L1 electrical system and the defect mark online monitoring system through a two-way Ethernet communication module (7).
2. The marking device for tracing the surface defects of the metal strip according to claim 1, wherein the output results of the defect marking control system are respectively output to the defect input real-time monitoring module (9), the field encoder input monitoring module (10), the field weld information monitoring module (11), the marking result display module (13) and the marking result query module (14) through an Ethernet communication module (8).
3. A marking apparatus for tracing surface defects of metal strips according to claim 1, wherein said defect marking control system is connected to the field encoder, the surface defect detector and the weld seam detector through IO interface, connected to the field L1 electrical system through ethernet interface, and connected to the spray head through hard wiring.
4. The apparatus for marking defects traced back on the surface of a metal strip according to claim 1, wherein said marking parameter configuration module (12) configures the marking parameters of a defect marking control system.
5. A marking method for tracing the surface defects of a metal strip is characterized by comprising the following steps:
the defect marking device receives the welding line signal, starts the current metal strip marking process, clears the defect cache and the encoder cache, and receives a defect IO signal sent by the surface defect detector;
the defect IO signals positioned in the head and tail dead zones of the metal are not marked, and the defects counted into the marking and merging process are merged according to a defect merging algorithm;
when a defect signal reaches the sprayer, marking and outputting according to the initial position and the end of the defect counted in the cache;
when the next weld signal arrives, the current metal strip marking process is finished.
6. A marking method for tracing back metal strip surface defects according to claim 5, characterized in that said defect merging algorithm comprises the following steps:
s1: the defect marking device receives the welding seam signal as an initial signal for starting detection of a new metal strip, and clears the defect buffer and the encoder buffer; the metal strip has a belt head dead zone and a belt tail dead zone, the size of the belt head dead zone is Hb, the size of the belt tail dead zone is Tb, the length of the metal strip is L, the interval [0, Hb ] is the belt head dead zone, the interval [ L-Tb, L ] is the belt tail dead zone, and L-Tb is larger than Hb;
s2: the defect marking apparatus receives the nth defect DnAt the time of rising edge signal, defect start position EsnWhen receiving defect IO falling edge signal, defect end position EenThen D isnHas an interval of (Es)n，Een) D is judged according to a preset rulenWhether a marking process is included;
s3: for defect signals D included in the marking processnWhen receiving DnIf there is a defect signal D which is included in the marking processn-1：
If Esn<＝Een-1Then D is addednAnd Dn-1Merge into new DnNew DnThe initial position is Esn-1End position is Een；
If Esn>Een-1Defect signal DnRecording the next marking process for judging whether to merge;
if D is not presentn-1Defect signal DnRecording the next marking process for judging whether to merge;
s4: merged defect signal DnAnd when the position of the spray head is reached, the spray head marks the defects according to the combined initial position and the combined end position.
7. The marking method for tracing surface defects of metal strips according to claim 6, characterized in that said preset rules are as follows:
when Esn<Hb and Een<Hb, or Esn>L-Tb and Een>The defect signal is not included in the marking process;
when Esn<Hb and Een>Hb, or Esn>Hb and Een<L-Tb, or Esn<L-Tb and Een>When L-Tb, the defect signal is included in the marking process; wherein when Esn<Hb and Een>Hb time DnThe initial position is modified into Hb; when Esn<L-Tb and Een>When L-Tb is, DnThe end position is modified to L-Tb.
8. A marking method for tracing back surface defects of metal strips as claimed in claim 7, wherein Es is counted every predetermined number of marking passesn<Hb and Een<The number of Hb times is marked as a, and Es is countedn>Hb and Een<The number of times of L-Tb is recorded as b, and Es is countedn<L-Tb and Een>The number of times of L-Tb is marked as c, and Es is countedn<Hb and Een<Number of Hb, denoted d, and Es was countedn>L-Tb and Een>B is calculated according to the following formula, the number of times L-Tb is denoted as eh：
Where α, β, γ are proportionality coefficients, if BhAnd if the number of the defects is larger than the preset threshold value, the defect marking control system sends the early warning signal to the defect marking on-line monitoring system and displays the early warning signal through a marking result display module (13).
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