CN114386554A - Chip-free terahertz label and preparation method thereof - Google Patents

Chip-free terahertz label and preparation method thereof Download PDF

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CN114386554A
CN114386554A CN202111538965.2A CN202111538965A CN114386554A CN 114386554 A CN114386554 A CN 114386554A CN 202111538965 A CN202111538965 A CN 202111538965A CN 114386554 A CN114386554 A CN 114386554A
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terahertz
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刘文权
鲁叶龙
张锐
佘荣斌
谷孟阳
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Shenzhen Institute of Advanced Technology of CAS
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Abstract

The invention relates to a chipless terahertz label and a preparation method thereof. The label layer has a pattern structure for coding, which is disposed on the bottom of the dielectric layer on the label layer and can be prepared by printing or transfer embedding or the like. The terahertz label can realize three-dimensional coding, has high label capacity and low label manufacturing cost, is easy to conform to a product, has high safety because identification information directly comes from an object, and is favorable for large-scale production.

Description

Chip-free terahertz label and preparation method thereof
Technical Field
The invention relates to the technical field of product labels for recording product information, in particular to a chip-free terahertz label and a preparation method thereof.
Background
The product label is the main carrier for recording product information. Based on the product label technology, people can realize the identification of product authenticity and the tracing of product quality so as to ensure and promote the improvement of product quality and the safety of consumption. At present, product labels frequently used in the market mainly have the forms of bar codes, magnetic stripes, two-dimensional codes, radio frequency identification electronic tags (RFID) and the like, and most of the product labels record product information in the modes of direct description, coding, inquiry through network communication means and the like. However, as product labels become more widely used, the product labels of these technical lines are inherently limited in security and susceptible to counterfeiting, thereby exposing the disadvantage of difficulty for manufacturers and consumers to further maintain rights. Particularly, in recent years, with the related label technology being subjected to the challenge of product counterfeiting, people have an increasing concern on product quality safety, so that the research and development of an effective and reliable novel product label technology has an important application meaning for guaranteeing the product quality safety.
With the development of terahertz scientific technology, terahertz spectrum and imaging technology are increasingly known. The terahertz wave has the advantages of capability of penetrating most nonpolar materials, easiness in realizing rapid nondestructive testing, spectral fingerprint property, rich information and the like. The tag based on the terahertz waves can be embedded under the non-transparent surface like a radio frequency identification electronic tag (RFID) and can be read and identified like visible light imaging, so that the tag is easy to realize high capacity and high safety, and has wide application prospects in product identification and safety.
The terahertz label identification technology is mainly divided into a terahertz chip label and a terahertz chipless label. The terahertz chip tag is similar to radio frequency identification technology (RFID), and can identify a specific target and read and write related data by terahertz waves. However, such terahertz tags require chip integration of an antenna array and wireless communication of a reader, which increases system complexity and cost of the tags. The terahertz chipless tag is similar to an optically visible bar code or two-dimensional code, a one-dimensional or two-dimensional photon structure or a planar bar code structure is adopted to design the tag, and the encoding and reading of the tag are realized according to transmitted or reflected terahertz frequency spectrum information. However, such chipless tags are based on one-dimensional or two-dimensional, and do not fully utilize the spatial information of the tags themselves, so that the information capacity is relatively limited. Moreover, the above labels are mainly prepared or attached on a rigid substrate, and for most products with non-planar structures, it is difficult to achieve good production conformality with the goods.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a chip-free terahertz label, which realizes three-dimensional coding by utilizing terahertz spectrum information of a flexible dielectric medium and a multilayer patterned structure thereof, thereby realizing a product label which is low in cost, beneficial to large-scale production, high in capacity and easy to produce and prepare in a manner of conforming to the shape of a commodity.
Specifically, the terahertz tag is a chipless tag and has a multilayer structure, and comprises a dielectric layer and a tag layer which are arranged in an overlapped mode from top to bottom, wherein the dielectric constant of the dielectric layer is different from that of the tag layer. The label layer has a pattern structure for encoding, which is provided on the bottom of the dielectric layer on top of it. And, the dielectric layer and the label layer are made of a flexible material.
The pattern structure is one or more combinations of bar codes, two-dimensional codes or custom patterns.
Preferably, the material of the dielectric layer is paper, plastic film or other dielectric materials; the material of the label layer is common printing material for printing, spraying, hot stamping and the like by a printer (including but not limited to a laser printer, an ink-jet printer, a label printer and the like).
Further, the pattern structure of the label layer is embedded at the bottom of the dielectric layer arranged on the label layer. Alternatively, on a projection section along the up-down direction, the positions of the pattern structures of each of the label layers on the projection section do not overlap each other.
Dimensionally, according to the preparation method of the terahertz label, the thickness of the dielectric layer is 0.1-0.5mm, preferably 0.1-0.2 mm; the thickness of the label layer is 0.005-0.05mm, preferably 0.02 mm.
Meanwhile, the invention also provides two preparation methods of the terahertz label. Wherein the printing method comprises the following steps,
step 1, determining the pattern structure of the terahertz label, the number of layers of the dielectric layer and the label layer and the thickness parameter of each layer according to requirements;
step 2, printing the label layer pattern structure determined in the step 1 on the surface of the dielectric layer substrate by one or a combination of ink-jet printing, spraying and hot stamping; wherein the thickness of the dielectric layer substrate and the thickness of the pattern structure satisfy the thickness parameter in the step 1;
and 3, laminating the dielectric layer substrate printed with the pattern structure.
The preparation method of the terahertz label with the label layer embedded in the dielectric layer comprises the following steps,
step 1, determining the pattern structure of the terahertz label, the number of layers of the dielectric layer and the label layer and the thickness parameter of each layer according to requirements;
step 2, pre-embedding the pattern structure on a dielectric layer substrate;
and 3, laminating and forming the dielectric layer substrate.
Preferably, the step 2 is to transfer the pattern structure to an adhesive tape, and then pre-embed the adhesive tape with the pattern structure transferred to the dielectric substrate. Specifically, the transferring the pattern structure onto the adhesive tape may include the steps of:
step 21, printing the pattern structure on the surface of the paper by using ink-jet printing;
and 22, pasting the pattern structure surface of the paper on an ultrathin transparent adhesive tape, and eluting the paper on the adhesive tape by using water to transfer the pattern structure to the adhesive tape.
Compared with the prior art, the technical scheme of the invention has the following advantages. 1) The terahertz label is coded information formed by flexible multilayer dielectric materials and label patterns, and the data structure of the terahertz label is a three-dimensional structure, so that the terahertz label is high in label capacity, low in label manufacturing cost, easy to conform to products, and more suitable for nondestructive testing methods of most products; 2) the device can be directly embedded or printed on a marked object in a similar way to an optical bar code instead of a label attached to the object, identification information is directly from the object itself instead of from the label placed on the object, and therefore the label is high in safety; 3) the pattern information of each layer of dielectric material can be printed or embedded on low-cost plastic film/paper or inside the material, and the code of the pattern can be compatible with the current bar code, two-dimensional code or custom pattern manufacture, so the label has strong universality; 4) each dielectric pattern can be made by ink jet printing, spraying, embedding or any other process, facilitating mass production.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a flexible terahertz tag according to the invention;
FIG. 2 is a schematic diagram of signal transmission of a terahertz tag;
FIG. 3 is a schematic diagram of a terahertz label signal encoding principle;
fig. 4 is a schematic diagram of a data structure of terahertz tag information;
FIG. 5 is a flow chart of terahertz tag readout and identification;
FIG. 6 is a schematic diagram of terahertz tag encoding in one embodiment;
FIG. 7 is an annotated terahertz sample signal waveform;
FIG. 8 is a diagram of a ResNet34 network training process;
fig. 9 shows an automatic identification result of the terahertz tag.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example 1 terahertz Label
Referring to the attached drawing 1 of the specification, the structure of the chipless terahertz label is schematically shown. According to the invention, terahertz three-dimensional coding information is formed by utilizing flexible multilayer dielectric material patterns, so that conformal chip-free terahertz tags are realized. In particular, due to the use of flexible dielectric materials, the tag can be embedded or printed directly on the marked object in a similar manner to an optical barcode, rather than in a tag attached to the object, which allows the information to be identified to come directly from the object itself rather than from a tag placed on the object. The pattern information of each layer of dielectric material can be printed on or in the dielectric material, and the usable dielectric material can be, for example, low-cost plastic film, paper or other dielectric materials, so that the cost of the tag can be greatly reduced. As to the encoding of the pattern, for example, the encoding may be performed in a barcode-based encoding manner as shown in fig. 1(a), or in a two-dimensional code-based encoding manner as shown in fig. 1(b), or in a custom pattern as shown in fig. 1 (c). Of course, other patterned encoding methods may be adopted, and this embodiment is not limited thereto. In addition, besides a single coding mode, two or more coding modes can be selected and combined according to a certain mode to obtain a label which is more flexible and has information capacity which can meet application requirements more easily. Based on the above description of the pattern encoding method, in the present embodiment, each layer of pattern is generated by distributing black and white pixels according to different rules in a planar space. Each layer of label pattern represents a binarized "1" with dots or some other shape, and a "0" where there is no dot or specific shape pattern. The arrangement and shape between them represents the information and meaning represented by the pattern. The information included in the terahertz label can be used for recombining the information expressed by the label patterns of each layer in a certain combination mode, so that the terahertz label is easy to expand. Each layer of pattern can be made by ink-jet printing, spraying, embedding or any other process, facilitating mass production.
Referring to the attached fig. 2 of the specification, a terahertz tag made of four layers of dielectric materials is taken as an example to illustrate the basic principle of the tag. Each position on the terahertz label region can be used as a point position for recording information, and the information of each position can be obtained by a reflection signal of the multilayer label at the position on the terahertz wave. As shown in fig. 2(a), when a terahertz wave as a terahertz interrogation is incident on a certain position of a multilayer terahertz tag, the chemical properties or the structures of the interfaces of the layers are different, so that the refractive index and the dielectric property are different, and a terahertz wave reflection phenomenon is generated at the interfaces of the layers. The reflection situation depends on the electromagnetic properties of the interacting medium. The terahertz label signal can be encoded by collecting the terahertz pulse reflection signal in the time domain through the terahertz detector. Taking a four-layer structure as an example, a patterned label is printed or embedded on the lower surface of each dielectric layer, and different structures of the label correspond to different transmission processes of terahertz waves in the label, so that the terahertz waves can be sequentially encoded. As shown in fig. 2(b), when a terahertz pulse is incident on the tag, a reflected pulse signal is generated on the first upper surface, a part of the terahertz wave penetrates through the lower surface to generate a reflected pulse signal, and so on, a new reflected pulse signal is generated whenever the terahertz wave meets the interface. Similar to a one-dimensional photonic crystal, when the terahertz label is formed by alternately laminating two materials, namely a dielectric medium and a label layer, with different dielectric constants, a proper time window is selected, and the binary coding of '0' and '1' of the terahertz label is determined by utilizing the characteristic that the echo reflected at the label is stronger than the echo at the non-label. In fig. 2(b), the terahertz pulse signal returned by the upper surface of the first layer of material is E1, the terahertz pulse signal returned by the lower surface label pattern layer of the first layer of material is E2, the terahertz pulse signal returned by the lower surface label pattern layer of the second layer of material is E3, the terahertz pulse signal returned by the lower surface label pattern layer of the third layer of material is E4, and the terahertz pulse signal returned by the lower surface label pattern layer of the fourth layer of material is E5. Then, a signal E (t) of the terahertz wave encoded by the terahertz tag is the sum of E1, E2, E3, E4, and E5.
Referring to the specification, fig. 3 shows an example of binary encoding in fig. 3 (a). The patterns of the label layer are embedded into the lower surfaces of the four dielectric material layers from top to bottom, the cross section view angle parallel to the paper surface is taken as an example, the pattern is arranged on the right side of the label layer on the lower surface of the first dielectric material layer, and a first layer label positioned on the right side is formed; the lower surface label layer of the second dielectric material layer is provided with a pattern at a position slightly to the right of the middle, a second layer label positioned at the right side of the middle is formed, and the second layer label is positioned at the left side of the first layer label in the left-right direction; the lower surface label layer of the third dielectric material layer is provided with a pattern at a position slightly to the left of the middle, and a third layer label positioned at the left of the middle is formed, and the third layer label is positioned at the left of the second layer label in the left-right direction; the label layer on the lower surface of the fourth dielectric material layer is patterned at the left side to form a fourth layer "label" located at the leftmost side. Since the reflected signal at the "label" position is different from that at the non-label position, binary encoding of "0" and "1" can be presented, as shown in fig. 3(a) top left corner.
As described above, when a terahertz pulse is incident on the terahertz surface, the detected terahertz wave is composed of a series of pulses reflected from the interfaces of the layers of the label. In the terahertz reflection mode, the relationship between the depth of each label layer and the terahertz echo time-of-flight difference thereof is estimated by the following formula:
Figure BDA0003413760960000071
d represents the depth of each label layer, delta t is the flight time difference of the terahertz echo between the upper surface and the lower surface or between the interfaces of each layer, c is the speed of light, nsampleDenotes the refractive index of the dielectric material, and θ is the incident angle for detecting terahertz waves. According to the relation, the corresponding terahertz reflection echo can be subjected to peak searching by using the time window determined by the label depth, if a specific reflection peak exists, the peak is set to be 1, and if the specific reflection peak does not exist, the peak is set to be 0.
The terahertz spectrum data set used for expressing terahertz label information can be obtained by matching a terahertz imaging system with two-dimensional space scanning of a terahertz label on the basis of measuring a reflected terahertz signal. Fig. 3(b) schematically shows the situation that different label layer materials are provided at different positions in the scanning direction, and fig. 3(c) shows the corresponding terahertz reflection signals, it can be seen that the material change and the position change of the label can be used for performing binarization encoding.
Referring to the attached drawing 4 in the specification, in combination with scanning of different positions of a terahertz tag, assuming that a composite material terahertz spectrum data set to be processed has M × N spatial sample points, and an acquisition sample point number (also referred to as a time frame number) of a time response pulse of each spatial sample point is T, a data structure of the composite material terahertz spectrum data set is a three-dimensional array M × N × T. Three different data visualizations can be carried out based on the data structure, namely A-Scan, B-Scan and C-Scan graphs. If the horizontal axis is the delay time and the vertical axis is the amplitude of the time domain waveform, the terahertz time domain waveform corresponding to the point pixel is obtained and is called an A-Scan diagram. If a dimension and a time dimension of a two-dimensional space are used for imaging, that is, the length M and the time dimension section or the width N and the time dimension section of the sample are imaged, the two-dimensional space is called a row B-Scan graph or a column B-Scan graph. Each pixel point of terahertz spectrum imaging comprises a time domain waveform, so that a certain imaging parameter can be determined from a time domain signal or a Fourier transform spectrum corresponding to each pixel point to form a two-dimensional matrix for imaging. If all the pixels of the sample are taken at a certain time point and plotted according to the spatial positions, an imaging picture of the section of the sample, namely a C-Scan picture, can be obtained. Different information recorded by the product label can be conveniently identified through different data visualizations, and the information identification efficiency is improved.
Example 2 preparation of terahertz Label
In order to make the terahertz tag of the present invention more easily produce with a product conformal shape and simultaneously meet the requirements of reducing cost and facilitating mass production, the preparation material is preferably a flexible material. For example, the dielectric layer may be a low-cost plastic film, paper, or other dielectric material, and the label layer may be printed, sprayed, or stamped with a printing material. The material can be selected to have flexibility, so long as the reflectivity of the terahertz wave to the label layer pattern can be different from the reflectivity of the dielectric layer boundary, and the terahertz reflection spectrum can be changed.
The terahertz label can be processed and prepared by printing, such as ink-jet printing, spraying, hot stamping or embedding.
1) The printing method comprises the following steps:
firstly, designing a terahertz chipless tag structure according to requirements, wherein parameters such as a coding pattern, the number of layers and the thickness of each layer are determined. Wherein, referring to embodiment 1, the coding pattern of the label layer can be one or more combinations of bar codes, two-dimensional codes and custom patterns.
Secondly, paper, plastic films and the like are used as base materials, and the designed label patterns are printed on the surface of the base materials by one or a combination of ink-jet printing, spraying and hot stamping. Since the reflectance of the terahertz wave to the sprayed printed material such as graphite ink is different from the reflectance of the paper/plastic film, the sprayed printed material forms a label layer.
Then, the paper or plastic film printed with the label is subjected to direct lamination in a certain order.
Alternatively, the dielectric medium printed with the label pattern may be adhered, stacked and formed by using an ultrathin double-sided adhesive tape, and finally, the label pattern is hidden under the opaque dielectric medium to obtain the terahertz chipless label. During the preparation process, it is ensured that no cavities, in particular essentially no air inclusions, are present between the layers.
2) The embedding method comprises the following steps: the method can be organically fused with a production process similar to but not limited to the preparation of multi-layer dielectric material products (including but not limited to quartz fibers, glass fibers and the like bonded composite materials), and the label can be conformed to the products, mainly as follows:
firstly, designing a terahertz chipless tag structure according to requirements, including determining parameters such as a coding pattern and the number of layers. Wherein, referring to embodiment 1, the coding pattern of the label layer can be one or more combinations of bar codes, two-dimensional codes and custom patterns.
Next, the designed label pattern is printed on the surface of the base material such as paper by ink jet printing to form a label layer.
Then, the label layer on the base material is adhered to an ultra-thin transparent tape (e.g., a PET film) and the paper on the tape is washed off with water to transfer the label layer pattern to the tape.
Then, the adhesive tape with the label transferred thereon is pre-embedded on a substrate made of quartz fiber, glass fiber or the like for preparing the dielectric layer composite material.
And finally, bonding and pressing the base materials into a multilayer composite material to complete the embedding of multilayer label information, thereby obtaining the terahertz chipless label.
In the above preparation process, it is ensured that no cavities, in particular substantially no air inclusions, are present between the layers.
Example 3 reading and identification of terahertz tags
Referring to the specification and the attached figure 5, a method flow for reading and identifying the terahertz label signal through an artificial intelligence algorithm is shown. In this embodiment, specifically, the transfer learning and the deep residual network ResNet are utilized. The transfer learning is a new machine learning method for solving related problems by using existing knowledge, and aims to transfer the existing knowledge to solve the learning problem that only a small amount of labeled sample data exists in the target field. The main method and the steps are as follows:
(a) and (3) carrying out self-adaptive reflective scanning on the flexible terahertz label sample by adopting a terahertz imaging robot, and acquiring a corresponding terahertz label signal.
(b) According to the coding rule, selecting part of terahertz time-domain spectral signals of the corresponding label region as input data of network training, preprocessing the data, and processing to generate a small labeled terahertz time-domain waveform image data set. The data set is used for training and validation of the migration depth residual network.
(c) And (3) finely adjusting and importing a pre-trained deep residual error network model according to an artificial intelligence algorithm, and then carrying out classification training and verification on the network module by using a small sample labeling data set until the expectation is reached, thereby completing the transfer learning of the deep residual error network.
(d) And generating a label-free test signal by using the same method, predicting the label-free test signal based on the migrated depth network model, and realizing automatic identification of the terahertz label signal.
The four-layer terahertz tag in embodiment 1 is used, and further in this embodiment, the four layers of dielectric materials are formed by pressing quartz fiber composite materials, for example. Of course, the above materials are only examples and are not intended to limit the dielectric material of the present invention. The structure of the terahertz label is shown in the attached figure 6 in the specification. The thickness of each dielectric layer may be 0.1-0.5mm, the thickness of the label layer may be 0.005-0.05mm, in this embodiment about 0.2mm, and the thickness of the label layer about 0.02 mm. From top to bottom, between the first, second and third dielectric layers, a circular plastic sheet with a diameter of about 20mm and a thickness of about 0.02mm was embedded to achieve exemplary label coding. Wherein three circular plastic sheets are each arranged at the bottom of a dielectric layer and adjacent to the next dielectric layer. Meanwhile, on a projected cross section in the up-down direction, as shown in the upper drawing of fig. 6, the positions of three circular plastic sheets do not overlap each other. In particular, in this embodiment, three circular plastic lamellae are located in the first, second and third quadrants, respectively, of the cross-section, and the fourth quadrant is located without a circular plastic lamella. Thus, three different codes, "100", "010", and "001" are defined in the tag areas of the first to third quadrants, and the code in the non-tag area of the fourth quadrant is defined as "000".
Further, the reading and identification implementation steps are mainly as follows:
(a) the terahertz label of the above example is subjected to reflective two-dimensional scanning by a terahertz imaging robot. And selecting the terahertz time-domain spectrum signals in the corresponding region as input data of the deep network ResNet to be migrated and learned.
(b) The data are preprocessed, terahertz time-domain waveform images are generated through processing, and labeling is carried out, as shown in the attached figure 7 of the specification, each image represents a spectrum signal. A plurality of training samples are generated according to the method, wherein the training samples comprise label samples and non-label samples. The samples were classified into 4 categories, which were defined as "100", "010", "001", and "000", respectively.
(c) According to the principle of mutual exclusion and same distribution and a certain proportion, data are divided into a training set and a verification set. Dividing the data of all categories in the data set into two mutually exclusive sets according to the ratio of 6: 4, wherein more data sets are used as training sets, and less data sets are used as verification sets.
(d) For deep network ResNet transfer learning, actual data is directly used for continuously training the original network. The learning rate is set to 0.000001, the training batch is 16, the data cycle training is 32 times, and the network parameters are saved and tested after the training is finished. The training process of the network is shown in the attached figure 8 in the specification. And (5) observing loss change by forward propagation and backward propagation of the training set data, and storing the model. After the migration, the loss is not reduced obviously for about 32 times of training, and the weight value at the moment is saved as a model.
(e) And generating a test set by the same method, and testing the deep network ResNet after the transfer learning training is completed to realize the automatic identification of the label.
(f) And after the network training verification is completed, loading the trained model, predicting by using the data test set, and evaluating the network performance after the migration. In the prediction process, the preprocessing mode of input data is consistent with that in training. Similarly, the original network model needs to be finely tuned, and the method is consistent with the network fine tuning during training.
(g) After the network prediction of the ResNet34 after the transfer learning, an identification result matrix is automatically generated, corresponding label coding types are respectively represented by different gray levels, and as can be seen from the attached figure 9 of the specification, the result of the prediction identification is consistent with the actual situation of the terahertz label sample of the attached figure 6 of the specification.
Compared with the prior art, the technical scheme of the invention has the following advantages. 1) The terahertz label is coded information formed by flexible multilayer dielectric materials and label patterns, and the data structure of the terahertz label is a three-dimensional structure, so that the terahertz label is high in label capacity, low in label manufacturing cost, easy to conform to products, and more suitable for nondestructive testing methods of most products; 2) the device can be directly embedded or printed on a marked object in a similar way to an optical bar code instead of a label attached to the object, identification information is directly from the object itself instead of from the label placed on the object, and therefore the label is high in safety; 3) the pattern information of each layer of dielectric material can be printed or embedded on low-cost plastic film/paper or inside the material, and the code of the pattern can be compatible with the current bar code, two-dimensional code or custom pattern manufacture, so the label has strong universality; 4) each dielectric pattern can be made by ink jet printing, spraying, embedding or any other process, facilitating mass production.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A terahertz label is a chipless label and has a multilayer structure, and is characterized in that,
the label comprises a dielectric layer and a label layer which are overlapped up and down, wherein the dielectric constants of the dielectric layer and the label layer are different;
the label layer is provided with a pattern structure for coding, and the pattern structure is printed or embedded at the bottom of one layer of the dielectric layer arranged on the label layer;
and, the dielectric layer is made of a flexible material.
2. The terahertz tag of claim 1,
the dielectric layer is made of paper and a plastic film; and/or the material of the label layer is printing material which is printed, sprayed or hot stamped.
3. The terahertz tag of claim 2,
the printing material is a printing material of a laser printer, an ink-jet printer or a label printer.
4. The terahertz tag according to any one of claims 1 to 3,
the pattern structure is one or a combination of a bar code, a two-dimensional code or a custom pattern.
5. The terahertz tag according to any one of claims 1 to 3,
on a projection section along the up-down direction, the positions of the pattern structures of each label layer on the projection section do not overlap with each other.
6. The terahertz tag according to any one of claims 1 to 3,
the thickness of the dielectric layer is 0.1-0.5 mm; the thickness of the label layer is 0.005-0.05 mm.
7. A method for preparing the terahertz label as claimed in any one of claims 1 to 6, comprising the following steps,
step 1, determining the pattern structure of the terahertz label, the number of layers of the dielectric layer and the label layer and the thickness parameter of each layer according to requirements;
step 2, printing the label layer pattern structure determined in the step 1 on the surface of the dielectric layer substrate by one or a combination of ink-jet printing, spraying and hot stamping; wherein the thickness of the dielectric layer substrate and the thickness of the pattern structure satisfy the thickness parameter in the step 1;
and 3, laminating the dielectric layer substrate printed with the pattern structure.
8. A method for preparing the terahertz label as claimed in any one of claims 1 to 6, comprising the following steps,
step 1, determining the pattern structure of the terahertz label, the number of layers of the dielectric layer and the label layer and the thickness parameter of each layer according to requirements;
step 2, pre-embedding the pattern structure on a dielectric layer substrate;
and 3, laminating and forming the dielectric layer substrate.
9. The method according to claim 8,
and step 2, firstly, transferring the pattern structure onto an adhesive tape, and then pre-embedding the adhesive tape transferred with the pattern structure onto the dielectric layer substrate.
10. The production method according to claim 9,
the step of transferring the pattern structure to the adhesive tape comprises the following steps:
step 21, printing the pattern structure on the surface of the paper by using ink-jet printing;
and 22, pasting the pattern structure surface of the paper on an ultrathin transparent adhesive tape, and eluting the paper on the adhesive tape by using water to transfer the pattern structure to the adhesive tape.
CN202111538965.2A 2021-12-15 2021-12-15 Chip-free terahertz label and preparation method thereof Pending CN114386554A (en)

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US20060231625A1 (en) * 2003-03-12 2006-10-19 Cumming David R Security label which is optically read by terahertz radiation
KR20100003566U (en) * 2008-09-25 2010-04-02 주식회사 손텍 Flexible RFID tag in VHF
CN101916387A (en) * 2010-08-11 2010-12-15 河北工业大学 Three-dimensional barcode label and manufacturing method thereof

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US20060231625A1 (en) * 2003-03-12 2006-10-19 Cumming David R Security label which is optically read by terahertz radiation
KR20100003566U (en) * 2008-09-25 2010-04-02 주식회사 손텍 Flexible RFID tag in VHF
CN101916387A (en) * 2010-08-11 2010-12-15 河北工业大学 Three-dimensional barcode label and manufacturing method thereof

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Publication number Priority date Publication date Assignee Title
CN116758527A (en) * 2023-08-16 2023-09-15 山东巨野盛鑫电器材料有限公司 Quality identification system of polyimide insulating film with low expansion coefficient
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