CN114406478B - Display panel processing device and method, display panel and controller - Google Patents
Display panel processing device and method, display panel and controller Download PDFInfo
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- CN114406478B CN114406478B CN202210047404.0A CN202210047404A CN114406478B CN 114406478 B CN114406478 B CN 114406478B CN 202210047404 A CN202210047404 A CN 202210047404A CN 114406478 B CN114406478 B CN 114406478B
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004590 computer program Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 15
- 238000002834 transmittance Methods 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000010406 cathode material Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present disclosure relates to a processing device and method of a display panel, and a controller. The device comprises: a laser for generating and emitting a laser beam; the scanning galvanometer is used for driving the laser beam to carry out scanning processing; and the controller is electrically connected with the laser and the scanning galvanometer, and is used for determining the arrangement mode of the light spots of the laser beam in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam, acquiring the target position of the laser beam during processing according to the arrangement mode, and controlling the scanning galvanometer to adjust the laser beam to the target position. The display panel display device can improve the light transmittance of the to-be-processed area, reduce the possibility of damage to the normal display area of the display panel, ensure the use function of the to-be-processed area and ensure the display effect of the display panel.
Description
Technical Field
The disclosure relates to the technical field of laser processing, in particular to a processing device and method of a display panel, the display panel and a controller.
Background
With the technology of mobile phones and other terminals being changed, consumers are increasingly pursuing higher screen occupation ratio, however, due to the existence of the necessary front-end camera assembly and other sensors, relevant areas need to be reserved on the display screen to place relevant devices. For balancing higher screen duty ratio and front shooting function, need place camera module etc. in the below of display screen for guarantee that outside light can penetrate the screen and form images on the sensor under the prerequisite that does not influence the display effect, camera module scheme under the screen promptly, this just requires the regional luminousness of camera module under the screen to be high, but present display panel comprises multilayer material, and camera module area under the screen also has luminous pixel circuit unit, and complicated multilayer structure makes holistic outside light transmittance lower, can't obtain satisfactory front shooting effect.
One reason for the low transmittance of external light is that the cathode layer in the display panel structure absorbs and reflects the external light, and the material of the cathode layer is usually magnesium-silver alloy, so that the transmittance of visible light is below 50%, and the use of the camera component is seriously affected. In the related art, a laser cathode etching mode is adopted to remove part of cathode materials, part of cathode materials are cathode materials in the area where the camera shooting assembly is located, and only the cathode materials corresponding to the inside of the outline of the camera shooting assembly are actually needed to be etched, so that the display effect of the display panel is affected by redundant etching.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a processing apparatus, a processing method, a display panel, and a controller for a display panel that can improve light transmittance and reduce damage to a normal display area of the display panel.
In a first aspect, the present disclosure provides a processing apparatus for a display panel, including:
a laser for generating and emitting a laser beam;
the scanning galvanometer is used for driving the laser beam to carry out scanning processing;
And the controller is electrically connected with the laser and the scanning galvanometer, and is used for determining the arrangement mode of the light spots of the laser beam in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam, acquiring the target position of the laser beam during processing according to the arrangement mode, and controlling the scanning galvanometer to adjust the laser beam to the target position.
Preferably, the determining, according to the structural information of the area to be processed of the display panel and the spot size of the laser beam, an arrangement manner of the spots of the laser beam in the area to be processed includes: when at least part of the position area of the pixel line unit of the display panel is not covered by the mask layer, the controller is further configured to determine an arrangement manner of the light spots in the rest area except for the position area in the to-be-processed area according to the structural information of the to-be-processed area of the display panel, the at least part of the position area, and the light spot size of the laser beam; and/or when the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam.
Preferably, the method further comprises: the collimation and beam expansion unit is used for collimating and expanding the laser beam emitted by the laser; and/or a focusing lens is arranged between the scanning galvanometer and the product to be processed and is used for focusing the laser beam passing through the scanning galvanometer.
In a second aspect, the present disclosure further provides a processing method of a display panel, where the method includes:
obtaining structural information of a region to be processed of a display panel and the spot size of a laser beam;
Determining the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed and the size of the light spots;
Acquiring a target position during processing of the laser beam according to the arrangement mode;
Controlling the emission of a laser beam and controlling the adjustment of the laser beam to the target position.
Preferably, the determining, according to the structural information of the area to be processed of the display panel and the spot size of the laser beam, the arrangement mode of the spots of the laser beam in the area to be processed includes: when at least part of the position area of the pixel line unit of the display panel is not covered by the mask layer, the controller is further configured to determine an arrangement manner of the light spots in the rest area except for the position area in the to-be-processed area according to the structural information of the to-be-processed area of the display panel, the at least part of the position area, and the light spot size of the laser beam; and/or when the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam.
Preferably, the obtaining structural information of the to-be-processed area of the display panel includes:
acquiring an image of a display panel;
and determining the position of the structure of the area to be processed in the image according to the position information of the image pickup assembly in the display panel, wherein the image pickup assembly corresponds to the structure of the area to be processed.
Preferably, the arrangement mode includes:
And arranging the light spots on the area to be processed, and enabling the center distance of two adjacent light spots after arrangement to be in a preset value or a preset range.
In a third aspect, the present disclosure also provides a display panel. The display panel comprises a substrate, an anode, a mask layer, an organic light-emitting layer and a cathode layer, wherein the cathode layer is manufactured by the processing method of the display panel.
In a fourth aspect, the present disclosure also provides a controller. The controller comprises a memory storing a computer program and a processor implementing the steps of the method of any of the embodiments of the present disclosure when the computer program is executed.
In a fifth aspect, the present disclosure also provides a computer program product. The computer program product comprises a computer program which, when executed by a processor, implements the steps of the method according to any of the embodiments of the present disclosure.
According to the method, the device and the system, the etching processing of the cathode layer of the display panel is realized by arranging the laser, the scanning galvanometer and the controller, the arrangement mode of light spots in the area to be processed is determined according to the light spot size of the laser beam and the structure of the area to be processed, and the target position during laser processing is determined according to the arrangement mode, so that the cathode layer is etched according to the structure of the area to be processed during laser processing, the light transmittance of the area to be processed is improved, the possibility of damage to the normal display area of the display panel is reduced, the using function of the area to be processed is guaranteed, and the display effect of the display panel is also considered.
Drawings
FIG. 1 is a schematic view of a processing apparatus for a display panel according to an embodiment;
FIG. 2 is a schematic diagram of a region to be processed of a display panel according to an embodiment;
FIG. 3 is a flow chart of a method for fabricating a display panel according to an embodiment;
FIG. 4 is a schematic diagram of a region to be processed of a display panel according to an embodiment;
FIG. 5 is a schematic illustration of spot placement of a region to be processed in one embodiment;
FIG. 6 is a schematic diagram of a region to be processed of a display panel according to an embodiment;
FIG. 7 is a schematic view of spot placement of a region to be processed in one embodiment;
FIG. 8 is a schematic diagram of a display panel before processing according to an embodiment;
FIG. 9 is a schematic diagram of a display panel after processing according to an embodiment;
FIG. 10 is a schematic diagram of a display panel before processing according to an embodiment;
FIG. 11 is a schematic diagram of a display panel after processing according to an embodiment;
fig. 12 is an internal structural diagram of a controller in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the disclosed embodiments and are not intended to limit the disclosed embodiments.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In one embodiment, as shown in fig. 1, there is provided a processing apparatus for a display panel, including:
a laser 101 for generating and emitting a laser beam;
in the embodiment of the disclosure, the processing device of the display panel includes a laser 101, where the laser 101 is used to generate a laser beam for etching a cathode layer during the processing of the display panel and emit the laser beam.
The scanning galvanometer 102 is used for driving the laser beam to scan;
In the embodiment of the disclosure, a scanning galvanometer 102 is disposed in a processing device of a display panel, and the scanning galvanometer 102 is used for driving a laser beam to process the display panel to be processed in a processing process. Typically, the direction and position of the laser machining is related to the placement of the scanning galvanometer 102. The scanning galvanometer 102 can be controlled to control the laser beam to perform laser processing on the corresponding position.
And the controller 103 is electrically connected with the laser 101 and the scanning galvanometer 102, and is used for determining the arrangement mode of the light spots of the laser beam in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam, and acquiring the target position of the laser beam during processing according to the arrangement mode.
In this embodiment of the disclosure, the controller 103 is electrically connected to the laser 101 and the scanning galvanometer 102, and obtains a structure of a to-be-processed area of the display panel and a spot size of a laser beam emitted by the laser 101, determines a target position of the laser beam during laser processing according to the structure information and the spot size, and controls the scanning galvanometer 102 to adjust the laser beam to the target position according to the target position. When determining the target position, the spots may be arranged in the region to be processed, and the target position during laser processing may be determined according to the positions of the arranged spots. Specifically, the laser light sequentially passes through the substrate, anode, mask layer, and organic light emitting layer of the display panel to process the cathode layer of the display panel.
In one example, the controller determines an arrangement mode of light spots of the laser beam in the area to be processed based on the structural information of the area to be processed and the light spot size of the laser beam, obtains target position information including the laser beam during processing according to the arrangement mode, and adjusts the laser beam of the scanning galvanometer to the target position according to control so as to complete scanning processing of a cathode layer of the display panel. Specifically, the structural information of the area to be processed may include, but is not limited to, a shape of the area to be processed and size data corresponding to the area to be processed. The area to be processed may include, but is not limited to, a camera assembly area or a sound assembly area or any other set area. The image capturing assembly area is generally an area, at a preset position on the display panel, consistent with the structure of the image capturing assembly.
Specifically, the arrangement mode of the light spots includes an arrangement number and an arrangement position, or an arrangement position and an arrangement time point, or an arrangement number, an arrangement position and an arrangement time point. The number of the arranged light spots can be calculated by dividing the area of the structure of the area to be processed by the area of the light spots. The arrangement of the light spots on the area to be processed correspondingly forms the arrangement position of the light spots, specifically, the XY coordinate of the center of each light spot is used as the arrangement position of the light spots. The light spots are sequentially arranged according to the structure of the area to be processed, and corresponding arrangement time points for forming the light spots are formed. When the light spots are arranged, the boundary of the light spots does not exceed the edge of the area to be processed, and the arrangement number of the light spots is preferably the largest in the area to be processed.
The information of the target position may include a plurality of laser scanning target positions or laser scanning target position fields according to the arrangement mode of the light spots, and further, alternatively, the target position information and the time information may also be acquired, where the information of the target position may include a plurality of laser scanning target positions or laser scanning target position fields, and the time information includes a plurality of laser scanning time points or laser scanning time fields.
According to the embodiment of the disclosure, the laser 101, the scanning galvanometer 102 and the controller 103 are arranged to realize etching processing on the cathode layer of the display panel, the arrangement mode of the light spots in the area to be processed is determined according to the light spot size of the laser beam and the structural information of the area to be processed, and the target position of the laser beam during processing is determined according to the arrangement mode, so that the cathode layer is etched according to the structure of the area to be processed during laser processing, the light transmittance of the area to be processed is improved, the possibility of damage to the normal display area of the display panel is reduced, the using function of the area to be processed is guaranteed, and the display effect of the display panel is also considered.
Fig. 2 is a schematic structural view of a region to be processed of a display panel according to an exemplary embodiment, and fig. 2 includes pixel points and connection lines in the region to be processed.
In one embodiment, the determining, according to the structural information of the area to be processed of the display panel and the spot size of the laser beam, an arrangement manner of the spots of the laser beam in the area to be processed includes: when at least part of the position area of the pixel line unit of the display panel is not covered by the mask layer, the controller is further configured to determine an arrangement manner of the light spots in the rest area except for the position area in the to-be-processed area according to the structural information of the to-be-processed area of the display panel, the at least part of the position area, and the light spot size of the laser beam; and/or when the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam.
In one example, in a case where at least a part of a location area of a pixel line unit of a display panel is not covered by a mask layer, the controller 103 is further configured to determine, according to a structure of a to-be-processed area of the display panel, at least a part of the location area of the pixel line unit, and a spot size of the laser beam, an arrangement manner of the spots in a remaining area of the to-be-processed area other than the location area, thereby determining a target location of the laser beam.
In an embodiment of the present disclosure, the location area of the pixel line unit may include a pixel point area and a connection line area of the pixel point. When at least part of the position area of the pixel circuit unit of the display panel is not covered by the mask layer, the processing is directly performed, and the laser beam may damage the pixel circuit unit area. Therefore, according to the embodiment of the disclosure, the processable area except the position area of the pixel circuit unit in the to-be-processed area is determined according to the structure of the to-be-processed area and the position area of the pixel circuit unit, and the arrangement mode of the laser beams in the processable area is determined according to the spot size of the laser beams, so that the position area of the pixel circuit unit is not damaged, and the display effect of the display panel in the to-be-processed area is improved.
According to the embodiment of the disclosure, when at least part of the position area of the pixel circuit unit in the area to be processed is not covered by the mask layer, the target position of the laser beam is determined according to the structure of the area to be processed, the position area of the pixel circuit unit and the spot size of the laser beam, so that the at least part of the position area of the pixel circuit unit can be avoided during processing, damage to the pixel circuit unit area is avoided, and the display effect of the display panel is influenced.
In another example, when the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam.
In the embodiment of the disclosure, when the position area of the pixel circuit unit of the display panel is completely covered by the mask layer, since the laser cannot pass through the mask layer when processing, the pixel circuit unit at the moment cannot be damaged during laser processing, so that the arrangement mode of the light spots in the area to be processed of the display panel can be directly determined according to the structural information of the area to be processed of the display panel and the light spot size.
According to the embodiment of the disclosure, the arrangement mode of the light spots in the area to be processed of the display panel can be determined under the condition that the pixel circuit unit of the display panel is completely covered by the mask layer, so that the accurate positioning and the processing effect during laser processing are realized.
In one embodiment, further comprising: and the collimation and beam expansion unit 104 is used for collimating and expanding the laser beam emitted by the laser.
In the embodiment of the present disclosure, a collimating and beam expanding unit 104 is provided, and the purpose of the collimating and beam expanding is to expand the diameter of the laser beam and reduce the divergence angle of the laser beam. The collimating and beam expanding unit 104 is generally used for converting a laser beam emitted by a laser into a parallel beam with a larger beam diameter through collimating and beam expanding. In one example, the collimating and beam expanding unit 104 is generally disposed in the laser's laser emission direction.
According to the embodiment of the disclosure, the collimating and beam expanding unit is arranged, so that the laser beam emitted by the laser can be collimated and expanded, the transmission of the laser beam is facilitated, and the final laser processing effect is improved.
In one embodiment, further comprising: and a focusing lens 105 disposed between the scanning galvanometer 102 and the product 106 (or the display panel 106, the same applies hereinafter) for focusing the laser beam passing through the scanning galvanometer 102.
In the embodiment of the present disclosure, a focus lens 105 is provided. The focusing lens 105 is disposed between the scanning galvanometer 102 and the product 106 to be processed, and focuses the laser beam passing through the scanning galvanometer 102 onto the product 106 to be processed.
According to the embodiment of the disclosure, the focusing lens is arranged to focus the laser beam passing through the scanning vibrating mirror on a product to be processed, so that the laser processing effect can be improved.
Based on the same inventive concept, as shown in fig. 3, the embodiment of the disclosure further provides a processing method of a display panel, where the method may or may not be applied to the apparatus of any one of the foregoing embodiments, and may also be applied to any other apparatus, and the method includes:
Step S100, obtaining structural information of a region to be processed of a display panel and the spot size of a laser beam;
In the embodiment of the disclosure, when the display panel is processed by laser, first, the structural information of the area to be processed of the display panel and the spot size of the laser beam during processing are obtained. The structural information and the spot size of the area to be processed can be directly input by a user, or can be determined by a controller according to the acquired image information, the laser parameter information and the like. Specifically, the structural information of the area to be processed may include, but is not limited to, a shape of the area to be processed and size data corresponding to the area to be processed. The area to be processed may include, but is not limited to, a camera assembly area or a sound assembly area or any other set area. The image capturing assembly area is generally an area, at a preset position on the display panel, consistent with the structure of the image capturing assembly.
Step S200, determining the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed and the size of the light spots;
In one example, specifically, the arrangement manner of the light spots includes an arrangement number and an arrangement position, or an arrangement position and an arrangement time point, or an arrangement number, an arrangement position, and an arrangement time point. The number of the arranged light spots can be calculated by dividing the area of the structure of the area to be processed by the area of the light spots. The light spots are sequentially arranged according to the structure of the area to be processed to form the arrangement positions of the light spots, specifically, the XY coordinates of the center of each light spot are used as the arrangement positions. The light spots are sequentially arranged according to the structure of the area to be processed, and corresponding arrangement time points for forming the light spots are formed.
In the embodiment of the disclosure, after the structural information of the area to be processed and the size of the light spot are obtained, the arrangement mode of the light spots of the laser beam in the area to be processed is determined according to the size of the light spot and the structural information of the area to be processed. When the light spots are arranged in the area to be processed, the distance between the light spots is reduced as much as possible, and the center distance between the two light spots is equal to the sum of the radii of the two light spots. Thus, as many laser spots as possible are arranged in the region to be processed.
Fig. 4 is a schematic structural view of a to-be-processed area of a display panel according to an exemplary embodiment, and referring to fig. 4, when pixel line units, i.e., connection lines and pixel points, in the display panel are covered by a mask layer, during the arrangement of light spots, the arrangement of light spots may be directly performed on the to-be-processed area without considering damage to the pixel line units, as shown in fig. 5, and during the arrangement, the light spots are closely arranged with minimal gaps along a preset arrangement direction.
Fig. 6 is a schematic view of a structure of a region to be processed of a display panel according to an exemplary embodiment, and referring to fig. 6, when pixel line units, i.e., connection lines and pixel points, in the display panel are not completely covered by a mask layer (the pixel points are covered by the mask layer, the connection lines are not covered by the mask layer in fig. 6), in this case, when the arrangement of light spots is performed, the arrangement of light spots needs to be considered, as shown in fig. 7, on regions other than the pixel line units in the region to be processed, and in the arrangement, the light spots are closely arranged with a minimum gap along a preset arrangement direction.
Step S300, obtaining a target position during laser processing according to the arrangement mode;
in the embodiment of the disclosure, after determining the arrangement mode of the light spots in the area to be processed, determining the target position during processing of the laser beam according to the arrangement of the light spots in the area to be processed, wherein one arranged light spot usually corresponds to one target position. In one example, the target position information also corresponds to a processing time corresponding to the target position. The information of the target location may comprise a plurality of laser scanned target locations or a laser scanned target location field. Alternatively, the target position information and the time information may be acquired, and the information of the target position may include a plurality of laser scanning target positions or laser scanning target position fields, and the time information may include a plurality of laser scanning time points or laser scanning time fields.
Step S400, controlling to emit a laser beam, and controlling to adjust the laser beam to the target position.
In the embodiment of the disclosure, the laser is controlled to emit laser beams, and the scanning galvanometer is controlled to adjust the laser beams to emit to corresponding target positions for processing according to the determined target positions. In one example, when processing the target positions by using the laser beam, processing times are set for a plurality of target positions, and the target positions are processed at the corresponding processing times.
According to the embodiment of the disclosure, firstly, the structure of the area to be processed of the display panel and the spot size of the laser beam are obtained, the arrangement mode of the spots in the area to be processed is determined according to the spot size of the laser beam and the structure of the area to be processed, and the target position during laser processing is determined according to the arrangement mode, so that the cathode layer is etched according to the structure of the area to be processed during laser processing, the light transmittance of the area to be processed is improved, the possibility of damage to the normal display area of the display panel is reduced, the using function of the area to be processed is guaranteed, and the display effect of the display panel is also considered.
In one embodiment, the determining, according to the structural information of the area to be processed of the display panel and the spot size of the laser beam, an arrangement manner of the spots of the laser beam in the area to be processed includes: when at least part of the position area of the pixel line unit of the display panel is not covered by the mask layer, the controller is further configured to determine an arrangement manner of the light spots in the rest area except for the position area in the to-be-processed area according to the structural information of the to-be-processed area of the display panel, the at least part of the position area, and the light spot size of the laser beam; and/or when the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam.
The display panel generally includes a pixel circuit unit, and the pixel circuit unit generally includes a pixel point and a connection circuit for enabling the display panel to display normally.
In the embodiment of the disclosure, the position area of the pixel circuit unit in the display panel is obtained, specifically, the position area of the pixel circuit unit in the whole display panel may be directly obtained, or only the position area of the pixel circuit unit corresponding to the area to be processed may be obtained. According to the obtained to-be-processed area and at least part of the position areas of the pixel circuit units, determining the residual areas except the position areas of the pixel circuit units in the to-be-processed area, taking the residual areas at the moment as processable areas, and determining the arrangement mode of light spots in the residual areas. When the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam.
According to the embodiment of the disclosure, at least part of the position areas of the pixel circuit units in the display panel are obtained, and the arrangement method of the laser spots in the rest areas except the at least part of the position areas of the pixel circuit units in the area to be processed is determined, so that the pixel circuit units can be avoided during laser processing, the light transmittance of the area to be processed is improved to the maximum extent, meanwhile, the damage of the laser etching cathode to the positions of the pixel circuit units is avoided, the influence of the laser processing on the display effect of the display panel is reduced, and the arrangement mode of the spots in the area to be processed of the display panel can be determined under the condition that the pixel circuit units of the display panel are completely covered by the mask layer, so that the accurate positioning during the laser processing is realized.
In one embodiment, the obtaining the structural information of the area to be processed of the display panel includes:
acquiring an image of a display panel;
and determining the position of the structure of the area to be processed in the image according to the position information of the image pickup assembly in the display panel, wherein the image pickup assembly corresponds to the structure of the area to be processed.
In the embodiment of the disclosure, when the structure of the to-be-processed area of the display panel is obtained, an image of the display panel is obtained, the to-be-processed area on the display panel is determined according to the position information of the preset camera assembly on the display panel, and the structure of the to-be-processed area is determined according to the image of the display panel. The preset position information of the camera shooting assembly on the display panel is a position information relation obtained by determining the position of the camera shooting assembly on the display panel according to an actual scene. The structure of the region to be processed may include, but is not limited to, shape information of the region to be processed, size information of the region to be processed, and position information of the pixel line unit in the region to be processed.
According to the embodiment of the disclosure, the position and the structure of the area to be processed are determined according to the image and the position information of the preset camera shooting assembly on the display panel by acquiring the image of the display panel, so that the accurate positioning of the area to be processed in laser processing can be realized, and the possibility of damage to the normal display area in the display panel in processing is reduced.
In one embodiment, the arrangement includes: arranging the light spots on the area to be processed, and enabling the center distance of two adjacent light spots after arrangement to be in a preset value or a preset range; further, the light spots may be arranged on the to-be-processed area according to a preset condition, and the center distance between two adjacent light spots after being arranged is within a preset value or a preset range.
In the embodiment of the disclosure, after the structure of the area to be processed and the spot size of the laser beam are obtained, the spots need to be arranged. At the time of arrangement, in general, the distance between the centers of the next spot and the previous spot is set to a preset value or a preset range. The preset value is generally equal to the spot diameter, and the preset range is generally set to a region around the spot diameter. For example, when the lower limit of the preset range is smaller than the spot diameter, the upper limit of the preset range is larger than or equal to the spot diameter. When the lower limit of the preset range is equal to the spot diameter, the upper limit of the preset range is larger than the spot diameter. When the lower limit of the preset range is larger than the spot diameter, the upper limit of the preset range is larger than the spot diameter. The boundary of the light spot does not exceed the edge of the area to be processed. When the next light spot cannot be adjacently arranged with the previous light spot, the next light spot is generally arranged next to the edge of the area to be processed along the arrangement direction determined according to the actual scene. Further, the preset condition is that the size of the gap after the arrangement of the adjacent light spots is reduced to the greatest extent according to the structure and the light spot size of the area to be processed. In one example, after the arrangement is completed, no more light spots can be arranged in any number in the region other than the arrangement of light spots in the region to be processed. In another example, the arrangement is such that the number of spots is maximized, and accordingly, it is set that as many spots as possible are arranged in the area to be processed until no more arrangement is possible.
According to the embodiment of the disclosure, the light spots are arranged along the preset condition, the center distance between the adjacent light spots is controlled, the arrangement number of the light spots is enabled to be maximum, and the light spots can occupy the area of the area to be processed to the greatest extent when being arranged, so that the light transmittance of the display panel after laser processing is improved, and the use effect of the area to be processed is ensured. In other embodiments, the spot shape may be rectangular, elongated, oval, or the like.
In one embodiment, the area to be machined is typically scoped by an image detection system prior to machining, avoiding damage to other areas that do not have to be machined. And then, reasonably planning the arrangement mode of the laser spots according to the shape of the area to be processed and the size of the actually adopted laser spots so as to ensure that the laser spots are in the range of the processing area as much as possible, the external area is not damaged, certain energy coverage uniformity is ensured, and the processing effect is ensured. When a product to be processed is processed, a laser emits a laser beam, the laser beam is transmitted to a display panel after passing through a collimation beam expanding unit, a scanning vibrating mirror and a focusing lens, is incident from a substrate surface, passes through a gap between the substrate and an anode layer and a mask layer and a gap between pixel circuit units on an organic light-emitting layer, is focused to a cathode layer for scanning, and has high energy density after laser focusing, so that partial metal cathode materials which are not covered by orthographic projection of the mask layer can be accurately removed near a processing focus, and the thermal influence is small. Because the mask layer adopts high-melting point metal, the damage of laser to the pixels and the luminous pixel circuit units can be prevented, and the normal display of the product is ensured.
It should be understood that, although the steps described above are shown in order as indicated by the arrows, the steps are not necessarily performed in the order in which the steps are shown. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least a portion of the steps in the figures may include steps or stages that are not necessarily performed at the same time, but may be performed at different times, nor does the order in which the steps or stages are performed necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the steps or stages in other steps.
In one embodiment, a display panel is provided, including a substrate, an anode, a mask layer, an organic light emitting layer, and a cathode layer, where the cathode layer is fabricated by the method for fabricating a display panel according to any one of the embodiments of the present disclosure.
Fig. 8 is a schematic diagram showing a structure of a display panel before processing according to an exemplary embodiment, and referring to fig. 8, the structure of the display panel includes a substrate 801, an anode 802, a mask layer 803, an organic light emitting layer 804, and a cathode 805, wherein the substrate 801 may be glass or polyimide, and ITO may be used as the anode 802 of the display panel; masking layer 803 is typically a refractory metal; the organic light-emitting layer 804 is a conventional light-emitting layer structure, and comprises red, green and blue pixels, wherein each pixel line unit is distributed in an array, and a certain gap exists between the pixels; cathode 805, which is a low work function metal layer, such as elemental metal: ag, al, li, mg, ca, in, etc., or alloy materials such as Mg: ag (10:1), li: al (0.6% Li) and the like, and in one example, the layer is an MgAg alloy, distributed throughout, and has a thickness in the range of 0-30 nm. The machining laser beam 806 etches the cathode. The processing laser beam sequentially passes through the substrate, anode, mask layer and organic light-emitting layer of the display panel to act on the cathode layer for processing.
Referring to fig. 8, when the pixel line unit, i.e., the connection line and the pixel point in the display panel are covered by the mask layer, the entire region to be processed is scanned by using the laser spot, and because of the mask layer, as shown in fig. 9, the processing laser beam sequentially passes through the substrate, the anode, the mask layer, and the organic light emitting layer of the display panel to act on the cathode layer for processing, and the cathode portion not covered by the mask layer can be directly removed, thereby improving light transmittance.
Fig. 10 is a schematic view of a structure before processing a display panel according to an exemplary embodiment, and referring to fig. 10, when a pixel line unit in the display panel, i.e., a connection line and/or a pixel point are at least partially not covered by a mask layer (only the mask layer covers the pixel point and the mask layer does not cover the connection line in fig. 10), a target position of laser spot processing is controlled during laser processing to avoid the pixel line unit and avoid damage to the pixel line unit, so that a processing laser beam sequentially passes through a substrate, an anode, the mask layer, and an organic light emitting layer of the display panel to process the cathode layer, and a cathode portion of a remaining region except the pixel line unit region in a region to be processed is removed, thereby improving light transmittance, as shown in fig. 11.
In one embodiment, a controller is provided, the internal structure of which may be as shown in FIG. 12. The controller includes a processor S120, a memory S122, a power supply component S124, a network interface S126, and an input-output interface S128, which are connected through a system bus. Wherein the processor of the controller is configured to provide computing and control capabilities. The memory of the controller includes a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database of the controller is used for storing data during the scanning process. The network interface of the controller is used for communicating with an external terminal through network connection. The controller, when executed by a processor, implements a method of processing a display panel.
Those skilled in the art will appreciate that the structure shown in fig. 12 is merely a block diagram of a portion of the structure associated with an embodiment of the present disclosure and is not limiting of the controller to which an embodiment of the present disclosure is applied, and that a particular controller may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
In an embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, implements the steps of the method embodiments described above.
It should be noted that, the user information (including, but not limited to, user equipment information, user personal information, etc.) and the data (including, but not limited to, data for analysis, stored data, presented data, etc.) according to the embodiments of the present disclosure are information and data authorized by the user or sufficiently authorized by each party.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in embodiments provided by the present disclosure may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magneto-resistive random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (PHASE CHANGE Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in various forms such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc. The databases referred to in the embodiments provided by the present disclosure may include at least one of a relational database and a non-relational database. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processors referred to in the embodiments provided in the present disclosure may be general-purpose processors, central processing units, graphic processors, digital signal processors, programmable logic units, data processing logic units based on quantum computing, and the like, without being limited thereto.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
Those of skill in the art will appreciate that the various operations, methods, steps in the flow, acts, schemes, and alternatives discussed in the present application may be alternated, altered, combined, or eliminated. Further, other steps, means, or steps in a process having various operations, methods, or procedures discussed herein may be alternated, altered, rearranged, disassembled, combined, or eliminated.
Further, steps, measures, schemes in the prior art with various operations, methods, flows disclosed in the present application may also be alternated, altered, rearranged, decomposed, combined, or deleted.
The above examples merely represent a few implementations of the disclosed embodiments, which are described in more detail and are not to be construed as limiting the scope of the disclosed embodiments. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made to the disclosed embodiments without departing from the spirit of the disclosed embodiments. Accordingly, the scope of the disclosed embodiments should be determined from the following claims.
Claims (8)
1. A processing device for a display panel, comprising:
a laser for generating and emitting a laser beam;
the scanning galvanometer is used for driving the laser beam to carry out scanning processing;
The controller is electrically connected with the laser and the scanning galvanometer, and is used for determining the arrangement mode of the light spots of the laser beam in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam, acquiring a target position of the laser beam during processing according to the arrangement mode, and controlling the scanning galvanometer to adjust the laser beam to the target position;
The method for determining the arrangement mode of the light spots of the laser beam in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam comprises the following steps: when at least part of the position area of the pixel line unit of the display panel is not covered by the mask layer, the controller is further configured to determine an arrangement manner of the light spots in the rest area except for the position area in the to-be-processed area according to the structural information of the to-be-processed area of the display panel, the at least part of the position area, and the light spot size of the laser beam; and/or when the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam.
2. The apparatus as recited in claim 1, further comprising:
the collimation and beam expansion unit is used for collimating and expanding the laser beam emitted by the laser; and/or a focusing lens is arranged between the scanning galvanometer and the display panel and is used for focusing the laser beam passing through the scanning galvanometer.
3. A method for processing a display panel, the method being applied to a controller of a processing apparatus for a display panel, comprising:
obtaining structural information of a region to be processed of a display panel and the spot size of a laser beam;
Determining the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed and the size of the light spots;
The method for determining the arrangement mode of the light spots of the laser beam in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam comprises the following steps: when at least part of the position area of the pixel line unit of the display panel is not covered by the mask layer, the controller is further configured to determine an arrangement manner of the light spots in the rest area except for the position area in the to-be-processed area according to the structural information of the to-be-processed area of the display panel, the at least part of the position area, and the light spot size of the laser beam; and/or when the position area of the pixel circuit unit of the display panel is covered by the mask layer, the controller directly determines the arrangement mode of the light spots in the area to be processed according to the structural information of the area to be processed of the display panel and the light spot size of the laser beam;
Acquiring a target position during processing of the laser beam according to the arrangement mode;
Controlling the emission of a laser beam and controlling the adjustment of the laser beam to the target position.
4. A method according to claim 3, wherein the obtaining structural information of the area to be processed of the display panel comprises:
acquiring an image of a display panel;
and determining the position of the structure of the area to be processed in the image according to the position information of the image pickup assembly in the display panel, wherein the image pickup assembly corresponds to the structure of the area to be processed.
5. A method according to claim 3, wherein the arrangement comprises:
And arranging the light spots on the area to be processed, and enabling the center distance of two adjacent light spots after arrangement to be in a preset value or a preset range.
6. A display panel, characterized by comprising a substrate, an anode, a mask layer, an organic light-emitting layer and a cathode layer, wherein the cathode layer is manufactured by the manufacturing method of the display panel according to any one of claims 3 to 5.
7. A controller comprising a memory and a processor, the memory storing a computer program, characterized in that the processor, when executing the computer program, carries out the steps of the method of processing a display panel according to any one of claims 3 to 5.
8. A computer program product comprising a computer program, characterized in that the computer program, when being executed by a processor, realizes the steps of the method for processing a display panel according to any one of claims 3 to 5.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
| CN112967975A (en) * | 2020-06-18 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Mass transfer device and mass transfer method |
| CN113199138A (en) * | 2021-05-20 | 2021-08-03 | 武汉锐科光纤激光技术股份有限公司 | Composite laser processing method and composite laser processing device |
| CN113695767A (en) * | 2021-10-29 | 2021-11-26 | 济南邦德激光股份有限公司 | Laser cutting light spot control system and method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7435927B2 (en) * | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
| CN112967975A (en) * | 2020-06-18 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Mass transfer device and mass transfer method |
| CN113199138A (en) * | 2021-05-20 | 2021-08-03 | 武汉锐科光纤激光技术股份有限公司 | Composite laser processing method and composite laser processing device |
| CN113695767A (en) * | 2021-10-29 | 2021-11-26 | 济南邦德激光股份有限公司 | Laser cutting light spot control system and method |
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