CN114388699A - Slit coating device and working method thereof - Google Patents
Slit coating device and working method thereof Download PDFInfo
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- CN114388699A CN114388699A CN202210030445.9A CN202210030445A CN114388699A CN 114388699 A CN114388699 A CN 114388699A CN 202210030445 A CN202210030445 A CN 202210030445A CN 114388699 A CN114388699 A CN 114388699A
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- glass substrate
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- cutter head
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- 238000000576 coating method Methods 0.000 title claims abstract description 92
- 239000011248 coating agent Substances 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000002347 injection Methods 0.000 claims abstract description 41
- 239000007924 injection Substances 0.000 claims abstract description 41
- 238000010926 purge Methods 0.000 claims abstract description 22
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims description 77
- 239000000243 solution Substances 0.000 claims description 66
- 238000000137 annealing Methods 0.000 claims description 24
- 239000002243 precursor Substances 0.000 claims description 22
- 239000007789 gas Substances 0.000 claims description 21
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 15
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 14
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000010329 laser etching Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229920001167 Poly(triaryl amine) Polymers 0.000 claims description 8
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims description 8
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 8
- 239000002096 quantum dot Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- 229910001018 Cast iron Inorganic materials 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 239000004579 marble Substances 0.000 claims description 3
- 238000002207 thermal evaporation Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000005054 agglomeration Methods 0.000 abstract description 3
- 230000002776 aggregation Effects 0.000 abstract description 3
- 238000010408 sweeping Methods 0.000 abstract 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 12
- 239000010408 film Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 4
- PXWSKGXEHZHFJA-UHFFFAOYSA-N dodecylazanium;iodide Chemical compound [I-].CCCCCCCCCCCC[NH3+] PXWSKGXEHZHFJA-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000003599 detergent Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910004755 Cerium(III) bromide Inorganic materials 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000012296 anti-solvent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000024 caesium carbonate Inorganic materials 0.000 description 2
- MOOUSOJAOQPDEH-UHFFFAOYSA-K cerium(iii) bromide Chemical compound [Br-].[Br-].[Br-].[Ce+3] MOOUSOJAOQPDEH-UHFFFAOYSA-K 0.000 description 2
- ZASWJUOMEGBQCQ-UHFFFAOYSA-L dibromolead Chemical compound Br[Pb]Br ZASWJUOMEGBQCQ-UHFFFAOYSA-L 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- -1 floors Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000005457 ice water Substances 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002159 nanocrystal Substances 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 229940127554 medical product Drugs 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
- B05D3/0473—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas for heating, e.g. vapour heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a slit coating device and a working method thereof, wherein the slit coating device comprises the following steps: a base; the movement control system is used for controlling the coated substrate to move on the base at a constant speed along a first direction; the coating system is located the top of base, and the coating system includes: the syringe comprises a tool bit, a first conduit connected with the tool bit through a first conduit joint, a syringe connected with the other end of the first conduit opposite to the tool bit, and an injection control system for controlling the syringe; gaseous purge system locates the top of base, and gaseous purge system includes: the air knife, a second conduit connected with the air knife through a second conduit joint, an air source connected with the other end of the second conduit opposite to the air knife, an air heating device for heating air and a meter for controlling the air sweeping flow rate; the cutter head and the air knife are sequentially arranged along the first direction, and the cutter head and the air knife run synchronously. The invention can blow and dry the solvent in time in the coating process, thereby avoiding solvent agglomeration.
Description
Technical Field
The invention relates to the technical field of solar cell preparation, in particular to a slit coating device and a working method thereof.
Background
As a precise wet coating technique, the working principle is that a coating liquid is extruded and ejected along a gap of a coating die under a certain pressure and a certain flow rate to be transferred onto a substrate. Compared with other coating modes, the coating method has the advantages of high coating speed, high precision and uniform wet thickness; the coating system is closed, can prevent pollutants from entering in the coating process, has high slurry utilization rate, can keep the stable slurry property, and can carry out multilayer coating simultaneously. And the method can adapt to different slurry viscosity and solid content ranges, and has stronger adaptability compared with a transfer coating process.
Slit Coating (slit die Coating) is a high-precision Coating method, and is not only applied to Coating of roll substrates such as electronic packages (FPC, RCC, CSP, LOC, etc.), optical films (brightness enhancement film, hardcoat, polarizing film, diffusion film, etc.), battery plates, etc., but also applied to Coating of discontinuous substrates such as LCD glass substrate photoresists. The principle of operation is to pump a volume of fluid into a mold that spreads the fluid evenly. Slit coating can process various types of adhesive (including special transparent adhesive) batteries, ceramic capacitors, decorative surfaces, electronic display media, filtration membranes, floors, fuel cells, magnetic slurries, medical products, photoresists, pressure sensitive tapes, solar cells, superconductors, tear tapes, window films, and the like.
The existing slit type coating instrument cannot adapt to the preparation of solar cells because of the following reasons: firstly, when coating a part of perovskite solar cells, an anti-solvent needs to be flushed in, but the operation of a slit type coating instrument is difficult at present. The antisolvent can not be simultaneously flushed, so that the quality of the perovskite film layer is influenced, and the efficiency of the solar cell is low; secondly, in the coating process, the solvent cannot be dried in time, which leads to solvent agglomeration, affects the formation of each film layer and also reduces the solar efficiency.
Disclosure of Invention
In view of the above, the present invention is directed to a slit coating apparatus and a working method thereof, which solve the problems that in a coating process, a solvent cannot be dried and dried in time, the solvent is agglomerated, the formation of each film layer is affected, and the solar efficiency is also reduced.
In order to achieve the purpose, the invention adopts the technical scheme that:
a slot coating apparatus, comprising:
a base;
the movement control system is used for controlling the coated substrate to move on the base at a constant speed along a first direction;
a coating system disposed above the base, the coating system comprising: the syringe comprises a cutter head, a first conduit connected with the cutter head through a first conduit joint, a syringe connected with the other end of the first conduit opposite to the cutter head, and an injection control system for controlling the syringe;
a gas purge system disposed above the pedestal, the gas purge system comprising: the air knife, a second conduit connected with the air knife through a second conduit joint, an air source connected with the other end, opposite to the air knife, of the second conduit, a gas heating device used for heating gas, and a meter used for controlling the gas purging flow rate;
the cutter head and the air knives are sequentially arranged along the first direction, and the cutter head and the air knives synchronously run.
The above slit coating apparatus, wherein the blade head comprises: the cutter head comprises an upper cutter head piece, a lower cutter head piece and a gasket arranged between the upper cutter head piece and the lower cutter head piece.
The slit coating apparatus described above further includes: a lift control system for driving the coating system and/or the gas purge system to move in a vertical direction relative to the pedestal.
In the slit coating apparatus, the base is made of cast iron or marble; the moving plane of the moving control system is made of stainless steel materials; the cutter head is made of stainless steel; the injector is a disposable injector or a corrosion-resistant injector.
In the slit coating apparatus, the air knife includes an upper air blade and a lower air blade; wherein the content of the first and second substances,
the air knife is provided with the second conduit, and a plurality of wind blocking parts are arranged between the upper wind blade and the lower wind blade;
or the air knife is provided with a plurality of second conduits which are connected with the air source.
A method of operating a slot coating apparatus, wherein the slot coating apparatus is based on any one of the above, wherein the method comprises:
step A1: pretreating the FTO glass substrate subjected to laser etching;
step A2: providing a PTAA solution with the concentration of 0.01-1000 mg/ml and the solvent of chlorobenzene, placing the PTAA solution in the injector, driving the FTO glass substrate to move at a constant speed of 0.01-500 mm/s by the movement control system, and controlling the injection rate of the injector to be 0.01-100 ml/min by the injection control system for coating;
step A3: placing the 1.35M MA0.6FA0.4PbI3 perovskite precursor solution into the injector, driving the FTO glass substrate to move at a constant speed of 20mm/s by the movement control system so as to coat, and simultaneously carrying out nitrogen purging on the FTO glass substrate by the gas purging device;
step A4: annealing the FTO glass substrate coated with the perovskite thin film at 50-200 ℃ for 5min under nitrogen atmosphere, wherein the thickness of the thin film is about 50 nm-300 mu m;
step A5: placing 20mg/ml of C60 solution into the injector, and driving the FTO glass substrate to move at a uniform speed of 40mm/s by the movement control system so as to coat on the perovskite thin film;
step A6: the FTO glass substrate is respectively placed at 75 ℃ for annealing for 8min under the nitrogen atmosphere;
step A7: placing a methanol saturated BCP solution into the injector, and driving the FTO glass substrate to move at a constant speed of 40mm/s by the movement control system so as to coat the perovskite thin film;
step A8: and respectively annealing the FTO glass substrate at 75 ℃ for 6min under the nitrogen atmosphere.
Or, a working method of a slot coating apparatus, wherein the slot coating apparatus is based on any one of the above, wherein the working method comprises:
step A1: pretreating the FTO glass substrate subjected to laser etching;
step A2: providing a PTAA solution with the concentration of 3.3mg/mL and chlorobenzene as a solvent, placing the PTAA solution into the injector, driving the FTO glass substrate to move at a constant speed of 20mm/s by the movement control system, and controlling the injection rate of the injector to be 1mL/min by the injection control system so as to coat;
step A3: providing a 2.5M MAPbI3 perovskite precursor solution and a 1.67M FAPbI3 perovskite precursor solution, mixing and diluting the 2.5M MAPbI3 perovskite precursor solution and the 1.67M FAPbI3 perovskite precursor solution to obtain a 1.35M MA0.6FA0.4PbI3 perovskite precursor solution, and adding 1.5 mol percent of CBH and 25 percent of dimethyl sulfoxide into the 1.35M MA0.6FA0.4PbI3 perovskite precursor solution;
step A4: placing the 1.35M MA0.6FA0.4PbI3 perovskite precursor solution into the injector, driving the FTO glass substrate to move at a constant speed of 20mm/s by the movement control system so as to coat, and simultaneously carrying out nitrogen purging on the FTO glass substrate by the gas purging device;
step A5: annealing the FTO glass substrate coated with the perovskite thin film at 120 ℃ for 5min under a nitrogen atmosphere, wherein the thickness of the thin film is about 1 mu m;
step A6: placing 20mg/ml of C60 solution into the injector, and driving the FTO glass substrate to move at a uniform speed of 40mm/s by the movement control system so as to coat on the perovskite thin film;
step A7: the FTO glass substrate is respectively placed at 75 ℃ for annealing for 8min under the nitrogen atmosphere;
step A8: placing a methanol saturated BCP solution into the injector, and driving the FTO glass substrate to move at a constant speed of 40mm/s by the movement control system so as to coat the perovskite thin film;
step A9: and respectively annealing the FTO glass substrate at 75 ℃ for 6min under the nitrogen atmosphere.
In the above method of operating a slit coating apparatus, the step a1 includes:
step A1.1: cleaning the FTO glass substrate subjected to laser etching by using liquid detergent, deionized water, ethanol and acetone;
step A1.2: the laser etched FTO glass substrate was treated with UV-ozone for 30 minutes.
In the working method of the slit coating apparatus, in step a3, 0.83mg/mL of dodecylammonium iodide, 0.27mg/mL of L- α -phosphatidylcholine, 0.14% by volume of MAH2PO2, 1.40mg/mL of p-F-PEAI, and 25% of dimethyl sulfoxide are added to the 2.5M MAPbI3 perovskite precursor solution;
and/or adding 0.83mg/mL of dodecyl ammonium iodide, 0.27mg/mL of L-alpha-phosphatidylcholine, 0.14% by volume of MAH2PO2, 1.40mg/mL of p-F-PEAI and 25% of dimethyl sulfoxide into the 1.67M FAPBI3 perovskite precursor solution.
A method of operating a slot coating apparatus, the method being based on any one of the above, wherein the method comprises:
step B1: pretreating the ITO glass substrate subjected to laser etching;
step B2: PSS solution is provided, the EDOT PSS solution is placed in the injector, the movement control system drives the ITO glass substrate to move at a constant speed of 0.01-500 mm/s, and the injection control system controls the injection speed of the injector to be 0.01-100 ml/min for coating;
step B3: annealing the ITO glass substrate at 140 ℃ for 20 min;
step B4: providing a poly-TPD solution, placing the poly-TPD solution coated with an EDOT PSS layer into an injector, driving the ITO glass substrate to move at a constant speed of 0.01-500 mm/s by the movement control system, and controlling the injection rate of the injector to be 0.01-100 ml/min by the injection control system so as to coat on the EDOT PSS layer;
step B5: annealing the ITO glass substrate at 150 ℃ for 25 min;
step B6: providing a quantum dot solution dispersed in octane, placing the quantum dot solution dispersed in octane into an injector, driving the ITO glass substrate to move at a constant speed of 0.01-500 mm/s by the movement control system, and controlling the injection rate of the injector to be 0.01-100 ml/min by the injection control system for coating;
step B7: and (3) annealing the ITO glass substrate at 150 ℃ for 25 min.
Alternatively, a method of operating a slot coating apparatus, the method being based on any one of the above-described slot coating apparatuses, wherein the method includes:
step B1: pretreating the ITO glass substrate subjected to laser etching;
step B2: PSS solution is provided, the EDOT PSS solution is placed in the injector, the movement control system drives the ITO glass substrate to move at a constant speed of 15mm/s, and the injection control system controls the injection speed of the injector to be 1.5mL/min for coating;
step B3: annealing the ITO glass substrate at 140 ℃ for 20 min;
step B4: providing a poly-TPD solution, placing the poly-TPD solution coated with an EDOT PSS layer into an injector, driving the ITO glass substrate to move at a constant speed of 20mm/s by the movement control system, and controlling the injection rate of the injector to be 2.0mL/min by the injection control system so as to coat on the EDOT PSS layer;
step B5: annealing the ITO glass substrate at 150 ℃ for 25 min;
step B6: providing a quantum dot solution dispersed in octane, placing the quantum dot solution dispersed in octane into the injector, driving the ITO glass substrate to move at a constant speed of 20mm/s by the movement control system, and controlling the injection rate of the injector to be 1.0mL/min by the injection control system for coating;
step B7: and (3) annealing the ITO glass substrate at 150 ℃ for 25 min.
The working method of the slit coating apparatus further includes:
step B8: and depositing TPBi, LiF and Ag on the ITO glass substrate layer by layer through a thermal evaporation system.
Due to the adoption of the technology, compared with the prior art, the invention has the following positive effects:
(1) the invention can blow and dry the solvent in time in the coating process, thereby avoiding solvent agglomeration.
(2) The invention can make the coating solution distribute evenly.
Drawings
FIG. 1 is a schematic front view of a slot coating apparatus of the present invention.
FIG. 2 is a schematic side view of a slot coating apparatus of the present invention.
FIG. 3 is a schematic view of the blade of the slot coating apparatus of the present invention.
FIG. 4a is a schematic view of a first air knife of the slot coating apparatus of the present invention.
FIG. 4b is a schematic view of a first air knife of the slot coating apparatus of the present invention.
FIG. 5a is a schematic view of a second air knife of the slot coating apparatus of the present invention.
FIG. 5b is a schematic view of a second air knife of the slot coating apparatus of the present invention.
In the drawings: 1. a base; 2. a movement control system; 31. a cutter head; 311. an upper blade; 312. a lower blade; 313. a gasket; 32. a first conduit fitting; 33. a first conduit; 34. an injector; 35. an injection control system; 41. an air knife; 411. an air-feeding blade; 412. a downwind blade; 414. a wind shield portion; 42. a second conduit fitting; 43. a second conduit; 5. a lifting control system.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "inside", "outside", "lateral", "vertical", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, and thus, should not be construed as limiting the present invention.
Fig. 1 is a front view, fig. 2 is a side view, fig. 3 is a tool bit, fig. 4a is a first air knife, fig. 4b is a first air knife, fig. 5a is a second air knife, fig. 5b is a second air knife, and fig. 1 to 5b show a slit coating apparatus according to a preferred embodiment, including: a base 1; and the movement control system 2 is used for controlling the coated substrate to move on the base 1 at a constant speed along the first direction.
Preferably, the motion control system 2 is embedded in the base 1.
Preferably, the movement control of the movement control system needs to control the movement rate through setting parameters of the control terminal. The control range of the moving speed is 0-500mm/s, and the error of the moving speed is 0-5 mm/s. Different materials are coated at different coating rates.
Further, as a preferred embodiment, a slit coating apparatus includes: coating system locates the top of base 1, and coating system includes: the syringe comprises a cutter head 31, a first conduit 33 connected with the cutter head 31 through a first conduit connector 32, a syringe 34 connected with the other end of the first conduit 33 opposite to the cutter head 31, and an injection control system 35 for controlling the syringe 34.
Preferably, the cutter head 31 is of a detachable construction.
Preferably, the injection control system 35 controls the injection rate to be 0-20 ml/min. The error of the injection rate is 0-3 ml/min. The injection rates vary from material to material.
Further, as a preferred embodiment, a slit coating apparatus includes: gaseous purge system locates the top of base 1, and gaseous purge system includes: the air knife 41, a second conduit 43 connected with the air knife 41 through a second conduit joint 42, a gas source connected with the other end of the second conduit 43 opposite to the air knife 41, a gas heating device for heating gas, and a meter for controlling the gas purging flow rate.
Further, as a preferred embodiment, in which the cutter head 31 and the air knife 41 are sequentially arranged in the first direction, the cutter head 31 and the air knife 41 operate in synchronization.
Further, as a preferred embodiment, the cutter head 31 includes: an upper blade 311, a lower blade 312, and a spacer 313 provided between the upper blade 311 and the lower blade 312.
Preferably, the thickness of the spacer 313 is 0 to 1 mm. More preferably, the thickness of the spacer 313 is 150 μm.
Further, as a preferred embodiment, the slot coating apparatus further includes: and the lifting control system 5 is used for driving the coating system and/or the gas purging system to move relative to the base 1 along the vertical direction.
Preferably, the left-right error of the lifting control system is +/-1 mm.
Further, as a preferred embodiment, the base 1 is made of cast iron material or marble material; the moving plane of the moving control system 2 is made of stainless steel material; the cutter head 31 is made of stainless steel; the injector 34 is a disposable injector or a corrosion resistant injector.
Further, as a preferred embodiment, the wind knife 41 includes an upwind blade 411 and a downwind blade 412.
Further, as a preferred embodiment, the air knife 41 is provided with a second duct 43, and a plurality of wind blocking portions 414 are provided between the upper wind blade 411 and the lower wind blade 412.
Further, as another preferred embodiment, a plurality of second conduits 43 are provided on the air knife 41, and all of the plurality of second conduits are connected to the air source.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope and the implementation manner of the present invention.
The present invention also has the following embodiments in addition to the above:
in a further embodiment of the present invention, there is also provided a working method of a slit coating apparatus, which is suitable for coating a perovskite solar cell, the working method including:
step A1: pretreating the FTO glass substrate subjected to laser etching;
step A2: providing a PTAA solution with the concentration of 3.3mg/mL and chlorobenzene as a solvent, placing the PTAA solution in an injector, driving an FTO glass substrate to move at a constant speed of 20mm/s by a movement control system, and controlling the injection rate of the injector to be 1mL/min by an injection control system so as to coat;
step A3: providing 2.5M MAPbI3 perovskite precursor solution and 1.67M FAPbI3 perovskite precursor solution, mixing and diluting the 2.5M MAPbI3 perovskite precursor solution and the 1.67M FAPbI3 perovskite precursor solution to obtain 1.35M MA0.6FA0.4PbI3 perovskite precursor solution, and adding 1.5 mol percent of CBH and 25 percent of dimethyl sulfoxide into the 1.35M MA0.6FA0.4PbI3 perovskite precursor solution;
step A4: placing 1.35M MA0.6FA0.4PbI3 perovskite precursor solution into an injector, driving an FTO glass substrate to move at a constant speed of 20mm/s by a movement control system so as to coat, and simultaneously carrying out nitrogen purging on the FTO glass substrate by a gas purging device;
step A5: annealing the FTO glass substrate coated with the perovskite thin film at 120 ℃ for 5min under nitrogen atmosphere, wherein the thickness of the thin film is about 1 mu m;
step A6: placing 20mg/ml of C60 solution into a syringe, and driving an FTO glass substrate to move at a constant speed of 40mm/s by a movement control system so as to coat on the perovskite thin film;
step A7: respectively annealing the FTO glass substrate at 75 ℃ for 8min under the nitrogen atmosphere;
step A8: placing a methanol saturated BCP solution into an injector, and driving an FTO glass substrate to move at a constant speed of 40mm/s by a movement control system so as to coat on the perovskite film;
step A9: and (3) annealing the FTO glass substrates at 75 ℃ for 6min in a nitrogen atmosphere respectively.
In a further embodiment of the present invention, step A1 includes:
step A1.1: cleaning the FTO glass substrate subjected to laser etching by using liquid detergent, deionized water, ethanol and acetone;
step A1.2: the laser etched FTO glass substrate was treated with UV-ozone for 30 minutes.
Preferably, the perovskite solar device preparation is carried out at room temperature in a nitrogen atmosphere glove box with the relative humidity of 25 +/-5%.
In a further embodiment of the invention, in step A3, 0.83mg/mL of dodecylammonium iodide, 0.27mg/mL of L- α -phosphatidylcholine, 0.14% by volume of MAH2PO2, 1.40mg/mL of p-F-PEAI, and 25% dimethyl sulfoxide are added to the 2.5M MAPbI3 perovskite precursor solution.
In a further embodiment of the invention, and/or 0.83mg/mL of dodecylammonium iodide, 0.27mg/mL of L- α -phosphatidylcholine, 0.14% by volume of MAH2PO2, 1.40mg/mL of p-F-PEAI, 25% dimethyl sulfoxide is added to the 1.67M FAPBI3 perovskite precursor solution.
In a further embodiment of the invention, a minimum module is fabricated on the coated FTO glass substrate following the same process as the solar cell, each subunit having a width of 6.5 mm. Laser scribing was performed twice using a laser cutter, and the widths of P2 and P3 were 200 μm and 50 μm, respectively.
In a further embodiment of the invention, a layer of 120nm MgF2 is evaporated on the front surface of the FTO glass substrate to serve as an antireflection layer. Preferably, the evaporation rate is set to 1A/S.
In a further embodiment of the present invention, a Polydimethylsiloxane (PDMS) layer is coated on the surface of the FTO glass substrate as an anti-reflective film.
In a further embodiment of the present invention, there is provided another working method of a slit coating apparatus, which is suitable for coating a perovskite light emitting diode, the working method including:
step B1: pretreating the ITO glass substrate subjected to laser etching;
step B2: PSS solution is provided, the EDOT solution is placed in an injector, a movement control system drives an ITO glass substrate to move at a constant speed of 15mm/s, and an injection control system controls the injection speed of the injector to be 1.5mL/min for coating;
step B3: placing the ITO glass substrate at 140 ℃ for annealing for 20 min;
step B4: providing a poly-TPD solution, placing the poly-TPD solution coated with the EDOT PSS layer in an injector, driving an ITO glass substrate to move at a constant speed of 20mm/s by a movement control system, and controlling the injection rate of the injector to be 2.0mL/min by an injection control system so as to coat on the EDOT PSS layer;
step B5: placing the ITO glass substrate at 150 ℃ and annealing for 25 min;
step B6: providing a quantum dot solution dispersed in octane, placing the quantum dot solution dispersed in octane into an injector, driving an ITO glass substrate to move at a constant speed of 20mm/s by a movement control system, and controlling the injection rate of the injector to be 1.0mL/min by an injection control system for coating;
step B7: and (3) annealing the ITO glass substrate at 150 ℃ for 25 min.
Preferably, the perovskite light emitting diodes are all prepared by coating in a nitrogen atmosphere glove box with a relative humidity of 25 +/-5% at room temperature.
In a further embodiment of the present invention, the method further comprises: step B8: TPBi, LiF and Ag are deposited on the ITO glass substrate layer by layer through a thermal evaporation system.
In a further embodiment of the present invention, step B1 includes:
step B1.1: cleaning the ITO glass substrate subjected to laser etching by using liquid detergent, deionized water, ethanol and isopropanol;
step B1.2: the laser etched ITO glass substrate was treated with UV-ozone for 30 minutes.
In a further embodiment of the present invention, prior to step B1, there is also provided the step of formulating a cesium oleate solution by: 814mg Cs2CO3, 2.5ml OA and 40ml ODE were added to a three-necked flask, vacuum dried for 1h, purged with nitrogen and warmed to 150 ℃ until all the Cs2CO3 powder was dissolved.
In a further embodiment of the present invention, before step B1, there is also provided a step of preparing CsPbBr3 nanocrystals: 30% strength CeBr3 was dissolved in 0.5ml OA at 60 ℃. 0.2mol of PbBr2 and 5ml of ODE were added to a three-necked flask and stirred, the temperature was raised to 120 ℃ and vacuum was applied, nitrogen was introduced, and 0.5ml of 30% CeBr3 oleic acid solution and 0.5ml of OAm were added. After the PbBr2 powder was completely dissolved, the temperature of the reaction system was raised to 185 ℃, and then 0.4ml of CS-OA was injected, and after 1 minute of reaction, the reaction was quenched in an ice-water bath.
In a further embodiment of the present invention, before step B1, there is also provided the step of formulating C6H13NH3X (HAX): 25ml of methanol and 10ml of hexylamine were sequentially added to the round-bottom flask and stirred under ice-water bath conditions. Then, 10ml of hydriodic acid or hydrobromic acid was added dropwise to the mixed solution and stirred for 2 hours. The product was dried in an oven and then stored under an inert atmosphere.
In a further embodiment of the present invention, before step B1, there is also provided the step of a halogen ion exchange reaction: all ion exchange reactions were carried out under ambient conditions. First, 0.4mmol of HAI was dissolved in 15ml of toluene and 0.2ml of DMF. Then 0.2ml of oa and 0.2ml of oam were injected into 5ml of Ce3+ -doped CsPbBr3 nanocrystalline toluene solution. And finally, respectively adding the prepared anion precursor into the nanocrystal solution, and stirring until the anion precursor is balanced.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. A slot coating apparatus, comprising:
a base;
the movement control system is used for controlling the coated substrate to move on the base at a constant speed along a first direction;
a coating system disposed above the base, the coating system comprising: the syringe comprises a cutter head, a first conduit connected with the cutter head through a first conduit joint, a syringe connected with the other end of the first conduit opposite to the cutter head, and an injection control system for controlling the syringe;
a gas purge system disposed above the pedestal, the gas purge system comprising: the air knife, a second conduit connected with the air knife through a second conduit joint, an air source connected with the other end, opposite to the air knife, of the second conduit, a gas heating device used for heating gas, and a meter used for controlling the gas purging flow rate;
the cutter head and the air knives are sequentially arranged along the first direction, and the cutter head and the air knives synchronously run.
2. The slot coating apparatus of claim 1, wherein the blade comprises: the cutter head comprises an upper cutter head piece, a lower cutter head piece and a gasket arranged between the upper cutter head piece and the lower cutter head piece.
3. The slot coating apparatus of claim 1, further comprising: a lift control system for driving the coating system and/or the gas purge system to move in a vertical direction relative to the pedestal.
4. A slot coating apparatus as claimed in claim 1, wherein the base is made of cast iron material or marble material; the moving plane of the moving control system is made of stainless steel materials; the cutter head is made of stainless steel; the injector is a disposable injector or a corrosion-resistant injector.
5. The slot coating apparatus of claim 1, wherein the air knife comprises an upwind blade, a downwind blade; wherein the content of the first and second substances,
the air knife is provided with the second conduit, and a plurality of wind blocking parts are arranged between the upper wind blade and the lower wind blade;
or the air knife is provided with a plurality of second conduits which are connected with the air source.
6. A working method of a slot coating apparatus, characterized in that the slot coating apparatus according to any one of claims 1 to 5, wherein the working method comprises:
step A1: pretreating the FTO glass substrate subjected to laser etching;
step A2: providing a PTAA solution with the concentration of 0.01-1000 mg/ml and the solvent of chlorobenzene, placing the PTAA solution in the injector, driving the FTO glass substrate to move at a constant speed of 0.01-500 mm/s by the movement control system, and controlling the injection rate of the injector to be 0.01-100 ml/min by the injection control system for coating;
step A3: placing the 1.35M MA0.6FA0.4PbI3 perovskite precursor solution into the injector, driving the FTO glass substrate to move at a constant speed of 20mm/s by the movement control system so as to coat, and simultaneously carrying out nitrogen purging on the FTO glass substrate by the gas purging device;
step A4: annealing the FTO glass substrate coated with the perovskite thin film at 50-200 ℃ for 5min under nitrogen atmosphere, wherein the thickness of the thin film is about 50 nm-300 mu m;
step A5: placing 20mg/ml of C60 solution into the injector, and driving the FTO glass substrate to move at a uniform speed of 40mm/s by the movement control system so as to coat on the perovskite thin film;
step A6: the FTO glass substrate is respectively placed at 75 ℃ for annealing for 8min under the nitrogen atmosphere;
step A7: placing a methanol saturated BCP solution into the injector, and driving the FTO glass substrate to move at a constant speed of 40mm/s by the movement control system so as to coat the perovskite thin film;
step A8: and respectively annealing the FTO glass substrate at 75 ℃ for 6min under the nitrogen atmosphere.
7. A working method of a slot coating apparatus, characterized in that the slot coating apparatus according to any one of claims 1 to 5, wherein the working method comprises:
step B1: pretreating the ITO glass substrate subjected to laser etching;
step B2: PSS solution is provided, the EDOT PSS solution is placed in the injector, the movement control system drives the ITO glass substrate to move at a constant speed of 0.01-500 mm/s, and the injection control system controls the injection speed of the injector to be 0.01-100 ml/min for coating;
step B3: annealing the ITO glass substrate at 140 ℃ for 20 min;
step B4: providing a poly-TPD solution, placing the poly-TPD solution coated with an EDOT PSS layer into an injector, driving the ITO glass substrate to move at a constant speed of 0.01-500 mm/s by the movement control system, and controlling the injection rate of the injector to be 0.01-100 ml/min by the injection control system so as to coat on the EDOT PSS layer;
step B5: annealing the ITO glass substrate at 150 ℃ for 25 min;
step B6: providing a quantum dot solution dispersed in octane, placing the quantum dot solution dispersed in octane into an injector, driving the ITO glass substrate to move at a constant speed of 0.01-500 mm/s by the movement control system, and controlling the injection rate of the injector to be 0.01-100 ml/min by the injection control system for coating;
step B7: and (3) annealing the ITO glass substrate at 150 ℃ for 25 min.
8. The working method of the slit coating apparatus as set forth in claim 6, further comprising:
step B8: and depositing TPBi, LiF and Ag on the ITO glass substrate layer by layer through a thermal evaporation system.
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| CN202210030445.9A CN114388699A (en) | 2022-01-12 | 2022-01-12 | Slit coating device and working method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115069496A (en) * | 2022-06-29 | 2022-09-20 | 江西镁淇实业有限公司 | Coating device for textile fabric |
| CN115672660A (en) * | 2022-11-03 | 2023-02-03 | 北京大学长三角光电科学研究院 | Slit coating apparatus and coating method |
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2022
- 2022-01-12 CN CN202210030445.9A patent/CN114388699A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115069496A (en) * | 2022-06-29 | 2022-09-20 | 江西镁淇实业有限公司 | Coating device for textile fabric |
| CN115069496B (en) * | 2022-06-29 | 2023-08-25 | 江西镁淇实业有限公司 | Coating device for textile fabric |
| CN115672660A (en) * | 2022-11-03 | 2023-02-03 | 北京大学长三角光电科学研究院 | Slit coating apparatus and coating method |
| CN115672660B (en) * | 2022-11-03 | 2023-10-13 | 北京大学长三角光电科学研究院 | Slit coating apparatus and coating method |
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