CN114395310A - GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and preparation method thereof - Google Patents
GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and preparation method thereof Download PDFInfo
- Publication number
- CN114395310A CN114395310A CN202111610036.8A CN202111610036A CN114395310A CN 114395310 A CN114395310 A CN 114395310A CN 202111610036 A CN202111610036 A CN 202111610036A CN 114395310 A CN114395310 A CN 114395310A
- Authority
- CN
- China
- Prior art keywords
- parts
- heat
- epoxy resin
- wave
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 85
- 239000011248 coating agent Substances 0.000 title claims abstract description 83
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 56
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 59
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000000945 filler Substances 0.000 claims abstract description 31
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 23
- 239000002105 nanoparticle Substances 0.000 claims abstract description 18
- 229940037003 alum Drugs 0.000 claims abstract description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000007822 coupling agent Substances 0.000 claims abstract description 14
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- -1 alum Substances 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 13
- 239000004094 surface-active agent Substances 0.000 claims description 11
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 238000001027 hydrothermal synthesis Methods 0.000 claims description 9
- 239000000047 product Substances 0.000 claims description 9
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 claims description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 7
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 6
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 6
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000005642 Oleic acid Substances 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 6
- AUVPWTYQZMLSKY-UHFFFAOYSA-N boron;vanadium Chemical compound [V]#B AUVPWTYQZMLSKY-UHFFFAOYSA-N 0.000 claims description 5
- 239000003431 cross linking reagent Substances 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000002244 precipitate Substances 0.000 claims description 4
- 239000008096 xylene Substances 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000010335 hydrothermal treatment Methods 0.000 claims description 3
- 230000002194 synthesizing effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 239000002131 composite material Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 239000011259 mixed solution Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229940049964 oleate Drugs 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G49/00—Compounds of iron
- C01G49/02—Oxides; Hydroxides
- C01G49/08—Ferroso-ferric oxide (Fe3O4)
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/23—Magnetisable or magnetic paints or lacquers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2275—Ferroso-ferric oxide (Fe3O4)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/01—Magnetic additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and a preparation method thereof. The heat-conducting wave-absorbing integrated coating comprises the following components: the heat-conducting and wave-absorbing integrated coating is prepared from graphene oxide, iron powder, a filler, epoxy resin, a film-forming agent, alum, propylene glycol and a titanate coupling agent in proportion. Wherein the filler is Fe3O4The nano particles, and the weight proportion of the filler is 27-29%. The heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound. The invention is integrated with heat conduction and wave absorptionThe coating has high heat conduction and wave absorption functions, the interface of the coating is thinner than that of a flaky heat conduction material, the coating is suitable for heat conduction and wave absorption of precise electronic elements, and the application prospect is excellent. The preparation method provided by the invention is low in cost and saves resources, and meanwhile, the Fe/Fe3O 4/epoxy resin magnetic composite is synthesized by reaction under the condition of 0.8T magnetic field, and the thermal conductivity of the prepared coating is enhanced by applying the magnetic field.
Description
Technical Field
The invention relates to the field of coatings, in particular to a GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and a preparation method thereof.
Background
The introduction of high frequency in the 5G era, the upgrading of hardware parts and the multiplication of the quantity of internet equipment and antennas, the electromagnetic interference between the equipment and inside the equipment is ubiquitous, and the harm of the electromagnetic interference and the electromagnetic radiation to the electronic equipment is increasingly serious. Meanwhile, along with the updating and upgrading of electronic products, the power consumption of equipment is continuously increased, and the heat productivity is also rapidly increased. The bottleneck of future high-frequency and high-power electronic products is the electromagnetic radiation and heat generated by the electronic products, and in order to solve the problem, heat transfer and wave absorption are carried out by virtue of coatings.
However, in order to realize the functions of heat conduction and wave absorption, the current coating needs to be coated by mixing a heat conduction material and an EMI wave absorption material, so that the coating has a thick interface and a large required space, cannot be applied to the heat conduction and wave absorption of precise electronic elements, and has a poor application prospect.
Disclosure of Invention
Based on the above, the GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and the preparation method thereof are provided for the problems that the interface of the coating is thick, the required space is large, the coating cannot be suitable for the heat-conducting wave-absorbing use of precise electronic elements and the application prospect is poor due to the fact that the heat-conducting material and the EMI wave-absorbing material are required to be mixed and coated in order to realize the heat-conducting and wave-absorbing functions of the current coating.
GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating, which comprises the following components: preparing the heat-conducting and wave-absorbing integrated coating by graphene oxide, iron powder, a filler, epoxy resin, a film-forming agent, alum, propylene glycol and a titanate coupling agent in proportion; wherein the filler is Fe3O4The filler comprises nano particles, wherein the filler accounts for 27-29% by weight;
the heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound.
The heat-conducting wave-absorbing integrated coating is prepared by taking Graphene Oxide (GO) as a carrier, combining Fe and Fe3O4 nano materials as magnetic insulating materials, and matching epoxy resin as a polymer material with strong bonding force, high stability and low solid shrinkage rate to blend and compound, so that a corresponding GO/Fe/Fe3O 4/epoxy resin composite material is obtained, the coating has high heat-conducting and wave-absorbing functions, and the influence of electromagnetic waves is reduced.
In one embodiment, the film forming agent comprises the following components in parts by weight: 2-4 parts of vanadium boride, 2-3 parts of a cross-linking agent, 4-5 parts of ditetradecanol ester, 1-2 parts of cyclohexanone peroxide, 3-4 parts of styrene, 1-2 parts of acrylonitrile and 8-10 parts of dimethylbenzene.
Further, the weight ratio of the cyclohexanone peroxide to the acrylonitrile is 1: 1.
in one embodiment, the heat-conducting wave-absorbing integrated coating comprises the following components in parts by weight: 12-18 parts of graphene oxide, 6-8 parts of iron powder, 27-29 parts of filler, 28-32 parts of epoxy resin, 4-6 parts of film forming agent, 1-3 parts of alum, 1-2 parts of propylene glycol and 3-4 parts of titanate coupling agent.
Further, the heat-conducting wave-absorbing integrated coating comprises the following components in parts by weight: 17 parts of graphene oxide, 7 parts of iron powder, 28 parts of filler, 32 parts of epoxy resin, 5 parts of film forming agent, 2 parts of alum, 3 parts of propylene glycol and 6 parts of titanate coupling agent.
A preparation method of a heat-conducting wave-absorbing integrated coating comprises the following steps:
s1 mixing to obtain a film-forming agent for later use;
s2, synthesizing a filler based on a hydrothermal method for later use;
s3, dispersing graphene oxide into deionized water to obtain a graphene dispersion liquid for later use;
s4, sequentially adding the filler, the iron powder, the epoxy resin and the film forming agent into the graphene dispersion liquid, and heating and stirring to obtain a mixture A;
s5, under the action of a 0.8T magnetic field, adding alum, propylene glycol and a titanate coupling agent into the mixture A, heating and stirring, and reacting to obtain the heat-conducting wave-absorbing integrated coating;
the heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound.
In one embodiment, the hydrothermal synthesis of Fe3O4The method for preparing the nano particles comprises the following specific operations:
s21 provides surfactant, FeCl 2.4H 2O;
s22, dropwise adding the surfactant into FeCl 2.4H 2O, and carrying out hydrothermal treatment for 1-4H at the temperature of 150-200 ℃ to obtain a mixture;
s23 centrifuging the mixture, and performing solid-liquid separation to obtain Fe precipitate3O4Nanoparticles.
In one embodiment, the surfactants are oleic acid and oleylamine.
Further, the preparation method is applied to the preparation of the GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating.
An application of GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating in electronic products.
Compared with the prior art, the invention has the beneficial effects that:
the heat-conducting wave-absorbing integrated coating disclosed by the invention is prepared by taking Graphene Oxide (GO) as a carrier, combining Fe and Fe3O4 nano materials as a magnetic insulating material, and matching epoxy resin as a polymer material with strong bonding force, high stability and low solid shrinkage rate to blend and compound, so that a corresponding GO/Fe/Fe3O 4/epoxy resin composite material is obtained, the coating has high heat-conducting and wave-absorbing functions, and the influence of electromagnetic waves is reduced.
According to the preparation method, oleic acid and amine oleate are mixed to serve as the surfactant, so that the nano particles synthesized by hydrothermal synthesis are small in dispersity, uniform in shape and size, and the waste liquid obtained after solid-liquid separation can be reused to synthesize the filler, so that the preparation cost is reduced and the resources are saved.
The preparation method of the invention, based on the reaction synthesis of Fe/Fe3O 4/epoxy resin magnetic compound under the condition of 0.8T magnetic field, enhances the thermal conductivity of the prepared coating by applying the magnetic field.
In conclusion, the heat-conducting wave-absorbing integrated coating is a GO/Fe/Fe3O 4/epoxy resin magnetic compound, has high heat-conducting and wave-absorbing functions, and reduces the influence of electromagnetic waves. The nano particles hydrothermally synthesized by the preparation method disclosed by the invention are small in dispersity, uniform in shape and size, and in addition, waste liquid after solid-liquid separation can be recycled, so that the preparation cost is reduced and resources are saved, meanwhile, the Fe/Fe3O 4/epoxy resin magnetic compound is synthesized by reaction under the condition of a 0.8T magnetic field, and the thermal conductivity of the prepared coating is enhanced by applying the magnetic field.
Detailed Description
The present invention is described in detail below.
The invention provides a GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating. The heat-conducting wave-absorbing integrated coating comprises the following components: the heat-conducting and wave-absorbing integrated coating is prepared from graphene oxide, iron powder, a filler, epoxy resin, a film-forming agent, alum, propylene glycol and a titanate coupling agent (TMC-TTS) in proportion, wherein the filler is Fe3O4The nano particles, and the weight proportion of the filler is 27-29%. According to the invention, alum is added to increase the binding power among the components, and the binding strength of the coating is improved to effectively prevent the coating from falling off.
The heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound.
The film forming agent comprises the following components in parts by weight: 2-4 parts of vanadium boride, 2-3 parts of a cross-linking agent (TAC), 4-5 parts of bistetradecanol ester, 1-2 parts of cyclohexanone peroxide, 3-4 parts of styrene, 1-2 parts of acrylonitrile and 8-10 parts of xylene. Wherein the weight ratio of the cyclohexanone peroxide to the acrylonitrile is 1: 1.
the heat-conducting wave-absorbing integrated coating comprises the following components in parts by weight: 12-18 parts of graphene oxide, 6-8 parts of iron powder, 27-29 parts of filler, 28-32 parts of epoxy resin, 4-6 parts of film forming agent, 1-3 parts of alum, 1-2 parts of propylene glycol and 3-4 parts of titanate coupling agent.
The heat-conducting wave-absorbing integrated coating of the embodiment takes Graphene Oxide (GO) as a carrier, Fe and Fe3O4 nano materials are combined to serve as magnetic insulating materials, epoxy resin is matched to serve as polymer materials with strong bonding force, high stability and low solid shrinkage rate to be blended and compounded, and a corresponding GO/Fe/Fe3O 4/epoxy resin composite material is obtained, so that the coating has high heat-conducting and wave-absorbing functions, the influence of electromagnetic waves is reduced, the heat-conducting wave-absorbing integrated coating of the embodiment is thinner in interface compared with a sheet-shaped heat-conducting material, therefore, the required space is smaller, the heat-conducting wave-absorbing integrated coating is suitable for heat-conducting wave-absorbing of a precise electronic element, and the application prospect is excellent.
Example 1
The embodiment provides a GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating. The heat-conducting wave-absorbing integrated coating comprises the following components: the heat-conducting and wave-absorbing integrated coating is prepared from graphene oxide, iron powder, a filler, epoxy resin, a film-forming agent, alum, propylene glycol and a titanate coupling agent (TMC-TTS) in proportion. In the embodiment, alum is added to increase the binding force among the components, and the binding strength of the coating is improved to effectively prevent the coating from falling off. Wherein the filler is Fe3O4The nano particles, and the weight proportion of the filler is 27-29%.
The heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound. The heat-conducting wave-absorbing integrated coating comprises the following components in parts by weight: 17 parts of graphene oxide, 7 parts of iron powder, 28 parts of filler, 32 parts of epoxy resin, 5 parts of film forming agent, 2 parts of alum, 3 parts of propylene glycol and 6 parts of titanate coupling agent. The film forming agent comprises the following components in parts by weight: 3 parts of vanadium boride, 2 parts of a cross-linking agent (TAC), 4 parts of ditetradecanol ester, 2 parts of cyclohexanone peroxide, 4 parts of styrene, 2 parts of acrylonitrile and 9 parts of xylene.
Example 2
The embodiment provides a preparation method of a heat-conducting wave-absorbing integrated coating, which is applied to the preparation of the GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating in the embodiment 1. The preparation method comprises the following steps:
s1 to obtain the filming agent.
The compounding method of the film forming agent comprises the following operations:
s11 mixing the cross-linking agent and the ditetradecanol ester, adding the mixture into xylene, and stirring for 15min to obtain a mixed solution A.
S12 adding cyclohexanone peroxide into the mixed solution A, stirring and reacting for 30-40 min, adding styrene, and continuing stirring and reacting for 55min to obtain mixed solution B.
S13, sequentially adding acrylonitrile and vanadium boride into the mixed solution B, and stirring to react for 2 hours to obtain the film-forming agent.
S2 Synthesis of Filler (Fe) based on hydrothermal method3O4Nanoparticles) for use.
The hydrothermal method is used for synthesizing Fe3O4The method for preparing the nano particles comprises the following specific operations:
s21 provides surfactant, FeCl 2.4H 2O.
S22 the surfactant is dripped into FeCl 2.4H 2O and hydrothermal treatment is carried out for 2H under the temperature condition of 180 ℃ to obtain a mixture.
S23 centrifuging the mixture, and performing solid-liquid separation to obtain Fe precipitate3O4Nanoparticles.
Washing and drying the collected precipitate to obtain Fe3O4Nanoparticles. The surfactant is oleic acid and oleic acid amine. In the embodiment, oleic acid and amine oleate are mixed to serve as the surfactant, so that the nano particles synthesized by hydrothermal synthesis are small in dispersity, uniform in appearance and size, and the waste liquid obtained after solid-liquid separation can be reused to synthesize the filler, so that the preparation cost is reduced and the resources are saved.
S3, dispersing the graphene oxide into deionized water to obtain a graphene dispersion liquid for later use.
S4 orderly putting the Chinese charactersThe filler (Fe)3O4And adding the nano particles), the iron powder, the epoxy resin and the film forming agent into the graphene dispersion liquid, and heating and stirring to obtain a mixture A.
S5, under the action of a 0.8T magnetic field, adding alum, propylene glycol and a titanate coupling agent into the mixture A, heating and stirring, and reacting to obtain the heat-conducting wave-absorbing integrated coating.
The heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound. In this embodiment, a Fe/Fe3O 4/epoxy resin magnetic composite is synthesized by reaction under the condition of a 0.8T magnetic field, and the result of testing the thermal conductivity of the prepared thermal conductive wave-absorbing integrated coating shows that the thermal conductivity of the coating formed by magnetic field assisted molding is 3.05 times that of pure epoxy resin, and the thermal conductivity of the coating not formed by magnetic field assisted molding is 2.47 times that of pure epoxy resin. This demonstrates that the preparation method of this example, by applying a magnetic field, enhances the thermal conductivity of the resulting coating.
According to the preparation method, the nano particles synthesized by the hydrothermal method are small in dispersity, uniform in shape and size, and the waste liquid obtained after solid-liquid separation can be recycled, so that the preparation cost is reduced, resources are saved, meanwhile, the Fe/Fe3O 4/epoxy resin magnetic composite is synthesized by reaction under the condition of a 0.8T magnetic field, and the thermal conductivity of the prepared coating is enhanced by applying the magnetic field.
Example 3
The embodiment provides application of a GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating in electronic products. The GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating in the embodiment 1 is taken, the heat-conducting wave-absorbing integrated coating is sprayed on the surface of an electronic product by a spray gun, and then is dried at the temperature of 100 ℃ for 1h to form a film, so that a coating is formed on the surface of the electronic product, and the coating has high heat transfer performance and an electromagnetic wave absorption function, and is suitable for the protection and use of high-sensitivity electronic products.
For the naming of each component referred to, the function described in the specification is used as the standard for naming, but is not limited by the specific term used in the present invention, and those skilled in the art can also select other terms to describe each component name of the present invention.
Claims (10)
- The GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating is characterized by comprising the following components: preparing the heat-conducting and wave-absorbing integrated coating by graphene oxide, iron powder, a filler, epoxy resin, a film-forming agent, alum, propylene glycol and a titanate coupling agent in proportion; wherein the filler is Fe3O4The filler comprises nano particles, wherein the filler accounts for 27-29% by weight;the heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound.
- 2. The GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating of claim 1, wherein the film-forming agent comprises the following components in parts by weight: 2-4 parts of vanadium boride, 2-3 parts of a cross-linking agent (TAC), 4-5 parts of bistetradecanol ester, 1-2 parts of cyclohexanone peroxide, 3-4 parts of styrene, 1-2 parts of acrylonitrile and 8-10 parts of xylene.
- 3. The GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating of claim 2, wherein the weight part ratio of cyclohexanone peroxide to acrylonitrile is 1: 1.
- 4. the GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating of claim 1, which is characterized in that the heat-conducting wave-absorbing integrated coating comprises the following components in parts by weight: 12-18 parts of graphene oxide, 6-8 parts of iron powder, 27-29 parts of filler, 28-32 parts of epoxy resin, 4-6 parts of film forming agent, 1-3 parts of alum, 1-2 parts of propylene glycol and 3-4 parts of titanate coupling agent.
- 5. The GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating of claim 4, wherein the heat-conducting wave-absorbing integrated coating comprises the following components in parts by weight: 17 parts of graphene oxide, 7 parts of iron powder, 28 parts of filler, 32 parts of epoxy resin, 5 parts of film forming agent, 2 parts of alum, 3 parts of propylene glycol and 6 parts of titanate coupling agent.
- 6. A preparation method of a heat-conducting wave-absorbing integrated coating is characterized by comprising the following steps:s1 mixing to obtain a film-forming agent for later use;s2, synthesizing a filler based on a hydrothermal method for later use;s3, dispersing graphene oxide into deionized water to obtain a graphene dispersion liquid for later use;s4, sequentially adding the filler, the iron powder, the epoxy resin and the film forming agent into the graphene dispersion liquid, and heating and stirring to obtain a mixture A;s5, under the action of a 0.8T magnetic field, adding alum, propylene glycol and a titanate coupling agent into the mixture A, heating and stirring, and reacting to obtain the heat-conducting wave-absorbing integrated coating;the heat-conducting wave-absorbing integrated coating contains a GO/Fe/Fe3O 4/epoxy resin magnetic compound.
- 7. The preparation method of the heat-conducting wave-absorbing integrated coating as claimed in claim 6, wherein Fe is synthesized by a hydrothermal method3O4The method for preparing the nano particles comprises the following specific operations:s21 provides surfactant, FeCl 2.4H 2O;s22, dropwise adding the surfactant into FeCl 2.4H 2O, and carrying out hydrothermal treatment for 1-4H at the temperature of 150-200 ℃ to obtain a mixture;s23 centrifuging the mixture, and performing solid-liquid separation to obtain Fe precipitate3O4Nanoparticles.
- 8. The preparation method of the heat-conducting wave-absorbing integrated coating according to claim 7, wherein the surfactant is oleic acid and oleylamine.
- 9. The preparation method of the heat-conducting and wave-absorbing integrated coating according to claim 6, wherein the preparation method is applied to the preparation of the GO/Fe/Fe3O 4/epoxy resin heat-conducting and wave-absorbing integrated coating according to any one of claims 1 to 5.
- 10. An application of GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating in electronic products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111610036.8A CN114395310A (en) | 2021-12-27 | 2021-12-27 | GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111610036.8A CN114395310A (en) | 2021-12-27 | 2021-12-27 | GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114395310A true CN114395310A (en) | 2022-04-26 |
Family
ID=81227276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111610036.8A Pending CN114395310A (en) | 2021-12-27 | 2021-12-27 | GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114395310A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101003701A (en) * | 2006-12-31 | 2007-07-25 | 大连理工大学 | Method for modifying functional coat of gradient dispersed stuffing grains, and application |
| CN103351786A (en) * | 2013-06-19 | 2013-10-16 | 天长市驰程电子科技有限公司 | Composite heat dissipation coating composition and preparation method thereof |
| CN103351743A (en) * | 2013-06-19 | 2013-10-16 | 天长市驰程电子科技有限公司 | Thermal-conductive and heat-dissipation coating and preparation method thereof |
| CN106977986A (en) * | 2017-04-28 | 2017-07-25 | 山东欧铂新材料有限公司 | A kind of resin antiradar coatings and preparation method thereof |
| CN112812660A (en) * | 2021-01-13 | 2021-05-18 | 牛墨石墨烯应用科技有限公司 | Coating with high thermal conductivity and high wave absorption performance and preparation method thereof |
| CN113337230A (en) * | 2021-05-11 | 2021-09-03 | 广东创辉鑫材科技股份有限公司 | High-thermal-conductivity semi-cured adhesive film for metal substrate and preparation method thereof |
-
2021
- 2021-12-27 CN CN202111610036.8A patent/CN114395310A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101003701A (en) * | 2006-12-31 | 2007-07-25 | 大连理工大学 | Method for modifying functional coat of gradient dispersed stuffing grains, and application |
| CN103351786A (en) * | 2013-06-19 | 2013-10-16 | 天长市驰程电子科技有限公司 | Composite heat dissipation coating composition and preparation method thereof |
| CN103351743A (en) * | 2013-06-19 | 2013-10-16 | 天长市驰程电子科技有限公司 | Thermal-conductive and heat-dissipation coating and preparation method thereof |
| CN106977986A (en) * | 2017-04-28 | 2017-07-25 | 山东欧铂新材料有限公司 | A kind of resin antiradar coatings and preparation method thereof |
| CN112812660A (en) * | 2021-01-13 | 2021-05-18 | 牛墨石墨烯应用科技有限公司 | Coating with high thermal conductivity and high wave absorption performance and preparation method thereof |
| CN113337230A (en) * | 2021-05-11 | 2021-09-03 | 广东创辉鑫材科技股份有限公司 | High-thermal-conductivity semi-cured adhesive film for metal substrate and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| GUANHUA GAO等: "Solvothermal synthesis and characterization of size-controlled monodisperse Fe3O4 nanoparticles", 《JOURNAL OF MATERIALS SCIENCE》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Liu et al. | Controllable synthesis and enhanced microwave absorption properties of silane-modified Ni 0.4 Zn 0.4 Co 0.2 Fe 2 O 4 nanocomposites covered with reduced graphene oxide | |
| Feng et al. | Fabrication of NiFe 2 O 4@ carbon fiber coated with phytic acid-doped polyaniline composite and its application as an electromagnetic wave absorber | |
| Jeon et al. | Microwave absorption properties of graphene oxide capsulated carbonyl iron particles | |
| Ma et al. | Preparation, characterization and microwave absorption properties of polyaniline/Co0. 5Zn0. 5Fe2O4 nanocomposite | |
| Hosseini et al. | Magnetic, conductive, and microwave absorption properties of polythiophene nanofibers layered on MnFe2O4/Fe3O4 core–shell structures | |
| CN107286907B (en) | Molybdenum disulfide/carbonyl iron composite microwave absorbent with core-shell structure and preparation method thereof | |
| Cao et al. | Preparation and microwave shielding property of silver-coated carbonyl iron powder | |
| Zhang et al. | Preparation and microwave absorbing performance of MoS 2@ Fe 3 O 4@ PANI composites | |
| CN105950112B (en) | A kind of nano combined absorbing material and preparation method thereof | |
| CN109943018B (en) | Wave absorbing agent, wave absorbing material and respective preparation method | |
| Han et al. | Complex permeability and microwave absorbing properties of planar anisotropy carbonyl-iron/Ni0. 5Zn0. 5Fe2O4 composite in quasimicrowave band | |
| Salimkhani et al. | Study on the magnetic and microwave properties of electrophoretically deposited nano-Fe3O4 on carbon fiber | |
| Poorbafrani et al. | Structural, magnetic and electromagnetic wave absorption properties of SrFe 12 O 19/ZnO nanocomposites | |
| Rahimi-Nasrabadi et al. | Synthesis, characterization, magnetic and microwave absorption properties of iron–cobalt nanoparticles and iron–cobalt@ polyaniline (FeCo@ PANI) nanocomposites | |
| Shimba et al. | Microwave absorption properties of polymer modified Ni-Zn ferrite nanoparticles | |
| CN112094482B (en) | High-dielectric low-loss resin-based nanocomposite material for X waveband and method thereof | |
| Sharma et al. | Development of electroless (Ni-P)/BaNi0. 4Ti0. 4Fe11. 2O19 nanocomposite powder for enhanced microwave absorption | |
| CN114395310A (en) | GO/Fe/Fe3O 4/epoxy resin heat-conducting wave-absorbing integrated coating and preparation method thereof | |
| Zheng et al. | Preparation of Ce2Fe17N3–δ@ FePO4 composite with excellent microwave absorption performance by reduction-diffusion (R/D) and phosphating processes | |
| US20160165766A1 (en) | Method for making electromagnetic wave shielding material | |
| JP6167560B2 (en) | Insulating flat magnetic powder, composite magnetic body including the same, antenna and communication device including the same, and method for manufacturing composite magnetic body | |
| CN104693690A (en) | Polyaniline/epoxy resin wave-absorbing composite material and preparation method thereof | |
| Youh et al. | A carbonyl iron/carbon fiber material for electromagnetic wave absorption | |
| CN112175437B (en) | RGO/Co x Cu 1-x Fe 2 O 4 Composite material and preparation method and application thereof | |
| CN113724957A (en) | Soft magnetic composite powder, soft magnetic powder core and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220426 |
|
| RJ01 | Rejection of invention patent application after publication |