CN114387922B - Driving chip - Google Patents
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- CN114387922B CN114387922B CN202210176908.2A CN202210176908A CN114387922B CN 114387922 B CN114387922 B CN 114387922B CN 202210176908 A CN202210176908 A CN 202210176908A CN 114387922 B CN114387922 B CN 114387922B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a driving chip. The invention comprises the following steps: the MIPI processing sub-chip is used for receiving the image data, generating parallel digital signals according to the image data and sending the parallel digital signals to the driving sub-chip, wherein the parallel digital signals at least comprise the image signals corresponding to the image data and driving signals used for driving a display device connected with the driving chip; and the driving sub-chip is connected with the MIPI sub-chip and used for driving the display device connected with the driving sub-chip, receiving the parallel digital signals, processing the image data, and sending the processed image data to the display device, wherein the processed image data at least comprises color matching and position information of pixel points in a target image corresponding to the image data. By the method and the device, the problems of low screen definition rate and high manufacturing cost of the virtual reality equipment in the related technology are solved.
Description
Technical Field
The invention relates to the field of chips, in particular to a driving chip.
Background
In the related art, the silicon-based OLED is a micro OLED display technology, is an emerging branch of the display industry, and is considered as a next-generation micro display technology suitable for the near-eye display industry. The silicon-based OLED device structure comprises a driving chip backboard and an OLED display module device. The driving chip back plate is manufactured by a standard CMOS process, encapsulation processing is not needed, and high-reflection metal is usually manufactured in top metal of a CMOS circuit and is used as an anode of an OLED device. The OLED display device portion typically includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, a translucent top electrode. And manufacturing a thin film packaging layer on the top electrode for blocking water and oxygen, spin-coating a transparent adhesive layer, and attaching glass to protect the strength of the device. The existing silicon-based OLED driving chip is usually designed and realized by adopting a high-voltage process of more than 100nm, but the existing process selection and structure cannot well support the requirements of high resolution, low power consumption and miniaturization. Another common problem with silicon-based OLED devices is that the yield is low, and current driver chip backplanes cannot be tested at the chip level because they are not encapsulated, and can generally only be tested at the final finished OLED device level. Any one of the driving chip back plate or the OLED display module device is in a problem, so that the whole OLED device is scrapped.
In view of the above problems in the related art, no effective solution has been proposed so far.
Disclosure of Invention
The invention mainly aims to provide a driving chip to solve the problems of low screen definition and high manufacturing cost of virtual reality equipment in the related technology.
In order to achieve the above object, according to an aspect of the present invention, there is provided a driving chip. The invention comprises the following steps: the MIPI processing sub-chip is used for receiving the image data, generating parallel digital signals according to the image data and sending the parallel digital signals to the driving sub-chip, wherein the parallel digital signals at least comprise the image signals corresponding to the image data and driving signals used for driving a display device connected with the driving chip; and the driving sub-chip is connected with the MIPI sub-chip and used for driving the display device connected with the driving sub-chip, receiving the parallel digital signals, processing the image data, and sending the processed image data to the display device, wherein the processed image data at least comprises color matching and position information of pixel points in a target image corresponding to the image data.
Further, the driving chiplet includes: a digital signal interface for receiving the parallel digital signal.
Further, the driving sub-chip further includes: and the control interface is used for sending a target configuration file corresponding to the digital parallel signal to the digital signal interface according to the parallel digital signal, sending a first processing command to the pixel array according to the parallel digital signal, and sending a second processing command to the row-column drive, wherein the target configuration file is used for configuring the digital signal interface to receive the parallel digital signal.
Further, the driving sub-chip further includes: and the pixel array module is used for determining color matching corresponding to each pixel point contained in the target image according to the first processing command.
Further, the driving sub-chip further includes: and the row and column driving module is used for determining the position information of each pixel point contained in the target image according to the second processing command, wherein the position information at least comprises row and column information corresponding to the pixel point.
Further, comprising: and the power input module is used for connecting a power supply to the driving chip.
In order to achieve the above object, according to another aspect of the present application, there is provided a virtual reality device, including a driving chip of any one of the above; and the display device is used for receiving the image data sent by the driving chip and displaying the target image corresponding to the image data.
The invention adopts the following steps: the MIPI processing sub-chip is used for receiving the image data, generating parallel digital signals according to the image data and sending the parallel digital signals to the driving sub-chip, wherein the parallel digital signals at least comprise the image signals corresponding to the image data and driving signals used for driving a display device connected with the driving chip; the driving sub-chip is connected with the MIPI sub-chip and used for driving the display device connected with the driving sub-chip and receiving parallel digital signals, the image data are processed, the processed image data are sent to the display device, wherein the processed image data at least comprise color matching and position information of pixel points in a target image corresponding to the image data, the problems that in the related technology, the screen definition rate of virtual reality equipment is low, the manufacturing cost is high are solved, the yield of the chip is improved, and the production cost is reduced are solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation of the invention. In the drawings:
fig. 1 is a first schematic structural diagram of a driver chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a driving chip according to an embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged as appropriate in order to facilitate the embodiments of the invention described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
According to an embodiment of the present invention, there is provided a driving chip.
Fig. 1 is a first schematic structural diagram of a driving chip according to an embodiment of the present invention. As shown in fig. 1, the invention comprises the following steps:
specifically, the MIPI processing sub-chip is configured to receive image data, generate a parallel digital signal according to the image data, and send the parallel digital signal to the driving sub-chip, where the parallel digital signal at least includes an image signal corresponding to the image data and a driving signal for driving a display device connected to the driving sub-chip.
In the above, the MIPI is a mobile industry processor interface, and is an open standard and a specification established for a mobile application processor initiated by the MIPI alliance. In the prior art, the display resolution reaches 4Kx4K, and even higher resolution and refresh rate can reach better visual effect, so that the application adopts popular MIPI interfaces to provide enough bandwidth. The MIPI processing sub-chip is a high-speed signal processing chip, supports the processing of image contents with the resolution of 4Kx4K,120Hz and above, has an advanced design process and is low in power consumption. The MIPI processing sub-chip generates digital parallel signals from the received image data and sends the digital parallel signals to the driving sub-chip.
A driver chip in this application includes a MIPI chiplet and a driver chiplet, through encapsulating the MIPI interface into single IC alone, has reached and can carry out the test of chip level and virtual reality equipment support high resolution image, low-power consumption, miniaturized effect.
Specifically, the driving sub-chip is connected with the MIPI sub-chip and used for driving a display device connected with the driving sub-chip, receiving parallel digital signals, processing image data, and sending the processed image data to the display device, wherein the processed image data at least includes color matching and position information of pixel points in a target image corresponding to the image data.
In the above-described manner, the driver chiplet supports low-speed parallel digital signal input, processes image data, and transmits the processed image data to the display device.
In an alternative example, the driving chiplet includes: a digital signal interface for receiving the parallel digital signals.
In the prior art, the driving chip usually employs a digital image interface, and the driving sub-chip in this application employs a digital signal interface for receiving parallel digital signals.
In an alternative embodiment, the driving sub-chip further comprises: and the control interface is used for sending a target configuration file corresponding to the digital parallel signal to the digital signal interface according to the parallel digital signal, sending a first processing command to the pixel array according to the parallel digital signal and sending a second processing command to the row-column drive, wherein the target configuration file is used for configuring the digital signal interface to receive the parallel digital signal.
In the above, the parallel digital signals processed by the driving chiplets are different, the control interface needs to send a configuration file to the digital signal interface, send a first processing command to the pixel array, and send a second processing command to the row-column driver, so that the problem of difference in the parallel digital signals is solved.
In an alternative embodiment, the driving sub-chip further comprises: and the pixel array module is used for determining color matching corresponding to each pixel point contained in the target image according to the first processing command.
The pixel array module is configured to control a permutation and combination manner of three sub-pixel points, red, green and blue (RGB), for example, the permutation and combination of the pixel points may be RRR, GGG, BBB or may also be RRG, GGB, BBR, and according to a received first processing command from the control interface, the permutation and combination of the pixel points are performed to determine a color matching corresponding to each pixel point included in the image.
In an alternative embodiment, the driving sub-chip further comprises: and the row and column driving module is used for determining the position information of each pixel point contained in the target image according to the second processing command, wherein the position information at least comprises row and column information corresponding to the pixel point.
In the above, the row-column driving module is configured to determine position information of the pixel point in the image, for example, position information of the pixel point in the row and the column.
In an alternative example, comprising: and the power input module is used for connecting a power supply to the driving chip.
The power input module is used for connecting a power supply to the driving chip and has a charging function.
In another optional example provided by the present application, as shown in fig. 2, fig. 2 is a schematic structural diagram of a driver chip according to an embodiment of the present invention, where the MIPI processing sub-chip sends a parallel digital signal to the driver sub-chip, the driver sub-chip includes a digital signal interface, a control interface, a pixel array module, a row-column driver module, and a power input module, the digital signal interface receives the parallel digital signal and receives a target configuration file corresponding to the digital parallel signal from the control interface, the pixel array module receives a first processing command from the control interface to determine a color matching corresponding to each pixel point included in a target image, the row-column driver module receives a second processing command from the control interface to determine position information of each pixel point included in the target image, and the power input module is used for accessing a power supply for the driver chip.
The driving chip provided by the embodiment of the invention is used for receiving image data, generating parallel digital signals according to the image data and sending the parallel digital signals to the driving sub-chip through the MIPI processing sub-chip, wherein the parallel digital signals at least comprise the image signals corresponding to the image data and driving signals for driving a display device connected with the driving chip; the driving sub-chip is connected with the MIPI sub-chip and used for driving the display device connected with the driving sub-chip and receiving parallel digital signals, the image data are processed, the processed image data are sent to the display device, wherein the processed image data at least comprise color matching and position information of pixel points in a target image corresponding to the image data, the problems that in the related technology, the screen definition rate of virtual reality equipment is low, the manufacturing cost is high are solved, the yield of the chip is improved, and the production cost is reduced are solved.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The above are merely examples of the present invention, and are not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (7)
1. A driver chip, comprising:
the MIPI processing sub-chip is used for receiving image data, generating parallel digital signals according to the image data and sending the parallel digital signals to the driving sub-chip, wherein the parallel digital signals at least comprise image signals corresponding to the image data and driving signals used for driving a display device connected with the driving chip;
and the driving sub-chip is connected with the MIPI processing sub-chip and used for driving the display device connected with the driving sub-chip, receiving the parallel digital signals, processing the image data and sending the processed image data to the display device, wherein the processed image data at least comprises color matching and position information of pixel points in a target image corresponding to the image data.
2. The driver chip of claim 1, wherein the driver chiplet comprises:
a digital signal interface for receiving the parallel digital signal.
3. The driver chip of claim 2, wherein the driver chiplet further comprises:
and the control interface is used for sending a target configuration file corresponding to the parallel digital signal to the digital signal interface according to the parallel digital signal, sending a first processing command to the pixel array according to the parallel digital signal, and sending a second processing command to the row-column driver, wherein the target configuration file is used for configuring the digital signal interface to receive the parallel digital signal.
4. The driver chip of claim 3, wherein the driver chiplet further comprises:
and the pixel array module is used for determining color matching corresponding to each pixel point contained in the target image according to the first processing command.
5. The driver chip of claim 3, wherein the driver chiplet further comprises:
and the row and column driving module is used for determining the position information of each pixel point contained in the target image according to the second processing command, wherein the position information at least comprises row and column information corresponding to the pixel point.
6. The driver chip of claim 1, comprising:
and the power input module is used for connecting a power supply to the driving chip.
7. A virtual reality device, comprising:
a driver chip as claimed in any one of claims 1 to 5;
and the display device is used for receiving the image data sent by the driving chip and displaying the target image corresponding to the image data.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106205454A (en) * | 2016-07-06 | 2016-12-07 | 昀光微电子(上海)有限公司 | A kind of microdisplay on silicon module |
CN107403601A (en) * | 2017-09-09 | 2017-11-28 | 深圳吉迪思电子科技有限公司 | A kind of display driver chip and terminal device |
CN112102770A (en) * | 2020-11-03 | 2020-12-18 | 上海视涯技术有限公司 | Drive chip, display screen and display device |
CN113409719A (en) * | 2021-08-19 | 2021-09-17 | 南京芯视元电子有限公司 | Video source display method, system, micro display chip and storage medium |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004233743A (en) * | 2003-01-31 | 2004-08-19 | Renesas Technology Corp | Display drive control device and electronic device equipped with display device |
CN104240659B (en) * | 2014-08-21 | 2016-08-24 | 武汉精测电子技术股份有限公司 | The method and apparatus realizing COMMAND pattern MIPI signal by bridging chip |
CN105208312A (en) * | 2015-09-17 | 2015-12-30 | 武汉精测电子技术股份有限公司 | MIPI signal generation method and device supporting compression mode |
KR102549463B1 (en) * | 2016-08-30 | 2023-06-30 | 삼성전자주식회사 | Method for Processing Image and the Electronic Device supporting the same |
CN206431607U (en) * | 2017-01-11 | 2017-08-22 | 四川创一智慧科技有限公司 | A kind of LCD drive circuit systems |
KR102508954B1 (en) * | 2017-12-18 | 2023-03-14 | 삼성디스플레이 주식회사 | Display system and control method thereof |
CN108446089B (en) * | 2018-03-22 | 2021-01-26 | 京东方科技集团股份有限公司 | Data display method and device and display |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106205454A (en) * | 2016-07-06 | 2016-12-07 | 昀光微电子(上海)有限公司 | A kind of microdisplay on silicon module |
CN107403601A (en) * | 2017-09-09 | 2017-11-28 | 深圳吉迪思电子科技有限公司 | A kind of display driver chip and terminal device |
CN112102770A (en) * | 2020-11-03 | 2020-12-18 | 上海视涯技术有限公司 | Drive chip, display screen and display device |
CN113409719A (en) * | 2021-08-19 | 2021-09-17 | 南京芯视元电子有限公司 | Video source display method, system, micro display chip and storage medium |
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