CN114427888A - Double-group piezoelectric ceramic vibration pressure sensor - Google Patents
Double-group piezoelectric ceramic vibration pressure sensor Download PDFInfo
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
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Abstract
The invention relates to a double-group piezoelectric ceramic vibration pressure sensor which comprises a force sensor shell, a gland, a bearing piece, a piezoelectric ceramic force sensing unit and a small circuit board, wherein the gland is arranged on the force sensor shell; the gland is arranged at the opening end of the force sensor shell, the disc of the supporting piece is positioned between the gland and the force sensor shell, and the supporting rod of the supporting piece penetrates through the gland and is connected with the external load acting device through external threads. The double-group piezoelectric ceramic vibration pressure sensor is provided with two piezoelectric ceramic force sensing units, wherein the directions of dynamic acting forces are always opposite, output charge signals are also always opposite, the charge signals of the two piezoelectric ceramic force sensing units are amplified and converted into two voltage signals, the two voltage signals are differentially amplified to obtain a single voltage, high-frequency noise is inhibited by using a high-order low-pass filter, the conditioned voltage signals are output, and a measured external power load is obtained through a signal acquisition instrument, a signal analysis processing technology and force sensitivity parameters, so that the measurement result is more accurate.
Description
Technical Field
The invention relates to the field of ship, ocean engineering and mechanical engineering, in particular to a double-group piezoelectric ceramic vibration pressure sensor.
Background
Dynamic pressure measurement is an important mechanical parameter for vibration and wave propagation analysis of mechanical structural systems. In the fields of ship and ocean engineering, underwater acoustic engineering, mechanical engineering and the like, the vibration load caused by a power mechanical device needs to be tested in an experiment, and the transmission characteristic of elastic waves is measured. Heavy-duty ship power devices such as ship diesel engines, large alternating current motors, ship gear boxes and the like are installed on a ship body through a shock absorber, and power loads act on the connection position of the ship power devices and the ship body.
The types of force sensors commonly used are resistive, capacitive and piezoelectric, however, resistive and capacitive pressure sensors are not suitable for high pressure, heavy load dynamic load measurements. Although the piezoelectric force sensor can be used for dynamic heavy-load pressure testing, a pre-tightening device is required to enable the piezoelectric ceramic piece force sensing element to be in a pressure stress state. The larger the load, the larger the pretension pressure and the larger the structural size of the piezoelectric force sensor.
The pretension device provides another vibration transmission channel for the power load transmission of the mechanical device, so that the single-channel acting load piezoelectric type force sensor cannot truly reflect the actual load acting on the foundation structure.
Disclosure of Invention
In view of the above, it is necessary to provide a dual-group piezoelectric ceramic vibration pressure sensor with more accurate measurement.
A double-group piezoelectric ceramic vibration pressure sensor comprises a force sensor shell, a gland, a bearing piece, a piezoelectric ceramic force sensing unit and a small circuit board; the gland is arranged at the opening end of the force sensor shell, the disc of the supporting piece is positioned between the gland and the force sensor shell, and the supporting rod of the supporting piece penetrates through the gland and is connected with an external load acting device through external threads; the two piezoelectric ceramic force sensing units are respectively arranged between a disc of the supporting piece and the gland and between a pressure rod of the supporting piece and a boss at the bottom in the shell of the force sensor; the two piezoelectric ceramic force sensing units are electrically connected with the small circuit board, and the small circuit board converts charge signals of the two groups of piezoelectric ceramic force sensing units into voltage signals for differential amplification of two paths of signals and low-pass filtering conditioning of the voltage signals; the small circuit board is electrically connected with the external power supply unit and the signal acquisition instrument.
Further, the gland can be fixed with the force sensor shell through a female thread connection mode, and also can be fixed with the force sensor shell through laser welding or a bolt connection mode.
Furthermore, the piezoelectric ceramic force sensing unit positioned between the disc of the supporting piece and the gland comprises a piezoelectric ceramic ring piece, a single copper sheet annular electrode with lugs and double copper sheet annular electrodes with lugs; the two piezoelectric ceramic ring pieces are sleeved on a support rod of the supporting piece, and the single copper sheet annular electrode with the lug is positioned between the two piezoelectric ceramic ring pieces and is connected with the anodes of the two piezoelectric ceramic ring pieces; two ends of the two copper sheet ring electrodes with the lugs are respectively attached to the back surfaces of the two piezoelectric ceramic ring sheets to connect the negative electrodes of the two piezoelectric ceramic ring sheets.
Furthermore, a rubber tube is sleeved on the support rod, and the inner ring of the piezoelectric ceramic ring piece sleeved on the support rod is attached to the outer ring of the rubber tube.
Furthermore, two ends of the double-copper-sheet annular electrode with the lug are respectively connected with the gland and the disc of the supporting piece in a prepressing mode.
Furthermore, the piezoelectric ceramic force sensing unit positioned between the pressure rod of the supporting piece and the boss at the bottom in the force sensor shell comprises a piezoelectric ceramic wafer, a single copper sheet circular electrode with lugs and double copper sheet circular electrodes with lugs; the lug-carrying single copper sheet circular electrode is positioned between the two piezoelectric ceramic wafers and is connected with the anodes of the two piezoelectric ceramic wafers; two ends of the double-copper-sheet circular electrode with the lug are respectively attached to the back surfaces of the two piezoelectric ceramic wafers and connected with cathodes of the two piezoelectric ceramic wafers.
Furthermore, two ends of the lug-carrying double-copper-sheet circular electrode are respectively connected with a pressure rod of the supporting piece and a boss of the force sensor shell in a prepressing manner; the boss is located at the bottom in the force sensor shell and is opposite to the pressure rod.
Further, the supporting piece comprises a support rod, a disc and a pressure rod; the pressure lever is positioned at the bottom end of the disc, and the support rod is positioned at the top end of the disc.
Furthermore, the small circuit board is installed at the bottom in the force sensor shell through an insulating board.
Further, the miniature circuit board is connected with an electric connector fixed on the shell of the force sensor through a conductive cable.
Furthermore, two straight notches are formed in the cylindrical surface of the head of the stay bar and are used for fastening and connecting the external threads of the stay bar with an external load acting device.
Furthermore, the center of the outer bottom of the shell of the force sensor is provided with an internal thread hole which is connected with a foundation structure through a bolt.
The double-group piezoelectric ceramic vibration pressure sensor is provided with two piezoelectric ceramic force sensing units, wherein the directions of dynamic acting forces are always opposite, output charge signals are also always opposite, the charge signals of the two piezoelectric ceramic force sensing units are amplified and converted into two voltage signals, the two voltage signals are differentially amplified to obtain a single voltage, a high-order low-pass filter is used for restraining high-frequency noise, the conditioned voltage signals are output, and the measured external power load is obtained through a signal acquisition instrument, a signal analysis processing technology and force sensitivity parameters, so that the measuring result is more accurate.
Drawings
FIG. 1 is a schematic structural diagram of a pressure sensor;
FIG. 2 is a schematic structural view of the gland;
FIG. 3 is a block diagram of a force sensor housing;
FIG. 4 is a schematic view of the structure of the support member;
FIG. 5 is a schematic structural diagram of a piezoceramic force sensing unit in an annular structure;
FIG. 6 is a schematic structural diagram of a piezoceramic force sensing unit with a circular structure;
fig. 7 is a schematic circuit diagram of the pressure sensor.
In the figure: 100. a force sensor housing; 110. a boss; 200. a gland; 300. a support member; 310. a disc; 320. a stay bar; 330. a pressure lever; 400. a piezoelectric ceramic force sensing unit; 410. a piezoelectric ceramic ring piece; 420. a single copper sheet annular electrode with ears; 430. the double copper sheet ring electrode with the lug; 440. a piezoelectric ceramic wafer; 450. a single copper sheet circular electrode with ears; 460. the double copper sheet round electrode with the lug; 500. a rubber tube; 600. a small circuit board; 610. an insulating plate; 620. a conductive cable; 700. an electrical connector.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 4, in one embodiment, a dual-group piezoceramic vibrating pressure sensor comprises a force sensor housing 100, a gland 200, a support member 300, a piezoceramic force sensing unit 400 and a miniature circuit board 600; the gland 200 is arranged at the opening end of the force sensor shell 100, the disc 310 of the support 300 is positioned between the gland 200 and the boss 110 at the bottom in the force sensor shell 100, and the stay rod 320 of the support 300 penetrates through the gland 200 and is connected with an external load acting device through external threads; the two piezoelectric ceramic force sensing units 400 are respectively installed between the disc 310 of the support 300 and the gland 200, and between the pressure rod 330 of the support 300 and the boss 110 of the force sensor housing 100; the two piezoelectric ceramic force sensing units 400 are electrically connected with the small circuit board 600, and the small circuit board 600 converts charge signals of the two groups of piezoelectric ceramic force sensing units 400 into voltage signals for differential amplification of two paths of signals and low-pass filtering conditioning of the voltage signals; the small circuit board 600 is electrically connected with an external power supply unit and a signal acquisition instrument.
In use, an external dynamic load acts on the disk 310 and the pressing rod 330 of the supporting member 300 through the supporting rod 320, if the external dynamic load is a pressure, the piezoceramic force sensing unit 400 located between the disk 310 of the supporting member 300 and the gland 200 is in a tensile stress near the equilibrium position of the pretension, and the piezoceramic force sensing unit 400 located between the pressing rod 330 of the supporting member 300 and the boss 110 at the bottom in the force sensor housing 100 is in a compressive stress. The corresponding difference value of the pressure and the tension is the dynamic load of the double-group piezoelectric ceramic vibration pressure sensor on the base structure. If the external dynamic load is a tensile force, the piezo ceramic force sensing unit 400 located between the disc 310 of the supporter 300 and the gland 200 is under a compressive stress near the equilibrium position of the pre-stress, and the piezo ceramic force sensing unit 400 located between the pressing rod 330 of the supporter 300 and the boss 110 of the inner bottom of the force sensor housing 100 is under a tensile stress. The corresponding difference value of the tension and the pressure is the load of the double-group piezoelectric ceramic vibration pressure sensor on the base structure. Therefore, under the action of the dynamic load, the directions of the load acting forces of the two piezoceramic force sensing units 400 are always opposite, and the output charge signals of the two piezoceramic force sensing units 400 are also always in opposite phases. After the output charge signals of the piezoelectric ceramic pieces are converted into voltage signals by the charge amplifier, a differential amplifier is used for obtaining a path of voltage signals, a Butterworth low-pass filter is used for outputting the voltage signals, and the measurement of external acting loads can be realized through a signal analysis processing technology and force sensitivity parameters.
The small circuit board 600 is configured to amplify and convert two paths of charge signals into two paths of voltage signals, differentially amplify the two paths of voltage signals to obtain a single path of voltage signal, low-pass filter and condition the voltage signal for output, and obtain a measured external power load through a signal analysis processing technique and force sensitivity parameters.
The double-group piezoelectric ceramic vibration pressure sensor is provided with two piezoelectric ceramic force sensing units 400, wherein the directions of the two acting forces are always opposite, the output charge signals are also always opposite, the charge signals of the two piezoelectric ceramic force sensing units are amplified and converted into two voltage signals, the two voltage signals are differentially amplified to obtain a single voltage, a high-order low-pass filter is used for inhibiting high-frequency noise, the conditioned voltage signals are output, the measured external power load is obtained through a signal acquisition instrument, a signal analysis processing technology and force sensitivity parameters, and the measurement result is more accurate.
As shown in fig. 2 and 3, in the present embodiment, the gland 200 may be fixed to the force sensor housing 100 by means of a female screw connection, or by means of laser welding or bolt connection. The depth of the pressing cover 200 entering the interior of the force sensor housing 100 can be adjusted by screwing in, so as to adjust the pre-tightening force acting on the piezoceramic force sensing unit 400. The two piezo-ceramic force sensor units 400 must operate in a pre-load mode, and once the external load is greater than the pre-load, the force sensor units fail because the piezo-ceramic elements resist compression and are not tensile. In order to further improve the connection rigidity of the gland 200 and the force sensor housing 100, the annular contact end surface between the gland 200 and the force sensor housing 100 may be laser welded, or a plurality of threaded holes may be formed in the force sensor housing 100, a plurality of through holes may be drilled in corresponding positions of the gland 200, and then the connection may be performed by bolts.
As shown in fig. 5, in the present embodiment, the piezoceramic force sensing unit 400 located between the circular disk 310 of the supporting member 300 and the gland 200 includes a piezoceramic ring sheet 410, an ear-carrying single copper sheet ring electrode 420 and an ear-carrying double copper sheet ring electrode 430; the two piezoelectric ceramic ring pieces 410 are sleeved on the support rods 320 of the support piece 300, and the lug-carrying single copper sheet annular electrode 420 is positioned between the two piezoelectric ceramic ring pieces 410 and is connected with the positive electrodes of the two piezoelectric ceramic ring pieces 410; two ends of the lug-carrying double-copper-sheet annular electrode 430 are respectively attached to the opposite surfaces of the two piezoelectric ceramic ring sheets 410 and connected with the cathodes of the two piezoelectric ceramic ring sheets; the ears of the single copper sheet annular electrode are arranged on the same sides of the ears of the double copper sheet annular electrodes, so that the electronic circuit connection is facilitated.
The ring piece 410 of piezoelectric ceramic, the single copper sheet ring electrode 420 with lugs and the double copper sheet ring electrode 430 with lugs are bonded together through epoxy resin. The two piezoelectric ceramic ring pieces 410 are polarized in the thickness direction and connected in parallel, and the upper and lower ring surfaces of the piezoelectric ceramic ring pieces 410 are plated with silver electrodes.
In this embodiment, the rubber tube 500 is sleeved on the supporting rod 320, and the inner ring of the piezoelectric ceramic ring piece 410 sleeved on the supporting rod 320 is attached to the outer ring of the rubber tube 500. The output signal of the copper sheet ring electrode of the piezoceramic ring sheet 410 is prevented from being short-circuited through the stay bar 320.
In this embodiment, the two ends of the two copper sheet ring electrode 430 with ears are also connected with the gland 200 and the disc 310 of the supporting member 300 in a pre-pressing manner, respectively, to bear dynamic tension and compression loads.
As shown in fig. 6, in the present embodiment, the piezoceramic force sensing unit 400 located between the pressure rod 330 of the support member 300 and the boss at the bottom inside the force sensor housing 100 comprises a piezoceramic wafer 440, a lug copper single-sheet circular electrode 450 and a lug copper double-sheet circular electrode 460. The lug-equipped single copper sheet circular electrode 450 is positioned between the two piezoelectric ceramic wafers 440 and is connected with the anodes of the two piezoelectric ceramic wafers; two ends of the lug-carrying double-copper-sheet circular electrode 460 are respectively attached to the opposite sides of the two piezoelectric ceramic wafers 440, and are connected with the cathodes of the two piezoelectric ceramic wafers. The ears of the single copper sheet circular electrode are arranged on the same sides of the ears of the double copper sheet circular electrodes, so that the electronic circuit connection is facilitated.
The piezoelectric ceramic wafer 440, the lug single copper sheet circular electrode 450 and the lug double copper sheet circular electrode 460 are bonded together through epoxy resin. The two piezoelectric ceramic wafers 440 are polarized in the thickness direction and connected in parallel, and the upper and lower surfaces of the piezoelectric ceramic wafers 440 are plated with silver electrodes.
In this embodiment, two ends of the ear-carrying double copper sheet circular electrode 460 are also connected with the pressure bar 330 of the support 300 and the boss 110 at the bottom inside the force sensor housing 100 in a pre-pressing manner; the boss is opposite to the pressure lever and bears dynamic tension and compression loads.
The piezoelectric ceramic pieces used by the two piezoelectric ceramic force sensing units 400 are made of the same piezoelectric material, so that the force-electricity coupling parameters of the piezoelectric ceramic pieces are consistent.
In the present embodiment, the supporter 300 includes a pressing rod 330, a disc 310, and a stay 320; the pressing rod 330 is located at the bottom end of the disc 310, the boss 110 is located at the center of the bottom in the force sensor housing 100 and opposite to the pressing rod 330, and the support rod 320 is located at the top end of the disc 310. The interior of the force sensor housing 100 requires a suitable space to be reserved for mounting other components. And the cylindrical surface of the head of the stay bar 320 is provided with two straight notches for the external threads of the stay bar to be fastened with an external load application device. The force sensor housing 100 has an internally threaded hole in the center of its outer bottom that is bolted to the base structure.
In this embodiment, the small circuit board 600 is mounted on the bottom of the force sensor housing 100 through the insulating plate 610, so as to avoid electric leakage. The small circuit board 600 is configured to amplify the charge signal to obtain a voltage signal, and then convert the voltage signal into a voltage signal for output after differential amplification and a 12-order Butterworth (Butterworth) low-pass filter circuit.
In this embodiment, the miniature circuit board 600 is connected to an electrical connector 700 fixed to the force sensor housing 100 by a conductive cable 620. The output voltage signal amplified and low-pass filtered by the small circuit board 600 is led into the electrical connector 700 through a cable for an external acquisition instrument to acquire and analyze. The cable is provided with four branch cables which are respectively a power supply positive cable, a power supply negative cable, a power supply ground and a signal output cable. The power ground and the voltage signal output cable in the electrical connector 700 are connected to an external signal acquisition instrument to acquire the output voltage of the small circuit board 600, and the external power load is calculated through the force sensitivity parameter of the vibration pressure sensor, the signal analysis processing technology and the low-pass filtering characteristic parameter.
The two paths of charge signals generated by the two piezoelectric ceramic force sensing units 400 are respectively connected with the signal input end of the small circuit board 600 through two conductive cables 620.
In the signal amplification and low-pass filter circuit diagram of the dual-group piezoceramic vibration pressure sensor as shown in fig. 7, the charge signals of the two piezoceramic force sensing units 400 are respectively amplified by the operational amplifiers a and B, and the output voltage signals are respectively U1And U2. The two charge amplifiers mainly have the function of converting high-impedance input into low-impedance output, so that the conversion from a charge signal to a voltage signal is realized. Then the differential voltage signal U is amplified by a differential amplifier circuit and an operational amplifier C2-U1Amplified to a voltage signal UoWherein the amplification factor P of the differential voltage signal is R5/R4。R3The resistance value is very large for improving the stability of the circuit. The signal conditioning circuit converts the voltage signal UoOutputting a voltage signal U after passing through a 12-order Butterworth low-pass filtero6And the signal acquisition instrument is used for directly acquiring and analyzing to realize the measurement of the external dynamic load. The signal amplification and low-pass filtering conditioning principle and the sensitivity calculation method of the double-group piezoelectric ceramic vibration pressure sensor are as follows.
The output charge signals of the double-group piezoelectric ceramic force sensing unit 400 are amplified by two identical charge amplifying circuits to obtain two paths of voltage signals. Then the two voltage signals are differentially amplified to output a voltage signal UoThen the voltage signal U is appliedoThe noise interference of the force sensor system is eliminated through low-pass filtering, and data are directly acquired by an external acquisition instrument. The charge q output by two parallel piezoelectric ceramic wafers 4401Is shown as
q1＝2F1d33 (1)
In the formula, F1Is the dynamic load on the piezoceramic wafer 440 in newtons; d33The force-electricity coefficient of the single piezoelectric ceramic wafer 440; because two identical piezoelectric ceramic pieces are connected in parallel, the charge output is doubled. Similarly, two parallel piezoelectric ceramic ring pieces 410 output electric charges q2Is shown as
q2＝-2F2d33 (2)
For the bimorph ceramic wafer 440, the voltage signal U is amplified after passing through the charge amplification circuit1And a charge signal q1Is expressed as
U1＝-q1/Cf (3)
In the formula, CfIs a feedback capacitor of the charge amplifying unit due to the resistor R3Has a large resistance value, and can neglect the voltage U1The influence of (c). For the dual piezoelectric ceramic ring plate 410, after passing through another same charge amplifying circuit, the voltage signal U2And a charge signal q2Is expressed as
U2＝-q2/Cf (4)
According to the relations (1) to (4), the following can be obtained
U1-U2＝-2(F1+F2)d33/Cf (5)
Carrying out differential amplification processing on the two voltage signals to obtain an output voltage signal UoIs shown as
Uo＝-P(U1-U2) (6)
Wherein P is the amplification factor of the differential amplifier. From the above two expressions, the load acting on the base structure is expressed as
F1+F2＝Uo/Sf,Sf＝2Pd33/Cf (7)
In the formula, a voltage signal U0Is an important analysis parameter, and utilizes the sensitivity coefficient S of the double-group piezoelectric ceramic plate vibration pressure sensorfCalculating the action load F on the double-group piezoelectric ceramic vibration pressure sensor1+F2. Since noise interference is inevitably introduced into the charge signal output by the force sensor, the voltage signal U is also required to be subjected to0Low pass filtering is performed to remove some of the clutter.
As shown in fig. 7, the operational amplifier D, E, F, G, H, I and associated electronics form six cascaded Butterworth low pass filters, each having a second order, thus forming a 12-order cascaded Butterworth low pass filter. Output voltage Uo6And U0The relationship can be expressed as
Where i is an imaginary unit, the low-pass filter can be adjusted to a magnification A by adjusting the relevant parametersuApproaches 1 in the pass band, and the variation is relatively flat, and attenuates rapidly in the stop band, and θ is the phase shift angle caused by the low pass filter. Due to the magnification factor AuAnd the phase offset angle theta is a given value varying with frequency by measuring the voltage signal Uo6And signal analysis processing technique, the voltage signal U can be determined by formula (8)oAnd then the action load on the double-group piezoelectric ceramic vibration pressure sensor is obtained by using the formula (7).
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (12)
1. A double-group piezoelectric ceramic vibration pressure sensor is characterized by comprising a force sensor shell, a gland, a bearing piece, a piezoelectric ceramic force sensing unit and a small circuit board; the gland is arranged at the opening end of the force sensor shell, the disc of the supporting piece is positioned between the gland and the force sensor shell, and the supporting rod of the supporting piece penetrates through the gland and is connected with an external load acting device through external threads; the two piezoelectric ceramic force sensing units are respectively arranged between a disc of the bearing piece and the gland, between a pressure rod of the bearing piece and a boss at the bottom in the force sensor shell; the two piezoelectric ceramic force sensing units are electrically connected with the small circuit board, and the small circuit board converts charge signals of the two groups of piezoelectric ceramic force sensing units into voltage signals for differential amplification of two paths of signals and low-pass filtering conditioning of the voltage signals; the small circuit board is electrically connected with the external power supply unit and the signal acquisition instrument.
2. The dual group piezoceramic vibrating pressure sensor of claim 1, wherein the gland is secured to the force sensor housing by an internal thread connection, or by laser welding or bolting.
3. The dual-group piezoceramic vibrating pressure sensor according to claim 1, wherein the piezoceramic force sensing units located between the disc of the support and the gland comprise a piezoceramic ring sheet, an eared single copper sheet ring electrode and an eared double copper sheet ring electrode; the two piezoelectric ceramic ring pieces are sleeved on a support rod of the supporting piece, and the single copper sheet annular electrode with the lug is positioned between the two piezoelectric ceramic ring pieces and is connected with the anodes of the two piezoelectric ceramic ring pieces; two ends of the two copper sheet ring electrodes with the lugs are respectively attached to the back surfaces of the two piezoelectric ceramic ring sheets to connect the negative electrodes of the two piezoelectric ceramic ring sheets.
4. The double-group piezoelectric ceramic vibrating pressure sensor according to claim 3, wherein the stay bar is sleeved with a rubber tube, and the inner ring of the piezoelectric ceramic ring piece sleeved on the stay bar is attached to the outer ring of the rubber tube.
5. The double-group piezoceramic vibrating pressure sensor as claimed in claim 3, wherein the two ends of the lug-carrying double-copper-sheet annular electrode are respectively connected with the gland and the disc of the supporting member in a prepressing manner.
6. The double-group piezoceramic vibrating pressure sensor according to claim 1, wherein the piezoceramic force sensing unit positioned between the pressure rod of the support member and the boss at the bottom in the force sensor shell comprises a piezoceramic wafer, a lug-carrying single copper sheet circular electrode and a lug-carrying double copper sheet circular electrode; the lug-carrying single copper sheet circular electrode is positioned between the two piezoelectric ceramic wafers and is connected with the anodes of the two piezoelectric ceramic wafers; two ends of the lug-carrying double-copper-sheet circular electrode are respectively attached to the back surfaces of the two piezoelectric ceramic wafers and connected with the negative electrodes of the two piezoelectric ceramic wafers.
7. The double-group piezoelectric ceramic vibration pressure sensor according to claim 6, wherein two ends of the lug-carrying double-copper sheet circular electrode are respectively connected with a pressure rod of the support member and a boss of the force sensor shell in a prepressing manner; the boss is located at the bottom in the force sensor shell and is opposite to the pressure rod.
8. The dual set piezoceramic vibrating pressure sensor according to claim 7, wherein the support comprises a strut, a disc, and a strut; the pressure lever is positioned at the bottom end of the disc, and the support rod is positioned at the top end of the disc.
9. The dual group piezoceramic vibrating pressure sensor of claim 1, wherein the miniature circuit board is mounted on the bottom inside the force sensor housing by an insulating plate.
10. The dual group piezoceramic vibrating pressure sensor of claim 9, wherein the miniature circuit board is connected to an electrical connector affixed to the force sensor housing by a conductive cable.
11. The dual group piezoceramic vibrating pressure sensor of claim 8, wherein the cylindrical surface of the strut head has two straight cut-outs for the external threads of the strut to engage with external load applying means.
12. The dual group piezoceramic vibrating pressure sensor of claim 1, wherein the force sensor housing has an internally threaded hole in the center of its outer bottom for bolting to the base structure.
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| CN117664203A (en) * | 2024-01-31 | 2024-03-08 | 成都楷模电子科技有限公司 | Novel high-frequency ultrasonic sensor |
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|---|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117664203A (en) * | 2024-01-31 | 2024-03-08 | 成都楷模电子科技有限公司 | Novel high-frequency ultrasonic sensor |
| CN117664203B (en) * | 2024-01-31 | 2024-04-26 | 成都楷模电子科技有限公司 | High-frequency ultrasonic sensor |
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