CN114388378A - IGBT full-automatic production line - Google Patents

IGBT full-automatic production line Download PDF

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Publication number
CN114388378A
CN114388378A CN202210017290.5A CN202210017290A CN114388378A CN 114388378 A CN114388378 A CN 114388378A CN 202210017290 A CN202210017290 A CN 202210017290A CN 114388378 A CN114388378 A CN 114388378A
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CN
China
Prior art keywords
welding
production line
assembly
automatic production
detection
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210017290.5A
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Chinese (zh)
Inventor
梁杰
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Saijing Asia Pacific Semiconductor Technology Zhejiang Co ltd
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Saijing Asia Pacific Semiconductor Technology Zhejiang Co ltd
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Application filed by Saijing Asia Pacific Semiconductor Technology Zhejiang Co ltd filed Critical Saijing Asia Pacific Semiconductor Technology Zhejiang Co ltd
Priority to CN202210017290.5A priority Critical patent/CN114388378A/en
Publication of CN114388378A publication Critical patent/CN114388378A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/77—Apparatus for connecting with strap connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/77—Apparatus for connecting with strap connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

An IGBT full-automatic production line comprises a conveyor belt component and a set of processing equipment. The processing equipment comprises at least one primary welding mechanism, at least one first detection sorting mechanism, at least one bonding assembly mechanism, at least one re-welding assembly, at least one second detection sorting mechanism and at least one assembling glue injection mechanism. The initial welding mechanism comprises a soldering terminal mounting machine, a chip mounting machine and a welding furnace. The soldering lug mounting machine and the chip mounting machine are arranged adjacently, so that workpieces are continuously processed by the soldering lug mounting machine and the chip mounting machine. The bonding assembly module is arranged adjacent to the re-welding assembly, so that workpieces are continuously machined by the bonding assembly module and the re-welding assembly. The IGBT full-automatic production line is provided with the adjacent soldering lug mounting machine and the chip mounting machine, can continuously mount soldering lugs and chips, and avoids the problems of low efficiency and high defective products caused by overlarge intervals between adjacent processes.

Description

IGBT full-automatic production line
Technical Field
The invention relates to the technical field of IGBT production equipment, in particular to a full-automatic production line of an IGBT.
Background
The IGBT is a composite full-control voltage-driven power semiconductor device and is widely applied to the fields of alternating current motors, switching power supplies, lighting circuits and the like. Most of equipment used for IGBT production is automated equipment nowadays, and the automation guarantees the completeness and consistency of production, so that the quality of the final product is stable. In an IGBT production line, loading and unloading and product assembly are often completed manually by an operator. Operator variability in the level of operation often results in wide fluctuations in the quality of the product. Meanwhile, the operation steps of operators are inserted between the automation steps, the manual operation steps are often separated from the automation steps, and the same operation is concentrated on the same place, so that the processed semi-finished products need to be transferred to the next processing point after the processing of each processing point is finished, and great inconvenience is brought.
Disclosure of Invention
In view of the above, the present invention provides a full-automatic production line of IGBTs to solve the above problems.
An IGBT full-automatic production line is used for assembling, welding and packaging material sheets and chips. The processing device comprises a conveyor belt component for conveying a material body and a workpiece, and a set of processing equipment sequentially arranged on one side of the conveyor belt component. The processing equipment comprises at least one initial welding mechanism, at least one first detection sorting mechanism, at least one bonding assembly mechanism, at least one re-welding assembly, at least one second detection sorting mechanism and at least one glue filling mechanism which are sequentially arranged. The initial welding mechanism comprises a soldering lug mounting machine, a chip mounting machine and a welding furnace which are sequentially arranged. The soldering terminal mounting machine and the chip mounting machine are arranged adjacently, so that the material sheet and the chip are continuously processed by the soldering terminal mounting machine and the chip mounting machine. The bonding assembly module is arranged adjacent to the re-welding assembly, so that workpieces are continuously machined by the bonding assembly module and the re-welding assembly.
Furthermore, the first detection sorting mechanism and the second detection sorting mechanism respectively comprise an X-ray detection module and a defective product conveyor belt, and the defective product conveyor belt of the first detection sorting mechanism is communicated with the defective product conveyor belt of the second detection sorting mechanism.
Furthermore, the X-ray detection module of the first detection sorting mechanism is a 2DX ray, and the X-ray detection module of the second detection sorting mechanism is a 3DX ray.
Further, the conveyor belt assembly comprises a conveyor belt main body, at least two trays arranged on the conveyor belt main body and used for supporting the workpiece to be processed, and at least one manipulator arranged on one side of the conveyor belt main body and used for transferring the workpiece to be processed.
Further, the bonding assembly mechanism comprises a bonding machine, a DBC testing machine and a DBC assembling machine.
Furthermore, the number of the bonding assembling mechanisms and the number of the module welding furnaces are two, the two bonding assembling mechanisms are symmetrically arranged on two sides of the conveyor belt assembly, the two module welding furnaces are symmetrically arranged on two sides of the conveyor belt assembly, and the bonding assembling mechanisms and the module welding furnaces on the same side are communicated with each other.
Furthermore, the assembling and glue-injecting mechanism comprises an outer frame assembling machine, a module bonding device and a glue-injecting machine.
Furthermore, each detection device is respectively provided with a data collection device to collect the operation data of each detection device, so that problems can be found in time.
Compared with the prior art, the IGBT full-automatic production line provided by the invention is provided with the adjacent soldering lug mounting machine and the chip mounting machine, can continuously mount soldering lugs and chips, avoids the problems of low efficiency and high defective products caused by overlarge interval between adjacent processes, is provided with the adjacent bonding assembly mechanism and the adjacent re-welding assembly, enables the assembled workpieces to be directly welded, ensures that the assembled parts before welding are consistent with the shapes of the assembled parts as soon as possible, and further improves the yield.
Drawings
Fig. 1 is an overall block diagram of an IGBT full-automatic production line according to the present invention.
Detailed Description
Specific examples of the present invention will be described in further detail below. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
As shown in fig. 1, it is a block diagram of an IGBT full-automatic production line provided by the present invention. The IGBT full-automatic production line comprises a conveyor belt assembly 10 and processing equipment 20 which are distributed along the conveyor belt assembly 10 in sequence. It is conceivable that the IGBT full-automatic production line further includes some functional modules, such as a distribution box, a control box, etc., which are well known to those skilled in the art and will not be described herein again.
It should be noted that the material sheet may be a DBC board and a polar plate, and the chip may be an IGBT chip. The DBC plate, the polar plate and the IGBT chip can be assembled into a complete semiconductor module through bonding through the production line.
The distribution of the conveyor belt assembly 10 is affected by the actual site and may be in the form of a straight line or a U-shape. When the floor space is not sufficient, the end of the belt assembly 10 will be bent 180 degrees when approaching a wall, while at other locations the belt assembly 10 will be straight, thereby ensuring that as much of the area of the belt assembly 10 as possible is straight. The conveyor belt assembly 10 includes a conveyor belt body 11, at least one tray 12 placed on the conveyor belt body 11 for accommodating a workpiece to be processed, and at least one robot arm 13 for transferring a position of the workpiece to be processed on the tray 12. The tray 12 is used for containing a semi-finished product in a production process and moves along with the movement of the conveyor belt body 11.
The processing devices 20 are sequentially disposed on one side or both sides of the conveyor belt assembly 10, respectively. It should be noted that, because the processing time of different processing devices 20 is different, a plurality of processing machines can be equipped at a link with a slower processing speed according to the actual speed, and the processing can be performed simultaneously, thereby ensuring the synchronization rate during the processing. The processing equipment 20 comprises at least one initial welding mechanism 21, at least one first detection sorting mechanism 22, at least one bonding assembly mechanism 23, at least one re-welding assembly 24, at least one second detection sorting mechanism 25 and at least one glue filling and assembling mechanism 26 which are sequentially arranged on one side of the conveyor belt assembly 10. Just weld mechanism 21 and including a soldering lug subsides installation 211, a chip subsides installation 212 that set gradually to and a welding stove 213, soldering lug subsides installation 211 accomplishes directly deliver to the work piece after pasting the dress the processing mouth of chip subsides installation 212, avoided the work piece to get rid of at long-time transportation in-process paster pine and lead to the product to scrap, also improved production efficiency simultaneously. First detection sorting mechanism 22 with second detection sorting mechanism 25 has adopted the X ray respectively to detect, wherein, first detection sorting mechanism 22 has adopted 2Dx-ray, second detection sorting mechanism 25 adopts 3 Dx-ray. The 2D ray is used for detecting the size of the inner cavity of the product after the first welding, so that whether the product is qualified or not is judged, the detection precision of the 3D ray is higher, and the quality of the product is guaranteed. When the first detection sorting mechanism 22 and the second detection sorting mechanism 25 are used for detection, the manipulator 13 transfers the workpieces to be processed in the tray 12 to the corresponding first detection sorting mechanism 22 or the second detection sorting mechanism 25, then the first detection sorting mechanism 22 and the second detection sorting mechanism 25 respectively detect the corresponding workpieces, when the detection result is qualified, the manipulator 13 transfers the workpieces into the tray 12 again, and the workpieces enter the next processing link along with the operation of the conveyor belt assembly 10. When the detection result is not qualified, the robot arm 13 moves the corresponding workpiece out of the conveyor belt assembly 10. A defect conveyer may be additionally provided at a side of the conveyer assembly 10 so that the robot 13 can transfer the detected defective work piece to the defect conveyer to be transported to a proper place. The bonding assembly mechanism 23 includes a bonding machine 231, a DBC tester 232, and a DBC assembly machine 233. The multi-weld assembly 12 includes a modular welding furnace. The workpieces processed by the bonding assembly mechanism 23 are directly conveyed to the rewelding assembly 24 by the manipulator 13, are welded, and are transferred to the tray 12 by the manipulator 13 after being processed, and are waiting for detection and sorting. The assembly and glue-injection mechanism 26 includes at least one outer frame assembling machine 261, at least one module bonding device 262, and at least one glue-injection machine 263. According to the processing speeds of different devices, the number of devices can be increased to balance the processing speed of each processing step, and the waiting time of each processing device 20 caused by different stepping speeds is reduced. The data collection device is connected to the control module of each of the processing devices 20, and can read information such as the operation state of each device. By referring to the collected information, the repairman can quickly perform the overhaul of the equipment.
Compared with the prior art, the IGBT full-automatic production line provided by the invention is provided with the adjacent soldering lug mounting machine 211 and the chip mounting machine 212, can continuously mount soldering lugs and chips, avoids the problems of low efficiency and high defective products caused by overlarge interval between adjacent processes, and simultaneously ensures that the assembled workpieces are directly welded because the IGBT full-automatic production line is provided with the adjacent bonding assembling mechanism 23 and the adjacent re-welding assembly 24, thereby ensuring that the assembled parts before welding are consistent with the shapes of the assembled parts as soon as possible, and further improving the yield.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.

Claims (8)

1. The utility model provides a full automatic production line of IGBT which is used for carrying out assembly welding and encapsulation to tablet and chip which characterized in that: the IGBT full-automatic production line comprises a conveyor belt assembly used for conveying a material body and a workpiece, and a set of processing equipment which is arranged on one side of the conveyor belt component in sequence, wherein the processing equipment comprises at least one initial welding mechanism, at least one first detection sorting mechanism, at least one bonding assembly mechanism, at least one re-welding component and at least one second detection sorting mechanism which are arranged in sequence, and at least one glue filling mechanism, the initial welding mechanism comprises a soldering terminal mounting machine and a chip mounting machine which are arranged in sequence, and a soldering furnace, said soldering terminal mounter being disposed adjacent to said chip mounter so that said material sheet and chip are successively processed by said soldering terminal mounter and said chip mounter, the bonding assembly module is arranged adjacent to the re-welding assembly, so that workpieces are continuously machined by the bonding assembly module and the re-welding assembly.
2. The IGBT full-automatic production line of claim 1, characterized in that: the first detection sorting mechanism and the second detection sorting mechanism respectively comprise an X-ray detection module and a defective product conveying belt, and the defective product conveying belt of the first detection sorting mechanism is communicated with the defective product conveying belt of the second detection sorting mechanism.
3. The IGBT full-automatic production line of claim 2, characterized in that: the X-ray detection module of the first detection and sorting mechanism is a 2DX ray, and the X-ray detection module of the second detection and sorting mechanism is a 3DX ray.
4. The IGBT full-automatic production line of claim 1, characterized in that: the conveyor belt assembly comprises a conveyor belt main body, at least two trays which are placed on the conveyor belt main body and used for supporting a workpiece to be processed, and at least one manipulator which is arranged on one side of the conveyor belt main body and used for transferring the workpiece to be processed.
5. The IGBT full-automatic production line of claim 1, characterized in that: the bonding assembly mechanism comprises a bonding machine, a DBC testing machine and a DBC assembling machine.
6. The IGBT full-automatic production line of claim 1, characterized in that: the number of the bonding assembling mechanisms and the number of the module welding furnaces are two, the two bonding assembling mechanisms are symmetrically arranged on two sides of the conveyor belt component, the two module welding furnaces are symmetrically arranged on two sides of the conveyor belt component, and the bonding assembling mechanism and the module welding furnace on the same side are communicated with each other.
7. The IGBT full-automatic production line of claim 1, characterized in that: the assembling and glue injecting mechanism comprises an outer frame assembling machine, a module bonding device and a glue injecting machine.
8. The IGBT full-automatic production line of claim 1, characterized in that: each detection device is respectively provided with a data collection device to collect the operation data of each detection device, so that problems can be found in time.
CN202210017290.5A 2022-01-07 2022-01-07 IGBT full-automatic production line Pending CN114388378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210017290.5A CN114388378A (en) 2022-01-07 2022-01-07 IGBT full-automatic production line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210017290.5A CN114388378A (en) 2022-01-07 2022-01-07 IGBT full-automatic production line

Publications (1)

Publication Number Publication Date
CN114388378A true CN114388378A (en) 2022-04-22

Family

ID=81200564

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210017290.5A Pending CN114388378A (en) 2022-01-07 2022-01-07 IGBT full-automatic production line

Country Status (1)

Country Link
CN (1) CN114388378A (en)

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