CN114395337A - Adhesive film for paving polymer industrial floor and preparation method thereof - Google Patents
Adhesive film for paving polymer industrial floor and preparation method thereof Download PDFInfo
- Publication number
- CN114395337A CN114395337A CN202111662454.1A CN202111662454A CN114395337A CN 114395337 A CN114395337 A CN 114395337A CN 202111662454 A CN202111662454 A CN 202111662454A CN 114395337 A CN114395337 A CN 114395337A
- Authority
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- China
- Prior art keywords
- resin
- adhesive
- base material
- adhesive film
- agent
- Prior art date
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- Granted
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 40
- 229920000642 polymer Polymers 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 78
- 239000011347 resin Substances 0.000 claims abstract description 78
- 239000000853 adhesive Substances 0.000 claims abstract description 66
- 230000001070 adhesive effect Effects 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- 239000004744 fabric Substances 0.000 claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 239000000835 fiber Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- 150000004658 ketimines Chemical class 0.000 claims abstract description 18
- 239000003085 diluting agent Substances 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002250 absorbent Substances 0.000 claims abstract description 8
- 230000002745 absorbent Effects 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 8
- -1 tackifier Substances 0.000 claims abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 52
- 229910052757 nitrogen Inorganic materials 0.000 claims description 26
- 239000004745 nonwoven fabric Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 15
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 14
- 239000007822 coupling agent Substances 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000012752 auxiliary agent Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000002562 thickening agent Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 7
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 7
- 239000004917 carbon fiber Substances 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 6
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 6
- 239000002518 antifoaming agent Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 238000009958 sewing Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 150000003672 ureas Chemical class 0.000 claims description 5
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- 229920000768 polyamine Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Polymers 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000292 calcium oxide Substances 0.000 claims description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 125000005456 glyceride group Chemical group 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 2
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical class [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000009408 flooring Methods 0.000 claims 6
- 238000007790 scraping Methods 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000003860 storage Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 238000010276 construction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical group CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 241000361919 Metaphire sieboldi Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000007551 Shore hardness test Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006161 polyetheramine-modified polyamide Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000009418 renovation Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J115/00—Adhesives based on rubber derivatives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an adhesive film for paving a polymer industrial floor, which comprises a base material, wherein the whole body of the base material is coated with a resin adhesive; the base material comprises fiber cloth; the resin adhesive comprises the following components in parts by weight: epoxy resin, flexible resin, diluent, tackifier, water absorbent, ketone imine curing agent and filler. The special resin adhesive prepared by taking the epoxy resin, the tough resin and the ketimine curing agent as raw materials is matched with the specific base material, and the prepared adhesive film solves the problem of labor cost caused by on-site adhesive preparation and scraping in the paving of the high-molecular industrial floor.
Description
Technical Field
The invention relates to the technical field of industrial floor paving application, in particular to an adhesive film for paving a polymer industrial floor and a preparation method thereof.
Background
The industrial production environment is more and more intelligent, the requirements on the renovation and the reconstruction of factory floors and the speed and the progress of newly-built factory buildings are very high, the construction of ground materials needs to be completed in a very short time, and particularly in the current new energy, hydrogen energy, semiconductor and chip industries, each new factory project is competing with the time.
At present, the floor material gradually enters the factory production from the field solidification and is prepared into a form of paving on the spot after being coiled; however, in the field paving construction process, the coating of the high molecular industrial floor adhesive is still needed to complete the paving of the coiled material. Most of the currently used polymer industrial floor adhesives are double components, the adhesives belong to paste substances, and the double components needing to be prepared in the construction process are strictly and uniformly stirred according to the proportion; in addition, a large amount of labor is needed for scraping glue, and manual operation has the characteristics of low speed and low efficiency; and the scraping time is critical, and the scraping of the whole area must be completed within half an hour, otherwise partial adhesive failure may result.
Therefore, it is very important to develop an adhesive film for paving polymer industrial floors.
Disclosure of Invention
The invention provides a high polymer industrial floor paving adhesive film and a preparation method thereof, the adhesive film is suitable for paving a high polymer industrial floor, can replace the existing double-component adhesive, and has the characteristics of convenient transportation, high bonding strength, good toughness, moderate hardness, convenient construction and high construction speed, and the storage condition is not harsh and the storage time is long.
The specific technical scheme is as follows:
the invention relates to an adhesive film for paving a polymer industrial floor, which comprises a base material, wherein the whole body of the base material is coated with a resin adhesive; the substrate comprises a fiber cloth;
the resin adhesive comprises the following components in parts by weight:
the invention selects the ketimine curing agent to be combined with the epoxy resin and the tough resin, so that the raw material components in the resin adhesive have a delayed reaction phenomenon, namely: the resin adhesive is prepared in a dry environment, so that the ketimine curing agent in the components can not react with epoxy resin and tough resin, and a stable adhesive film without obvious viscosity is obtained; when the polymer industrial floor is paved, the resin adhesive component ketone imine curing agent on the outer surface of the adhesive film reacts with moisture in the ground and air to be decomposed, so that the resin adhesive film is subjected to curing reaction with epoxy resin and tough resin to form the adhesive film with strong viscosity, and the paving requirement of the industrial floor is met.
The ketimine curing agent is a condensation polymer prepared by the reaction of ketones and poly-primary amine, the reaction is reversible, once the ketimine curing agent meets water and moisture, polyamine and corresponding ketones are dissociated, after the reverse reaction, the decomposed polyamine is an epoxy resin curing agent, and can rapidly react with an epoxy group to form a cured product after crosslinking and curing, so that the bonding effect is achieved. The epoxy resin has the advantages of high activity, high reaction speed, high epoxy value, large curing agent amount required by reaction, excellent toughness of the tough resin, low epoxy value and small amount of required curing agent, and the combination of the epoxy resin and the tough resin has high solid content of the resin and small using amount of the curing agent, thereby being beneficial to prolonging the storage time of the adhesive film.
The adhesive film obtained by the principle improves the construction convenience and does not need manual scraping. Meanwhile, the fiber cloth with a certain fixed shape is used as a base material, so that the bonding area and the bonding strength of the foundation ground and the polymer industrial floor are greatly improved, bubbles generated during bonding can be well eliminated by the fiber cloth, the bonding integral performance is improved, and earthworm grains generated by the polymer industrial floor due to tiny and tiny cracks on the ground are eliminated.
The fiber cloth is used as a base material, integrity and stability of the whole adhesive film can be improved, a reinforcing effect is achieved, the bonding area and bonding strength of the basic ground and the polymer industrial floor are greatly improved, bubbles generated during bonding can be well eliminated, the bonding integral performance is improved, and earthworm grains of the polymer industrial floor caused by small and fine cracks on the ground are eliminated. Further, the fiber cloth is at least one of glass fiber woven cloth, carbon fiber woven cloth and polyester woven cloth; the thickness of the fiber cloth is 0.2-1.5 mm. The fiber cloth is too thin, the glue content is low, hollowing is easy to generate when the industrial floor is paved, and the bonding strength is reduced; the fiber cloth is thick, the hardness is easy to increase, the thickness of the glue layer is too thick, and the unevenness phenomenon is easy to occur when the industrial floor is paved.
In order to further improve the adhesive content, the bonding strength and the bonding contact area of the base material, the base material further comprises non-woven fabrics attached to the upper surface and/or the lower surface of the fiber cloth; the non-woven fabric is at least one of carbon fiber felt, PP non-woven fabric and PET non-woven fabric. The use of non-woven fabrics can increase whole bonding strength, increases the bonding area, improves the industrial floor flatness of mating formation.
Furthermore, the base material is formed by sequentially overlapping a non-woven fabric surface layer, a fiber cloth middle reinforcing layer and a non-woven fabric bottom layer from top to bottom and sewing the non-woven fabric surface layer, the fiber cloth middle reinforcing layer and the non-woven fabric bottom layer through elastic threads; the gram weight of the non-woven fabric is 50-120 g/m2The tensile elongation is more than or equal to 100 percent, and the thickness is 0.03-0.5 mm. The too low gram weight and the too low thickness of the non-woven fabrics lead to easy cracking and wrinkling, and can not achieve the function of increasing the strength of the adhesive, and the too high gram weight and the too high thickness lead to too large proportion of the non-woven fabrics in the rubber sheet composition, and serious deformation during the paving use, thus leading to uneven paved industrial floors. The tensile elongation of the elastic thread and the non-woven fabric is more than or equal to 100 percent, so that a certain amount of deformable allowance can be ensured in the use process of the film, and the film is suitable for the anisotropic size of the bonded ground.
Further, the epoxy resin is at least one of bisphenol A epoxy resin and bisphenol F epoxy resin, is in a liquid state, and has an epoxy equivalent of 150-250 g/eq; the tough resin is at least one of polyurethane polymer and hydroxyl-terminated modified liquid nitrile rubber prepolymer. The epoxy resin is in a liquid state, is convenient to operate, has low viscosity, and can reduce the dosage of a diluent; the tough resin has good toughness, has epoxy groups participating in crosslinking curing reaction, and has low activity for prolonging storage.
Furthermore, the tough resin is a liquid polymer, a branched chain polymer containing ether and polyurethane groups, and a hydroxyl-terminated modified liquid nitrile rubber prepolymer, and the epoxy equivalent is 800-2500 g/eq.
Further, the ketimine-based curing agent is at least one of a condensate of methyl isobutyl ketone and 1, 3-bis (aminomethyl) cyclohexane, and a condensate of polyether-modified aliphatic polyamine and methyl isobutyl ketone; the diluent is at least one of propylene carbonate, 1, 6-hexanediol diglycidyl ether and polyethylene glycol; the tackifier is at least one of natural rosin, hydrogenated rosin glyceride and pentaerythritol ester of hydrogenated rosin; the water absorbent is at least one of calcium oxide and activated molecular sieve; the filler is at least one of calcium carbonate, talcum powder, TPU powder and quartz powder.
In order to improve the effects of the adhesive strength, filler dispersibility and viscosity stability of the resin adhesive, the resin adhesive further comprises: 0.1-2% of a thickening agent; 0.3-1% of an auxiliary agent; 0.1-0.3% of a coupling agent; 1-3% of color paste.
Preferably, the resin adhesive comprises the following components in parts by weight:
further, the thickening agent is at least one of fumed silica, bentonite and modified urea solution; the auxiliary agent is one of a defoaming agent, a dispersing agent and a flatting agent; the coupling agent is at least one of gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane and gamma-aminopropyl triethoxy silane; the color paste is solvent-free epoxy resin-based color paste.
Further, the defoaming agent is an organic silicon modified polymer; the dispersant is alkanol ammonium salt solution of polyfunctional group polymer; the leveling agent is polyacrylate solution.
The invention also provides a preparation method of the adhesive film for paving the polymer industrial floor, which comprises one of the following two modes:
the first method is as follows:
(1) mixing the epoxy resin, the tough resin, the diluent and the tackifier according to the using amount proportion of each component of the resin adhesive in the adhesive film of any one of claims 1 to 6, heating to 100-110 ℃, cooling to below 60 ℃, adding the ketimine curing agent, the water absorbent and the filler under the protection of dry nitrogen, and mixing to prepare the resin adhesive;
(2) coating the resin adhesive prepared in the step (1) on the surface of a base material under the protection of nitrogen, heating the base material coated with the resin adhesive to 60-70 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain an adhesive film for paving a polymer industrial floor;
the second method comprises the following steps:
(A) mixing epoxy resin, tough resin, diluent, thickener, tackifier, color paste and coupling agent according to the proportion of each component of the resin adhesive in the adhesive film of any one of claims 7 or 8, heating to 100-110 ℃, cooling to below 60 ℃, and adding auxiliary agent, ketimine curing agent, water absorbent and filler under the protection of dry nitrogen to prepare the resin adhesive;
(B) and (C) coating the resin adhesive prepared in the step (A) on the surface of a base material under the protection of nitrogen, heating the base material coated with the resin adhesive to 60-70 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain the adhesive film for paving the polymer industrial floor.
The water contained in the raw materials such as resin, diluent and the like can be removed by heating, the addition of the auxiliary agent is facilitated by reducing the temperature, the effect of part of the auxiliary agent can be damaged by high temperature, and part of the low-boiling-point solvent in the auxiliary agent can be volatilized. The nitrogen protection has the advantages of air and moisture isolation, no active wave in chemical property of nitrogen, stability and difficult reaction with other substances.
In order to improve the integrity, the bonding contact area and the bonding strength of the adhesive film, further, in the step (2), the preparation method of the substrate comprises the following steps: and (3) sequentially superposing the surface non-woven fabric, the middle enhancement layer fiber cloth and the bottom non-woven fabric from top to bottom, and sewing the three layers into a whole by adopting elastic threads to obtain the base material.
Compared with the prior art, the invention has the following beneficial effects:
the special resin adhesive prepared by taking the epoxy resin, the tough resin and the ketimine curing agent as raw materials is matched with the specific base material, and the prepared adhesive film solves the problem of labor cost caused by on-site adhesive preparation and scraping in the paving of the high-molecular industrial floor.
Detailed Description
The present invention will be further described with reference to the following specific examples, which are only illustrative of the present invention, but the scope of the present invention is not limited thereto.
The sources of materials referred to in the following examples are as follows:
epoxy resin NPEL-128, epoxy resin NPEL-170 (Nanya electronic materials Kunshan Co., Ltd.); diluent 632 (hunbei green home chemical llc); diluents PC100, PG400, antifoaming agents 7010 (Kashing City Anxing New materials science and technology Co., Ltd.); flexible resins Desmocap12, Desmocap 11 (complex advanced materials (shanghai) ltd); tackifiers 5020F, 8030F (Shanghai Xingsheng industries Co., Ltd.); water-absorbing agents a4, a5 (guangzhou xin china environmental protection materials limited); the ketimine curing agent 1023M-73 (Guangzhou Xianhui International trade Co., Ltd.); ketimine curing agent YR332 (yori chemical co., york); thickener silica M5, modified urea solution BYK-410 (Shanghai Yikomao Co., Ltd.); dispersant BYK181, leveling agent BYK-354 (Shanghai Bick chemical Co., Ltd.); coupling agents KH550, KH560 (jiangsu morning light coupling agent limited); calcium carbonate, talcum powder, TPU powder and quartz powder (Hebei Baisteke technology Co., Ltd.).
The index detection methods involved in the following examples are as follows:
shore hardness: the determination is carried out by adopting a GB/T2411 Shore hardness test method for plastics; flexibility: the measurement is carried out by using GB/T6742 color paint and varnish bending test (cylindrical shaft); bonding strength: the measurement is carried out by adopting JC/T550 polyvinyl chloride plastic floor adhesive specification; tensile strength: the determination is carried out by GB/T1040.1 determination of tensile property of plastics; the storage conditions and the curing conditions were determined under the conditions of an ambient temperature of 25 ℃ and a humidity of 70%.
Example 1
Preparation of resin adhesive
Mixing 12 parts of bisphenol A epoxy resin NPEL-128 with the epoxy equivalent of 194g/eq, 33 parts of tough resin Desmocap12, 8 parts of diluent 632 and 4 parts of tackifier 5020F, heating to 110 ℃, cooling to 55 ℃, adding 10 parts of ketimine curing agent 1023M-73, 3 parts of water absorbent A4 and 30 parts of calcium carbonate under the protection of dry nitrogen, and mixing to prepare a resin adhesive;
preparation of adhesive film
Coating the resin adhesive prepared in the step on the surface of glass fiber woven cloth with the thickness of 1.0mm under the protection of nitrogen, heating the glass fiber woven cloth coated with the resin adhesive to 70 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain an adhesive film for paving a polymer industrial floor;
through the test: the bonding strength is 2.5 MPa; flexibility after curing of(ii) a The storage time is 180 days; the curing time is 4 hours; the hardness was 25D.
Example 2
Preparation of resin adhesive
Mixing 10 parts of bisphenol F epoxy resin NPEL-170 with the epoxy equivalent of 195g/eq, 30 parts of tough resin Desmocap 11, 10 parts of diluent PG400 and 5 parts of tackifier 5020F, heating to 110 ℃, cooling to 50 ℃, and adding 11 parts of ketimine curing agent YR332 under the protection of dry nitrogen; 3 parts of a water-absorbing agent A5; 0.1 part of thickener silica M5; 0.3 part of a defoaming agent 7010; 0.1 part of a coupling agent KH 550; 1 part of color paste EP 566; 29.5 parts of talcum powder, and mixing to prepare a resin adhesive;
preparation of adhesive film
Coating the resin adhesive prepared in the step on the surface of carbon fiber woven cloth with the thickness of 0.8mm under the protection of nitrogen, heating the glass fiber woven cloth coated with the resin adhesive to 70 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain an adhesive film for paving a polymer industrial floor;
through the test: the bonding strength is 2.8 MPa; flexibility after curing of(ii) a The storage time is 360 days; the curing time is 5 hours; the hardness was 30D.
Example 3
Preparation of resin adhesive
Mixing 9 parts of bisphenol F epoxy resin NPEL-170 with the epoxy equivalent of 195g/eq, 33 parts of tough resin Desmocap12, 8 parts of diluent PC100 and 4 parts of tackifier 8030F, heating to 100 ℃, cooling to 55 ℃, and adding 9 parts of ketimine curing agent YR332 under the protection of dry nitrogen; 4 parts of a water-absorbing agent a 4; 1 part of thickener modified urea solution BYK-410; 0.3 part of dispersant BYK 181; 0.2 part of a coupling agent KH 560; 3 parts of color paste EP 566; 20 parts of talcum powder; 8.5 parts of TPU powder, and mixing to prepare a resin adhesive;
preparation of adhesive film
The gram weight is 60g/m2PET non-woven fabric with tensile elongation of 150% and thickness of 0.1mm, polyester fiber woven fabric with thickness of 0.5mm and gram weight of 80g/m2Tensile elongation of 180% and thicknessAnd (3) sequentially superposing the carbon fiber non-woven fabrics with the degree of 0.13mm from top to bottom, and sewing the three layers into a whole by adopting elastic threads to obtain the base material. And (3) coating the resin adhesive prepared in the step on the obtained base material under the protection of nitrogen, heating the glass fiber woven cloth coated with the resin adhesive to 65 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain the adhesive film for paving the polymer industrial floor.
Through the test: the bonding strength is 3.5 MPa; flexibility after curing of(ii) a The storage time is 360 days; the curing time was 3 hours; the hardness was 20D.
Comparative example 1
This comparative example, except for the different choice of type of curing agent, is: the same procedure as in example 1 was repeated except that a polyether amine-modified polyamide curing agent A7-11 was used.
Through detection: the curing agent has already begun to react with the epoxy resin, the tough resin, during the preparation of the resin adhesive.
Comparative example 2
This comparative example was identical to example 1, except that 6 parts of a bisphenol F epoxy resin NPEL-170 having an epoxy equivalent of 195g/eq was used in place of the tough resin Desmocap 12.
Through detection: the bonding strength is 1.8 MPa; flexibility after curing of(ii) a The storage time is 80 days; the curing time is 2 hours; the hardness was 70D.
Comparative example 3
This comparative example is exactly the same as example 1 except that 12 parts of the solid epoxy resin NPEL-901 was used instead of the bisphenol A epoxy resin NPEL-128.
Through detection: the viscosity of the prepared resin adhesive is too high, and the resin adhesive cannot be coated to prepare a film.
Comparative example 4
This comparative example is exactly the same as example 1 except that 33 parts of a hydroxyl toughener, CM4010, was used in place of the toughened resin, Desmocap 12.
Through detection: the bonding strength is 0.8 MPa; toughness and flexibility after curing of(ii) a The storage time is 200 days; the curing time is 8 hours; the hardness was 10D.
Comparative example 5
This comparative example is identical to example 1 except that the amount of the ketimine-based curing agent 1023M-73 was increased to 18 parts and the amount of the corresponding calcium carbonate was reduced to 22 parts.
Through detection: the bonding strength is 0.5 MPa; toughness and flexibility after curing of(ii) a The storage time is 180 days; the curing time is 5 hours; no value was determined for hardness.
Comparative example 6
This comparative example is identical to example 1 except that the amount of tough resin Desmocap12 was reduced to 15 parts, corresponding to an increase in calcium carbonate to 48 parts.
Through detection: the bonding strength is 2.5 MPa; flexibility after curing of(ii) a The storage time is 100 days; the curing time is 2 hours; the hardness was 60D.
Example 4
Preparation of resin adhesive
Mixing 13 parts of bisphenol F epoxy resin NPEL-128 with the epoxy equivalent of 195g/eq, 22 parts of tough resin Desmocap12, 7 parts of diluent PC100 and 3 parts of tackifier 8030F, heating to 110 ℃, cooling to 55 ℃, and adding 11 parts of ketimine curing agent YR332 under the protection of dry nitrogen; 4 parts of a water-absorbing agent a 4; 1.5 parts of thickener-modified urea solution BYK-410; 0.5 part of dispersant BYK 181; 0.2 part of a leveling agent BYK 354; 0.3 part of a coupling agent KH 560; 2 parts of color paste; 15 parts of talcum powder; 20.5 parts of calcium carbonate, and mixing to prepare a resin adhesive;
preparation of adhesive film
The gram weight is 100g/m2A carbon fiber nonwoven fabric having a tensile elongation of 200% and a thickness of 0.1mm, a polyester fiber woven fabric having a thickness of 0.6mm, and a grammage of 60g/m2And the PP non-woven fabrics with the tensile elongation of 120 percent and the thickness of 0.13mm are sequentially overlapped from top to bottom, and the three layers are sewn into a whole by adopting elastic threads to obtain the base material. Coating the resin adhesive prepared in the step on the obtained base material under the protection of nitrogen, heating the glass fiber woven cloth coated with the resin adhesive to 60 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain an adhesive film for paving a polymer industrial floor; .
Claims (10)
2. the adhesive film for polymer industrial flooring application according to claim 1, wherein the fiber cloth is at least one of a glass fiber woven cloth, a carbon fiber woven cloth, and a polyester woven cloth; the thickness of the fiber cloth is 0.2-1.5 mm.
3. The adhesive sheet for polymer industrial flooring according to claim 1, wherein the base material further comprises a non-woven fabric attached to the upper surface and/or the lower surface of the fiber cloth; the non-woven fabric is at least one of carbon fiber felt, PP non-woven fabric and PET non-woven fabric.
4. The adhesive sheet for polymer industrial flooring according to claim 3, wherein the substrate is formed by sequentially stacking a non-woven surface layer, a fiber cloth middle reinforcing layer and a non-woven bottom layer from top to bottom and sewing the non-woven surface layer, the fiber cloth middle reinforcing layer and the non-woven bottom layer by elastic threads; the gram weight of the non-woven fabric is 50-120 g/m2The tensile elongation is more than or equal to 100 percent, and the thickness is 0.03-0.5 mm.
5. The adhesive sheet for polymer industrial floor paving according to claim 1, wherein the epoxy resin is at least one of bisphenol a epoxy resin and bisphenol F epoxy resin, is in a liquid state, and has an epoxy equivalent of 150 to 250 g/eq; the tough resin is at least one of polyurethane polymer and hydroxyl-terminated modified liquid nitrile rubber prepolymer.
6. The adhesive sheet according to claim 1, wherein the ketimine-based curing agent is at least one of a condensate of methyl isobutyl ketone and 1, 3-bis (aminomethyl) cyclohexane, and a condensate of polyether-modified aliphatic polyamine and methyl isobutyl ketone; the diluent is at least one of propylene carbonate, 1, 6-hexanediol diglycidyl ether and polyethylene glycol; the tackifier is at least one of natural rosin, hydrogenated rosin glyceride and pentaerythritol ester of hydrogenated rosin; the water absorbent is at least one of calcium oxide and activated molecular sieve; the filler is at least one of calcium carbonate, talcum powder, TPU powder and quartz powder.
7. The adhesive sheet for polymer industrial flooring application according to claim 1, wherein the resin adhesive further comprises: 0.1-2% of a thickening agent; 0.3-1% of an auxiliary agent; 0.1-0.3% of a coupling agent; 1-3% of color paste.
8. The adhesive film for polymer industry flooring application according to claim 7, wherein the thickener is at least one of fumed silica, bentonite, and modified urea solution; the auxiliary agent is at least one of a defoaming agent, a dispersing agent and a flatting agent; the coupling agent is at least one of gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane and gamma-aminopropyl triethoxy silane; the color paste is solvent-free epoxy resin-based color paste.
9. The preparation method of the adhesive film for paving the polymer industrial floor is characterized by comprising one of the following two modes:
the first method is as follows:
(1) mixing the epoxy resin, the tough resin, the diluent and the tackifier according to the using amount proportion of each component of the resin adhesive in the adhesive film of any one of claims 1 to 6, heating to 100-110 ℃, cooling to below 60 ℃, adding the ketimine curing agent, the water absorbent and the filler under the protection of dry nitrogen, and mixing to prepare the resin adhesive;
(2) coating the resin adhesive prepared in the step (1) on the surface of a base material under the protection of nitrogen, heating the base material coated with the resin adhesive to 60-70 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain an adhesive film for paving a polymer industrial floor;
the second method comprises the following steps:
(A) mixing epoxy resin, tough resin, diluent, thickener, tackifier, color paste and coupling agent according to the proportion of the components of the resin adhesive in the adhesive film of any one of claims 7 or 8, heating to 100-110 ℃, cooling to below 60 ℃, and adding auxiliary agent, curing agent, water absorbent and filler under the protection of dry nitrogen to prepare the resin adhesive;
(B) and (C) coating the resin adhesive prepared in the step (A) on the surface of a base material under the protection of nitrogen, heating the base material coated with the resin adhesive to 60-70 ℃, cooling and rolling, and filling nitrogen into an aluminum foil bag for protection and sealing to obtain the adhesive film for paving the polymer industrial floor.
10. The method for preparing adhesive film for polymer industrial flooring according to claim 9, wherein in the step (2) or (B), the substrate is prepared by: and (3) sequentially superposing the surface non-woven fabric, the middle enhancement layer fiber cloth and the bottom non-woven fabric from top to bottom, and sewing the three layers into a whole by adopting elastic threads to obtain the base material.
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CN115895393A (en) * | 2022-12-27 | 2023-04-04 | 浙江港流高分子科技股份有限公司 | Internal and external corner section bar for polymer industrial floor upper wall and preparation method thereof |
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