CN114420803A - Preparation method of Micro-LED display module, display module and display device - Google Patents
Preparation method of Micro-LED display module, display module and display device Download PDFInfo
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Abstract
The invention provides a preparation method of a Micro-LED display module, the display module and a display device, and belongs to the field of LED display. The preparation method of the Micro-LED display module comprises the following steps: acquiring or preparing a Micro-LED array; designing a structure diagram of a Micro lens array according to the Micro-LED array, and preparing a Micro lens array model according to the structure diagram of the Micro lens array; obtaining the thickness and the light transmittance of the micro-lens structure, selecting a light-transmitting material, and preparing the micro-lens structure through a micro-lens array model; and bonding the Micro lens structure and the Micro-LED array to form the Micro-LED display module. The light emitting angle of the LED pixel units is shrunk through the Micro lens, so that the collimation of the emitted light is improved, the light interference effect of the emitted light of the adjacent LED pixel units is effectively avoided, the light emitting loss of the LED pixel units is also reduced, and the light emitting brightness of the Micro-LED module is increased.
Description
Technical Field
The invention relates to the field of LED display, in particular to a preparation method of a Micro-LED display module, the display module and a display device.
Background
Micro-LEDs are LED (light-emitting diode) Micro-scale and matrixing technologies, which means that LED backlight is thinned, miniaturized, and arrayed, so that LED pixel units can be reduced to several micrometers to several hundred micrometers, and each pixel can be addressed independently to drive light emission (self-luminescence) independently.
As the Micro-LED pixels are reduced, the ratio of the area of the side wall to the whole surface area is increased, and the side wall luminescence occupies a large component and cannot be ignored. The influence is large in Micro display, and a large crosstalk effect is brought: (1) in rgb (red green blue) three-chip colorization, light emitted by the Micro-LED pixel unit may cross-talk to an adjacent pixel, and the LED of the pixel may be turned off, which may affect the black level of the adjacent pixel, because ideally the pixel is completely turned off and does not emit light to display, thereby affecting the contrast and black level of the display; (2) for photoluminescence colorized Micro-LED displays, for example, blue light Micro-LED emission of the same pixel unit may excite red and green emitting materials in the same pixel, reducing color purity, saturation, etc. of the display. The Micro-LED light beam regulation not only comprises the regulation of the light emitting beam of the Micro-LED, but also comprises the light beam regulation of photo-induced color light.
Therefore, it is worth studying how to reduce or even eliminate the crosstalk of light emission of adjacent Micro-LED pixel cells.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a Micro-LED display module, a display module and a display device, so as to overcome the defects in the prior art.
The invention provides the following technical scheme: a preparation method of a Micro-LED display module comprises the following steps:
s1, acquiring or preparing a Micro-LED array;
s2, designing a structure diagram of the Micro-lens array according to the Micro-LED array, and preparing a Micro-lens array model according to the structure diagram of the Micro-lens array;
s3, obtaining the thickness and the light transmittance of the micro-lens structure, selecting a light-transmitting material, and preparing the micro-lens structure through the micro-lens array model;
and S4, bonding the Micro lens structure and the Micro-LED array to form the Micro-LED display module.
In some embodiments of the present invention, in step S4, the Micro lens structure is laminated on one side in the thickness direction of the Micro-LED array.
Some embodiments of the invention also provide a Micro-LED display module, and a preparation method using the Micro-LED display module;
the Micro-LED display module comprises a driving substrate, an LED pixel layer and a packaging layer which are sequentially stacked;
the LED pixel layer comprises a plurality of spaced LED pixel units;
a micro-lens structure is arranged on one side, away from the LED pixel layer, of the packaging layer;
the micro-lens structure comprises a plurality of spaced micro-lenses, and the concave surface of one micro-lens faces one LED pixel unit.
Furthermore, orthographic projections of the driving substrate and the packaging layer on a plane where the LED pixel layer is located are covered on the LED pixel layer respectively.
Further, the thickness of the micro lens is 30nm to 1 mm.
Further, the light emitting color of each of the LED pixel units is any one of red, green, or blue.
Further, the light transmittance of the microlens is not less than 90%.
Further, the microlens includes a hollow hemisphere or a hollow semi-ellipsoid.
Further, the number of the micro lenses is equal to the number of the LED pixel units.
Some embodiments of the invention also provide a display device comprising the Micro-LED display module.
The embodiment of the invention has the following advantages: the Micro-lens structure is arranged on the Micro-LED array, the concave surface of the Micro-lens faces towards the LED pixel unit, the light emitting angle of the LED pixel unit is contracted through the Micro-lens, the collimation of the light emitting is improved, the light interference effect of the light emitting of the adjacent LED pixel units is effectively avoided, the light emitting loss of the LED pixel units is also reduced, and therefore the light emitting brightness of the Micro-LED module is increased.
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible and comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart illustrating a method for manufacturing a Micro-LED display module according to an embodiment of the invention;
FIG. 2 is a first schematic view illustrating a first view angle of a Micro-LED display module according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram illustrating a viewing angle of light emitted by an LED pixel unit in a Micro-LED display module according to an embodiment of the present invention after being refracted by a Micro-lens;
FIG. 4 is a schematic view showing a viewing angle of a Micro-LED array in a Micro-LED display module according to an embodiment of the present invention;
fig. 5 shows a schematic structural diagram of a viewing angle of a Micro-LED display module according to an embodiment of the present invention.
Description of the main element symbols:
100-a drive substrate; 200-LED pixel layer; 210-LED pixel cells; 300-an encapsulation layer; 400-a microlens structure; 410-micro lenses.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the templates herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and 2, some embodiments of the present invention provide a method for manufacturing a Micro-LED display module, including the steps of:
and step S1, acquiring or preparing the Micro-LED array.
Specifically, in some embodiments of the present invention, the Micro-LED array may be obtained by any one of a photolithography process, icp (inductively Coupled plasma) dry etching, a wet etching process, magnetron sputtering, or electron beam evaporation, and may be specifically set according to an actual situation.
And step S2, designing a structure diagram of the Micro-lens array according to the Micro-LED array, and preparing a Micro-lens array model according to the structure diagram of the Micro-lens array.
In some embodiments of the present invention, the Micro lens structure 400 is prepared by using a two-photon interference Micro-nano 3D printing technology based on the size of the Micro-LED array.
Specifically, a Micro lens array structure diagram matched with the size of a required Micro-LED array is designed, and a Micro lens array model is printed through Micro-nano 3D of two-photon interference.
First, a substrate is prepared or used while a photoresist is uniformly coated on one side in the thickness direction of the substrate. Among them, Photoresist (Photoresist) is also called Photoresist, which refers to a resist etching film material whose solubility changes by irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, etc. The photosensitive mixed liquid consists of three main components, including photosensitive resin, sensitizer and solvent. Used as a corrosion-resistant coating material during a photolithography process. When processing a surface of a semiconductor material, a desired image can be obtained on the surface by using an appropriate selective photoresist.
And then scanning the substrate coated with the photoresist by utilizing two-photon interference to form a micro-nano model. Specifically, based on the principle of the two-photon absorption effect, laser is focused on the photoresist, and the photoresist is denatured and solidified under the action of the laser, so that the required micro-nano model can be printed. It should be noted that two-photon absorption is a process in which a medium absorbs two photons, wherein each individual photon does not have enough energy to excite a molecule (in the medium) to an excited state, but two photons act together to pass from a ground state through a virtual state to an excited state, and the process absorbs two photons in total, so the name two-photon absorption is known.
And finally, arranging a cured substance on one side of the micro-nano model coated with the photoresist to finally form the micro-lens array model. Specifically, a curing agent is filled at one side of the micro-nano model coated with the photoresist, a cured substance is formed after the curing agent is solidified, and the cured substance is taken down from the micro-nano model to form the micro-lens array model.
The two-photon interference micro-nano 3D printing is based on the two-photon polymerization principle.
The two-photon polymerization is a photopolymerization process initiated after a substance generates two-photon absorption, the two-photon absorption means that one molecule of the substance absorbs two photons at the same time, the two-photon absorption mainly occurs at a focus of ultra-strong laser generated by pulse laser, the laser intensity at other places on a light path is not enough to generate two-photon absorption, and the corresponding single-photon absorption process cannot occur due to the fact that the wavelength of the used light is long and the energy is low.
Therefore, the two-photon process has good spatial selectivity, thereby improving the accuracy of modeling the microlens array.
In addition, a metal microlens structure model can be obtained by a liga (lithographie silver of the forming and developing) process in combination with a microlens structure drawing.
It should be noted that the LIGA process is an MEMS (Micro-Electro-Mechanical systems) processing technology based on the X-ray lithography technology, and mainly includes three processing steps of X-ray deep synchrotron radiation lithography, electroforming, and injection molding replication.
In particular, X-ray deep synchrotron radiation lithography, i.e., deep X-ray exposure. A substrate coated with a photoresist is first acquired and then a two-dimensional pattern on an X-ray mask is transferred onto the photoresist on the surface of the substrate by a simultaneous X-ray to etch a desired pattern.
Next, the exposed photoresist is placed in a developing solution to be developed. It should be noted that the long bonds of the exposed photoresist molecules are broken and degraded, the degraded molecules can be dissolved in the developer, and the unexposed photoresist still exists after development, so that a three-dimensional photoresist microstructure identical to the mask pattern is formed.
And electroplating the developed three-dimensional photoresist microstructure by using the metal thin layer below the photoresist layer as a cathode, and filling metal into gaps of the photoresist three-dimensional structure until the metal layer completely covers the photoresist relief to form a stable closed metal structure complementary with the photoresist structure, thereby forming a metal microlens structure model.
It should be noted that, in some embodiments of the present invention, the metal microlens structure model may be used as a template to replicate a desired microlens structure through any one of injection molding or compression molding, so as to improve the efficiency of microlens structure preparation.
And step S3, obtaining the thickness and the light transmittance of the micro-lens structure, selecting a light-transmitting material, and preparing the micro-lens structure through the micro-lens array model.
Specifically, a light-transmitting material having high light transmittance is selected and copied by a nanoimprint technique with the microlens array mold as a reference to form the microlens structure 400 having a desired thickness and light transmittance.
Specifically, the depth of the nano-imprinting can be controlled according to actual conditions, so as to obtain the required thickness of the micro-lens structure.
Firstly, processing a template, and processing a required structure on an obtained substrate as the template through electron beam etching. Since the diffraction limit of electrons is much smaller than that of photons, much higher resolution than lithography can be achieved.
Secondly, transferring the pattern, coating photoresist on the surface of the substrate to be processed, pressing the template on the surface of the substrate, and transferring the pattern onto the photoresist in a pressurizing mode. It should be noted that the photoresist cannot be completely removed, preventing the template from being damaged by direct contact with the material.
And finally, processing the substrate, namely curing the photoresist through ultraviolet light, removing the template after the photoresist is cured, etching the incompletely removed photoresist through etching liquid, and simultaneously exposing the surface of the material to be processed. And then, processing by using a chemical etching method, and removing all the photoresist after the processing is finished to form the micro-lens structure.
Nanoimprinting is a process of patterning nanostructures of complex structure on a stamp by means of high-resolution electron beams or the like, and then deforming the polymer material with a pre-patterned stamp to form a structural pattern on the polymer.
Among them, the nanoimprint technology is a low-cost and fast method for obtaining a replica structure at a nano-scale, which can repeatedly prepare a nano-pattern structure on a large area in a large scale, and the prepared high-resolution pattern has excellent uniformity and repeatability.
And step S4, bonding the Micro lens structure and the Micro-LED array to form the Micro-LED display module.
Specifically, the Micro-LED array and the Micro-lens structure 400 are bonded together by a high-precision bonding technique to form a Micro-LED display module.
In step S4, the Micro-lens structure is laminated on one side of the Micro-LED array in the thickness direction, and the Micro-LED display module is formed by a high precision bonding technique.
In some embodiments of the present invention, in step S2, the shape and size of the microlens array model are calculated by the Micro-LED array obtained or prepared in step S1 to prepare the microlens array model.
Specifically, according to the Micro-LED array prepared in the step S1, a Micro-lens array model drawing matched with the size and shape of the Micro-LED array is calculated, and a Micro-lens array model is manufactured through a Micro-nano 3D printing technology.
As shown in fig. 2 and 3, some embodiments of the present invention further provide a Micro-LED display module, which is mainly used for light path alignment of LED display. The Micro-LED display module comprises a driving substrate 100, an LED pixel layer 200 and an encapsulation layer 300 which are sequentially stacked.
In addition, the LED pixel layer 200 includes a plurality of spaced LED pixel units 210. Specifically, in some embodiments of the present invention, the plurality of LED pixel units 210 are arranged in an array. Each LED pixel unit 210 may be any one of a red LED pixel unit 210, a green LED pixel unit 210, or a blue LED pixel unit 210.
Meanwhile, a micro-lens structure 400 is arranged on one side of the packaging layer 300 far away from the LED pixel layer 200, and the micro-lens structure 400 is attached to the packaging layer 300.
It should be noted that the microlens structure 400 includes a plurality of spaced microlenses 410. In some embodiments of the present invention, a plurality of spaced apart microlenses 410 are arranged in an array, and the concave surface of one microlens 410 faces one of the LED pixel units 210.
The micro lens 410 may be of any one of a hollow hemispherical structure and a hollow semi-ellipsoidal structure, and the micro lens 410 is made of a transparent material, so that light emitted from the LED pixel unit 210 can pass through the micro lens 410.
In some embodiments of the present invention, the material of the microlens 410 is a high-transmittance, high-temperature-resistant polymer, such as any one of epoxy resin or acrylate.
In addition, in order to prevent the micro lenses 410 from affecting the light transmittance, the thickness of the micro lenses is 30nm to 1 mm. It is understood that the thickness of the microlens 410 can be any value from 30nm to 1mm, and can be specifically set according to actual conditions.
In some embodiments of the present invention, the encapsulation layer 300 is made of transparent material, and the refractive index of light on the encapsulation layer 300 is greater than that of light in air. The transparency of the packaging layer 300 is not less than 90% so as to improve the brightness of the Micro-LED display module.
When the light emitted from the LED pixel unit 210 is refracted after passing through the microlens 410, since the microlens 410 includes a hollow hemispherical structure, the light passing through the microlens 410 is refracted, and the incident angle of the light when passing through the microlens 410 is smaller than the exit angle of the light, that is, the exit angle of the LED pixel unit 210 is shrunk by the microlens 410.
It can be understood that the collimation of the light emitted from the layer of the LED pixel unit 210 is increased by the Micro lens 410, and the optical cross effect is effectively avoided, so that the light emitting loss of the LED pixel unit 210 is reduced, and the light emitting brightness of the Micro-LED display module is increased.
In addition, the vertical distance from the side of the microlens 410 away from the encapsulation layer 300 to the encapsulation layer 300 can be specifically defined according to practical situations.
It should be noted that, the vertical distance from the side of the Micro lens 410 away from the encapsulation layer 300 to the encapsulation layer 300 can be adjusted to control the collimation efficiency of the Micro lens 410 on the light emitted by the LED pixel unit 210, so as to adjust the light emitting brightness of the Micro-LED display module.
As shown in fig. 2 to 5, in some embodiments of the invention, in order to improve the stability of each LED pixel unit 210, an orthogonal projection of the driving substrate 100 on the plane of the LED pixel layer 200 covers the LED pixel layer 200, and an orthogonal projection of the encapsulation layer 300 on the plane of the LED pixel layer 200 covers the LED pixel layer 200, so that the driving substrate 100 and the encapsulation layer 300 form a protection for the LED pixel layer 200.
It should be noted that the orthogonal projection of a microlens 410 on the plane of the pixel layer covers one LED pixel unit 210.
In addition, in some embodiments of the present invention, the light emitting color of each of the LED pixel units 210 is any one of red, green, or blue, and can be specifically set according to actual situations.
As shown in fig. 2, fig. 3 and fig. 5, in some embodiments of the present invention, in order to improve the collimation of the light emitted from each LED pixel unit 210 and improve the light emitting brightness of the Micro-LED display module, the orthogonal projection of the Micro lens 410 on the plane of the LED pixel layer 200 covers the LED pixel unit 210.
It should be noted that the number of the microlenses 410 is the same as the number of the LED pixel layers 200, and each microlens 410 corresponds to one LED pixel unit 210.
Specifically, the orthographic projection of each microlens 410 on the plane where the LED pixel layer 200 is located covers one LED pixel unit 210, and the microlens 410 collimates the light emitted by the LED pixel unit 210 to improve the light emitting brightness of each LED pixel unit 210, so as to improve the light emitting brightness of the Micro-LED display module.
In addition, in some embodiments of the present invention, in order to avoid the brightness from being reduced after the light emitted from the LED pixel unit 210 passes through the microlens 410, the microlens structure 400 is made of a transparent material with high light transmittance.
The material of the microlens structure 400 may be any one of polymethyl methacrylate (PMMA), Polystyrene (PS), Polycarbonate (PC), and polydiallyl diglycol carbonate (CR-39), which may be specifically selected according to actual conditions.
Specifically, in some embodiments of the present invention, the light transmittance of the Micro lens 410 is not less than 90% to improve the light transmittance of the Micro lens 410, so as to improve the light emitting brightness of the Micro-LED display module.
It should be noted that the encapsulation layer 300 is used to block liquid and air, so as to protect the LED pixel layer 200.
In addition, the packaging layer 300 is also made of a transparent material with high light transmittance, so that the light emitted by the LED pixel units is prevented from being weakened after passing through the packaging layer 300, and the light emitting brightness of the Micro-LED display module is improved.
In the Micro-LED display module provided in some embodiments of the present invention, the Micro lens 410 is disposed on one side of the encapsulation layer 300 away from the driving substrate 100, and the Micro lens 410 is used to converge light emitted by the LED pixel unit 210, so as to shrink the light emitting angle of the Micro-LED, increase the collimation of the emitted light, effectively avoid the optical crosstalk effect, reduce the light emitting loss of the pixel point, increase the light emitting brightness of the Micro-LED module, and increase the light emitting efficiency of the Micro-LED display module, thereby improving the display brightness of the Micro-LED display module.
In addition, some embodiments of the present invention further provide a display device, where the display device includes the Micro-LED display module described in any one of the embodiments above.
The Micro LED display device according to some embodiments of the present invention may be applied to any product or component with a display function, such as a mobile phone, a computer, a television, a display, a camera, and a navigator.
In all examples shown and described herein, any particular value should be construed as merely exemplary, and not as a limitation, and thus other examples of example embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above examples are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. A preparation method of a Micro-LED display module is characterized by comprising the following steps:
s1, acquiring or preparing a Micro-LED array;
s2, designing a structure diagram of the Micro-lens array according to the Micro-LED array, and preparing a Micro-lens array model according to the structure diagram of the Micro-lens array;
s3, obtaining the thickness and the light transmittance of the micro-lens structure, selecting a light-transmitting material, and preparing the micro-lens structure through the micro-lens array model;
and S4, bonding the Micro lens structure and the Micro-LED array to form the Micro-LED display module.
2. The method of claim 1, wherein the Micro-LED array is laminated on one side of the Micro-LED array in the thickness direction in step S4.
3. A Micro-LED display module, characterized in that, the preparation method of the Micro-LED display module of claim 1 or 2 is used;
the Micro-LED display module comprises a driving substrate, an LED pixel layer and a packaging layer which are sequentially stacked;
the LED pixel layer comprises a plurality of spaced LED pixel units;
a micro-lens structure is arranged on one side, away from the LED pixel layer, of the packaging layer;
the micro-lens structure comprises a plurality of spaced micro-lenses, and the concave surface of each micro-lens faces one LED pixel layer;
the orthographic projection of each micro lens on the plane where the LED pixel layer is located covers one LED pixel unit.
4. The Micro-LED display module according to claim 3, wherein the driving substrate and the encapsulation layer respectively cover the LED pixel layers in orthographic projections of the LED pixel layers.
5. A Micro-LED display module according to claim 3, wherein the Micro-lenses have a thickness of 30nm to 1 mm.
6. A Micro-LED display module according to claim 3, wherein the light emission color of each LED pixel cell is any one of red, green or blue.
7. A Micro-LED display module according to claim 3, wherein the light transmittance of the Micro-lenses is not less than 90%.
8. A Micro-LED display module according to claim 3, wherein the Micro-lenses comprise hollow hemispheres or hollow semi-ellipsoids.
9. A Micro-LED display module according to claim 3, wherein the number of Micro-lenses is equal to the number of LED pixel cells.
10. A display device comprising a Micro-LED display module according to any one of claims 3 to 9.
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