CN114397734A

CN114397734A - High-integration vertical wireless light emitting module

Info

Publication number: CN114397734A
Application number: CN202210078579.8A
Authority: CN
Inventors: 郭建设; 王刚; 张磊; 李征; 郭静
Original assignee: China Aviation Optical Electrical Technology Co Ltd
Current assignee: China Aviation Optical Electrical Technology Co Ltd
Priority date: 2022-01-21
Filing date: 2022-01-21
Publication date: 2022-04-26

Abstract

A high-integration-level vertical wireless light emitting module comprises a shell and a printed board arranged in the shell, wherein a heat conducting block is arranged on the printed board in a penetrating mode, the inner side face of the heat conducting block radiates heat through the shell, a plurality of optical active devices are arranged on the outer side face of the heat conducting block, a driving chip is arranged on the heat conducting block on the periphery of the optical active devices, and the optical active devices, the driving chip and the printed board are connected through gold wire bonding; the printed board is provided with array lenses which cover the optical active devices and the driving chip and can transmit optical signals with the outside of the shell, each lens on the array lenses is coaxially coupled with the corresponding optical active device, and each optical active device is positioned at the focus position of the corresponding lens in the array lenses. The optical active device is bonded on the heat conducting block, the array lens is used for shaping light beams, the micro-assembly platform is used for high-precision coupling and packaging, the problem that an existing product is provided with MT tail fibers is solved, and cableless communication of the parallel optical module is achieved.

Description

High-integration vertical wireless light emitting module

Technical Field

The invention belongs to the technical field of wireless optical communication, and particularly relates to a high-integration-level vertical wireless light emitting module.

Background

In the military field, various signal lines are very numerous and complicated, and a plurality of problems exist when optical fiber cables and radio frequency cables are interwoven. Therefore, demands are made for a whole interconnection link which is cableless, integrated (active integration, multi-signal connection integration), miniaturized, and highly densified. The parallel optical module used at present has the problems of large volume, low integration level and the like. In the future, the chassis for the platform will be developed in the directions of small volume, high integration degree, high speed and low weight, so that the existing parallel optical module cannot meet the requirements, and becomes a great obstacle for restricting the development of the fields of aviation, aerospace, electronics and the like.

As shown in fig. 1, the products currently used to establish interconnection through the MT pigtail and the connector include VCSEL arrays or PIN detector arrays, optical coupling units, MT pigtails, connectors, etc. When the product is used, the product is welded on a printed board, meanwhile, the MT tail fiber is inserted into a connector, the length of the MT tail fiber needs to be strictly controlled in the connection process, and in addition, the tail fiber of the parallel optical module occupies the area of a daughter board and the available space in a compressor case.

Disclosure of Invention

In order to solve the technical problem that the optical module occupies space with MT tail fibers, the invention provides a high-integration-level vertical wireless light emitting module.

The purpose of the invention is realized by adopting the following technical scheme. According to the high-integration-level vertical wireless light emitting module provided by the invention, the high-integration-level vertical wireless light emitting module comprises a shell and a printed board arranged in the shell, wherein a heat conducting block is arranged on the printed board in a penetrating manner, the inner side surface of the heat conducting block radiates heat through the shell, a plurality of optical active devices are arranged on the outer side surface of the heat conducting block, a driving chip is arranged on the heat conducting block at the periphery of the optical active devices, and the optical active devices, the driving chip and the printed board are connected through gold wire bonding; the printed board is provided with array lenses which cover the optical active devices and the driving chip and can transmit optical signals with the outside of the shell, each lens on the array lenses is coaxially coupled with the corresponding optical active device, and each optical active device is positioned at the focus position of the corresponding lens in the array lenses.

Furthermore, end face contact connectors are symmetrically arranged at two ends of the outer side face of the printed board.

Furthermore, the heat conducting block is a tungsten copper block, a heat conducting material is arranged between the tungsten copper block and the shell, and the tungsten copper block and the printed board are fixed in a dispensing mode.

Furthermore, the tungsten copper block and the driving chip are fixed in an eutectic mode.

Furthermore, the outer side surface of the heat conducting block is provided with a groove, a substrate is nested in the groove, and a plurality of optical active devices are distributed on the substrate.

Further, the substrate is fixed in the groove by using solder, and the optical active device is fixed on the substrate by using silver paste.

Further, the substrate is made of silicon or ceramic, and the thickness of the substrate is 0.2 mm.

Further, the optically active device comprises a laser and/or a detector.

Furthermore, the array lens is a multi-core beam expanding lens capable of shaping optical signals, the lenses in the array lens are arranged in a staggered mode, and correspondingly, the optical active devices are also arranged in a staggered mode.

Furthermore, the periphery of the array lens is provided with a guide pin hole for guiding during installation.

Compared with the prior art, the invention has the advantages that:

1. the optical active device is bonded on the heat conducting block, the array lens is used for shaping light beams, and the micro-assembly platform is used for high-precision coupling and packaging, so that the problem that an existing product has MT tail fibers is solved, and cableless communication of the parallel optical module is realized;

2. the invention has the characteristics of small volume and direct coupling with the waveguide plate, the optical fiber plate or the photoelectric composite plate, overcomes the problem that complicated optical devices such as a prism and the like need to turn when the parallel optical module is coupled with the waveguide plate, the optical fiber plate or the photoelectric composite plate, simplifies the optical path structure and reduces the cost.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a schematic diagram of a prior art optical module;

fig. 2 is a perspective view of an embodiment of a highly integrated vertical wireless light exit module according to the present invention;

FIG. 3 is a front view of FIG. 2;

FIG. 4 is a cross-sectional view taken at A in FIG. 3;

FIG. 5 is an enlarged schematic view at B in FIG. 4;

fig. 6 is a schematic installation view of the embodiment of fig. 2.

[ reference numerals ]

1-end face contact connector, 2-array lens, 201-guide pin hole, 3-shell, 4-printed board, 5-substrate, 6-tungsten copper block, 7-heat conducting material, 8-optical active device, 9-driving chip, 10-guide pin, 11-light through hole, 12-optical waveguide, 13-coupling piece, and 14-photoelectric composite board.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

An embodiment of the invention relates to a high-integration-level vertical wireless light emitting module, which comprises a shell 3, wherein the shell 3 is integrally a rectangular plate, a printed board 4 is embedded in the shell 3, and one end face of the printed board 4 is flush with the end face of the shell 3, as shown in fig. 1 to 5. Two sides of the exposed surface of a printed board 4 are respectively symmetrically provided with an end face contact connector 1, the middle position of the printed board 4 is provided with an array lens 2, a substrate 5, a tungsten copper block 6, a heat conduction material 7, an optical active device 8 and a driving chip 9, wherein the optical active device 8 can be a laser or a detector, in the same optical module, the optical active devices can be all lasers and can be used for emitting optical signals, can also be all detectors and can be used for receiving the optical signals, meanwhile, part of the optical active devices can be the lasers, the other part of the optical active devices is the detectors, the optical module can be used for realizing bidirectional transmission of the optical signals, the driving chip 9 is used as a driver or an amplifier of the module, the substrate 5 is made of materials such as silicon or ceramics, and the thickness of the substrate 5 is 0.2 mm.

A groove-shaped hole or other types of assembling holes are formed in the middle of the printed board 4, the main body of the tungsten copper block 6 is located in the shell 3, the middle protruding portion of the tungsten copper block 6 penetrates out of the groove-shaped hole from the shell 3, and the tungsten copper block 6 is fixed to the joint of the printed board 4 through dispensing. The outer portion of the convex portion of the tungsten copper block 6 is grooved, and the substrate 5 is fixed in the groove with solder. All optically active devices 8 are fixed on the substrate 5 with silver paste or the like. When the tungsten copper block 6 is installed, the substrate 2 and the optical active device 8 are arranged on the tungsten copper block 6, the tungsten copper block 6 is integrally buckled on the printed board 4 in an inverted mode, the end face of the protruding portion of the tungsten copper block is flush with the outer side face of the printed board, and then the shell 3 covers the outer sides of the printed board 4 and the tungsten copper block 6.

The driving chip 9 is adhered to the tungsten copper block 6 on the periphery of the optical active device 8, the tungsten copper block 6 and the driving chip 9 are eutectic, a gold wire bonding pad is arranged on the printed board 4, and the optical active device 8, the driving chip 9 and the printed board 4 are respectively connected through routing by gold wire bonding. The driving chip 9 is eutectic-crystallized on the tungsten copper block 6, so that the fixing and heat dissipation problems of the driving chip 9 can be effectively solved. Emergent light of the laser or incident light of the detector is transmitted perpendicular to the bottom surface of the shell 3 and is electrically connected with the driving chip 9 through gold wire bonding.

The tungsten copper block 6 can be used for conducting heat, the driving chip 9 and the light-active device 8 are fixedly bonded on the tungsten copper block 6, a heat conducting material 7 is added between the tungsten copper block 6 and the shell 3 before the shell 3 is additionally arranged, heat generated by the driving chip 9 and the light-active device 8 is completely led into the shell 3, and the surface of the shell 3 is connected to a heat dissipation system of equipment for active heat dissipation.

The array lens 2 covers and is fixed on the printed board 4, and covers all the optical active devices 8 and the driving chip 9, a plurality of lenses are arranged on the array lens 2 and correspond to the optical active devices 8 one by one, the coaxial coupling of each optical active device 8 and the corresponding lens in the array lens 2 is realized by utilizing a high-precision micro-assembly process, the coupling error is within +/-3 mu m, the optical active devices are positioned at the focus positions of the corresponding lenses in the array lens 2, and the error is within +/-2 mu m. The array lens 2 adopted by the invention is a multi-core beam expanding lens, and can be used for shaping light beams. In addition, the periphery of the array lens 2 is provided with a guide pin hole 201, the diameter of the guide pin hole 201 is phi 0.699mm, the guide pin hole 201 and the array lens 2 are formed into a whole through injection molding, the guide pin hole 201 can be matched with an MT standard guide pin 10 for use, the product portability is improved, and the alignment precision of a module in the using process can be effectively ensured. The array lens 2 is integrally formed by adopting a die and plated with an antireflection film, so that a light beam can be shaped into quasi-parallel light with the diameter of 400 mu m, the alignment tolerance of products during interconnection can be greatly improved, and in the embodiment, 4 guide pin holes 201 are arranged, so that the alignment precision of the products is further improved.

The optical active devices 8 are bonded on the substrate 5 in a staggered arrangement mode, the distance between the optical active devices 8 is increased from 0.25mm to 0.5mm, products can be debugged and assembled according to the existing parallel optical module standard, the production cost is greatly reduced, and the compatibility of the optical active device is improved. Correspondingly, each lens position on the array lens 2 corresponds to an optically active device 8.

The invention can select the number of optical transmission paths as 12 paths, 24 paths, 48 paths and the like, and can also select other paths according to the requirement, and correspondingly, the number of the optical active devices 8 and the array lenses 2 corresponds to the number of paths.

The invention relates to a parallel wireless optical module, which is characterized in that an optical active device 8 is bonded on a substrate 5, an array lens 2 is used for beam shaping, and a micro-assembly platform is used for high-precision coupling packaging, so that the problem that the existing product has MT tail fibers is solved, and the cableless communication of the parallel optical module is realized.

The invention can be used for products such as waveguide boards, optical fiber boards or photoelectric composite boards, and is assisted by a circuit board for power supply and signal transmission, in the embodiment, the photoelectric composite board 14 is adopted, a groove-shaped hole is required to be arranged between the circuit board and the photoelectric composite board 14 as a light through hole 11, and the circuit board can be electrically connected with the invention through the end face contact connector 1 on the invention. In practical operation, firstly, the invention and the photoelectric composite board 14 are assembled together, the guide pins 10 are arranged on two sides inside the light through holes 11, the invention and the photoelectric composite board 14 are accurately assembled together by utilizing the structures of the guide pins 10 and the guide pin holes 201, and the alignment of the array lens 2 and each optical waveguide 12 is realized, wherein the number of lenses in the array lens, the number of optical active devices and the number of optical waveguides correspond to each other; then, the invention and the circuit board layer can be fixed by adopting modes of LCC welding, fuzz button installation, LGA installation, pogo pin installation and the like. After the invention is fixed with the photoelectric composite board 14, assuming that the optical active device 8 is a laser, divergent light emitted by the laser is integrated into parallel light or quasi-parallel light with a near optical axis by the array lens 2 on the bottom surface to be incident into the optical waveguide 12, so as to realize cableless communication of the parallel wireless optical module, or in other embodiments, the optical active device 8 is a detector, and parallel light in the optical waveguide 12 is converted into light which can be received by the detector through the array lens 2. The photoelectric composite board 14 is provided with a coupling piece 13 connected with the optical waveguide 12 for connecting and coupling with other equipment.

The invention has the characteristics of small volume and direct coupling with the waveguide plate, the optical fiber plate or the photoelectric composite plate, overcomes the problem that complicated optical devices such as a prism and the like need to turn when the parallel optical module is coupled with the waveguide plate, the optical fiber plate or the photoelectric composite plate, simplifies the optical path structure and reduces the cost.

The interconnection mode of the photoelectric composite board and the circuit board layer in the photoelectric composite board can adopt the mode of equal-pressure welding of a hair button, a spring needle, an LGA and the like, and can also adopt the mode of surface-mounted welding of a BGA and an LCC, thereby greatly improving the practicability of the product.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a perpendicular wireless light emitting module of high integration degree, includes the casing, sets up the printing board in the casing, its characterized in that: a heat conducting block penetrates through the printed board, the inner side surface of the heat conducting block radiates heat through the shell, a plurality of optical active devices are arranged on the outer side surface of the heat conducting block, a driving chip is arranged on the heat conducting block at the periphery of the optical active devices, and the optical active devices, the driving chip and the printed board are connected through gold wire bonding; the printed board is provided with array lenses which cover the optical active devices and the driving chip and can transmit optical signals with the outside of the shell, each lens on the array lenses is coaxially coupled with the corresponding optical active device, and each optical active device is positioned at the focus position of the corresponding lens in the array lenses.

2. The high-integration vertical wireless light emitting module of claim 1, wherein: and end face contact connectors are symmetrically arranged at two ends of the outer side face of the printed board.

3. The high-integration vertical wireless light emitting module of claim 1, wherein: the heat conducting block is a tungsten copper block, a heat conducting material is arranged between the tungsten copper block and the shell, and the tungsten copper block and the printed board are fixed in a dispensing mode.

4. The highly integrated vertical wireless light emitting module according to claim 3, wherein: and the tungsten copper block and the driving chip are fixed in an eutectic mode.

5. The high-integration vertical wireless light emitting module of claim 1, wherein: the outer side surface of the heat conduction block is provided with a groove, a substrate is nested in the groove, and a plurality of optical active devices are distributed on the substrate.

6. The highly integrated vertical wireless light emitting module of claim 5, wherein: the substrate is fixed in the groove by using solder, and the optically active device is fixed on the substrate by using silver paste.

7. The highly integrated vertical wireless light emitting module of claim 5, wherein: the substrate is made of silicon or ceramic, and the thickness of the substrate is 0.2 mm.

8. The high-integration vertical wireless light emitting module of claim 1, wherein: the optically active device comprises a laser and/or a detector.

9. The high-integration vertical wireless light emitting module of claim 1, wherein: the array lens is a multi-core beam expanding lens capable of shaping optical signals, the lenses in the array lens are arranged in a staggered mode, and correspondingly, the optical active devices are also arranged in a staggered mode.

10. The high-integration vertical wireless light emitting module of claim 1, wherein: and guide pin holes for guiding during installation are formed in the periphery of the array lens.